CN115835482A - Display module and display device - Google Patents

Abstract

The application provides a display module assembly and a display device, and relates to the technical field of display. This display module assembly includes: the display panel comprises a display area and a binding area connected with one side of the display area; a panel support layer positioned on the back surface of the display area; the circuit board is electrically connected with the binding area of the display panel and is positioned on one side, far away from the display area, of the panel supporting layer, and the circuit board comprises a bottom plate and components; and the reinforcing supporting layer is positioned between the bottom plate and the panel supporting layer, and the orthographic projection of the reinforcing supporting layer on the panel supporting layer covers the orthographic projection of the component on the panel supporting layer. The application provides a display module assembly, binding the technology in, the pressure that display panel bore is less and even, improves the display panel and binds the impression problem that the local deformation that the technology produced caused to improve display effect.

Description

Display module and display device

Technical Field

The application relates to the technical field of display, in particular to a display module and a display device.

Background

With the rapid development of flexible Organic Light Emitting Diode (OLED) display technology, flexible electronic devices are receiving more and more attention, such as folding mobile phones, sliding mobile phones, and the like.

Among the correlation technique, to flexible display module assembly, display panel and circuit board among the display module assembly can use the material that the flexibility can be buckled, but like this, bind the technology at flexible circuit board, display panel produces the die print problem easily, influences display module assembly's display effect.

Disclosure of Invention

The embodiment of the application provides a display module assembly and display device, and the display module assembly can improve the impression problem that the local deformation that display panel produced in binding technology caused to improve display effect.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, a display module is provided, including:

the display panel comprises a display area and a binding area connected with one side of the display area; the display area comprises a display surface and a back surface arranged opposite to the display surface, and the binding area is positioned on the back surface of the display area;

the panel supporting layer is positioned on the back surface of the display area, and a partial area of the panel supporting layer is positioned between the display area and the binding area;

the circuit board is electrically connected with the binding region of the display panel and is positioned on one side, far away from the display region, of the panel supporting layer, and the circuit board comprises a bottom plate and an element, wherein the element is positioned on one side, far away from the panel supporting layer, of the bottom plate;

and the reinforcing supporting layer is positioned between the bottom plate and the panel supporting layer, and the orthographic projection of the reinforcing supporting layer on the panel supporting layer covers the orthographic projection of the component on the panel supporting layer.

Optionally, the display module further includes a first supporting layer, and the first supporting layer is located between the panel supporting layer and the binding region;

the orthographic projection of the reinforcing support layer on the panel support layer and the orthographic projection of the first support layer on the panel support layer are not overlapped.

Optionally, the reinforcing support layer extends between the bonding region and the panel support layer;

the orthographic projection of the reinforcing support layer on the panel support layer covers the orthographic projection of the binding area on the panel support layer.

Optionally, the display module further includes a second supporting layer, where the second supporting layer is located between the bonding region and the reinforcing supporting layer;

the orthographic projection of the reinforcing support layer on the panel support layer covers the orthographic projection of the second support layer on the panel support layer.

Optionally, one surface of the portion of the display panel located in the bonding region, which is close to the panel support layer, and one surface of the bottom plate, which is close to the panel support layer, are located on the same plane.

Optionally, the circuit board further includes an electromagnetic shielding layer, and the electromagnetic shielding layer is located between the bottom plate and the reinforcing support layer.

Optionally, the material of the reinforcing support layer comprises a metal material;

the bottom plate further comprises a grounding terminal, and one surface of the bottom plate close to the panel supporting layer comprises an opening;

the area encircled by the orthographic projection of the outline of the opening on the reinforcing support layer is at least partially overlapped with the orthographic projection of the grounding terminal on the reinforcing support layer;

the ground terminal is electrically connected to the reinforcing support layer through the conductive material in the opening.

Optionally, the reinforcing support layer and the electromagnetic shielding layer are of an integrated structure.

Optionally, the bottom plate includes a bottom plate main body and a binding terminal connected to one side of the bottom plate main body;

the binding terminal is electrically connected with the binding region.

In a second aspect, the present application provides a display device, which includes the display module set according to any one of the first aspect.

The display module assembly that this application embodiment provided includes: the display panel comprises a display area and a binding area connected with one side of the display area; the display area comprises a display surface and a back surface arranged opposite to the display surface, and the binding area is positioned on the back surface of the display area; the panel supporting layer is positioned on the back surface of the display area, and a partial area of the panel supporting layer is positioned between the display area and the binding area; the circuit board is electrically connected with the binding region of the display panel and is positioned on one side, far away from the display region, of the panel supporting layer, and the circuit board comprises a bottom plate and a component, wherein the component is positioned on one side, far away from the panel supporting layer, of the bottom plate; and the reinforcing supporting layer is positioned between the bottom plate and the panel supporting layer, and the orthographic projection of the reinforcing supporting layer on the panel supporting layer covers the orthographic projection of the component on the panel supporting layer.

The embodiment of this application is through setting up the reinforcement supporting layer between circuit board and panel supporting layer, the orthographic projection of reinforcement supporting layer on the panel supporting layer covers the orthographic projection of components and parts on the panel supporting layer, thus, bind the in-process, when the circuit board receives great pressure, the reinforcement supporting layer can share the pressure that the circuit board received, because the reinforcement supporting layer self can bear great pressure, so the deformation that the reinforcement supporting layer produced is less, and transmit the pressure on display panel less from the reinforcement supporting layer, the less and pressure distribution of pressure that display panel bore is even, thereby improve the great problem that the die mark appears of display panel local pressure, and then display effect has been improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a display module in the related art according to an embodiment of the present application;

fig. 2 is a light reflection diagram of a display module according to the related art provided in the embodiment of the present application;

fig. 3 is a schematic structural diagram of a display module according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of another display module provided in the embodiment of the present application;

fig. 5 is a schematic structural diagram of another display module provided in the embodiment of the present application;

fig. 6 is a schematic structural diagram of a supporting layer according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of another supporting layer provided in an embodiment of the present application;

fig. 8 is a schematic structural diagram of a circuit board and a reinforcing supporting layer according to an embodiment of the present disclosure;

fig. 9 is a top view of a circuit board and a reinforcing support layer according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of another circuit board and a reinforcing supporting layer according to an embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Throughout the specification and claims, the term "comprising" is to be interpreted in an open, inclusive sense, i.e., as "including, but not limited to," unless the context requires otherwise. In the description herein, the terms "one embodiment," "some embodiments," "example," "certain examples," or "some examples" or the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In addition, it should be further noted that when introducing elements of the present application and the embodiments thereof, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements; "plurality" means two or more unless otherwise specified; the terms "comprising," "including," "containing," and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements; the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or order of formation.

In this specification, "electrically connected" includes a case where constituent elements are connected together by an element having some kind of electrical action. The "element having a certain electric function" is not particularly limited as long as it can transmit and receive an electric signal between connected components. Examples of the "element having some kind of electric function" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.

Fig. 1 shows a schematic structural diagram of a display module in the related art, where the display module includes a display panel 1, a panel supporting layer 2, a circuit board 3, a glue layer S1, a first supporting layer 5, and a cover glass 6. For the flexible display module, the bottom plate 31 of the circuit board 3, the display panel 1 and the cover glass 6 have certain flexibility or bendability.

The circuit board 3 includes a bottom plate 31 and a component 32, and a height difference exists between the component 32 and the bottom plate 31. The circuit board 3 is assembled into the display module through a bonding process in which a large pressure needs to be applied to the circuit board 3.

Because there is the height offset between components and parts 32 and bottom plate 31, consequently, bind the in-process or circuit board 3 and receive the condition of pressure, the pressure that components and parts 32 received can be greater than the regional pressure that receives that bottom plate 31 does not have components and parts 32, bottom plate 31 can transmit local great pressure to glue film S1, glue film S1 has certain mobility, the support capacity is relatively poor, can further transmit local great pressure to display panel 1 and cover plate glass 6, cause display panel 1 and cover plate glass 6 to produce more obvious deformation and stamp, reduce display effect. The local deformation of the display module caused by the height difference of the circuit board 3 can cause the stamping problem.

The stamping problem is obvious, and the display effect of the display module is seriously reduced due to the stamping problem. For example, fig. 2 shows a reflection diagram of a cover glass 6 with a mold in the related art, and a white area is a reflection area, and particularly, a distinct unevenness occurs in the area a, which indicates that the cover glass 6 in the area a has a mold problem caused by a large deformation, and the display effect is seriously reduced. Based on this, an embodiment of the present application provides a display module, referring to fig. 3, including a display panel 1, where the display panel 1 includes a display area 11 and a binding area 12 connected to one side of the display area 11; the display area 11 comprises a display surface B1 and a back surface B2 arranged opposite to the display surface B1, and the binding area 12 is positioned on the back surface B2 of the display area 11; a panel support layer 2 located on the back side B2 of the display area 11, and a partial area of the panel support layer 2 is located between the display area 11 and the bonding area 12; the circuit board 3 is electrically connected with the binding area 12 of the display panel 1 and is positioned on one side of the panel supporting layer 2, which is far away from the display area 11, the circuit board 3 comprises a bottom plate 31 and a component 32, and the component 32 is positioned on one side of the bottom plate 31, which is far away from the panel supporting layer 2; and the reinforcing support layer 4 is positioned between the bottom plate 31 and the panel support layer 2, and the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 covers the orthographic projection of the component 32 on the panel support layer 2.

In the embodiment of the application, the display module assembly includes flexible display module assembly, and display panel 1 includes flexible display panel, and is specific, and flexible display panel includes flexible OLED display panel.

Referring to fig. 3, the display panel 1 includes a display area 11, a binding area 12, and a bending area 13, and the display area 11 and the binding area 12 are connected by the bending area 13. It should be noted that the display panel 1 is a single body, and the display panel 1 is divided into the display area 11, the binding area 12 and the bending area 13 for convenience of description.

The structure in the display panel 1 is not limited in the embodiment of the present application, and for example, the display area 11 of the display panel 1 may include structures such as a substrate, a light emitting layer, a thin film transistor, a gate line, and a data line; the bonding region 12 of the display panel 1 may include a plurality of connection traces electrically connected to the gate lines and the data lines of the display region 11; the bending region 13 of the display panel 1 may also include a plurality of leads for electrically connecting the display region 11 and the bonding region 12 together.

The display area 11 includes a display surface B1 and a back surface B2 opposite to the display surface B1, where the display surface B1 is a light emitting surface B1 of the display area 11, and the back surface B2 is a surface of the display area 11 away from the light emitting surface. The binding region 12 is located on the back side B2 of the display region 11, and specifically, the binding region 12 is spaced from the display region 11 by a certain distance in a direction perpendicular to the display region 11.

The bonding region 12 and the Bending region 13 are formed by a terminal Bending (Pad Bending) technique, and the bonding region 12 and the Bending region 13 may also be referred to as a Pad region, where the terminal Bending technique is a technique of Bending the bonding region 12 to the back side B2 of the display region 11 to reduce the width of the bezel.

The panel supporting layer 2 is configured to support the display area 11 of the display panel 1, and is located at the back B2 of the display area 11, a partial area of the panel supporting layer 2 is located between the display area 11 and the bonding area 12, the panel supporting layer 2 and the bonding area 12 are generally not in direct contact, and in some embodiments, as shown in fig. 3, a first supporting layer 4 is included between the panel supporting layer 2 and the bonding area 12; in some embodiments, as shown in fig. 4, a second support layer 7 and a reinforcing support layer 4 are included between the panel support layer 2 and the bonding region 12; in some embodiments, as shown in fig. 5, a reinforcing support layer 4 is included between the panel support layer 2 and the bonded region 12.

The material of the panel support layer 2 includes a metal material, and the metal material of the panel support layer 2 includes, for example, titanium alloy, stainless steel, and copper.

The Circuit board 3 includes a Flexible Printed Circuit (FPC); the circuit board 3 comprises a base plate 31 and a component 32, the base plate 31 of the circuit board 3 comprising a flexible base plate.

The bottom plate 31 includes a bottom plate body 311 and a binding terminal 312, and one side of the bottom plate body 311 is connected to the binding terminal 312. The circuit board 3 is electrically connected to the bonding region 12 of the display panel 1, and specifically, the bonding terminal 312 of the bottom plate 31 is electrically connected to the bonding region 12 of the display panel 1, so that the electrical signal transmission between the circuit board 3 and the bonding region 12 can be realized.

The component 32 is located on a side of the bottom plate 31 away from the panel support layer 2, the component 32 is electrically connected to the bottom plate 31, the component 32 protrudes from the bottom plate 31 in a direction along the bottom plate 31 toward the component 32, and a height difference exists between the component 32 and the bottom plate 31. It should be noted that the circuit board 3 may include a plurality of components 32 according to actual requirements. The specific structure of the circuit board 3 can refer to the description in the related art, and is not described herein.

The circuit board 3 is located on a side of the panel supporting layer 2 away from the display area 11, specifically, the bottom plate 31 of the circuit board 3 is located on a side of the panel supporting layer 2 away from the display area 11, and the circuit board 3

The bottom plate 31 is not in direct contact with the panel support layer 2, and referring to fig. 3, a reinforcing support layer 4 is further provided between the circuit board 3 and the panel support layer 2.

When the circuit board 3 is subjected to a pressure directed along the component 32 towards the bottom plate 31, e.g. during a bonding process or by an external pressure, the component 32 is subjected to a greater pressure than the bottom plate 31 without the component 32, i.e. the bottom plate 31 is locally subjected to a greater pressure, and the bottom plate 31 is typically a flexible bottom plate, which transmits an uneven pressure to the reinforcing support layer 4.

And a reinforcing support layer 4 located between the bottom plate 31 and the panel support layer 2. The orthographic projection of the reinforcing support layer 4 on the panel support layer 2 covers the orthographic projection of the component 32 on the panel support layer 2, specifically, the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 can be within the orthographic projection of the bottom plate 31 on the panel support layer 2, so that the material consumption of the panel support layer 2 is less, and the cost is lower; alternatively, the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 may exceed the orthographic projection of the bottom plate 31 on the panel support layer 2, so that the area of the reinforcing support layer 4 is larger, the pressure transmitted to the panel support layer 2 is smaller, and the support performance is better.

The reinforcing support layer 4 may also extend between the bonded area 12 and the panel support layer 2, such that the area of the reinforcing support layer 4 may be further increased to further improve the support performance.

For the circuit board 3 with a plurality of components 32, the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 covers the orthographic projection of all the components 32 on the panel support layer 2, and the reinforcing support layer 4 is of an integrated structure, so that the strength is high.

The material of the reinforcing support layer 4 includes a metal material, which has a high strength and a small deformation under pressure, and specifically, the metal material of the reinforcing support layer 4 includes a stainless Steel material (SUS).

In addition, in the related art, when the adhesive layer S1 is a conductive adhesive layer, the conductive adhesive layer may flow due to uneven pressure, so that the conductive adhesive in a partial region may be gathered or lost, thereby reducing the conductivity. In the embodiment of the present application, the conductive performance of the reinforcing support layer 4 made of a metal material is not substantially affected by pressure, the reinforcing support layer 4 can be electrically connected to the ground terminal 313 of the circuit board 3, and the ground resistance of the circuit board 3 is not increased by pressure.

The display module further includes a Cover Glass 6 (CG), the Cover Glass 6 is located on the display surface B1 side of the display area 11, and the Cover Glass 6 generally covers the display area 11. For flexible display modules, the material of the cover glass 6 comprises flexible glass, for example thinned glass.

According to the display module provided by the embodiment of the application, the reinforcing support layer 4 is arranged between the circuit board 3 and the panel support layer 2, and the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 covers the orthographic projection of the component 32 on the panel support layer 2; like this, in the course of the binding process, when circuit board 3 received great pressure, because reinforcement supporting layer 4 covers the orthographic projection of components and parts 32 on panel supporting layer 2 in the orthographic projection of panel supporting layer 2, so can all transmit reinforcement supporting layer 4 because of the great pressure in part of bottom plate 31 that components and parts 32 generated, reinforcement supporting layer 4 can share the great pressure in part of bottom plate 31, because reinforcement supporting layer 4 self can bear great pressure, so the deformation that reinforcement supporting layer 4 produced is less, it is comparatively even to transmit the pressure to display panel 1 from reinforcement supporting layer 4, improve the impression problem that display panel 1 produced in the process of binding the local deformation of production and cause, thereby display effect has been improved.

Optionally, referring to fig. 3, the display module further includes a first supporting layer 5, where the first supporting layer 5 is located between the panel supporting layer 2 and the binding region 12; the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 and the orthographic projection of the first support layer 5 on the panel support layer 2 do not overlap.

The orthographic projection of the first support layer 5 on the panel support layer 2 can be positioned in the orthographic projection of the binding region 12 on the panel support layer 2, so that the first support layer 5 occupies a smaller volume; alternatively, the orthographic projection of the first support layer 5 on the panel support layer 2 may be beyond the orthographic projection of the bonding zone 12 on the panel support layer 2.

The material of the first supporting layer 5 comprises a metal material and a wave-absorbing material, wherein the metal material has better supporting performance; the wave-absorbing material is a material capable of absorbing or greatly reducing the electromagnetic wave energy received by the surface of the wave-absorbing material and reducing the interference of the electromagnetic wave, and can realize electromagnetic shielding.

Generally, the orthographic projection of the main body 311 of the bottom plate 31 on the panel supporting layer 2 and the orthographic projection of the binding region 12 on the panel supporting layer 2 do not overlap with each other, the reinforcing supporting layer 4 is located between the bottom plate 31 and the panel supporting layer 2, and the first supporting layer 5 is located between the binding region 12 and the panel supporting layer 2, so that the orthographic projection of the reinforcing supporting layer 4 on the panel supporting layer 2 and the orthographic projection of the first supporting layer 5 on the panel supporting layer 2 can not overlap with each other.

According to the display module provided by the embodiment of the application, the first supporting layer 5 is arranged between the panel supporting layer 2 and the binding area 12; the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 and the orthographic projection of the first support layer 5 on the panel support layer 2 are not overlapped; like this, on the one hand, improve the supporting role, in binding the course of the technology, when circuit board 3 receives great pressure, because reinforcement supporting layer 4 covers the orthographic projection of components and parts 32 on panel supporting layer 2 in the orthographic projection of panel supporting layer 2, so can all transmit to reinforcement supporting layer 4 because of the great pressure in part of bottom plate 31 that components and parts 32 generated, reinforcement supporting layer 4 can share the great pressure in part of bottom plate 31, because reinforcement supporting layer 4 self can bear great pressure, so the deformation that reinforcement supporting layer 4 produced is less, it is comparatively even to transmit the pressure to display panel 1 from reinforcement supporting layer 4, improve the impression problem that display panel 1 caused at the local deformation that binds the technology in, thereby display effect has been improved.

On the other hand, in the manufacturing process, the film structure between the binding region 12 and the panel supporting layer 2 does not need to be changed, the cost for changing the first supporting layer 5 is not additionally increased, and the area of the reinforcing supporting layer 4 is smaller and the cost is lower.

Alternatively, referring to fig. 4 and 5, the reinforcing backing layer 4 extends between the bonded region 12 and the panel backing layer 2; the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 covers the orthographic projection of the bonding area 12 on the panel support layer 2.

In the direction of pointing to reinforcement supporting layer 4 along panel supporting layer 2, when the distance between bonding area 12 and reinforcement supporting layer 4 is greater than or equal to the distance between bottom plate 31 of circuit board 3 and reinforcement supporting layer 4, reinforcement supporting layer 4 can extend to between bonding area 12 and panel supporting layer 2, this moment includes two kinds of situations:

first, referring to fig. 4, the distance between the bonding area 12 and the panel support layer 2 is greater than the distance between the bottom plate 31 of the circuit board 3 and the panel support layer 2, in this case, the reinforcing support layer 4 and the bonding area 12 cannot be directly attached to each other, and a second support layer 7 needs to be disposed between the reinforcing support layer 4 and the bonding area 12.

Secondly, referring to fig. 5, the distance between the binding region 12 and the panel support layer 2 is equal to the distance between the bottom plate 31 of the circuit board 3 and the panel support layer 2, one surface of the binding region 13 close to the panel support layer 2 and one surface of the bottom plate 31 close to the panel support layer 2 are located on the same plane, the reinforcing support layer 4 and the binding region 12 can be directly attached to each other, and the reinforcing support layer 4 directly plays a role in supporting the binding region 12.

The orthographic projection of the reinforcing supporting layer 4 on the panel supporting layer 2 covers the orthographic projection of the binding area 12 on the panel supporting layer 2, therefore, under the condition that the binding area 12 is under pressure, the pressure can be directly or indirectly transmitted to the reinforcing supporting layer 4, the reinforcing supporting layer 4 can distribute the pressure of the binding area 12, and the reinforcing supporting layer 4 can bear larger pressure, so that the deformation generated by the reinforcing supporting layer 4 is smaller, the pressure transmitted from the reinforcing supporting layer 4 to the display panel 1 is smaller and average, and the problem of die stamping caused by the deformation generated at the edge of the display panel 1 is solved; in addition, when circuit board 3 receives pressure, the area of reinforcement supporting layer 4 is bigger, and the pressure of transmitting to display panel 1 is littleer, further improves the impression problem that the local deformation that display panel 1 produced in binding technology caused to further improve display effect.

Optionally, referring to fig. 4, the display module further includes a second supporting layer 7, where the second supporting layer 7 is located between the bonding region 12 and the reinforcing supporting layer 4; the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 covers the orthographic projection of the second support layer 7 on the panel support layer 2.

In the case where the distance between the bonding region 12 and the reinforcing support layer 4 is larger than the distance between the bottom plate 31 of the circuit board 3 and the reinforcing support layer 4, a second support layer 7 needs to be provided between the bonding region 12 and the reinforcing support layer 4. In some embodiments, the side of the second support layer 7 adjacent to the panel support layer 2 is in the same plane as the side of the base plate 31 adjacent to the panel support layer 2.

The material of the second supporting layer 7 includes a metal material and a wave-absorbing material, wherein the wave-absorbing material is a kind of material capable of absorbing or greatly reducing the electromagnetic wave energy received by the surface thereof, thereby reducing the interference of the electromagnetic wave.

The orthographic projection of the second supporting layer 7 on the panel supporting layer 2 can be positioned in the orthographic projection of the binding area 12 on the panel supporting layer 2, and the second supporting layer 7 occupies a smaller volume; alternatively, the orthographic projection of the second support layer 7 on the panel support layer 2 may be beyond the orthographic projection of the bonding zone 12 on the panel support layer 2.

It should be noted that, referring to fig. 6, the reinforcing support layer 4 and the panel support layer 2 may be integrally supplied, or, referring to fig. 7, the panel support layer 2, the reinforcing support layer 4, and the second support layer 7 may be integrally supplied; integrative supplied materials is attached into a whole before the technology of binding of display module assembly, and like this in binding the technology, a plurality of retes of integrative supplied materials only need attach once, avoid separately the pressure of attaching the in-process many times arouse display panel 1's deformation.

Orthographic projection of the reinforcing supporting layer 4 on the panel supporting layer 2 covers orthographic projection of the second supporting layer 7 on the panel supporting layer 2, therefore, all pressure that the second supporting layer 7 received is transmitted to the reinforcing supporting layer 4, the reinforcing supporting layer 4 can share the pressure of the second supporting layer 7, because the reinforcing supporting layer 4 can bear great pressure by itself, so the deformation that the reinforcing supporting layer 4 produced is less, the pressure that display panel 1 bore is less and average, improve the impression problem at 11 edges in display area, thereby the display effect is improved.

Alternatively, referring to fig. 5, a surface of the display panel 1 in the bonding region 12 adjacent to the panel support layer 2 and a surface of the bottom plate 31 adjacent to the panel support layer 2 are in the same plane.

The distance between the bonding area 12 and the panel supporting layer 2 may be designed in the Pad bonding process, the distance between the bottom plate 31 and the panel supporting layer 2 may also be designed and adjusted to some extent, and in some specific cases, the distance between the bonding area 12 and the panel supporting layer 2 may be equal to the distance between the bottom plate 31 of the circuit board 3 and the panel supporting layer 2, and at this time, the second supporting layer 7 is not required to be disposed.

In the embodiment of the application, one surface of the binding region 12 close to the panel supporting layer 2 and one surface of the bottom plate 31 close to the panel supporting layer 2 are located on the same plane, the reinforcing supporting layer 4 and the binding region 12 can be directly attached to each other, the reinforcing supporting layer 4 directly plays a role in supporting the binding region 12, the second supporting layer 7 is not required to be arranged, and the cost is reduced to a certain extent; and the process of attaching the second supporting layer 7 is reduced, and the efficiency of manufacturing the display module is improved.

Optionally, referring to fig. 8, the circuit board 3 further includes an electromagnetic shielding layer 33, and the electromagnetic shielding layer 33 is located between the bottom plate 31 and the reinforcing support layer 4. Fig. 8 is a schematic diagram of the specific structure of the circuit board 3 and the structure of a part of the reinforcing support layer 4 in fig. 3 to 5.

The Electromagnetic shielding layer 33 (Electromagnetic Interference) is configured to shield Electromagnetic Interference outside the circuit board 3.

The material of the electromagnetic shielding layer 33 includes a metal material, and the thickness of the electromagnetic shielding layer 33 in a direction perpendicular to the panel support layer 2 is determined according to a specific process, and for example, the thickness of the electromagnetic shielding layer 33 may include 15 μm.

Alternatively, referring to fig. 8, the material of the reinforcing support layer 4 includes a metal material; bottom plate 31 further includes ground terminal 313, and the side of bottom plate 31 adjacent to panel support layer 2 includes opening 314; the area defined by the orthographic projection of the outline of the opening 314 on the panel support layer 2 at least partially overlaps with the orthographic projection of the ground terminal 313 on the panel support layer 2; the ground terminal 313 is electrically connected to the reinforcing support layer 4 through the conductive material in the opening 314.

The material of the reinforcing support layer 4 includes a metal material, the strength of the metal material is high, and the conductivity is good, and specifically, the metal material of the reinforcing support layer 4 includes a stainless steel material.

The material of the ground terminal 313 includes copper, and thus the ground terminal 313 may also be referred to as a copper-exposed region, and the bottom plate 31 may include a plurality of ground terminals 313.

The area circumscribed by the orthographic projection of the outline of the opening 314 on the panel support layer 2 at least partially overlaps with the orthographic projection of the ground terminal 313 on the panel support layer 2, which may include the area circumscribed by the orthographic projection of the outline of the opening 314 on the panel support layer 2 overlapping with the orthographic projection of the ground terminal 313 on the panel support layer 2, or the area circumscribed by the orthographic projection of the outline of the opening 314 on the panel support layer 2 completely overlapping with the orthographic projection of the ground terminal 313 on the panel support layer 2. One opening 314 needs to be provided for each ground terminal 313, or one large opening 314 may be provided for a plurality of ground terminals 313.

The opening 314 is filled with a conductive material, which may include a conductive adhesive, so that the conductive and adhesive functions are performed simultaneously.

Fig. 9 shows a schematic top view of the circuit board 3 and the reinforcing support layer 4, wherein the area defined by the outline of the opening 314 in the orthographic projection of the ground terminal 313 on the panel support layer 2 is within the orthographic projection of the ground terminal 313 on the panel support layer 2. In fig. 9, in order to distinguish the component 32, the ground terminal 313, and the opening 314, different wire types are used.

In the related art, the ground terminal 313 and the conductive adhesive layer S1 are electrically connected, but the conductive adhesive layer S1 may flow due to uneven pressure, which may cause aggregation or loss of the conductive adhesive in a partial region, thereby reducing the conductive performance, and increasing the ground resistance of the circuit board 3.

In the embodiment of the present application, the reinforcing support layer 4 made of a metal material does not affect the conductivity under pressure, and the ground terminal 313 is electrically connected to the reinforcing support layer 4 through the conductive material in the opening 314, so that the ground resistance of the circuit board 3 is reduced, and the energy consumption of the circuit board 3 can be reduced.

Alternatively, referring to fig. 10, the reinforcing support layer 4 and the electromagnetic shielding layer 33 are of an integrated structure.

The material of the reinforcing support layer 4 includes a metal material, and the reinforcing support layer 4 of the metal material has an electromagnetic shielding performance, and can integrate the reinforcing support layer 4 and the electromagnetic shielding layer 33, so that the thickness of the reinforcing support layer 4 can be increased without changing the position of the bottom plate 31.

Wherein the integrated structure is different from the integrated incoming material in the previous text, and the integrated structure is made of the same material and is formed simultaneously in the same process; the integrated material is formed by bonding several different parts together and then bonding the parts to the display panel.

The thickness of reinforcement supporting layer 4 is confirmed according to concrete design, and is concrete, along the direction of perpendicular to panel supporting layer, the thickness of reinforcement supporting layer can be less than or equal to 200 microns, and the thickness of electromagnetic shield layer 33 can include 15 microns, and like this, under the condition of reinforcement supporting layer 4 and electromagnetic shield layer 33 structure as an organic whole, the thickness of reinforcement supporting layer 4 has obvious increase, and the intensity of reinforcement supporting layer 4 also can improve, and then the support capacity of reinforcement supporting layer 4 can improve.

Alternatively, referring to fig. 3 to 5, the bottom plate 31 includes a bottom plate main body 311 and a binding terminal 312 connected to one side of the bottom plate main body 311; the binding terminal 312 is electrically connected to the binding region 12.

The bonding terminal 312 includes a signal line electrically connected to the bottom plate 31, and the bonding region 12 is provided with a conductive pad on a side away from the panel supporting layer 2, and the conductive pad is electrically connected to the signal line in the bonding region 12; the binding terminal 312 is electrically connected to the binding region 12, and particularly, the signal line of the binding terminal 312 is electrically connected to the conductive pad of the binding region 12, so that the electrical signal transmission between the circuit board 3 and the binding region 12 can be realized.

Wherein the conductive pad includes a pad, the conductive pad may be electrically connected with the signal line within the binding terminal 312.

The embodiment of the application provides a display device, which comprises the display module.

Exemplarily, the display device comprises a flexible display device, and the flexible display device comprises a flexible display module.

In addition, the display device comprises any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

The display device provided by the embodiment of the application comprises a display module, wherein the display module comprises a display panel 1, and the display panel 1 comprises a display area 11 and a binding area 12 connected with one side of the display area 11; the display area 11 comprises a display surface B1 and a back surface B2 arranged opposite to the display surface B1, and the binding area 12 is positioned on the back surface B2 of the display area 11; a panel support layer 2 located on the back side B2 of the display area 11, and a partial area of the panel support layer 2 is located between the display area 11 and the bonding area 12; the circuit board 3 is electrically connected with the binding area 12 of the display panel 1 and is positioned on one side of the panel supporting layer 2, which is far away from the display area 11, the circuit board 3 comprises a bottom plate 31 and a component 32, and the component 32 is positioned on one side of the bottom plate 31, which is far away from the panel supporting layer 2; and the reinforcing support layer 4 is positioned between the bottom plate 31 and the panel support layer 2, and the orthographic projection of the reinforcing support layer 4 on the panel support layer 2 covers the orthographic projection of the component 32 on the panel support layer 2. Like this, in the course of the binding process, when circuit board 3 received great pressure, because reinforcement supporting layer 4 covers the orthographic projection of components and parts 32 on panel supporting layer 2 in the orthographic projection of panel supporting layer 2, so can all transmit reinforcement supporting layer 4 because of the great pressure in part of bottom plate 31 that components and parts 32 generated, reinforcement supporting layer 4 can share the great pressure in part of bottom plate 31, because reinforcement supporting layer 4 self can bear great pressure, so the deformation that reinforcement supporting layer 4 produced is less, it is comparatively even to transmit the pressure to display panel 1 from reinforcement supporting layer 4, improve the impression problem that display panel 1 produced in the process of binding the local deformation of production and cause, thereby display effect has been improved.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A display module, comprising:

the display device comprises a display panel, a display unit and a control unit, wherein the display panel comprises a display area and a binding area connected with one side of the display area; the display area comprises a display surface and a back surface arranged opposite to the display surface, and the binding area is positioned on the back surface of the display area;

the panel supporting layer is positioned on the back surface of the display area, and a partial area of the panel supporting layer is positioned between the display area and the binding area;

the circuit board is electrically connected with the binding region of the display panel and is positioned on one side, far away from the display region, of the panel supporting layer, and the circuit board comprises a bottom plate and an element, wherein the element is positioned on one side, far away from the panel supporting layer, of the bottom plate;

and the reinforcing supporting layer is positioned between the bottom plate and the panel supporting layer, and the orthographic projection of the reinforcing supporting layer on the panel supporting layer covers the orthographic projection of the component on the panel supporting layer.

2. The display module of claim 1,

the display module further comprises a first supporting layer, and the first supporting layer is located between the panel supporting layer and the binding region;

the orthographic projection of the reinforcing support layer on the panel support layer and the orthographic projection of the first support layer on the panel support layer are not overlapped.

3. The display module of claim 1, wherein the reinforcing support layer extends between the bonding region and the panel support layer;

the orthographic projection of the reinforcing support layer on the panel support layer covers the orthographic projection of the binding area on the panel support layer.

4. The display module assembly of claim 3, further comprising a second support layer between the bonding region and the reinforcing support layer;

the orthographic projection of the reinforcing support layer on the panel support layer covers the orthographic projection of the second support layer on the panel support layer.

5. The display module of claim 3, wherein a surface of the display panel in the bonding region adjacent to the panel support layer is coplanar with a surface of the bottom plate adjacent to the panel support layer.

6. The display module assembly of any one of claims 1-5, wherein the circuit board further comprises an electromagnetic shielding layer, the electromagnetic shielding layer being located between the base plate and the reinforcing support layer.

7. The display module of claim 6, wherein the material of the reinforcing support layer comprises a metallic material;

the bottom plate further comprises a grounding terminal, and one surface of the bottom plate close to the panel supporting layer comprises an opening;

the area defined by the orthographic projection of the outline of the opening on the panel supporting layer at least partially overlaps the orthographic projection of the ground terminal on the panel supporting layer;

the ground terminal is electrically connected to the reinforcing support layer through the conductive material in the opening.

8. The display module of claim 7, wherein the reinforcing support layer and the electromagnetic shielding layer are of a unitary structure.

9. The display module according to any one of claims 1 to 5, wherein the chassis base includes a chassis base body and a binding terminal connected to one side of the chassis base body;

the binding terminal is electrically connected with the binding region.

10. A display device, characterized in that the display device comprises a display module according to any one of claims 1 to 9.

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