CN115832367A - Flow control method and system for electric pile test bench, electronic equipment and storage medium - Google Patents
Flow control method and system for electric pile test bench, electronic equipment and storage medium Download PDFInfo
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Abstract
The application relates to a flow control method and system for a galvanic pile test bench, electronic equipment and a storage medium. The method comprises the following steps: acquiring a first temperature, a first pressure and a first humidity of an outlet of a humidifier; acquiring a second temperature, a second pressure and a second humidity of the inlet of the galvanic pile; acquiring the total flow of dry gas of the dry gas introduced into the dry gas path and the wet gas path; controlling a first flow rate of gas in the dry gas path and a second flow rate of gas in the wet gas path according to changes in the first temperature, the first pressure, the first humidity, the second temperature, the second pressure, the second humidity, and the total flow rate of dry gas; and the second flow rate is the total flow rate of the dry gas and the wet gas in the wet gas circuit. Because the route of gas flow through shortens, when the operating mode changes, the actual flow and the pressure of galvanic pile entry can quick response for the air feed is sufficient or the air feed has reached the operating mode requirement, and the simulation ability demand under the full operating mode can be satisfied to the galvanic pile testboard.
Description
Technical Field
The present disclosure relates to the field of fuel cell technologies, and in particular, to a method and a system for controlling flow of a stack test board, an electronic device, and a storage medium.
Background
The fuel cell is a chemical device for directly converting chemical energy of fuel into electric energy, is not limited by Carnot cycle effect, and has high efficiency; in addition, the fuel cell uses fuel and oxygen as raw materials, does not have mechanical transmission parts at the same time, discharges little harmful gas, have long performance life. Therefore, fuel cells are the most promising power generation technology from the viewpoint of energy conservation and ecological environment protection.
The fuel cell stack is a main site where electrochemical reactions occur, and is a core component of a fuel cell system. The galvanic pile test bench can comprehensively test the working state, stability and safety of the galvanic pile. When a galvanic pile test bench is used for testing a galvanic pile, the flow of gas to the galvanic pile needs to be controlled.
However, in the conventional stack testing technology, the gas needs to flow through a humidifier, a heater, a corresponding pipeline and the like in sequence from a flow control point for controlling the flow of the gas to a back pressure valve section, and the flowing path is long. And when the operating mode is when the rapid change, the unable rapid response of actual flow and the pressure of galvanic pile entry can appear lagging great condition to cause the galvanic pile to be short of gas or cause the air feed to reach the requirement of operating mode, make the simulating ability demand under the unable full operating mode of satisfying of galvanic pile testboard.
Disclosure of Invention
Therefore, it is necessary to provide a flow control method, a flow control system, an electronic device and a storage medium for a test platform of a galvanic pile, which can improve response speed, in order to solve the problem that the traditional galvanic pile test cannot meet the requirement of simulation capability under all working conditions due to low response speed.
A flow control method for a galvanic pile test bench comprises the following steps:
acquiring a first temperature, a first pressure and a first humidity of an outlet of a humidifier;
acquiring a second temperature, a second pressure and a second humidity of the inlet of the galvanic pile;
acquiring the total flow of dry gas of the dry gas introduced into the dry gas path and the wet gas path;
controlling a first flow rate of gas in the dry gas path and a second flow rate of gas in the wet gas path according to changes in the first temperature, the first pressure, the first humidity, the second temperature, the second pressure, the second humidity, and the total flow rate of dry gas;
and the second flow rate is the total flow rate of the dry gas and the wet gas in the wet gas circuit.
In one embodiment, the first flow rate is defined as Qa1, the first temperature is defined as T1, the first pressure is defined as P1, the first humidity is defined as RH1, the second temperature is defined as T2, the second pressure is defined as P2, the second humidity is defined as RH2, and the total dry gas flow rate is defined as Qa; the Qa1, T1, P1, RH1, T2, P2, RH2 and Qa satisfy:
In one embodiment, the second flow rate is defined as m, the first temperature is defined as T1, the first pressure is defined as P1, the first humidity is defined as RH1, the second temperature is defined as T2, the second pressure is defined as P2, the second humidity is defined as RH2, and the total dry gas flow rate is defined as Qa; the m, T1, P1, RH1, T2, P2, RH2 and Qa satisfy:
In one embodiment, the RH1 is 100%.
In one embodiment, the method further comprises the following steps:
judging the relation between the second humidity and the target humidity required by the galvanic pile;
and when the second humidity is not equal to the target humidity, acquiring the actual dew point temperature of the outlet of the humidifier based on deviation, and correcting the first flow and the second flow.
A stack test stand flow control system comprising:
a dry gas circuit;
the wet gas path is connected with the dry gas path and is provided with a first junction and a second junction, the first junction is communicated with the gas source, and the second junction is communicated with the galvanic pile; a humidifier is arranged on the wet gas path;
the first mass flow controller is arranged on the dry gas path and used for controlling the first flow of the dry gas path according to the first temperature, the first pressure and the first humidity of the outlet of the humidifier, the second temperature, the second pressure and the second humidity of the inlet of the galvanic pile and the change of the total dry gas flow of the dry gas introduced into the dry gas path and the wet gas path;
and the second mass flow controller is arranged on the wet gas path, is positioned at the downstream of the humidifier and is used for controlling the second flow in the wet gas path according to the changes of the first temperature, the first pressure, the first humidity, the second temperature, the second pressure, the second humidity and the total flow of the dry gas.
In one embodiment, the method further comprises the following steps:
the first temperature sensor, the first pressure sensor and the first humidity sensor are all arranged on the wet gas path and are positioned at the downstream of the humidifier; the first humidity sensor is configured to detect a first temperature at the humidifier outlet, the first pressure sensor is configured to detect a first pressure at the humidifier outlet, and the first humidity sensor is configured to detect a first humidity at the humidifier outlet;
the second temperature sensor, the second pressure sensor and the second humidity sensor are arranged between the second intersection point and the galvanic pile; the second temperature sensor is used for detecting a second temperature of the electric pile inlet, the second pressure sensor is used for detecting a second pressure of the electric pile inlet, and the second humidity sensor is used for detecting a second humidity of the electric pile inlet.
In one embodiment, the method further comprises the following steps:
the first heater is arranged on the dry gas path and located at the downstream of the first mass flow controller, and the second heater is arranged between the second intersection point and the electric pile.
An electronic device comprising a memory storing a computer program and a processor implementing the steps of the method of any of the preceding claims when the computer program is executed.
A computer readable storage medium having instructions which, when executed by a processor of an electronic device, enable the electronic device to perform the stack test station flow control method of any one of the preceding claims.
According to the flow control method, the flow control system, the electronic equipment and the storage medium of the galvanic pile test bench, the second flow of the gas in the wet gas path is controlled according to the first temperature, the first humidity, the second temperature, the second pressure, the second humidity and the change of the total flow of the dry gas, wherein the second flow is the total flow of the dry gas and the wet gas in the wet gas path, namely the flow of the gas after the wet gas path is humidified by the humidifier. Compared with the prior art that the mass flow controller is arranged at the upstream of the humidifier, the gas flowing path from the flow control point to the back pressure valve section is shortened. And because the route of gas flow through shortens, when the operating mode changes, the actual flow and the pressure of galvanic pile entry can quick response for the air feed is sufficient or the air feed has reached the operating mode requirement, and the simulation ability demand under the full operating mode can be satisfied to the galvanic pile testboard. Meanwhile, the pressure in the galvanic pile is ensured to be within a preset range by simultaneously controlling the first flow and the second flow.
Drawings
Fig. 1 is a schematic diagram of a flow control system of a stack testing station according to an embodiment of the present disclosure;
fig. 2 is a flowchart of a flow control method for a stack testing station according to an embodiment of the present disclosure;
fig. 3 is a block diagram of an electronic device of a flow control method for a stack test stand according to an embodiment of the present application.
100. A flow control system of the galvanic pile test bench; 10. a dry gas circuit; 20. a wet gas path; 30. a first junction point; 40. a second junction; 50. a humidifier; 60. a first mass flow controller; 70. a second mass flow controller; 80. a first temperature sensor; 90. a first pressure sensor; 110. a first humidity sensor; 120. a second temperature sensor; 130. a second pressure sensor; 140. a second humidity sensor; 150. a first heater; 160. a second heater; 170. a back pressure valve; 200. and (4) electric pile.
Detailed Description
In order to make the technical solutions of the present application better understood by those of ordinary skill in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
As described in the background art, in the conventional stack testing technology, when the working condition changes, the actual flow and pressure at the inlet of the stack cannot respond quickly, and the situation of large hysteresis occurs, so that the stack is short of gas or the gas supply cannot meet the requirement of the working condition, and the stack testing device cannot meet the requirement of the simulation capability under the full working condition. The root cause of the above problems is: in the prior art, the mass flow controller is generally disposed at the upstream of the humidifier, so that the gas from the flow control point to the back pressure valve section needs to pass through the humidifier, the heater and the corresponding pipeline in sequence, thereby causing a long path for the gas to flow through. Due to the long path for the gas to flow through, the actual flow and pressure at the inlet of the stack cannot respond quickly when the operating conditions change.
Referring to fig. 1, fig. 1 is a schematic diagram of a flow control system of a stack testing station according to an embodiment of the present disclosure.
In order to solve the above problems, the present application provides a flow control system 100 for a stack testing platform, which includes a dry gas path 10 and a wet gas path 20, wherein the wet gas path 20 is connected to the dry gas path 10 and has a first junction 30 and a second junction 40, the first junction 30 is connected to a gas source, and the second junction 40 is connected to a stack 200. The wet gas path 20 is provided with a humidifier 50, and the dry gas introduced into the wet gas path 20 is humidified by the humidifier 50 to form a mixed gas of the dry gas and the wet gas, and is converged at a second convergence point 40 with the dry gas flowing from the dry gas path 10 to the galvanic pile 200, and is introduced into the galvanic pile 200 together.
It should be noted that the flow control system 100 of the stack testing station can be used to control the flow rate of the cathode gas and also can be used to control the flow rate of the anode gas. Specifically, when applied to a hydrogen-oxygen fuel cell, the cathode gas is air, and the anode gas is hydrogen. In other embodiments, the type of gas used in the anode is not limited.
With continued reference to fig. 1, the flow control system 100 of the stack testing station further includes a first mass flow controller 60, and the first mass flow controller 60 is disposed on the dry gas path 10 and configured to control the first flow of the dry gas flow 10 according to the first temperature, the first pressure, the first humidity, the second temperature, the second pressure, the second humidity, and the change of the total flow of the dry gas. The first temperature is a temperature at an outlet of the humidifier 50, the first pressure is a pressure at the outlet of the humidifier 50, and the first humidity is a humidity at the outlet of the humidifier 50. The second temperature is a temperature of an inlet of the stack 200, the second pressure is a pressure of the inlet of the stack 200, and the second humidity is a humidity of the inlet of the stack 200. The total flow rate of the dry gas is the sum of the flow rate from the gas source into the dry gas path 10 and the flow rate into the wet gas path 20.
The flow control system 100 of the stack testing platform further includes a second mass flow controller 70, which is disposed on the wet gas path 20 and located downstream of the humidifier 50, and is configured to control a second flow rate in the wet gas path 20 according to changes of the first temperature, the first pressure, the first humidity, the second temperature, the second pressure, the second humidity, and the total flow rate of the dry gas. The second flow rate is the total flow rate of the dry gas and the wet gas in the wet gas path 20.
It is also noted herein that mass flow controllers are capable of precise measurement and control of the mass flow of a gas or liquid. The first mass flow controller 60 adopts a mass flow controller based on a laminar flow principle or a thermal principle, the second mass flow controller 70 adopts a coriolis type mass flow controller, that is, the coriolis type mass flow controller is adopted as the flow meter of the wet gas path 20, the flow control valve adopts a high temperature and high humidity resistant medium proportional valve, and the coriolis type mass flow controller is formed by the first mass flow controller and the second mass flow controller.
In the flow control system 100 of the stack testing station provided by the embodiment of the present application, the second mass flow controller 70 is disposed at the downstream of the humidifier 50, so that a gas flow path from a flow control point to the section of the backpressure valve 170 is shortened compared to a case that the mass flow controller is disposed at the upstream of the humidifier 50 in the prior art. And because the gas flow path shortens, when the operating mode changes, the actual flow and the pressure of galvanic pile 200 entry can quick response for the air feed is sufficient or the air feed has reached the operating mode requirement, and the galvanic pile testboard can satisfy the simulation ability demand under the full operating mode. Meanwhile, the first mass flow controller 60 and the second mass flow controller 70 cooperate to control the air flow, so that the pressure in the stack 200 can be ensured to be within a preset range.
In one embodiment, with reference to fig. 1, the flow control system 100 of the stack testing platform further includes a first temperature sensor 80, a first pressure sensor 90 and a first humidity sensor 110, wherein the first temperature sensor 80, the first pressure sensor 90 and the first humidity sensor 110 are all disposed on the wet gas circuit 20 and located at the outlet of the humidifier 50. The first temperature sensor 80 is configured to detect a first temperature at an outlet of the humidifier 50, the first pressure sensor 90 is configured to detect a first pressure at the outlet of the humidifier 50, and the first humidity sensor 110 is configured to detect a first humidity at the outlet of the humidifier 50.
The flow control system 100 of the stack testing platform further includes a second temperature sensor 120, a second pressure sensor 130, and a second humidity sensor 140, wherein the second temperature sensor 120, the second pressure sensor 130, and the second humidity sensor 140 are all disposed between the second junction 40 and the stack 200. The second temperature sensor 120 is used for detecting a second temperature at the inlet of the stack 200, the second pressure sensor 130 is used for detecting a second pressure at the inlet of the stack 200, and the second humidity sensor 140 is used for detecting a second humidity at the inlet of the stack 200.
Here, the types of the first temperature sensor 80, the first pressure sensor 90, the first humidity sensor 110, the second temperature sensor 120, the second pressure sensor 130, and the second humidity sensor 140 are not limited as long as the respective detection functions can be achieved.
In one embodiment, the flow control system 100 of the stack testing station further includes a first heater 150 and a second heater 160, the first heater 150 is disposed on the dry gas path 10 and located downstream of the first mass flow controller 60, and the second heater 160 is disposed between the second junction 40 and the stack 200. The first heater 150 is used for heating dry air in the dry air path 10, the second heater 160 is used for heating gas to be flowed to the stack 200, and the temperature of the gas flowed to the stack 200 is in a preset range by the cooperation of the first heater 150 and the second heater 160.
Further, the flow control system 100 of the stack testing platform further includes a back pressure valve 170, wherein the back pressure valve 170 is disposed on one side of an outlet of the stack 200, so as to control a pressure difference between two sides of a proton exchange membrane of the stack 200 within a certain range.
Referring to fig. 2, fig. 2 is a flowchart of a flow control method of a stack testing station according to an embodiment of the present disclosure.
Another embodiment of the present application further provides a flow control method for a stack test board, including the steps of:
s110: acquiring a first temperature, a first pressure and a first humidity at an outlet of the humidifier 50;
s12: acquiring a second temperature, a second pressure and a second humidity at the inlet of the galvanic pile 200;
specifically, the stack 200 inlet gas pressure is controlled to a second pressure based on the membrane backpressure valve 170, and the stack 200 inlet gas temperature is controlled to a second temperature based on the heater.
S130: acquiring the total flow of dry gas of the dry gas introduced into the dry gas path 10 and the wet gas path 20;
s140: controlling a first flow rate of the gas in the dry gas path 10 and a second flow rate of the gas in the wet gas path 20 according to changes of a first temperature, a first pressure, a first humidity, a second temperature, a second pressure, a second humidity and a total flow rate of the dry gas;
the second flow rate is a total flow rate of the dry gas and the wet gas in the wet gas passage 20.
According to the flow control method for the galvanic pile test bench provided by the embodiment of the application, the second flow of the gas in the wet gas path 20 is controlled according to the first temperature, the first humidity, the second temperature, the second pressure, the second humidity and the change of the total flow of the dry gas, wherein the second flow is the total flow of the dry gas and the wet gas in the wet gas path 20, that is, the flow of the gas after the wet gas path 20 is humidified by the humidifier 50 is controlled. The gas flow path from the flow control point to the section of the backpressure valve 170 is shortened relative to the prior art where a mass flow controller is placed upstream of the humidifier 50. And because the gas flow path shortens, when the operating mode changes, the actual flow and the pressure of galvanic pile 200 entry can quick response for the air feed is sufficient or the air feed has reached the operating mode requirement, and the galvanic pile testboard can satisfy the simulation ability demand under the full operating mode. Meanwhile, the pressure in the stack 200 is ensured to be within a preset range by controlling the first flow rate and the second flow rate simultaneously.
Further, the first temperature, the first pressure and the first humidity are respectively obtained by the first temperature sensor 80, the first pressure sensor 90 and the first humidity sensor 110. The second temperature, the second pressure and the second humidity are respectively obtained by the second temperature sensor 120, the second pressure sensor 130 and the second humidity sensor 140. The first flow rate is controlled by a first mass flow controller 60 and the second flow rate is controlled by a second mass flow controller 70.
The first temperature is defined as T1, the first pressure is defined as P1, the first humidity is defined as RH1, the second temperature is defined as T2, the second pressure is defined as P2, the second humidity is defined as RH2, and the total flow rate of the dry gas is defined as Qa. Qa = Qa1+ Qa2, qa1 being the dry gas flow rate of the dry gas passage 10, and Qa2 being the dry gas flow rate of the wet gas passage 20. Wherein Qa, qa1, and Qa2 have unit sLPM, which is a volume flow rate.
According to the required target state, the water vapor flow rate Qw can be calculated,
where Psat2 is the saturated vapor pressure at the inlet of the stack 200, which can be calculated using the antoni equation, and is related to the temperature at that point, abbreviated as Psat2= f (T2).
The flow rate of the water vapor is obtained by the following formula:
psat1= f (T1), psat1 being the saturated vapor pressure at the outlet of the humidifier 50.
Similarly, the flow rate of water vapor is calculated from the parameters at the outlet of the humidifier 50 as:
wherein Psat1= f (T1). In one embodiment, RH1 is 100%. And since the water vapor at the inlet of the stack 200 originates from the wet gas path 20, then:
can obtain the product
The first flow rate controlled by the first mass flow controller 60 is:
the second flow rate controlled by the second mass flow controller 70 is:
Here, when the gas to be introduced to the cathode side is air, mr is 29. On the anode side, when the gas to be fed is hydrogen, mr is 2.
In one embodiment, the first flow rate of the dry gas path 10 is controlled as follows:
the second flow rate of the wet gas path 20 is:
thus, the pressure in the stack 200 is always kept within a preset range. Wherein m is the mass flow.
In one embodiment, the temperature of the humidifier 50 is kept constant during operation, i.e. the outlet dew point temperature of the humidifier 50 is kept at a stable value.
In other embodiments, the flow rate of the mass flow controllers of the dry gas circuit 10 and the wet gas circuit 20 may be corrected by determining whether the humidifier 50 is in a normal state and based on a mathematical model. Specifically, the method further comprises the following steps:
judging the relationship between the second humidity and the target humidity required by the galvanic pile 200;
specifically, the target humidity is preset and meets the performance requirement of the stack 200, and the second humidity is the detected humidity.
When the second humidity is not equal to the target humidity, the actual dew point temperature at the outlet of the humidifier 50 is obtained based on the deviation, and the first flow rate and the second flow rate are corrected.
Specifically, when the second humidity is less than the target humidity or the second humidity is greater than the target humidity, the actual dew point temperature at the outlet of the humidifier 50 is obtained based on the deviation between the second humidity and the target humidity, and the first flow rate and the second flow rate are corrected to always ensure that the pressure in the stack 200 is within the preset range.
Fig. 3 is a block diagram of an electronic device, which may be a terminal, of the flow control method for a stack test stand according to the embodiment of the present application, where an internal structure diagram of the electronic device may be as shown in fig. 3. The electronic device comprises a processor, a memory, a communication interface, a display screen and an input device which are connected through a system bus. Wherein the processor of the electronic device is configured to provide computing and control capabilities. The memory of the electronic equipment comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The communication interface of the electronic device is used for carrying out wired or wireless communication with an external terminal, and the wireless communication can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by a processor to implement a method for flow control in a stack test station. The display screen of the electronic equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the electronic equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the electronic equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 3 is a block diagram of only a portion of the architecture associated with the subject application, and does not constitute a limitation on the electronic devices to which the subject application may be applied, and that a particular electronic device may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In an exemplary embodiment, there is also provided an electronic device including: a processor; a memory for storing the processor-executable instructions; wherein the processor is configured to execute the instructions to implement the method as in the embodiments of the present application.
In an exemplary embodiment, a computer-readable storage medium is also provided, in which instructions, when executed by a processor of an electronic device, enable the electronic device to perform the method in the embodiments of the present application.
In an exemplary embodiment, a computer program product containing instructions is also provided, which when run on a computer, causes the computer to perform the method in the embodiments of the present application.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in the embodiments provided herein may include non-volatile and/or volatile memory, among others. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically Programmable ROM (EPROM), electrically Erasable Programmable ROM (EEPROM), or flash memory. Volatile memory can include Random Access Memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in a variety of forms such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), rambus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims (10)
1. A flow control method for a galvanic pile test bench is characterized by comprising the following steps:
acquiring a first temperature, a first pressure and a first humidity of an outlet of a humidifier;
acquiring a second temperature, a second pressure and a second humidity of the inlet of the galvanic pile;
acquiring the total flow of dry gas of the dry gas introduced into the dry gas path and the wet gas path;
controlling a first flow rate of gas in the dry gas path and a second flow rate of gas in the wet gas path according to changes in the first temperature, the first pressure, the first humidity, the second temperature, the second pressure, the second humidity, and the total flow rate of dry gas;
and the second flow rate is the total flow rate of the dry gas and the wet gas in the wet gas circuit.
2. The flow control method for a stack testing platform according to claim 1, wherein the first flow rate is Qa1, the first temperature is T1, the first pressure is P1, the first humidity is RH1, the second temperature is T2, the second pressure is P2, the second humidity is RH2, and the total flow rate of the dry gas is Qa; the Qa1, T1, P1, RH1, T2, P2, RH2 and Qa satisfy:
3. The method for controlling the flow of the stack test bench according to claim 1, wherein the second flow is defined as m, the first temperature is T1, the first pressure is P1, the first humidity is RH1, the second temperature is T2, the second pressure is P2, the second humidity is RH2, and the total flow of the dry gas is Qa; the m, T1, P1, RH1, T2, P2, RH2 and Qa satisfy:
4. The flow control method for the galvanic pile test bench according to claim 2 or 3, wherein the RH1 is 100%.
5. The flow control method for the galvanic pile test bench according to claim 1, further comprising the steps of:
judging the relation between the second humidity and the target humidity required by the galvanic pile;
and when the second humidity is not equal to the target humidity, acquiring the actual dew point temperature of the outlet of the humidifier based on deviation, and correcting the first flow and the second flow.
6. A flow control system of a galvanic pile test bench is characterized by comprising:
a dry gas circuit;
the wet gas path is connected with the dry gas path and is provided with a first junction and a second junction, the first junction is communicated with the gas source, and the second junction is communicated with the galvanic pile; a humidifier is arranged on the wet gas path;
the first mass flow controller is arranged on the dry gas path and used for controlling the first flow of the dry gas path according to the first temperature, the first pressure and the first humidity of the outlet of the humidifier, the second temperature, the second pressure and the second humidity of the inlet of the galvanic pile and the change of the total dry gas flow of the dry gas introduced into the dry gas path and the wet gas path;
and the second mass flow controller is arranged on the wet gas path, is positioned at the downstream of the humidifier and is used for controlling the second flow in the wet gas path according to the changes of the first temperature, the first pressure, the first humidity, the second temperature, the second pressure, the second humidity and the total flow of the dry gas.
7. The stack test stand flow control system of claim 6, further comprising:
the first temperature sensor, the first pressure sensor and the first humidity sensor are all arranged on the wet gas path and are positioned at the downstream of the humidifier; the first humidity sensor is used for detecting a first temperature of the humidifier outlet, the first pressure sensor is used for detecting a first pressure of the humidifier outlet, and the first humidity sensor is used for detecting a first humidity at the humidifier outlet;
the second temperature sensor, the second pressure sensor and the second humidity sensor are arranged between the second intersection point and the galvanic pile; the second temperature sensor is used for detecting a second temperature of the inlet of the galvanic pile, the second pressure sensor is used for detecting a second pressure of the inlet of the galvanic pile (200), and the second humidity sensor is used for detecting a second humidity of the inlet of the galvanic pile.
8. The stack test stand flow control system of claim 6, further comprising:
the first heater is arranged on the dry gas path and located at the downstream of the first mass flow controller, and the second heater is arranged between the second intersection point and the electric pile.
9. An electronic device comprising a memory and a processor, the memory storing a computer program, characterized in that the processor realizes the steps of the method of any of claims 1 to 5 when executing the computer program.
10. A computer readable storage medium, wherein instructions in the storage medium, when executed by a processor of an electronic device, enable the electronic device to perform the stack test stand flow control method of any of claims 1 to 5.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211496084.3A CN115832367A (en) | 2022-11-24 | 2022-11-24 | Flow control method and system for electric pile test bench, electronic equipment and storage medium |
Applications Claiming Priority (1)
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