CN115831881B - Tube seat for semiconductor packaging - Google Patents
Tube seat for semiconductor packaging Download PDFInfo
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- CN115831881B CN115831881B CN202211510252.XA CN202211510252A CN115831881B CN 115831881 B CN115831881 B CN 115831881B CN 202211510252 A CN202211510252 A CN 202211510252A CN 115831881 B CN115831881 B CN 115831881B
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- sealing block
- hole section
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- plug
- annular
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 162
- 230000007423 decrease Effects 0.000 claims abstract 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 18
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000001125 extrusion Methods 0.000 description 5
- 230000006978 adaptation Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000007123 defense Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
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- Connector Housings Or Holding Contact Members (AREA)
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Abstract
The application relates to a tube seat for semiconductor packaging, which comprises a seat body and a sealing cap, wherein a jack is formed in the seat body, a lead is inserted into the jack, a sealing part is fixedly arranged in the jack, a through hole for the lead to pass through is formed in the sealing part, the sealing part comprises a first sealing block and a second sealing block, the jack comprises a first hole section and a second hole section, the first hole section is inserted into the first sealing block in an adapting way, the second hole section is inserted into the second sealing block in an adapting way, the aperture of the first hole section gradually decreases in the direction of the first hole section pointing to the second hole section, and the aperture of the second hole section gradually increases in the direction of the first hole section pointing to the second hole section, and two opposite end faces of the first sealing block and the second sealing block are abutted and fixed. When the tube seat for the semiconductor package is used, the first hole section and the second hole section are shaped so that the first sealing block and the second sealing block cannot move in the jack, so that the sealing effect of the sealing part is ensured, the tube seat for the semiconductor package is better in sealing performance, and the service life is prolonged.
Description
Technical Field
The application relates to the field of semiconductor packaging, in particular to a tube seat for semiconductor packaging.
Background
With the rapid development of the semiconductor field, semiconductors are widely used in real life. When the product is manufactured, the semiconductor light-emitting element needs to be sealed and packaged in the tube seat, and the sealing effect of the tube seat has great influence on the quality of the product. A conventional semiconductor package stem generally includes a base body, a cap, and a metal block fixedly mounted on the base body for mounting a semiconductor light emitting element. The sealing cap is fixedly arranged on the seat body, and a sealing space for installing the semiconductor light-emitting element is enclosed between the sealing cap and the seat body. The socket body is provided with a jack, a lead is inserted into the jack, a columnar sealing part is fixedly arranged in the jack, the sealing part is provided with a through hole for the lead to pass through, and one end of the lead passes through the through hole and stretches into the sealing space. The surface of the sealing part, which is contacted with the jack, is tightly matched with the wall of the jack, and the surface of the sealing part, which is contacted with the lead, is tightly matched with the lead, so that the sealing of the sealing part on the jack on the seat body is realized.
The above-described conventional semiconductor package header has the following problems: the sealing part is easy to move in the jack of the seat body after long-term use, so that the sealing effect of the sealing part is weakened, and the sealing performance of the tube seat for the semiconductor package is poor and the service life is short.
Disclosure of Invention
In order to solve the technical problems of poor sealing performance and short service life of the prior art, the application provides a tube seat for semiconductor packaging.
The tube seat for the semiconductor package provided by the application adopts the following technical scheme:
The utility model provides a tube socket for semiconductor encapsulation, includes pedestal and closing cap, and closing cap fixed mounting is on the pedestal, encloses into the sealed space that is used for installing semiconductor light emitting component between closing cap and the pedestal, has seted up the jack on the pedestal, cartridge has the lead wire in the jack, still fixed mounting has sealing part in the jack, has seted up the perforation that supplies the lead wire to pass on the sealing part, and the one end of lead wire passes the perforation and stretches into in the sealed space, sealing part includes first sealing block and second sealing block, and first sealing block and second sealing block are round platform column structure, and the jack includes first hole section and second hole section, and first hole section and second hole section are connected, and first hole section and first sealing block adaptation cartridge, second hole section and second sealing block adaptation cartridge, and first hole section is located near sealed space one side on the pedestal, and the second hole section is located the sealed space one side of keeping away from of first hole section, and the aperture of first hole section is gradually reduced in the directional second hole section direction of first hole section, and the aperture of first hole section is gradually increased in the directional second hole section direction of first hole section and two opposite end faces of first sealing block and second sealing block.
By adopting the technical scheme, when the tube seat for the semiconductor package is used, the first sealing block and the second sealing block are respectively arranged in the first hole section and the second hole section, the opposite end faces of the first sealing block and the second sealing block are abutted and fixed, and the first hole section and the second hole section are shaped so that the first sealing block and the second sealing block cannot move in the jack, thereby ensuring the sealing effect of the sealing part, ensuring better sealing performance of the tube seat for the semiconductor package and prolonging the service life.
Optionally, the terminal surface that is used for with second sealing piece fixed connection of first sealing piece is provided with first grafting structure, is provided with the second grafting structure on the terminal surface that is used for with first sealing piece fixed connection of second sealing piece, and first grafting structure and second grafting structure can cartridge fixed fit.
Through adopting above-mentioned technical scheme, can be quick realize that the cartridge of first sealing piece and second sealing piece is fixed when installing first sealing piece and second sealing piece in first hole section and second hole section, it is very convenient to install.
Optionally, the first grafting structure is the spliced pole, annular draw-in groove has been seted up on the outer peripheral face of spliced pole, the second grafting structure is the spliced pole with spliced pole adaptation cartridge, the mounting groove has been seted up on the pore wall of spliced pole, install the joint subassembly in the mounting groove, the joint subassembly includes elastic component and chucking spare, the one end fixed connection of elastic component is on the diapire of mounting groove, the other end fixed connection of elastic component is on the chucking spare, the chucking spare can follow the degree of depth direction removal of mounting groove in the mounting groove, the chucking spare is in the natural state, the overhanging end of elastic component one end of keeping away from can stretch out the mounting groove and outwards extend the end, be provided with the extrusion inclined plane on the overhanging end, the bottom of spliced pole can be pushed up on the extrusion inclined plane and with overhanging end extrusion into the mounting groove when the spliced pole is inserted into the spliced pole in, the overhanging end of chucking spare can stretch out the mounting groove and the chucking is fixed to the chucking of realization to the chucking post in the annular draw-in groove of spliced pole under the elastic component's elasticity effect when the spliced pole is inserted completely.
Through adopting above-mentioned technical scheme, can be fixed with the grafting post chucking through joint subassembly when inserting the grafting post cartridge in the spliced eye to improve the fixed connection intensity of first sealing block and second sealing block, further ensure the sealed effect of sealing portion.
Optionally, the outer peripheral surfaces of the first sealing block and the second sealing block are provided with first annular sealing ring grooves, and first annular sealing rings are arranged in the first annular sealing ring grooves.
Through adopting above-mentioned technical scheme, first ring seal can improve the sealed effect to the jack.
Optionally, an external thread is arranged on the circumferential side surface of the base, an internal thread is arranged on the inner circumferential surface of the sealing cap, and the sealing cap is in threaded connection with the base.
By adopting the technical scheme, the threaded connection is quite convenient to operate, and the threaded connection can improve the sealing effect between the sealing cap and the seat body.
Optionally, a second annular sealing ring groove is further formed in one side, close to the bottom wall of the sealing cap, of the inner thread on the inner circumferential surface of the sealing cap, and a second annular sealing ring is installed in the second annular sealing ring groove.
By adopting the technical scheme, the second annular sealing ring can further improve the sealing effect between the sealing cap and the seat body.
Optionally, the external screw thread is close to sealed space one side and is formed with annular seal cooperation step on the pedestal, is provided with annular elastic piece on the inner peripheral surface of closing cap, and the outer lane of annular elastic piece is fixed to be set up on the inner peripheral surface of closing cap, and the inner circle of annular elastic piece is towards the center overhang setting of closing cap, the second annular seal groove sets up on the inner circle of annular elastic piece, and annular elastic piece can tightly be with the second annular seal on the circumference side of annular seal cooperation step.
Through adopting above-mentioned technical scheme, annular elastic piece can be better with second annular sealing washer top tightly on the circumference side of annular sealing fit step to improve the sealed effect between sealing cap and the pedestal.
Optionally, a plurality of annular elastic sheets are arranged in parallel at intervals.
By adopting the technical scheme, a plurality of annular elastic sheets form a plurality of sealing defense lines, so that the sealing effect between the sealing cap and the seat body is further improved.
Drawings
Fig. 1 is a schematic view showing the overall structure of a semiconductor package stem according to an embodiment of the present application;
Fig. 2 is an exploded view of a header for semiconductor package according to an embodiment of the present application;
FIG. 3 is a cross-sectional view of the housing;
FIG. 4 is a schematic structural view of a seal;
FIG. 5 is an exploded view of the seal;
FIG. 6 is a top view of a second seal block;
FIG. 7 is a cross-sectional view taken along line A-A of FIG. 6;
FIG. 8 is an enlarged view of the structure at B in FIG. 7;
FIG. 9 is a schematic cross-sectional view of the closure cap;
Fig. 10 is an enlarged view of the structure at C in fig. 9.
Reference numerals illustrate: 1. a base; 11. a jack; 111. a first bore section; 112. a second bore section; 12. an external thread; 13. annular sealing fit steps; 2. sealing the cap; 21. an internal thread; 22. an annular elastic sheet; 23. a second annular seal ring; 3. a metal block; 4. a lead wire; 5. a sealing part; 51. a first sealing block; 52. a second sealing block; 53. a first annular seal ring; 54. a plug-in column; 55. an annular clamping groove; 56. a plug hole; 57. a mounting groove; 6. a clamping assembly; 61. an elastic member; 62. a clamping piece; 621. pressing the inclined plane.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, an embodiment of the present application discloses a socket for semiconductor package, comprising a socket body 1, a cap 2, and a metal block 3 fixedly mounted on the socket body 1 for mounting a semiconductor light emitting element. The sealing cap 2 is fixedly arranged on the seat body 1, and a sealing space for installing the semiconductor light-emitting element is enclosed between the sealing cap 2 and the seat body 1. The socket body 1 is provided with a jack 11, the jack 11 is internally inserted with a lead 4, the jack 11 is also fixedly provided with a sealing part 5, the sealing part 5 is provided with a through hole for the lead 4 to pass through, and one end of the lead 4 passes through the through hole and stretches into the sealing space.
Referring to fig. 3 and 4, the sealing part 5 includes a first sealing block 51 and a second sealing block 52, and the first sealing block 51 and the second sealing block 52 each have a truncated cone-like structure. The jack 11 includes a first hole section 111 and a second hole section 112, the first hole section 111 and the second hole section 112 are connected, the first hole section 111 is inserted with the first sealing block 51, the second hole section 112 is inserted with the second sealing block 52, and two opposite end surfaces of the first sealing block 51 and the second sealing block 52 are abutted and fixed. The first hole section 111 is located on the side of the base body 1 close to the sealed space, the second hole section 112 is located on the side of the first hole section 111 away from the sealed space, the hole diameter of the first hole section 111 is gradually reduced in the direction of the first hole section 111 pointing to the second hole section 112, and the hole diameter of the second hole section 112 is gradually increased in the direction of the first hole section 111 pointing to the second hole section 112. The outer peripheral surfaces of the first sealing block 51 and the second sealing block 52 are also respectively provided with a first annular sealing ring groove, and a first annular sealing ring 53 is arranged in the first annular sealing ring groove. The first annular seal 53 can enhance the sealing effect against the insertion hole 11 when the first seal block 51 and the second seal block 52 are installed in the first hole section 111 and the second hole section 112, respectively.
Referring to fig. 5 and 6, a first plugging structure is provided on an end surface of the first sealing block 51 for being fixedly connected with the second sealing block 52, a second plugging structure is provided on an end surface of the second sealing block 52 for being fixedly connected with the first sealing block 51, and the first plugging structure and the second plugging structure can be fixedly matched in a plugging manner. In this embodiment, the first plugging structure is a plugging column 54, and an annular clamping groove 55 is formed on the outer peripheral surface of the plugging column 54. The second plug-in structure is a plug-in hole 56 which is matched and inserted with the plug-in column 54, the hole wall of the plug-in hole 56 is provided with a mounting groove 57, and the mounting groove 57 is internally provided with a clamping assembly 6. Referring again to fig. 7 and 8, the snap assembly 6 includes an elastic member 61 and a clip 62, the elastic member 61 being a spring in this embodiment. One end of the elastic member 61 is fixedly coupled to the bottom wall of the mounting groove 57, and the other end of the elastic member 61 is fixedly coupled to the chucking member 62. The clamping member 62 is guided in the mounting groove 57 in the depth direction of the mounting groove 57, and when the elastic member 61 is in a natural state, an end of the clamping member 62 away from the elastic member 61 can protrude out of the mounting groove 57 to form an overhanging end. The overhanging end is provided with an extrusion inclined surface 621, and when the plug-in post 54 is inserted into the plug-in hole 56, the bottom of the plug-in post 54 can press against the extrusion inclined surface 621 and extrude the overhanging end into the mounting groove 57. When the plug-in post 54 is completely inserted into the plug-in hole 56, the overhanging end of the clamping piece 62 can extend out of the mounting groove 57 under the elastic action of the elastic piece 61 and be clamped in the annular clamping groove 55 of the plug-in post 54 to realize clamping and fixing of the plug-in post 54. The design has the advantages that the first sealing block 51 and the second sealing block 52 can be quickly inserted and fixed when being installed in the first hole section 111 and the second hole section 112, the installation is very convenient, the inserting column 54 can be clamped and fixed through the clamping assembly 6, the fixed connection strength of the first sealing block 51 and the second sealing block 52 is improved, and the sealing effect of the sealing part 5 is ensured.
Referring to fig. 2 and 9, an external thread 12 is provided on a circumferential side surface of the housing 1, an internal thread 21 is provided on an inner circumferential surface of the cap 2, and the cap 2 is screw-coupled with the housing 1. Two annular elastic pieces 22 are arranged on the inner peripheral surface of the sealing cap 2 at intervals on one side of the internal thread 21, which is close to the bottom wall of the sealing cap 2, and the outer ring of each annular elastic piece 22 is fixedly arranged on the inner peripheral surface of the sealing cap 2, and the inner ring of each annular elastic piece 22 is arranged in a overhanging manner towards the center of the sealing cap 2. Referring to fig. 10 again, a second annular seal ring groove is further formed in the inner ring of the annular elastic piece 22, and a second annular seal ring 23 is installed in the second annular seal ring groove. With continued reference to fig. 2, an annular seal engagement step 13 is formed on the seat body 1 on the side of the external thread 12 close to the seal space. When the seal cap 2 is mounted on the seat body 1 in a threaded connection manner, the annular elastic piece 22 can press the second annular seal ring 23 against the circumferential side surface of the annular seal fit step 13. The advantage of this design is that the annular elastic piece 22 can better press the second annular sealing ring 23 against the circumferential side of the annular sealing matching step 13, thereby improving the sealing effect between the sealing cap 2 and the seat body 1.
The implementation principle of the embodiment of the application is as follows: when the tube seat for the semiconductor package is used, the first sealing block 51 and the second sealing block 52 are respectively arranged in the first hole section 111 and the second hole section 112, the plug-in post 54 of the first sealing block 51 and the plug-in hole 56 of the second sealing block 52 are fixedly inserted, and the first hole section 111 and the second hole section 112 are shaped so that the first sealing block 51 and the second sealing block 52 cannot move in the jack 11, so that the sealing effect of the sealing part 5 is ensured. Further, the first annular seal ring 53 on the first seal block 51 and the second seal block 52 can further improve the sealing effect on the insertion hole 11. In addition, with sealing cap 2 threaded connection on pedestal 1, threaded connection can improve the sealed effect between sealing cap 2 and the pedestal 1, and annular elastic piece 22 can better with second annular sealing washer 23 top tightly on annular seal cooperation step 13's circumference side to improve the sealed effect between sealing cap 2 and the pedestal 1, make the leakproofness of the tube socket for semiconductor package better, prolonged life.
The embodiments of the present application are all preferred embodiments of the present application, and are not intended to limit the scope of the present application, wherein like reference numerals are used to refer to like elements throughout. Therefore: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (8)
1. The utility model provides a tube seat for semiconductor encapsulation, including pedestal (1) and closing cap (2), closing cap (2) fixed mounting is on pedestal (1), enclose into the sealed space that is used for installing semiconductor light emitting component between closing cap (2) and the pedestal (1), jack (11) have been seted up on pedestal (1), insert in jack (11) and be equipped with lead wire (4), still fixed mounting has sealing part (5) in jack (11), set up the perforation that supplies lead wire (4) to pass on sealing part (5), the one end of lead wire (4) passes the perforation and stretches into the sealed space in, characterized in that, sealing part (5) are including first sealing block (51) and second sealing block (52), first sealing block (51) and second sealing block (52) are round platform column structure, jack (11) are including first hole section (111) and second hole section (112), first hole section (111) and second hole section (112) are connected, first hole section (111) and first sealing block (51) adapt to insert, first sealing block (51) are located one side of second sealing block (112) far away from first sealing block (112) and second sealing block (112) are located in the sealed space of one side (1), the aperture of the first hole section (111) gradually decreases in the direction that the first hole section (111) points to the second hole section (112), the aperture of the second hole section (112) gradually increases in the direction that the first hole section (111) points to the second hole section (112), and two opposite end surfaces of the first sealing block (51) and the second sealing block (52) are abutted and fixed.
2. The semiconductor package header according to claim 1, wherein the first sealing block (51) is provided with a first plug structure on an end face for fixedly connecting with the second sealing block (52), the second sealing block (52) is provided with a second plug structure on an end face for fixedly connecting with the first sealing block (51), and the first plug structure and the second plug structure can be fixedly fitted by plug.
3. The header for semiconductor package according to claim 2, wherein the first plug structure is a plug-in post (54), an annular clamping groove (55) is formed in an outer circumferential surface of the plug-in post (54), the second plug structure is a plug-in hole (56) for being plugged with the plug-in post (54), a mounting groove (57) is formed in a wall of the plug-in hole (56), a clamping assembly (6) is mounted in the mounting groove (57), the clamping assembly (6) comprises an elastic member (61) and a clamping member (62), one end of the elastic member (61) is fixedly connected to a bottom wall of the mounting groove (57), the other end of the elastic member (61) is fixedly connected to the clamping member (62), the clamping member (62) can move in the mounting groove (57) in a guiding manner in a depth direction of the mounting groove (57), one end of the elastic member (62) away from the elastic member (61) can extend out of the mounting groove (57) to form an overhanging end when the elastic member (61) is in a natural state, an extruding inclined surface (621) is arranged on the overhanging end, the plug-in post (54) can be extruded into the inclined surface (57) when the plug-in the mounting groove (56) is plugged into the bottom of the mounting groove (54), when the plug-in column (54) is completely inserted into the plug-in hole (56), the overhanging end of the clamping piece (62) can extend out of the mounting groove (57) under the elastic action of the elastic piece (61) and be clamped in the annular clamping groove (55) of the plug-in column (54) to realize clamping and fixing of the plug-in column (54).
4. A semiconductor package header according to any one of claims 1 to 3, wherein the outer peripheral surfaces of the first sealing block (51) and the second sealing block (52) are each provided with a first annular seal ring groove in which a first annular seal ring (53) is fitted.
5. A semiconductor package header according to any one of claims 1 to 3, wherein the circumferential side surface of the housing (1) is provided with external threads (12), and the inner circumferential surface of the cap (2) is provided with internal threads (21), and the cap (2) is screwed to the housing (1).
6. The semiconductor package stem according to claim 5, wherein a second annular seal ring groove is further provided on a side of the inner peripheral surface of the cap (2) near the bottom wall of the cap (2) with the internal thread (21), and a second annular seal ring (23) is installed in the second annular seal ring groove.
7. The semiconductor package stem for semiconductor package according to claim 6, wherein an annular seal fit step (13) is formed on a side of the external thread (12) of the stem (1) close to the seal space, an annular elastic piece (22) is provided on the inner peripheral surface of the cap (2), an outer ring of the annular elastic piece (22) is fixedly provided on the inner peripheral surface of the cap (2), an inner ring of the annular elastic piece (22) is overhanging toward the center of the cap (2), the second annular seal ring groove is provided on the inner ring of the annular elastic piece (22), and the annular elastic piece (22) can press the second annular seal ring (23) tightly against the circumferential side surface of the annular seal fit step (13).
8. The semiconductor package header according to claim 7, wherein a plurality of the annular elastic pieces (22) are arranged in parallel at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211510252.XA CN115831881B (en) | 2022-11-29 | 2022-11-29 | Tube seat for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211510252.XA CN115831881B (en) | 2022-11-29 | 2022-11-29 | Tube seat for semiconductor packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115831881A CN115831881A (en) | 2023-03-21 |
| CN115831881B true CN115831881B (en) | 2024-04-30 |
Family
ID=85532557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211510252.XA Active CN115831881B (en) | 2022-11-29 | 2022-11-29 | Tube seat for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115831881B (en) |
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| CN214706578U (en) * | 2021-05-29 | 2021-11-12 | 江苏昂德光电科技有限公司 | Detachable packaging structure of semiconductor laser diode |
| CN216387502U (en) * | 2021-11-09 | 2022-04-26 | 国网浙江省电力有限公司双创中心 | Optical cable joint box and connection structure of optical cable inlet wire thereof |
| CN114696209A (en) * | 2020-12-28 | 2022-07-01 | 新光电气工业株式会社 | Tube seat for semiconductor package |
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2022
- 2022-11-29 CN CN202211510252.XA patent/CN115831881B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003204238A (en) * | 2002-01-08 | 2003-07-18 | Seiko Epson Corp | Piezoelectric device, sealing method therefor, portable telephone equipment utilizing piezoelectric device and electronic equipment utilizing piezoelectric device |
| WO2008023746A1 (en) * | 2006-08-22 | 2008-02-28 | Mitsubishi Chemical Corporation | Semiconductor device member, liquid for forming semiconductor device member, method for manufacturing semiconductor device member, and liquid for forming semiconductor device member using the method, phosphor composition, semiconductor light emitting device, illuminating apparatus and image display apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN115831881A (en) | 2023-03-21 |
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