CN115884027A - earphone - Google Patents

Abstract

The present application provides an earphone to improve the sound pressure sensitivity of the full frequency band of the speaker and reduce the thickness of the speaker. The earphone includes an ear bag, a fixing plate and a loudspeaker, the ear bag includes a housing, one end of the housing is an open end, the fixing plate is connected to the opening end of the housing, and cooperates with the housing to form a first cavity, and the fixing plate is also provided with There is an opening, including a cavity shell, a diaphragm and a piezoelectric sheet. At least a part of the cavity shell is located in the first cavity, and the cavity shell is connected to the fixed plate. One end of the cavity shell is an open end, and the opening of the cavity shell The end corresponds to the opening of the fixed plate, and the diaphragm is connected to the opening end of the cavity shell, so that the diaphragm and the cavity shell cooperate to form a second cavity, and the piezoelectric sheet is located in the second cavity and attached to the diaphragm.

Description

earphone

technical field

The present application relates to the technical field of electronic equipment, in particular to an earphone.

Background technique

Most of the existing headphone solutions are dynamic earphone solutions, and the pronunciation unit is a dynamic coil exciter, that is, the air is driven by using the force characteristic of the energized coil in the magnetic field, and the front cavity of the earphone is carried out by using the foam ear bag. Sealed, thereby providing a closed pressure field for sound playback. However, as consumers have higher and higher requirements for the sound quality and appearance of electronic equipment, this solution requires a thicker magnet design, which will occupy more space under the product design with gradually higher requirements for product thickness , and the dynamic headphone solution has poor high-frequency characteristics in a pressure field environment due to the compliance of the ring, so it cannot guarantee the sound quality of the full frequency band.

Contents of the invention

The present application provides an earphone, which is used to improve the sound pressure sensitivity of the full frequency band of the loudspeaker, and is beneficial to thinning the thickness of the loudspeaker.

In a first aspect, the present application provides an earphone, the earphone includes an ear bag, a fixing plate and a speaker, the ear bag includes a housing, the housing is a cavity with one end open, the fixing plate is connected to the first open end of the housing, The fixed plate cooperates with the housing to form a first cavity, the fixed plate is also provided with an opening, and the position of the speaker corresponds to the opening. The speaker includes a cavity shell, a diaphragm, and a piezoelectric sheet, and at least a part of the cavity shell is located in the first cavity. In the cavity, the side wall of the cavity shell is connected to the fixed plate, one end of the cavity shell is the second open end, the second open end corresponds to the opening of the fixed plate, and the diaphragm is connected to the second open end of the cavity shell, The vibrating membrane cooperates with the cavity shell to form a second cavity, and the piezoelectric sheet is located in the second cavity and attached to the vibrating membrane.

Compared with the traditional solution, in the above-mentioned solution, the diaphragm is driven by bonding the piezoelectric sheet. Since the high-frequency characteristics of the piezoelectric sheet material are relatively good, the high-frequency characteristics are compensated to a certain extent, and the second cavity formed The body can not only solve the problem of acoustic short circuit, but also help to improve low-frequency performance, and the second cavity is also a resonant cavity, which is helpful for adjusting the resonance characteristics of the vibration system, and at the same time, it can also make the piezoelectric film and the second cavity The matching design matches the characteristics of the diaphragm with the piezoelectric film, so that the overall sensitivity is improved, and the sound pressure sensitivity and flatness of the full frequency band are guaranteed. In addition, since there is no need to use a moving coil unit, the electrical energy is directly converted into mechanical energy by bonding the piezoelectric film to the diaphragm to drive the air, and the driving part and the sounding part are combined into one, making the structure of the device more concise , the energy conversion efficiency is higher, and the thin and light design of the speaker can also be realized.

In some embodiments, the ear bag further includes an ear pad, and the ear pad is connected to the side of the fixing plate away from the first side wall along the circumferential direction of the fixing plate, so that when the earphone is worn by the user, the ear pad can be in contact with the user's face. The parts are fitted to form a sealed front cavity, so that the low-frequency sound energy does not spread outward, forming a pressure field, so that the low-frequency is flat.

In some embodiments, the circuit board and the power module can be arranged in the first cavity, so that the piezoelectric sheet and the circuit board are electrically connected through the power module, and the piezoelectric sheet is driven by the power module, and the electrical energy is directly converted into mechanical energy. Promoting the air to produce sound makes the structure of the device more concise.

In some possible implementations, the earphone further includes a weight assembly located in the first cavity, and the weight assembly may be located between the outer wall of the housing of the cavity and the first side wall of the casing, wherein the first side wall and the fixed The plates are arranged opposite to each other. By adding vibration mass, the resonance characteristics of the overall system can be adjusted to avoid excessive resonance of the ear bag, thereby optimizing the frequency response characteristics of low frequencies.

In some embodiments, the counterweight component can be arranged at the position of the pitch circle of the vibration mode, so as to effectively control the quality factor of the overall vibration.

In some embodiments, the counterweight assembly may include a first counterweight component connected to the outer wall of the cavity shell, and may also include a second counterweight component connected to the first side wall of the shell, the first counterweight component and the second counterweight component. The counterweight part can be selected one of the two, and can also be set at the same time, so as to facilitate adaptation and adjustment.

In some embodiments, the shape of the first weight part may be ring-shaped, and the shape of the second weight part may also be ring-shaped, so that the shape of the first weight part or the second weight part is similar to the shape of the housing , so as to facilitate the adaptation adjustment.

In some embodiments, the earphone further includes a head beam, the end of the head beam is connected to the housing, and the head beam can form a clamping space for accommodating the user's head, so that it is convenient for the user to wear.

In some embodiments, when the shape of the first weight component is ring-shaped, the first plane is a plane perpendicular to the thickness direction of the first side wall, and the orthographic projection of the first weight component in the first plane is located at the head The periphery of the orthographic projection of the position where the beam is connected to the first side wall in the first plane; when the shape of the second counterweight component is ring-shaped, the orthographic projection of the second counterweight component in the first plane is located at the first plane where the head beam is connected. The position of the side wall is on the periphery of the orthographic projection in the first plane, so as to facilitate the adjustment of the resonance characteristics of the system.

In some possible implementations, along the radial direction of the diaphragm, a first elastic member can also be provided at the position where the diaphragm is located between the piezoelectric sheet and the edge of the diaphragm, so that the overall vibration of the diaphragm will not be completely transmitted to the case.

In some possible implementations, the vibrating membrane is connected to the fixing plate through the second elastic member, so that the whole vibration of the vibrating membrane will not be completely transmitted to the casing.

In some possible implementations, the earphone further includes a third elastic component, one end of the third elastic component is connected to the shell of the cavity, and the other end is connected to the shell, so that the connection between the second cavity and the shell is elastic and prevents The vibration of the cavity is transmitted to the shell, which is beneficial to facilitate the overall resonance.

In some possible implementations, a first opening may also be provided on the housing of the cavity, and the first opening is used to communicate with the first cavity and the second cavity. In some embodiments, the diameter of the first opening may be If it is larger than 3mm, it can significantly improve the low frequency of the overall design.

In some embodiments, a damping mesh can also be attached to the first opening, so as to control the flow resistance of the system.

In some possible implementations, a baffle can also be provided in the cavity shell, and the baffle can divide the second cavity into a plurality of interconnected sub-cavities, so that the second cavity forms a divided sound cavity, thereby Easy to adjust the overall acoustic characteristics.

In some possible implementations, the material of the cavity shell can be metal or plastic, and when the material of the cavity shell is metal, its thickness is not less than 0.2 mm; when the material of the cavity shell is plastic, its thickness is not less than 0.2 mm. Less than 0.8mm, so that the cavity shell can generate enough acoustic cavity to ensure the resonance characteristics of the system.

In some possible implementations, the shape of the piezoelectric sheet is circular or elliptical. When the shape of the piezoelectric sheet is circular, its diameter is 20mm-60mm, so as to match the shape and size of the speaker, so that Overall sensitivity increased.

In some possible implementations, the piezoelectric sheet includes multiple stacked piezoelectric materials, and the thickness is less than 1 mm, so as to reduce the thickness of the product.

In some possible implementations, an adhesive layer is also provided between the piezoelectric sheet and the diaphragm. In some embodiments, the thickness of the adhesive layer is 0.01mm-0.15mm, and the adhesive layer can make the piezoelectric sheet stick on the diaphragm.

In some possible implementations, the diaphragm is provided with a second opening. In some embodiments, the area of the second opening may be 45%-85% of the area of the piezoelectric sheet, so as to provide rigidity to the system. Make adjustments.

In some possible implementations, the material of the diaphragm can be metal alloy, and its thickness is less than 0.3mm, so as to ensure good frequency response.

In some embodiments, the planar size of the cross-sectional area of the diaphragm perpendicular to the fixed plate is greater than or equal to the dimension of the cross-sectional area of the piezoelectric sheet perpendicular to the fixed plate, and optionally, the peripheral edge of the diaphragm is more The edge width of the electric sheet is 0.5mm-5mm.

In some possible implementations, the loudspeaker may further include a support assembly for supporting the diaphragm, and the support assembly includes a first support structure located on the side of the diaphragm facing the piezoelectric sheet and a first support structure located on the side of the diaphragm facing away from the piezoelectric sheet. For the second support structure, both sides of the diaphragm abut against the first support structure and the second support structure respectively, so that the first support structure and the second support structure cooperate to support the diaphragm.

In some embodiments, a first layered structure can also be provided between the first support structure and the diaphragm, or a second layered structure can also be provided between the second support structure and the diaphragm, avoiding the first support structure The direct contact with the second support structure will cause damage to the diaphragm, and it is also convenient to adjust the quality factor value of the system to balance the system.

In some possible implementations, the earphone further includes a processor and a power amplifier, the processor can be used to flatten the first audio signal according to the frequency response characteristics of the speaker to obtain a second audio signal, and can also be used to use The parameter model of the piezoelectric sheet predicts the control parameters, and according to the control parameters, the second audio signal is controlled and processed to obtain the third audio signal, and then the third audio signal is subjected to envelope control processing, and the power amplifier can process the envelope control The audio signal is subjected to power amplification processing, and the audio signal after power amplification processing is output to the speaker. Wherein, the above parameter model includes at least one of a displacement control model, a nonlinear control model or a current control model, the control parameter predicted by the displacement control model is the vibration amplitude of the piezoelectric sheet, and the control parameter predicted by the nonlinear control model is the acoustic distortion parameter , the control parameter predicted by the current control model is the current value, and the audio signal can be fed back to the displacement control model, nonlinear control model or current control model after being processed by the power amplifier, so that the above control models can adjust the model parameters, so that the output The audio effect is better.

Description of drawings

FIG. 1 is a schematic diagram of an overall structure of an earphone provided by an embodiment of the present application;

FIG. 2 is a partial structural schematic diagram of the earphone shown in FIG. 1;

Fig. 3 is an exploded schematic diagram of the earphone shown in Fig. 2;

Fig. 4 is a schematic cross-sectional structure diagram of the earphone shown in Fig. 2;

Fig. 5 is a schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 2;

Fig. 6 is another schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 2;

Fig. 7 is a schematic structural view of the piezoelectric sheet in Fig. 6;

Fig. 8 is another schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 2;

Fig. 9 is another schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 2;

10a-10c are schematic diagrams of various structures of the first elastic member;

FIG. 11 is a schematic diagram of another overall structure of the earphone shown in FIG. 1;

FIG. 12 is a schematic cross-sectional structural diagram of the loudspeaker shown in FIG. 11;

Fig. 13 is another schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 11;

Fig. 14 is a schematic diagram of the attachment position of the counterweight assembly shown in Fig. 4;

Fig. 15 is another schematic cross-sectional structural diagram of the earphone shown in Fig. 2;

Fig. 16 is a schematic diagram of the theoretical model calculation curve of the front and rear earphones with the counterweight part, the first elastic part and the second elastic part shown in Fig. 2;

Fig. 17 is another schematic cross-sectional structure diagram of the earphone shown in Fig. 2;

Fig. 18 is another schematic cross-sectional structure diagram of the earphone shown in Fig. 2;

FIG. 19 is a schematic diagram of a hardware structure inside the earphone shown in FIG. 1;

FIG. 20 is a flowchart of audio signal processing by the processor in FIG. 19 .

Reference signs:

1-earphone; 100-speaker; 101-diaphragm; 1011-second opening; 102-piezoelectric sheet; 103-cavity shell; 1031-first opening; 1032-damping mesh; 1033-partition; 104-second cavity; 105-adhesive layer; 106-first elastic member; 107-support assembly; 1071-first support structure; 1072-second support structure; 108-first layered structure; 109-second Layered structure; 11-first cavity; 200-head beam; 300-ear bag; 301-housing; 3011-first side wall; 3012-second side wall; 302-ear pad; 400-fixing plate; 401-opening; 500-circuit board; 600-counterweight part; 601-first counterweight part; 602-second counterweight part; 700-second elastic part; 800-third elastic part; 900-processor; 901-audio envelope control algorithm model; 902-inverse filter model; 903-piezoelectric equalizer; 904-displacement control model; 905-nonlinear control model; 906-current control model; 907-noise reduction model; 1000-power Amplifier; 1100-A/D converter.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application.

In this embodiment of the application, the terms "first", "second", "third", and "fourth" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the indicated The number of technical characteristics. Thus, a feature defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of such features.

In the embodiment of this application, "and/or" is just a kind of relationship describing the relationship between related objects, which means that there may be three kinds of relationships, for example, A and/or B, which can mean that A exists alone, and A and B exist at the same time. B, there are three situations of B alone. In addition, the character "/" in this article generally indicates that the contextual objects are an "or" relationship. A connection includes a direct connection or an indirect connection.

Reference to "one embodiment" or "some embodiments" or the like in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in other embodiments," etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean "one or more but not all embodiments" unless specifically stated otherwise. The terms "including", "comprising", "having" and variations thereof mean "including but not limited to", unless specifically stated otherwise.

In recent years, manufacturers of high-end headphone equipment have paid more and more attention to the sound effect of headphones, and at the same time, product design has become increasingly thinner, lighter, and more energy-efficient. According to the power source of the sound, earphones can generally be divided into dynamic and piezoelectric. The dynamic speaker uses the force of the voice coil to generate displacement in the magnetic field to produce sound. The piezoelectric speaker uses piezoelectric ceramics to deform directly after being stressed. For sound production, due to the improvement of ceramic firing technology and micro-electromechanical technology in recent years, the development of piezoelectric speaker devices has been particularly rapid in recent years.

For the piezoelectric headphone solution, the traditional solution is only used as a high-frequency compensation solution, and the full-band design is not carried out. First, because the piezoelectric speaker is not good at low frequencies, and second, because of its poor frequency response flatness, there are many modal.

In view of this, the embodiment of the present application provides an earphone, which uses a piezoelectric speaker to realize full-band characteristics without using a dynamic unit, which not only improves the sound pressure sensitivity of the speaker in the full frequency band, but also realizes the thin and light design of the speaker.

As shown in Figures 1-4, Figure 1 is a schematic diagram of the overall structure of an earphone provided by this application, Figure 2 is a schematic diagram of a part of the structure of an earphone provided by this application, and Figure 3 is a disassembly of the earphone shown in Figure 2 Schematic diagram, FIG. 4 is a schematic cross-sectional structure diagram of the earphone shown in FIG. 2 , and the earphone of the embodiment shown in FIG. 1 is described by taking a headset as an example.

The earphone 1 can include a loudspeaker 100, a head beam 200, an ear bag 300, and a fixing plate 400. The head beam 200 can be roughly arc-shaped, and the head beam 200 has a semi-enclosed clamping space. The end of the head beam 200 is connected to The ear packs 300 , that is, the ear packs 300 are located on both sides of the head beam 200 . The ear bag 300 includes a housing 301 and an ear pad 302. The housing 301 is a cavity with an open end formed by cooperation of the first side wall 3011 and the second side wall 3012. The fixing plate 400 is connected to the opening end of the housing 301 (it can be understood is the first open end), so as to cooperate with the housing 301 to form the first cavity 11 . The fixing plate is also provided with an opening 401, and the position of the speaker 100 corresponds to the position of the opening 401. At this time, the ear pad 302 is connected to the side of the fixing plate 400 away from the housing 301, that is, the side where the speaker 100 is used for sounding. The pad 302 can be made of soft material, such as foam, etc. When the earphone 1 is worn, the ear pad 302 is located on the side facing the human face or/and facing the human ear, so as to fit the user's face when in use. When the user wears the earphone 1, the clamping space can be used to accommodate the user's head, and the ear pad 302 can be pressed against the user's ear, and can form a relatively airtight environment with the user's ear canal, so that the user can hear The audio played by the speaker 100 and the sound leakage from the speaker 100 are reduced.

It should be noted that, the first side wall 3011 and the second side wall 3012 can be an integral structure or a split structure, for example, in some embodiments, the first side wall 3011 and the second side wall 3012 are integrated type structure, the fixing plate 400 can be regarded as a cover plate covering the opening end of the housing 301, or, in some other embodiments, the second side wall 3012 and the fixing plate 400 are of an integrated structure, and the first side wall 3011 can be It is considered that the cover plate covers the opening end of the second side wall.

In addition, it should be noted that the structure of the housing 301 (namely the first side wall 3011 and the second side wall 3012) is only used as an implementation form of the earphone housing in this embodiment; in some other embodiments, The shape of the casing 301 may also be approximately spherical, polygonal or other irregular shapes, as long as there is a space for accommodating components inside, which is not limited in this application.

Continuing to refer to FIG. 3 and FIG. 4 , in some embodiments, the speaker 100 may include a diaphragm 101, a piezoelectric sheet 102 and a cavity housing 103, at least a part of the cavity housing 103 is located in the first cavity, and the cavity housing 103 The side wall is connected to the side wall at the opening 401 of the fixed plate 400, so that the cavity shell 103 can cover the opening 401, and the end of the cavity shell 103 away from the first side wall 3011 is an open end, and the cavity shell 103 The opening end (which can be understood as the second opening end) corresponds to the opening 401, and the diaphragm 101 covers the opening end of the cavity shell 103, so that the diaphragm 101 cooperates with the cavity shell 103 to form a closed second cavity 104. The electrode 102 is located in the second cavity 104 and attached to the diaphragm 101 . In some embodiments, as shown in FIG. 4 , the opening end surface of the cavity housing 103 can be flush with the surface of the fixing plate 400 facing away from the first side wall 3011 , which ensures that the speaker 100 is stably connected to the housing 301 , to ensure the resonance characteristics of the system, and also prevent the speaker 100 from being damaged due to protruding from the surface of the casing 301 during use. It is worth noting that when the cavity shell 103 is connected to the fixed plate 400, it can be directly connected with the fixed plate 400, and the connection method can be fixedly connected by screws or by bonding, or the cavity shell 103 can be connected with the fixed plate 400. The board 400 may also be connected indirectly. In some embodiments, an elastic member may be provided between the cavity shell 103 and the fixed board, so that the two are connected through the elastic member.

In addition, the side of the vibrating membrane 101 away from the piezoelectric sheet 102 can also be provided with a dust-proof net (not shown). On the one hand, the dust-proof net can also protect the vibrating membrane, preventing the user from accidentally touching the vibrating membrane 101 and puncturing the vibrating membrane 101 during use.

In some embodiments, the loudspeaker 100 may adopt a micro-electro-mechanical system (MEMS), which has good piezoelectric characteristics, is small in size, and has high precision, and is applicable to small volume product. In some other embodiments, the loudspeaker 100 can also use a common piezoelectric unit. Since the size is not limited, the common piezoelectric unit can increase the sound pressure level by increasing the size of the piezoelectric sheet, thereby improving the low-frequency performance.

In some embodiments, continuing to refer to FIG. 3 or FIG. 4, the earphone can also include a circuit board 500 and a power module (not shown in the figure) disposed in the first cavity 11, and the circuit board 500 and the power module can be located in the cavity. The body shell 123 is away from the side of the diaphragm 121. The power module is electrically connected to the circuit board 500 to provide power for the circuit board 500. The piezoelectric sheet 102 is electrically connected to the circuit board 500. There is a chip inside the circuit board 500. The chip can be a piezoelectric The electric sheet 102 is equipped with an electric signal, so that the piezoelectric sheet 102 vibrates under the action of the electric signal, thereby driving the diaphragm 101 to vibrate, that is, the piezoelectric sheet 122 directly converts electrical energy into mechanical energy, and pushes the diaphragm 101 to vibrate, thereby causing the diaphragm 101 to vibrate. The membrane 101 pushes the air to produce sound.

For the sound field, the difference between the earphone and the loudspeaker is whether the sound field is a pressure field or a diffuse field. The pressure field means that when the sound wave wavelength is larger than the cavity space, the sound pressure is evenly distributed, and the sound pressure is basically equal everywhere. The sound field in which the sound energy basically does not diffuse outward; the diffuse field refers to the sound field in which the sound energy is evenly distributed and propagates irregularly in all directions of propagation. It should be noted that the diffuse field at this time refers to the The environment includes not only the theoretical diffuse sound field in the ideal sense, but also the use environment of external loudspeakers between the free field and the diffuse field. In this embodiment, the earphone is a playback audio component. Specifically, the earphone can use the electroacoustic transducer unit to couple with the outside of the human ear through the ear pad 302, and send the sound directly to the external auditory canal. For the embodiment of this application For the earphones provided, the ear pad 302 can form a sealed front cavity with the human ear, that is, the user listens in a sealed state, and the sound field is a pressure field, so that the low-frequency sound energy does not spread outward, so that the low-frequency is flat, Moreover, since the material of the piezoelectric sheet 102 has relatively good high-frequency characteristics, it can compensate the high-frequency characteristics to a certain extent.

In addition, when the air at the front end of the diaphragm 102 is squeezed by the diaphragm 102, due to diffraction, it will directly go around from both sides of the diaphragm 102 to the rear end of the diaphragm 102, resulting in no significant outward radiation of sound waves and poor low-frequency performance. The earphone provided in the example can solve the problem of acoustic short circuit by forming the second cavity 104, that is, it can make the sound wave radiate outward, thereby improving the low-frequency performance. At the same time, the second cavity 104 is also a resonant cavity, which is helpful for adjusting the resonance characteristics of the vibration system. Therefore, matching design between the piezoelectric sheet 102 and the cavity shell 103 can also be made to improve the resonance characteristics of the vibration system. Moreover, since the housing 301 is also provided with openings in practical applications, when the air enters the first cavity 11 through the opening of the housing 301, due to the existence of the second cavity 104, the air cannot enter through the diaphragm 101 Inside the user's ear, the passive sound insulation performance is guaranteed to be better, so that the overall sensitivity can be improved, and the sound pressure sensitivity and flatness of the full frequency band can be guaranteed.

In addition, since there is no need to use a moving coil unit, the electrical energy is directly converted into mechanical energy by bonding the piezoelectric film to the diaphragm to drive the air, and the driving part and the sounding part are combined into one, making the structure of the device more concise , the energy conversion efficiency is higher, and the thin and light design of the earphone can also be realized.

In some other embodiments, referring to FIG. 2 and FIG. 5 , FIG. 5 is a schematic cross-sectional structure diagram of a speaker, and the piezoelectric sheet 102 is a vibration unit of the speaker 100 for providing the conversion of electrical energy to mechanical energy of the overall system. The piezoelectric sheet 102 can be made of laminated piezoelectric ceramics, for example, lead zirconate titanate ceramic laminated piezoelectric sheet. In other embodiments, the piezoelectric sheet 122 can also use other piezoelectric ceramics, such as piezoelectric polymers, piezoelectric crystals, etc., wherein the piezoelectric crystal material can be lead zirconate titanate, polyvinylidene fluoride, niobium Lithium oxide, quartz, Rochelle salt, etc., when using a piezoelectric crystal, the vibration scheme can be a single crystal vibration mode or a twin crystal vibration mode, when the single crystal vibration mode is used, when the laminated piezoelectric sheet 122 vibrates It cannot bend itself in the thickness direction, but when the dual crystal vibration mode is used, the laminated piezoelectric sheet 122 can bend itself in the thickness direction when vibrating. In some embodiments, the speaker in the embodiment of the present application can use a dual crystal Vibration mode to achieve better vibration and sound effects.

In addition, the shape and size of the piezoelectric sheet 102 can match the relevant dimensions of the second cavity 104, that is, the shape of the piezoelectric sheet 102 can be circular or oval. When the shape of the piezoelectric sheet 102 is circular, the piezoelectric The diameter of the sheet 102 can be 20mm-60mm. Exemplarily, the diameter of the piezoelectric sheet 122 can be 20mm, 30mm, 50mm, 60mm, etc., so as to avoid the sound of the earphone due to the small size of the piezoelectric sheet 102. Smaller to improve low frequency performance. When the piezoelectric sheet 102 has a laminated structure, the number of layers is generally tens of layers, and the overall thickness is less than 1 mm, so as to ensure that the piezoelectric sheet 102 can generate enough thrust to push the diaphragm 101 .

The thickness of the diaphragm 101 is on the order of tens of microns. The material of the diaphragm 101 may include materials such as metals and alloys, polymers, and carbon fibers. The shape of the diaphragm 101 may be in the form of a sheet. In some embodiments, the diaphragm 121 Specifically, the material can be magnesium-aluminum alloy, magnesium-lithium alloy, polyester resin, polyurethane, thermoplastic polyurethane elastomer rubber, carbon fiber, graphene and other isotropic materials. The diaphragm 101 can be a single-layer structure or a multi-layer structure, and openings can be arranged on the diaphragm 101, so as to adjust the stiffness of the system, and then facilitate the compliance adjustment of the diaphragm 101, thereby ensuring the frequency of the unit. sound good.

In addition, when the material of the vibrating membrane 101 is selected as a lightweight metal alloy film, its thickness can be less than 0.3 mm, and the cross-sectional area of the vibrating membrane 101 can be larger than that of the piezoelectric sheet 102, so as to ensure that the piezoelectric sheet 102 can be fixed. Attached to the diaphragm 101. In some embodiments, as shown in FIG. 5, the Y direction is the thickness direction of the diaphragm 101, and X is the direction perpendicular to the Y direction. Along the X direction, the edge of the diaphragm 121 may exceed the edge of the piezoelectric sheet 122 by 0.5mm -5mm.

The material of the cavity shell 103 can be metal, plastic or other materials. When the material of the cavity shell 103 is a metal material such as steel sheet, its thickness can be no less than 0.2mm. When the material of the cavity shell 103 is a material such as plastic, Its thickness may not be less than 0.8mm, so as to ensure sufficient rigidity of the cavity housing 103 to be stably supported, so as to generate sufficient acoustic cavity and ensure the resonance characteristics of the system.

As shown in Figure 6, Figure 6 is a schematic cross-sectional structure diagram of a loudspeaker with a hole in the diaphragm 101, the diaphragm 101 is provided with a second opening 1011 along the thickness direction, and the form of the second opening 1011 can be circular Or holes in the shape of a square or the like may also be an array hole, and its area may be 45%-85% of the area of the piezoelectric sheet 102 . In this case, the piezoelectric sheet 102 may cover the second opening 1011 . Correspondingly, the shape of the piezoelectric sheet 102 can be adjusted to a shape such as a circle, an ellipse, a ring, a racetrack, a square, or a square. Wherein, when the shape of the piezoelectric sheet 102 is ellipse, the ratio of its long and short axes may be greater than 0.6.

In addition, refer to FIG. 7, which is a schematic structural view of the piezoelectric sheet 102 in FIG. The edge is cut to form a slit on the edge of the piezoelectric sheet 122 . At this time, the piezoelectric sheet 102 has an asymmetric shape. When the shape of the piezoelectric sheet 10 is a circle, since the circle is a symmetrical figure, when the piezoelectric sheet 102 vibrates, its modes are highly symmetrical, and the resonance is very strong. The peak-to-valley difference of the frequency response is obvious, and when the piezoelectric sheet 102 is made into an asymmetric pattern, the resonance of the vibration system can be broken, so that resonance can be complemented in different directions to balance the peak-to-valley difference of the frequency response.

In some embodiments, when the diaphragm 121 is made of anisotropic material, the design of the above structure can also be used to optimize the diaphragm 121, and by using anisotropic material, the resonance of the system in different directions is different. , can also break the resonance of the vibration system, so that resonance can be complemented in different directions to balance the peak-to-valley difference in frequency response, which will not be repeated here.

Referring to FIG. 8 , FIG. 8 is another schematic cross-sectional structure diagram of a loudspeaker, an adhesive layer 105 is provided between the diaphragm 101 and the piezoelectric sheet 102, so that a sandwich is formed between the piezoelectric sheet 102, the diaphragm 101 and the adhesive layer 105 structure, the adhesive layer 105 can adhere the piezoelectric film 102 to the diaphragm 101, and in some embodiments, the material of the adhesive layer 105 can be double-sided adhesive, epoxy cured adhesive, ultraviolet (ultraviolet rays, UV) cured adhesive etc., so as to ensure that the piezoelectric sheet 102 can be firmly adhered to the diaphragm 101 . Wherein, the thickness of the adhesive layer 105 can be between 0.01mm and 0.15mm. By controlling the material and thickness of the adhesive layer 105, the vibration characteristics of the vibration unit can be improved, thereby ensuring the resonance characteristics of the system.

Referring to FIG. 9, FIG. 9 is another schematic cross-sectional structure diagram of the speaker. Along the radial direction of the diaphragm 101, the diaphragm 101 is located between the piezoelectric sheet 102 and the side wall of the cavity housing 103. A first elastic member can be provided. 106 , the first elastic component 106 can adjust the stiffness of the system, and the buffering effect of the first elastic component 106 prevents all the vibration of the diaphragm 101 from being transmitted to the housing, thereby adjusting the resonance characteristics of the system. In some embodiments, the first elastic member 106 may be a spring, a shrapnel or other elastic materials, wherein, when the first elastic member 127 is a shrapnel, as shown in FIG. 10a, the first elastic member 106 may face the fixing plate 400 or as shown in FIG. 10b, the first elastic member 106 can also bend towards the inside of the fixing plate 400. When the first elastic member 106 is made of other elastic materials, as shown in FIG. 10c, the first elastic member 127 can be Formed from plastic. Wherein, both ends of the first elastic member 106 may be respectively connected to the diaphragm 101 and the fixing plate 400 .

In some embodiments, as shown in FIG. 11 and FIG. 12 , FIG. 11 is a schematic diagram of another overall structure of the earphone shown in FIG. 1 , and FIG. 12 is a schematic diagram of a cross-sectional structure of the speaker in FIG. 11 . Including a support assembly 107 for supporting the diaphragm 101, the support assembly 107 may include a first support structure 1071 and a second support structure 1072, wherein the first support structure 1071 is located on the side of the diaphragm 101 facing the piezoelectric sheet 102 , the second support structure 1072 is located on the side of the diaphragm 101 away from the piezoelectric sheet 102, the first support structure 1071 and the second support structure 1072 will not affect the degree of freedom of vibration of the diaphragm 121 while supporting the diaphragm 121 . It is worth noting that, in some embodiments, as shown in FIG. 12 , when the first support structure 1071 is provided, the first support structure 1071 can also be reused as the side wall of the cavity shell 103, that is, the first support structure 1071 is formed on a part of the cavity housing 103 for connecting the fixing plate and the diaphragm 101 .

It should also be noted that the first support structure 1071 and the second support structure 1072 can be ring-shaped structures, and both are arranged close to the edge of the diaphragm 121, and will not cover the diaphragm 121, so as to avoid affecting the sound generation effect.

In some embodiments, referring to FIG. 13 , FIG. 13 is another schematic cross-sectional structure diagram of the loudspeaker in FIG. The shape structure 108 can also be a ring structure, which can be used to avoid direct contact between the first support structure 1071 and the diaphragm 101, thereby preventing the first support structure 1071 from causing damage to the diaphragm 101. The first layered structure 108 can be formed by multiple layers of glue , can also be formed by a multi-layer film, the first layered structure 108 can increase the damping of the system, when the number of layers of the first layered structure 108 is more, the damping can be made larger, so that the response of the system is smoother, and This is used to adjust the quality factor value of the system to balance the system.

In other embodiments, referring to FIG. 13 , a second layered structure 109 may also be provided between the second support structure 1072 and the diaphragm 101 , and the second layered structure 109 may also be ring-shaped. Its function is the same as that of the first layered structure 109 , and can be used to prevent the second support structure 1072 from directly contacting the diaphragm 101 , thereby preventing the second support structure 1072 from causing damage to the diaphragm 101 . The second layered structure 109 can be formed by multi-layer glue, and can also be formed by multi-layer films. When the number of layers of the second layered structure 109 is large, the damping can be made larger, thereby making the response of the system smoother, so that Adjust the quality factor value of the system to balance the system. In addition, it is worth noting that in some embodiments, the shape of the second layered structure 109 can also be designed asymmetrically, for example, the shape of the second layered structure 109 can be an incomplete ring, that is, an arc shape , when the piezoelectric sheet 102 vibrates, the second layered structure 109 can break the resonance of the vibration system, so as to complement the resonance in different directions, thereby balancing the peak-to-valley difference in frequency response.

It should be noted that the first support structure 1071 and the second support structure 1072 can be set either one of the two, or can be set at the same time, which is not limited in this application.

Referring to Figure 3, Figure 4 and Figure 14 and Figure 15 together, Figure 14 is a schematic diagram of the attachment position of the counterweight assembly, Figure 15 is a schematic cross-sectional structure diagram of another earphone in the embodiment of the application, the earphone may also include a A counterweight assembly 600 in a cavity 11. The shape of the counterweight component 600 can be circular or annular, and its attachment position inside the first cavity 11 is the pitch circle position of the vibration mode, and the vibration mode The pitch circle position is the position where the amplitude of the loudspeaker 100 is 0 or the amplitude displacement is the largest during the resonance process, which is generally a concentric circle or a position similar in shape to the first side wall 3011 of the casing 301, so as to adjust the resonance characteristics of the overall system , to avoid excessive resonance in the housing, thereby optimizing the low-frequency frequency response characteristics.

In some implementations, with continued reference to FIG. 14 and FIG. 15 , the counterweight assembly 600 may include a first counterweight component 601 , and the first counterweight component 601 is attached to the side of the cavity shell 103 away from the diaphragm 101 , as shown in FIG. 14 As shown, the first plane is defined as a plane perpendicular to the thickness direction of the speaker 100, and the x area in the first plane (which can be understood as the outermost circle and its inner area) can be regarded as the first plane of the housing 301. The orthographic projection of the side wall 3011 on the first plane, the y area (which can be understood as the innermost small circle and its inner area) can be regarded as the orthographic projection of the part where the head beam 200 is connected to the housing 301 on the first plane. For the projected position, it should be understood that the y area is located inside the x area, and the z area can be regarded as the corresponding position of the first counterweight member 601, that is, the first counterweight member 601 can be arranged on the periphery of the y area, and its shape can be ring. The material of the first weight part 601 can be a soft gelatinous substance, such as rubber block, plasticine, etc., and its mass can be less than 100g, and its shape can be a sheet-like object, so as not to affect the overall thickness of the speaker. When the shape of the first counterweight part 601 is ring-shaped, the diameter of the circle corresponding to the ring can be designed according to the situation. When designing, its size can be determined according to the material and material density of the first counterweight part, which can make the first counterweight part The mass of the heavy part 601 is not less than that of the piezoelectric sheet 101, so as to adjust the resonance characteristics of the overall system. When the first counterweight component 601 is attached to the cavity shell 103, it can be bonded with an adhesive or connected with screws. The quality factor value of the overall vibration is effectively controlled.

In other embodiments, referring to FIG. 14 and FIG. 15 , the counterweight assembly 600 may further include a second counterweight part 602, and the second counterweight part 602 is attached to the side of the first side wall 3011 facing the diaphragm 101, In some embodiments, when the second weight member 602 is attached to the first side wall 3011, its orthographic projection position on the first plane may be the same as the orthographic projection position of the first weight member 601 on the first plane. , the shape of the second counterweight member 602 may be ring-shaped. The shape of the second weight component 602 can also be designed correspondingly according to different speakers for adaptive adjustment. The material of the second weight component 142 can be a soft gelatinous substance, such as rubber block, plasticine, etc., its mass can be less than 100g, and its shape can be a thin sheet object, so as not to affect the overall thickness of the speaker. When the shape of the second counterweight part 602 is annular, the diameter of the circle corresponding to the annular can be designed according to the situation. When designing, its size can be determined according to the material and material density of the first counterweight part, which can make the second counterweight part The mass of the heavy part 602 is not less than that of the piezoelectric sheet 101, so as to adjust the resonance characteristics of the overall system. When the second counterweight component 602 is attached to the cavity shell 103, it can be bonded with adhesive or screwed. When bonding with adhesive, it can be bonded with a material with higher viscosity and greater damping. The quality factor value of the overall vibration is effectively controlled.

Continuing to refer to FIG. 15 , the diaphragm 101 and the fixed plate 400 can be connected through the second elastic member 700, and the overall vibration of the diaphragm 101 can not be completely transmitted to the fixed plate 400 by using the buffering effect of the second elastic member 700, so that Adjust the structural rigidity between the cavity shell 103 and the fixed plate 400 to reduce the vibration of the speaker itself, and then cooperate with the counterweight assembly to adjust the resonance characteristics of the system from two aspects of elasticity and quality, so as to achieve more adjustment Effect. In some embodiments, the second elastic member 700 may be a spring, a shrapnel or other elastic materials, and its specific structure may refer to the structural configuration of the first elastic member 106 , which will not be repeated here.

4 and 15, the first cavity 11 is also provided with a third elastic member 800, one end of the third elastic member 800 is connected to the cavity shell 103, and the other end is connected to the first side wall 3011, so that the cavity shell 103 forms an elastic connection with the housing 301 , so as to reduce the transmission of the vibration of the cavity housing 103 to the housing 301 , so as to cooperate with the counterweight assembly 600 and the second elastic member 700 to adjust the resonance characteristics of the system. In some embodiments, the third elastic member 800 can be a spring, shrapnel or other elastic materials, etc. In addition, when the first counterweight member 601 is provided, one end of the third elastic member 800 connected to the cavity shell 103 can be connected to The first counterweight part 601 may be connected to the cavity housing 103. When the second counterweight part 602 is provided, the end of the third elastic part 800 connected to the first side wall 3011 may be connected to the second counterweight part 602 or to the For the first side wall 3011, when the third elastic member 800 is connected to the first counterweight member 601 or the second counterweight member 602, since the first counterweight member 601 or the second counterweight member 602 has certain elasticity, its The elastic properties further dampen speaker vibrations.

In addition, when the third elastic member 800 is provided, the circuit board 500 is provided with an escape hole so that the third elastic member 800 can pass through the circuit board 500 from the avoidance hole without affecting the performance and structure of the circuit board 500, while the first After the three parts 800 pass through the avoidance hole, their two ends are respectively connected with the cavity shell 103 and the first side wall 3011, so that the third elastic part 800 is in a symmetrical position, so as to better exert its elasticity for adjusting the resonance characteristics. effect.

15 and 16, FIG. 16 is a schematic diagram of theoretical model calculation curves of electronic equipment before and after setting the counterweight component 600, the second elastic component 700 and the third elastic component 800, wherein curve a is the unused counterweight component 600, the second elastic component The data curves of the second elastic member 700 and the third elastic member 800, the curve b is the measured data curve after using the counterweight member 600, the second elastic member 700 and the third elastic part 800, and the curve c is the use of the counterweight member 600, The theoretical simulation data curve behind the second elastic part 700 and the third elastic part 800 . Compared with curve a and curve b, curve c, when the counterweight component 600, the second elastic component 700 and the third elastic component 800 are used, not only can the vibration characteristics of the resonant system of the housing 301 be reasonably controlled, so that the vibration in the low frequency range The peaks and valleys can be reduced, and the low-frequency frequency response decline can be significantly improved, and the flatness of the frequency response has been improved, thereby improving the overall sense of hearing.

In some implementations, referring to FIG. 17 , FIG. 17 is another cross-sectional schematic diagram of the earphone in the embodiment of the present application. The cavity housing 103 is provided with a first opening 1031, which can be a second cavity The body 104 provides compliance, that is, to improve the reaction characteristics of the second cavity 104 to the movement of the diaphragm 101, so that the diaphragm 101 can have a larger amplitude, and the first opening 1031 can also balance the air pressure in the second cavity 104 , improve system stability, thereby improving the frequency response characteristics of low frequency. The first opening 1031 can be located on the side wall of the cavity shell 103 opposite to the diaphragm 101 , or can be located on the side wall of the cavity shell 103 connected to the diaphragm 101 . If the diameter of the first opening 1031 is small, a damping effect will be produced on the gas entering and leaving the second cavity 104 through the first opening 1031. Therefore, the diameter of the first opening 1031 can be designed to be greater than 3mm, which can make The gas is unobstructed when it enters and exits, so that the overall design can be significantly improved at low frequencies. The number of first openings 1031 may be one or more, and when the number of first openings 1031 is multiple, the plurality of first openings 1031 may be arranged in an array. In addition, a damping mesh 1232 can also be attached to the first opening 1031, so as to control the flow resistance of the system.

In some other implementations, refer to FIG. 18 , which is another cross-sectional schematic diagram of the earphone in the embodiment of the present application. The second cavity 104 formed by the cavity shell 103 and the diaphragm 101 can form a split sound cavity. , that is, a partition 1033 is provided in the cavity housing 103, and the partition 1033 can divide the formed second cavity 104 into at least two sub-cavities, and each adjacent two sub-cavities are connected. During the vibration process, more Resonance can be generated in each sub-cavity, so that the resonance characteristics of the system can be adjusted, so as to adjust the overall acoustic characteristics. In addition, multiple sub-cavities can be designed with different volumes to adjust the resonance point, and the damping can also be adjusted to further adjust the resonance characteristics of the system. In some embodiments, the arrangement of multiple sub-cavities is not limited. For example, as shown in FIG. 17 , it can be a sub-cavity with an up-and-down positional relationship, or it can also be a sub-cavity with a left-right positional relationship. Body, or other designs can also be done.

It should be noted that, referring to FIG. 17 and FIG. 18 , when the first opening 1031 is provided on the cavity housing 103 , when the outside air enters the first cavity 11 through the opening of the casing 301 , it can be passed through the first opening 1031 . into the second cavity 104, and then enter the user's ear through the diaphragm 101, which leads to poor passive sound insulation performance. When the acoustic characteristics are adjusted by forming a split sound cavity inside the second cavity 104, It can ensure that the overall passive sound insulation performance of the earphone is better.

It should be noted that the orientation words such as "up", "down", "left" and "right" used by the speaker in the embodiment of the present application are mainly explained based on the display orientation of the speaker in Figure 17, and do not form a definition of the speaker in the actual situation. Limitation of the orientation in the application scene.

In some other embodiments, as shown in FIG. 19 and FIG. 20, FIG. 19 is a schematic diagram of a hardware structure in an earphone, and FIG. 20 is a flowchart of an audio signal processing of the processor 900 in FIG. 19, and the electronic device further includes The processor 900 and the power amplifier 1000, wherein the processor 900 can be used to obtain the second audio signal after flattening the first audio signal according to the frequency response characteristics of the speaker 100, and then the parameter model of the piezoelectric sheet used by the speaker 100 Predict the control parameters, and perform control processing on the second audio signal according to the control parameters to obtain a third audio signal, and then use the audio envelope control algorithm model 901 to perform envelope control processing on the third audio signal, and the audio envelope control algorithm model 901 can be The audio signal is processed by adopting the audio signal envelope rise, attenuation, release (attack, decay, sustain, release, ADSR) model, and the audio envelope control algorithm model 901 can make the enabling, weakening, maintaining and releasing of the algorithm follow certain rules during operation. The gradual change of the sound energy, so as to avoid the jump of the sound energy in a short time, which will cause the sound to be loud and small, and then the power amplifier 1000 performs power amplification processing on the audio signal processed by the envelope control, and amplifies the power after the processing. The audio signal is output to the loudspeaker 100 to complete the output of the audio. In addition, after the audio signal is processed by the power amplifier, the signal can be fed back to the parameter model, so that the above parameter model can adjust the model parameters.

The processor 900 in the embodiment of the present application may be a central processing unit (central processing unit, CPU), and may also be other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (application specific integrated circuits) , ASIC), field programmable gate array (field programmable gate array, FPGA) or other programmable logic devices, transistor logic devices, hardware components or any combination thereof. A general-purpose processor can be a microprocessor, or any conventional processor.

Continuing to refer to FIG. 19, when the audio signal is fed back to the parameter model after being processed by the power amplifier 1000, in some embodiments, it can be fed back in the form of initial vector (initialization vector, IV) feedback, and the feedback signal of the feedback mode The power amplifier 1000 can output characteristic detection data, and the analog/digital converter 1100 can also be used to convert the analog signal into a digital signal, so that the processor 900 can receive and process the signal in time.

Continuing to refer to FIG. 20 , when the first audio signal is flattened, an inverse filtering model 902 and a piezoelectric equalizer (equalizer, EQ) 903 can be used, and the inverse filtering model 902 can use a series of filters for the first audio signal The characteristics are extracted and restored, and the piezoelectric equalizer 903 can adjust the characteristics of the first audio signal according to the frequency response characteristics of the loudspeaker 100 . In this process, a filter can be used to cut peaks and valleys of the frequency response.

In addition, the above parameter models may include one or more of the displacement control model 904 , the nonlinear control model 905 and the current control model 906 . Wherein, the control parameter predicted by the displacement control model 904 is the vibration amplitude of the piezoelectric sheet, that is, the vibration displacement. In some embodiments, the displacement control model 904 uses a mathematical model to describe the vibration characteristics of the piezoelectric sheet, so that the vibration characteristics of the piezoelectric sheet can be described according to The signal of each frame predicts the vibration, so that the pre-gain control is performed according to the preset index threshold. The control parameters predicted by the nonlinear control model 905 are acoustic distortion parameters, that is, a mathematical model is used to describe the vibration distortion characteristics of the piezoelectric sheet, so that the acoustic distortion can be predicted according to the signal of each frame, so that according to some audio effect indicators Thresholding is processed with a pre-inverse inverse nonlinear model that can be processed synchronously in the time and frequency domains for gain control or inverse model predistortion. The control parameter predicted by the current control model 906 is the current value, that is, a mathematical model is used to describe the impedance characteristics of the piezoelectric sheet, so that it can be predicted according to the current characteristics of the signal of each frame, so that the power amplifier can perform a power amplifier according to the maximum electrical output capability. control, the model can be processed synchronously in the time and frequency domains for maximum current control.

The above shift control model 904, nonlinear control model 905 and current control model 906 can be used selectively, and their operation sequence can also be designed differently according to different usage situations. Taking Figure 20 as an example, the audio signal is passed through the inverse filter model 902 and the pressure After the flattening process by the electrical equalizer 903, the audio signal successively passes through the position control model 904, the nonlinear control model 905 and the current control model 906, so as to realize the gain control by using the predicted displacement, the gain control by using the predicted acoustic distortion parameters and the use of Predict the current for gain control, and then the audio signal is processed by the audio envelope control algorithm model 901 , and the noise of the system can be controlled and suppressed by the noise reduction model 907 , and finally output to the speaker 100 through the power amplifier 1000 . Moreover, after the audio signal is amplified and processed by the power amplifier 1000, the parameters of the audio signal can be fed back to the shift control model 904, the nonlinear control model 905, and the current control model 906, so that the shift control model 904, the nonlinear control model 905 and each model parameter in the current control model 906 can be adjusted in time. In this embodiment, the displacement and distortion of the piezoelectric sheet are controlled by an algorithm, so that greater low-frequency loudness can be provided in a low-distortion state, thereby improving the system’s Spectrum and transient characteristics are optimized to improve the output audio effect and make the sense of hearing better.

Compared with the traditional dynamic speaker, the speaker of this embodiment adopts the piezoelectric scheme, which saves the magnet and voice coil structure, reduces the thickness of the speaker, and uses the piezoelectric unit to make the high frequency exhibit capacitive characteristics, and uses the algorithm to make The flatness of the frequency response is strengthened, and the matching design of the piezoelectric film and the cavity improves the sensitivity.

The above is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application, and should cover Within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (20)

1. An earphone, comprising an ear cup, a fixing plate and a speaker, wherein:

the ear cup comprises a housing comprising a first open end;

the fixing plate comprises an opening, the fixing plate is connected with the first opening end, and a first cavity is formed by the fixing plate and the shell;

the loudspeaker comprises a vibrating diaphragm, a cavity shell and a piezoelectric sheet, wherein at least one part of the cavity shell is positioned in the first cavity, and the cavity shell is connected with the fixed plate; the cavity shell comprises a second opening end, the second opening end faces the opening of the fixing plate, the vibrating diaphragm is connected with the second opening end, and the vibrating diaphragm and the cavity shell form a second cavity; the piezoelectric piece is located in the second cavity and connected with the diaphragm.

2. The headset of claim 1, further comprising a weight assembly located within the first cavity, the weight assembly being disposed between the cavity housing and a first sidewall, the first sidewall being a sidewall of the housing opposite the fixed plate.

3. The earphone of claim 2, wherein the weight assembly comprises a first weight member disposed on a side of the cavity housing facing away from the diaphragm.

4. The headset of claim 2 or 3, wherein the weight assembly further comprises a second weight member, the second weight member being disposed at the first sidewall.

5. The headset of claim 4, wherein the first weight member is annular in shape and/or the second weight member is annular in shape.

6. The headset of claim 4 or 5, further comprising a head beam, an end of the head beam being connected to the first sidewall.

7. The headset of claim 6, wherein an orthographic projection of the portion of the head bridge connected to the first side wall in a first plane is within an area encompassed by an orthographic projection of the first weight member in the first plane, and/or an orthographic projection of the portion of the head bridge connected to the first side wall in a first plane is within an area encompassed by an orthographic projection of the second weight member in the first plane, wherein the first plane is a plane perpendicular to a thickness direction of the first side wall.

8. The earphone as claimed in any one of claims 1-7, wherein a first elastic member is provided at a portion of the diaphragm located between the piezoelectric sheet and the cavity housing in a radial direction of the diaphragm.

9. The headset of any one of claims 1-8, further comprising a second resilient member, the cavity housing being connected to the fixed plate by the second resilient member.

10. The earphone of any of claims 1-9, further comprising a third resilient member positioned within the first cavity, the third resilient member having one end connected to the cavity housing and another end connected to the housing.

11. The headset of any one of claims 1-10, wherein the cavity housing is provided with a first opening that communicates between the first cavity and the second cavity.

12. The headset of claim 11, wherein the first opening has a diameter greater than 3mm.

13. The earphone according to any one of claims 1-12 wherein a partition is provided within the chamber housing, the partition dividing the second chamber into at least two sub-chambers, any two adjacent sub-chambers being in communication with each other.

14. An earphone as claimed in any one of claims 1-13, wherein the diaphragm is provided with a second opening.

15. The earphone of claim 14, wherein the area of the second opening is 45% -85% of the area of the end surface of the piezoelectric sheet facing the diaphragm.

16. An earphone as claimed in any one of claims 1-15, wherein the distance between the orthographic projection of the edge of the piezoelectric sheet on the diaphragm and the edge of the diaphragm is 0.5mm-5mm.

17. An earphone as recited in any one of claims 1-16, wherein the speaker further comprises a support assembly, the support assembly comprising a first support structure and a second support structure, the first support structure being located on a side of the diaphragm facing the piezoelectric patch, the second support structure being located on a side of the diaphragm facing away from the piezoelectric patch, two sides of the diaphragm abutting the first support structure and the second support structure, respectively.

18. The earphone of claim 17, wherein the speaker further comprises a first layered structure positioned between the first support structure and the diaphragm.

19. An earphone as claimed in claim 17 or 18, wherein the loudspeaker further comprises a second layered structure between the second support structure and the diaphragm.

20. The headset of any one of claims 1-19, wherein the ear cup further comprises an ear pad attached to a side of the fixed plate facing away from the first cavity along a circumference of the fixed plate.

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