CN115825707A - PD array-based optical coupling and chip testing process - Google Patents

PD array-based optical coupling and chip testing process Download PDF

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CN115825707A
CN115825707A CN202211476604.4A CN202211476604A CN115825707A CN 115825707 A CN115825707 A CN 115825707A CN 202211476604 A CN202211476604 A CN 202211476604A CN 115825707 A CN115825707 A CN 115825707A
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chip
array
optical
coupling
light
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何祺昌
熊小敏
王善伟
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Guangdong Agilecom Photonics Solutions Co ltd
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Guangdong Agilecom Photonics Solutions Co ltd
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Abstract

A PD array-based optical coupling and chip testing process comprises the following steps; outputting four lights with different wavelengths from a laser light source; transmitting light generated by a laser light source through a 9/125SMF optical fiber line; the 9/125SMF optical fiber line is coupled with the AWG chip, and the AWG chip divides light with different wavelengths into corresponding waveguides according to the wavelengths; the circuit board is provided with four PD arrays, each PD array corresponds to light with four wavelengths one by one, and the circuit board receives optical signals and converts the optical signals into electric signals for transmission; the signal processing unit receives the electric signal; the PC end power monitoring unit receives the electric signal of the signal processing unit to visually monitor the optical signal of the AWG chip, so that the chip damage ratio in the chip coupling process is reduced; the problem that alcohol or glycerol is remained on the surface of the product in the conventional process is solved; the coupling and testing are consistent with the use scene of the client, and the measured data is more accurate; the adjustment is simple, and even if the output end of the chip is not accurately aligned with the PD, accurate data can be tested.

Description

PD array-based optical coupling and chip testing process
Technical Field
The invention relates to the field of AWG chip testing, in particular to a PD array-based optical coupling and chip testing process.
Background
In recent years, with the development of application scenes and the rapid increase of market demand, the global and Chinese data center optical module market scale is accelerated to expand and keep a rapid development trend for a future period of time. The CWDM4 AWG Demux/LR4 AWG Demux assembly which is an important component of the RX end of the QSFP28 optical module has huge market demand.
Taking 41 ° FA as an example, the wavelength is: the method includes the steps that reference values (namely reference values) of light of lambda 1, lambda 2, lambda 3 and lambda 4 are recorded in optical power meters 1,2,3 and 4 respectively through 9/125 single-mode optical fibers, the light of the required working wavelength (lambda 1, lambda 2, lambda 3 and lambda 4) is transmitted to an optical chip simultaneously through the 9/125 single-mode optical fibers after the reference values are recorded, the optical chip outputs the light to corresponding waveguide channels respectively according to different wavelengths, a 62.5/125 multimode optical fiber array transmits the light (lambda 1, lambda 2, lambda 3 and lambda 4) in an output channel of the optical chip to the optical power meters 1,2,3 and 4 respectively for measurement after the light is completely received, the 62.5/125 multimode optical fiber array mainly adopts 0 DEG, 8 DEG, 41 DEG, 43 DEG and 45 DEG multimode FA as light receiving and transmitting parts of a chip output end, and as the surface of the FA is a mirror surface after optical grinding, when the light enters the air optical fibers, a part of the mirror surface generates mirror surface, the mirror surface is reflected back to air loss, a part of the optical power loss is satisfied, and simultaneously, the light receiving and the optical power of the multimode optical fiber is not accurately transmitted to a fiber core, and the optical fiber core is not accurately removed.
2. When multimode FA of 41 degrees, 43 degrees and 45 degrees is used, alcohol and glycerol are used as transmission media, impurities remained after alcohol volatilization can be attached to the surface of the optical chip, alcohol and glycerol residues at the FA end can affect the production efficiency, and residues at the chip end can affect the use of customers, so that the FA input end and the chip output end need to be cleaned, and additional labor cost is brought;
3. meanwhile, in the process of receiving and transmitting light by using multimode FA, the distance between the multimode fiber core in the FA and the light output end of the chip is required to be close and aligned, so that the light power can be measured to be higher.
Disclosure of Invention
In order to solve the problems, the technical scheme provides a PD array-based optical coupling and chip testing process, and solves the problems of large test loss caused by using FA, inconsistency of a coupling scene and a client practical application scene, and product contamination caused by using alcohol/glycerol matching fluid.
In order to realize the purpose, the technical scheme is as follows:
a light coupling and chip testing process based on a PD array is characterized by comprising the following steps;
outputting four lights with different wavelengths at a laser light source, wherein the four lights are lambda 1, lambda 2, lambda 3 and lambda 4 respectively;
transmitting light generated by a laser light source through a 9/125SMF optical fiber line;
the 9/125SMF optical fiber line is coupled with the AWG chip, and the AWG chip divides light with different wavelengths into corresponding waveguides according to the wavelengths of the light;
the circuit board is provided with four PD arrays, each PD array corresponds to light with four wavelengths one by one, and the circuit board receives optical signals and converts the optical signals into electric signals for transmission;
the signal processing unit receives the electric signal;
and the PC end power monitoring unit receives the electric signal of the signal processing unit so as to perform visual monitoring on the optical signal of the AWG chip.
In some embodiments, the 9/125SMF fiber lines are coupled to the AWG chip by UV glue.
In some embodiments, the optimal coupling position between the waveguide and the PD is found by adjusting the machine and then coupling is performed by UV glue.
In some embodiments, the aperture size of the PD array is
Figure BDA0003960195930000031
In some embodiments, further comprising the steps of;
the circuit board firstly records the reference value of each wavelength under each PD array and then accesses the light source for comparison.
In some embodiments, the AWG chip provides light source transmission to the circuit board through air as a medium.
The beneficial effect of this application does:
1. the chip damage ratio in the chip coupling process is reduced;
2. the problem that alcohol or glycerol is remained on the surface of the product in the conventional process is solved;
3. the coupling and testing are consistent with the use scene of the client, and the measured data is more accurate;
4. the adjustment is simple, and even if the output end of the chip is not accurately aligned with the PD, accurate data can be tested.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic diagram of a prior art configuration;
FIG. 2 is a front view of a schematic structural diagram of an embodiment of the present invention;
FIG. 3 is a schematic top view of an embodiment of the present invention;
fig. 4 is a PCB assembly schematic of an embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
Referring to fig. 1-3, a process for optically coupling and testing a chip based on a PD array includes the following steps;
outputting four lights with different wavelengths at a laser light source, wherein the four lights are lambda 1, lambda 2, lambda 3 and lambda 4 respectively;
transmitting the light generated by the laser light source through a 9/125SMF optical fiber line;
the 9/125SMF optical fiber line is coupled with the AWG chip, and the AWG chip divides light with different wavelengths into corresponding waveguides according to the wavelengths of the light;
the circuit board is provided with four PD arrays, each PD array corresponds to light with four wavelengths one by one, and the circuit board receives optical signals and converts the optical signals into electric signals for transmission;
the signal processing unit receives the electric signal;
and the PC end power monitoring unit receives the electric signal of the signal processing unit so as to perform visual monitoring on the optical signal of the AWG chip.
The wavelength is as follows: the method comprises the steps that light of lambda 1, lambda 2, lambda 3 and lambda 4 is respectively recorded with optical power reference values in 4 120um PD arrays by using 9/125 single-mode fibers (four PDs and four wavelengths are in a one-to-one correspondence, each PD corresponds to one wavelength, and a reference value of each wavelength under each PD is respectively recorded), after the light is completed, the light (lambda 1, lambda 2, lambda 3 and lambda 4) with the required working wavelength is simultaneously transmitted to an optical chip by using the 9/125 single-mode fibers, the optical chip respectively outputs the light to corresponding waveguide channels according to different wavelengths, the PD arrays respectively convert the received four beams of light into current signals, the stronger the light is, the larger the generated current signal is, the current signals are converted into light intensity by a signal processing unit and displayed in a monitoring unit at a PC end, and the real-time monitoring of the four beams of light is realized. Because light energy loss is generated in the coupling process, the light power received by the light power is lower than a reference value, namely a negative value, the optimal coupling position of the waveguide and the PD is found by adjusting the machine table, namely the light power is the maximum, the UV curing operation is carried out, and the process is finished.
In this embodiment, the 9/125SMF fiber line is coupled with the AWG chip by UV glue.
In this embodiment, the optimal coupling position between the waveguide and the PD is found by adjusting the machine and then coupled by the UV glue.
In this embodiment, the aperture size of the PD array is
Figure BDA0003960195930000041
Use of
Figure BDA0003960195930000042
The PD array replaces a multimode fiber array to be used for light collection at the 0-degree 8-degree 41-degree 43-degree output end of the AWG optical quartz-based chip.
In this embodiment, the method further comprises the following steps;
the circuit board firstly records the reference value of each wavelength under each PD array and then accesses the light source for comparison.
In this embodiment, the AWG chip transmits light to the circuit board through air as a medium.
Referring to fig. 4, the circuit is designed according to the product pitch, a positive electrode and a negative electrode are respectively connected to the positive electrode and the negative electrode of the photodiode through conducting wires, the PD is irradiated by light to generate current, and the circuit processes the electric signal and converts the electric signal into the intensity of the light, and then transmits the intensity of the light to the signal processing unit.
The above description is only a preferred embodiment of the present application and is not intended to limit the scope of the present application, and other embodiments and basic structures that are the same as or similar to the present application are within the scope of the present application.

Claims (6)

1. A PD array-based optical coupling and chip testing process is characterized by comprising the following steps;
outputting four lights with different wavelengths at a laser light source, wherein the four lights are lambda 1, lambda 2, lambda 3 and lambda 4 respectively;
transmitting the light generated by the laser light source through a 9/125SMF optical fiber line;
the 9/125SMF optical fiber line is coupled with the AWG chip, and the AWG chip divides light with different wavelengths into corresponding waveguides according to the wavelengths of the light;
the circuit board is provided with four PD arrays, each PD array corresponds to light with four wavelengths one by one, and the circuit board receives optical signals and converts the optical signals into electric signals for transmission;
the signal processing unit receives the electric signal;
and the PC end power monitoring unit receives the electric signal of the signal processing unit so as to perform visual monitoring on the optical signal of the AWG chip.
2. The PD-array based optical coupling and testing chip process of claim 1, wherein: the 9/125SMF optical fiber line is coupled with the AWG chip through UV glue.
3. The PD-array based optical coupling and testing chip process of claim 2, wherein: and finding the optimal coupling position of the waveguide and the PD by adjusting the machine table, and coupling by using UV glue.
4. The PD-array based optical coupling and testing chip process of claim 1, wherein: the aperture size of the PD array is
Figure FDA0003960195920000011
5. The PD-array based optical coupling and testing chip process of claim 1, wherein: also comprises the following steps;
the circuit board firstly records the reference value of each wavelength under each PD array and then accesses the light source for comparison.
6. The PD-array based optical coupling and testing chip process of claim 1, wherein: and the AWG chip transmits light source to the circuit board by taking air as a medium.
CN202211476604.4A 2022-11-23 2022-11-23 PD array-based optical coupling and chip testing process Pending CN115825707A (en)

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Application Number Priority Date Filing Date Title
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Publications (1)

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CN115825707A true CN115825707A (en) 2023-03-21

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