CN115896786A - Stainless steel etching solution - Google Patents
Stainless steel etching solution Download PDFInfo
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- CN115896786A CN115896786A CN202211268245.3A CN202211268245A CN115896786A CN 115896786 A CN115896786 A CN 115896786A CN 202211268245 A CN202211268245 A CN 202211268245A CN 115896786 A CN115896786 A CN 115896786A
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- stainless steel
- etching solution
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- 238000005530 etching Methods 0.000 title claims abstract description 327
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 186
- 239000010935 stainless steel Substances 0.000 title claims abstract description 186
- 239000002738 chelating agent Substances 0.000 claims abstract description 28
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000008367 deionised water Substances 0.000 claims abstract description 23
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000007800 oxidant agent Substances 0.000 claims abstract description 16
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims abstract description 13
- 230000001590 oxidative effect Effects 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 37
- -1 linfelon Chemical compound 0.000 claims description 26
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 21
- UMGDCJDMYOKAJW-UHFFFAOYSA-N aminothiocarboxamide Natural products NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 19
- UOFGSWVZMUXXIY-UHFFFAOYSA-N 1,5-Diphenyl-3-thiocarbazone Chemical compound C=1C=CC=CC=1N=NC(=S)NNC1=CC=CC=C1 UOFGSWVZMUXXIY-UHFFFAOYSA-N 0.000 claims description 15
- 239000005725 8-Hydroxyquinoline Substances 0.000 claims description 15
- 229960003540 oxyquinoline Drugs 0.000 claims description 15
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 claims description 15
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 8
- 229910017604 nitric acid Inorganic materials 0.000 claims description 8
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 6
- DZCAZXAJPZCSCU-UHFFFAOYSA-K sodium nitrilotriacetate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CC([O-])=O DZCAZXAJPZCSCU-UHFFFAOYSA-K 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 2
- 229920000388 Polyphosphate Polymers 0.000 claims description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 2
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 2
- 239000001205 polyphosphate Substances 0.000 claims description 2
- 235000011176 polyphosphates Nutrition 0.000 claims description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 2
- 229940074439 potassium sodium tartrate Drugs 0.000 claims description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 2
- 229940061605 tetrasodium glutamate diacetate Drugs 0.000 claims description 2
- 229940080258 tetrasodium iminodisuccinate Drugs 0.000 claims description 2
- UZVUJVFQFNHRSY-OUTKXMMCSA-J tetrasodium;(2s)-2-[bis(carboxylatomethyl)amino]pentanedioate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CC[C@@H](C([O-])=O)N(CC([O-])=O)CC([O-])=O UZVUJVFQFNHRSY-OUTKXMMCSA-J 0.000 claims description 2
- GYBINGQBXROMRS-UHFFFAOYSA-J tetrasodium;2-(1,2-dicarboxylatoethylamino)butanedioate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CC(C([O-])=O)NC(C([O-])=O)CC([O-])=O GYBINGQBXROMRS-UHFFFAOYSA-J 0.000 claims description 2
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 claims description 2
- DCCWEYXHEXDZQW-BYPYZUCNSA-N (2s)-2-[bis(carboxymethyl)amino]butanedioic acid Chemical compound OC(=O)C[C@@H](C(O)=O)N(CC(O)=O)CC(O)=O DCCWEYXHEXDZQW-BYPYZUCNSA-N 0.000 claims 1
- 229940024606 amino acid Drugs 0.000 claims 1
- 238000002791 soaking Methods 0.000 claims 1
- 150000007522 mineralic acids Chemical class 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- 238000003756 stirring Methods 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 24
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 20
- 239000000203 mixture Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 9
- 239000007921 spray Substances 0.000 description 9
- 238000009472 formulation Methods 0.000 description 7
- 229910021645 metal ion Inorganic materials 0.000 description 6
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 4
- JGUQDUKBUKFFRO-CIIODKQPSA-N dimethylglyoxime Chemical compound O/N=C(/C)\C(\C)=N\O JGUQDUKBUKFFRO-CIIODKQPSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 230000009920 chelation Effects 0.000 description 2
- 229910001430 chromium ion Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910001453 nickel ion Inorganic materials 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229940009098 aspartate Drugs 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- ing And Chemical Polishing (AREA)
Abstract
The invention discloses a stainless steel etching solution which comprises an oxidant, an inorganic acid, an organic acid and a chelating agent. The stainless steel etching solution comprises, by mass, 20-30% of ferric trichloride, 15-20% of 37% hydrochloric acid, 10-25% of an oxidant, 10-15% of a chelating agent, and the balance of deionized water. The stainless steel etching solution has stable etching rate, smooth etching surface and long service life.
Description
Technical Field
The invention relates to an etching solution for a stainless steel plate, belonging to the technical field of electronic chemicals.
Background
The stainless steel has high temperature resistance, corrosion resistance, stronger processing performance and high toughness, and is used for manufacturing precision instruments. Conventional chemicals cannot be effectively etched, the requirements cannot be met only by traditional mechanical polishing, and the polished surface is rough and cannot be applied to manufacturing of precise devices.
The chemical liquid medicine wet etching has various characteristics, the metal ions generated in the etching process can cause the concentration of ions in the solution to be increased, the forward proceeding of the reaction is prevented, a proper and effective chelating agent needs to be added into the etching solution to chelate the metal ions generated in the solution due to the reaction, the free metal ions in the solution are reduced, the forward proceeding of the etching reaction is promoted, and the stable etching rate of the etching solution is kept.
The surface of the etched stainless steel needs to be polished to ensure the surface smoothness and the etching life cannot be guaranteed by the currently used etching solution, so that the stainless steel etching solution with the smooth surface and the long etching life needs to be provided.
Disclosure of Invention
In view of the above circumstances, an object of the present invention is to provide an etching solution which has a long etching life and can provide a smooth surface of stainless steel after etching.
In order to achieve the purpose, the technical scheme provided by the invention is as follows.
The stainless steel etching solution comprises the following components in percentage by weight:
20-30% of ferric trichloride, 15-20% of 37% hydrochloric acid, 10-25% of oxidant, 10-15% of chelating agent and the balance of deionized water.
In the etching solution of the present invention, the chelating agent is one or more selected from ethylenediaminetetraacetic acid, nitrilotriacetic acid, dithizone, 8-hydroxyquinoline, linfield, sodium nitrilotriacetate, potassium sodium tartrate, ammonium citrate, polyphosphate, tetrasodium glutamate diacetate, tetrasodium iminodisuccinate, tetrasodium aspartate, trisodium methyl aminoacetate diacetate, dimethylglyoxime, and acetylacetone.
Further, the chelating agent is selected from one or more of dithizone, 8-hydroxyquinoline, dimethylglyoxime, acetylacetone, nitrilotriacetic acid and sodium nitrilotriacetate.
In the etching solution of the invention, the oxidant is selected from one or more of nitric acid, perchloric acid, ammonium persulfate, peroxyacetic acid and thiourea peroxide.
Still further, the oxidizing agent is one or two of nitric acid, peroxyacetic acid and thiourea peroxide.
The stainless steel etching solution and the stainless steel mainly carry out the following chemical reactions:
Fe+2FeCl 3 ＝ 3FeCl 2 ；
2Fe+6H + ＝ Fe 3+ +3H 2 ↑；
Cr+2HCl===CrCl 2 +H 2 ↑；
4CrCl 2 +4HCl+O2=4CrCl 3 +2H 2 O；
4Fe 2+ +O 2 +4H + ＝ 4Fe 3+ +2H 2 O；
Ni+2HNO 3 ＝ Ni(NO 3 ) 2 +H 2 ↑；
Fe+3HCl+HNO 3 ＝ FeCl 3 +NO+2H 2 O；
Fe+2CH 3 COOH=（CH 3 COO）Fe+H 2 O 2 。
the invention has the advantages and beneficial effects that: compared with the prior art, the stainless steel etching solution provided by the invention has the advantages that the etching surface is smooth, and the service life of the etching solution is long.
(1) The etching solution contains nitric acid or thiourea peroxide, and can oxidize iron, nickel and the like in stainless steel to promote the etching of the stainless steel. And the sulfur element separated from the thiourea peroxide can precipitate heavy metal ions in the etched solution and promote the etching reaction.
(2) Chromium is easily oxidized at normal temperature to form a compact oxide layer for passivation, and the chromium does not react with nitric acid any more, so that hydrochloric acid in the etching solution promotes the dissolution of chromium oxide, and the etching of chromium is accelerated.
(3) According to the invention, a proper amount of one or more of chelating agents dithizone, 8-hydroxyquinoline, dimethylglyoxime, acetylacetone, nitrilotriacetic acid and sodium nitrilotriacetate is added into the etching solution, and iron ions, nickel ions and chromium ions in the etching solution are subjected to chelation reaction with the chelating agent, so that the content of free metal ions in the etching solution is reduced, and the long etching life of the etching solution can be ensured.
(4) According to the invention, a proper amount of one or more of chelating agent dithizone, 8-hydroxyquinoline, dimethylglyoxime, acetylacetone, nitrilotriacetic acid and nitrilotriacetic acid is added into the etching solution, and iron ions, nickel ions and chromium ions in the etched solution and the chelating agent are subjected to chelation reaction, so that the content of free metal ions in the solution is reduced, the aggregation of the metal ions on the surface of stainless steel to form point etching is avoided, and the etching uniformity of the surface of the stainless steel is adjusted.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to specific embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The embodiment 1 is an etching solution using nitric acid as an oxidant and an etching effect thereof, and specifically includes the following steps:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 30% of 70% of nitric acid and the balance of deionized water by mass percentage.
500mL of the etching solution prepared according to the proportion is used for etching a 4 x 4cm stainless steel sheet at 35 ℃, and the stirring speed is 400r/min. The thickness of the stainless steel sheet before etching is 1.38mm, and after 10min etching, the thickness of the stainless steel sheet is 1.28mm, and the etching rate is 10 μm/min. The reaction is violent in the etching process, a large amount of sharp yellow smoke is emitted, the surface of the etched stainless steel is bright silver, the granular feeling is obvious, the roughness Ra is 210nm, and the requirement of a precision device on the surface roughness cannot be met.
And etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min in the residual 500mL, taking out the residual etched stainless steel plates, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.37mm, and after 10min of etching, the thickness of the stainless steel plate is 1.34mm, the etching rate is 3 mu m/min.
Example 2
9000mL of the specific formula of the embodiment 2 is prepared according to the embodiment 1, 4500mL of the etching solution prepared according to the proportion is used for etching a 4 x 4cm stainless steel block at 35 ℃, the thickness of the stainless steel plate is 1.38mm before etching, a rotary spraying mode is adopted for etching, deionized water is firstly adopted for spraying, surface stains are removed, the solution speed is 200mL/min during spraying, the rotation speed is 400r/min, after 10min of etching, deionized water is adopted for cleaning, and N2 is adopted for drying. The thickness of the stainless steel plate was 1.25mm, and the etching rate was 13 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 200nm.
And removing surface stains on 18 stainless steel plates with the length of 4-4 cm at 35 ℃ by using deionized water in 4500mL of the rest stainless steel plates, etching for 100min at the stirring speed of 400r/min, taking out the rest stainless steel plates after etching, collecting used etched liquid medicine, and performing spray etching on a new stainless steel plate by using the collected liquid medicine according to the etching method for 10min, wherein the thickness of the stainless steel plate before etching is 1.36mm, the thickness of the stainless steel plate after etching is 1.25mm, and the etching speed is 11 mu m/min.
Example 3
The embodiment 3 is an etching solution using thiourea peroxide as an oxidant and an etching effect thereof, and specifically includes the following steps:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide and the balance of deionized water according to mass percentage.
500mL of the etching solution prepared according to the proportion is used for etching a stainless steel block with the length of 4 x 4cm at the temperature of 35 ℃, and the stirring speed is 400r/min. Before etching, the thickness of the stainless steel plate is 1.37mm, after 10min etching, the thickness of the stainless steel plate is 1.18mm, and the etching rate is 19 μm/min. The reaction is violent in the etching process, the surface of the etched stainless steel is bright silver, the roughness Ra is 178nm, and the requirement of a precision device on the surface roughness cannot be met.
Etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min for the rest 500mL, taking out the rest stainless steel plates after etching, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.37mm, and after 10min of etching, the thickness of the stainless steel plate is 1.32, the etching rate is 5 mu m/min, and the etching rate is greatly reduced.
Example 4
In the specific formulation of example 4, 9000mL of the etching solution prepared according to the proportion is prepared according to example 3, 4500mL of the etching solution is used for etching a 4 x 4cm stainless steel block at 35 ℃, the thickness of the stainless steel plate is 1.38mm before etching, the etching method of example 2 is used for 10min, the thickness of the stainless steel plate is 1.14mm, and the etching rate is 24 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 170nm.
4500mL of the residual stainless steel plate is subjected to deionized water at 35 ℃ to remove surface stains on 18 stainless steel plates of 4 x 4cm, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plate after etching is taken out, a new stainless steel plate is subjected to spray etching for 10min according to the etching method of the embodiment 2, the thickness of the stainless steel plate before etching is 1.39mm, the thickness of the stainless steel plate after etching is 1.27mm, and the etching speed is 12 mu m/min.
Example 5
The embodiment 5 is an etching solution using thiourea peroxide as an oxidant and adding 10% chelating agent dithizone and an etching effect thereof, and specifically comprises the following components:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide, 10% of dithizone and the balance of deionized water by mass percent.
500mL of the etching solution prepared according to the proportion is used for etching a stainless steel block with the length of 4 x 4cm at the temperature of 35 ℃, and the stirring speed is 400r/min. The thickness of the stainless steel plate before etching is 1.38mm, and after 10min etching, the thickness of the stainless steel plate is 1.16mm, and the etching rate is 22 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 143nm.
Etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min in the residual 500mL, then taking out the residual stainless steel plates after etching, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.37mm, after 10min of etching, the thickness of the stainless steel plate is 1.24, the etching rate is 13 mu m/min, after adding the chelating agent, the etching rate of the etching solution is reduced after etching a certain amount of stainless steel plates, the number of etchable stainless steel plates is increased, and the etching service life of the etching solution is prolonged.
Example 6
In the specific formulation of example 6, 9000mL of the etching solution prepared according to the proportion is prepared according to example 5, 4500mL of the etching solution is used for etching a 4 x 4cm stainless steel block at 35 ℃, the thickness of the stainless steel plate is 1.38mm before etching, the etching method of example 2 is used for 10min, the thickness of the stainless steel plate is 1.13mm, and the etching rate is 25 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 120nm.
4500mL of the residual stainless steel plate is subjected to deionized water at 35 ℃ to remove surface stains on 18 stainless steel plates of 4 x 4cm, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plate after etching is taken out, a new stainless steel plate is subjected to spray etching for 10min according to the etching method of the embodiment 2, the thickness of the stainless steel plate before etching is 1.39mm, the thickness of the stainless steel plate after etching is 1.21mm, and the etching speed is 18 mu m/min.
Example 7
The embodiment 7 is an etching solution using thiourea peroxide as an oxidant and adding 10% of chelating agent 8-hydroxyquinoline and the etching effect thereof, and the specific steps are as follows:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide, 10% of 8-hydroxyquinoline and the balance of deionized water by mass percent.
500mL of the etching solution prepared according to the proportion is used for etching a stainless steel block with the length of 4 x 4cm at the temperature of 35 ℃, and the stirring speed is 400r/min. Before etching, the thickness of the stainless steel plate is 1.37mm, after 10min etching, the thickness of the stainless steel plate is 1.16mm, and the etching rate is 21 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 125nm.
Etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min for the rest 500mL, then taking out the residual etched stainless steel plates, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.37mm, and after 10min of etching, the thickness of the stainless steel plate is 1.21, the etching rate is 16 mu m/min, and the additive has the effect close to that of dithizone, so that the etching service life of the etching solution can be prolonged.
Example 8
In the specific formulation of example 8, 9000mL of the etching solution prepared according to the proportion is prepared according to example 7, 4500mL of the etching solution is used for etching a 4 x 4cm stainless steel block at 35 ℃, the thickness of the stainless steel plate is 1.38mm before etching, the etching method of example 2 is used for 10min, the thickness of the stainless steel plate is 1.14mm, and the etching rate is 24 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 105nm.
4500mL of the residual stainless steel plate is subjected to deionized water at 35 ℃ to remove surface stains on 18 stainless steel plates of 4 x 4cm, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plate after etching is taken out, a new stainless steel plate is subjected to spray etching for 10min according to the etching method of the embodiment 2, the thickness of the stainless steel plate before etching is 1.39mm, the thickness of the stainless steel plate after etching is 1.22mm, and the etching speed is 17 mu m/min.
Example 9
In the embodiment 9, thiourea peroxide is used as an oxidant, 10% of a chelating agent is added, and the chelating agent is an etching solution of a composition of 8-hydroxyquinoline and dithizone, and the etching effect is as follows:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide, 5% of 8-hydroxyquinoline, 5% of dithizone and the balance of deionized water by mass percentage.
500mL of the etching solution prepared according to the proportion is used for etching a stainless steel block with the length of 4 x 4cm at the temperature of 35 ℃, and the stirring speed is 400r/min. The thickness of the stainless steel plate before etching is 1.38mm, and after 10min etching, the thickness of the stainless steel plate is 1.17mm, and the etching rate is 21 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 107nm.
Etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min for the rest 500mL, taking out the rest stainless steel plates after etching, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.37mm, and after 10min of etching, the thickness of the stainless steel plate is 1.21mm, and the etching rate is 16 mu m/min.
Example 10
In the specific formulation of example 10, 9000mL of the etching solution prepared according to the above ratio was prepared according to example 9, 4500mL of the etching solution was used for etching a 4 x 4cm stainless steel block at 35 ℃, the thickness of the stainless steel plate before etching was 1.39mm, the etching method according to example 2 was used for 10min, the thickness of the stainless steel plate was 1.15mm, and the etching rate was 23 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 87nm.
4500mL of the residual stainless steel plate is subjected to deionized water at 35 ℃ to remove surface stains on 18 stainless steel plates of 4 x 4cm, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plate after etching is taken out, a new stainless steel plate is subjected to spray etching for 10min according to the etching method of the embodiment 2, the thickness of the stainless steel plate before etching is 1.39mm, the thickness of the stainless steel plate after etching is 1.19mm, and the etching speed is 20 mu m/min.
Example 11
In the embodiment 11, thiourea peroxide is used as an oxidant, 10% of a chelating agent is added, and the chelating agent is an etching solution of a composition of 8-hydroxyquinoline, acetylacetone and dithizone, and the etching effect is as follows:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide, 4% of 8-hydroxyquinoline, 4% of dithizone, 2% of acetylacetone and the balance of deionized water by mass percentage.
500mL of the etching solution prepared according to the proportion is used for etching a stainless steel block with the length of 4 x 4cm at the temperature of 35 ℃, and the stirring speed is 400r/min. The thickness of the stainless steel plate before etching is 1.36mm, and after 10min etching, the thickness of the stainless steel plate is 1.15mm, and the etching rate is 21 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 89nm.
Etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min for the rest 500mL, taking out the rest stainless steel plate after etching, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.37mm, and after 10min of etching, the thickness of the stainless steel plate is 1.22, and the etching rate is 15 mu m/min.
Example 12
In the specific formulation of example 12, 9000mL of the etching solution prepared in the above ratio was prepared in example 11, and 4500mL of the etching solution was used to etch a 4 x 4cm stainless steel block at 35 ℃ until the thickness of the stainless steel plate was 1.38mm, and the etching solution was etched in the etching method of example 2 for 10min until the thickness of the stainless steel plate was 1.15mm and the etching rate was 23 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 71nm.
4500mL of the residual stainless steel plate is subjected to deionized water at 35 ℃ to remove surface stains on 18 stainless steel plates of 4 x 4cm, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plate after etching is taken out, a new stainless steel plate is subjected to spray etching for 10min according to the etching method of the embodiment 2, the thickness of the stainless steel plate before etching is 1.39mm, the thickness of the stainless steel plate after etching is 1.21mm, and the etching speed is 18 mu m/min.
Example 13
In the embodiment 13, thiourea peroxide is used as an oxidizing agent, 12% of a chelating agent is added, and the chelating agent is an etching solution of a composition of 8-hydroxyquinoline, acetylacetone and dithizone, and the etching effect thereof is as follows:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide, 5% of 8-hydroxyquinoline, 5% of dithizone, 2% of acetylacetone and the balance of deionized water by mass percent.
500mL of the etching solution prepared according to the proportion is used for etching a stainless steel block with the length of 4 x 4cm at the temperature of 35 ℃, and the stirring speed is 400r/min. The thickness of the stainless steel plate before etching is 1.37mm, and after 10min etching, the thickness of the stainless steel plate is 1.15mm, and the etching rate is 22 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 70nm.
Etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min for the rest 500mL, taking out the rest stainless steel plates after etching, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.38mm, and after 10min of etching, the thickness of the stainless steel plate is 1.18mm, and the etching rate is 17 mu m/min.
Example 14
In the specific formulation of example 14, 9000mL of the etching solution prepared in the above ratio was prepared in example 13, and 4500mL of the etching solution prepared in the above ratio was used to etch a 4 x 4cm stainless steel block at 35 ℃, wherein the thickness of the stainless steel plate before etching was 1.38mm, the thickness of the stainless steel plate after etching was 1.13mm according to the etching method of example 2 for 10min, and the etching rate was 25 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 50nm.
4500mL of the residual stainless steel plate is subjected to deionized water at 35 ℃ to remove surface stains on 18 stainless steel plates of 4 x 4cm, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plate after etching is taken out, a new stainless steel plate is subjected to spray etching for 10min according to the etching method of the embodiment 2, the thickness of the stainless steel plate before etching is 1.39mm, the thickness of the stainless steel plate after etching is 1.17mm, and the etching speed is 22 mu m/min.
Example 15
In the embodiment 15, thiourea peroxide is used as an oxidizing agent, 15% of a chelating agent is added, and the chelating agent is an etching solution of a composition of 8-hydroxyquinoline, acetylacetone and dithizone, and the etching effect thereof is as follows:
preparing 1000mL of stainless steel etching solution, wherein the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide, 5% of 8-hydroxyquinoline, 5% of acetylacetone and the balance of deionized water according to mass percentage.
500mL of the etching solution prepared according to the proportion is used for etching a stainless steel block with the length of 4 x 4cm at the temperature of 35 ℃, and the stirring speed is 400r/min. Before etching, the thickness of the stainless steel plate is 1.38mm, after 10min etching, the thickness of the stainless steel plate is 1.14mm, and the etching rate is 24 mu m/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 56nm. The content of the chelating agent is increased, the roughness after etching is lower, and the requirement of a precision device on the surface smoothness is met.
Etching 24 x 4cm stainless steel plates at 35 ℃ for 100min at the stirring rate of 400r/min for the rest 500mL, taking out the rest stainless steel plates after etching, placing a new stainless steel plate for etching, wherein the thickness of the stainless steel plate before etching is 1.36mm, and after 10min of etching, the thickness of the stainless steel plate is 1.15mm, and the etching rate is 21 mu m/min.
Example 16
In the specific formulation of example 16, 9000mL of the etching solution prepared in the above ratio was prepared in example 15, 4500mL of the etching solution was used to etch a 4 x 4cm stainless steel block at 35 ℃, the thickness of the stainless steel plate before etching was 1.38mm, the etching method of example 2 was used to etch the stainless steel plate for 10min, the thickness of the stainless steel plate was 1.10mm, and the etching rate was 28 μm/min. The reaction is stable in the etching process, the surface is smooth after etching, and the roughness Ra is 34nm. Under the same formula condition, when the etching is carried out by adopting a rotary spraying mode, the etching rate is obviously accelerated due to the impact force of the solution and the influence of the retention time of the solution on the surface, and the solution can quickly take away the bubbles generated by the reaction in the rotating process, so that the influence of the bubbles on the surface appearance is reduced, and the surface is smoother.
After 4500mL of residual stainless steel plates with the surface stain of 18 pieces of 4 x 4cm are removed by deionized water at 35 ℃, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plates after etching are taken out, and a new piece of stainless steel plates are subjected to 10min of spray etching according to the etching method of the embodiment 2, wherein the thickness of the stainless steel plates before etching is 1.36mm, the thickness of the stainless steel plates after etching is 1.10mm, and the etching speed is 26 mu m/min.
Example 17
In the example 17, thiourea peroxide is used as an oxidizing agent, 15% of a chelating agent is added, and the chelating agent is sodium nitrilotriacetate.
9000mL of stainless steel etching solution is prepared, and the etching solution comprises 25% of ferric trichloride, 18% of 37% hydrochloric acid, 20% of thiourea peroxide, 15% of sodium nitrilotriacetate and the balance of deionized water by mass percent.
4500mL of the etching solution prepared according to the above ratio was used for etching a 4 x 4cm stainless steel block at 35 ℃ until the thickness of the stainless steel plate was 1.39mm, and the etching method of example 2 was used for 10min until the thickness of the stainless steel plate was 1.10mm and the etching rate was 29 μm/min.
4500mL of the residual stainless steel plate is subjected to deionized water at 35 ℃ to remove surface stains on 18 stainless steel plates of 4 x 4cm, etching is carried out for 100min under the condition that the stirring speed is 400r/min, then the residual stainless steel plate after etching is taken out, a new stainless steel plate is subjected to spray etching for 10min according to the etching method of the embodiment 2, the thickness of the stainless steel plate before etching is 1.37mm, the thickness of the stainless steel plate after etching is 1.09mm, and the etching speed is 28 mu m/min.
The formula only contains one chelating agent, can achieve the effect of mixing and preparing the chelating agent, has high etching rate and smooth surface, and meets the requirement of serving as equipment accessories.
The stainless steel etching solution of the present invention is described in detail above, and the above description is only a specific embodiment of the present invention and is not intended to limit the scope of the present invention, and it will be apparent to those skilled in the art that some modifications or improvements may be made on the basis of the present invention. Accordingly, it is intended that all such modifications and alterations be included within the scope of this invention as defined in the appended claims.
Claims (7)
1. The stainless steel etching solution is characterized by comprising the following components:
20-30% of ferric trichloride, 15-20% of 37% hydrochloric acid, 10-25% of oxidant, 10-15% of chelating agent and the balance of deionized water.
2. The stainless steel etching solution according to claim 1, wherein: the chelating agent is selected from one or more of ethylenediamine tetraacetic acid, nitrilotriacetic acid, dithizone, 8-hydroxyquinoline, linfelon, sodium nitrilotriacetate, potassium sodium tartrate, ammonium citrate, polyphosphate, tetrasodium glutamate diacetate, tetrasodium iminodisuccinate, tetrasodium aspartate diacetate and trisodium methyl amino acid diacetate.
3. The stainless steel etching solution of claim 1, wherein: the oxidant is selected from one or more of nitric acid, perchloric acid, ammonium persulfate and thiourea peroxide.
4. The stainless steel etching solution of claim 1, wherein: the mass content of ferric trichloride is 22-28%.
5. The stainless steel etching solution of claim 1, wherein: the mass content of the 70% nitric acid is 28-32%.
6. The stainless steel etching solution of claim 1, wherein: the stainless steel etched by the etching solution is S M S304.
7. A method for etching a stainless steel sheet, characterized by comprising: the etching solution is used for etching in a soaking or rotary spraying mode in the process of etching the stainless steel.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107279A (en) * | 1990-08-27 | 1992-04-08 | Nippon Steel Corp | Production of etched stainless steel product |
| JPH10251877A (en) * | 1997-03-14 | 1998-09-22 | Nippon Steel Corp | Etching property evaluating liquid for stainless steel and etching property evaluating method therefor |
| CN101173360A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区汉达精密电子科技有限公司 | Stainless steel etching technique |
| CN102234806A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Stainless steel etching solution and etching method |
| KR20140045121A (en) * | 2012-10-08 | 2014-04-16 | 동우 화인켐 주식회사 | Etchant composition for copper-containing metal layer |
| CN104233302A (en) * | 2014-09-15 | 2014-12-24 | 南通万德科技有限公司 | Etching liquid and application thereof |
| CN105039987A (en) * | 2015-08-18 | 2015-11-11 | 广东富行洗涤剂科技有限公司 | Stainless steel etching solution composition |
| CN107858685A (en) * | 2017-11-15 | 2018-03-30 | 深圳市华星光电技术有限公司 | Etching solution and its application for copper/molybdenum film layer |
| CN108360058A (en) * | 2018-03-23 | 2018-08-03 | 中山大学 | A kind of electrolyte and stainless steel engraving method for etching stainless steel |
| CN111041207A (en) * | 2019-11-28 | 2020-04-21 | 中国电器科学研究院股份有限公司 | Electrochemical gold leaching agent and method for recovering gold from waste gold-plated circuit board |
-
2022
- 2022-10-17 CN CN202211268245.3A patent/CN115896786A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04107279A (en) * | 1990-08-27 | 1992-04-08 | Nippon Steel Corp | Production of etched stainless steel product |
| JPH10251877A (en) * | 1997-03-14 | 1998-09-22 | Nippon Steel Corp | Etching property evaluating liquid for stainless steel and etching property evaluating method therefor |
| CN101173360A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区汉达精密电子科技有限公司 | Stainless steel etching technique |
| CN102234806A (en) * | 2010-04-23 | 2011-11-09 | 比亚迪股份有限公司 | Stainless steel etching solution and etching method |
| KR20140045121A (en) * | 2012-10-08 | 2014-04-16 | 동우 화인켐 주식회사 | Etchant composition for copper-containing metal layer |
| CN104233302A (en) * | 2014-09-15 | 2014-12-24 | 南通万德科技有限公司 | Etching liquid and application thereof |
| CN105039987A (en) * | 2015-08-18 | 2015-11-11 | 广东富行洗涤剂科技有限公司 | Stainless steel etching solution composition |
| CN107858685A (en) * | 2017-11-15 | 2018-03-30 | 深圳市华星光电技术有限公司 | Etching solution and its application for copper/molybdenum film layer |
| CN108360058A (en) * | 2018-03-23 | 2018-08-03 | 中山大学 | A kind of electrolyte and stainless steel engraving method for etching stainless steel |
| CN111041207A (en) * | 2019-11-28 | 2020-04-21 | 中国电器科学研究院股份有限公司 | Electrochemical gold leaching agent and method for recovering gold from waste gold-plated circuit board |
Non-Patent Citations (5)
| Title |
|---|
| 傅玉婷;巴俊洲;蒋亚雄;颜飞雪;: "不锈钢蚀刻速率影响因素研究", 电镀与精饰, no. 02, pages 34 - 36 * |
| 化学工业部科学技术情报研究所编: "《化工产品手册 有机化工原料上》", 化学工业出版社, pages: 538 - 539 * |
| 张永成;卢建树;: "化学蚀刻304不锈钢表面结构研究", 表面技术, no. 01, pages 122 - 176 * |
| 朱凯等: ""基于微纳米孔洞结构的彩色超疏水不锈钢表面的制备"", 《电镀与精饰》, pages 260 - 207 * |
| 辛菲;李磊;王秋旺;: "流体微通道浸泡蚀刻技术实验", 化工学报, no. 10, pages 4115 - 4122 * |
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