CN115895590A - Hot-melt UV (ultraviolet) curing organic silicon OCA (optically clear adhesive) - Google Patents
Hot-melt UV (ultraviolet) curing organic silicon OCA (optically clear adhesive) Download PDFInfo
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- CN115895590A CN115895590A CN202211116466.9A CN202211116466A CN115895590A CN 115895590 A CN115895590 A CN 115895590A CN 202211116466 A CN202211116466 A CN 202211116466A CN 115895590 A CN115895590 A CN 115895590A
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Abstract
The invention discloses a hot-melt UV curing organic silicon OCA, which specifically comprises the following raw materials in parts by mass: 100 parts of an organic silicon prepolymer; 45-85 parts of hot-melt resin; 40-65 parts of reactive diluent; 1-3 parts of a photoinitiator; 0.5-1 part of additive. The hot-melt UV-cured organic silicon OCA is good in bonding strength, excellent in light transmittance and good in aging resistance.
Description
Technical Field
The invention relates to the technical field of organic silicon OCA, in particular to hot-melt UV curing organic silicon OCA.
Background
The light curing technology has the characteristics of energy conservation and environmental protection, and the light curing organic silicon material has the excellent performance of the organic silicon material and the characteristics of high efficiency and energy conservation of the light curing technology, so that the application of the light curing organic silicon material is expanded to a wider field. In the prior art, acrylate optical adhesives, epoxy resin optical adhesives, polyurethane optical adhesives and the like are generally used, but in practical application, the epoxy optical adhesives contain a large number of active groups in molecules, so that the epoxy optical adhesives have high bonding strength but poor aging resistance and are easy to suffer from diseases, and the polyurethane optical adhesives have good impact resistance and aging resistance but have obvious insufficient moisture resistance. The acrylate optical adhesive is the most applied in various fields, and has the problems of foaming, yellowing, aging and the like in the forming process although the comprehensive performance is better.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a hot-melt UV curing organic silicon OCA, and the raw material formula of the organic silicon OCA comprises the following raw materials in parts by mass:
100 parts of an organic silicon prepolymer;
45-85 parts of hot-melt resin;
40-65 parts of reactive diluent;
1-3 parts of a photoinitiator;
0.5-1 part of additive;
preferably, the organic silicon prepolymer is vinyl-terminated polysiloxane.
Preferably, the hot-melt resin is one or a combination of several of methyl vinyl MQ resin, methyl phenyl MQ resin, EVA resin, LOPE resin and HDPE resin.
Preferably, the reactive diluent is a vinyl ether monomer;
the vinyl ether monomer is vinyl ether monomer mainly comprising hydroxybutyl vinyl ether (HBVE), triethylene glycol divinyl ether (DVE-3), 1, 4-cyclohexyl dimethanol divinyl ether (CHVE) and Butyl Vinyl Ether (BVE);
preferably, the photoinitiation is liquid TPO (diphenyl- (2, 4, 6-trimethylbenzoyl) oxyphosphorus).
Preferably, the additive is an adhesion promoter; the adhesion promoter is a phosphorus-containing acrylate adhesion promoter.
The invention also provides a preparation method of the hot-melt UV-cured organic silicon OCA, which comprises the steps of adding the organic silicon prepolymer, the reactive diluent, the photoinitiator and the hot-melt resin into a kneader, kneading uniformly at a high temperature until the mixture is colorless and transparent, cooling to room temperature, adding the additive, and kneading uniformly under negative pressure to obtain the hot-melt UV-cured organic silicon OCA.
Has the advantages that:
the invention adopts the organic silicon prepolymer with a proper chemical structure to carry out the photocuring reaction, thereby improving the operability of the glue in the curing process. The vinyl-terminated organic silicon prepolymer is adopted in the invention, the photocuring speed is high during the photocuring reaction, and meanwhile, the problem of bubble generation in the attaching process is avoided. In addition, the adhesion promoter is adopted in the application, so that the bonding strength of the optical cement can be greatly improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
Example 1
The invention provides a hot-melt UV curing organic silicon OCA, which is composed of the following raw materials in parts by mass:
100 parts of vinyl-terminated polysiloxane, 75 parts of methyl vinyl MQ resin, 50 parts of active diluent BVE, 1.5 parts of photoinitiator LTPO and 0.5 part of adhesion promoter PM-1.
The preparation method of the hot-melt UV-cured organosilicon OCA comprises the steps of adding vinyl-terminated polysiloxane, BVE, LTPO and methyl vinyl MQ resin into a kneader, kneading uniformly at a high temperature until colorless and transparent, cooling to room temperature, adding PM-1, and kneading the mixture uniformly at a negative pressure to obtain the hot-melt UV-cured organosilicon OCA.
Example 2
The invention provides a hot-melt UV curing organic silicon OCA, which is composed of the following raw materials in parts by mass:
100 parts of vinyl-terminated polysiloxane, 70 parts of methyl vinyl MQ resin, 60 parts of reactive diluent HBVE, 1 part of photoinitiator LTPO and 0.8 part of adhesion promoter PM-2.
The preparation method of the hot-melt UV-cured organic silicon OCA comprises the steps of adding vinyl-terminated polysiloxane, HBVE, LTPO and methyl phenyl MQ resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding PM-2, and kneading uniformly the mixture under negative pressure to obtain the hot-melt UV-cured organic silicon OCA.
Example 3
The invention provides a hot-melt UV curing organic silicon OCA, which is composed of the following raw materials in parts by mass:
100 parts of vinyl-terminated polysiloxane, 60 parts of EVA resin, 70 parts of HBVE (ethylene vinyl acetate), 2.3 parts of LTPO (photoinitiator LTPO) and 0.5 part of PM (adhesion promoter).
The preparation method of the hot-melt UV-cured organic silicon OCA comprises the steps of adding vinyl-terminated polysiloxane, HBVE, LTPO and EVA resin into a kneader, kneading uniformly at high temperature until colorless and transparent, cooling to room temperature, adding PM-2, and kneading uniformly the mixture under negative pressure to obtain the hot-melt UV-cured organic silicon OCA.
The comparative example selects the prior acrylate full-lamination glue L.
Performance test
And (3) testing light transmittance: the silicone OCA obtained in the examples and comparative examples was measured according to the standard ASTM D1003-13, the results of which are given in the following table;
the refractive index of the silicone OCA prepared in the examples and the comparative examples is measured according to the national standard GB/T6448-2008, and the test results are shown in the following table;
and (3) testing the adhesive force: the initial viscosity test is carried out according to the method of the national standard GB/T4582-2002; the 180 DEG peel strength test is carried out according to the method of national standard GB2792-1998, and the test results are shown in the following table;
and (3) testing high temperature and high humidity resistance: the environmental setting conditions are that the temperature is 85 ℃ and the humidity is 85%, the sample is placed for 2000h, and the denaturation condition of each sample is observed;
the following table shows the results of performance tests on silicone OCAs prepared in the examples and comparative examples:
according to the performance test result, the organic silicon OCA optical adhesive prepared by the invention has excellent high-temperature and high-humidity resistance, can still maintain the appearance characteristic under the long-time high-temperature and high-humidity environment treatment, has no bubble, no whitening and yellowing phenomena, has better light transmittance and refractive index, and high bonding strength and peeling strength, and can adapt to various application scenes.
Claims (8)
1. The hot-melt UV-cured organic silicon OCA is characterized in that the raw material formula of the organic silicon OCA comprises the following raw materials in parts by mass:
100 parts of an organic silicon prepolymer;
45-85 parts of hot-melt resin;
40-65 parts of reactive diluent;
1-3 parts of a photoinitiator;
0.5-1 part of additive.
2. The hot-melt UV-curable silicone OCA according to claim 1, wherein the silicone prepolymer is a vinyl-terminated polysiloxane.
3. The hot-melt UV-curable silicone OCA according to claim 1, wherein the hot-melt resin is one or a combination of several of a methyl vinyl MQ resin, a methyl phenyl MQ resin, an EVA resin, an LOPE resin, and an HDPE resin.
4. The hot-melt UV-curable silicone OCA according to claim 1, characterized in that the reactive diluent is a vinyl ether monomer.
5. The hot-melt UV-curable silicone OCA according to claim 4, wherein said vinyl ether monomer is selected from the group consisting of vinyl ether monomers consisting essentially of hydroxybutyl vinyl ether (HBVE), triethylene glycol divinyl ether (DVE-3), 1, 4-cyclohexyl dimethanol divinyl ether (CHVE), butyl Vinyl Ether (BVE).
6. The hot-melt UV-curable silicone OCA according to claim 5, wherein said photoinitiator is liquid TPO (diphenyl- (2, 4, 6-trimethylbenzoyl) oxyphosphorus).
7. The hot-melt UV-curable silicone OCA according to claim 1, characterized in that the additive is an adhesion promoter; the adhesion promoter is a phosphorus-containing acrylate adhesion promoter.
8. A preparation method of hot-melt UV-cured organic silicon OCA is characterized by adding an organic silicon prepolymer, an active diluent, a photoinitiator and hot-melt resin into a kneader, kneading uniformly at a high temperature until colorless and transparent, cooling to room temperature, adding an additive, and kneading uniformly the mixture under negative pressure to obtain the hot-melt UV-cured organic silicon OCA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211116466.9A CN115895590A (en) | 2022-09-14 | 2022-09-14 | Hot-melt UV (ultraviolet) curing organic silicon OCA (optically clear adhesive) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211116466.9A CN115895590A (en) | 2022-09-14 | 2022-09-14 | Hot-melt UV (ultraviolet) curing organic silicon OCA (optically clear adhesive) |
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| Publication Number | Publication Date |
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| CN115895590A true CN115895590A (en) | 2023-04-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211116466.9A Pending CN115895590A (en) | 2022-09-14 | 2022-09-14 | Hot-melt UV (ultraviolet) curing organic silicon OCA (optically clear adhesive) |
Country Status (1)
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| CN (1) | CN115895590A (en) |
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2022
- 2022-09-14 CN CN202211116466.9A patent/CN115895590A/en active Pending
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