CN115835527B - SMT (surface mounting technology) technology and equipment for circuit board - Google Patents
SMT (surface mounting technology) technology and equipment for circuit board Download PDFInfo
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- CN115835527B CN115835527B CN202211677837.0A CN202211677837A CN115835527B CN 115835527 B CN115835527 B CN 115835527B CN 202211677837 A CN202211677837 A CN 202211677837A CN 115835527 B CN115835527 B CN 115835527B
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- 238000005516 engineering process Methods 0.000 title abstract description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000003381 stabilizer Substances 0.000 claims abstract description 32
- 238000003466 welding Methods 0.000 claims abstract description 28
- 238000001816 cooling Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 10
- 230000000630 rising effect Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims description 2
- 238000004064 recycling Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 description 13
- 230000008859 change Effects 0.000 description 6
- 238000009835 boiling Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Tunnel Furnaces (AREA)
Abstract
The application relates to the technical field of reflow oven equipment, and discloses a circuit board SMT (surface mount technology) equipment, which comprises a furnace body, wherein a display is fixedly arranged on the furnace body, the circuit board SMT technology and the circuit board SMT equipment are characterized in that a stabilizer is arranged at the junction of a temperature rise region and a preheating region and the temperature rise region in a top cover, the stabilizer can be used for more accurately controlling temperature air flow in the region, a roller drives a limit structure to rotate, the limit head can rotate to the upper part of the circuit board, then nitrogen air flow which is heated and conveyed to a body in the inside is remembered to impact the limit head, the limit head extends out and is abutted to an electronic component on the circuit board, so that the pressure touch stability of the electronic component is realized, the limit head can synchronously move along with the movement of the circuit board, the tilting condition caused by different melting time of welding pins at two ends of the electronic component is not generated, and the stability of the circuit board production technology is ensured to the maximum.
Description
Technical Field
The application relates to the technical field of reflow oven equipment, in particular to a circuit board SMT technology and equipment thereof.
Background
Along with the development trend of miniaturization and light weight of electronic products, many circuit boards in electronic equipment use SMT manufacturing technology, namely surface mounting technology, meaning that each electronic element is welded on the surface of the circuit board, and then the electronic element is not required to be inserted into a through hole reserved on the circuit board as before, and then welded from the back, SMT technology can enable the processing process of the circuit board to be more automatic and rapid, reduce artificial interference, compared with the prior plug-in, a component using the technology has the advantages of small size, light weight and strong stability, the prior circuit board SMT manufacturing technology comprises a plurality of devices such as a printer, a chip mounter, a reflow oven, a cooling device and the like, wherein the reflow oven is called as a reflow oven, and is used for mechanically and electrically connecting a solder between a solder terminal or a pin of a surface-assembled component and a printed board pad by remelting paste solder material pre-distributed on the printed board pad, and the prior nitrogen reflow oven is used for welding the circuit board by spraying nitrogen into the heated furnace body, but the prior reflow oven has the following specific problems in the use process:
the most critical factor in the existing reflow oven is the control of temperature change, whether the temperature change reasonably determines whether the circuit board can be welded successfully or not, so the interior of the existing reflow oven is approximately divided into four temperature areas of a preheating area, a Wen Shengou area, a welding area and a cooling area, the circuit board which is pasted by a chip mounter in advance is placed on a conveying belt of the reflow oven, so that the circuit board is welded after moving through the four temperature areas in the reflow oven, but the electronic components can be welded on the bonding pads only by slowly heating and melting the soldering paste in the moving welding process of the existing circuit board through the preheating area and the temperature rise area of the reflow oven, but the heating of the two ends of the electronic components on the bonding pads is different in the moving process, especially at the junction between the preheating area and the temperature rise area, the electronic components are placed longer and transversely, the temperature difference between two ends of the reflow oven is increased when the reflow oven moves to the junction, and the temperature difference between two ends of the reflow oven is increased, and the problem that the temperature difference between two ends of the reflow oven is heated and melted is likely to occur at one end of the temperature rise area, but one end of the reflow oven is not melted, so that the stress existing in the solder paste in the non-melted one end is released when the other end of the reflow oven is melted, the melted one end is lifted, the tombstoning phenomenon occurs, the problem is solved by the existing reflow oven, the temperature change range is only adjusted as much as possible to alleviate the temperature change range, so that the probability of the phenomenon is reduced, the situation cannot be really avoided, and if the temperature curve in the reflow oven is poorly controlled, the water in the solder paste is heated too quickly to cause the boiling of the solder paste, the solder paste is splashed, the splashed soldering paste may drop onto the surface of the bonding pad or other electronic components, and if the soldering paste drops onto the soldering feet of other components, bridging may occur, so that the circuit board cannot be used normally after being soldered.
Disclosure of Invention
The application provides a circuit board SMT process and equipment thereof, which have the advantages of good welding effect and high reliability, and solve the problems in the prior art.
The application provides the following technical scheme: the SMT equipment for the circuit board comprises a furnace body, wherein a display is fixedly arranged on the furnace body, a driving roller is movably arranged in the furnace body, a conveyor belt is movably sleeved on the driving roller, a top cover is movably arranged at the top end of the furnace body, a stabilizer is fixedly arranged in the top cover, a driving motor is arranged on the stabilizer, and a limiting structure is movably sleeved on the stabilizer;
the stabilizer comprises a body, wherein an air inlet is formed in the body, rotating rollers are movably mounted at two ends in the body respectively, an air outlet grid is formed in the bottom end of the body, and wind shields are fixedly mounted at two sides of the bottom end of the body respectively;
the limiting structure comprises a rotating belt, and limiting heads are uniformly arranged on the rotating belt.
In a preferred embodiment, the top cover is divided into four parts of a preheating zone, a Wen Shengou zone, a welding zone and a cooling zone, and the stabilizer is fixedly arranged at the junction of the preheating zone and the temperature rise zone of the top cover and the whole temperature rise zone.
In a preferred embodiment, the interior of the body is hollow, the air inlet is formed through the interior of the body, the diameter of the roller is equal to the distance between the upper surface and the lower surface of the middle part of the body, and the air inlet is connected with the nitrogen supply structure in a penetrating way.
In a preferred embodiment, the distance between two ends of the air outlet grid is small, the distance between two ends of the air outlet grid is large, the wind shields are respectively arranged at the bottom ends of two sides of the air outlet grid, and the two wind shields are arranged in the inward shrinking direction.
In a preferred embodiment, the rotating belt is movably sleeved between the two rotating rollers, one end of the limiting head connected with the rotating belt is connected with the wall thickness of the rotating belt, and the limiting head is communicated with the inside of the body when rotating to the position of the air outlet grid.
In a preferred embodiment, the limit head comprises an outer shell, an air inlet channel is formed in the outer shell, a baffle ring is movably arranged in the air inlet channel, an inner air channel is fixedly arranged at one end of the baffle ring, a side exhaust channel and an end exhaust channel are uniformly formed in an annular shape at the end part of the inner air channel, and a spring is movably arranged in the outer shell.
In a preferred embodiment, the air inlet channel is provided with a horn-shaped structure at the lower end, and a round hole with a diameter smaller than the diameter of the inner cavity of the inner air channel is formed in the upper middle part of the baffle ring.
In a preferred embodiment, the side exhaust passage is formed by penetrating through the inner side and the outer side of the inner air passage and the inner side of the opening is lower than the outer side, the end exhaust passage is formed at uniform intervals at the bottom end of the inner air passage, and the spring is movably sleeved on the outer surface of the inner air passage.
The SMT process for circuit board includes four steps of debugging, heat treatment, welding and cooling recovery, including the following steps:
and (3) equipment debugging: before using the device, the device is opened and the temperature of each temperature zone is adjusted;
heat treatment of a circuit board: placing a circuit board on a conveyor belt, driving the conveyor belt to rotate along with the equipment, further conveying the circuit board to be welded into the equipment, driving a roller to rotate by a driving motor, driving a limiting structure to rotate at the same speed by the roller, and when the circuit board reaches the junction of a preheating area and a temperature rising area, namely reaching the lower part of one end of a stabilizer, after heated nitrogen is supplied into a body by a nitrogen supply device in the equipment, air flow is downwards sprayed out from an air outlet grid, the air flow enters an air inlet channel, the air flow pushes a baffle ring to downwards move, so that an inner air channel downwards extends, the air flow strength is bigger and bigger along with the movement of the position towards the middle part of the air outlet grid, the extending length of the inner air channel is longer and bigger until the bottom end of the inner air channel is abutted against the top end of an electronic component on the circuit board, after the circuit board is in contact with pressure, a limiting head and the electronic component synchronously move, the air flow flows into the side air outlet channel and the end of the air outlet channel, and simultaneously and the solder paste is effectively heated;
welding a circuit board: after passing through the temperature rising area, the soldering paste is melted and enters a welding area for welding;
and (3) cooling and recycling the circuit board: the circuit board welded by the welding area enters the cooling area for cooling, and is conveyed out from the other end of the device by the conveyor belt for collection after cooling.
The application has the following beneficial effects:
1. according to the SMT technology and equipment for the circuit board, the stabilizer is arranged at the junction of the temperature rising area, the preheating area and the temperature rising area in the top cover, the stabilizer is utilized to control the temperature airflow more accurately in the area, the rotating roller drives the limiting structure to rotate, the limiting head can rotate above the circuit board, then the nitrogen airflow which is heated and conveyed to the body in the inside is remembered to impact the limiting head, the limiting head stretches out and is abutted to the electronic component on the circuit board, the pressing contact stability of the electronic component is further realized, and meanwhile the limiting head can synchronously move along with the movement of the circuit board, so that the stability of the electronic component on the circuit board can be ensured, the warping condition caused by different melting time of welding pins at two ends of the electronic component is avoided, and the stability of the production technology of the circuit board is ensured to the greatest extent.
2. According to the SMT technology for the circuit board and the SMT equipment, through the cooperation setting of the stabilizer and the limiting structure, the situation that the electronic components on the circuit board cannot tilt due to temperature difference change in the moving process can be realized, meanwhile, the nitrogen gas flow can be gradually increased from two sides to the middle part in the range of the air outlet grid by utilizing the setting of the air outlet grid, so that the limiting head and the electronic components on the circuit board entering and exiting can be more gently and effectively contacted and separated, the position of the electronic components cannot be influenced by the limiting head, and meanwhile, the nitrogen gas flow can be ensured to accurately heat the welding legs of the electronic components through the air outlet grid, and the subsequent normal welding operation is ensured.
Drawings
FIG. 1 is a schematic perspective view of the present application;
FIG. 2 is a schematic perspective view of a stabilizer according to the present application;
FIG. 3 is a schematic cross-sectional view of a stabilizer of the present application;
FIG. 4 is a partial perspective view of a spacing structure of the present application;
FIG. 5 is a schematic cross-sectional view of a spacing structure of the present application;
FIG. 6 is a schematic perspective view of a spacing head according to the present application;
fig. 7 is a schematic cross-sectional view of a spacing head according to the present application.
In the figure: 1. a furnace body; 2. a display; 3. a conveyor belt; 4. a top cover; 5. a stabilizer; 51. a body; 52. an air inlet; 53. a rotating roller; 54. an air outlet grid; 55. a wind deflector; 6. a limit structure; 61. rotating the belt; 62. a positioning head; 621. an outer housing; 622. an air inlet channel; 623. a baffle ring; 624. an inner airway; 625. a side exhaust passage; 626. an end exhaust passage; 627. and (3) a spring.
Detailed Description
The embodiments of the present application will be clearly and completely described below with reference to the drawings, and the configurations of the structures described in the following embodiments are merely examples, and the SMT process and the apparatus for the circuit board according to the present application are not limited to the structures described in the following embodiments, and all other embodiments obtained by a person skilled in the art without making any creative effort are within the scope of the present application.
Referring to fig. 1, 2 and 4, the SMT device for circuit board includes a furnace body 1, a display 2 is fixedly installed on the furnace body 1, a driving roller is movably installed inside the furnace body 1, a conveyor belt 3 is movably sleeved on the driving roller, a top cover 4 is movably installed at the top end of the furnace body 1, a stabilizer 5 is fixedly installed in the top cover 4, a driving motor is installed on the stabilizer 5, and a limit structure 6 is movably sleeved on the stabilizer 5;
compared with the prior art, the application has the advantages that the stabilizer 5 is arranged at the junction of the temperature rising area and the preheating area and the temperature rising area in the top cover 4, the stabilizer 5 can be used for more accurate temperature air flow control on the area, the rotating roller 53 drives the limiting structure 6 to rotate to the upper part of the circuit board, then the limiting head 62 is impacted by the nitrogen air flow which is heated and conveyed to the body 51 in the inside is remembered, the limiting head 62 extends out and is abutted against the electronic components on the circuit board, the pressure contact stability of the electronic components is realized, the limiting head 62 can synchronously move along with the movement of the circuit board, the stability of the electronic components on the electronic components can be ensured, the tilting condition caused by different melting time of welding pins at two ends of the electronic components can not occur, the stability of circuit board production technology has been guaranteed to the maximize, cooperation setting through stabilizer 5 and limit structure 6 simultaneously, not only can realize guaranteeing that the circuit board can not take place the perk because of the difference of temperature change on its electronic components in the removal in-process, also can utilize the setting of grid 54 of giving vent to anger simultaneously makes nitrogen gas flow increase gradually from both sides to the middle part in the scope that grid 54 is located of giving vent to anger, can guarantee like this that limit head 62 and the electronic components on the circuit board that gets into and go out are more mild and effectual contact and separation, can guarantee that limit head 62 can not exert an influence to the position of electronic components, can also guarantee simultaneously that nitrogen gas flow can heat the welding leg of electronic components through grid 54 accurately, guarantee follow-up normal welding operation.
Referring to fig. 1 and 2, a circuit board SMT device includes a top cover 4 and a stabilizer 5, wherein the top cover 4 is divided into four parts of a preheating zone, a Wen Shengou zone, a welding zone and a cooling zone, and the stabilizer 5 is fixedly installed at the junction of the preheating zone and the temperature rise zone of the top cover 4 and the whole temperature rise zone;
in this embodiment, it should be noted that, because there is a certain temperature difference at the junction of the preheating area and the temperature rising area, the influence of the temperature difference at the junction on the electronic component on the circuit board can be reduced by using the setting of the stabilizer 5, so that the electronic component can be more stable when entering the temperature rising area, the situation that one end of the electronic component is tilted due to uneven heating at two ends of the electronic component due to overlong electronic component is avoided, and the welding effect of the circuit board is further ensured.
Referring to fig. 2 and 3, an SMT apparatus for a circuit board includes a stabilizer 5, where the stabilizer 5 includes a body 51, an air inlet 52 is formed on the body 51, two ends in the body 51 are respectively movably provided with a rotating roller 53, an air outlet grid 54 is formed at the bottom end in the body 51, and two sides of the bottom end of the body 51 are respectively fixedly provided with a wind shield 55;
in this embodiment, it should be noted that, the inside of the body 51 is hollow, the air inlet 52 is formed by penetrating through the inside of the body 51, the diameter of the roller 53 is equal to the distance between the upper surface and the lower surface of the middle of the body 51, the air inlet 52 is connected with the nitrogen supply structure in a penetrating manner, the interval of the air outlet grid 54 is small at the two side end portions and large at the middle portion, the air baffles 55 are respectively installed at the bottom ends of the two sides of the air outlet grid 54, and the two air baffles 55 are arranged in the inward shrinking direction, so that when the circuit board moves to the position on the conveyor belt 3, the temperature of the nitrogen in the area is closer to the temperature of the preheating area after being mixed by the arrangement of the body 51, and meanwhile, the limit structure 6 is driven to rotate, so that the deviation of electronic components of the circuit board in the preheating process can be avoided, and the welding quality of the equipment is ensured.
Referring to fig. 4 and 5, a circuit board SMT apparatus includes a limit structure 6, wherein the limit structure 6 includes a rotating belt 61, and limit heads 62 are uniformly arranged on the rotating belt 61;
in this embodiment, it should be noted that, the rotating belt 61 is movably sleeved between the two rotating rollers 53, one end, connected to the rotating belt 61, of the limiting head 62 is connected to the wall thickness of the rotating belt 61, and the limiting head 62 is connected to the inside of the body 51 when rotating to the position of the air outlet grid 54, so that the limiting head 62 can supply nitrogen into the body 51 by using a nitrogen supply structure when rotating to the position of the air outlet grid 54 and when rotating to the position of the end downwards, and then is conveyed to the inner side surface of the rotating belt 61 through the stabilizer 5, and then the nitrogen is injected into the limiting head 62 to be sprayed out, so that the stable pressing of the electronic components by the limiting head 62 is ensured, and meanwhile, the melting effect of the nitrogen on the solder paste is ensured, and further, the welding effect is ensured.
Referring to fig. 5, 6 and 7, a circuit board SMT device includes a limit head 62, where the limit head 62 includes an outer shell 621, an air inlet 622 is provided in the outer shell 621, a baffle ring 623 is movably provided in the air inlet 622, an inner air channel 624 is fixedly installed at one end of the baffle ring 623, side air channels 625 and end air channels 626 are uniformly provided at the end of the inner air channel 624 in a ring shape, and a spring 627 is movably installed in the outer shell 621;
in this embodiment, it should be noted that, the air inlet 622 is provided with a trumpet-shaped structure at the lower end, a round hole with a diameter smaller than the diameter of the inner cavity of the inner air passage 624 is provided at the upper middle part of the baffle ring 623, the side air outlet 625 is provided through the inner side and the outer side of the inner air passage 624, the end air outlet 626 is provided at the bottom end of the inner air passage 624 at a uniform interval, the spring 627 is movably sleeved on the outer surface of the inner air passage 624, thus when the positioning head 62 rotates below the air outlet grid 54, the air flow entering the air inlet 622 can be directly regulated according to the interval between the air outlet grids 54, the impact force of the air flow on the baffle ring 623 is relatively smaller, the extending distance of the inner air passage 624 is relatively smaller, the trumpet-shaped arrangement of the air inlet 622 can better increase the stress area of the baffle ring 623, the effect of the air flow on the impact is improved, after the air flow reaches the maximum after the moving position is gradually close to the middle, the baffle ring 623 moves downwards to the maximum, the bottom end of the inner air passage 624 is abutted to the upper part of the electronic component on the circuit board, the rotary roller 53 rotates along with the rotation of the driving motor, and the limit structure 6 and the conveyor belt 3 at the bottom end are driven to move at the same speed, so that each limit structure 6 can be prevented from relative displacement after abutting against the top end of the electronic component, the electronic component is prevented from shaking, namely, the displacement driving force generated by stress released when the solder paste in the temperature rising area is ensured to be prevented from moving, and bridging caused by splashing caused by boiling of the solder paste due to unreasonable heating unevenness or temperature curve setting is avoided, the air flow at the end exhaust passage 626 can be ejected out of the air passage to effectively melt and heat the solder pins, and the redundant air flow can be discharged from the side exhaust passage 625 on the side surface, so that a downward reaction force is formed by the flow direction of the air flow, the stability of the position of the limiting head 62 when the solder paste of the electronic component in the temperature rise region is melted is further ensured, and the subsequent welding effect is further improved.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The SMT equipment for the circuit board comprises a furnace body (1), and is characterized in that: the device comprises a furnace body (1), a display (2) is fixedly arranged on the furnace body (1), a driving roller is movably arranged in the furnace body (1), a conveyor belt (3) is movably sleeved on the driving roller, a top cover (4) is movably arranged at the top end of the furnace body (1), a stabilizer (5) is fixedly arranged in the top cover (4), the top cover (4) is divided into a preheating zone, a Wen Shengou, a welding zone and a cooling zone, the stabilizer (5) is fixedly arranged at the junction of the preheating zone and the temperature rise zone of the top cover (4) and the whole temperature rise zone, a driving motor is arranged on the stabilizer (5), and a limiting structure (6) is movably sleeved on the stabilizer (5);
the stabilizer (5) comprises a body (51), an air inlet (52) is formed in the body (51), rotating rollers (53) are movably mounted at two ends in the body (51), an air outlet grid (54) is formed in the bottom end of the body (51), and wind shields (55) are fixedly mounted at two sides of the bottom end of the body (51);
the limiting structure (6) comprises a rotating belt (61), and limiting heads (62) are uniformly arranged on the rotating belt (61);
the rotating belt (61) is movably sleeved between the two rotating rollers (53), one end, connected with the rotating belt (61), of the limiting head (62) is connected with the wall thickness of the rotating belt (61) in a connecting mode, and the limiting head (62) is communicated with the inside of the body (51) when rotating to the position of the air outlet grid (54).
2. A circuit board SMT device as claimed in claim 1, wherein: the inside of body (51) is hollow, air inlet (52) link up the inside of body (51) and offer, the diameter of commentaries on classics roller (53) equals the distance between the upper and lower surface in the middle part of body (51), air inlet (52) link up with nitrogen gas supply structure and be connected.
3. A circuit board SMT device as claimed in claim 1, wherein: the interval of the air outlet grids (54) is small in interval of the end parts of the two sides and large in interval of the middle, the wind shields (55) are arranged at the bottom ends of the two sides of the air outlet grids (54) respectively, and the two wind shields (55) are arranged in the inward shrinking direction.
4. A circuit board SMT device as claimed in claim 1, wherein: spacing head (62) contain shell body (621), intake duct (622) have been seted up to the inside of shell body (621), intake duct (622) internal activity is provided with baffle ring (623), the one end of baffle ring (623) has interior air flue (624), side exhaust duct (625) and tip exhaust duct (626) have evenly been seted up to the tip annular of interior air flue (624), shell body (621) internally movable installs spring (627).
5. A circuit board SMT device as claimed in claim 4, wherein: the air inlet channel (622) is arranged at the lower end and is provided with a horn-shaped structure, and a round hole with the diameter smaller than the diameter of the inner cavity of the inner air channel (624) is formed in the upper middle part of the baffle ring (623).
6. A circuit board SMT device according to claim 5, wherein: the side exhaust passage (625) is formed by penetrating through the inner side and the outer side of the inner air passage (624) and the inner side of the opening is lower than the outer side, the end exhaust passage (626) is formed at uniform intervals at the bottom end of the inner air passage (624), and the springs (627) are movably sleeved on the outer surface of the inner air passage (624).
7. A circuit board SMT device according to any one of claims 1-6, performing a circuit board SMT process, characterized by: the method comprises four steps of equipment debugging, circuit board heat treatment, circuit board welding and circuit board cooling recovery, and specifically comprises the following steps:
and (3) equipment debugging: before using the circuit board SMT equipment, opening the equipment and adjusting the proper temperature of each temperature zone;
heat treatment of a circuit board: placing the circuit board on the conveyor belt (3), driving the conveyor belt (3) to rotate along with the SMT equipment of the circuit board, and then conveying the circuit board to be welded into the equipment, meanwhile, driving a roller (53) to rotate by a driving motor, driving a limit structure (6) to rotate integrally with the conveyor belt (3) by the roller (53), when the circuit board reaches the junction of a preheating area and a temperature rise area, namely, reaching the lower part of one end of a stabilizer (5), after the nitrogen gas supply device in the equipment supplies heated nitrogen gas into a body (51), air flow is downwards sprayed out from an air outlet grid (54), the air flow enters an air inlet channel (622), the air flow pushes a baffle ring (623) to downwards move, so that an inner air channel (624) downwards extends out, and the air flow strength is large, the extending length of the inner air channel (624) is longer and longer until the bottom end of the inner channel (624) is abutted against the top end of an electronic component on the circuit board, and after the electronic component is abutted against the top end of the electronic component (62) and the electronic component (624) is synchronously pressed, and the electronic component is synchronously sprayed out from the air channel (625) to finish the movement of the electronic component and the electronic component (626;
welding a circuit board: after passing through the temperature rising area, the soldering paste is melted and enters a welding area for welding;
and (3) cooling and recycling the circuit board: the circuit board welded by the welding area enters a cooling area for cooling, and after cooling, the circuit board is conveyed out from the other end of the equipment by a conveyor belt (3) for collection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211677837.0A CN115835527B (en) | 2022-12-26 | 2022-12-26 | SMT (surface mounting technology) technology and equipment for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211677837.0A CN115835527B (en) | 2022-12-26 | 2022-12-26 | SMT (surface mounting technology) technology and equipment for circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN115835527A CN115835527A (en) | 2023-03-21 |
| CN115835527B true CN115835527B (en) | 2023-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211677837.0A Active CN115835527B (en) | 2022-12-26 | 2022-12-26 | SMT (surface mounting technology) technology and equipment for circuit board |
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| CN115835527A (en) | 2023-03-21 |
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