CN115835094A - Audio signal processing method, system, device, product and medium - Google Patents
Audio signal processing method, system, device, product and medium Download PDFInfo
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Abstract
The application is applied to the technical field of electronics, and provides an audio signal processing method, an audio signal processing system, audio signal processing equipment, an audio signal processing product and an audio signal processing medium, wherein the audio signal processing method is applied to an audio playing device, the audio playing device is used for converting an audio signal into a sound signal, and the method comprises the following steps: determining that the temperature value belongs to a first temperature interval according to the temperature value of the audio playing device, wherein the first temperature interval corresponds to a first signal gain; a first signal gain is applied to the audio signal based on the audio signal being at a zero crossing. Therefore, the audio playing device can adjust the size of the audio signal according to the signal gain, avoid the temperature rise during working under the large signal state, and effectively reduce the working temperature. The corresponding gain size does not need to be calculated according to the temperature every time, the calculation amount of the audio playing device is saved, and further the power consumption is saved. Meanwhile, the audio playing device applies the signal gain to the audio signal when the audio signal is at the zero crossing point, so that the probability of signal distortion is reduced.
Description
Technical Field
The present invention relates to the field of electronic technologies, and in particular, to a method, a system, a device, a product, and a medium for processing an audio signal.
Background
The audio playing device is usually heated up when the working power is high or the working time is long, and if the audio chip and/or the speaker is not heated up, the audio chip and/or the speaker may be burnt out.
Generally, a temperature sensor is added in the audio playing device, and when the temperature acquired by the temperature sensor is higher, the audio chip is usually closed or some functions are weakened, so that the power consumption of the audio chip is reduced, and the effect of reducing the temperature is achieved. For example, when the temperature of the audio chip is too high, one or more of the functions of spatial sound effect, echo cancellation, noise reduction and the like can be turned off to reduce the power consumption of the audio chip.
However, in the process of playing sound or music, if the temperature of the audio chip is too high, part of the functions of the audio chip are directly turned off to reduce the temperature of the audio chip, which may cause distortion of the sound signal in the playing process, such as sudden change of sound effect or sudden change of sound, and affect the user experience.
Disclosure of Invention
An audio signal processing method, system, device, product and medium are provided.
In a first aspect, an audio signal processing system is provided, which includes a digital signal processing chip and an audio chip, where the digital signal processing chip is configured to determine, according to a temperature value of an audio playing apparatus, that a temperature value belongs to a first temperature interval, and the first temperature interval corresponds to a first signal gain; and the audio chip is used for applying the first signal gain to the audio signal to obtain the adjusted audio signal.
With reference to the first aspect, in some implementations, the audio chip is further configured to apply the first signal gain to the audio signal when the audio signal is at the zero-crossing point, so as to obtain the adjusted audio signal.
With reference to the first aspect, in some implementations, the audio chip is further configured to gradually increase or gradually decrease the audio signal according to the first signal gain to obtain the adjusted audio signal.
With reference to the first aspect, in some implementations, the temperature sensor is configured to obtain a temperature value of the audio playing apparatus, and send the temperature value to the digital signal processing chip.
With reference to the first aspect, in some implementations, the system further includes a speaker, an audio chip, and a processing unit, where the audio chip is further configured to convert the adjusted audio signal into an electrical signal; the audio chip is also used for sending the electric signal to the loudspeaker; and the loudspeaker is used for converting the electric signal into a sound signal.
With reference to the first aspect, in some implementations, the audio chip includes a first control switch and a second control switch, where the first control switch is configured to determine whether the first signal gain is zero, and when the first signal gain is not zero, the first control switch is turned on; and the second control switch is used for judging whether the audio signal is at a zero crossing point, and when the audio signal is at the zero crossing point, the second control switch is turned on.
With reference to the first aspect, in some implementation manners, the audio chip is further configured to apply the first signal gain to the audio signal when the first control switch and the second control switch are both turned on, so as to obtain the adjusted audio signal.
In a second aspect, the present application provides an audio signal processing method applied to an audio playing apparatus, where the method includes: determining that the temperature value belongs to a first temperature interval according to the temperature value of the audio playing device, wherein the first temperature interval corresponds to a first signal gain; and applying the first signal gain to the audio signal to obtain an adjusted audio signal.
With reference to the second aspect, in some implementations, applying a first signal gain to the audio signal to obtain an adjusted audio signal includes: determining whether the audio signal is at a zero crossing; and based on the fact that the audio signal is at the zero crossing point, applying the first signal gain to the audio signal to obtain the adjusted audio signal.
With reference to the second aspect, in some implementations, the method further includes: determining whether the first signal gain is zero and whether the audio signal is at a zero crossing; and based on that the first signal gain is not zero and the audio signal is at a zero crossing point, applying the first signal gain to the audio signal to obtain an adjusted audio signal.
With reference to the second aspect, in some implementations, the method further includes: and gradually increasing or gradually reducing the audio signal according to the first signal gain to obtain the adjusted audio signal.
In a third aspect, the present application provides an electronic device comprising a processor and a memory, the memory being configured to store instructions, the processor being configured to execute the instructions, and when the processor executes the instructions, to perform the method as described in the first aspect.
In a fourth aspect, the present application provides a computer readable storage medium having stored therein instructions that, when executed on an electronic device, perform the method as described in the first aspect.
In a fifth aspect, the present application provides a computer program product comprising computer instructions which, when executed by a computing device, the computing device performs the method as described in the first aspect.
In summary, according to the audio signal processing method, system, device, product, and medium provided by the present application, the audio chip can directly determine the corresponding signal gain according to the temperature, for example, when the temperature is high, the audio chip can directly reduce the audio signal according to the temperature interval where the temperature is located, so as to avoid the temperature rise of the speaker and the audio chip when the speaker and the audio chip are working under a large signal state, effectively reduce the temperature of the audio chip, and avoid the voice coil of the speaker from generating noise and even burning the audio playing device. The audio chip prestores the corresponding relation between the temperature interval and the signal gain, so that the audio chip is prevented from calculating the corresponding gain according to the temperature value every time, the calculated amount of the audio chip is saved, and the power consumption of the audio chip is further saved. Meanwhile, the audio chip applies signal gain to the audio signal when the audio signal is at a zero crossing point, the amplitude of the audio signal is zero at the zero crossing point, namely the intensity of the corresponding sound signal is lowest, the audio signal is adjusted at the moment, the probability of signal distortion can be reduced, and the problem that the sound effect is suddenly changed or the sound is suddenly changed can not be caused.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below.
Fig. 1 is a schematic structural diagram of an audio playing apparatus according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of an audio chip according to an embodiment of the present disclosure;
fig. 3 is a schematic flowchart of an audio signal processing method according to an embodiment of the present disclosure;
fig. 4 is a schematic flowchart of an audio chip according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of an audio signal processing apparatus according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
Illustrative embodiments of the present application include, but are not limited to, an audio signal processing method, system, apparatus, article of manufacture, and medium.
More and more electronic devices are equipped with audio playing devices such as speakers, such as mobile phones, tablet computers, DVs, video cameras, portable computers, notebook computers, smart speakers, televisions, and other electronic devices all have the function of playing sound or music. The audio playing device may include an audio chip and a speaker, where the audio chip may convert a received audio signal into an electrical signal, transmit the electrical signal to the speaker, and convert the electrical signal into a sound signal through the speaker for outputting.
In addition, the audio chip can also apply signal gain to the audio signal to realize the adjustment of the power of the audio signal. For example, the equalizer in the audio chip applies different gains to different frequency bands in the audio signal to amplify or reduce the audio signal of a specific frequency band, and then adjusts the sound effect of the finally output sound signal, so that the style of sound is more prominent, and the same audio signal can be adjusted to different sound effect styles under different equalizer parameters.
Optionally, some audio playing devices may further include functions of spatial sound effect, echo cancellation, noise reduction, and the like. The two-channel virtual stereo is realized by applying a spatial sound effect, and particularly, the sound wave amplitude of a left channel and a right channel is adjusted by the position of a given virtual sound source and the relative position of the given virtual sound source and the head of a person, so that the stereo listening feeling of a two-dimensional plane space is realized. Echo cancellation is to cancel noise generated by a microphone and a speaker through a feedback path (feedback path) generated by air in a sound wave interference mode. The noise reduction function is to utilize the principle of sound wave superposition cancellation to neutralize noise by collecting environmental noise and generating reverse sound waves equal to the environmental noise, thereby realizing the effect of noise reduction.
However, the audio playing device often has a temperature rise due to a large working power or a long working time, and if no temperature protection measure is applied, the audio chip and/or the speaker may be burnt out.
In some examples, a temperature sensor may be added to the audio playing device, and when the temperature acquired by the temperature sensor is high, the audio chip may be normally turned off or some functions may be weakened, so as to reduce the power consumption of the audio chip, thereby achieving the effect of reducing the temperature. For example, when the temperature of the audio chip is too high, one or more of the functions of spatial sound effect, echo cancellation, noise reduction and the like can be turned off to reduce the power consumption of the audio chip, so that the temperature of the audio chip is reduced.
However, in the process of playing sound or music, if the temperature of the audio chip is too high, part of the functions of the audio chip are directly turned off to reduce the temperature of the audio chip, which may cause distortion of the sound signal in the playing process, such as sudden change of sound effect or sudden change of sound, and affect the user experience.
In order to solve the problem that the audio playing device may be burnt out due to the overhigh temperature, the application provides an audio signal processing method, the method obtains the temperature of the audio chip through a temperature sensor, determines a plurality of temperature intervals, each temperature interval corresponds to different signal gain, and the signal gain can adjust the size of the audio signal. The audio chip determines a temperature interval corresponding to the current temperature according to the temperature acquired by the temperature sensor, then determines the gain corresponding to the temperature interval, and applies the gain to the audio signal when the audio signal is at a zero crossing point. That is, when the waveform of the audio signal is switched from the positive half axis to the negative half axis or from the negative half axis to the positive half axis, a gain is applied to the audio signal.
Like this, the audio frequency chip can be directly according to the corresponding signal gain size of temperature determination, for example, when the temperature is great, according to the temperature interval that the temperature is located, directly according to the signal gain reduction audio signal that the temperature interval corresponds, the temperature rise when having avoided speaker and audio frequency chip to work under big signal state, can effectively reduce the temperature of audio frequency chip, has avoided the voice coil of speaker to loose the circle and produce the noise and even burn out audio playback device. The audio chip prestores the corresponding relation between the temperature interval and the signal gain, avoids that the audio chip calculates the corresponding gain according to the temperature value every time, saves the calculated amount of the audio chip and further saves the power consumption of the audio chip. Meanwhile, the audio chip applies signal gain to the audio signal when the audio signal is at a zero crossing point, the amplitude of the audio signal is zero at the zero crossing point, namely the intensity of the corresponding sound signal is lowest, the audio signal is adjusted at the moment, the probability of signal distortion can be reduced, and the problem that the sound effect is suddenly changed or the sound is suddenly changed can not be caused.
Alternatively, the present invention may be applied to a terminal device having a speaker external playing function, and may be an intelligent terminal, such as a mobile phone, a tablet, a DV, a video camera, a portable computer, a notebook computer, an intelligent sound box, a television, and other products equipped with an audio playing device.
In some embodiments, some functional modules in the present invention may also be deployed on a Digital Signal Processing (DSP) chip of an associated device, and specifically may be applications or software therein. The invention is arranged on the terminal equipment, provides the audio signal processing function through software installation or upgrading and calling and matching of hardware, improves the temperature protection function of the audio playing device and further gives full play to the performance of the loudspeaker.
For example, as shown in fig. 1, fig. 1 shows a schematic structural diagram of an audio playing apparatus 100, which can execute the audio processing method, and which can include a temperature sensor 110, a DSP120, an audio chip 130, and a speaker 140. The temperature sensor 110 is used to obtain the temperature of the audio playing apparatus 100, and specifically, the temperature of the DSP120, the audio chip 130 and/or the speaker 140 may be used. The temperature sensor 110 is configured to send the temperature of the audio playing apparatus 100 to the DSP120, and the DSP120 prestores signal gain magnitudes corresponding to different temperature intervals. Furthermore, the DSP120 may determine a temperature interval to which the temperature value belongs according to the temperature value, then determine a signal gain corresponding to the temperature interval, and then send the signal gain to the audio chip 130, where the audio chip 130 acts on the audio signal when the signal gain is not zero and when the audio signal crosses zero, so as to adjust the power of the audio signal, and further reduce the power consumption of the audio chip and the speaker 140. Finally, the audio chip 130 converts the adjusted audio signal into an electrical signal, and then transmits the electrical signal to the speaker 140, and the speaker 140 converts the electrical signal into a sound signal for output.
Fig. 2 shows a structure diagram of the audio chip 130, and as shown in fig. 2, the audio chip 130 may specifically include a first control switch and a second control switch, and the first control switch and the second control switch may be software units or logic determination units. The first control switch is used for judging whether the signal gain is zero or not, and when the signal gain is not zero, the first control switch is turned on. The second control switch is used for judging whether the audio signal is at a zero crossing point, and when the audio signal is at the zero crossing point, the second control switch is turned on. When both the first control switch and the second control switch are open, the audio chip 130 will apply a signal gain to the audio signal.
It should be understood that fig. 1 above is only one possible implementation manner of the embodiment of the present application, and in practical applications, the audio playing apparatus may further include more or less components, for example, the functions performed by the DSP120 may also be performed by the audio chip 130, and the present application is not limited thereto.
To sum up, the audio playing device 100 provided by the present application can determine the magnitude of the signal gain according to the temperature by pre-storing the corresponding relationship between the magnitude of the temperature and the signal gain, and the corresponding magnitude of the signal gain is not required to be calculated according to the temperature every time when the audio playing device 100 determines the magnitude of the signal gain according to the temperature, so that the calculation amount of the DSP120 and/or the audio chip 130 can be saved, and further, the power consumption can be saved. Moreover, the audio chip 130 applies signal gain to the audio signal when the audio signal is at a zero crossing point, so that the probability of audio signal distortion is reduced.
The following describes a specific process of the audio signal processing method in the embodiment of the present application. Taking the audio signal processing method applied to the audio playback device 100 shown in fig. 1 as an example, as shown in fig. 3, the audio signal processing method includes the steps of:
s310: the temperature sensor 110 acquires the temperature of the audio playback apparatus.
The temperature sensor 110 may detect the temperature of the audio playback device 100 and transmit the temperature value to the DSP120. Alternatively, the temperature sensor 110 may specifically measure the temperature of the DSP120, the audio chip 130 and/or the speaker 140 in the audio playing apparatus.
The temperature sensor 110 may be an infrared temperature sensor, a photoelectric temperature sensor, a thermocouple temperature sensor, or a thermal resistance temperature sensor. Specifically, the temperature sensor 110 may also acquire data of a potential value, a resistance value, and the like related to the temperature, convert the data into an actual temperature value, and send the actual temperature value to the DSP120, or directly send the data of the potential value, the resistance value, and the like related to the temperature to the DSP120. It should be understood that the present application is not limited to a particular type of temperature sensor.
S320: the DSP120 determines the signal gain corresponding to the temperature interval to which the current temperature belongs according to the temperature interval to which the current temperature belongs.
The DSP120 prestores a plurality of temperature intervals and signal gain magnitudes corresponding to different temperature intervals. After acquiring the temperature value sent by the temperature sensor 110, the DSP120 determines the temperature interval to which the current temperature value belongs, and may further determine the corresponding signal gain.
For example, DSP120 may first set a number of temperature thresholds Th1, th2, th3, 8230, thn, where Th1 ≦ Th2 ≦ Th3 ≦ 8230, ≦ Thn, where n is a positive integer, and then determine a number of temperature intervals [ Th1, th2], [ Th2, th3] \ 8230, and [ Thn-1, thn ]. In some embodiments, n is typically 4, i.e. 4 temperature intervals are defined. Then, the DSP120 determines the signal gain corresponding to each temperature interval according to the different temperature intervals to obtain a signal gain set { G1, G2 \8230; gn-1}. The signal gains corresponding to the different temperature intervals can be calculated according to the median, the maximum value or the temperature value corresponding to the minimum value of the temperature interval, and the signal gains can adjust the size of the audio signal.
S330: the audio chip 130 applies signal gain to the audio signal at the time of its zero crossing.
After the DSP120 determines the signal gain corresponding to the current temperature and sends the signal gain to the audio chip 130, the audio chip 130 applies the signal gain to the audio signal when the audio signal is at the zero crossing point.
Finally, the audio chip 130 converts the adjusted audio signal into an electrical signal, and then transmits the electrical signal to the speaker 140, and the speaker 140 converts the electrical signal into a sound signal for output.
Specifically, referring to fig. 2, the audio chip 130 may include a first control switch for determining whether the signal gain is zero, and a second control switch for determining whether the audio signal crosses zero. The specific workflow is shown in fig. 4:
s410: the first control switch judges whether the signal gain is zero or not.
If the first control switch is determined not to be yes, step S420 is executed. If the first control switch is determined as yes, the audio chip 130 continues to wait for a new signal gain value.
S420: the first control switch is turned on. That is, when the signal gain is not zero, the first control switch is turned on.
S430: the second control switch judges whether the audio signal is at a zero crossing point.
If the second control switch determination result is yes, step S440 is executed. If the judgment result of the second control switch is negative, continuing to wait for the audio signal to be at the zero-crossing point.
S440: the second control switch is turned on. I.e. when the audio signal is at a zero crossing, the second control switch is open.
S450: the signal gain is applied to the audio signal.
When both the first control switch and the second control switch are open, i.e., the signal gain is not zero and the audio signal is at the zero crossing point, the audio chip 130 will apply the signal gain to the audio signal.
In some embodiments, the audio chip 130 may also perform fade-in/fade-out processing when applying signal gain to the audio signal. The fade-in processing refers to slowly changing the audio signal from a small signal to a large signal through a signal gain, and the fade-out processing refers to slowly changing the audio signal from the large signal to the small signal through the signal gain. That is to say, the signal gain is gradually increased or decreased, so that the problems that the audio signal is suddenly increased or decreased due to sudden change of the signal gain can be avoided.
To sum up, the audio chip can directly confirm the size of the corresponding signal gain according to the temperature, and the signal gain can adjust the size of the audio signal, so that the temperature rise of the loudspeaker and the audio chip during working under a large signal state is avoided, the temperature of the audio playing device can be effectively reduced, and the phenomenon that the voice coil of the loudspeaker generates noise and even burns the audio playing device is avoided. The audio chip also prestores the corresponding relation between the temperature and the signal gain, so that the audio chip is prevented from calculating the corresponding gain according to the temperature every time, the calculation amount of the audio chip is saved, and the power consumption of the audio chip is further saved. Meanwhile, the audio chip applies signal gain to the audio signal when the audio signal is at a zero crossing point, so that the probability of signal distortion is reduced.
The following describes a structure of an audio signal processing apparatus 500 provided in an embodiment of the present application, which can implement the audio processing method described above. As shown in fig. 5, the apparatus includes an obtaining unit 510, a determining unit 520, and a processing unit 530.
The obtaining unit 510 is configured to obtain a temperature of the audio playing apparatus, the determining unit 520 is configured to determine that the temperature value belongs to a first temperature interval according to the temperature value of the audio playing apparatus, where the first temperature interval corresponds to a first signal gain, and the processing unit 530 is configured to apply the first signal gain to the audio signal based on that the audio signal is at a zero crossing point, so as to obtain an adjusted audio signal.
In some embodiments, the determining unit 520 pre-stores a plurality of temperature intervals and signal gain levels corresponding to different temperature intervals. After acquiring the temperature value sent by the obtaining unit 510, the determining unit 520 determines the temperature interval to which the current temperature belongs, and may further determine the corresponding signal gain.
In further embodiments, the determination unit 520 is further configured to determine whether the audio signal is at a zero crossing. The processing unit 530 is further configured to apply the first signal gain to the audio signal based on the audio signal being at a zero crossing point, resulting in an adjusted audio signal.
In further embodiments, the determination unit 520 is further configured to determine whether the first signal gain is zero and whether the audio signal is at a zero crossing. The processing unit 530 is further configured to apply the first signal gain to the audio signal based on that the first signal gain is not zero and the audio signal is at a zero crossing point, so as to obtain an adjusted audio signal.
In other embodiments, the processing unit 530 is further configured to gradually increase or gradually decrease the audio signal according to the first signal gain to obtain the adjusted audio signal.
To sum up, the audio signal processing apparatus that this application provided can be directly according to the signal gain size that the temperature determination corresponds, and this signal gain can adjust audio signal's size, has avoided speaker and audio chip temperature rise when work under the big signal state, can effectively reduce audio playback device's temperature, has avoided the voice coil loudspeaker voice coil loose circle of speaker to produce the noise and even has burnt audio playback device. The audio playing device also prestores the corresponding relation between the temperature and the signal gain, so that the audio playing device is prevented from calculating the corresponding gain according to the temperature every time, the calculated amount of the audio playing device is saved, and the power consumption of the audio playing device is further saved. Meanwhile, the audio playing device applies the signal gain to the audio signal when the audio signal is at the zero crossing point, so that the probability of signal distortion is reduced.
The structure of the electronic device 600 in the embodiment of the present application is described below. The electronic device 600 may be the electronic device including the audio playing apparatus 100 in the foregoing.
Referring to fig. 6, fig. 6 is a schematic structural diagram of an electronic device according to an embodiment of the present application. As shown in fig. 6, the electronic device 600 includes: the audio playback device 100, the processor 610, the communication interface 620, and the memory 630 are connected to each other through an internal bus 640.
The processor 610, the communication interface 620 and the memory 630 may be connected by a bus, or may communicate by other means such as wireless transmission. In the embodiment of the present application, the bus 640 is taken as an example of connection, where the bus 640 may be a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, or the like. The bus 640 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown in FIG. 6, but this is not intended to represent only one bus or type of bus.
The processor 610 may be formed by one or more general-purpose processors, such as a Central Processing Unit (CPU), or a combination of a CPU and a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a Programmable Logic Device (PLD), or a combination thereof. The PLD may be a Complex Programmable Logic Device (CPLD), a field-programmable gate array (FPGA), a General Array Logic (GAL), or any combination thereof. The processor 610 executes various types of digitally stored instructions, such as software or firmware programs stored in the memory 630, which enable the electronic device 600 to provide a wide variety of services.
Specifically, the processor 610 may be formed by at least one general-purpose processor, such as a Central Processing Unit (CPU), or a combination of a CPU and a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a Programmable Logic Device (PLD), or a combination thereof. The PLD may be a Complex Programmable Logic Device (CPLD), a field-programmable gate Array (FPGA), a General Array Logic (GAL), or any combination thereof. The processor 610 executes various types of digitally stored instructions, such as software or firmware programs stored in the memory 630, which enable the electronic device 600 to provide a wide variety of services.
The communication interface 620 may be a wired interface (e.g., an ethernet interface), may be an internal interface (e.g., a peripheral component interconnect express (PCIe bus interface)), a wired interface (e.g., an ethernet interface), or a wireless interface (e.g., a cellular network interface or using a wireless local area network interface) for communicating with other devices or modules.
It should be noted that fig. 6 is only one possible implementation manner of the embodiment of the present application, and in practical applications, the electronic device may further include more or less components, which is not limited herein. For the content that is not shown or described in the embodiment of the present application, reference may be made to the related explanation in the embodiment described in fig. 3, and details are not described here. The electronic device shown in fig. 6 may also be a computer cluster formed by a plurality of computing nodes, and the present application is not limited in particular.
Embodiments of the present application also provide a computer-readable storage medium, which stores instructions that, when executed on a processor, implement the method flow illustrated in fig. 3.
Embodiments of the present application also provide a computer program product, where when the computer program product runs on a processor, the method flow shown in fig. 3 is implemented.
The above embodiments may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, the above-described embodiments may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded or executed on a computer, cause the flow or functions according to embodiments of the invention to occur, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a network of computers, or other programmable device. The computer instructions may be stored on or transmitted from one computer-readable storage medium to another, for example, from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital Subscriber Line (DSL), or wireless (e.g., infrared, wireless, microwave, etc.) means.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (14)
1. An audio signal processing system, characterized in that the system comprises a digital signal processing chip and an audio chip,
the digital signal processing chip is used for determining that the temperature value belongs to a first temperature interval according to the temperature value of the audio playing device, and the first temperature interval corresponds to a first signal gain;
and the audio chip is used for applying the first signal gain to an audio signal to obtain an adjusted audio signal.
2. The audio signal processing system of claim 1,
the audio chip is further configured to apply the first signal gain to the audio signal when the audio signal is at a zero-crossing point, so as to obtain the adjusted audio signal.
3. The audio signal processing system of claim 1,
the audio chip is further configured to gradually increase or gradually decrease the audio signal according to the first signal gain to obtain the adjusted audio signal.
4. The audio signal processing system of claim 1, further comprising a temperature sensor,
the temperature sensor is used for acquiring the temperature value of the audio playing device and sending the temperature value to the digital signal processing chip.
5. The audio signal processing system of claim 4, wherein the system further comprises a speaker,
the audio chip is also used for converting the adjusted audio signal into an electric signal;
the audio chip is also used for sending the electric signal to the loudspeaker;
the loudspeaker is used for converting the electric signal into a sound signal.
6. The audio signal processing system of any of claims 1 to 5, wherein the audio chip comprises a first control switch and a second control switch,
the first control switch is used for judging whether the first signal gain is zero or not, and when the first signal gain is not zero, the first control switch is turned on;
the second control switch is used for judging whether the audio signal is at a zero crossing point, and when the audio signal is at the zero crossing point, the second control switch is turned on.
7. The audio signal processing system of claim 6,
the audio chip is further configured to apply the first signal gain to the audio signal when the first control switch and the second control switch are both turned on, so as to obtain the adjusted audio signal.
8. An audio signal processing method applied to an audio playing device, the method comprising:
determining that the temperature value belongs to a first temperature interval according to the temperature value of the audio playing device, wherein the first temperature interval corresponds to a first signal gain;
and applying the first signal gain to the audio signal to obtain an adjusted audio signal.
9. The audio signal processing method of claim 8, wherein the applying the first signal gain to the audio signal to obtain an adjusted audio signal comprises:
determining whether the audio signal is at a zero crossing;
and based on the fact that the audio signal is at a zero-crossing point, applying the first signal gain to the audio signal to obtain the adjusted audio signal.
10. The audio signal processing method of claim 8, wherein the applying the first signal gain to the audio signal to obtain an adjusted audio signal comprises:
determining whether the first signal gain is zero and whether the audio signal is at a zero crossing;
and based on that the first signal gain is not zero and the audio signal is at a zero crossing point, applying the first signal gain to the audio signal to obtain the adjusted audio signal.
11. The audio signal processing method according to any one of claims 8 to 10, characterized in that the method further comprises:
and gradually increasing or gradually reducing the audio signal according to the first signal gain to obtain the adjusted audio signal.
12. An electronic device comprising a processor and a memory, the memory for storing instructions, the processor for executing the instructions, the processor when executing the instructions performing the method of any of claims 8 to 11.
13. A computer program product, characterized in that the computer program product comprises computer instructions which, when executed by an electronic device, the electronic device performs the method according to any of claims 8 to 11.
14. A computer-readable storage medium comprising instructions that, when executed on an electronic device, cause the electronic device to perform the method of any of claims 8-11.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310019688.7A CN115835094A (en) | 2023-01-06 | 2023-01-06 | Audio signal processing method, system, device, product and medium |
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| CN202310019688.7A CN115835094A (en) | 2023-01-06 | 2023-01-06 | Audio signal processing method, system, device, product and medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784271A (en) * | 2021-09-28 | 2021-12-10 | 深圳市奥拓普科技有限公司 | High-temperature protection method and system for sound equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784271A (en) * | 2021-09-28 | 2021-12-10 | 深圳市奥拓普科技有限公司 | High-temperature protection method and system for sound equipment |
| CN113784271B (en) * | 2021-09-28 | 2024-04-16 | 深圳市奥拓普科技有限公司 | High-temperature protection method and system for sound equipment |
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