CN115873538A - Semi-conductive adhesive, semi-conductive belt, and preparation method and application thereof - Google Patents
Semi-conductive adhesive, semi-conductive belt, and preparation method and application thereof Download PDFInfo
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- CN115873538A CN115873538A CN202310148261.7A CN202310148261A CN115873538A CN 115873538 A CN115873538 A CN 115873538A CN 202310148261 A CN202310148261 A CN 202310148261A CN 115873538 A CN115873538 A CN 115873538A
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- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims abstract description 45
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 31
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- 239000000843 powder Substances 0.000 claims abstract description 29
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- 238000003756 stirring Methods 0.000 claims description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 238000009941 weaving Methods 0.000 claims description 27
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- 238000007765 extrusion coating Methods 0.000 claims description 7
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- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
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- 239000000463 material Substances 0.000 abstract description 14
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- 229910052751 metal Inorganic materials 0.000 description 10
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
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Abstract
A semi-conductive adhesive, a semi-conductive belt, a preparation method and an application thereof belong to the technical field of cable manufacturing materials. The semi-conductive glue comprises the following components in percentage by mass: 10-15% of aluminum powder, 15-20% of super absorbent resin powder, 10-15% of conductive acetylene black, 15-30% of acrylic emulsion, 3-5% of water-based dispersant and 30-40% of propylene glycol. The invention also discloses a preparation method of the semi-conductive adhesive, a method for preparing the semi-conductive belt by using the semi-conductive adhesive, the semi-conductive belt prepared by the preparation method and application of the semi-conductive belt. The invention can solve the problems of small tensile strength, large surface resistance, large volume resistivity, slow expansion speed, low expansion height, large thickness of the semi-conductive buffer water-blocking tape, long heat and current transmission channel and the like of the conventional semi-conductive buffer water-blocking tape.
Description
Technical Field
The invention belongs to the technical field of cable material manufacturing, and relates to a semiconductive adhesive and a preparation method thereof, a method for preparing a semiconductive tape by using the semiconductive adhesive, the semiconductive tape prepared by the preparation method and application of the semiconductive tape.
Background
The semi-conductive buffer water-blocking tape is arranged between the aluminum corrugated layer of the ultra-high voltage cable and the cable core shielding layer, plays a role in electrical connection, reduces the enrichment of electric charges on the insulating surface, and reduces the possibility of partial discharge; meanwhile, the semiconductive buffering water-blocking tape can be filled in the aluminum corrugated layer, so that water is prevented from entering the aluminum corrugated layer, and accidents harmful to cable safety, such as water trees of the ultrahigh-voltage cable, are reduced.
The existing semi-conductive buffer water-blocking tape often causes ablation and corrosion phenomena of an aluminum corrugated inner wall layer, and has poor longitudinal water-blocking performance mainly because the existing semi-conductive buffer water-blocking tape has poor heat conduction and current transmission performance, and the adopted water-absorbing resin powder has poor water absorption effect, so that water enters a cable to corrode a metal piece. In addition, the currently used semiconductive buffering water-blocking tape has the defects of small tensile strength, large surface resistance, large volume resistivity, low expansion speed, low expansion height, poor longitudinal water resistance, large thickness, long heat and current transmission channel and the like.
Disclosure of Invention
The invention aims to provide a semi-conductive adhesive material, which is used for solving the problems of poor performance of the semi-conductive adhesive of the existing semi-conductive buffering water-blocking tape in heat conduction and current transmission and poor water-blocking property.
In order to solve the technical problem, the invention adopts the following technical scheme:
the semiconductive adhesive comprises the following components in percentage by mass: 10-15% of aluminum powder, 15-20% of super absorbent resin powder, 10-15% of conductive acetylene black, 15-30% of acrylic emulsion, 3-5% of water-based dispersant and 30-40% of propylene glycol.
Preferably, the aluminum powder is light conductive aluminum powder, has a particle size of 20-50 meshes, is small in particle size, light in weight, uniform in dispersion and not easy to agglomerate, can be fully contacted with the aluminum corrugated layer, can enhance the conductivity of the semiconductive adhesive, can improve the heat conductivity of the semiconductive adhesive, and is high in corrosion resistance. The light conductive aluminum powder and the conductive acetylene carbon black are used in a composite manner, and are cooperated with electric conduction and heat conduction, so that the heat conduction and current transmission performances of the semi-conductive adhesive can be obviously improved.
Preferably, the super absorbent resin powder is Japanese Sumitomo fine chemical industry super absorbent resin powder (product model: 10 SH-PF-HR), has good water absorption and excellent water retention performance, improves the water blocking performance of the semi-conductive adhesive, and effectively prevents water from entering the cable to corrode metal parts such as aluminum corrugated layers and the like.
Preferably, the acrylic emulsion has a solid content of more than 55%, good water resistance and good adhesion.
Preferably, the aqueous dispersant is an environmentally friendly aqueous dispersant, preferably a DN dispersant, also known as ethylene glycol.
The semi-conductive adhesive prepared by the invention has the characteristics of excellent conductivity, strong water absorption performance and capability of protecting metal parts in cables from being corroded by water, and can replace conductive liquid (a process of coating and drying a woven tape and then combining viscose and water-absorbent resin powder on the surface of the woven tape) prepared by using conductive carbon black and water-based acrylic emulsion in the current market, wherein the process has the defects of easiness in powder falling, poor conductivity, complex process, poor efficiency and high energy consumption.
The second purpose of the invention is to provide a preparation method of the semi-conductive adhesive, which comprises the following steps:
(1) Adding propylene glycol and water-based dispersant into a stirrer, and stirring at room temperature for 5-10min at a stirring speed of 600-800r/min;
(2) And then adding the conductive acetylene black, stirring at low speed at room temperature to prevent agglomeration, then stirring at high speed to uniformly disperse the conductive acetylene black, and specifically stirring at multi-stage variable speed according to the following speed and time:
(1) stirring at 600-800r/min for 20-40min;
(2) stirring at 800-1000r/min for 20-40min;
(3) stirring at 1000-1200r/min for 20-40min;
(4) stirring at 1200-1400r/min for 20-40min;
(3) Adding aluminum powder in the step (2), stirring at room temperature for 5-10min at a stirring speed of 600-800r/min to uniformly disperse the aluminum powder;
(4) Adding the super absorbent resin powder in the step (3), and stirring at room temperature for 5-10min at a stirring speed of 600-800r/min to uniformly disperse the super absorbent resin powder;
(5) And (4) finally, adding the acrylic emulsion in the step (4), stirring at room temperature for 5-10min at the stirring speed of 600-800r/min, and uniformly stirring and mixing all the substances to obtain the semiconductive adhesive.
The third purpose of the invention is to provide a preparation method of the semiconductive belt, which solves the problems of small tensile strength, large surface resistance, large volume resistivity, slow expansion speed, low expansion height, large thickness of the semiconductive buffering water-blocking belt, long heat and current transmission channel and the like of the conventional semiconductive buffering water-blocking belt.
In order to solve the technical problems, the invention adopts the following technical scheme: a preparation method of a semi-conductive belt, a braid is dipped in the semi-conductive adhesive, then the semi-conductive adhesive is extruded, dipped again, coated on the surface in a scraping way and dried to prepare the semi-conductive belt, and high-performance conductive water-resistant layers are respectively formed on the front side and the back side of the braid, and the preparation method specifically comprises the following steps:
(1) Woven tape weaving
1) The method is characterized in that a tinned copper wire (with the diameter of 0.18-0.2mm and formed by stranding a single filament or a plurality of single filaments) is used for replacing part of warps, the rest warps are 20-30 cotton yarns or 300-1000dtex polyester filaments, and the wefts are cotton yarns or polyester filaments with the same specification and model as the warps.
2) The method comprises the steps of adjusting the weft yarn cross stroke of a ribbon loom (preferably a high-speed braiding machine) according to the required width of the ribbon, setting the rotating speed (145-160 r/min) of the high-speed braiding machine and the tape-out speed (0.5-2 m/min), weaving the ribbon by longitudinal warps, tinned copper wires and transverse wefts, and uniformly and orderly distributing the tinned copper wires among the warps at intervals.
Putting warp yarns and weft yarns on an unwinding creel, and uniformly arranging a warp creel tensioner, a creel yarn separating plate and a steel comb; placing the tinned copper wires on a metal wire unwinding creel, and uniformly arranging the tinned copper wires in the middle of warp yarns at intervals in order through ceramic holes, a creel tensioner and a steel comb;
the warp yarns and the weft yarns are woven in a crossed mode, and the tinned copper wires are woven with the weft yarns in a wave-shaped jumping mode at intervals to form a crossed jumping ribbon weaving process;
the woven belt woven by a high-speed weaving machine is coiled by constant tension, the diameter of a disc reaches more than 50cm (or other sizes), and an inner hole of the disc adopts a conventional paper core (or other sizes) with the diameter of 76 mm.
Preferably, the weaving density of the tinned copper wires is 2-8/cm (namely 2-8 tinned copper wires are arranged at equal intervals per centimeter), the weaving density of the warp yarns is 8-16/cm, and the weaving density of the weft yarns is 10-20/cm.
Preferably, in the cross jumping ribbon weaving process, when the tinned copper wires are arranged above, the tinned copper wires jump to the lower part after the warps and the wefts are woven in a cross mode for a certain length (such as 3-5 mm) below, and the warps and the wefts are woven in a cross mode for the same length above (such as 3-5mm in length of each section of tinned copper wire and 3-5mm in distance between two adjacent sections of tinned copper wires on the front side or the back side of the ribbon weaving in the longitudinal direction), so that the tinned copper wires are woven in a wave jumping mode in a reciprocating mode, and the tinned copper wires are fully exposed on the surface of the ribbon weaving.
(2) Extrusion coating
In the process, 2-5 woven belts are adopted to be carried out simultaneously, the woven belts are sequentially unreeled through constant tension, enter a glue groove containing the semi-conductive glue to be soaked through a spacing groove (playing a role of keeping the space between the woven belts), are extruded through an upper rubber roller and a lower rubber roller and enter the same semi-conductive glue groove to be soaked, and finally, glue is scraped on the front surface and the back surface of each woven belt through a pair of cylindrical compression rollers, the glue scraping pressure is monitored through a pressure sensor and is kept at 2kg, so that the strips are kept flat.
Preferably, the diameter of the rubber roller is 20-40cm, the extrusion pressure is 2-5kg, and the hardness is 50-80 degrees.
Preferably, the cylindrical press roll and the web pressure are determined according to the coating amount, the coating is thicker the smaller the pressure is, and the coating amount is set to be 100-150 g/m.
(3) Vacuum drying
In this process, 2 to 5 ribbons are also used simultaneously. After extrusion coating, the woven belts are sequentially sent into a drying cylinder, and are wound under constant tension and vacuum packaged by a spacing baffle plate (playing a role of keeping the space between the woven belts) to prepare the semi-conductive belt. The mesh belt transmission speed is set at 10-20m/min, and the energy-saving, rapid and efficient production efficiency is achieved.
Preferably, the drying cylinder is a steam or electric heating drying cylinder with the width of 50-100cm and the diameter of 57-80cm, the temperature is set to be 130-200 ℃ (according to the thickness of the woven belt, the thickness is thicker, the temperature is relatively high, 6-12 drying cylinders can be used in each production line, and the vacuum drying pressure is-0.05-0.1 MPa.
After the braid is coated with the semi-conductive adhesive, the conductivity and tensile strength of the semi-conductive tape are greatly improved due to the fact that the metal tinned copper wire is arranged on the surface of the braid.
The invention applies the crossed jumping ribbon weaving process to ensure that the tinned copper wires are completely displayed on the surface of the ribbon (the front and the back are distributed in a jumping manner at intervals along the longitudinal direction), avoids the tinned copper wires from being partially embedded between warps and wefts, improves the contact area of the tinned copper wires and the aluminum corrugated wall, and improves the electric conduction and heat conduction effects of the semi-conductive ribbon.
In addition, because the tinned copper wire is woven with the weft in a wave jumping mode, the semi-conductive belt material is internally in a wave structure, the function of a miniature spring is achieved, the woven belt has an elastic function, and the tinned copper wire and the weft can be mutually cooperated to play a buffering role under the action of external pressure.
A fourth object of the present invention is to provide a semiconductive tape obtained by the above method for producing a semiconductive tape.
The semi-conductive belt prepared by the invention has the characteristics of excellent conductivity, strong water absorption performance, capability of effectively preventing water from entering a cable to corrode metal parts, smaller surface resistance, smaller volume resistivity and thinner thickness, realizes quick transmission and conduction of current and heat, solves the problem of poor longitudinal water blocking performance, improves the transverse water blocking performance, creatively adopts a water blocking layer structure with the front surface and the back surface, and can replace conductive liquid (prepared by coating and drying a woven belt and then combining viscose and water-absorbent resin powder on the surface of the conductive liquid after coating and drying conductive carbon black and water-based acrylic emulsion in the current market, and the semi-conductive belt has the defects of easy powder falling, poor conductivity, complex process, poor efficiency and high energy consumption).
The semi-conductive belt prepared by the invention has the following beneficial effects:
1. is thin in thickness
The semi-conductive tape prepared by the invention has the thickness of 0.3-0.5mm (the thickness of the existing semi-conductive buffering water-blocking tape is 1.5-2.0 mm), the outer diameter of the cable is reduced after wrapping, and the outer diameter of the aluminum corrugated pipe is reduced.
2. High tensile strength
The tensile strength of the semi-conductive tape prepared by the invention is more than 1000N/cm, while the tensile strength of the existing semi-conductive buffer water-blocking tape is less than 100N/cm.
3. Excellent semi-conductive performance
The semiconductive tape prepared by the present invention has a surface resistance smaller than 100 Ω, and a volume resistivity smaller than 1 × 10 Ω. The surface resistance of the prior semiconductive buffer water-blocking tape is 400-1500 omega, and the volume resistivity is 1 multiplied by 10 4 -1×10 6 Ω•cm。
4. Excellent water absorption performance
The semi-conductive belt prepared by the invention has excellent water-absorbing materials on the surface, has two water-absorbing layers (semi-conductive water-blocking layers on the front and back sides of the belt), and has the expansion speed of more than 16mm/min and the expansion height of more than 22mm/3min. The existing semiconductive buffering water-blocking tapes only have a water absorption layer and are positioned in the strip material, the expansion speed of the semiconductive buffering water-blocking tapes is less than 12mm/min, and the expansion height of the semiconductive buffering water-blocking tapes is less than 20mm/3min.
5. Has low harm
After the shielding layer of the cable core in the ultra-high voltage cable is wrapped by the semi-conductive tape, the cable core has quick electric conduction and heat dissipation effects, and the phenomena of ablation, corrosion and breakdown are not easy to generate on the inner wall of the aluminum corrugated pipe. The existing semi-conductive buffer water-blocking tape is easy to cause ablation, corrosion and breakdown phenomena on the inner wall of the aluminum corrugated pipe.
6. High production efficiency and environment-friendly production
The semi-conductive belt of the invention adopts a high-speed braiding machine, has the advantage of producing multiple belts in one machine, and the woven belt is formed by dipping, extruding, dipping again, drying and rolling, so that the whole production process has no pollution. The conventional semiconductive buffering water-blocking tape is manufactured through multiple processes, fibers are blown out too much in the manufacturing process, water-absorbing powder can be blown out along with wind in the powder spraying, bonding and compounding process, the environmental pollution is large, and the manufacturing process has certain harm to human bodies.
A fifth object of the present invention is to provide a use of a semiconductive tape in the manufacture of an extra-high voltage cable.
The invention has simple process, and the braid prepared by adopting the cross jumping braid process is dipped in the high-performance semi-conductive adhesive containing aluminum powder and is rapidly manufactured by extrusion coating, vacuum drying and the like. The invention has thin thickness (0.3-0.5 mm) and high tensile strength (more than 1000N/cm); excellent semi-conductive performance: small surface resistance (less than 100 Ω), small volume resistivity (less than 1 × 10 Ω · cm); the water absorption is strong: the expansion performance is high (the expansion speed is more than 16mm/min, the expansion height is more than 22mm/3 min), the water absorption effect is good, and water can be effectively prevented from entering the cable to corrode a metal piece.
Drawings
FIG. 1 is a schematic view showing a structure of weaving a webbing in embodiment 1 of the present invention;
FIG. 2 is a process flow diagram in example 1 of the present invention;
in the figure: 1 warp, 2 weft and 3 tinned copper wires.
Detailed Description
The raw materials of the invention are obtained from the following sources:
the light conductive aluminum powder is purchased from Zhengzhou Xinli wear-resistant material Co., ltd;
the super absorbent resin powder is made from Japanese Sumitomo fine chemical industry super absorbent resin powder, and the product model is as follows: 10SH-PF-HR;
conductive acetylene black, purchased from coke-making and chemical industry limited, granular acetylene black;
acrylic emulsion, purchased from romajas international trade ltd, product type: HS-11;
the water-based dispersant adopts DN dispersant (also named ethylene glycol) purchased from Jiangsu Haiyun New materials Co., ltd, model number: b-700;
propylene glycol, purchased from Henan Chunji chemical products, inc.;
tinned copper wire, purchased from taizhou feida electrical equipment limited;
polyester filament was purchased from honor petrochemical company, inc.
Comparative example 1
The prior preparation method of the semi-conductive buffer water-blocking tape (refer to Chinese patent application with publication number CN 105002653A and publication date 2015, 10 and 28), the embodiment I of the description of the super-strong nano semi-conductive buffer water-blocking tape and the processing technology thereof): producing needle-punched cotton non-woven fabric from the SAF fiber through a cotton-punching production process; then the needle-punched cotton non-woven fabric is dipped in oily nano conductive liquid (consisting of 20 percent of nano hollow carbon tube, 30 percent of oily acrylic acid colloid and 50 percent of ethyl ester), and is extruded and dried in vacuum to obtain the product.
Example 1
A semiconductive rubber material having a mass of 2000g, comprising the following components in mass percent: 10% of light conductive aluminum powder, 20% of super absorbent resin powder, 15% of conductive acetylene black, 20% of acrylic emulsion, 3% of DN dispersing agent and 32% of propylene glycol, wherein the particle size of the aluminum powder is 35 meshes, and the solid content of the acrylic emulsion is larger than 55%.
The preparation method of the semi-conductive adhesive material comprises the following steps:
(1) Adding propylene glycol and water-based dispersant into a stirrer, and stirring (stirring at room temperature) for 6min at a stirring speed of 800r/min;
(2) And then adding the conductive acetylene black for stirring (stirring at low speed at room temperature firstly) to prevent agglomeration, then stirring at high speed to disperse the conductive acetylene black uniformly, and specifically stirring at multi-step variable speed according to the following speed and time:
(1) stirring at 800r/min for 30min;
(2) stirring at 1000r/min for 30min;
(3) stirring at 1200r/min for 30min;
(4) stirring at 1400r/min for 30min;
(3) Adding aluminum powder in the step (2) and stirring (stirring at room temperature) for 10min at a stirring speed of 800r/min to uniformly disperse the aluminum powder;
(4) Adding the super absorbent resin powder in the step (3) and stirring (stirring at room temperature) for 10min at a stirring speed of 800r/min to uniformly disperse the super absorbent resin powder;
(5) And finally, adding the acrylic emulsion in the step (4) (stirring at room temperature) for 5min at a stirring speed of 800r/min, and uniformly stirring and mixing all the substances to obtain the semi-conductive adhesive.
The semi-conductive adhesive prepared by the embodiment has the characteristics of excellent conductivity, strong water absorption performance and capability of protecting a metal piece in a cable from being corroded by moisture.
As shown in fig. 2, a method for manufacturing a semiconductive tape,
(1) Ribbon weaving
1) Tin-plated copper wires (with the diameter of 0.18mm and being monofilaments) are used for replacing part of warps, 1000dtex polyester filaments are selected as the rest warps, and the same specification and model of the polyester filaments as the warps are selected as the wefts.
2) Adjusting the weft yarn cross stroke of the high-speed braiding machine according to the required width of the mesh belt, and setting the rotating speed (150 r/min) and the belt discharging speed (1 m/min) of the high-speed braiding machine;
the mesh belt is formed by weaving longitudinal warps, tinned copper wires and transverse wefts, and the tinned copper wires are uniformly and orderly distributed in the warps at intervals; the weaving density of the tinned copper wires is 5 pieces/cm (namely 5 tinned copper wires are arranged at equal intervals per centimeter), the weaving density of warp yarns is 12 pieces/cm, and the weaving density of weft yarns is 15 pieces/cm.
Putting warp yarns and weft yarns on an unwinding creel, and uniformly arranging a warp creel tensioner, a creel yarn dividing plate and a steel comb; placing the tinned copper wires on a metal wire unwinding creel, and uniformly arranging the tinned copper wires in the middle of warp yarns at intervals in order through ceramic holes, a creel tensioner and a steel comb;
as shown in fig. 1, warp yarns and weft yarns are woven in a crossing manner, and the tinned copper wires are woven with the weft yarns in a wave-shaped jumping manner at intervals to form a crossing jumping woven belt process; namely, when the tinned copper wire is arranged above, the tinned copper wire jumps to the lower part after warp and weft yarns are crosswise woven for 4mm below, and the warp and weft yarns are crosswise woven for the same length above; the tinned copper wire is woven in a wave-shaped jumping manner in such a reciprocating manner, so that the tinned copper wire is fully exposed on the surface of the braid;
the woven belt obtained by weaving through a high-speed weaving machine is coiled by constant tension, the diameter of a disc reaches 50cm, and an inner hole of the disc adopts a conventional paper core with the thickness of 76 mm.
(2) Extrusion coating
In this process, adopt 4 meshbelts to go on simultaneously, unreel the meshbelt that will weave through constant tension in proper order, through the gauge groove (playing and keeping meshbelt interval effect), get into the gluey groove flooding that contains above-mentioned semi-conductive glue, through upper and lower rubber roll extrusion (diameter 40cm, extruded pressure is 4kG, hardness 60 degrees), get into same semi-conductive glue groove flooding, at the positive and negative two sides frictioning of meshbelt by a pair of cylindrical compression roller at last, set for the coating volume at 120g/m, utilize pressure sensor monitoring frictioning pressure, frictioning pressure keeps at 2kG, makes the strip keep level and smooth.
(3) Vacuum drying
In this step, 4 woven tapes were used at the same time. After extrusion coating, the woven belts are sequentially sent into a drying cylinder, and are wound under constant tension and vacuum packaged by a spacing baffle plate (playing a role of keeping the space between the woven belts) to prepare the semi-conductive belt. The web transport speed was set at 15m/min.
Wherein the drying cylinder is an electric heating drying cylinder with the width of 80cm and the diameter of 60cm, the temperature is set to be 150 ℃, and the vacuum drying pressure is-0.05 MPa.
Example 2
The difference from example 1 is: the semi-conductive adhesive material has a mass of 2000g and comprises the following components in percentage by mass: 13% of light conductive aluminum powder, 17% of super absorbent resin powder, 12% of conductive acetylene black, 23% of acrylic emulsion, 4% of DN dispersant and 31% of propylene glycol.
Example 3
The difference from example 1 is: the semi-conductive adhesive material has a mass of 2000g and comprises the following components in percentage by mass: 15% of light conductive aluminum powder, 15% of super absorbent resin powder, 10% of conductive acetylene black, 22% of acrylic emulsion, 5% of DN dispersant and 33% of propylene glycol.
Example 4
Different from example 1, a semiconductive rubber material, having a mass of 2000g, comprised the following components in mass percent: 10% of light conductive aluminum powder, 20% of super absorbent resin powder, 10% of conductive acetylene black, 25% of acrylic emulsion, 3% of DN dispersant and 32% of propylene glycol.
Example 5
Different from the example 1, the semi-conductive glue material has the mass of 2000g and comprises the following components in percentage by mass: 20% of light conductive aluminum powder, 20% of super absorbent resin powder, 25% of acrylic emulsion, 3% of DN dispersant and 32% of propylene glycol. In the embodiment, the conductive components of the semi-conductive adhesive are all light conductive aluminum powder, so that the semi-conductive adhesive has high metal content and high specific gravity; the light conductive aluminum powder has rough surface, and the semi-conductive belt is wrapped or folded, so that the light conductive aluminum powder falls off and the conductivity of the semi-conductive belt is unstable.
Example 6
Different from example 1, a semiconductive rubber material, having a mass of 2000g, comprised the following components in mass percent: 20% of super absorbent resin powder, 20% of conductive acetylene black, 25% of acrylic emulsion, 3% of DN dispersant and 32% of propylene glycol.
Example 7
Different from the example 1, the semi-conductive glue material has the mass of 2000g and comprises the following components in percentage by mass: 10% of light conductive aluminum powder, 20% of water-blocking powder (purchased from Ningsu environmental protection technology Co., ltd., model HS 150), 15% of conductive acetylene black, 20% of acrylic emulsion, 3% of DN dispersant and 32% of propylene glycol. Wherein the particle size of the aluminum powder is 35 meshes, and the solid content of the acrylic emulsion is more than 55 percent.
Example 8
Different from example 1, a semiconductive rubber material, having a mass of 2000g, comprised the following components in mass percent: 10% of light conductive aluminum powder, 25% of water-absorbent resin (Sumitomo super absorbent resin CA 180), 15% of conductive acetylene black, 20% of acrylic emulsion, 3% of DN dispersant and 27% of propylene glycol.
Performance test
When in use, the semi-conducting belt is generally wrapped outside a cable semi-finished product and is in a bending and winding state. In order to obtain the performance parameters of the semiconductive tapes in the service state (more referential), the semiconductive tapes prepared in examples 1 to 8 were subjected to simulated wrapping before the performance test, the object of wrapping was a cable semi-finished product, and the wrapping method was a conventional process. The properties of the semiconductive tapes obtained in comparative example 1, examples 1, 2, 3, 4, 5, 6, 7 and 8 were measured by means of a balance, a thickness gauge, a tensile tester, a resistance meter, a measuring cup (showing the height of expansion) and the like, and the results are shown in Table 1.
The method for testing the performance of the semi-conductive belt product comprises the following steps:
(1) tensile strength: unit N/cm; the technical requirements are as follows: not less than 100; the test method adopts GB/T1040.1-2018, see determination part 1 of tensile properties of plastics: a total rule;
(2) surface resistance: unit: omega; technique of the method comprises the following steps: less than or equal to 200; the test method comprises the following steps: adopting GB/T1410-2006, referring to the volume resistivity and surface resistivity test method of the solid insulating material;
(3) volume resistivity: unit: omega, cm; the technical requirements are as follows: smallIs equal to 1.0X 10 3 (ii) a The test method comprises the following steps: adopting GB/T1410-2006, referring to the volume resistivity and surface resistivity test method of the solid insulating material;
(4) expansion rate: unit: mm/min; the technical requirements are as follows: 16 or more; the test method comprises the following steps: JB/T10259-2014 is adopted, which refers to the water-blocking tape for cables and optical cables;
(5) height of expansion: unit: mm/3min; the technical requirements are as follows: greater than or equal to 20; the test method comprises the following steps: JB/T10259-2014 is adopted, and the water-blocking tape for the electric cable and the optical cable is referred to.
TABLE 1 comparison of the Properties of the semiconductive tapes in comparative example 1 and examples 1 to 8
Claims (9)
1. The semiconductive adhesive is characterized by comprising the following components in percentage by mass: 10-15% of aluminum powder, 15-20% of super absorbent resin powder, 10-15% of conductive acetylene black, 15-30% of acrylic emulsion, 3-5% of water-based dispersant and 30-40% of propylene glycol;
the aluminum powder is light conductive aluminum powder, and the particle size is 20-50 meshes; the super absorbent resin powder is Japanese Sumitomo fine chemical industry super absorbent resin powder, and the product model is as follows: 10SH-PF-HR.
2. The method for preparing the semi-conductive adhesive according to claim 1, comprising the steps of:
(1) Adding propylene glycol and water-based dispersant into a stirrer, and stirring at room temperature for 5-10min at a stirring speed of 600-800r/min;
(2) Then adding conductive acetylene black, and carrying out multi-stage variable speed stirring at room temperature at a stirring speed of 600-1400r/min to uniformly disperse the conductive acetylene black;
(3) Adding aluminum powder in the step (2), stirring at room temperature for 5-10min at a stirring speed of 600-800r/min to uniformly disperse the aluminum powder;
(4) Adding the super absorbent resin powder in the step (3), and stirring at room temperature for 5-10min at a stirring speed of 600-800r/min to uniformly disperse the super absorbent resin powder;
(5) And (5) finally, adding the acrylic emulsion in the step (4), stirring at room temperature for 5-10min at a stirring speed of 600-800r/min, and uniformly stirring and mixing all the substances to obtain the semi-conductive adhesive.
3. The method for preparing the semi-conductive adhesive according to claim 2, wherein in the step (2), the multi-step variable speed stirring is specifically as follows:
(1) stirring at 600-800r/min for 20-40min;
(2) stirring at 800-1000r/min for 20-40min;
(3) stirring at 1000-1200r/min for 20-40min;
(4) the stirring speed is 1200-1400r/min, and the stirring time is 20-40min.
4. A method for producing a semiconductive tape, characterized by comprising the steps of:
(1) Woven tape weaving
1) Replacing a part of warps with tinned copper wires, selecting cotton yarns or polyester filaments as the rest warps, and selecting cotton yarns or polyester filaments with the same specification and model as the warps as the wefts;
2) Adjusting the weft yarn crossing stroke of the ribbon loom according to the required width of the ribbon loom, wherein the ribbon loom is formed by weaving longitudinal warps, tinned copper wires and transverse wefts, and the tinned copper wires are uniformly and orderly distributed among the warps at intervals;
the warp yarns and the weft yarns are woven in a crossed mode, and the tinned copper wires are woven with the weft yarns in a wave-shaped jumping mode at intervals to form a crossed jumping ribbon weaving process; weaving the obtained woven belt by a high-speed weaving machine, and rolling by adopting constant tension;
(2) Extrusion coating
Sequentially unreeling the woven braid under constant tension, passing through a gauge groove, impregnating in a rubber groove containing semi-conductive rubber, extruding by an upper rubber roller and a lower rubber roller, impregnating in the same semi-conductive rubber groove, and finally scraping the rubber on the front side and the back side of the braid by a pair of cylindrical compression rollers;
the semi-conductive adhesive is the semi-conductive adhesive of claim 1 or the semi-conductive adhesive obtained by the preparation method of any one of claims 2 to 3;
(3) Vacuum drying
After extrusion coating, sequentially feeding the woven tape into a drying cylinder, and carrying out spacing baffle, constant tension rolling and vacuum packaging to obtain the semi-conductive tape; the temperature of the drying cylinder is set to be 130-200 ℃.
5. The method for manufacturing the semiconductive tape according to claim 4, wherein in step (1), the diameter of the tinned copper wire is 0.18-0.2mm and is formed by stranding a single wire or a plurality of single wires.
6. The method for producing a semiconductive tape according to claim 4, wherein in the step (1), the weaving density of the tinned copper wire is 2 to 8 pieces/cm, the weaving density of the warp is 8 to 16 pieces/cm, and the weaving density of the weft is 10 to 20 pieces/cm.
7. The method for producing a semiconductive tape according to claim 4, wherein in the step (1), the tinned copper wire is jumped to the lower side after the warp and weft yarns are crossly woven 3 to 5mm in the lower side while the tinned copper wire is on the upper side, and the warp and weft yarns are crossly woven in the upper side for the same length, and so forth, the tinned copper wire is formed into a wavy jump weave.
8. A semiconductive tape obtainable by a process according to claim 4, 5, 6 or 7.
9. Use of the semiconductive tape according to claim 8 in the manufacture of an extra-high voltage cable.
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| CN110504060A (en) * | 2018-05-18 | 2019-11-26 | 扬州腾飞电缆电器材料有限公司 | A kind of high-performance semiconductive blocks water flame-retarding metal silk braid over braid and its manufacture craft |
| CN113338048A (en) * | 2021-05-25 | 2021-09-03 | 扬州腾飞电缆电器材料有限公司 | Water-blocking expansion type semi-conductive nylon belt for ultrahigh-voltage cable and preparation method thereof |
| CN113674910A (en) * | 2021-07-02 | 2021-11-19 | 扬州腾飞电缆电器材料有限公司 | Copper wire seam edge type semi-conductive buffering water-blocking tape for ultrahigh-voltage cable |
| CN114300186A (en) * | 2021-11-22 | 2022-04-08 | 江苏沃峰新材料有限公司 | Magnesium-aluminum alloy wire seam edge type semi-conductive buffer water-blocking tape special for ultrahigh-voltage cable above 110KV, semi-conductive resistance water glue and method |
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- 2023-02-22 CN CN202310148261.7A patent/CN115873538B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110504060A (en) * | 2018-05-18 | 2019-11-26 | 扬州腾飞电缆电器材料有限公司 | A kind of high-performance semiconductive blocks water flame-retarding metal silk braid over braid and its manufacture craft |
| CN113338048A (en) * | 2021-05-25 | 2021-09-03 | 扬州腾飞电缆电器材料有限公司 | Water-blocking expansion type semi-conductive nylon belt for ultrahigh-voltage cable and preparation method thereof |
| CN113674910A (en) * | 2021-07-02 | 2021-11-19 | 扬州腾飞电缆电器材料有限公司 | Copper wire seam edge type semi-conductive buffering water-blocking tape for ultrahigh-voltage cable |
| CN114300186A (en) * | 2021-11-22 | 2022-04-08 | 江苏沃峰新材料有限公司 | Magnesium-aluminum alloy wire seam edge type semi-conductive buffer water-blocking tape special for ultrahigh-voltage cable above 110KV, semi-conductive resistance water glue and method |
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