CN115915405A

CN115915405A - Control method and device for bonding wire equipment cluster

Info

Publication number: CN115915405A
Application number: CN202310029539.9A
Authority: CN
Inventors: 李妍琼; 李盛伟
Original assignee: Shenzhen Zhongbao New Material Technology Co ltd
Current assignee: Shenzhen Zhongbao New Material Technology Co ltd
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-04-04
Anticipated expiration: 2043-01-09
Also published as: CN115915405B

Abstract

The application provides a control method and a control device for a bonding wire equipment cluster, which are used for realizing control over the bonding wire equipment cluster. In this method, since the coverage area of one beam is limited, in the case that the control terminal is provided with a plurality of antenna panels, for example, M antenna panels, the control terminal may irradiate with a plurality of beams, for example, M beams, of the M antenna panels to increase the coverage area, so as to implement control over a large-range cluster of bond wire devices, for example, N bond wire devices. In addition, the control terminal irradiates by using a plurality of beams, and compared with a single beam, the stability and the reliability of control can be improved.

Description

Control method and device for bonding wire equipment cluster

Technical Field

The present application relates to the field of communications technologies, and in particular, to a method and an apparatus for controlling a bonding wire device cluster.

Background

The 5th generation,5g mobile communication system has been widely used in industrial internet scenarios due to its high reliability and low latency characteristics. Taking an anti-oxidation healthy silk manufacturing scene as an example, the control terminal can make the beam of the control terminal always reach the anti-oxidation healthy silk equipment by adjusting the beam direction of the control terminal, so that the control terminal can be carried by a worker to control the anti-oxidation healthy silk equipment anytime and anywhere.

However, the control efficiency of controlling the antioxidant healthy wire equipment by a single control terminal is relatively low, and the method cannot adapt to a large-scale clustering scene.

Disclosure of Invention

The embodiment of the application provides a control method and a control device for a bonding wire equipment cluster, which are used for controlling the bonding wire equipment cluster.

In order to achieve the purpose, the technical scheme is as follows:

in a first aspect, an embodiment of the present application provides a control method for a bonding wire device cluster. The method is applied to a control terminal provided with M antenna panels, wherein M is an integer larger than 1. The method comprises the following steps: the control terminal obtains N side row control signals, wherein each side row control signal in the N side row control signals is used for controlling a corresponding one of the N key wire devices, and N is an integer which is greater than 1 and less than or equal to M. The control terminal uses M antenna panels and simultaneously sends N side-row control signals to N key silk devices.

Based on the method in the first aspect, since the coverage area of one beam is limited, in a case that the control terminal is provided with a plurality of antenna panels, for example, M antenna panels, the control terminal may use a plurality of beams, for example, M beams, of the M antenna panels to illuminate, so as to increase the coverage area, and thus, a large-range bonding wire device cluster, for example, N bonding wire devices, may be controlled. In addition, the control terminal irradiates by using a plurality of beams, and compared with a single beam, the stability and the reliability of control can be improved.

In one possible design, the control terminal sends N side row control signals to N bond wire devices simultaneously using M antenna panels, including: the control terminal uses one wave beam of each antenna panel in the M antenna panels, totally M wave beams, and simultaneously sends N side row control signals to the N key silk devices. Therefore, the service efficiency of the antenna panel can be improved, overlarge power of the antenna panel can be avoided, the overall power consumption can be reduced, and energy conservation is achieved.

Optionally, ki beams of an ith antenna panel of the M antenna panels are all directed to the N keyed-wire devices, an ith beam of the M beams is a beam with the best beam quality among Ki beams of the ith antenna panel, and K and i are any integers from 1 to M. Therefore, the control stability and reliability of the bonding wire equipment cluster can be guaranteed.

Further, before the control terminal acquires N side row control signals, the method of the first aspect further includes: the control terminal receives a plurality of reference signals from a target bonding wire device in the N bonding wire devices by using all beams of the M antenna panels; the control terminal determines the beam quality of each beam in all beams for receiving a plurality of reference signals; and the control terminal sends measurement information to the target bonding wire device, wherein the measurement information is used for indicating one reference signal in a plurality of reference signals corresponding to each of the M beams. It will be appreciated that since the position between the control terminal and the cluster of bond wire devices is relatively fixed, the beam quality between the two is typically slow, in which case the beam quality between a bond wire device, such as the target bond wire device, and the control terminal may be equivalent to the beam quality between the entire cluster of bond wire devices and the control terminal. Therefore, the measurement can be performed only for the beam between the target bonding wire device and the control terminal, so that the beam measurement efficiency can be greatly improved, the measurement overhead is reduced, and the energy conservation of the control terminal is facilitated.

Further, the target bonding wire device is the bonding wire device farthest from the control terminal among the N bonding wire devices. It will be appreciated that the beam quality will deteriorate with increasing distance, and therefore the control terminal needs to measure the beam quality of the furthest bond wire device to ensure that the beam quality of the other bond wire devices, i.e. the closer bond wire devices, will meet the transmission requirements.

Further, two identical beams of any two bonding wire devices in the N bonding wire devices point to the same direction, and the two identical beams refer to that the two beams have the same identifier. That is, beams directed in the same direction by the N key silk devices may share the same beam identifier, so that when the quality of the beam is indicated by the beam identifier, the quality of the beam can be known by the N key silk devices. For example, beam #1 indicates RSRP #1, beam #2 indicates RSRP #2, then the bond wire device #1 may know that the mass of beam #1 of bond wire device #1 is RSRP #1, and the mass of beam #2 of bond wire device #1 is RSRP #2, the bond wire device #2 may also know that the mass of beam #1 of bond wire device #2 is RSRP #1, and the mass of beam #2 of bond wire device #2 is RSRP #2, and so on, up to bond wire device # N.

Further, after the control terminal uses M antenna panels and simultaneously sends N side row control signals to the N keypad devices, the method of the first aspect further includes: and under the condition that at least one beam in the M beams generates power backoff, the control terminal sends information of a reference signal corresponding to the at least one beam to the target bonding wire device, wherein the information of the reference signal is used for indicating the target bonding wire device to adjust a side row resource from a side row available state to a side row flexible state, the side row resource is a side row resource reserved by the target bonding wire device for using the beam of the target bonding wire device, and the beam of the target bonding wire device is a beam corresponding to the reference signal corresponding to the at least one beam.

It will be appreciated that in the sidestream flexible state, the sidestream resources are in a usable or non-usable state, thereby reducing the usage of the sidestream resources and thus the power of the beam as a whole. On this basis, the target bonding wire device can also synchronize a plurality of other bonding wire devices according to the information of the signal, so that the N bonding wire devices execute corresponding power back-off.

Similarly, in a case that at least one beam of the M beams requires power backoff, the method of the first aspect further comprises: and the control terminal adjusts the side row resources reserved for using at least one beam by the control terminal from the side row available state to the side row flexible state.

In a second aspect, embodiments of the present application provide a control apparatus for a cluster of bonding wire devices. The device is applied to a control terminal provided with M antenna panels. M is an integer greater than 1, the apparatus comprising: the processing module is used for controlling the terminal to acquire N side row control signals, wherein each side row control signal in the N side row control signals is used for controlling a corresponding one of the N key wire devices, and N is an integer which is greater than 1 and less than or equal to M; and the transceiver module is used for controlling the terminal to use the M antenna panels and simultaneously sending N side row control signals to the N key silk devices.

In a possible design, the transceiver module is further configured to control the terminal to use one beam of each of the M antenna panels, for M beams, and simultaneously send N sideline control signals to the N keypad devices.

Optionally, ki beams of an ith antenna panel of the M antenna panels are all directed to the N keying devices, an ith beam of the M beams is a beam with the best beam quality among the Ki beams of the ith antenna panel, and K and i are any integers from 1 to M.

Further, the transceiver module is further configured to control the terminal to receive a plurality of reference signals from a target bonding wire device of the N bonding wire devices using all beams of the M antenna panels; the processing module is further used for controlling the terminal to determine the beam quality of each beam in all the beams for receiving the plurality of reference signals; and the transceiver module is further configured to control the terminal to transmit measurement information to the target bonding wire device, where the measurement information is used to indicate one reference signal of multiple reference signals corresponding to each of the M beams.

Further, two identical beams of any two bonding wire devices in the N bonding wire devices point to the same direction, and the two identical beams refer to that the two beams have the same identifier.

Further, the transceiver module is further configured to, when at least one of the M beams has power backoff, control the terminal to send information of a reference signal corresponding to the at least one beam to the target bonding wire device, where the information of the reference signal is used to instruct the target bonding wire device to adjust a sidestream resource from a sidestream available state to a sidestream flexible state, the sidestream resource is a sidestream resource reserved by the target bonding wire device for a beam using the target bonding wire device, and the beam of the target bonding wire device is a beam corresponding to the reference signal corresponding to the at least one beam.

Similarly, when at least one beam of the M beams needs power backoff, the processing module is further configured to control the terminal to adjust a sidelink resource reserved by the control terminal for using the at least one beam from a sidelink available state to a sidelink flexible state.

For technical effects of the second aspect, reference may be made to the related description of the first aspect, and details are not repeated here.

In a third aspect, an embodiment of the present application provides a control system, which includes the above-mentioned control terminal and N key silk devices.

In a fourth aspect, the present application provides a computer-readable storage medium, on which program code is stored, and when the program code is executed by the computer, the method according to the first aspect is executed.

Drawings

Fig. 1 is a schematic structural diagram of a control system according to an embodiment of the present disclosure;

fig. 2 is a flowchart of a control method for a bonding wire device cluster according to an embodiment of the present disclosure;

fig. 3 is a first schematic structural diagram of a control apparatus for a bonding wire device cluster according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a control apparatus for a bonding wire device cluster according to an embodiment of the present application.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

Referring to fig. 1, an embodiment of the present application provides a control system, which may include: control terminal and N key silk equipment.

The control terminal and the N key silk devices can be understood as terminals. The terminal may be a terminal having a wireless transceiving function or a chip system provided to the terminal. The terminal equipment may also be referred to as a User Equipment (UE), an access terminal, a subscriber unit, a subscriber station, a mobile station, a remote terminal, a mobile device, a user terminal, a terminal, wireless communication equipment, a user agent, or a user device. The terminal device in the embodiment of the present application may be a mobile phone (mobile phone), a tablet computer (Pad), a computer with a wireless transceiving function, a Virtual Reality (VR) terminal device, an Augmented Reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self driving (self driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), a vehicle-mounted terminal, an RSU with a terminal function, and the like. The terminal device of the present application may also be an on-board module, an on-board component, an on-board chip, or an on-board unit that is built in a vehicle as one or more components or units, and the vehicle may implement the method provided by the present application through the built-in on-board module, the on-board component, the on-board chip, or the on-board unit. The communication between the control terminal and the anti-oxidation bond wire device can be the communication between the terminals, and can also be called side-to-side (side) communication.

The control terminal is provided with a plurality of antenna panels (pannel), such as M antenna panels. Each of the M antenna panels may transmit or receive a plurality of beams in different directions, referred to as a plurality of beams of the antenna panel. In contrast, each of the N bond wire devices is typically provided with only one antenna panel, which may also transmit or receive multiple beams in different directions, also referred to as multiple beams of the antenna panel. Of course, each of the N bonding wire devices may also be provided with a plurality of antenna panels, which is not limited.

The following will describe the method in detail mainly by taking the interaction between the control terminal and the N key wire devices as an example.

Referring to fig. 2, an embodiment of the present application provides a control method for a bonding wire device cluster. The method may be adapted for communication between a control terminal and N key wire devices. The method comprises the following steps:

s201, the control terminal acquires N side row control signals.

Wherein N is an integer greater than 1 and less than or equal to M. Each of the N side row control signals is used to control a corresponding one of the N bonding wire devices, for example, the side row control signal may control the bonding wire device to start, temporarily operate, and end operation, or may also control an operation mode, an operation type, and the like of the bonding wire device, which is not limited specifically.

S202, the control terminal uses M antenna panels and sends N side row control signals to N key silk devices at the same time.

The control terminal can use one beam of each antenna panel in the M antenna panels, and simultaneously send N side row control signals to the N key silk devices, wherein the total number of the M beams are M. Therefore, the service efficiency of the antenna panel can be improved, overlarge power of the antenna panel can be avoided, the overall power consumption can be reduced, and energy conservation is achieved.

Optionally, ki beams of an ith antenna panel of the M antenna panels are all directed to the N keying devices, an ith beam of the M beams is a beam with the best beam quality among the Ki beams of the ith antenna panel, and K and i are any integers from 1 to M. Therefore, the control stability and reliability of the bonding wire equipment cluster can be guaranteed.

In this embodiment of the application, the control terminal may perform beam measurement in cooperation with the N keying wire devices, and determine a beam with the best beam quality, that is, M beams of the M antenna panels.

It should be noted that, since the position between the control terminal and the bond wire device cluster is relatively fixed, the beam quality between the control terminal and the bond wire device cluster is generally slow, in this case, the beam quality between a bond wire device, such as the target bond wire device, and the control terminal may be equivalent to the beam quality between the entire bond wire device cluster and the control terminal. Therefore, the measurement can be performed only for the beam between the target bonding wire device and the control terminal, so that the beam measurement efficiency can be greatly improved, the measurement overhead is reduced, and the energy conservation of the control terminal is facilitated. As described in detail below.

Step A: one target bonding wire device of the N bonding wire devices sends a plurality of reference signals of the target bonding wire device to the control terminal. Accordingly, the control terminal receives a plurality of reference signals from the target bond wire device using all beams of the M antenna panels.

The target bonding wire device may be a bonding wire device that is defined by the control terminal and the N bonding wire devices in advance. For example, the target bond wire device may be the bond wire device that is farthest from the control terminal among the N bond wire devices. It will be appreciated that the beam quality will deteriorate with increasing distance, and therefore the control terminal needs to measure the beam quality of the furthest bond wire device to ensure that the beam quality of the other bond wire devices, i.e. the closer bond wire devices, will meet the transmission requirements.

The target bonding wire device can periodically and sequentially send a plurality of beams with different directions according to an antenna panel of the target bonding wire device, and each beam can carry one reference signal so as to realize sending of a plurality of reference signals. At the transmission time point of each period, the control terminal may receive the reference signal using one beam of each of the M antenna panels. Thus, after a plurality of cycles, it is possible to receive a plurality of reference signals from the target bond wire device using all beams of the M antenna panels.

And B: the control terminal determines the beam quality of each beam in all beams for receiving a plurality of reference signals;

the beam quality at which each of all beams receives the plurality of reference signals may be RSRP of the beam at each of the plurality of reference signals. The larger the value of the RSRP is, the better the beam quality is, and on the contrary, the smaller the value of the RSRP is, the worse the beam quality is.

The control terminal may locally establish and maintain a mapping relationship between a reference signal with the best beam quality and a beam, as shown in table 1 below.

TABLE 1

The RS1 is used to indicate the reference signal #1, and specifically may be an identifier of the reference signal # 1. RS2 is used to indicate reference signal #2, and may specifically be the identity of reference signal # 2. RS3 is used to indicate reference signal #3, and may specifically be an identifier of reference signal # 3. B1 is used to indicate beam #1, and may specifically be the identity of beam # 1. B2 is used to indicate beam #2, which may specifically be the identity of beam # 12. B3 is used to indicate beam #3, which may specifically be the identity of beam # 3. B4 is used to indicate beam #4, which may specifically be the identity of beam # 4.

And C: and the control terminal sends the measurement information to the target bonding wire device.

The measurement information is used to indicate one reference signal of multiple reference signals corresponding to each beam of M beams, which may have the same reference signal, that is, the same reference signal is the best reference signal for controlling different beams of the terminal, or the beam quality is the best. Thus, the target bonding wire device can determine the beams corresponding to the M reference signals as the optimal beam of the target bonding wire device according to the measurement information. The communication of the target bond wire device with the control terminal may use these optimal beams to transmit or receive signals.

It is further understood that the same two beams of any two of the N bond wire devices point in the same direction, and the same two beams refer to the same identification of the two beams. That is, beams directed in the same direction by the N key silk devices may share the same beam identifier, so that when the quality of the beam is indicated by the beam identifier, the quality of the beam can be known by the N key silk devices. That is, after the target bonding wire device synchronizes the measurement information to the other N-1 bonding wire devices, the other N-1 bonding wire devices may also determine respective optimal beams according to the measurement information. For example, beam #1 indicates RSRP #1, beam #2 indicates RSRP #2, then the bond wire device #1 may know that the mass of beam #1 of bond wire device #1 is RSRP #1, and the mass of beam #2 of bond wire device #1 is RSRP #2, the bond wire device #2 may also know that the mass of beam #1 of bond wire device #2 is RSRP #1, and the mass of beam #2 of bond wire device #2 is RSRP #2, and so on, up to bond wire device # N.

In summary, since the coverage area of one beam is limited, in the case that the control terminal is provided with a plurality of antenna panels, for example, M antenna panels, the control terminal may use a plurality of beams, for example, M beams, of the M antenna panels to illuminate, so as to increase the coverage area, thereby implementing control over a large-range bonding wire device cluster, for example, N bonding wire devices. In addition, the control terminal irradiates by using a plurality of beams, and compared with a single beam, the stability and the reliability of control can be improved.

Optionally, in some possible implementations, after the control terminal uses M antenna panels, and simultaneously sends N side row control signals to the N bonding wire devices, and under a condition that at least one beam of the M beams has power backoff, the control terminal sends information of a reference signal corresponding to the at least one beam to the target bonding wire device. The information of the reference signal is used for indicating the target bonding wire device to adjust the side row resource from a side row available state to a side row flexible state, the side row resource is a side row resource reserved by the target bonding wire device for using a beam of the target bonding wire device, and the beam of the target bonding wire device is a beam corresponding to the reference signal corresponding to at least one beam.

It is understood that a sidelink resource, such as a Resource Block (RB) or a Resource Element (RE), may have three states, namely a sidelink available state, a sidelink unavailable state, and a sidelink flexible state. The sideline available status indicates that the sideline resource can always be used for sideline transmission. The side row unavailable state indicates that the side row resource may not be used for side row transmission at all times. The sideline available status indicates that the sideline resource can always be used for sideline transmission. The sideline flexible state indicates whether the sideline resource is used for sideline transmission or not, and can be flexibly decided and can be used for sideline transmission at certain time, and cannot be used for sideline transmission at certain time. That is, in the sidestream flexible state, the sidestream resources are in a usable or non-usable state, so that the usage rate of the sidestream resources can be reduced, thereby reducing the power of the beam as a whole. On this basis, the target bonding wire device can also synchronize a plurality of other bonding wire devices according to the information of the signal, so that the N bonding wire devices execute corresponding power back-off.

Similarly, when at least one beam of the M beams needs power backoff, the control terminal may also adjust a sidelink resource reserved by the control terminal for using the at least one beam from a sidelink available state to a sidelink flexible state.

Alternatively, the transmit power of the beam may also be reduced by other manners, for example, the control terminal instructs the target bonding wire device or the N bonding wire devices to adjust a part of RBs or REs in the side row resource corresponding to at least one beam from the side row available state to the side row unavailable state, and the remaining RBs or REs still maintain the side row available state.

Referring to fig. 3, the present embodiment further provides a control apparatus 300 for a bonding wire device cluster, where the apparatus 300 is applied to a control terminal provided with M antenna panels. M is an integer greater than 1, the apparatus 300 comprising: a transceiver module 301 and a processing module 302.

A processing module 302, configured to control the terminal to obtain N side row control signals, where each side row control signal in the N side row control signals is used to control a corresponding one of N key wire devices, and N is an integer greater than 1 and less than or equal to M; and the transceiver module 301 is configured to control the terminal to use M antenna panels and send N side row control signals to the N keypad devices at the same time.

In a possible design, the transceiver module 301 is further configured to control the terminal to use one beam of each of the M antenna panels, for M beams, and simultaneously send N sidelink control signals to the N keypad devices.

Further, the transceiver module 301 is further configured to control the terminal to receive multiple reference signals from a target bond wire device of the N bond wire devices by using all beams of the M antenna panels; the processing module 302 is further configured to control the terminal to determine a beam quality of each beam of all beams receiving the plurality of reference signals; the transceiver module 301 is further configured to control the terminal to transmit measurement information to the target bonding wire device, where the measurement information is used to indicate one reference signal of multiple reference signals corresponding to each beam of the M beams.

Further, the target bond wire device is the bond wire device that is farthest from the control terminal among the N bond wire devices. It will be appreciated that the beam quality will deteriorate with increasing distance, and therefore the control terminal needs to measure the beam quality of the furthest bond wire device to ensure that the beam quality of the other bond wire devices, i.e. the closer bond wire devices, will meet the transmission requirements.

Further, the transceiver module 301 is further configured to, when at least one of the M beams has power backoff, control the terminal to send information of a reference signal corresponding to the at least one beam to the target bonding wire device, where the information of the reference signal is used to instruct the target bonding wire device to adjust a sidestream resource from a sidestream available state to a sidestream flexible state, the sidestream resource is a sidestream resource reserved by the target bonding wire device for a beam using the target bonding wire device, and the beam of the target bonding wire device is a beam corresponding to the reference signal corresponding to the at least one beam.

Similarly, in the case that at least one beam of the M beams needs power backoff, the processing module 302 is further configured to control the terminal to adjust the sidelink resources reserved for controlling the terminal to use the at least one beam from a sidelink available state to a sidelink flexible state.

The following describes in detail the respective components of the control apparatus 400 for a cluster of bonding wire devices with reference to fig. 4:

the processor 401 is a control center of the control apparatus 400 for the bonding wire device cluster, and may be a single processor or a collective name of multiple processing elements. For example, the processor 401 is one or more Central Processing Units (CPUs), or may be an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application, such as: one or more microprocessors (digital signal processors, DSPs), or one or more Field Programmable Gate Arrays (FPGAs).

Alternatively, the processor 401 may perform various functions of the control apparatus 400 for a cluster of bonding wire devices, such as the functions in the method as described above with reference to fig. 2, by running or executing a software program stored in the memory 402 and invoking data stored in the memory 402.

In particular implementations, processor 401 may include one or more CPUs, such as CPU0 and CPU1 shown in fig. 4, as one embodiment.

In a specific implementation, the control apparatus 400 for a cluster of bonding wire devices may also include a plurality of processors, for example, as shown in fig. 4, as an embodiment. Each of these processors may be a single-Core Processor (CPU) or a multi-Core Processor (CPU). A processor herein may refer to one or more devices, circuits, and/or processing cores for processing data (e.g., computer program instructions).

The memory 402 is configured to store a software program for executing the scheme of the present application, and is controlled by the processor 401 to execute the software program.

Alternatively, memory 402 may be a read-only memory (ROM) or other type of static storage device, random Access Memory (RAM), or any other type of memory that may store static information and instructions

Other types of dynamic storage devices that may store information and instructions may be, but are not limited to, electrically erasable programmable read-only memory (EEPROM), compact disk read-only memory (CD-ROM) or other optical disk storage, optical disk storage (including compact disk, laser disk, optical disk, digital versatile disk, blu-ray disk, etc.), magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. The memory 402 may be integrated with the processor 401, or may be separate and dedicated to the control apparatus 400 of the cluster of bonding wire devices

Is coupled to the processor 401 (not shown in fig. 4), which is not specifically limited in this embodiment of the application.

A transceiver 403 for communication with other devices. For example, a multi-beam based positioning device is a terminal and transceiver 403 may be used to communicate with a network device or with another terminal.

Optionally, the transceiver 403 may include a receiver and a transmitter (not separately shown in fig. 4). Wherein the receiver is configured to implement a receive function and the transmitter is configured to implement a transmit function.

Optionally, the transceiver 403 may be integrated with the processor 401, or may exist independently, and is coupled to the processor 401 through an interface circuit (not shown in fig. 4) of the control apparatus 400 for a bonding wire device cluster, which is not specifically limited in this embodiment of the present application.

It is noted that the structure of the control arrangement 400 for a cluster of bond wire devices shown in fig. 4 does not constitute a limitation of the arrangement, and the actual control arrangement 400 for a cluster of bond wire devices may comprise more or less components than those shown, or some components may be combined, or a different arrangement of components.

In addition, based on the technical effect of the control apparatus 400 for the bonding wire device cluster, reference may be made to the technical effect of the method of the foregoing method embodiment, and details are not described here again.

It should be understood that the processor in the embodiments of the present application may be a Central Processing Unit (CPU), and the processor may also be other general purpose processors, digital Signal Processors (DSPs), application Specific Integrated Circuits (ASICs), field Programmable Gate Arrays (FPGAs) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, and the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.

It will also be appreciated that the memory in the embodiments of the subject application can be either volatile memory or nonvolatile memory, or can include both volatile and nonvolatile memory. The non-volatile memory may be a read-only memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an electrically Erasable EPROM (EEPROM), or a flash memory. Volatile memory can be Random Access Memory (RAM), which acts as external cache memory. By way of example, but not limitation, many forms of Random Access Memory (RAM) are available, such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchlink DRAM (SLDRAM), and direct bus RAM (DR RAM).

The above embodiments may be implemented in whole or in part by software, hardware (e.g., circuitry), firmware, or any combination thereof. When implemented in software, the above-described embodiments may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. The procedures or functions according to the embodiments of the present application are wholly or partially generated when computer instructions or a computer program are loaded or executed on a computer. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored on a computer readable storage medium or transmitted from one computer readable storage medium to another computer readable storage medium, for example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (e.g., infrared, wireless, microwave, etc.). Computer-readable storage media can be any available media that can be accessed by a computer or a data storage device, such as a server, data center, etc., that contains one or more collections of available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium. The semiconductor medium may be a solid state disk.

It should be understood that the term "and/or" herein is only one kind of association relationship describing the association object, and means that there may be three kinds of relationships, for example, a and/or B, and may mean: a exists alone, A and B exist simultaneously, and B exists alone, wherein A and B can be singular or plural. In addition, the "/" in this document generally indicates that the former and latter associated objects are in an "or" relationship, but may also indicate an "and/or" relationship, and may be understood with particular reference to the former and latter contexts.

In the present application, "at least one" means one or more, "a plurality" means two or more. "at least one of the following" or similar expressions refer to any combination of these items, including any combination of the singular or plural items. For example, at least one (one) of a, b, or c, may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or multiple.

It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, a division of a unit is only a logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some characteristic fields may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one position, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a read-only memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A control method for a bonding wire equipment cluster is characterized by being applied to a control terminal provided with M antenna panels, wherein M is an integer greater than 1, and the method comprises the following steps:

the control terminal acquires N side row control signals, wherein each side row control signal in the N side row control signals is used for controlling a corresponding key wire bonding device in the N key wire bonding devices, and N is an integer which is greater than 1 and less than or equal to M;

and the control terminal uses the M antenna panels and simultaneously sends the N side row control signals to the N key silk devices.

2. The method of claim 1, wherein the controlling terminal simultaneously transmits the N side row control signals to the N bonded wire devices using the M antenna panels, comprising:

and the control terminal uses one wave beam of each antenna panel in the M antenna panels, and sends the N side row control signals to the N key silk devices simultaneously, wherein the wave beams are M in total.

3. The method of claim 2, wherein the Ki beams of the ith antenna panel of the M antenna panels are all directed to the N bond wire devices, wherein the ith beam of the M beams is the beam with the best beam quality among the Ki beams of the ith antenna panel, and wherein K and i are any integers from 1 to M.

4. The method of claim 3, wherein before the control terminal acquires N sidelink control signals, the method further comprises:

the control terminal receives a plurality of reference signals from a target bond wire device of the N bond wire devices using all beams of the M antenna panels;

the control terminal determining the beam quality of each of the all beams for receiving the plurality of reference signals;

the control terminal sends measurement information to the target bonding wire device, wherein the measurement information is used for indicating one reference signal in the multiple reference signals corresponding to each beam in the M beams.

5. The method of claim 4, wherein the target bond wire device is a bond wire device of the N bond wire devices that is farthest from the control terminal.

6. A method according to claim 4 or 5, characterized in that the same two beams of any two of the N bond wire devices, which means that the identity of the two beams is the same, are directed in the same direction.

7. The method of any of claims 4-6, wherein after the control terminal sends the N side row control signals to the N key wire devices simultaneously using the M antenna panels, the method further comprises:

and the control terminal sends information of a reference signal corresponding to at least one beam to the target bonding wire device when at least one beam among the M beams has power backoff, where the information of the reference signal is used to instruct the target bonding wire device to adjust a side row resource from a side row available state to a side row flexible state, the side row resource is a side row resource reserved by the target bonding wire device for a beam using the target bonding wire device, and the beam of the target bonding wire device is a beam corresponding to the reference signal corresponding to the at least one beam.

8. The method of claim 7, wherein in case that at least one of the M beams requires a power backoff, the method further comprises:

and the control terminal adjusts the side row resources reserved for using the at least one beam by the control terminal from the side row available state to the side row flexible state.

9. The utility model provides a controlling means to bonding wire equipment cluster which characterized in that is applied to the control terminal who is provided with M antenna panel, and M is for being greater than 1 integer, the device includes:

the processing module is used for the control terminal to acquire N side row control signals, wherein each side row control signal in the N side row control signals is used for controlling corresponding one of N key wire devices, and N is an integer which is greater than 1 and less than or equal to M;

and the transceiving module is used for the control terminal to use the M antenna panels and simultaneously send the N side row control signals to the N key silk devices.

10. A computer-readable storage medium, characterized in that the storage medium has stored thereon a program code which, when executed by the computer, performs the method according to any one of claims 1-8.