CN115863293A - Integrated circuit and electronic device - Google Patents

Abstract

The embodiment of the application provides an integrated circuit and electronic equipment, and relates to the technical field of semiconductor device packaging. The integrated circuit includes: a first circuit unit and a second circuit unit stacked above the first circuit unit; the bottom surface of the first circuit unit is provided with a first connecting terminal; the top surface of the second circuit unit is provided with a second connection terminal. Therefore, the problem that local current density of the circuit board is overlarge due to the fact that the stacked power supply packaging module is applied to the circuit board is solved.

Description

Integrated circuit and electronic device

Technical Field

The embodiment of the application relates to the technical field of semiconductor packaging, in particular to an integrated circuit and electronic equipment.

Background

With the development of technology, the miniaturization of electronic devices is gradually becoming a trend. Therefore, miniaturization of semiconductor devices in electronic equipment is also receiving attention. As compared with the packaging technology of a semiconductor device including a single electronic component, the packaging technology of a semiconductor device including a plurality of electronic components has been rapidly developed, and particularly, the miniaturization and high-density packaging technology of a semiconductor device including a plurality of electronic components has been rapidly developed.

In the related art, the semiconductor device may adopt a Package On Package (POP) structure to realize miniaturization development of the semiconductor device. Specifically, the stack package is a stack type package in which one package substrate is stacked on another package substrate. For the miniaturization requirement of the power supply packaging module, the stack packaging is beneficial to realizing the miniaturization and high-density packaging requirement of the power supply packaging module. However, when the power package module with stack package is soldered on the circuit board, the current density of the circuit board near the power package module is increased more than that of the power package module without stack package. Especially, the current value of low voltage and large current exceeds the limit value of the circuit board wiring layer, which causes a significant challenge to the application end of the circuit board of the stacked package power supply package module.

Therefore, how to solve the problem that the local current density of the circuit board is too high after the power package module with stack package is applied to the circuit board becomes the research focus of the present application.

Disclosure of Invention

The embodiment of the application provides an integrated circuit and electronic equipment, is favorable to solving and piles up the power encapsulation module of encapsulation and be applied to the circuit board after, leads to the too big problem of circuit board local current density.

In a first aspect, an embodiment of the present application provides an integrated circuit, including: a first circuit unit and a second circuit unit stacked above the first circuit unit; the bottom surface of the first circuit unit is provided with a first connecting terminal; the top surface of the second circuit unit is provided with a second connection terminal.

The integrated circuit provided by the embodiment of the application comprises the first circuit unit and the second circuit unit, and the second circuit unit is stacked above the first circuit unit, so that the purposes of miniaturization and high-density packaging of the integrated circuit are favorably achieved. Meanwhile, the first connecting terminal is arranged on the bottom surface of the first circuit unit, and the second connecting terminal is arranged on the top surface of the second circuit unit, so that the integrated circuit can input/output current through the first connecting terminal and the second connecting terminal. Therefore, when the bottom surface of the first circuit unit (the top surface of the second circuit unit) is connected to the circuit board, the second connecting terminal of the top surface of the second circuit unit (the first connecting terminal of the bottom surface of the first circuit unit) can share the current flowing amount of the circuit board, and the problem that the local current density of the circuit board is overlarge due to the fact that the integrated circuit is applied to the circuit board can be solved.

In a possible implementation manner, the first circuit unit includes a first substrate, and a first electronic component, a first metal pillar, and a first package body that are disposed on an upper surface of the first substrate, and both the first electronic component and the first metal pillar are packaged in the first package body; the top end of the first metal column is connected with the bottom surface of the second circuit unit.

The top end of the first metal column is connected with the bottom surface of the second circuit unit, so that the first circuit unit and the second circuit unit are conveniently and fixedly connected, and the stability and the reliability of the second circuit unit stacked above the first circuit unit are favorably ensured; and be convenient for with first circuit unit and second circuit unit electric connection, be favorable to guaranteeing the smooth transmission of signal of telecommunication between first circuit unit and second circuit unit.

In a possible implementation manner, the first circuit unit further includes a second electronic component, a second metal pillar, and a second package body that are disposed on the lower surface of the first substrate, and the second electronic component and the second metal pillar are both packaged in the second package body; the bottom end of the second metal pillar extends to the bottom surface of the first circuit unit and forms the first connection terminal.

Through setting up first circuit unit still including locating the second electronic components of first base plate lower surface to be favorable to the purpose of the miniaturization and the high-density encapsulation of better realization integrated circuit. In addition, through setting up first circuit unit still including locating first base plate lower surface second metal post, the bottom of second metal post extends to first circuit unit's bottom surface and forms first connecting terminal, and on the one hand, the second metal post can play the effect of connecting integrated circuit and circuit board, and on the other hand, integrated circuit can be through second metal post input/output current to the ability of second metal post input/output current is better.

In one possible implementation, the first circuit unit further includes a first heat conduction member, and an upper surface of the first package body, which is close to the second circuit unit, includes a first opening; the first heat-conducting member is disposed between the first electronic component and the bottom surface of the second circuit unit through the first opening.

The first circuit unit also comprises the first heat-conducting piece, and the first heat-conducting piece is arranged between the first electronic component and the bottom surface of the second circuit unit, so that the first circuit unit and the first circuit unit are conveniently and fixedly connected, and the stability and reliability of the second circuit unit stacked above the first circuit unit are favorably ensured; and the heat conduction link of the integrated circuit is shortened, the thermal resistance is reduced, and the heat dissipation of the first electronic component is facilitated.

In a possible implementation manner, the first circuit unit further includes a second heat conduction member, and the second heat conduction member is disposed on a surface of the second electronic component, the surface being away from the first substrate.

In a possible implementation manner, a side of the second package body facing away from the first substrate includes a second opening; the second heat conduction member is in contact with a circuit board electrically connected with the integrated circuit through the second opening.

The first circuit unit further comprises the second heat-conducting piece, and the second heat-conducting piece is arranged on one surface, away from the first substrate, of the second electronic component, so that when the bottom surface of the first circuit unit is connected to the circuit board, the first circuit unit and the circuit board can be fixedly connected conveniently, and the stability and the reliability of connection of the integrated circuit and the circuit board can be guaranteed; but also the heat conduction link between the integrated circuit and the circuit board is shortened, the thermal resistance is reduced, and the heat dissipation of the second electronic component is facilitated.

In a possible implementation manner, the second circuit unit includes a second substrate, and a third electronic component and a third metal pillar that are disposed on an upper surface of the second substrate, and a top end of the third metal pillar forms the second connection terminal; the top end of the first metal column is electrically connected with the lower surface of the second substrate.

The top end of the first metal column is connected with the lower surface of the second substrate, so that the first circuit unit and the second circuit unit are conveniently and fixedly connected, and the stability and the reliability of the second circuit unit stacked above the first circuit unit are favorably ensured; and be convenient for with first circuit unit and second circuit unit electric connection, be favorable to guaranteeing the smooth transmission of signal of telecommunication between first circuit unit and second circuit unit. In addition, the top end of the third metal column is provided with the second connecting terminal, so that on one hand, the third metal column can play a role in connecting the integrated circuit and the circuit board, on the other hand, the integrated circuit can input/output current through the third metal column, and the current input/output capacity of the third metal column is better.

In a possible implementation manner, the second circuit unit further includes a third package body disposed on the upper surface of the second substrate, and the third electronic component and the third metal pillar are both packaged in the third package body.

Through all encapsulating third electronic components and third metal column in the third packaging body to not only be favorable to protecting third electronic components and third metal column, be favorable to fixed third electronic components and third metal column moreover.

In a possible implementation manner, the second circuit unit further includes a third heat conduction member, and the third heat conduction member is disposed on a surface of the third electronic component, the surface being away from the second substrate.

The second circuit unit further comprises a third heat-conducting piece, and the third heat-conducting piece is arranged on one surface, away from the second substrate, of the third electronic component, so that when the top surface of the second circuit unit is connected to the circuit board, the second circuit unit and the circuit board are conveniently and fixedly connected, and the stability and reliability of connection of the integrated circuit and the circuit board are favorably ensured; but also is beneficial to shortening the heat conduction link between the integrated circuit and the circuit board, reducing the thermal resistance and simultaneously being beneficial to the heat dissipation of the third electronic component.

In a possible implementation manner, the second circuit unit includes a second substrate, and a fourth electronic component, a fourth metal pillar, and a fourth package body that are disposed on a lower surface of the second substrate, and the fourth electronic component and the fourth metal pillar are both packaged in the fourth package body; the top end of the first metal column is connected with the bottom end of the fourth metal column; the upper surface of the second substrate is provided with the second connection terminal.

The top end of the first metal column is connected with the bottom end of the fourth metal column, so that the first circuit unit and the second circuit unit are fixedly connected, and the stability and the reliability of the second circuit unit stacked above the first circuit unit are guaranteed; and be convenient for with first circuit unit and second circuit unit electric connection, be favorable to guaranteeing the smooth transmission of signal of telecommunication between first circuit unit and second circuit unit. In addition, the second connecting terminals are arranged on the upper surface of the second substrate, so that the arrangement density of the second connecting terminals is improved, and the input/output path of the integrated circuit is increased.

In a possible implementation manner, the second circuit unit further includes a fourth heat conduction member, and the fourth heat conduction member is disposed on a surface of the fourth electronic component, which faces away from the second substrate; the fourth packaging body is provided with a third opening; the fourth heat-conducting member is connected to the first heat-conducting member through the third opening.

The second circuit unit further comprises a fourth heat-conducting piece, the fourth heat-conducting piece is arranged on the surface, away from the second substrate, of the fourth electronic component, and the first heat-conducting piece is connected with the fourth heat-conducting piece, so that the first circuit unit and the second circuit unit are conveniently and fixedly connected, and the stability and the reliability of connection of the first circuit unit and the second circuit unit are favorably ensured; and the heat conduction link of the integrated circuit is shortened, the thermal resistance is reduced, and the heat dissipation of the fourth electronic component is facilitated.

In one possible implementation, the integrated circuit is a power supply slow start circuit.

The integrated circuit is used as the power supply slow start circuit, so that the power supply slow start circuit is miniaturized and packaged at high density, and the problem that local current density of a circuit board is overlarge due to the fact that the power supply slow start circuit which is miniaturized and packaged at high density is applied to the circuit board can be solved.

In a second aspect, an embodiment of the present application provides a motherboard, including: a circuit board and at least one integrated circuit as described in any of the above; the top or bottom surface of the integrated circuit is connected to the circuit board.

The main board provided by the embodiment of the present application includes at least one integrated circuit as described in any one of the above, so that the main board of the embodiment of the present application also has the beneficial effects that the integrated circuit has, and details are not described herein again.

In a third aspect, an embodiment of the present application provides an electronic device, including: at least one circuit board and an integrated circuit as described in any of the above; the top and bottom surface connection terminals of the integrated circuit are electrically connected to the at least one circuit board.

The electronic device provided by the embodiment of the application includes the integrated circuit, so that the integrated circuit has the same beneficial effects as the electronic device provided by the embodiment of the application, and the details are not repeated here.

Drawings

FIG. 1 is a first schematic structural diagram of a motherboard in the related art;

FIG. 2 is a second schematic structural diagram of a motherboard in the related art;

FIG. 3 is a first schematic diagram illustrating an integrated circuit according to an embodiment of the present disclosure;

fig. 4 is a second schematic structural diagram of an integrated circuit according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an integrated circuit according to an embodiment of the present application;

fig. 6 is a fourth schematic structural diagram of an integrated circuit according to an embodiment of the present application;

fig. 7 is a fifth schematic structural diagram of an integrated circuit according to an embodiment of the present application;

fig. 8 is a sixth schematic structural diagram of an integrated circuit according to an embodiment of the present application;

fig. 9 is a first schematic structural diagram of a motherboard according to an embodiment of the present application;

fig. 10 is a second schematic structural diagram of a motherboard according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of a main board according to an embodiment of the present application;

fig. 12 is a schematic structural diagram of a motherboard according to an embodiment of the present application;

fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Description of reference numerals:

100' -an integrated circuit; 111' -a first substrate; 1121' -a first electronic component; 1122' -a second electronic component; 1131' -a first package; 1132' -a second package; 121' -a second substrate; 200' -a main board; 210' -a circuit board;

100-an integrated circuit;

100A-integrated circuit;

110A-first circuit unit; 111A-a first substrate; 1121A-first electronic component; 1131A — first package; 1122A-a second electronic component; 1132A-a second package; 114A-a first thermally conductive member; 115A-a second thermally conductive member; 117A-first metal pillar; 118A-a second metal pillar; 1181A-first connection terminal;

120A-a second circuit unit; 121A-a second substrate; 122A-a third electronic component; 123A-third package; 124A-a third thermally conductive member; 125A-third metal pillar; 1251A-second connection terminal;

100B-integrated circuit;

110B — a first circuit unit; 111B-a first substrate; 1121B-a first electronic component; 1131B — first package; 1122B-a second electronic component; 1132B — a second package; 114B-a first thermally conductive member; 115B-a second thermally conductive member; 117B-first metal pillar; 118B-a second metal pillar; 1181B-first connection terminal;

120B — a second circuit unit; 121B-a second substrate; 1211B — a second connection terminal; 126B-a fourth electronic component; 127B-a fourth package; 128B-a fourth thermally conductive member; 129B-a fourth metal pillar;

200A, 200B, 200C, 200D-main board; 210A, 210B, 210C, 210D-circuit board;

300-a server; 310-a housing; 320-a circuit board; 330-PCle card; 340-a power supply; 350-input/output interface.

Detailed Description

The terminology used in the description of the embodiments of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the application, as the embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Printed Circuit Boards (PCBs), also known as Printed circuit boards, are providers of electrical connections for electronic passive components. The processor chip is the most core part for the electronic equipment, has the functions of logic processing and controlling the normal operation of the whole machine, and in the electronic equipment, the chip is mainly fixed on a printed circuit board in a chip packaging structure mode so as to achieve the purpose of stably controlling the chip in the chip packaging structure to be stably conducted with an external printed circuit board. Flip Chip (Flip Chip) is not only a Chip interconnection technology but also an ideal Chip bonding technology, and has become a packaging form frequently adopted in the fields of high-end devices and high-density packaging.

The die (die) is a chip of which the wafer is not packaged after being subjected to a dicing test, and the die usually has only a bonding pad for packaging and cannot be directly applied to an actual circuit. Since the bare chip is easily damaged by the temperature, impurities and physical force of the external environment, the bare chip must be packaged in a space and corresponding pins are led out to be used as a basic component.

A Package On Package (POP) is a stack package in which one package substrate is stacked on another package substrate.

Double-sided plastic package (DSM package) is a structure in which devices are attached to both surfaces of a package substrate and are plastic-packaged.

In the related art, the main board 200' shown in fig. 1 includes a circuit board 210' and an integrated circuit 100' of POP structure, and the integrated circuit 100' is electrically connected to an upper surface of the circuit board 210 '. The integrated circuit 100' includes a first substrate 111' and a second substrate 121', a lower surface of the first substrate 111' is soldered to an upper surface of the circuit board 210' by solder balls, and a first electronic component 1121' is disposed on the upper surface of the first substrate 111 '. The second substrate 121 'is stacked over the first substrate 111', a lower surface of the second substrate 121 'and an upper surface of the first substrate 111' are soldered by solder balls, and the upper surface of the second substrate 121 'is provided with a second electronic component 1122' and a first package 1131 'that packages the second electronic component 1122'.

In the motherboard 200' shown in fig. 1, since only the bottom surface of the integrated circuit 100' is connected to the circuit board 210', the integrated circuit 100' can only input/output current through the circuit board 210', so that the current density of the circuit board 210' near the integrated circuit 100' is relatively large, and the current value thereof even exceeds the limit value of the circuit layer of the circuit board 210', thereby causing the integrated circuit 100' to present a significant challenge in the application of the circuit board.

The main board 200' shown in fig. 2 includes a circuit board 210' and an integrated circuit 100' of a DSM structure, and the integrated circuit 100' is electrically connected to an upper surface of the circuit board 210 '. The integrated circuit 100 'includes a first substrate 111', and a first electronic component 1121 'and a first package 1131' for packaging the first electronic component 1121 'are disposed on an upper surface of the first substrate 111'. The lower surface of the first substrate 111' is provided with a second electronic component 1122' and a second package 1132' for packaging the second electronic component 1122', and the lower surface of the first substrate 111' has an exposed area not covered by the second package 1132', and the exposed area is provided with solder balls which are soldered to the upper surface of the circuit board 210 '.

In the main board 200 'shown in fig. 2, since the area of the first package 1131' covering the upper surface of the first substrate 111 'and the area of the second package 1132' covering the lower surface of the first substrate 111 'are not symmetrical, not only the integrated circuit 100' of the DSM structure is easily warped; and a plastic package mold needs to be additionally designed, so that the cost is high and the possibility of overflowing of plastic package materials exists.

Based on this, the embodiments of the present application provide an integrated circuit, which includes a first circuit unit and a second circuit unit, and the second circuit unit is stacked above the first circuit unit, so as to facilitate the purpose of realizing miniaturization and high-density packaging of the integrated circuit. Meanwhile, the first connecting terminal is arranged on the bottom surface of the first circuit unit, and the second connecting terminal is arranged on the top surface of the second circuit unit, so that the integrated circuit can input/output current through the first connecting terminal and the second connecting terminal. Therefore, when the bottom surface of the first circuit unit (the top surface of the second circuit unit) is connected to the circuit board, the second connecting terminal of the top surface of the second circuit unit (the first connecting terminal of the bottom surface of the first circuit unit) can share the current flowing amount of the circuit board, and the problem that the local current density of the circuit board is overlarge due to the fact that the integrated circuit is applied to the circuit board can be solved.

In addition, in some embodiments of the first circuit unit, by disposing the first package body on the upper surface of the first substrate and disposing the second package body on the lower surface of the first substrate, and making the area of the first package body covering the upper surface of the first substrate and the area of the second package body covering the lower surface of the first substrate symmetrical, not only the first circuit unit can be prevented from warping and deforming, but also the reliability of the semiconductor device can be ensured; and the plastic package mold does not need to be additionally designed, so that the cost is favorably reduced, and the possibility of overflowing of the plastic package material is favorably reduced.

The specific structure of the integrated circuit, motherboard and computing device will be described in detail below with reference to the accompanying drawings.

Referring to fig. 3, an embodiment of the present application provides an integrated circuit 100A, where the integrated circuit 100A may package a plurality of electronic components together. For example, the integrated circuit 100A includes, but is not limited to, a power package module, which may be used for packaging circuits such as dc power supply or power slow start circuits in electronic devices such as servers, switches, computers, and the like. The power supply packaging module can internally contain a control chip and a power chip, such as a metal-oxide-semiconductor field effect transistor or a metal-oxide-semiconductor field effect transistor chip.

The integrated circuit 100A provided in the embodiment of the present application includes a first circuit unit 110A and a second circuit unit 120A, and the second circuit unit 120A is stacked above the first circuit unit 110A.

The first circuit unit 110A may include a first substrate 111A, and the first electronic component 1121A and the first metal posts 117A are distributed on the upper surface of the first substrate 111A. Illustratively, the first electronic component 1121A includes, but is not limited to, a transistor, a controller, a memory, a capacitor, an inductor, a resistor, and the like; the first electronic component 1121A may be soldered on the upper surface of the first substrate 111A by solder so as to electrically connect the first electronic component 1121A with the first substrate 111A; the number and the type of the first electronic components 1121A may be set according to actual needs, and are not particularly limited herein.

The material of the first metal pillar 117A includes, but is not limited to, copper alloy, aluminum alloy, and the like, and the number of the first metal pillar 117A may be set according to actual needs, and is not limited specifically here. The first metal posts 117A may be disposed in an edge region of the upper surface of the first substrate 111A, and the first electronic component 1121A may be disposed in a region surrounded by the first metal posts 117A. The first electronic component 1121A can be electrically connected to the first metal pillar 117A through the trace of the first substrate 111A. The top end of the first metal pillar 117A is connected to the bottom surface of the second circuit unit 120A.

The first substrate 111A is further provided with a first package 1131A on an upper surface thereof. Illustratively, the first package body 1131A includes, but is not limited to, a package structure formed by epoxy molding compound. The first electronic component 1121A and the first metal pillar 117A are both packaged in the first package 1131A. An end surface of the first metal pillar 117A facing away from the first substrate 111A is exposed at a surface of the first package body 1131A facing away from the first substrate 111A. Illustratively, an end surface of the first metal pillar 117A facing away from the first substrate 111A, and a surface of the first package body 1131A facing away from the first substrate 111A are flush with each other. The first package 1131A may perform limiting fixation and sealing protection on the first electronic component 1121A, and meanwhile, the first package 1131A may perform limiting fixation on the first metal pillar 117A.

In one possible implementation manner, the second electronic component 1122A and the second metal pillar 118A may be distributed on the lower surface of the first substrate 111A. For example, the second electronic component 1122A includes, but is not limited to, a transistor, a controller, a memory, a capacitor, an inductor, and a resistor; the second electronic component 1122A may be soldered to the lower surface of the first substrate 111A by solder so as to electrically connect the second electronic component 1122A to the first substrate 111A; the number and the type of the second electronic components 1122A may be set according to actual needs, and are not particularly limited herein.

The material of the second metal pillar 118A includes, but is not limited to, copper alloy, aluminum alloy, and the like, and the number of the second metal pillars 118A may be set according to actual needs, and is not limited herein. The second metal pillars 118A may be arranged in an edge region of the lower surface of the first substrate 111A, and the second electronic component 1122A may be arranged in a region surrounded by the second metal pillars 118A. The second electronic component 1122A can be electrically connected to the second metal pillar 118A through the trace of the first substrate 111A. The bottom end of the second metal pillar 118A extends to the bottom surface of the first circuit unit 110A and forms a first connection terminal 1181A, and the first connection terminal 1181A may be used for inputting/outputting current. Alternatively, the positions of the second metal posts 118A on the lower surface of the first substrate 111A and the positions of the first metal posts 117A on the upper surface of the first substrate 111A may correspond to each other.

A second package 1132A is further disposed on the lower surface of the first substrate 111A. For example, the second package 1132A includes, but is not limited to, an epoxy molding compound formed package structure. The second electronic component 1122A and the second metal pillar 118A are both packaged in a second package 1132A. An end surface of the second metal pillar 118A facing away from the first substrate 111A is exposed at a surface of the second package 1132A facing away from the first substrate 111A. Illustratively, an end surface of the second metal pillar 118A facing away from the first substrate 111A, and a surface of the second package 1132A facing away from the first substrate 111A are flush with each other. Second packaging body 1132A can carry out spacing fixed and sealed protection to second electronic component 1122A, and simultaneously, second packaging body 1132A can carry out spacing fixed to second metal post 118A.

In another possible implementation manner (not shown), the second electronic component 1122A, the second metal pillar 118A and the second package 1132A may not be disposed on the lower surface of the first substrate 111A, and the first connection terminal may be directly disposed on the lower surface of the first substrate 111A, so as to facilitate increasing the disposing density of the first connection terminal, so as to increase the input/output path of the integrated circuit.

The second circuit unit 120A may include a second substrate 121A, and a third electronic component 122A and a third metal pillar 125A are distributed on an upper surface of the second substrate 121A. Illustratively, the third electronic component 122A includes, but is not limited to, a transistor, a controller, a memory, a capacitor, an inductor, and a resistor; the third electronic component 122A may be soldered on the upper surface of the second substrate 121A by solder so as to electrically connect the third electronic component 122A and the second substrate 121A; the number and the type of the third electronic component 122A may be set according to actual needs, and are not particularly limited herein.

The material of the third metal pillar 125A includes, but is not limited to, copper alloy, aluminum alloy, and the like, and the number of the third metal pillar 125A may be set according to actual needs, and is not limited herein. The third metal pillars 125A may be arranged at an edge region of the upper surface of the second substrate 121A, and the third electronic component 122A may be arranged in a region surrounded by the third metal pillars 125A. The third electronic component 122A can be conducted with the third metal pillar 125A through the trace of the second substrate 121A. The top end of the third metal pillar 125A forms a second connection terminal 1251A, and the second connection terminal 1251A may be used for inputting/outputting current.

In one possible implementation, the upper surface of the second substrate 121A may be provided with a third package body 123A. Illustratively, the third package body 123A includes, but is not limited to, a package structure formed by epoxy molding compound. The third electronic component 122A and the third metal pillar 125A are packaged in the third package 123A. An end surface of the third metal pillar 125A facing away from the second substrate 121A is exposed at a surface of the third package body 123A facing away from the second substrate 121A. Illustratively, an end surface of the third metal pillar 125A facing away from the second substrate 121A, and a surface of the third package body 123A facing away from the second substrate 121A are flush with each other. The third package body 123A may perform limiting fixation and sealing protection on the third electronic component 122A, and meanwhile, the third package body 123A may perform limiting fixation on the third metal pillar 125A.

In another possible implementation manner, the third package 123A may not be disposed on the upper surface of the second substrate 121A.

The second circuit unit 120A is stacked above the first circuit unit 110A, and the lower surface of the second substrate 121A is opposite to a surface of the first package 1131A away from the first substrate 111A. The lower surface of the second substrate 121A may be provided with a pad region, and an end surface of the first metal pillar 117A facing away from the first substrate 111A corresponds to the pad region, so as to connect an end surface of the first metal pillar 117A facing away from the first substrate 111A with the pad region on the lower surface of the second substrate 121A. Illustratively, solder is provided between the end surface of the first metal pillar 117A facing the second substrate 121A and the pad area of the lower surface of the second substrate 121A, so as to reliably solder the end surface of the first metal pillar 117A facing the second substrate 121A and the pad area of the lower surface of the second substrate 121A.

In a first aspect, the integrated circuit 100A of the embodiment of the present application may use two or three substrates to realize two-layer or three-layer stacking, so as to improve the packaging density, thereby facilitating the miniaturized design of the integrated circuit 100A.

In the second aspect, the first metal pillar 117A may not only serve to reliably connect the first circuit unit 110A and the second circuit unit 120A, but also serve to turn on a signal. The second metal pillar 118A and the third metal pillar 125A may function as a conducting signal, so that the top surface and the bottom surface of the integrated circuit 100A may both input/output current, and further, the problem of excessive local current density of the circuit board caused by the application of the integrated circuit 100A to the circuit board may be solved. Meanwhile, since the cross-sectional areas of the first metal pillar 117A, the second metal pillar 118A, and the third metal pillar 125A are relatively large, the current passing capability is relatively good.

In a third aspect, since the first substrate 111A derives signals by arranging the first metal posts 117A and the second metal posts 118A, it is not necessary to arrange an exposed region on the lower surface of the first substrate 111A, which is not only convenient for arranging the package bodies on the two sides of the first substrate 111A, but also does not need to additionally design a plastic package model, which is beneficial to saving cost, and can ensure that the coverage regions of the package bodies on the two sides of the first substrate 111A are mutually symmetrical, so as to avoid the warpage deformation of the first circuit unit 110A.

Referring to fig. 4, a first variation of the first embodiment of the present application provides an integrated circuit 100A, where the integrated circuit 100A differs from the integrated circuit 100A shown in fig. 3 in that the integrated circuit 100A further includes a first thermal conductive member 114A and/or a second thermal conductive member 115A.

In a first possible implementation manner, the first circuit unit 110A includes a first heat conduction member 114A, the first heat conduction member 114A is disposed on a surface of the first electronic component 1121A away from the first substrate 111A, and the first heat conduction member 114A is located between the first electronic component 1121A and a bottom surface of the second circuit unit 120A.

Illustratively, the first heat conduction member 114A has a plate shape, and the plate-shaped first heat conduction member 114A may extend in a plane parallel to the first substrate 111A. The material of the first thermal conduction member 114A includes, but is not limited to, at least one of copper, copper alloy, aluminum and aluminum alloy. One surface of the first heat conducting member 114A facing the first substrate 111A and one surface of the first electronic component 1121A facing away from the first substrate 111A may be in insulation connection through an insulating adhesive, so as to prevent the first heat conducting member 114A from causing an internal short circuit of the integrated circuit 100A, and one surface of the first heat conducting member 114A facing away from the first substrate 111A is in welding connection with a bottom surface of the second circuit unit 120A.

One end of the first thermal conductive element 114A may be packaged in the first package 1131A, and an end surface of the first thermal conductive element 114A facing away from the first substrate 111A is exposed at a surface of the first package 1131A facing away from the first substrate 111A. Illustratively, an end surface of the first thermal conduction member 114A facing away from the first substrate 111A, and a surface of the first package body 1131A facing away from the first substrate 111A are flush with each other. The first package 1131A may limit and fix the first thermal conductive member 114A. The gap between the first package 1131A and the second circuit unit 120A may be sealed with glue so that the integrated circuit 100A may be used in a liquid-cooled scenario.

When the first electronic component 1121A includes a plurality of components: in a first possible implementation manner, a first heat conduction member 114A is disposed on a surface of one of the first electronic components 1121A facing away from the first substrate 111A. For example, the power of the first electronic component is relatively large, such as a controller or a memory.

A second possible implementation manner is to provide the first heat conduction member 114A on a side of the plurality of first electronic components 1121A away from the first substrate 111A.

A third possible implementation manner is to provide the first heat conduction member 114A on a side of all the first electronic components 1121A away from the first substrate 111A. When the first heat conduction member 114A is disposed on a surface of the first electronic component 1121A away from the first substrate 111A: a first possible implementation manner is to provide a first heat conduction member 114A on a side of each first electronic component 1121A away from the first substrate 111A. A second possible implementation manner is to arrange a first heat conduction member 114A on a surface of the first electronic components 1121A away from the first substrate 111A, at this time, the heights of the surfaces of the first electronic components 1121A away from the first substrate 111A are flush or nearly flush, so that the first heat conduction member 114A is smoothly arranged. A third possible implementation manner is to provide a plurality of first heat conducting members 114A on a surface of the first electronic component 1121A away from the first substrate 111A.

In a second possible implementation manner, the first circuit unit 110A includes a second heat conducting member 115A, and the second heat conducting member 115A is disposed on a surface of the second electronic component 1122A facing away from the first substrate 111A. Illustratively, the second heat-conducting member 115A has a sheet shape, and the sheet-shaped second heat-conducting member 115A may extend in a plane parallel to the first substrate 111A; the material of the second heat conduction member 115A includes, but is not limited to, at least one of copper, copper alloy, aluminum and aluminum alloy; one surface of the second heat conducting member 115A facing the first substrate 111A and one surface of the second electronic component 1122A facing away from the first substrate 111A may be insulated and connected by an insulating adhesive to prevent the second heat conducting member 115A from causing an internal short circuit of the integrated circuit 100A, and one surface of the second heat conducting member 115A facing away from the first substrate 111A may be welded and connected to the circuit board.

One end of the second thermal conductive element 115A may be packaged in the second package 1132A, and an end surface of the second thermal conductive element 115A facing away from the first substrate 111A is exposed on a surface of the second package 1132A facing away from the first substrate 111A. Illustratively, an end surface of the second thermal conduction member 115A facing away from the first substrate 111A, and a surface of the second package 1132A facing away from the first substrate 111A are flush with each other. The second package 1132A may limit and fix the second thermal conductor 115A.

When the second electronic component 1122A includes a plurality of: in a first possible implementation manner, the second heat conducting member 115A is disposed on a surface of one of the second electronic components 1122A facing away from the first substrate 111A. A second possible implementation manner is to provide the second heat conducting member 115A on a side of the plurality of second electronic components 1122A facing away from the first substrate 111A. In a third possible implementation manner, the second heat-conducting member 115A is disposed on a surface of all the second electronic components 1122A facing away from the first substrate 111A.

When the second heat-conductive member 115A is provided on the surface of the second electronic components 1122A facing away from the first substrate 111A: in a first possible implementation manner, one second heat conduction member 115A is disposed on a surface of each second electronic component 1122A facing away from the first substrate 111A; for example, the power of the first electronic component is relatively large, such as a controller or a memory. A second possible implementation manner is that one second heat conduction member 115A is disposed on one surface of the plurality of second electronic components 1122A facing away from the first substrate 111A, and at this time, the heights of the surfaces of the plurality of second electronic components 1122A facing away from the first substrate 111A are flush or nearly flush, so that the one second heat conduction member 115A is smoothly disposed. In a third possible implementation manner, a plurality of second heat-conducting members 115A are disposed on a surface of one second electronic component 1122A facing away from the first substrate 111A.

In a third possible implementation manner, the first circuit unit 110A includes both the first heat-conducting member 114A and the second heat-conducting member 115A.

In the first aspect, the first thermal conduction member 114A may not only function to reliably connect the first circuit unit 110A and the second circuit unit 120A; and may reduce the thermal resistance between the first circuit unit 110A and the second circuit unit 120A, thereby facilitating shortening of the thermal conduction link between the top and bottom of the integrated circuit 100A.

In the second aspect, the second heat-conducting member 115A can not only function as a reliable connection with the circuit board when the bottom surface of the integrated circuit 100A is connected with the circuit board; and the thermal resistance between the integrated circuit 100A and the circuit board can be reduced, thereby being beneficial to shortening the heat conduction link between the integrated circuit 100A and the circuit board and solving the heat transfer problem of the multilayer stack package.

Referring to fig. 5, a second variation of the first embodiment of the present application provides an integrated circuit 100A, where the integrated circuit 100A differs from the integrated circuit 100A shown in fig. 4 in that the integrated circuit 100A further includes a third thermal conductive member 124A.

Specifically, the second circuit unit 120A includes a third heat conducting member 124A, and the third heat conducting member 124A is disposed on a surface of the third electronic component 122A facing away from the second substrate 121A. Illustratively, the third heat-conducting member 124A has a plate shape, and the plate-shaped third heat-conducting member 124A may extend in a plane parallel to the second substrate 121A; the material of the third heat conduction member 124A includes, but is not limited to, at least one of copper, copper alloy, aluminum and aluminum alloy; one surface of the third heat-conducting member 124A facing the second substrate 121A and one surface of the third electronic component 122A facing away from the second substrate 121A may be insulated and connected by an insulating adhesive, so as to prevent the third heat-conducting member 124A from causing an internal short circuit of the integrated circuit 100A, and one surface of the third heat-conducting member 124A facing away from the second substrate 121A may be connected to a circuit board.

The third thermal conductive member 124A may be packaged in the third package body 123A, and an end surface of the third thermal conductive member 124A facing away from the second substrate 121A is exposed at a surface of the third package body 123A facing away from the second substrate 121A. Illustratively, an end surface of the third thermal conduction member 124A facing away from the second substrate 121A, and a surface of the third package body 123A facing away from the second substrate 121A are flush with each other. The third package body 123A may limit and fix the third heat conducting member 124A.

When the third electronic component 122A includes a plurality of: in a first possible implementation manner, a third heat conducting element 124A is disposed on a side of one of the third electronic components 122A facing away from the second substrate 121A. A second possible implementation manner is to provide a third heat conducting member 124A on a side of the plurality of third electronic components 122A facing away from the second substrate 121A. A third possible implementation manner is to provide a third heat-conducting member 124A on a side of all the third electronic components 122A facing away from the second substrate 121A.

When the third heat-conducting member 124A is disposed on a surface of the plurality of third electronic components 122A facing away from the second substrate 121A: in a first possible implementation manner, a third heat conducting element 124A is disposed on a side of each third electronic component 122A facing away from the second substrate 121A. A second possible implementation manner is to arrange a third heat conducting element 124A on a surface of the plurality of third electronic components 122A facing away from the second substrate 121A, where heights of the surfaces of the plurality of third electronic components 122A facing away from the second substrate 121A are flush or nearly flush, so that the third heat conducting element 124A is smoothly arranged. A third possible implementation manner is to provide a plurality of third heat-conducting members 124A on a surface of one third electronic component 122A that faces away from the second substrate 121A.

In a first possible implementation (not shown), the integrated circuit 100A includes a third heat-conducting member 124A.

In a second possible implementation (not shown), the integrated circuit 100A includes a third thermal conductive member 124A and a first thermal conductive member 114A.

In a third possible implementation (not shown), the integrated circuit 100A includes a third thermal conductive member 124A and a second thermal conductive member 115A.

In a fourth possible implementation (as shown in fig. 5), the integrated circuit 100A includes a third thermal conduction member 124A, a second thermal conduction member 115A, and a first thermal conduction member 114A.

The third heat conducting member 124A can not only serve as a reliable connection with the circuit board when the top surface of the integrated circuit 100A is connected with the circuit board; and the thermal resistance between the integrated circuit 100A and the circuit board can be reduced, thereby being beneficial to shortening the heat conduction link between the integrated circuit 100A and the circuit board and solving the heat transfer problem of the multilayer stack package.

Referring to fig. 6, a second embodiment of the present application provides an integrated circuit 100B, where the integrated circuit 100B may package a plurality of electronic components together. For example, the integrated circuit 100B includes, but is not limited to, a power package module, and may be used in the fields of dc power supply or power supply slow start circuit in the fields of servers, switches, and the like. The power supply package module may include a power supply chip, such as a metal-oxide-semiconductor field effect transistor package or a metal-oxide-semiconductor field effect transistor chip.

The integrated circuit 100B provided in the embodiment of the present application includes a first circuit unit 110B and a second circuit unit 120B, and the second circuit unit 120B is stacked above the first circuit unit 110B.

The first circuit unit 110B may include a first substrate 111B, and first electronic components 1121B and first metal posts 117B are distributed on an upper surface of the first substrate 111B. Illustratively, the first electronic component 1121B includes, but is not limited to, a transistor, a bare chip, a memory, a capacitor, a resistor, or the like; the first electronic component 1121B may be soldered on the upper surface of the first substrate 111B by solder so as to electrically connect the first electronic component 1121B with the first substrate 111B; the number of the first electronic components 1121B may be set according to actual needs, and is not particularly limited herein.

The material of the first metal pillar 117B includes, but is not limited to, copper alloy, aluminum alloy, and the like, and the number of the first metal pillar 117B may be set according to actual needs, which is not limited herein. The first metal posts 117B may be arranged in an edge region of the upper surface of the first substrate 111B, and the first electronic component 1121B may be arranged in a region surrounded by the first metal posts 117B. The first electronic component 1121B can be electrically connected to the first metal pillar 117B through the trace of the first substrate 111B. The top end of the first metal pillar 117B is connected to the bottom surface of the second circuit unit 120B.

The first substrate 111B is also provided with a first package 1131B on an upper surface thereof. Illustratively, the first package body 1131B includes, but is not limited to, a package structure formed by epoxy molding compound. The first electronic component 1121B and the first metal pillar 117B are both packaged in a first package 1131B. An end surface of the first metal pillar 117B facing away from the first substrate 111B is exposed at a surface of the first package 1131B facing away from the first substrate 111B. Illustratively, an end surface of the first metal pillar 117B facing away from the first substrate 111B, and a surface of the first package body 1131B facing away from the first substrate 111B are flush with each other. The first package 1131B may perform limiting fixation and sealing protection on the first electronic component 1121B, and meanwhile, the first package 1131B may perform limiting fixation on the first metal pillar 117B.

In one possible implementation manner, the second electronic component 1122B and the second metal pillars 118B may be distributed on the lower surface of the first substrate 111B. For example, the second electronic component 1122B includes, but is not limited to, a transistor, a controller, a memory, a capacitor, an inductor, and a resistor; the second electronic component 1122B may be soldered to the lower surface of the first substrate 111B by solder so as to electrically connect the second electronic component 1122B to the first substrate 111B; the number of the second electronic components 1122B may be set according to actual needs, and is not particularly limited herein.

The material of the second metal pillar 118B includes, but is not limited to, copper alloy, aluminum alloy, and the like, and the number of the second metal pillars 118B may be set according to actual needs, and is not limited herein. The second metal pillars 118B may be arranged in an edge region of the lower surface of the first substrate 111B, and the second electronic component 1122B may be arranged in a region surrounded by the second metal pillars 118B. The second electronic component 1122B can be electrically connected to the second metal pillar 118B through the trace of the first substrate 111B. The bottom end of the second metal pillar 118B extends to the bottom surface of the first circuit unit 110B and forms a first connection terminal 1181B, and the first connection terminal 1181B may be used for inputting/outputting current. Alternatively, the positions of the second metal posts 118B on the lower surface of the first substrate 111B and the positions of the first metal posts 117B on the upper surface of the first substrate 111B may correspond to each other.

A second package 1132B is further disposed on the lower surface of the first substrate 111B. For example, the second package body 1132B includes, but is not limited to, an epoxy molding compound formed package structure. The second electronic component 1122B and the second metal pillar 118B are both packaged in a second package 1132B. An end surface of the second metal pillar 118B facing away from the first substrate 111B is exposed at a surface of the second package 1132B facing away from the first substrate 111B. Illustratively, an end surface of the second metal pillar 118B facing away from the first substrate 111B, and a surface of the second package 1132B facing away from the first substrate 111B are flush with each other. Second packaging body 1132B can carry out spacing fixed and sealed protection to second electronic component 1122B, and simultaneously, second packaging body 1132B can carry out spacing fixed to second metal column 118B.

In another possible implementation manner (not shown), the second electronic component 1122B, the second metal pillar 118B, and the second package 1132B may not be disposed on the lower surface of the first substrate 111B, and the first connection terminal may be directly disposed on the lower surface of the first substrate 111B, so as to facilitate increasing the disposing density of the first connection terminal, so as to increase the input/output path of the integrated circuit.

The second circuit unit 120B may include a second substrate 121B, and a fourth electronic component 126B and a fourth metal pillar 129B are distributed on a lower surface of the second substrate 121B. Illustratively, the fourth electronic component 126B includes, but is not limited to, a transistor, a die, a memory, a capacitor, a resistor, or the like; the fourth electronic component 126B may be soldered on the lower surface of the second substrate 121B by solder so as to electrically connect the fourth electronic component 126B and the second substrate 121B; the number of the fourth electronic component 126B can be set according to actual needs, and is not limited specifically here.

The material of the fourth metal pillar 129B includes, but is not limited to, copper alloy, aluminum alloy, and the like, and the number of the fourth metal pillar 129B may be set according to actual needs, and is not limited herein. The fourth metal posts 129B may be disposed at an edge region of the lower surface of the second substrate 121B, and the fourth electronic component 126B may be disposed in a region surrounded by the fourth metal posts 129B. The fourth electronic component 126B can be electrically connected to the fourth metal pillar 129B through the trace of the second substrate 121B. The bottom end of the fourth metal pillar 129B is connected to the top end of the first metal pillar 117B.

The lower surface of the second substrate 121B may also be provided with a fourth package 127B. Illustratively, the fourth package body 127B includes, but is not limited to, a package structure formed by epoxy molding compound. The fourth electronic component 126B and the fourth metal pillar 129B are packaged in a fourth package 127B. An end surface of the fourth metal pillar 129B facing away from the second substrate 121B is exposed at a surface of the fourth package body 127B facing away from the second substrate 121B. Illustratively, an end surface of the fourth metal pillar 129B facing away from the second substrate 121B, and a surface of the fourth package body 127B facing away from the second substrate 121B are flush with each other. The fourth package body 127B may perform position limiting, fixing and sealing protection on the fourth electronic component 126B, and meanwhile, the fourth package body 127B may perform position limiting and fixing on the fourth metal pillar 129B.

The second circuit unit 120B is stacked above the first circuit unit 110B, and a surface of the fourth package body 127B facing away from the second substrate 121B is opposite to a surface of the first package body 1131B facing away from the first substrate 111B. The bottom end of the fourth metal post 129B is welded to the top end of the first metal post 117B. The upper surface of the second substrate 121B may be provided with a second connection terminal 1211B, and the second connection terminal 1211B may be used to input/output current, through a terminal of a top semiconductor package of the semiconductor package, to increase an input/output path of the integrated circuit, and to reduce a through-current density of a bottom.

In a first aspect, the integrated circuit 100B according to the embodiment of the present application may use two substrates to realize two-layer or three-layer stacking, so as to improve the packaging density, thereby facilitating the miniaturization design of the integrated circuit 100B.

In the second aspect, the first metal pillar 117B and the fourth metal pillar 129B may not only serve to reliably connect the first circuit unit 110B and the second circuit unit 120B, but also serve to turn on a signal. The second metal pillar 118B can function as a conducting signal, so that the top surface and the bottom surface of the integrated circuit 100B can both input/output current, and the problem of excessive local current density of the circuit board caused by the application of the integrated circuit 100B to the circuit board can be solved. Meanwhile, since the cross-sectional areas of the first metal pillar 117B, the second metal pillar 118B, and the fourth metal pillar 129B are relatively large, the current passing capability is relatively good, and thus the signal deriving capability is also relatively good.

In a third aspect, since the first substrate 111B derives the signal by arranging the first metal pillar 117B and the second metal pillar 118B, it is not necessary to arrange an exposed region on the lower surface of the first substrate 111B, which is not only convenient to arrange the package bodies on the two sides of the first substrate 111B, but also does not need to additionally design a plastic package model, which is beneficial to saving cost, and can ensure that the coverage regions of the package bodies on the two sides of the first substrate 111B are mutually symmetrical, so as to avoid the warpage deformation of the first circuit unit 110B.

Referring to fig. 7, a first variation of the second embodiment of the present application provides an integrated circuit 100B, and the integrated circuit 100B is different from the integrated circuit 100B shown in fig. 6 in that the integrated circuit 100B further includes a first thermal conduction member 114B and/or a fourth thermal conduction member 128B.

In a first possible implementation manner, the first circuit unit 110B includes a first heat conduction member 114B, the first heat conduction member 114B is disposed on a surface of the first electronic component 1121B away from the first substrate 111B, and the first heat conduction member 114B is located between the first electronic component 1121B and the bottom surface of the second circuit unit 120B. Illustratively, the first heat conduction member 114B has a plate shape, and the plate-shaped first heat conduction member 114B may extend in a plane parallel to the first substrate 111B; the material of the first heat conduction member 114B includes, but is not limited to, at least one of copper, copper alloy, aluminum, and aluminum alloy; one surface of the first heat conduction member 114B facing the first substrate 111B and one surface of the first electronic component 1121B facing away from the first substrate 111B may be in insulation connection through an insulating adhesive, so as to prevent the first heat conduction member 114B from causing an internal short circuit of the integrated circuit 100B, and one surface of the first heat conduction member 114B facing away from the first substrate 111B is connected to the bottom surface of the second circuit unit 120B.

The first thermal conductive member 114B may be packaged in the first package body 1131B, and an end surface of the first thermal conductive member 114B facing away from the first substrate 111B is exposed at a surface of the first package body 1131B facing away from the first substrate 111B. Illustratively, an end surface of the first thermal conduction member 114B facing away from the first substrate 111B, and a surface of the first package body 1131B facing away from the first substrate 111B are flush with each other. The first package 1131B may limit and fix the first thermal conductive member 114B.

When the first electronic component 1121B includes a plurality of components: a first possible implementation manner is to provide a first heat conduction member 114B on a surface of one of the first electronic components 1121B, which is away from the first substrate 111B. A second possible implementation manner is to provide the first heat conduction member 114B on a side of the plurality of first electronic components 1121B away from the first substrate 111B. A third possible implementation manner is to provide the first heat conduction member 114B on a side of all the first electronic components 1121B away from the first substrate 111B.

When the first heat conduction member 114B is disposed on a surface of the first electronic components 1121B away from the first substrate 111B: a first possible implementation manner is to provide a first heat conduction member 114B on a side of each first electronic component 1121B away from the first substrate 111B. A second possible implementation manner is to arrange a first heat conduction member 114B on a surface of the first electronic components 1121B facing away from the first substrate 111B, where the heights of the surfaces of the first electronic components 1121B facing away from the first substrate 111B are flush or nearly flush, so that the first heat conduction member 114B is smoothly arranged. A third possible implementation manner is to provide a plurality of first heat conducting members 114B on a surface of one first electronic component 1121B away from the first substrate 111B.

In a second possible implementation manner, the second circuit unit 120B includes a fourth heat conduction member 128B, and the fourth heat conduction member 128B is disposed on a side of the fourth electronic component 126B facing away from the second substrate 121B. Illustratively, the fourth heat-conducting member 128B has a plate shape, and the plate-shaped fourth heat-conducting member 128B may extend in a plane parallel to the second substrate 121B; the fourth heat conduction member 128B is made of at least one material selected from copper, copper alloy, aluminum and aluminum alloy; one surface of the fourth heat-conducting member 128B facing the second substrate 121B and one surface of the fourth electronic component 126B facing away from the second substrate 121B may be in insulation connection through an insulating adhesive, so as to prevent the fourth heat-conducting member 128B from causing an internal short circuit of the integrated circuit 100B, and one surface of the fourth heat-conducting member 128B facing away from the second substrate 121B is connected to the top surface of the first circuit unit 110B.

The fourth thermal conductive element 128B may be packaged in the fourth package body 127B, and an end surface of the fourth thermal conductive element 128B facing away from the second substrate 121B is exposed at a surface of the fourth package body 127B facing away from the second substrate 121B. Illustratively, an end surface of the fourth thermal conduction member 128B facing away from the second substrate 121B, and a surface of the fourth package body 127B facing away from the second substrate 121B are flush with each other. The fourth package body 127B may limit and fix the fourth thermal conductive member 128B.

When the fourth electronic component 126B includes a plurality of: in a first possible implementation manner, a fourth heat conduction member 128B is disposed on a side of one of the fourth electronic components 126B facing away from the second substrate 121B. A second possible implementation is to provide a fourth heat conducting element 128B on a side of the plurality of fourth electronic components 126B facing away from the second substrate 121B. A third possible implementation manner is to provide a fourth heat conduction member 128B on a side of all the fourth electronic components 126B facing away from the second substrate 121B.

When the fourth heat-conducting member 128B is provided on the side of the plurality of fourth electronic components 126B facing away from the second substrate 121B: in a first possible implementation manner, a fourth heat conduction element 128B is disposed on a side of each fourth electronic component 126B facing away from the second substrate 121B. A second possible implementation manner is to provide one fourth heat conduction element 128B on one surface of the plurality of fourth electronic components 126B facing away from the second substrate 121B, and at this time, the heights of the surfaces of the plurality of fourth electronic components 126B facing away from the second substrate 121B are flush or nearly flush, so that the one fourth heat conduction element 128B is smoothly disposed. A third possible implementation manner is to provide a plurality of fourth heat conduction members 128B on a side of one fourth electronic component 126B facing away from the second substrate 121B.

In a third possible implementation, the integrated circuit 100B includes both the first thermal conduction member 114B and the fourth thermal conduction member 128B. The second circuit unit 120B is stacked above the first circuit unit 110B, and the first heat-conducting member 114B and the fourth heat-conducting member 128B are correspondingly connected, for example, the first heat-conducting member 114B and the fourth heat-conducting member 128B may be connected by welding.

The first and fourth heat conduction members 114B and 128B may not only function to reliably connect the first and second circuit units 110B and 120B; and the thermal resistance between the first circuit unit 110B and the second circuit unit 120B may be reduced, thereby facilitating shortening of the thermal conduction link between the top and bottom of the integrated circuit 100B.

Referring to fig. 8, a second variation of the second embodiment of the present application provides an integrated circuit 100B, where the integrated circuit 100B differs from the integrated circuit 100B shown in fig. 7 in that the integrated circuit 100B further includes a second thermal conduction member 115B.

Specifically, the first circuit unit 110B includes a second heat conduction member 115B, and the second heat conduction member 115B is disposed on a surface of the second electronic component 1122B opposite to the first substrate 111B. Illustratively, the second heat conduction member 115B has a plate shape, and the plate-shaped second heat conduction member 115B may extend in a plane parallel to the first substrate 111B; the material of the second heat conduction member 115B includes, but is not limited to, at least one of copper, copper alloy, aluminum, and aluminum alloy; one surface of the second heat-conducting member 115B facing the first substrate 111B and one surface of the second electronic component 1122B facing away from the first substrate 111B may be in insulation connection with an insulating adhesive, so as to prevent the second heat-conducting member 115B from causing an internal short circuit of the integrated circuit 100B, and one surface of the second heat-conducting member 115B facing away from the first substrate 111B may be connected to a circuit board.

The second thermal conductive member 115B may be packaged in the second package 1132B, and an end surface of the second thermal conductive member 115B facing away from the first substrate 111B is exposed at a surface of the second package 1132B facing away from the first substrate 111B. Illustratively, an end surface of the second thermal conduction member 115B facing away from the first substrate 111B, and a surface of the second package 1132B facing away from the first substrate 111B are flush with each other. The second package 1132B may limit and fix the second thermal conductor 115B.

When the second electronic component 1122B includes a plurality of: in a first possible implementation manner, the second heat conducting member 115B is disposed on a surface of one of the second electronic components 1122B, which is away from the first substrate 111B. A second possible implementation manner is to provide the second heat-conducting member 115B on a side of the plurality of second electronic components 1122B facing away from the first substrate 111B. In a third possible implementation manner, the second heat-conducting member 115B is disposed on a surface of all the second electronic components 1122B facing away from the first substrate 111B.

When the second heat-conductive member 115B is provided on the surface of the plurality of second electronic components 1122B facing away from the first substrate 111B: a first possible implementation manner is to provide one second heat-conducting member 115B on a surface of each second electronic component 1122B, which surface is away from the first substrate 111B. A second possible implementation manner is that one second heat conduction member 115B is disposed on a surface of the plurality of second electronic components 1122B facing away from the first substrate 111B, and at this time, the heights of the surfaces of the plurality of second electronic components 1122B facing away from the first substrate 111B are flush or nearly flush, so that the one second heat conduction member 115B is smoothly disposed. In a third possible implementation manner, a plurality of second heat-conducting members 115B are disposed on a surface of one second electronic component 1122B that is away from the first substrate 111B.

In a first possible implementation (not shown), the integrated circuit 100B includes a second heat-conducting member 115B.

In a second possible implementation (not shown), the integrated circuit 100B includes a second thermal conduction member 115B and a first thermal conduction member 114B.

In a third possible implementation (not shown), the integrated circuit 100B includes a second heat-conducting member 115B and a fourth heat-conducting member 128B.

In a fourth possible implementation (as shown in fig. 8), the integrated circuit 100B includes a second thermal conduction member 115B, a first thermal conduction member 114B, and a fourth thermal conduction member 128B.

The second heat-conducting member 115A may not only serve to reliably connect with the circuit board when the bottom surface of the integrated circuit 100A is connected with the circuit board; and the thermal resistance between the integrated circuit 100A and the circuit board can be reduced, thereby being beneficial to shortening the heat conduction link between the integrated circuit 100A and the circuit board and solving the heat transfer problem of the multilayer stack package.

Referring to fig. 9, a third embodiment of the present application provides a motherboard 200A. The motherboard 200A includes a circuit board 210A and at least one integrated circuit 100A as shown in fig. 3, a bottom surface of the integrated circuit 100A being connected to a front surface of the circuit board 210A. At this time, a side of the second package 1132A of the integrated circuit 100A facing away from the first substrate 111A is opposite to the front side of the circuit board 210A, and the first connection terminal 1181A formed at the bottom end of the second metal pillar 118A and the front side of the circuit board 210A may be reliably soldered by solder, for example, the solder includes but is not limited to solder paste.

The second connection terminal 1251A formed at the top end of the third metal pillar 125A of the integrated circuit 100A may lead out a circuit, for example, a hard disk power supply circuit, a bus power supply circuit, and the like, through a conductor (not shown). Exemplary conductors include, but are not limited to, copper wire, copper bar, or other material of wire and conductor.

In a first aspect, the second metal posts not only serve to reliably connect the integrated circuit and the circuit board; but also to derive the signal. The cross-sectional area of the second metal column is larger, so that the current passing capacity is better, and the signal deriving capacity is also better.

In a second aspect, the integrated circuit can input/output current through the second connection terminals on the top surface and the first connection terminals on the bottom surface, so that the problem of excessive local current density of the circuit board caused by applying the integrated circuit to the circuit board can be solved.

In addition, since the main board 200A of the embodiment of the present application includes the integrated circuit 100A shown in fig. 3, the main board 200A has the features and effects of the integrated circuit 100A shown in fig. 3.

In some modified embodiments of the third embodiment of the present application, the integrated circuit 100A shown in fig. 4 or 5 and the circuit board form a motherboard, and specific structural features and effects may refer to the motherboard 200A shown in fig. 9, which is not described herein again. It should be noted that, when the bottom surface of the integrated circuit shown in fig. 4 or fig. 5 is connected to the front surface of the circuit board, the surface of the second heat conduction member facing away from the first substrate and the front surface of the circuit board can be soldered reliably by solder. The second heat conducting member can not only play a role in reliably connecting the integrated circuit and the circuit board; and the thermal resistance between the integrated circuit and the circuit board can be reduced, thereby being beneficial to shortening the heat conduction link from the top of the integrated circuit to the circuit board.

Referring to fig. 10, a motherboard 200B is provided in the fourth embodiment of the present application. The motherboard 200B includes a circuit board 210B and at least one integrated circuit 100A as shown in fig. 3, the top surface of the integrated circuit 100A being connected to the front surface of the circuit board 210B. At this time, a surface of the third package body 123A of the integrated circuit 100A facing away from the second substrate 121A is opposite to the front surface of the circuit board 210B, and the second connection terminal 1251A formed at the top end of the third metal pillar 125A and the front surface of the circuit board 210B can be reliably soldered by solder, which includes but is not limited to solder paste, for example.

The first connection terminal 1181A formed at the bottom end of the second metal pillar 118A of the integrated circuit 100A may lead out a circuit, such as a hard disk power supply circuit and a bus power supply circuit, through a conductor (not shown). Exemplary conductors include, but are not limited to, copper wire, copper bar, or other material of wire and conductor.

On the first hand, the third metal column not only can play a role in reliably connecting the integrated circuit and the circuit board; but also to derive the signal. The cross-sectional area of the third metal column is larger, so that the current passing capacity is better, and the signal deriving capacity is also better.

In the second aspect, the integrated circuit can input/output current through the second connection terminal on the top surface and the first connection terminal on the bottom surface, so that the problem of excessive local current density of the circuit board caused by the application of the integrated circuit to the circuit board can be solved.

In addition, since the main board 200B of the embodiment of the present application includes the integrated circuit 100A shown in fig. 3, the main board 200B has the features and effects of the integrated circuit 100A shown in fig. 3.

In some variant embodiments of the fourth embodiment of the present application, the integrated circuit 100A shown in fig. 4 or fig. 5 and the circuit board constitute a motherboard, and specific structural features and effects may refer to the motherboard 200B shown in fig. 10, which is not described herein again. It should be noted that when the top surface of the integrated circuit shown in fig. 5 is connected to the front surface of the circuit board, the surface of the third heat-conducting member facing away from the second substrate and the front surface of the circuit board can be soldered reliably by solder. The third heat conducting member can not only play a role in reliably connecting the integrated circuit and the circuit board; and the thermal resistance between the integrated circuit and the circuit board can be reduced, thereby being beneficial to shortening the heat conduction link from the top of the integrated circuit to the circuit board.

Referring to fig. 11, a fifth embodiment of the present application provides a motherboard 200C. The motherboard 200C includes a circuit board 210C and at least one integrated circuit 100B as shown in fig. 6, a bottom surface of the integrated circuit 100B being connected to a front surface of the circuit board 210C. At this time, a side of the second package body 1132B of the integrated circuit 100B facing away from the first substrate 111B is opposite to the front surface of the circuit board 210C, and the first connection terminal 1181B formed at the bottom end of the second metal pillar 118B and the front surface of the circuit board 210C may be reliably soldered by solder, for example, the solder includes but is not limited to solder paste.

The second connection terminal 1211B provided on the upper surface of the second substrate 121B of the integrated circuit 100B may be connected to a circuit, such as a hard disk power supply circuit or a bus power supply circuit, via a conductor (not shown). Exemplary conductors include, but are not limited to, copper wire, copper bar, or other material of wire and conductor.

On the first hand, the second metal column not only can play a role in reliably connecting the integrated circuit and the circuit board; but also to derive the signal. The cross-sectional area of the second metal column is larger, so that the current passing capacity is better, and the signal deriving capacity is also better.

In the second aspect, the integrated circuit can input/output current through the second connection terminal on the top surface and the first connection terminal on the bottom surface, so that the problem of excessive local current density of the circuit board caused by the application of the integrated circuit to the circuit board can be solved.

In addition, since the main board 200C of the embodiment of the present application includes the integrated circuit 100B shown in fig. 6, the main board 200C has the features and effects of the integrated circuit 100B shown in fig. 6.

In some modified embodiments of the fifth embodiment of the present application, the integrated circuit 100B shown in fig. 7 or fig. 8 and the circuit board form a motherboard, and specific structural features and effects may refer to the motherboard 200C shown in fig. 11, which is not described herein again. It should be noted that, when the bottom surface of the integrated circuit shown in fig. 8 is connected to the front surface of the circuit board, the surface of the second heat conduction member facing away from the first substrate and the front surface of the circuit board can be soldered reliably by solder. The second heat conducting member can not only play a role in reliably connecting the integrated circuit and the circuit board; and the thermal resistance between the integrated circuit and the circuit board can be reduced, thereby being beneficial to shortening the heat conduction link from the top of the integrated circuit to the circuit board.

Referring to fig. 12, a motherboard 200D is provided according to a sixth embodiment of the present application. The motherboard 200D includes a circuit board 210D and at least one integrated circuit 100B as shown in fig. 6, with a top surface of the integrated circuit 100B connected to a front surface of the circuit board 210D. At this time, the upper surface of the second substrate 121B of the integrated circuit 100B is opposite to the front surface of the circuit board 210D, and the second connection terminal 1211B disposed on the upper surface of the second substrate 121B and the front surface of the circuit board 210D can be reliably soldered by solder balls, for example, the material of the solder balls includes but is not limited to tin material.

The first connection terminal 1181B formed at the bottom end of the second metal pillar 118B of the integrated circuit 100B may be led out of a circuit through a conductor (not shown), for example, a hard disk power supply circuit, a bus power supply circuit, and the like. Exemplary conductors include, but are not limited to, copper wire, copper bar, or other material of wire and conductor.

In the first aspect, the second substrate can not only serve to reliably connect the integrated circuit and the circuit board; but also to derive the signal. Since the upper surface of the second substrate may be arranged with more second connection terminals, it may derive more multi-path signals.

In the second aspect, the integrated circuit can input/output current through the second connection terminal on the top surface and the first connection terminal on the bottom surface, so that the problem of excessive local current density of the circuit board caused by the application of the integrated circuit to the circuit board can be solved.

In addition, since the main board 200D of the embodiment of the present application includes the integrated circuit 100B shown in fig. 6, the main board 200D has the features and effects of the integrated circuit 100B shown in fig. 6.

In some variant embodiments of the sixth embodiment of the present application, the integrated circuit 100B shown in fig. 7 or fig. 8 and the circuit board constitute a motherboard, and specific structural features and effects may refer to the motherboard 200D shown in fig. 12, which is not described herein again.

Referring to fig. 13, an embodiment of the present application further provides an electronic device 300, which includes at least one circuit board and the integrated circuit described above; the top and bottom surface connection terminals of the integrated circuit are electrically connected to at least one circuit board. The electronic device 300 includes, but is not limited to, computing devices that are servers, switches, and computers.

The electronic device 300, such as a server, may include a housing 310 and at least one circuit board 320 installed in the housing 310, at least one integrated circuit 100 connected to the circuit board 320, a PCle card 330, a power supply 340, an input/output interface 350, and the like. For example, the integrated circuit 100 may be any one of the integrated circuit 100A and its modified embodiment, and the integrated circuit 100B and its modified embodiment described above according to actual needs. Circuit board 320 may be combined with integrated circuit 100 to form a motherboard, i.e., circuit board 320 is formed as a circuit board in a motherboard; alternatively, the circuit board 320 may be a different circuit board from the circuit board in the motherboard and may be connected to each other. It is to be understood that fig. 13 is only an illustration of the connection relationship between the devices and the circuit board in the electronic device, and is not a limitation on the internal structure of the electronic device.

Because the electronic device provided by the embodiment of the application is provided with the integrated circuit, the electronic device provided by the embodiment of the application also has the beneficial effects of the integrated circuit, and the description is omitted here.

It should be noted that the technical features in the embodiments of the present application can be used in common without conflict.

In the description of the present application, it is to be noted that terms describing orientations such as "top", "bottom", "upper", "lower", and the like are based on the orientation in the drawings of the specification. It is to be understood that the orientation of the figures in the description is for the purpose of illustration only and is not intended as a definition of the limits of the product in which the figures are drawn.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. Specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto. Although embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: it is also possible to modify the solutions described in the previous embodiments or to substitute some or all of them with equivalents. And the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (11)

1. An integrated circuit, comprising: a first circuit unit and a second circuit unit;

the second circuit unit is stacked over the first circuit unit;

the bottom surface of the first circuit unit is provided with a first connecting terminal;

the top surface of the second circuit unit is provided with a second connection terminal.

2. The integrated circuit of claim 1, wherein the first circuit unit comprises a first substrate, and a first electronic component, a first metal pillar and a first package body disposed on an upper surface of the first substrate, and the first electronic component and the first metal pillar are packaged in the first package body;

the first circuit unit further comprises a second electronic component, a second metal column and a second packaging body which are arranged on the lower surface of the first substrate, and the second electronic component and the second metal column are packaged in the second packaging body;

the top end of the first metal column is electrically connected with the bottom surface of the second circuit unit;

the bottom end of the second metal pillar extends to the bottom surface of the first circuit unit and forms the first connection terminal.

3. The integrated circuit of claim 2, wherein the first circuit unit further comprises a first thermally conductive member; the first package body includes a first opening on an upper surface thereof facing the second circuit unit; the first heat-conducting member is disposed between the first electronic component and the bottom surface of the second circuit unit through the first opening.

4. The integrated circuit of claim 2 or 3, wherein the first circuit unit further comprises a second heat conducting member; the second heat conducting piece is arranged on one surface, departing from the first substrate, of the second electronic component.

5. The integrated circuit of claim 4, wherein a side of the second package body facing away from the first substrate includes a second opening; the second heat conduction member is in contact with a circuit board to which the integrated circuit is electrically connected through the second opening.

6. The integrated circuit according to any one of claims 2-5, wherein the second circuit unit comprises a second substrate, and a third electronic component, a third metal pillar and a third package body disposed on an upper surface of the second substrate; the third electronic component and the third metal column are packaged in the third packaging body;

the top end of the third metal column forms the second connecting terminal;

the top end of the first metal column is electrically connected with the lower surface of the second substrate.

7. The integrated circuit of claim 6, wherein the second circuit unit further comprises a third thermal conductive member disposed on a side of the third electronic component facing away from the second substrate.

8. The integrated circuit according to claim 3, wherein the second circuit unit comprises a second substrate, and a fourth electronic component, a fourth metal pillar and a fourth package body which are arranged on a lower surface of the second substrate, and both the fourth electronic component and the fourth metal pillar are packaged in the fourth package body;

the top end of the first metal column is connected with the bottom end of the fourth metal column;

the upper surface of the second substrate is provided with the second connection terminal.

9. The integrated circuit of claim 8, wherein the second circuit unit further comprises a fourth thermal conductive member disposed on a side of the fourth electronic component facing away from the second substrate; the fourth packaging body is provided with a third opening; the fourth heat conduction member is connected with the first heat conduction member through the third opening.

10. The integrated circuit of any of claims 1-9, wherein the integrated circuit is a power soft start circuit.

11. An electronic device, characterized in that the electronic device comprises at least one circuit board and an integrated circuit according to any of claims 1-10; the top and bottom surface connection terminals of the integrated circuit are electrically connected to the at least one circuit board.

Images