CN115900986A - Cylindrical surface precursor ceramic film temperature sensor and preparation device and preparation method thereof - Google Patents
Cylindrical surface precursor ceramic film temperature sensor and preparation device and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a cylindrical surface precursor ceramic film temperature sensor and a preparation device and a preparation method thereof. The ceramic film temperature sensor can be prepared on the cylindrical surface substrate of a bearing, a bolt and the like in situ, and has the advantages of in-situ nondestructive detection, strong extreme environment tolerance, small influence on the surface characteristics of a structure to be detected and the like; the preparation device and the preparation method have the advantages of high cylindrical surface patterning efficiency, simple process and the like, and provide a new idea for the practical application of the high-temperature film sensor.
Description
Technical Field
The invention relates to the technical field of film temperature sensor preparation, in particular to a cylindrical surface precursor ceramic film temperature sensor and a preparation device and a preparation method thereof.
Background
In the fields of aerospace, gas turbines and the like, parts with cylindrical surface common characteristics such as aviation bearings, high-temperature resistant bolts and the like often run under severe conditions of high temperature, high pressure and high rotating speed, and failure problems such as fatigue, abrasion and the like are easily caused. The temperature is an important index for measuring the service state of the parts, and the realization of high-temperature in-situ detection on the parts with the cylindrical surface common characteristic has important significance for state monitoring and early fault diagnosis of key parts.
However, the traditional sensor has a large size, and the curved surface measurement part often adopts a hole opening or external installation mode to collect signals, so that the structure of the part to be measured is damaged, and the measurement position is not in the original position, so that a more accurate test signal is difficult to obtain; in addition, the high-temperature application scene has higher requirements on sensor materials, so that the development and application of a mature curved surface self-assembly technology and a curved surface transfer printing technology are limited.
In order to solve the problems, various inventions are proposed in the prior art, for example, patent application No. CN 201811300429.7 provides a thin film temperature sensor for turbine blades of aero-engines, which utilizes an ion deposition technology to prepare a functional and structural integrated thin film sensor on a curved surface of a blade, wherein the total thickness of the thin film sensor is less than 25um, the maximum measurement temperature is 1100 ℃, but the ion deposition technology is not suitable for curved surfaces with large curvature, and the preparation cost is high; for example, utility model with application number CN201921389203.9 provides a grating formula bolt sensor, it has prepared on the face of cylinder of bolt that can repeatedly dismantle suitable, the lower grating formula sensor of cost, but its temperature measurement scope is limited, and has set up the circular slot on the face of cylinder of bolt, influences its mechanical strength.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, provides a cylindrical surface precursor ceramic film temperature sensor which has the advantages of in-situ detection, strong extreme environment tolerance and small influence on the surface characteristics of a structure to be detected, and also provides a device and a method for preparing the cylindrical surface precursor ceramic film temperature sensor, which have the advantages of high cylindrical surface patterning efficiency and simple process.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
a device for preparing a cylindrical surface precursor ceramic film temperature sensor comprises a machine base, a workbench, a Y-axis sealing linear module, an X-axis sealing linear module, a Z-axis sealing linear module, an electric rotating table, a Wessenberg direct-writing module, a motion controller and a V-shaped clamp holder;
the workbench is fixed above the base, the two sides above the base are respectively provided with a Y-axis sealing linear module, each Y-axis sealing linear module comprises a Y-axis motor, a Y-axis sliding rail and a Y-axis sliding block, the Y-axis sliding blocks are arranged on the Y-axis sliding rails, and the Y-axis motors are used for driving the Y-axis sliding blocks to slide along the Y-axis sliding rails;
the X-axis sealing linear module comprises an X-axis motor, an X-axis sliding rail and an X-axis sliding block, wherein two ends of the X-axis sliding rail are fixed on the Y-axis sliding block, the X-axis sliding block is arranged on the X-axis sliding rail, and the X-axis motor is used for driving the X-axis sliding block to slide along the X-axis sliding rail;
the Z-axis sealing linear module comprises a Z-axis motor, a Z-axis slide rail and a Z-axis slide block, wherein the Z-axis slide rail is fixed on the X-axis slide block, the Z-axis slide block is arranged on the Z-axis slide rail, the Z-axis motor is used for driving the Z-axis slide block to slide along the Z-axis slide rail, and the X-axis slide rail, the Y-axis slide rail and the Z-axis slide rail are mutually vertical in pairs;
the electric rotating table is fixed on the Z-axis sliding block, the Wessenburg direct-writing module is fixed on the electric rotating table, and the Wessenburg direct-writing module is driven to swing when the electric rotating table rotates;
the V-shaped clamp holder is arranged on the workbench and used for clamping and fixing the cylindrical surface substrate;
the controller is used for reading four-axis G codes and controlling the X-axis motor, the Y-axis motor, the Z-axis motor and the electric rotating table to move, so that the Weisenberg direct writing module performs curved surface concurrent direct writing on the cylindrical surface substrate to form a ceramic film sensitive grid and a welding spot, and in the curved surface concurrent direct writing process, the spraying direction of the raw materials of the Weisenberg direct writing module coincides with the normal direction of the curved surface.
Preferably, the V-shaped clamp holder comprises a V-shaped seat, a pressing block, a guide rod and a compression screw, one end of the guide rod is fixed on the V-shaped seat, the pressing block is sleeved with the guide rod, and the pressing block is fixed on the guide rod through the compression screw.
Preferably, the wesenberg direct writing module comprises a connecting assembly, a rotating motor, a coupler, a microneedle, a liquid storage cavity, a check washer, a liquid storage cavity cover, a dispensing needle head and a direct current power supply, wherein the connecting assembly comprises a connecting plate, a motor fixing plate, a liquid storage cavity fixing plate, a first set screw and a second set screw;
the automatic micro-needle dispensing machine comprises a connecting plate, a motor fixing plate, a liquid storage cavity fixing plate, a rotating motor, a coupling, a micro-needle, a liquid storage cavity fixing plate, a micro-needle fixing plate, a first set screw, a second set screw, a liquid storage cavity cover and a micro-needle fixing plate.
Preferably, the micro-needle is flush with or extends into the liquid outlet port of the dispensing needle head by 0 to 200 mu m.
A preparation method of a cylindrical surface precursor ceramic film temperature sensor adopts the preparation device of the cylindrical surface precursor ceramic film temperature sensor, and comprises the following steps:
s1, correcting a V-shaped seat of an electric rotating table and a V-shaped clamp holder to enable a dispensing needle head of a Wessenberg direct writing module to be vertical to a workbench, and enabling two side surfaces of the V-shaped seat to be parallel to a Y-axis sliding rail;
s2, ultrasonically cleaning the cylindrical surface substrate by sequentially using acetone, alcohol and deionized water, placing the cylindrical surface substrate on a V-shaped seat after cleaning, and pressing the cylindrical surface substrate by using a pressing block of the V-shaped clamp holder and fixing by using a pressing screw to enable the cylindrical surface substrate to be parallel to the two side surfaces and the bottom surface of the V-shaped seat respectively;
s3, 50-60wt% of TiB 2 Adding the powder into 40-50wt% SiCN precursor ceramic solution to form raw materials of a direct-writing ceramic film sensitive grid and a welding spot, magnetically stirring for 1h at normal temperature, and injecting into a liquid storage cavity of a Wessenberg direct-writing module;
s4, moving a liquid outlet port of the dispensing needle head to a processing original point, setting the processing original point as a machine tool coordinate system original point, and after the machine tool coordinate system original point is reset, coinciding with a workpiece coordinate system according to which four-axis G codes are generated;
s5, loading the four-axis G code into a motion controller, switching on a direct current power supply of the Wessenberg direct-writing module, giving a proper voltage, stably conveying raw materials of a direct-writing ceramic film sensitive grid and a welding spot, executing the four-axis G code, and directly writing the ceramic film sensitive grid on the curved surface of the cylindrical surface substrate in a conformal manner;
s6, pre-curing the ceramic thin film sensitive grid in the air;
s7, placing the pre-cured ceramic film sensitive grid into a tubular furnace, and sintering in an air atmosphere to pyrolyze the ceramic film sensitive grid;
s8, respectively spot-coating proper welding spots at the head end and the tail end of the pyrolyzed ceramic film sensitive grid, and respectively fixing the lead wires on the grooves of the fixing piece;
s9, adhering the slotted side of the fixing piece to a welding spot, and pre-curing the welding spot in air;
and S10, placing the product obtained in the step S9 into a tube furnace, and sintering in an air atmosphere to pyrolyze the welding spots.
The cylindrical surface precursor ceramic film temperature sensor comprises a cylindrical surface substrate, a ceramic film sensitive grid, a welding spot, a lead and a fixing piece, wherein the ceramic film sensitive grid and the welding spot are conformally laid on the cylindrical surface substrate by a Wessenberg direct writing forming technology and are prepared by thermal decomposition and ceramic, the welding spot is arranged on the ceramic film sensitive grid, the lead is connected with the welding spot, and the fixing piece covers the welding spot.
Preferably, the cylindrical surface substrate is a cylindrical part which can resist temperature exceeding 800 ℃ and is insulated at high temperature, and the processing origin point is arranged on the highest generatrix of the cylindrical surface substrate during direct writing.
Preferably, the ceramic film sensitive grid is in a comb shape, and the thickness of the ceramic film sensitive grid is 5-30 μm.
Preferably, one side of the fixing part, which is close to the welding point, is provided with a slot, and the lead is in interference fit with the slot and led out of the slot.
Preferably, the raw material components for the direct-writing ceramic thin film sensitive grid and the welding spot comprise: 50wt% -60wt% TiB 2 Powder and 40wt% -50wt% SiCN precursor ceramic solution.
Compared with the prior art, the invention has the beneficial effects that:
the invention can solve the problems that key parts of high-end equipment such as precision machine tools, aerospace equipment, robots and the like serving in complex high-temperature environments have complex appearance curvature distribution and are difficult to prepare sensors in situ for health monitoring and the like. Based on a high-temperature-resistant precursor ceramic material, the preparation device of the cylindrical surface precursor ceramic film temperature sensor is provided, and the manufacture of the curved surface structure sensing integrated sensor is realized. Compared with the situation that most researches are on a plane, the preparation device and the preparation method of the cylindrical surface precursor ceramic film temperature sensor can effectively realize the preparation of the film sensor close to practical application; compared with the processes of physical sputtering deposition, chemical vapor deposition and the like of the common preparation method of the sensor at present, the method overcomes the defects of complexity, high cost, limited curved surface manufacture and the like of the traditional process, lays a good foundation for practical application, can realize conformal printing of the curved surface, and can provide a certain reference for solving the problem. And the dispensing needle head is always vertical to the surface of the curved surface in the direct writing process of the preparation device of the cylindrical surface precursor ceramic film temperature sensor, so that the uniformity and consistency of the film in the direct writing process can be ensured, the phenomena of liquid advance and lag caused by the inconsistent distance between the dispensing needle head and the surface in the traditional triaxial curved surface direct writing process are overcome, and the surface quality of the film is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the invention. Other embodiments and many of the intended advantages of embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
FIG. 1 is a schematic diagram of a manufacturing apparatus for a cylindrical surface precursor ceramic thin film temperature sensor according to an embodiment of the present disclosure;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is an enlarged view of portion B of FIG. 1;
FIG. 4 (a) is a three-dimensional diagram of a manufacturing apparatus of a cylindrical surface precursor ceramic thin film temperature sensor according to an embodiment of the present application; FIG. 4 (b) is a schematic direct-write diagram of a manufacturing apparatus of a cylindrical surface precursor ceramic thin film temperature sensor according to an embodiment of the present application; fig. 4 (c) is a schematic view of a microneedle rotary liquid supply of the manufacturing apparatus of a cylindrical surface precursor ceramic film temperature sensor according to the embodiment of the present application;
FIGS. 5 (a) -5 (h) are schematic diagrams of different patterning direct-writing of the apparatus for preparing a cylindrical surface precursor ceramic thin film temperature sensor according to the embodiment of the present application;
FIG. 6 is a schematic diagram of a method of fabricating a cylindrical surface precursor ceramic film temperature sensor according to an embodiment of the present application;
FIG. 7 is a schematic diagram of a cylindrical surface precursor ceramic film temperature sensor of an embodiment of the present application;
FIG. 8 is an exploded view of a cylindrical surface precursor ceramic film temperature sensor of an embodiment of the present application;
FIGS. 9 (a) -9 (d) are surface micro-topography maps of cylindrical surface precursor ceramic thin film temperature sensors of embodiments of the present application;
FIG. 10 is a graph of temperature measurement performance results of a cylindrical surface precursor ceramic film temperature sensor according to an embodiment of the present application;
11 (a) -11 (f) are graphs showing the temperature measurement performance of the cylindrical surface precursor ceramic film temperature sensor according to the embodiment of the present application;
12 (a) -12 (b) are schematic diagrams of the application of the preparation method of the cylindrical surface precursor ceramic film temperature sensor to the bearing according to the embodiment of the present application and temperature dynamic test result diagrams thereof; 12 (c) -12 (d) are schematic diagrams of the application of the preparation method of the cylindrical surface precursor ceramic film temperature sensor to the bolt and temperature measurement performance result diagrams at different temperatures according to the embodiment of the present application;
FIG. 13 is a temperature resistance result graph of the cylindrical surface precursor ceramic film temperature sensor applied to a bearing according to the method for manufacturing the cylindrical surface precursor ceramic film temperature sensor of the embodiment of the present application;
FIG. 14 is a temperature resistance result graph of the cylindrical surface precursor ceramic film temperature sensor of the embodiment of the present application applied to a bolt;
reference numerals: 1. a cylindrical surface base; 1a, a processing origin 1a; 2. a ceramic thin film sensitive grid; 3. a first solder joint; 4. a second solder joint; 5. a first fixing member; 6. a second fixing member; 7. a first lead; 8. a second lead; 5a, first slotting; 6a, second slotting; 9. a machine base; 10. a work table; 11. a Y-axis seal linear module; 111. a Y-axis motor; 112. a Y-axis slide rail; 113. a Y-axis slider; 12. an X-axis seal linear module; 121. an X-axis motor; 122. an X-axis slide rail; 123. an X-axis slide block; 13. a Z-axis seal linear module; 131. a Z-axis motor; 132. a Z-axis slide rail; 133. a Z-axis slide block; 14. an electric rotating table; 15. a Wessenberg direct writing module; 151. a fixing assembly; 1511. a connecting plate; 1512. a liquid storage cavity fixing plate; 1513. a motor fixing plate; 1514. a first set screw; 1515. a second set screw; 152. a rotating electric machine; 153. a coupling; 154. microneedles; 155. a liquid storage cavity; 156. a lock washer; 157. a liquid storage cavity cover; 158. dispensing a needle head; 159. a direct current power supply; 16. a motion controller; 17. a V-shaped clamp holder; 171. a V-shaped seat; 172. briquetting; 173. a guide bar; 174. and (4) pressing the screw.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the related invention are shown in the drawings.
It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Referring to fig. 1 to 3, in an embodiment of the present application, a device for manufacturing a cylindrical surface precursor ceramic film temperature sensor is provided, including a base 9, a worktable 10, a Y-axis sealing linear module 11, an X-axis sealing linear module 12, a Z-axis sealing linear module 13, an electric rotary table 14, a wesenberg direct writing module 15, a motion controller 16, and a V-shaped clamp 17; the workbench 10 is fixed above the machine base 9, the Y-axis sealing linear modules 11 are arranged on two sides above the machine base 9, each Y-axis sealing linear module 11 comprises a Y-axis motor 111, a Y-axis slide rail 112 and a Y-axis slide block 113, each Y-axis slide block 113 is arranged on each Y-axis slide rail 112, and each Y-axis motor 111 is used for driving each Y-axis slide block 113 to slide along each Y-axis slide rail 112; the X-axis sealing linear module 12 comprises an X-axis motor 121, an X-axis slide rail 122 and an X-axis slide block 123, wherein two ends of the X-axis slide rail 122 are fixed on the Y-axis slide block 113, the X-axis slide block 123 is arranged on the X-axis slide rail 122, and the X-axis motor 121 is used for driving the X-axis slide block 123 to slide along the X-axis slide rail 122; the Z-axis sealing linear module 13 comprises a Z-axis motor 131, a Z-axis slide rail 132 and a Z-axis slide block 133, wherein the Z-axis slide rail 132 is fixed on the X-axis slide block 123, the Z-axis slide block 133 is arranged on the Z-axis slide rail 132, the Z-axis motor 131 is used for driving the Z-axis slide block 133 to slide along the Z-axis slide rail 132, and the X-axis slide rail 122, the Y-axis slide rail 112 and the Z-axis slide rail 132 are mutually vertical in pairs; the electric rotating platform 14 is fixed on the Z-axis sliding block 133, the Weisenberg direct-writing module 15 is fixed on the electric rotating platform 14, and the Weisenberg direct-writing module 15 is driven to swing when the electric rotating platform 14 rotates; the V-shaped clamp 17 is arranged on the workbench 10, and the V-shaped clamp 17 is used for clamping and fixing the cylindrical surface substrate 1; the X-axis motor 121, the Y-axis motor 111, the Z-axis motor 131 and the electric rotating platform 14 are electrically connected with the motion controller 16, the controller is used for reading four-axis G codes and controlling the X-axis motor 121, the Y-axis motor 111, the Z-axis motor 131 and the electric rotating platform 14 to move, so that the Wessenberg direct writing module 15 carries out curved surface concurrent direct writing on the cylindrical surface substrate 1 to form the ceramic film sensitive grid 2 and the welding points, and in the curved surface concurrent direct writing process, the ejection direction of raw materials of the Wessenberg direct writing module coincides with the normal direction of the curved surface.
In a specific embodiment, the V-shaped holder 17 includes a V-shaped seat 171, a pressing block 172, a guide rod 173 and a pressing screw 174, one end of the guide rod 173 is fixed on the V-shaped seat 171, the pressing block 172 is sleeved on the guide rod 173, and the pressing block 172 is fixed on the guide rod 173 by the pressing screw 174.
In a specific embodiment, the westerberg direct writing module 15 includes a connection assembly, a rotating motor 152, a coupling 153, a microneedle 154, a reservoir 155, a lock washer 156, a reservoir cover 157, a dispensing needle 158, and a dc power supply 159, where the connection assembly includes a connection plate 1511, a motor fixing plate 1513, a reservoir fixing plate 1512, a first set screw 1514, and a second set screw 1515; the connecting plate 1511 is fixed on the electric rotating platform 14, the motor fixing plate 1513 is installed on the upper side of the connecting plate 1511, the liquid storage cavity fixing plate 1512 is installed on the lower side of the connecting plate 1511, the rotating motor 152 is installed on the motor fixing plate 1513 and is used for driving the microneedles 154 to rotate, one end of the coupler 153 is sleeved with the output shaft of the rotating motor 152, the other end of the coupler 153 is sleeved with the microneedles 154 and is fixedly connected with the output shaft of the rotating motor 152 through the first set screw 1514 and the second set screw 1515 respectively, the upper end of the liquid storage cavity 155 is sleeved with the anti-loosening washer 156 and then is in threaded connection with the liquid storage cavity fixing plate 1512, the liquid storage cavity 155 is used for storing raw materials of the direct writing ceramic film sensitive grid 2 and a welding spot, a through hole for accommodating the microneedles 154 to pass through is formed in the center of the liquid storage cavity cover 157, the liquid storage cavity cover 157 passes through the microneedles 154 and is in threaded connection with the liquid storage cavity 155, the dispensing needle 158 is fixed at the lower end of the liquid storage cavity 155, the dispensing needle 154 is penetrated by the dispensing needle 158, the direct current power source 159 is electrically connected with the rotating motor 152 and is used for controlling the rotating speed of the rotating motor 152, so that the raw materials of the direct writing ceramic film sensitive grid 2 and the microneedle can stably flow out along the dispensing needle 154.
Specifically, the micro-needle 154 is flush with or extends into the liquid outlet of the dispensing needle 158 by 0-200 μm. The preparation device of the application is in the process of directly writing the perpendicular curved surface all the time of dispensing pinhead 158, can guarantee directly write in-process film homogeneity and uniformity, has overcome traditional triaxial curved surface and has directly write in-process because the inconsistent liquid that leads to of dispensing pinhead 158 and surface interval and lead to leads to and lags the phenomenon, improves film surface quality.
The traditional triaxial curved surface jet printing device can be stacked layer by layer in one direction only. When the printing parts are complex, a large number of support structures need to be printed as assistance, so that materials are wasted, the processing efficiency is influenced, the liquid advancing and lagging phenomena exist, and the step effect is easy to generate, so that the printing quality is influenced, and the uniform film forming is not facilitated. Five-axis is as the common equipment of manufacturing curved surface spare part, possesses advantages such as flexibility height, strong adaptability. The manufacturing apparatus of the cylindrical surface precursor ceramic thin film temperature sensor according to the embodiment of the present application is shown in fig. 4 (a). In order to further improve the personalized direct writing capability, a complex curved surface conformal direct writing algorithm is developed to control the point glue pinhead 158 to be always parallel to the normal direction of the curved surface in the direct writing process, so that the uniform forming of the film is facilitated. As shown in fig. 4 (b), the micropins 154 rotate in the dispensing tip 158 to supply liquid, and the pattern direct writing can be continued under the drive of a five-axis platform. As shown in fig. 4 (c), the liquid forms a meniscus at the dispensing tip 158 in a short time under the weissenberg effect.
In order to further verify the direct writing performance, different curvature radiuses (10 mm-25 mm) are selected for carrying out grid-shaped patterns, and as shown in figures 5 (a) -5 (d), the consistency is better. As shown in fig. 5 (f) to 5 (h), by directly writing a complex pattern on the cylindrical surface, the direct writing performance is expanded, and it is further verified that the preparation apparatus of the cylindrical surface precursor ceramic film temperature sensor according to the embodiment of the present application can realize stable direct writing of a curved surface.
Referring to fig. 6, an embodiment of the present application provides a method for manufacturing a cylindrical surface precursor ceramic film temperature sensor, where the apparatus for manufacturing a cylindrical surface precursor ceramic film temperature sensor includes the following steps:
s1, correcting a V-shaped seat 171 of an electric rotating table 14 and a V-shaped clamp holder 17, enabling a dispensing needle 158 of a Wessenberg direct writing module 15 to be vertical to a workbench 10, and enabling two side faces of the V-shaped seat 171 to be parallel to a Y-axis sliding rail 112;
s2, ultrasonically cleaning the cylindrical surface substrate 1 by using acetone, alcohol and deionized water in sequence, placing the cylindrical surface substrate 1 on the V-shaped seat 171 after cleaning, and pressing the cylindrical surface substrate 1 by using a pressing block 172 of the V-shaped clamp holder 17 and fixing by using a pressing screw 174 to enable the cylindrical surface substrate 1 to be parallel to the two side surfaces and the bottom surface of the V-shaped seat 171 respectively;
s3, 50-60wt% of TiB 2 Adding the powder into 40-50wt% SiCN precursor ceramic solution to form raw materials of a direct-writing ceramic film sensitive grid 2 and a welding spot, magnetically stirring for 1h at normal temperature, and injecting into a liquid storage cavity 155 of a Wessenberg direct-writing module 15;
s4, moving the liquid outlet port of the dispensing needle 158 to a machining original point 1a, setting the machining original point 1a as a machine tool coordinate system original point, and after the machine tool coordinate system original point is reset, coinciding with a workpiece coordinate system according to which four-axis G codes are generated;
s5, loading the four-axis G code into the motion controller 16, switching on a direct current power supply 159 of the Wessenberg direct-writing module 15, giving a proper voltage, stably conveying raw materials of the direct-writing ceramic film sensitive grid 2 and a welding spot, then executing the four-axis G code, and directly writing the ceramic film sensitive grid 2 on the curved surface of the cylindrical surface substrate 1 in a conformal manner, wherein the thickness of the ceramic film sensitive grid 2 is 10 microns;
s6, pre-curing the ceramic thin film sensitive grid 2 in air at 180 ℃ for 30min;
s7, placing the pre-cured ceramic film sensitive grid 2 into a tubular furnace, sintering in an air atmosphere, and pyrolyzing the ceramic film sensitive grid 2 under the conditions that the temperature is increased from room temperature to 800 ℃ at the temperature increase rate of 2 ℃/min, preserving heat for 1h, and then reducing the temperature from 800 ℃ to room temperature at the temperature reduction rate of 3 ℃/min;
s8, respectively spot-coating a proper amount of welding spots at the head end and the tail end of the pyrolyzed ceramic film sensitive grid 2 to form a first welding spot 3 and a second welding spot 4, respectively fixing the lead wires to the grooves of the fixing piece, and specifically, respectively fixing the first lead wire 7 and the second lead wire 8 to the first groove 5a and the second groove 6 a;
s9, adhering the slotted sides of the fixing pieces to welding points, specifically adhering the slotted sides of the first fixing piece 5 and the second fixing piece 6 to the first welding point 3 and the second welding point 4 respectively; pre-curing the welding spot in air at 180 ℃ for 30min;
and S10, placing the product obtained in the step S9 into a tube furnace, sintering in an air atmosphere, and pyrolyzing welding spots, wherein the sintering condition is that the temperature is increased from room temperature to 800 ℃ at the temperature increasing rate of 2 ℃/min, the temperature is kept for 1h, and then the temperature is decreased from 800 ℃ to room temperature at the temperature decreasing rate of 3 ℃/min.
Referring to fig. 7 and 8, an embodiment of the present application provides a cylindrical surface precursor ceramic film temperature sensor, which is manufactured by using the above manufacturing method of the cylindrical surface precursor ceramic film temperature sensor, and includes a cylindrical surface substrate 1, a ceramic film sensitive grid 2, a welding spot, a lead wire and a fixing member, wherein the ceramic film sensitive grid 2 and the welding spot are conformally laid on the cylindrical surface substrate 1 by a wesenberg direct writing molding technology and are manufactured by performing pyrolytic ceramization, the welding spot is arranged on the ceramic film sensitive grid 2, the lead wire is connected with the welding spot, and the fixing member covers the welding spot.
In a specific embodiment, the cylindrical surface substrate 1 is a cylindrical part which can resist temperature exceeding 800 ℃ and is insulated at high temperature, and the processing origin 1a is arranged on the highest generatrix of the cylindrical surface substrate 1 during direct writing. The raw material components for the direct-write ceramic thin film sensitive grid 2 and the welding spot comprise: 50wt% -60wt% TiB 2 Powder and 40wt% -50wt% SiCN precursor ceramic solution. The direct-writing or ceramic film sensitive grid 2 is comb-shaped, and the thickness is 5-30 μm.
In a specific embodiment, a slot is arranged on one side of the fixing piece close to the welding point, and the lead is in interference fit with the slot and is led out from the slot. Specifically, the welding spots comprise a first welding spot 3 and a second welding spot 4, the fixing part comprises a first fixing part 5 and a second fixing part 6, the first fixing part 5 is provided with a first groove 5a, the second fixing part 6 is provided with a second groove 6a, the lead comprises a first lead 7 and a second lead 8, the first lead 7 and the second lead 8 are in interference fit with the first groove 5a and the second groove 6a respectively, one end of the first welding spot 3 and one end of the second welding spot 4 are fixedly connected with the ceramic thin film sensitive grid 2 respectively, the other end of the first welding spot 3 and the other end of the second welding spot 4 are fixedly connected with the first fixing part 5 and the second fixing part 6 respectively, meanwhile, the first lead 7 and the second lead 8 are in contact with the first welding spot 3 and the second welding spot 4 respectively, the lead is made of conductive platinum wire, and the diameter of the first lead 7 and the diameter of the second lead 8 are equal and are 0.2-0.5 mm as the preferred lead.
Based on the preparation method of the cylindrical surface precursor ceramic film temperature sensor, the film temperature sensor is prepared on the cylindrical surface substrate 1 of the alumina base. As shown in fig. 9 (a) and 9 (b), the surface morphology of the prepared sensitive film is shown, and the film has a continuous, uniform and compact structure, so that the ceramic film sensitive grid 2 has excellent conductivity. As shown in fig. 9 (c), it can be seen from the cross-sectional analysis that the ceramic thin film sensor grid 2 is tightly attached to the cylindrical substrate 1 without any significant gap. Ti element in the ceramic film sensitive grid 2 and Al element in the alumina-based cylindrical surface substrate 1 are respectively analyzed through EDS, and the ceramic film sensitive grid 2 is conformally laid along the cylindrical surface and is in a crescent shape, as shown in figure 9 (d).
In order to further characterize the temperature measurement performance of the cylindrical surface film temperature sensor, a temperature measurement platform is set up, wherein the temperature measurement platform comprises a tube furnace, a K-type thermocouple, a data acquisition device and a computer. The alumina cylindrical film temperature sensor is placed in a high-temperature furnace, and the acquisition card acquires the resistance of the film temperature sensor and the temperature value of the K-type thermocouple and transmits the resistance and the temperature value to a computer for post-processing.
Based on the above preparation method of the cylindrical surface precursor ceramic film temperature sensor, the film temperature sensor is manufactured in a conformal manner on the cylindrical surface, as shown in fig. 11 (a). The test was carried out by placing it on a temperature test platform, and referring to fig. 11 (b), the results show that: in six-cycle (room temperature to 800 ℃) tests, the resistance of the cylindrical surface film temperature sensor is in negative correlation with the change trend of the temperature, and the repeatability is good in six-cycle tests. In order to further test the high-temperature stability, the high-temperature steady-state and dynamic tests are respectively carried out on the high-temperature stability. Referring to FIG. 11 (c), the resistance change rates were 0.5%, 0.7%, and 0.4% at 400 deg.C, 600 deg.C, and 800 deg.C, respectively, for 20 minutes. Referring to fig. 11 (d), five dynamic cycle tests from 610 ℃ to 785 ℃ were applied to the cylindrical surface film temperature sensor, and the maximum resistance change rates at 610 ℃ and 785 ℃ were 5.95% and 2.75%, respectively. Referring to fig. 11 (e), the she equation can describe the non-linear behavior of resistance as a function of temperature, which is fit to a curve as in equation (1). Referring to fig. 11 (f), the temperature value of the film temperature sensor is calculated by fitting a curve and compared with the test value of the standard thermocouple, the variation trend of the cylindrical surface film thermocouple is consistent with that of the standard thermocouple, the maximum temperature variation rate is less than 5%, and the variation rate is reduced to 0.5% with the increase of the number of test wheels.
In the formula, R is the resistance of the cylindrical surface film temperature sensor under the temperature T.
The bearing is a core part of the rotary supporting unit, is known as the heart of a rotary supporting system, and is widely applied to various fields of aerospace, high-speed rails, automobile hubs, large rotors, precision machine tools and the like. The main shaft bearing is a supporting part of a rotary main shaft of high-end equipment such as an aircraft engine and the like, is mostly used in complex and harsh working condition environments such as ultrahigh temperature, high-low temperature alternation and the like, and is easy to lose effectiveness. Therefore, the in-situ temperature real-time detection on the air conditioner can help to ensure the operational reliability of the air conditioner. Based on the preparation method of the cylindrical surface precursor ceramic film temperature sensor, the curved surface film temperature sensor is prepared on the outer ring of the bearing with the temperature resistance of the silicon nitride substrate reaching 1200 ℃, as shown in fig. 12 (a). In order to further verify the high-temperature stability and repeatability, five rounds of dynamic temperature cycle tests are respectively carried out at different temperature intervals (395-415 ℃, 602-622 ℃ and 792-812 ℃), and the results are referred to as a figure 12 (b). The temperature curve trends of the temperature sensor and the thermocouple are consistent, the resistance change rates are 1.6%, 0.7% and 3.8%, and the repeatability is good.
The bolts are used as fasteners of a plurality of parts, creep deformation failure is easy to occur at high temperature, and therefore the bolts are kept in a healthy state at high temperature and guarantee the reliability of high-temperature equipment. Based on the foregoing manufacturing process, a thin film temperature sensor was manufactured on the alumina bolt as shown in fig. 12 (c). The high-temperature heating state is simulated by flame loading and heating, and the mixture is respectively heated from room temperature to 285 ℃, 595 ℃ and 705 ℃. As shown in fig. 12 (d), the trend of the temperature resistance curve of the thin film temperature sensor is consistent with the trend of the commercial thermocouple. The response time of the thermocouple and the film temperature sensor at room temperature to 285 ℃, 595 ℃ and 705 ℃ is 3.342s/1.269s, 3.938s/2.022s and 4.811s/2.037s respectively.
The in-situ integrated film temperature sensor can effectively monitor the health state of high-end parts with complex shape curvature distribution and is beneficial to promoting the intelligent development of high-end equipment. A preparation device and a preparation method of a direct-writing raw material prepared by doping nanometer conductive particles in a precursor ceramic solution are combined with a cylindrical surface precursor ceramic film temperature sensor. Based on the preparation method, different curvatures and different patterning direct writing are realized, and the process feasibility is verified. Preparing a film temperature sensor in situ on the surface of an aluminum oxide cylinder, and performing high-temperature test, wherein the result shows that: the six-cycle test has good repeatability, the resistance change rate of the five-cycle dynamic cycle test at 400 ℃, 600 ℃ and 800 ℃ for 20 minutes is less than 1 percent, and the resistance change rate of the five-cycle dynamic cycle test at 610 ℃ to 785 ℃ is less than 6 percent. The temperature curve is obtained by fitting the temperature resistance characteristic of the film temperature sensor, and the temperature change rate of the film temperature sensor after multiple testing compared with that of a standard thermocouple is less than 0.5%. In order to further verify the practicability of the film temperature sensor, different surfaces of a bearing, a bolt and the like are selected to prepare the film sensor for testing. The result shows that the resistance change rate of the bearing film temperature sensor is less than 4% under the cyclic test of different temperature sections; under different flame temperature tests, the resistance change trend of the bolt film temperature sensor is consistent with that of a standard thermocouple, and the response time of the bolt film temperature sensor is shorter than that of the standard thermocouple.
Referring to fig. 10, fig. 13 and fig. 14, three curves respectively represent the performance of the thin film temperature sensor in different application scenarios, which are respectively an aluminum oxide cylindrical surface, a bearing surface and a bolt surface, and it is proved that the material, precursor ceramic, can be well applied to the cylindrical surface to be used as the temperature sensor under the process.
While the present invention has been described with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. The word 'comprising' does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (10)
1. A device for preparing a cylindrical surface precursor ceramic film temperature sensor is characterized by comprising a machine base, a workbench, a Y-axis sealing linear module, an X-axis sealing linear module, a Z-axis sealing linear module, an electric rotating platform, a Wessenberg direct-writing module, a motion controller and a V-shaped clamp holder;
the workbench is fixed above the base, the Y-axis sealing linear modules are arranged on two sides above the base and comprise a Y-axis motor, a Y-axis sliding rail and a Y-axis sliding block, the Y-axis sliding block is arranged on the Y-axis sliding rail, and the Y-axis motor is used for driving the Y-axis sliding block to slide along the Y-axis sliding rail;
the X-axis sealing linear module comprises an X-axis motor, an X-axis sliding rail and an X-axis sliding block, wherein two ends of the X-axis sliding rail are fixed on the Y-axis sliding block, the X-axis sliding block is arranged on the X-axis sliding rail, and the X-axis motor is used for driving the X-axis sliding block to slide along the X-axis sliding rail;
the Z-axis sealing linear module comprises a Z-axis motor, a Z-axis slide rail and a Z-axis slide block, the Z-axis slide rail is fixed on the X-axis slide block, the Z-axis slide block is arranged on the Z-axis slide rail, the Z-axis motor is used for driving the Z-axis slide block to slide along the Z-axis slide rail, and the X-axis slide rail, the Y-axis slide rail and the Z-axis slide rail are mutually perpendicular in pairs;
the electric rotating table is fixed on the Z-axis sliding block, the Weisenberg direct-writing module is fixed on the electric rotating table, and the electric rotating table drives the Weisenberg direct-writing module to swing when rotating;
the V-shaped clamp holder is arranged on the workbench and used for clamping and fixing the cylindrical surface substrate;
the controller is used for reading four-axis G codes and controlling the X-axis motor, the Y-axis motor, the Z-axis motor and the electric rotating table to move, so that the Weisenberg direct writing module performs curved surface concurrent direct writing on the cylindrical surface substrate to form a ceramic film sensitive grid and a welding spot, and in the curved surface concurrent direct writing process, the ejection direction of raw materials of the Weisenberg direct writing module coincides with the normal direction of a curved surface.
2. The apparatus of claim 1, wherein the V-shaped holder comprises a V-shaped seat, a pressing block, a guide rod and a pressing screw, one end of the guide rod is fixed on the V-shaped seat, the pressing block is sleeved with the guide rod, and the pressing block is fixed on the guide rod through the pressing screw.
3. The device for preparing the cylindrical surface precursor ceramic film temperature sensor according to claim 1, wherein the wesenberg direct writing module comprises a connecting assembly, a rotating motor, a coupler, a microneedle, a liquid storage cavity, a check washer, a liquid storage cavity cover, a dispensing needle head and a direct current power supply, wherein the connecting assembly comprises a connecting plate, a motor fixing plate, a liquid storage cavity fixing plate, a first set screw and a second set screw;
the connecting plate is fixed on the electric rotating table, the motor fixing plate is installed the connecting plate upside, stock solution chamber fixed plate is installed the connecting plate downside, the rotating electrical machines is installed on the motor fixing plate, be used for the drive the micropin is rotatory, the one end of shaft coupling with the output shaft registrates of rotating electrical machines, the other end with the micropin registrates, and pass through first holding screw, second holding screw respectively with the output shaft and the micropin fixed connection of rotating electrical machines, the upper end cover in stock solution chamber is established behind the lock washer with stock solution chamber fixed plate threaded connection, the stock solution chamber is used for storing the raw materials of directly writing sensitive bars of ceramic film and solder joint, hold at stock solution chamber lid center the through-hole that the micropin passed behind the micropin with stock solution chamber threaded connection, the point is glued the syringe needle and is fixed stock solution chamber lower extreme, the micropin is worn to locate in the point glue syringe needle, DC power supply with the rotating electrical connection, be used for control the rotational speed of rotating electrical machines makes the raw materials of directly writing sensitive bars of ceramic film and solder joint follow in the micropin the little needle the stable outflow of gluing.
4. The apparatus of claim 3, wherein the micro-needle is flush with or extends into the outlet of the dispensing needle by 0-200 μm.
5. A method for manufacturing a cylindrical surface precursor ceramic film temperature sensor, characterized by using the apparatus for manufacturing a cylindrical surface precursor ceramic film temperature sensor according to any one of claims 1 to 4, comprising the steps of:
s1, correcting a V-shaped seat of the electric rotating table and the V-shaped holder to enable a dispensing needle head of the Wessenberg direct writing module to be perpendicular to the workbench, and enabling two side faces of the V-shaped seat to be parallel to the Y-axis slide rail;
s2, ultrasonically cleaning a cylindrical surface substrate by sequentially using acetone, alcohol and deionized water, placing the cylindrical surface substrate on the V-shaped seat after cleaning, pressing the cylindrical surface substrate by using a pressing block of the V-shaped clamp holder and fixing by using a pressing screw, so that the cylindrical surface substrate is parallel to the two side surfaces and the bottom surface of the V-shaped seat respectively;
s3, 50wt% -60wt% of TiB 2 Adding the powder into 40-50wt% SiCN precursor ceramic solution to form raw materials of a direct-writing ceramic film sensitive grid and a welding spot, magnetically stirring for 1h at normal temperature, and injecting into a liquid storage cavity of the Wessenberg direct-writing module;
s4, moving a liquid outlet port of the dispensing needle head to a machining original point, setting the machining original point as a machine tool coordinate system original point, and after resetting, coinciding with a workpiece coordinate system according to which the four-axis G codes are generated;
s5, loading the four-axis G code into the motion controller, switching on a direct current power supply of the Wessenburg direct-writing module, giving a proper voltage, stably conveying the raw materials of the direct-writing ceramic film sensitive grid and the welding spot, executing the four-axis G code, and directly writing the ceramic film sensitive grid on the curved surface of the cylindrical surface substrate in a conformal manner;
s6, pre-curing the ceramic film sensitive grid in the air;
s7, placing the pre-cured ceramic film sensitive grid into a tubular furnace, and sintering in an air atmosphere to pyrolyze the ceramic film sensitive grid;
s8, respectively spot-coating a proper amount of welding spots at the head end and the tail end of the pyrolyzed ceramic film sensitive grid, and respectively fixing lead wires on the grooves of the fixing piece;
s9, adhering the slotted side of the fixing piece to the welding spot, and pre-curing the welding spot in air;
and S10, sintering the product obtained in the step S9 in an air atmosphere after the product is placed in a tube furnace so as to pyrolyze the welding spot.
6. The cylindrical surface precursor ceramic film temperature sensor is characterized by comprising a cylindrical surface substrate, a ceramic film sensitive grid, a welding point, a lead and a fixing piece, wherein the ceramic film sensitive grid and the welding point are conformally laid on the cylindrical surface substrate by a Wessenberg direct writing forming technology and are prepared by thermal decomposition and ceramic formation, the welding point is arranged on the ceramic film sensitive grid, the lead is connected with the welding point, and the fixing piece covers the welding point.
7. The cylindrical surface precursor ceramic film temperature sensor according to claim 6, wherein the cylindrical surface substrate is a cylindrical part which can resist temperature exceeding 800 ℃ and is insulated at high temperature, and the processing origin point in direct writing is set on the highest generatrix of the cylindrical surface substrate.
8. The cylindrical surface precursor ceramic film temperature sensor according to claim 6, wherein the ceramic film sensitive grid is comb-shaped and has a thickness of 5 μm to 30 μm.
9. The cylindrical surface precursor ceramic film temperature sensor according to claim 6, wherein a slot is formed on the side of the fixing member close to the welding point, and the lead is in interference fit with the slot and led out from the slot.
10. The cylindrical surface precursor ceramic film temperature sensor according to claim 6, wherein the raw material composition for direct writing the ceramic film sensitive grid and the welding spot comprises: 50wt% -60wt% TiB 2 Powder and 40-50wt% SiCN precursor ceramic solution.
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| CN117030043A (en) * | 2023-08-08 | 2023-11-10 | 岭南师范学院 | Curved polymer precursor ceramic film temperature sensor and preparation method thereof |
| CN117030043B (en) * | 2023-08-08 | 2024-03-19 | 岭南师范学院 | Curved polymer precursor ceramic film temperature sensor and preparation method thereof |
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