CN115831588A - Preparation method and system of high-density chip inductor blank - Google Patents
Preparation method and system of high-density chip inductor blank Download PDFInfo
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Abstract
The invention discloses a preparation method of a high-density chip inductor blank, which relates to the field of chip power inductors.
Description
Technical Field
The invention relates to the field of surface-mounted power inductors, in particular to a method and a system for preparing a high-density surface-mounted inductor blank.
Background
The patch type power inductor is used as a basic electronic element and is widely applied to various electronic devices or electronic control circuits. At present, various electronic devices develop towards miniaturization, light weight and multiple functions, the number of applied patch type power inductors is more and more, and meanwhile, new requirements for miniaturization, low installation thickness, large inductance and the like are also provided for the patch type power inductors. The inductance volume develops toward miniaturization, and the internal coil occupies certain space, and the result is that product outline and coil fit clearance are little, and the powder is difficult to fill. In addition, the conventional preparation process of the patch type power inductor usually prepares an inductor blank by directly filling powder into a die and performing compression molding, and the common preparation process is as follows: the method comprises the steps of firstly manufacturing a T-shaped or I-shaped component, winding on a T-shaped or I-shaped columnar bulge, then filling powder and pressing, wherein the initial powder is in a relatively loose state and needs to be pressed by large pressure, and the coil is easy to deform due to the large pressing pressure in the process. In summary, the main problems of the chip inductor prepared by the existing preparation process are as follows:
in the preparation process of the chip inductor, if the chip inductor is pressed by large pressure, the coil is easy to deform due to the large pressing pressure, so that the performance is reduced; and because the coil size of present paster inductance is close to the finished size of inductance, if reduce the pressure of suppression, then can lead to powder density to hang down excessively, and then has aroused the emergence of the exposed, magnetic leakage scheduling problem of coil, produces the hidden danger to the follow-up reliability and the security of using of inductance, and this makes the manufacturing degree of difficulty and the cost of small-size inductance increase by a wide margin moreover.
Disclosure of Invention
In order to improve the compacted density of the chip inductor and reduce the deformation amount generated by a coil, the invention provides a preparation method of a high-density chip inductor green body, which adopts a split type pressing die to press powder into a chip inductor green body consisting of a cup-shaped magnet and a cylindrical magnet arranged in the cup-shaped magnet by a step-by-step multi-stage pressing method; a groove is formed between the cup-shaped magnet and the cylindrical magnet; the split type pressing die comprises an upper die pressing head, a middle die and a lower die pressing head, wherein the lower die pressing head comprises a first lower die pressing head and a second lower die pressing head which are arranged in a split manner, and the first lower die pressing head can penetrate through the second lower die pressing head; the upper die pressure head, the lower die pressure head and the side wall of the forming hole of the middle die jointly form a cavity for preparing a chip inductor blank.
Further, the preparation method comprises the following steps:
s1: loading a preset amount of powder material into the cavity, and starting the upper die pressing head, the first lower die pressing head and the second lower die pressing head to enable the pressing heads to gather towards the middle of the cavity until the distance value between the upper die pressing head and the second lower die pressing head is equal to the first distance;
s2: first-stage pressing of powder: controlling the current positions of the upper die pressing head and the second lower die pressing head to be unchanged, starting the first lower die pressing head and controlling the first lower die pressing head to upwards press at a first preset pressure, so that the powder in the cavity flows to the periphery of the cavity from the center of the cavity, and entering the step S3 when the height of the powder on the periphery of the cavity is higher than the height of the powder at the center of the cavity by a preset size; the center of the cavity is a space corresponding to the cylindrical magnet, and the peripheral side of the cavity is a space corresponding to the cup-shaped magnet;
s3: and (3) secondary pressing of powder: keeping the first lower die pressing head to continuously press at a first preset pressure, simultaneously starting and controlling the upper die pressing head and the second lower die pressing head to respectively press downwards and upwards at a second preset pressure, at the moment, powder in the cavity flows to the center of the cavity from the periphery of the cavity, and when the height of the powder corresponding to the periphery of the cavity is consistent with the height of the powder corresponding to the center of the cavity, adjusting the pressing pressure of the first lower die pressing head to the second preset pressure and maintaining the pressure for a preset time to obtain a chip inductor blank.
Further, the second preset pressure is greater than the first preset pressure; the value range of the first preset pressure is 1t/cm 2 To 13t/cm 2 (ii) a The value range of the second preset pressure is 2t/cm 2 To 15t/cm 2 。
Further, the first distance is larger than a preset height value of the chip inductor blank.
The invention also provides a preparation system of the high-density chip inductor green body, which adopts a split type pressing die to press the powder material into the chip inductor green body consisting of the cup-shaped magnet and the cylindrical magnet arranged in the cup-shaped magnet by a step-by-step multi-stage pressing method; a groove is formed between the cup-shaped magnet and the cylindrical magnet; the split type pressing die comprises an upper die pressing head, a middle die and a lower die pressing head, wherein the lower die pressing head comprises a first lower die pressing head and a second lower die pressing head which are arranged in a split manner, and the first lower die pressing head can penetrate through the second lower die pressing head; and the upper die pressing head, the lower die pressing head and the side wall of the forming hole of the middle die jointly form a cavity for preparing the chip inductor blank.
Further, the preparation system comprises:
the preparation module is used for loading a preset amount of powder into the cavity and starting the upper die pressing head, the first lower die pressing head and the second lower die pressing head so that the pressing heads gather towards the middle of the cavity until the distance value between the upper die pressing head and the second lower die pressing head is equal to the first distance;
the first-stage pressing module is used for controlling the current positions of the upper die pressing head and the second lower die pressing head to be unchanged, starting the first lower die pressing head and controlling the first lower die pressing head to upwards press at a first preset pressure, so that the powder in the cavity flows to the periphery of the cavity from the center of the cavity, and entering the step S3 when the height of the powder on the periphery of the cavity is higher than the height of the powder at the center of the cavity by a preset size; the center of the cavity is a space corresponding to the cylindrical magnet, and the peripheral side of the cavity is a space corresponding to the cup-shaped magnet;
and the second-stage pressing module is used for keeping the first lower die pressing head to continue to press at the first preset pressure, starting and controlling the upper die pressing head and the second lower die pressing head to respectively press downwards and upwards at the second preset pressure, at the moment, the powder in the cavity flows to the center of the cavity from the periphery of the cavity, and when the height of the powder corresponding to the periphery of the cavity is consistent with the height of the powder corresponding to the center of the cavity, the pressing pressure of the first lower die pressing head is adjusted to the second preset pressure and is maintained for a preset time to obtain the chip inductor blank.
Further, the second preset pressure is greater than the first preset pressure; the value range of the first preset pressure is 1t/cm 2 To 13t/cm 2 (ii) a The value range of the second preset pressure is 2t/cm 2 To 15t/cm 2 。
Further, the first distance is larger than a preset height value of the chip inductor blank.
Compared with the prior art, the invention at least has the following beneficial effects:
(1) According to the chip inductor blank, the first lower die pressing head and the second lower die pressing head which are arranged in a split mode are pressed in a grading mode, so that powder in the chip inductor blank has better fluidity, the compaction density and the magnetic conductivity of the chip inductor blank are greatly improved, the comprehensive performance of the chip inductor is remarkably improved, the chip inductor blank has higher inductance and saturation current and lower direct current resistance under the same design conditions of raw materials, structure and size, and the defects caused by a powder filling and pressing process in the prior art can be avoided;
(2) The cup-shaped magnet part of the paster inductance blank can play a certain supporting role in the subsequent preparation process of the paster inductance, the deformation of the coil can be effectively reduced, and the bad phenomena of exposure, deformation and even breakage of the coil are avoided, so that the shielding performance and the inductance value of the inductor are ensured, and the comprehensive performance of the product is greatly improved.
Drawings
Fig. 1 is a flow chart of a preparation method of a high-density chip inductor blank;
fig. 2 is a block diagram of a system for manufacturing a high-density chip inductor blank;
fig. 3 is a schematic structural diagram of a chip inductor blank;
FIG. 4 is a schematic diagram of a coil structure;
FIG. 5 is a schematic structural view of a flat sheet blank;
fig. 6 is a schematic view of a combined structure of a chip inductor blank and a coil;
fig. 7 is a schematic view of a combined structure of a chip inductor blank, a coil and a flat plate blank;
FIG. 8 is a cross-sectional view of a cavity formed between the upper die ram, the middle die and the lower die ram;
fig. 9 is a diagram of a forming process of the chip inductor blank in the step pressing process.
In the figure: 1. a chip inductor blank; 11. a cup-shaped magnet; 12. a cylindrical magnet; 13. a groove; 2. a coil; 21. a tip; 3. a flat plate blank; 31. an electrode tank; 41. a first lower die ram; 42. a second lower die ram; 5. an upper die ram; 6. a middle mold; 61. a cavity; 7. and (3) powder material.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
Example one
In order to reduce the deformation quantity of the coil in the existing powder filling process and simultaneously improve the pressing density of powder and avoid the bad phenomena of exposure, deformation and even breakage of the coil in the pressing process, as shown in figure 1, the invention provides a preparation method of a high-density chip inductor blank body, which adopts a split type pressing die to press powder into the chip inductor blank body 1 which is composed of a cup-shaped magnet 11 and a cylindrical magnet 12 arranged in the cup-shaped magnet 11 and is shown in figure 3 by a step-by-step multi-stage pressing method; a groove 13 is formed between the cup-shaped magnet 11 (in particular, a kidney-shaped or annular magnet) and the cylindrical magnet 12; the split type pressing die comprises an upper die pressing head 5, a middle die 6 and a lower die pressing head, the lower die pressing head comprises a first lower die pressing head 41 and a second lower die pressing head 42 which are arranged in a split manner, and the first lower die pressing head 41 can penetrate through the second lower die pressing head 42; as shown in fig. 8, the upper die pressing head 5, the lower die pressing head and the side wall of the molding hole of the middle die 6 together form a cavity 61 for preparing the chip inductor blank 1 (the upper die pressing head 5 can extend into the cavity 61 from top to bottom, and the lower die pressing head can extend into the cavity 61 from bottom to top).
The preparation method comprises the following steps:
s1: a predetermined amount of the powder 7 is charged into the cavity 61 and the upper punch press head is started5. The first lower die ram 41 and the second lower die ram 42 to gather the rams toward the middle of the cavity 61 until the distance between the upper die ram 5 and the second lower die ram 42 is equal to the first distance d 1 ；
Note that the first pitch d 1 Need carry out reasonable settlement according to the height of predetermineeing of paster inductance blank, if the interval is too big, can lead to going up the die cavity space volume that forms between mould pressure head, well mould and the lower mould pressure head too big to lead to the suppression effect of powder material not good or can not play the effect of suppression.
In this embodiment, the powder is a soft magnetic alloy powder, and the composition of the soft magnetic alloy powder includes: epoxy resin, zinc stearate, fe-Si-B-Nb-Cu nanocrystalline magnetically soft alloy powder and carbonyl iron powder.
The forming process of steps S2 and S3 is shown in fig. 9.
S2: first-stage pressing of powder: controlling the current positions of the upper and second lower squeeze heads 5 and 42 to be constant, starting the first lower squeeze head 41 and controlling it to be at a first preset pressure (3 t/cm) 2 ) Upward stamping, so that the powder 7 in the cavity 61 flows from the center of the cavity 61 to the periphery of the cavity 61 (at this time, the powder in the center of the cavity in the cavity is gradually reduced, and the powder on the periphery of the cavity is gradually increased), and when the height of the powder 7 on the periphery of the cavity 61 is higher than the height of the powder 7 in the center of the cavity 61 by a preset size, the step S3 is performed; the center of the cavity 61 is a space corresponding to the cylindrical magnet 12, and the peripheral side of the cavity 61 is a space corresponding to the cup-shaped magnet 11;
s3: and (3) secondary pressing of powder: keeping the first lower molding press 41 at the first preset pressure while starting and controlling the upper and second lower molding presses 5 and 42 at the second preset pressure (6 t/cm) 2 ) And respectively downwards and upwards punching, wherein at the moment, the powder 7 in the cavity 61 flows to the center of the cavity 61 from the peripheral side of the cavity 61, when the height of the powder 7 corresponding to the peripheral side of the cavity 61 is consistent with the height of the powder 7 corresponding to the center of the cavity 61, the punching pressure of the first lower die pressing head 41 is adjusted to a second preset pressure, so that the split type die is kept in a relatively static punching state, and the pressure is maintained for a preset time (2 s), and the chip inductor blank 1 is obtained.
It should be noted that when the height of the powder material corresponding to the peripheral side of the cavity is consistent with the height of the powder material corresponding to the center of the cavity, the preset height value of the chip inductor blank (i.e. the second distance d in fig. 9) is reached 2 )。
According to the invention, the first-stage pressing and the second-stage pressing of the powder are realized through the first lower die pressing head and the second lower die pressing head which are arranged in a split manner, so that the powder of the cylindrical magnet part has better fluidity, the compaction density of the cylindrical magnet in the chip inductor blank is greatly improved, and the chip inductor blank has higher magnetic conductivity.
The second preset pressure is greater than the first preset pressure; the value range of the first preset pressure is 1t/cm 2 To 13t/cm 2 (ii) a The value range of the second preset pressure is 2t/cm 2 To 15t/cm 2 。
The first distance is larger than a preset height value of the chip inductor blank 1.
In this embodiment, after the chip inductor blank 1 is prepared, the method further includes:
s4: preparing a chip inductor based on the chip inductor blank 1;
the patch inductor further comprises a coil shown in fig. 4 and a flat plate blank shown in fig. 5; the step S4 specifically includes:
s41: prefabricating a coil 2 and a flat plate blank 3, wherein the flat plate blank 3 is provided with two electrode grooves 31, and the electrode grooves 31 are used for leading out two end heads 21 of the coil 2;
the step S41 specifically includes:
prefabricating a coil: selecting flat enameled copper wires with preset specifications, winding enameled wires on a winding jig through an automatic winding machine, and horizontally bending two ends of the enameled wires to obtain coils with preset sizes and shapes;
prefabricating a flat plate blank: and (3) putting the powder into a second die with a preset structure and size, and starting a forming press to sequentially perform press forming, pressure maintaining and demolding on the powder at a preset pressure so as to obtain a flat plate blank with two electrode grooves.
In this example, the green sheet is pressedThe pressure used was 6t/cm 2 The dwell time was 2s.
S42: placing a coil 2 in a groove 13 of a chip inductor blank 1, covering a flat blank 3 on the tops of the chip inductor blank 1 and the coil 2 (see the combined structural schematic diagrams in fig. 6 and 7), respectively introducing two ends 21 of the coil 2 to two electrode grooves 31 corresponding to the flat blank 3 to obtain an inductor primary blank, starting a hot-press forming die to sequentially perform stamping, pressure maintaining and demolding on the inductor primary blank to obtain an inductor blank, and baking and curing the inductor blank to obtain an inductor semi-finished product;
wherein the hot-pressing pressure adopted during hot-pressing molding is 4t/cm 2 The pressure maintaining time is 120s, and the heat preservation temperature is 180 ℃. The baking and curing treatment of the inductor blank specifically comprises the following steps: and (3) putting the inductor blank into an oven for heating and raising the temperature, so that the epoxy resin in the inductor blank is subjected to a curing reaction. The resin adopted here is epoxy resin, and only has small volume shrinkage during curing, so that the inductance blank body is not deformed after curing and molding. Specifically, the baking curing temperature is 190 ℃, baking equipment with a temperature rise and drop step curve can be selected here, heat preservation is carried out for 2 hours, and finally an inductance semi-finished product is obtained, wherein the size of the inductance semi-finished product is 2.0 multiplied by 1.6 multiplied by 1.0mm.
According to the invention, after the chip inductor blank body 1 is prefabricated in advance, the coil is arranged, so that the deformation quantity of the coil generated when the initial powder is in a relatively loose state and needs to be pressed by larger pressure in the prior art is greatly reduced. In addition, in the invention, the annular part of the cup-shaped magnet can play a certain supporting role in the process of starting the hot-press forming die to sequentially perform stamping, pressure maintaining and demoulding on the inductance primary blank body in the step S42, so that the deformation of the coil can be effectively reduced, and the bad phenomena of exposure, deformation and even breakage of the coil are avoided, thereby ensuring the shielding performance and inductance value of the inductor and greatly improving the comprehensive performance of the product.
S43, spraying a layer of epoxy resin protective material on the surface of the inductor semi-finished product through constant-temperature heating spraying equipment, and baking the sprayed inductor semi-finished product (baking conditions are set in the embodiment that baking is carried out for 2 hours at 150 ℃) so as to cure the epoxy resin on the surface of the inductor semi-finished product;
s44: and removing the epoxy resin protective material at the position of the electrode groove 31 of the semi-finished inductor product and the paint coats of the two ends 21 of the coil 2 by adopting laser paint stripping equipment, and sequentially electroplating a copper layer, a nickel layer and a tin layer on the ends 21 with the paint coats stripped to obtain the finished inductor product, namely the chip inductor.
According to the invention, the inductor blank, the coil and the flat blank are prefabricated respectively, and then are combined and pressed to be molded (step S41-step S44), so that the density of the side wall of the inductor blank is greatly improved, and the defects caused by a powder filling pressing process in the prior art are avoided.
In this example, the prepared sample of the chip inductor was tested, and the average inductance Ls of the sample was 1.142 μ H, the average saturation current Isat was 5.03A, and the average dc resistance Rdc was 28.5m Ω under the condition of 1V/1MHz by using an impedance analyzer.
The method comprises the steps of prefabricating a chip inductor blank in advance, performing first-stage pressing and second-stage pressing on the chip inductor blank in the prefabricating process, controlling the current positions of an upper die pressing head and a second lower die pressing head to be unchanged in the first-stage pressing process, starting the first lower die pressing head and controlling the first lower die pressing head to press upwards at a first preset pressure, enabling powder in a cavity to flow from the center of the cavity to the periphery of the cavity (the flowability of the powder is improved), and entering second-stage pressing when the height of the powder on the periphery of the cavity is higher than the preset height of the powder at the center of the cavity, keeping the first lower die pressing head to press continuously at the first preset pressure in the second-stage pressing process, starting and controlling the upper die pressing head and the second lower die pressing head to press downwards and upwards at a second preset pressure respectively, at the moment, enabling the powder in the cavity to flow from the periphery of the cavity to the center of the cavity (the flowability of the powder is improved), adjusting the pressing pressure of the first lower die pressing head to the second preset pressure and keeping the pressure to flow towards the periphery of the cavity when the height of the powder corresponding to the center of the cavity reaches the same height of the cavity, so that the powder corresponding to the cavity, and the inductor blank is pressed at the high-stage, and the inductor blank has the high-density, and the inductor blank is remarkably improved in the inductor blank pressing density.
Example two
This example includes two comparative examples, where comparative example 1 is:
preparing a chip inductor blank by using an integrated die, wherein other preparation steps and conditions are the same as those of the first embodiment of the invention, preparing a chip inductor under the conditions, and testing the performance of the chip inductor; the method specifically comprises the following steps:
in the comparative example, the lower die pressing head of the die is of an integral structure, a cavity formed by the upper die pressing head, the lower die pressing head and the middle die is consistent with the shape of the chip inductor blank, and the chip inductor blank is prepared in a one-step forming mode. The soft magnetic alloy powder, the enameled wire, the binder, the lubricant and the external insulating coating material which are the same as those in the first embodiment are selected, and the parameters of the sizes and the shapes of the chip inductor blank and the flat plate blank in the inductor, the number of turns and the shape of the wound coil, the electrode structure and the size, the size of the inductor finished product and the like are the same as those in the first embodiment. The preparation method of the patch inductor blank in the comparative example specifically comprises the following steps:
s1, prefabricating a chip inductor blank: loading a preset amount of soft magnetic alloy powder into the cavity, starting a forming press to perform punch forming, and obtaining a chip inductor blank;
wherein the molding pressure is 6t/cm 2 The dwell time was 2s.
The remaining steps of the chip inductor were the same as in the first embodiment.
The main properties of the prepared inductor samples were tested using the same performance testing equipment and conditions as in example one, and the measured performance parameters are shown in table 1.
Comparative example 2 is:
the chip inductor is prepared by the steps of prefabricating a T-shaped magnet, winding on the T-shaped magnet, filling powder, hot-press molding, spraying and manufacturing electrodes which are commonly used in the industry. The same soft magnetic alloy composite powder material, the same enameled wire, the same adhesive, the same lubricant and the same external insulation coating material as those in the embodiment 1 are selected, parameters such as the size and the shape of a cylindrical magnet in the inductor, the number and the shape of turns of a coil, the electrode structure and the size of an electrode, the size of a finished inductor product and the like are the same as those in the embodiment 1, but a prefabricated chip inductor blank, a coil and a flat plate blank are not adopted and combined to prepare the chip inductor. The preparation method of the patch inductor in the comparative example specifically comprises the following steps:
wherein the cold pressing pressure adopted when pressing the magnet is 6t/cm 2 Keeping the pressure for 2s, baking at 150 ℃ for 30min;
wherein the hot pressing pressure adopted in the hot pressing is 4t/cm 2 The pressure maintaining time is 120s, and the heat preservation temperature is 180 ℃. And (3) baking and curing the inductor blank, specifically, putting the inductor blank into an oven to heat and raise the temperature, so that the resin in the inductor blank is subjected to a curing reaction. The resin adopted here is epoxy resin, and only has small volume shrinkage during curing, so that the inductance blank body is not deformed after curing and molding. Specifically, the baking curing temperature is 190 ℃, baking equipment with a temperature rising and decreasing step curve can be selected here, heat preservation is carried out for 2 hours, and finally an inductance semi-finished product is obtained, wherein the size of the inductance semi-finished product is 2.0 multiplied by 1.6 multiplied by 1.0mm;
step 4, spraying: the spraying process is the same as the step S43 in the first embodiment;
The main properties of the prepared inductor samples were tested using the same performance testing equipment and conditions as in example one, and the measured performance parameters are shown in table 1.
Table 1 performance parameters of the chip inductors obtained in example one and comparative examples 1 to 2
By comparing the first embodiment with the first embodiment and the second embodiment, it can be shown that the chip inductor green body of the chip inductor is prepared by adopting a step pressing manner, the prepared chip inductor green body has higher density, and the increase of the density brings about the increase of the magnetic conductivity, so that the chip inductor has higher inductance (Ls), saturation current (Isat) and lower direct current resistance (Rdc) under the condition of the same raw materials, size and structure design, and the overall performance of the chip inductor is more excellent.
EXAMPLE III
As shown in fig. 2, the invention further provides a system for preparing a high-density chip inductor green body, wherein a split type pressing die is adopted to press powder material into a chip inductor green body consisting of a cup-shaped magnet and a cylindrical magnet arranged in the cup-shaped magnet by a step-by-step multi-stage pressing method; a groove is formed between the cup-shaped magnet and the cylindrical magnet; the split type pressing die comprises an upper die pressing head, a middle die and a lower die pressing head, wherein the lower die pressing head comprises a first lower die pressing head and a second lower die pressing head which are arranged in a split manner, and the first lower die pressing head can penetrate through the second lower die pressing head; the upper die pressure head, the lower die pressure head and the side wall of the forming hole of the middle die jointly form a cavity for preparing a chip inductor blank.
The preparation system comprises:
the preparation module is used for loading a preset amount of powder into the cavity and starting the upper die pressing head, the first lower die pressing head and the second lower die pressing head so that the pressing heads gather towards the middle of the cavity until the distance value between the upper die pressing head and the second lower die pressing head is equal to the first distance;
the first-stage pressing module is used for controlling the current positions of the upper die pressing head and the second lower die pressing head to be unchanged, starting the first lower die pressing head and controlling the first lower die pressing head to upwards press at a first preset pressure, so that the powder in the cavity flows to the periphery of the cavity from the center of the cavity, and entering the step S3 when the height of the powder on the periphery of the cavity is higher than the height of the powder at the center of the cavity by a preset size; the center of the cavity is a space corresponding to the cylindrical magnet, and the peripheral side of the cavity is a space corresponding to the cup-shaped magnet;
and the second-stage pressing module is used for keeping the first lower die pressing head to continue to press at a first preset pressure, simultaneously starting and controlling the upper die pressing head and the second lower die pressing head to respectively press downwards and upwards at a second preset pressure, at the moment, the powder in the cavity flows to the center of the cavity from the peripheral side of the cavity, and when the height of the powder corresponding to the peripheral side of the cavity is consistent with the height of the powder corresponding to the center of the cavity, the pressing pressure of the first lower die pressing head is adjusted to the second preset pressure and is kept for a preset time to obtain the chip inductor blank.
The second preset pressure is greater than the first preset pressure; the value range of the first preset pressure is 1t/cm 2 To 13t/cm 2 (ii) a The value range of the second preset pressure is 2t/cm 2 To 15t/cm 2 。
The first distance is larger than a preset height value of the chip inductor blank.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
Moreover, descriptions of the present invention as relating to "first," "second," "a," etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating a number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise explicitly stated or limited, the terms "connected", "fixed", and the like are to be understood broadly, for example, "fixed" may be fixedly connected, may be detachably connected, or may be integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Claims (8)
1. A preparation method of a high-density chip inductor blank is characterized in that a split type pressing die is adopted to press powder materials into a chip inductor blank consisting of a cup-shaped magnet and a cylindrical magnet arranged in the cup-shaped magnet by a step-by-step multi-stage pressing method; a groove is formed between the cup-shaped magnet and the cylindrical magnet; the split type pressing die comprises an upper die pressing head, a middle die and a lower die pressing head, wherein the lower die pressing head comprises a first lower die pressing head and a second lower die pressing head which are arranged in a split manner, and the first lower die pressing head can penetrate through the second lower die pressing head; the upper die pressure head, the lower die pressure head and the side wall of the forming hole of the middle die jointly form a cavity for preparing a chip inductor blank.
2. The method for preparing a high-density patch inductor blank according to claim 1, wherein the method comprises the following steps:
s1: filling a preset amount of powder material into the cavity, and starting the upper die pressing head, the first lower die pressing head and the second lower die pressing head to enable the pressing heads to gather towards the middle of the cavity until the distance value between the upper die pressing head and the second lower die pressing head is equal to the first distance;
s2: first-stage pressing of powder: controlling the current positions of the upper die pressing head and the second lower die pressing head to be unchanged, starting the first lower die pressing head and controlling the first lower die pressing head to press upwards at a first preset pressure, so that the powder in the cavity flows to the periphery of the cavity from the center of the cavity, and entering the step S3 when the height of the powder at the periphery of the cavity is higher than the preset height of the powder at the center of the cavity; the center of the cavity is a space corresponding to the cylindrical magnet, and the peripheral side of the cavity is a space corresponding to the cup-shaped magnet;
s3: and (3) secondary pressing of the powder: keeping the first lower die pressing head to continuously press at a first preset pressure, simultaneously starting and controlling the upper die pressing head and the second lower die pressing head to respectively press downwards and upwards at a second preset pressure, at the moment, powder in the cavity flows to the center of the cavity from the periphery of the cavity, and when the height of the powder corresponding to the periphery of the cavity is consistent with the height of the powder corresponding to the center of the cavity, adjusting the pressing pressure of the first lower die pressing head to the second preset pressure and maintaining the pressure for a preset time to obtain a chip inductor blank.
3. The method for preparing a high-density patch inductor blank according to claim 2, wherein the second preset pressure is greater than the first preset pressure; the value range of the first preset pressure is 1t/cm 2 To 13t/cm 2 (ii) a The value range of the second preset pressure is 2t/cm 2 To 15t/cm 2 。
4. The method for preparing a high-density chip inductor blank according to claim 3, wherein the first distance is greater than a preset height value of the chip inductor blank.
5. A preparation system of a high-density chip inductor green body is characterized in that a split type pressing die is adopted to press powder materials into a chip inductor green body consisting of a cup-shaped magnet and a cylindrical magnet arranged in the cup-shaped magnet by a step-by-step multi-stage pressing method; a groove is formed between the cup-shaped magnet and the cylindrical magnet; the split type pressing die comprises an upper die pressing head, a middle die and a lower die pressing head, wherein the lower die pressing head comprises a first lower die pressing head and a second lower die pressing head which are arranged in a split manner, and the first lower die pressing head can penetrate through the second lower die pressing head; and the upper die pressing head, the lower die pressing head and the side wall of the forming hole of the middle die jointly form a cavity for preparing the chip inductor blank.
6. The system for preparing a high-density patch inductor blank according to claim 5, wherein the system comprises:
the preparation module is used for loading a preset amount of powder into the cavity and starting the upper die pressing head, the first lower die pressing head and the second lower die pressing head so that the pressing heads gather towards the middle of the cavity until the distance value between the upper die pressing head and the second lower die pressing head is equal to the first distance;
the first-stage pressing module is used for controlling the current positions of the upper die pressing head and the second lower die pressing head to be unchanged, starting the first lower die pressing head and controlling the first lower die pressing head to upwards press at a first preset pressure, so that the powder in the cavity flows to the periphery of the cavity from the center of the cavity, and entering the step S3 when the height of the powder on the periphery of the cavity is higher than the height of the powder at the center of the cavity by a preset size; the center of the cavity is a space corresponding to the cylindrical magnet, and the peripheral side of the cavity is a space corresponding to the cup-shaped magnet;
and the second-stage pressing module is used for keeping the first lower die pressing head to continue to press at the first preset pressure, starting and controlling the upper die pressing head and the second lower die pressing head to respectively press downwards and upwards at the second preset pressure, at the moment, the powder in the cavity flows to the center of the cavity from the periphery of the cavity, and when the height of the powder corresponding to the periphery of the cavity is consistent with the height of the powder corresponding to the center of the cavity, the pressing pressure of the first lower die pressing head is adjusted to the second preset pressure and is maintained for a preset time to obtain the chip inductor blank.
7. The system for preparing a high-density patch inductor blank according to claim 6, wherein the second preset pressure is greater than the first preset pressure; the value range of the first preset pressure is 1t/cm 2 To 13t/cm 2 (ii) a The value range of the second preset pressure is 2t/cm 2 To 15t/cm 2 。
8. The system for preparing a high-density patch inductor blank according to claim 7, wherein the first distance is greater than a preset height value of the patch inductor blank.
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