CN1159130C - Silk screen aided laser soldering method for heterogeneous multi-layer structure - Google Patents
Silk screen aided laser soldering method for heterogeneous multi-layer structure Download PDFInfo
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- CN1159130C CN1159130C CNB011310944A CN01131094A CN1159130C CN 1159130 C CN1159130 C CN 1159130C CN B011310944 A CNB011310944 A CN B011310944A CN 01131094 A CN01131094 A CN 01131094A CN 1159130 C CN1159130 C CN 1159130C
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- Prior art keywords
- solder
- silk screen
- side pole
- laser
- layer structure
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- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000005476 soldering Methods 0.000 title abstract description 8
- 239000007769 metal material Substances 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 35
- 238000003466 welding Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 9
- 239000002131 composite material Substances 0.000 abstract description 3
- 239000006071 cream Substances 0.000 description 14
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000010445 mica Substances 0.000 description 6
- 229910052618 mica group Inorganic materials 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000001569 carbon dioxide Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 241000446313 Lamella Species 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000007581 slurry coating method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a wire screen aided laser soldering method of a side electrode in a multi-layer heterogeneous composite structure. Firstly, a soldering material is coated on the side of an element; then, a wire screen is placed in the soldering material; the wire screen is made of metal materials; finally, the element is heated by laser beams to make the soldering material melted; the soldering material is cooled and solidified for forming the side electrode of the element after heated and melted. The side electrode formed by the method can ensure full communication among different layer sheets; only a part of the element is heated in the processing process without damaging the element; the formed electrode has high intensity. Furthermore, the method has the advantages of high processing efficiency and easy control of the processing process, and the requirement of the automatic production of the element is satisfied.
Description
Technical field:
The present invention relates to a kind of silk screen auxiliary laser method for welding of heterogeneous multi-layer structure side pole, belong to technical field of electronic components.
Background technology:
The heterogeneous multi-layer structure element refers to form the components and parts that each synusia material is different by a plurality of synusia are superimposed.Present this components and parts have: stacked piezoelectric ceramic transformer, stacked piezoelectric pottery micro positioner, stacked piezoelectric ceramic filter, stacked piezoelectric ceramic resonator, stacked piezoelectric coupler, stacked piezoelectric ultrasonic motor, multilayer ceramic capacitor (MLC), monolithic structure capacitor, stacked mica condenser, multilayer sheet type resistor, synusia formula inductance or the like.
This device is made up of synusia owing to element, and is uneven when superimposed, and because the different switching performances with side pole of the material of each synusia are also inequality.This just make the side pole of this class device often can not guarantee with each synusia and side pole between effective the connection.Especially for piezoelectric element, often require processing temperature can not surpass a certain temperature value, in order to avoid make component wear; And the side pole that forms when wanting to stand element work the higher-order of oscillation and do not damage.This has just proposed very high requirement to the formation of this class component side pole.
The method of electrode processing and manufacturing that is applied to these several lamination elements is because the difference of processed components and parts is also varied.Main processing method has following several: 1. make between side extraction pole and each lamination by method for welding effectively to connect, 2. conducting resinl connects, and 3. uses extraction pole slurry, 4. ion sputtering.Wherein in forming, the termination electrode of heterogeneous multi-layer structure spare is most widely used with the method for using the extraction pole slurry to connect.This method earlier with slurry coating on device blank side pole, then blank is put into high temperature resistance furnace and is fired and form.
The shortcoming of above-mentioned several method is: 1. narrow application range, the valuable manufacturing that is only applicable to the miniaturized component lateral electrode of electrode slurry; 2. be difficult to guarantee the full-mesh between side pole and each synusia; 3. some piezoelectric elements require side pole that the element of certain mechanical strength is arranged, and just can not meet the demands in this way; 4. side pole must at high temperature be fired, and this often causes the damage of element.For example piezoelectric element will be lost piezoelectric property after temperature surpasses curie point, and the silver layer of ceramic condenser at high temperature will lose; 5. production efficiency is low; 6. process is wayward, and the automatization level of production is limited.
Summary of the invention:
The objective of the invention is to design a kind of silk screen auxiliary laser method for welding of heterogeneous multi-layer structure side pole, not only guarantee the full-mesh between each lamella, the bonding strength height, and can not damage element body, and the production efficiency height, process is easy to control.
The silk screen auxiliary laser method for welding of the heterogeneous multi-layer structure side pole that the present invention proposes comprises following each step:
(1) be coated with solder in the element side, solder is the soft solder of operating temperature between 100 ℃ and 500 ℃, to select paste solder the best for use, for example selects to add the tin lead base paste solder (to call pricker cream in the following text) of 11-15% scaling powder.Used
The solder amount is suitable with the volume of the side pole that will form.
(2) in above-mentioned solder, place silk screen.Its position can be in the bottom near the components and parts place, also can be at upper face, also can be among solder.But solder layer thickness ratio was 1 about selection was placed on and makes: 1-1: 3, and its effect will be better.Silk screen selects fusing point to be higher than 500 ℃ of metal materials, and mesh size is between the 40-200 order.
(3) side pole with the laser beam heats element makes the solder fusing, and laser beam can focus on below the solder surface, or the solder top.
Focus can be a point, also can be designed as focal line parallel with synusia or scanning laser beam,
Can use Nd:YAG or carbon dioxide (CO2) laser instrument to produce laser beam, can also produce laser beam by semiconductor laser.
If use the Nd:YAG laser instrument, its power output is no more than 800W, and the power output of carbon dioxide laser is no more than 3000W.For the long wavelength semiconductor laser power output is 800W.
Preferred parameters of laser beam can obtain according to following formula:
Laser power=input energy ÷ (heat time heating time * absorption coefficient)
Input energy (joule)=proportionality coefficient * solder addition (10
-3Ml), wherein when the unit of solder addition be 10
-3Ml, when the unit of input energy was joule, proportionality coefficient can be chosen between 18～24.
Absorption coefficient refers to solder to the laser beam absorption coefficient, and scope can obtain with reference to relevant handbook between 0～1.For example for the solder of Nd:YAG laser and 62%Sn36%Pb2%Ag globular powder+11%RHG scaling powder, this coefficient desirable 0.75.
(4) solder is after heat fused, and cooled and solidified forms the side pole of element.
The side pole that adopts this method to form not only can guarantee the full-mesh between the different synusia with each, and process only makes element local heating not damage element, the pole strength height of formation; And this method working (machining) efficiency height, process is easy to control, satisfies the demand of element automated production.The side pole that the present invention is directed to prior art formation can not guarantee full-mesh between the element, side pole connects the shortcoming that bonding strength can not meet the demands, adopt the auxiliary method for welding of silk screen, guarantee the full-mesh between the synusia element, satisfy side pole and connect the particularly requirement of the fatigue resistance of piezoelectric element of mechanical performance; And the existence of silk screen can make the solder thermally equivalent, the reliability of raising soldering; Because laser can be operated under the out of focus mode, thereby the two dimensional motion in the part processing of can exchanging work is the process velocity that element has been accelerated in motion in one dimension; Low at prior art production efficiency, the Automation of Manufacturing Process level is not high, the shortcoming that high-temperature heating element integral body causes element function to damage easily, use the laser braze welding technology, not only process is convenient to control, working (machining) efficiency height, is guaranteed not lesion element of element local heating, and can carry out advantage such as retrofit; If adopt the out of focus working method, also can avoid concentrating of beam energy, guarantee that element to be processed suitably is heated.
Description of drawings:
Fig. 1 is a kind of structural representation of typical heterogeneous multi-layer structure device.
Fig. 2 is that silk screen places solder, the silk screen auxiliary laser soldering schematic diagram the during irradiation of laser beam out of focus.
Among Fig. 1 and Fig. 2,1,2 is the side pole of composite construction, and 3,4,5 for forming the different lamella of material of composite construction, and 6 is laser beam, and 7,9 is solder, and 8 is silk screen, and 10 is laser beam foucing.
The specific embodiment:
Example one: the welding of piezoelectric ceramic transformer lateral electrode
Piezoelectric ceramic transformer is the device of being made by piezoceramic material with voltage transformation characteristic.Form by two driving elements and a generating element, the thick only 3mm of PECT generating element in this example, diameter 30mm is formed through the glue-line bonding by several potsherds of thick 0.17mm～0.24mm, and the both sides of each potsherd are coated with one deck silver layer.The interior electrode of each odd number piezoelectric ceramic thin sheet and the interior electrode of each even number thin slice are staggered, and constitute generating respectively and rectify bus electrode and negative bus electrode, and bus electrode is a silver layer, and thickness is about 10 μ m.The polarised direction of adjacent piezoelectric ceramic thin sheet is opposite.The positive and negative bus electrode of generating end is drawn respectively from the side.The lateral electrode width is between 2～4mm, and the solder joint length requirement is between 4～10mm.
According to side pole formation method of the present invention
(1) is coated with solder.With reference to surface mounted component laser braze welding method, select 62%Sn36%Pb2%Ag globular powder+11%RHG scaling powder, its operating temperature is between 170 ℃-190 ℃.Because of the about 3mm length of lateral electrode width 10mm thickness of electrode less than 0.8mm, therefore add pricker cream amount and select 24 * 10
-3Ml;
(2) selecting density is 60 orders, and the brass screen of the thousands of degree of fusing point is positioned among the pricker cream, and pricker cream layer thickness ratio is 1: 3 about making;
(3) adopt the Nd:YAG laser beam of 1.06 microns of wavelength to shine pricker cream, according to electrode width 3mm, it is 3mm that setting defocusing amount 37mm makes the spot diameter that is radiated on the pricker cream.Nd:YAG laser input power 128W.
(4) pricker cream cooled and solidified forms the element side pole.
The joint surface of above-mentioned side pole is smooth evenly, well guaranteed the full-mesh of each unit of potsherd, and strength of joint is good.
Example two: the side pole of stacked mica condenser forms
This capacitor is to be medium with the mica sheet, and thickness is generally between 15～60 μ m.One side lining one deck silver at this mica sheet forms silver electrode then.With the mica sheet of several silver layers that have been covered formation capacitor base substrate compressed together after the superimposition alternately as shown in the figure, be processed to form the two side ends electrode with this method then, be cut into discrete component again, the outside adds the encapsulating material moulding.
Its base substrate size 3 * 20 * 6mm, mica sheet thickness are 30 μ m ± 10%, and silver electrode thickness is about 20 μ m ± 10%.
According to side pole formation method of the present invention
(1) with reference to surface mounted component laser braze welding method, select the 43%Sn43%Pb14Bi+15%RHG scaling powder, its operating temperature is between 210 ℃-240 ℃.Because of the about 3mm length of lateral electrode width 20mm thickness of electrode less than 0.5mm, therefore add pricker cream amount and select 30 * 10
-3Ml
(2) select for use the steel wire of about 1500 ℃ of 80 order fusing points to be placed among the pricker cream, it is 1: 1 that the position of silk screen in pricker cream makes the ratio of levels pricker cream amount.
(3) adopt the carbon dioxide laser irradiation pricker cream of 10.6 microns of wavelength, because of requiring electrode width 3mm, therefore must setting defocusing amount, to make the spot diameter that is radiated on the pricker cream be 3mm.Output lens focal length 98.5mm, the laser beam incident beam diameter 8mm on lens, calculating defocusing amount thus is 37mm.Laser power selects 300W to get final product in this example, but can select optimum process parameters, and system of selection is as follows:
Amount 30 * 10 according to added solder
-3M, selection percentage coefficient 15, calculating the input energy is 450 joules; According to pricker cream to the absorption coefficient of carbon dioxide laser about 0.55, selecting heat time heating time simultaneously is 3 seconds, can be according to the present invention the power output that calculates laser instrument of the formula in the content be 272W.
(4) solder fusing back cooled and solidified forms the element side pole.
The joint surface of above-mentioned side pole is smooth evenly, has guaranteed the full-mesh of electrode unit in the capacitor.Lateral electrode satisfies the technology requirement of strength.Process velocity is fast, adapts to the demand of the retrofit of automated production and surface encapsulation element.
Claims (2)
1, a kind of silk screen auxiliary laser method for welding of heterogeneous multi-layer structure side pole is characterized in that this method comprises following each step:
(1) be coated with solder in the element side, solder is the soft solder of operating temperature between 100 ℃ and 500 ℃;
(2) place silk screen in above-mentioned solder, silk screen is that fusing point is higher than 500 ℃ metal material, and mesh is of a size of the 40-200 order, and the position of silk screen is close components and parts place bottom side pole, or at the solder upper face, or among solder;
(3) side pole with the laser beam heats element makes the solder fusing, and laser beam focuses on below the solder surface, or the solder top;
(4) solder is after heat fused, and cooled and solidified forms the side pole of element.
2, the method for claim 1 is characterized in that described silk screen is placed on to make up and down that the ratio of solder layer thickness is 1: 1-1: 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011310944A CN1159130C (en) | 2001-09-21 | 2001-09-21 | Silk screen aided laser soldering method for heterogeneous multi-layer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011310944A CN1159130C (en) | 2001-09-21 | 2001-09-21 | Silk screen aided laser soldering method for heterogeneous multi-layer structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1343543A CN1343543A (en) | 2002-04-10 |
| CN1159130C true CN1159130C (en) | 2004-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011310944A Expired - Fee Related CN1159130C (en) | 2001-09-21 | 2001-09-21 | Silk screen aided laser soldering method for heterogeneous multi-layer structure |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220369473A1 (en) * | 2021-04-26 | 2022-11-17 | Pac Tech - Packaging Technologies Gmbh | Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101151569B1 (en) * | 2009-10-26 | 2012-05-31 | 주식회사 경동나비엔 | Welding method of stainless steel |
| CN105397289B (en) * | 2015-12-09 | 2017-09-15 | 贵州黎阳航空动力有限公司 | A kind of ultra-thin-wall high temperature alloy lamination laser welding process and its fixture |
| CN112276477A (en) * | 2019-07-26 | 2021-01-29 | 中国科学院理化技术研究所 | Preparation method of wire mesh heat regenerator |
-
2001
- 2001-09-21 CN CNB011310944A patent/CN1159130C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220369473A1 (en) * | 2021-04-26 | 2022-11-17 | Pac Tech - Packaging Technologies Gmbh | Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole |
| US12028987B2 (en) * | 2021-04-26 | 2024-07-02 | PAC Tech—Packaging Technologies GmbH | Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole |
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| Publication number | Publication date |
|---|---|
| CN1343543A (en) | 2002-04-10 |
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