CN115850664A - Preparation method and application of waterborne epoxy floor coating curing agent - Google Patents
Preparation method and application of waterborne epoxy floor coating curing agent Download PDFInfo
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- CN115850664A CN115850664A CN202211697801.9A CN202211697801A CN115850664A CN 115850664 A CN115850664 A CN 115850664A CN 202211697801 A CN202211697801 A CN 202211697801A CN 115850664 A CN115850664 A CN 115850664A
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- curing agent
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- epoxy resin
- floor coating
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 49
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 45
- 239000011248 coating agent Substances 0.000 title claims abstract description 45
- 238000000576 coating method Methods 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 29
- 229920000570 polyether Polymers 0.000 claims abstract description 29
- 239000003822 epoxy resin Substances 0.000 claims description 32
- 229920000647 polyepoxide Polymers 0.000 claims description 32
- 238000001816 cooling Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 19
- 238000007599 discharging Methods 0.000 claims description 16
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 13
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 13
- 150000004988 m-phenylenediamines Chemical class 0.000 claims description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000010 aprotic solvent Substances 0.000 claims description 11
- 239000003085 diluting agent Substances 0.000 claims description 11
- 229920005862 polyol Polymers 0.000 claims description 11
- 150000003077 polyols Chemical class 0.000 claims description 11
- 239000003054 catalyst Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 150000007524 organic acids Chemical class 0.000 claims description 9
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical group FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 238000010790 dilution Methods 0.000 claims description 5
- 239000012895 dilution Substances 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920005903 polyol mixture Polymers 0.000 claims description 4
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical group C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 claims description 3
- 238000006386 neutralization reaction Methods 0.000 claims description 3
- 238000007151 ring opening polymerisation reaction Methods 0.000 claims description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical group C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 claims description 2
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 230000018044 dehydration Effects 0.000 claims description 2
- 238000006297 dehydration reaction Methods 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 239000004310 lactic acid Substances 0.000 claims description 2
- 235000014655 lactic acid Nutrition 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 238000007865 diluting Methods 0.000 claims 1
- 239000002994 raw material Substances 0.000 abstract description 5
- 230000004048 modification Effects 0.000 abstract description 2
- 238000012986 modification Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000003973 paint Substances 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000002932 luster Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
The invention discloses a preparation method of a water-based epoxy floor coating curing agent, which greatly improves the performance of the curing agent by performing polyether or modification on main raw material components of the curing agent.
Description
Technical Field
The invention belongs to the technical field of water-based paint, and particularly relates to a preparation method of a water-based epoxy floor paint curing agent.
Background
Compared with the traditional solvent type epoxy floor coating, the water-based epoxy floor coating takes water as a main dispersion medium, has less environmental pollution and smaller fire hazard, can be constructed and cured in a humid environment, and has more reasonable curing time. In addition, the construction operation of the water-based paint is more convenient, and various tools can be directly cleaned by water after the construction is finished. Therefore, the water-based epoxy floor coating is a mainstream trend to replace the original oil solvent epoxy floor coating.
However, compared with solvent-based coating products, the waterborne epoxy floor coating still has more defects, wherein the defect that the luster and brightness are not high is a remarkable defect of the waterborne epoxy floor coating.
Disclosure of Invention
Aiming at the problems, the invention provides a preparation method of a curing agent for a water-based epoxy floor coating, wherein the curing agent is matched with an epoxy component to prepare the water-based epoxy floor, so that the problem of low brightness of the coating of the water-based epoxy floor coating can be effectively solved.
In order to achieve the technical effects, the invention adopts the following technical scheme:
a preparation method of a water-based epoxy floor coating curing agent comprises the following steps:
a) Mixing epoxy resin and polyether polyol, heating for dehydration, cooling, adding a catalyst, keeping the temperature, adding an aprotic solvent and pure water, stirring, cooling and discharging to obtain a polyether epoxy resin;
b) Heating m-phenylenediamine, dripping an epoxy diluent after the m-phenylenediamine is melted, heating, preserving heat, cooling and discharging to obtain modified m-phenylenediamine;
c) Dripping the polyether epoxy resin prepared in the step A) into the modified m-phenylenediamine prepared in the step B), heating and preserving heat after finishing dripping, adding organic acid for neutralization, adding deionized water for dilution while dispersing, and finally cooling and discharging to obtain the waterborne epoxy floor coating curing agent.
In some embodiments, the method of preparing the curing agent comprises the steps of:
a) Mixing epoxy resin and polyether polyol, heating to 140-145 ℃ under the stirring condition, preserving heat, dehydrating for 2 hours, cooling to 70-75 ℃, adding a catalyst, preserving heat for 5-7 hours, adding an aprotic solvent and pure water, stirring for 30 minutes, cooling, and discharging to obtain the polyether epoxy resin;
b) Heating m-phenylenediamine to 80-90 ℃, dripping a diluent with an equal molar weight after the m-phenylenediamine is melted, heating to 90-100 ℃ after dripping is finished, preserving heat for 2 hours, cooling to 60 ℃, and discharging to obtain modified m-phenylenediamine;
c) Preheating the polyether epoxy resin prepared in the step A) to 60 ℃, then dropwise adding the polyether epoxy resin into the modified m-phenylenediamine prepared in the step B), heating to 80-90 ℃ after dropwise adding, keeping the temperature for 2 hours, then adding small-molecular organic acid, adding deionized water for dilution while dispersing, finally cooling to 50 ℃ and discharging to obtain the waterborne epoxy floor coating curing agent.
In some embodiments, in step a), the epoxy resin is E51 having an epoxy equivalent weight of 180 to 190; the polyether polyol has a molecular weight of 400-8000 and is subjected to ring opening polymerization through a PO chain segment or a PO-EO mixed chain segment; the aprotic solvent is 1,4 dioxane, 2-methyltetrahydrofuran, ethyl acetate or butyl acetate; the catalyst is boron trifluoride diethyl etherate and is diluted by an aprotic solvent before being added.
In some embodiments, the epoxy resin and polyether polyol are used in amounts such that the molar ratio of epoxy groups to hydroxyl groups is (4-6): 1; the addition amount of the catalyst is 1-2 per mill of the total weight of the epoxy resin-polyether polyol mixture; the addition amount of the aprotic solvent is 1-4.2%; the adding amount of the pure water is 3-10 per mill of the total weight of the epoxy resin-polyether polyol mixture.
In some embodiments, in step B), the epoxy diluent is benzyl glycidyl ether.
In some embodiments, in step C), the organic acid is acetic acid or lactic acid.
In some embodiments, the amount of the polyetherated epoxy resin and the modified m-phenylenediamine is such that the molar ratio of epoxy groups to amine groups is 1: (5-10); the addition amount of the organic acid satisfies the condition that the molar ratio of carboxyl to amino is 1: (4-5).
In another aspect, the present invention provides a water-based epoxy floor coating, which comprises an epoxy resin and a curing agent prepared according to the preparation method.
In some embodiments, the aqueous epoxy floor coating comprises 3:1, a curing agent component and a resin component; wherein the resin component comprises an epoxy resin and a reactive diluent; the curing agent component comprises the curing agent prepared by the preparation method.
The invention has the beneficial effects that:
1. m-phenylenediamine is selected as a main body, so that rigidity and good corrosion resistance and chemical resistance are provided for a curing agent; the benzyl group is introduced to modify the m-phenylenediamine, so that the crystallinity of the m-phenylenediamine is damaged, the freezing point of the m-phenylenediamine is effectively reduced, the subsequent coating construction is facilitated, and the primary amine is used for sealing the end, so that the gel possibility of the subsequent modified amine is greatly reduced;
2. the polyether polyol subjected to ring-opening polymerization of the PO chain segment or the PO and EO mixed chain segment provides good wetting and flexibility for the curing agent, and can effectively wrap various pigments and fillers; in addition, along with the volatilization of the solvent system, the polyether polyol can also effectively improve the leveling effect of the micro surface and provide good luster for a coating film;
3. when the epoxy resin and the polyether polyol are mixed, the catalyst is efficiently quenched by adding pure water, so that the service life of the polyether epoxy resin can be prolonged;
4. the organic acid is added during the preparation of the curing agent, so that the curing agent is endowed with good water solubility, and an excellent emulsification effect is further brought.
Detailed Description
The present invention is described in detail below, and the examples are only for explaining the present invention and are not intended to limit the scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
EXAMPLE 1 preparation of a Polyetherified epoxy resin
Preparing materials according to the content in the table 1, adding E-51 epoxy resin (128 southern Asia) and PPG-1000 into a four-neck flask provided with a thermometer, a stirring paddle and a condensing tube, heating to 140-145 ℃, dehydrating for 2 hours, cooling to 70-75 ℃, adding a boron trifluoride diethyl etherate catalyst, preserving heat for 5.5 hours, adding an aprotic solvent ethyl acetate and pure water, cooling, discharging, and placing into a dry and sealed container for later use.
TABLE 1
| Raw materials | Dosage (g) |
| E-51 epoxy resin | 188.04 |
| PPG-1000 | 100.06 |
| Ethyl acetate | 8.21 |
| Boron trifluoride diethyl etherate | 0.41 |
| Pure water | 2.03 |
Example 2 preparation of modified m-phenylenediamine and epoxy curing agent for floor coating
Preparing materials according to the content in the table 2, adding m-phenylenediamine into a four-neck flask provided with a thermometer, a stirring paddle and a condensing tube, heating to 80-90 ℃, after complete melting, dropwise adding 692 epoxy diluent (benzyl glycidyl ether), heating to 90-100 ℃ after dropwise adding, preserving heat for 2 hours, and cooling to 60 ℃ to obtain modified m-phenylenediamine; the polyether epoxy resin prepared in the embodiment 1 is taken and preheated to 60 ℃, then is dripped into the modified m-phenylenediamine at the temperature of 60-65 ℃, the temperature is raised to 80-90 ℃ after the dripping is finished, the heat preservation is carried out for 2 hours, acetic acid is dripped for neutralization, deionized water is slowly added for dilution while high-speed dispersion is carried out, finally, the temperature is lowered to below 50 ℃, and the curing agent with the solid content of 50% is prepared.
TABLE 2
Example 3 preparation of two-component waterborne epoxy floor coating
Preparing materials according to the table 3.1, mixing all the raw materials, stirring at a high speed, discharging after the particle fineness is not higher than 50 mu m, and obtaining the curing agent component of the epoxy floor coating.
TABLE 3.1
Preparing materials according to the table 3.2, and uniformly mixing the epoxy resin and the reactive diluent to obtain the resin component of the epoxy floor coating.
TABLE 3.2
| Raw materials | Dosage (g) |
| E51 (nan ya 128) | 90.04 |
| AGE (Xinyuan Anhui) | 10.11 |
And (2) taking the curing agent component and the resin component according to the weight ratio of 3.
Comparative example 1 preparation of curing agent for conventional epoxy floor coating
Preparing materials according to the table 4, taking a commercially available water-based curing agent GCA01, slowly adding deionized water for dilution while dispersing at a high speed, and finally cooling to below 50 ℃ for discharging to prepare a diluted comparative curing agent component.
TABLE 4
Comparative example 2 preparation of comparative example of two-component aqueous epoxy floor coating
Preparing materials according to the table 5.1, mixing all the raw materials, stirring at a high speed, discharging after the particle fineness is not higher than 50 mu m, and obtaining the curing agent component of the epoxy floor coating comparative example.
TABLE 5.1
Preparing materials according to the table 3.2, and uniformly mixing the epoxy resin and the reactive diluent to obtain the resin component of the epoxy floor coating.
And (2) taking the curing agent component and the resin component according to the weight ratio of 3.
Performance testing
The paint samples prepared in example 3 and comparative example 2 were applied to a plurality of putty-containing test panels, and after the paint samples were dried by air for 48 hours to form films, the properties of the respective films were measured, and the results are shown in Table 6 below.
TABLE 6
| Test items | Examples coating films | Comparative example sample coating film | Detection standard |
| Hardness of | 2H | 2H | GB/T6739-1996 |
| Flexibility | ＜2mm | ＜2mm | GB/T 1731-1993 |
| Adhesion force | Level 1 | Level 1 | GB/T 1720-1989 |
| Impact resistance | ＞50kg/cm | ＞50kg/cm | GB/T 1732-1993 |
| Water resistance (25 ℃ C.) | No abnormal condition for 96h | No abnormal condition for 96h | GB/T 1733-1993 |
| Alkali resistance (10% NaOH) | No abnormal condition for 96h | No abnormal condition for 96h | GB/T 1763-1989 |
| Abrasion resistance (750g, 500r/m) | Loss on abrasion of 0.02g | Loss on abrasion of 0.03g | GB/T 1768-1989 |
| Salt fog resistance | ＞200h | ＞200h | GB/T 1771 |
| Glossiness (60 degree) | 104 | 92 | GB/T 1743-1989 |
As can be seen from the data in the table above, the coating film prepared by the curing agent provided by the invention has good basic performance which is basically equivalent to that of the commercially available mature curing agent, but the coating prepared by the curing agent provided by the invention has excellent gloss and brightness.
It will be apparent to those skilled in the art that various modifications may be made to the above embodiments without departing from the general spirit and concept of the invention. All falling within the scope of protection of the present invention. The protection scheme of the invention is subject to the appended claims.
Claims (9)
1. A preparation method of a water-based epoxy floor coating curing agent is characterized by comprising the following steps:
a) Mixing epoxy resin and polyether polyol, heating for dehydration, cooling, adding a catalyst, keeping the temperature, adding an aprotic solvent and pure water, stirring, cooling and discharging to obtain a polyether epoxy resin;
b) Heating the m-phenylenediamine, dripping an epoxy diluent after the m-phenylenediamine is melted, heating, preserving heat, cooling and discharging to obtain modified m-phenylenediamine;
c) Dripping the polyether epoxy resin prepared in the step A) into the modified m-phenylenediamine prepared in the step B), heating and preserving heat after finishing dripping, adding organic acid for neutralization, adding deionized water for dilution while dispersing, and finally cooling and discharging to obtain the waterborne epoxy floor coating curing agent.
2. The preparation method of the water-based epoxy floor coating curing agent according to claim 1, characterized by comprising the following steps:
a) Mixing epoxy resin and polyether polyol, heating to 140-145 ℃ under the stirring condition, preserving heat and dehydrating for 2 hours, cooling to 70-75 ℃, adding a catalyst, preserving heat for 5-7 hours, adding an aprotic solvent and pure water, stirring for 30 minutes, cooling and discharging to obtain the polyether epoxy resin;
b) Heating m-phenylenediamine to 80-90 ℃, dripping an equimolar amount of diluent after the m-phenylenediamine is melted, heating to 90-100 ℃ after dripping is finished, preserving heat for 2 hours, cooling to 60 ℃, and discharging to obtain modified m-phenylenediamine;
c) Preheating the polyether epoxy resin prepared in the step A) to 60 ℃, then dropwise adding the polyether epoxy resin into the modified m-phenylenediamine prepared in the step B), heating to 80-90 ℃ after dropwise adding, keeping the temperature for 2 hours, then adding small molecular organic acid, diluting with deionized water while dispersing, finally cooling to 50 ℃, and discharging to obtain the waterborne epoxy floor coating curing agent.
3. The preparation method of the water-based epoxy floor coating curing agent according to claim 1, wherein in the step a), the epoxy resin is E51 with an epoxy equivalent of 180-190; the polyether polyol has a molecular weight of 400-8000 and is subjected to ring opening polymerization through a PO chain segment or a PO-EO mixed chain segment; the aprotic solvent is 1,4 dioxane, 2-methyltetrahydrofuran, ethyl acetate or butyl acetate; the catalyst is boron trifluoride diethyl etherate and is diluted by an aprotic solvent before being added.
4. The preparation method of the water-based epoxy floor coating curing agent according to claim 3, wherein the epoxy resin and the polyether polyol are used in an amount such that the molar ratio of epoxy groups to hydroxyl groups is (4-6): 1; the addition amount of the catalyst is 1-2 per mill of the total weight of the epoxy resin-polyether polyol mixture; the addition amount of the aprotic solvent is 1-4%; the adding amount of the pure water is 3-10 per mill of the total weight of the epoxy resin-polyether polyol mixture.
5. The preparation method of the water-based epoxy floor coating curing agent according to claim 1, wherein in step B), the epoxy diluent is benzyl glycidyl ether.
6. The preparation method of the water-based epoxy floor coating curing agent according to claim 1, wherein in step C), the organic acid is acetic acid or lactic acid.
7. The preparation method of the waterborne epoxy floor coating curing agent of claim 6, wherein the use amounts of the polyether epoxy resin and the modified m-phenylenediamine satisfy the condition that the molar ratio of the epoxy group to the amino group is 1: (5-10); the addition amount of the organic acid satisfies the condition that the molar ratio of carboxyl to amino is 1: (4-5).
8. An aqueous epoxy floor coating, characterized in that the coating comprises an epoxy resin and a curing agent prepared according to the preparation method of any one of claims 1 to 7.
9. The waterborne epoxy floor coating of claim 8, wherein the coating comprises the following components in a weight ratio of 3:1, a curing agent component and a resin component; wherein the resin component comprises an epoxy resin and a reactive diluent; the curing agent component comprises the curing agent prepared by the preparation method of any one of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211697801.9A CN115850664A (en) | 2022-12-28 | 2022-12-28 | Preparation method and application of waterborne epoxy floor coating curing agent |
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| CN202211697801.9A CN115850664A (en) | 2022-12-28 | 2022-12-28 | Preparation method and application of waterborne epoxy floor coating curing agent |
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2022
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