CN115902283A - Sensor framework assembly, manufacturing method thereof and wheel speed sensor - Google Patents

Abstract

The invention relates to a sensor skeleton assembly which comprises a skeleton body (1), a chip part (2) and an inserting piece (3), wherein the chip part (2) and the inserting piece (3) are fixedly connected with each other, and the skeleton body (1) is formed by an injection molding body at least partially wrapping the chip part (2) and the inserting piece (3). The invention also relates to a manufacturing method of the sensor frame assembly and a wheel speed sensor comprising the sensor frame assembly. Through the moulding skeleton body of moulding making a bet in the state of chip portion and inserted sheet fixed connection each other, avoided the chip to install not in place or cooperate the insecure condition on the skeleton body, can ensure chip position uniformity.

Description

Sensor framework assembly, manufacturing method thereof and wheel speed sensor

Technical Field

The present invention relates to a sensor, and more particularly, to a sensor frame assembly, a method of manufacturing the same, and a wheel speed sensor including the same.

Background

Currently, wheel speed sensors are increasingly used in vehicles, and are one of the key sensors in vehicles. For example, a vehicle dynamic control system (VDC), an Electronic Stability Program (ESP), an Antilock Brake System (ABS), an automatic transmission control system, etc. require wheel speed information measured by a wheel speed sensor.

Wheel speed sensors typically include a chip, which is the core component of the wheel speed sensor, and a skeleton, which provides support for the chip and its attachment structure. The manufacturing method of the wheel speed sensor generally comprises the steps of firstly manufacturing a framework, respectively installing a chip and an insert for connecting a chip pin and a cable core wire at two ends of the framework, and then wrapping the framework, the chip and the insert together by using an injection molding material to form a sensor head.

The current wheel speed sensor needs to install a chip in a chip receiving part (a cavity or a groove) formed on a framework, and the position of the chip on a mold is fixed through positioning points on the framework when a sensor head is injected. This requires a high degree of precision in the fit between the chip and the backbone to ensure that the chip is fully seated during injection molding. However, the problems of the chip being not mounted in place, the chip being in large tolerance with the framework, and the fitting being not firm exist in the actual mounting process. These problems may cause the defects of unstable signal output, unqualified waterproof and insulating properties, and the like of the wheel speed sensor.

Disclosure of Invention

The present invention has been made in view of the above background, and an object of the present invention is to provide a sensor skeleton assembly capable of ensuring chip position uniformity.

A first aspect of the invention provides a sensor skeleton assembly comprising a skeleton body, a chip portion and an insert, wherein the chip portion and the insert are fixedly connected to each other, and the skeleton body is formed by an injection molded body at least partially wrapping the chip portion and the insert.

In a preferred embodiment, the chip portion and the tab are welded together prior to injection molding to form the skeleton body.

In a preferred embodiment, the chip part and the soldering part of the tab are bent.

In a preferred embodiment, the insert is provided with a positioning hole, and the positioning hole is used for fixing the positions of the chip part and the insert in the mold when the framework body is formed by injection molding.

In a preferred embodiment, the skeleton body comprises a positioning block for positioning the skeleton body in a mold when injection molding the sensor head.

In a preferred embodiment, an anti-reverse structure is arranged on the positioning block.

In a preferred embodiment, a riveting part for riveting the chip pin and the wiring harness is formed on the inserting sheet.

The second aspect of the present invention provides a method for manufacturing a sensor skeleton assembly, the sensor skeleton assembly including a skeleton body, a chip portion, and an insertion piece, the method comprising the steps of:

(a) Respectively manufacturing the chip part and the inserting piece, wherein the inserting piece is provided with a positioning hole;

(b) Welding the chip part and the inserting piece together;

(c) Placing the chip part and the insert sheet which are welded together into a die, so that a first positioning column on the die penetrates through the positioning hole on the insert sheet;

(d) Introducing an injection molding fluid into the mold to form the skeleton body at least partially encasing the chip portion and the insert.

In a preferred embodiment, in the step (c), the insert sheet is also clamped at two sides by second positioning columns on the die.

In a preferred embodiment, the manufacturing method further comprises a step of bending the chip part and the soldering part of the tab after the step (b) and before the step (c).

A third aspect of the invention provides a wheel speed sensor having a sensor skeleton assembly according to the first aspect described above.

According to the sensor framework assembly and the manufacturing method thereof, the chip part and the inserting piece are fixedly connected together before the framework body is formed through injection molding, the condition that the chip is not installed on the framework body in place or is not matched firmly is avoided, and the position consistency of the chip can be ensured.

Drawings

FIG. 1 is a schematic view of a sensor skeletal assembly in accordance with an embodiment of the present invention;

FIG. 2 is a perspective view of the sensor frame assembly;

FIG. 3 is an elevation view of the sensor frame assembly;

FIG. 4 is a side view of the sensor frame assembly;

FIG. 5 is a perspective view of the chip section and the insert sheet after being soldered together and before injection molding;

FIG. 6 is a front view of the chip section and the insert sheet after soldering together and before injection molding;

FIG. 7 is a side view of the chip section and tab after being soldered together and before injection molding;

FIG. 8 is a schematic diagram of a method of manufacturing a sensor frame assembly according to an embodiment of the invention.

Detailed Description

The technical scheme of the invention is explained in detail in the following with reference to the attached drawings. The embodiments described herein are presented by way of example only and should not be construed as limiting the invention.

Fig. 1 is a schematic diagram of a sensor frame assembly according to an embodiment of the present invention, and fig. 2-4 are perspective, front and side views, respectively, of the sensor frame assembly.

As shown in fig. 1, the sensor skeleton assembly in this embodiment includes a skeleton body 1, a chip portion 2, and an insertion piece 3. The skeleton body 1 is formed by an injection molding body at least partially wrapping the chip part 2 and the inserting piece 3. In the schematic view of fig. 1, the skeleton body 1 is partially seen in perspective to show a chip part 2 and a part of the insert sheet 3 inside thereof. Another part of the insert 3 extends to the outside of the skeleton body 1. The chip section 2 includes a chip and a holding structure thereof, in which the chip is firmly fixed.

Hereinafter, for convenience of description, the up-down direction in fig. 3 is referred to as the longitudinal direction of the sensor skeleton assembly or skeleton body 1, and the left-right direction in fig. 3 is referred to as the lateral direction of the sensor skeleton assembly or skeleton body 1. In addition, chip pins are not shown in the drawings.

The skeleton body 1 includes a positioning block 11. The positioning blocks 11 in this embodiment are two square positioning blocks provided to project laterally outward from the main body portion of the skeleton body 1. The positioning block 11 is used for positioning the position of the skeleton body 1 in the sensor head when the sensor head is formed by injection molding. Compared with the traditional single-point cylindrical positioning block, the square positioning block can eliminate the defects of inaccurate positioning, easy inclination, difficult process control and the like.

The two positioning blocks 11 formed on the left and right sides of the frame body 1 are different in structure. Specifically, in the present embodiment, a semi-cylindrical mistake preventing groove is provided as the reverse prevention structure 12 on the positioning block 11 on the left side in fig. 3, and such a mistake preventing groove is not provided on the positioning block 11 on the right side. The anti-inversion structure 12 is not limited to the semi-cylindrical anti-mistake groove. For example, the anti-backup structure 12 may be a recess or a protrusion formed on either one of the positioning blocks, so long as the recess or protrusion is adapted to mate with a corresponding protrusion or recess on the injection mold. When the sensor head is injected, the anti-reverse structure 12 is matched with a corresponding structure on an injection mold, so that the sensor framework assembly can be prevented from being placed reversely.

The carcass body 1 is also formed with a plurality of holes 13. The positions and shapes of these holes 13 correspond to the positions and shapes of positioning posts on a mold employed in injection molding of the carcass body 1, which will be described further below.

In the prior art, a framework body is formed firstly, a chip part and an inserting piece are respectively installed at two longitudinal end parts of the framework body, and then a sensor head part is formed through injection molding. In contrast, in the present embodiment, the chip part 2 and the tab 3 are first welded together, and then the frame body 1 covering the chip part 2 and the tab 3 is formed by injection molding.

Fig. 5-7 are perspective, front and side views, respectively, of the chip section 2 and the tab 3 after soldering together and before injection molding.

As shown in the figure, the chip part 2 and the two tabs 3 are welded to each other at the welding portion 23. The two insertion tabs 3 serve to connect together chip pins, not shown in the drawing, and cable cores, also not shown.

In this embodiment, the soldering portions 23 of the chip part 2 and the tab 3 are bent as best shown in fig. 7. This helps to reduce the thickness of the sensor skeleton assembly after injection molding the skeleton body 1.

Each tab 3 includes a positioning hole 31 and a rivet 32. The positioning holes 31 are used for fixing the positions of the chip part 2 and the insert 3 in the mold when the framework body 1 is formed by injection molding. Each rivet 32 comprises, for example, four rivet tabs. In the present embodiment, the riveting portions 32 of the two inserting pieces 2 are designed in a staggered manner. That is, as shown in fig. 6 and 7, the caulking pieces of the caulking portions 32 of the two tabs 2 are arranged to intersect with each other in the longitudinal direction of the skeleton body 1. Two inserted sheets 2 can be formed by the punching press of same sheet metal, and through the riveting portion that adopts the alternating expression design, material utilization when can giving the punching press production of improvement inserted sheet.

A method for manufacturing a sensor skeletal assembly as described above in accordance with an embodiment of the present invention is described below with reference to fig. 8.

According to the manufacturing method of the present embodiment, first, the chip part 2 and the tab 3 are separately manufactured. Here, the chip is firmly fixed in the holding structure, and a positioning hole 31 is formed on each insert sheet 3.

After the chip part 2 and the tab 3 are separately manufactured, the chip part 2 and the tab 3 are soldered together. In other embodiments, the chip portion 2 and the tab 3 may be fixedly attached together by any suitable means other than soldering. Preferably, the soldering portions 23 of the chip part 2 and the tab 3 may be bent.

Then, the chip section 2 and the tab 3 soldered together are put into a mold. The mold is not shown, but those skilled in the art can understand that the mold is provided with a first positioning column capable of passing through the positioning hole 31 of the insert sheet 3 to fix the position of the insert sheet 3 and the chip part 2 soldered therewith in the mold. In order to prevent the punching force of the injection fluid from causing the chip part 2 and the insert 3 to be displaced in a direction perpendicular to the drawing plane of fig. 6, additional second positioning posts may be provided on the mold to hold the insert 3 on both sides.

After the chip part 2 and the insert sheet 3 are fixed in the mold as described above, an injection fluid is introduced into the mold to form the skeleton body 1 at least partially wrapping the chip part 2 and the insert sheet 3.

Thus, a sensor skeletal assembly is formed as shown in fig. 1-4. The shape, size and relative position of the holes 13 on the framework body 1 correspond to the shape, size and relative position of the first and second positioning posts on the die.

According to the present invention, the chip part 2 and the tab 3 are first welded or otherwise fixed to each other, and then the skeleton body 1 wrapping the chip part 2 and the tab 3 is formed by injection molding. The condition that the chip is not installed in place or is not firmly matched on the framework body is avoided, and the position consistency of the chip can be ensured.

It will be understood that the above-described embodiments of the present invention are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. The scope of the invention is to be defined only by the meaning of the language of the following claims and by the equivalents thereof.

Claims (11)

1. The utility model provides a sensor skeleton assembly, includes skeleton body (1), chip portion (2) and inserted sheet (3), its characterized in that, chip portion (2) with inserted sheet (3) fixed connection each other, skeleton body (1) is by wrapping up partly at least chip portion (2) with the injection moulding body of inserted sheet (3) forms.

2. Sensor skeleton assembly according to claim 1, characterized in, that the chip part (2) and the insert (3) are welded together before injection moulding the skeleton body (1).

3. Sensor skeleton assembly according to claim 2, characterized in that the soldering portions (23) of the chip part (2) and the tab (3) are bent.

4. Sensor skeleton assembly according to any one of claims 1 to 3, characterized in that positioning holes (31) are provided on the insert sheet (3), which positioning holes (31) are used for fixing the position of the chip part (2) and the insert sheet (3) in a mold when injection molding the skeleton body (1).

5. Sensor skeleton assembly according to any one of claims 1 to 3, characterized in that the skeleton body (1) comprises positioning blocks (11), which positioning blocks (11) are used for positioning the skeleton body (1) in a mould when injection moulding a sensor head.

6. The sensor skeleton assembly according to claim 5, characterized in that the positioning block (11) is provided with an anti-inversion structure (12).

7. The sensor frame assembly according to any one of claims 1 to 3, wherein the tab (3) is formed with a rivet (32) for riveting a chip pin and a wire harness.

8. A manufacturing method of a sensor skeleton assembly, wherein the sensor skeleton assembly comprises a skeleton body (1), a chip part (2) and an inserting piece (3), and is characterized by comprising the following steps:

(a) Respectively manufacturing the chip part (2) and the inserting piece (3), wherein a positioning hole (31) is formed in the inserting piece (3);

(b) Welding the chip part (2) and the insert sheet (3) together;

(c) Placing the chip part (2) and the insert sheet (3) which are welded together into a mould, so that a first positioning column on the mould penetrates through the positioning hole (31) on the insert sheet (3);

(d) Introducing an injection molding fluid into the mold to form the skeleton body (1) at least partially encasing the chip portions (2) and the insert (3).

9. The manufacturing method according to claim 8, characterized in that in step (c), the insert (3) is also clamped on both sides by second positioning posts on the mold.

10. The manufacturing method according to claim 8 or 9, further comprising a step of bending the chip part (2) and the soldering portion (23) of the tab (3) after step (b) and before step (c).

11. A wheel speed sensor having the sensor frame assembly of any of claims 1-7.

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