CN115821337A - Micro-electroforming forming method for imprinting metal template based on multi-layer structure silicon rubber core mold - Google Patents
Micro-electroforming forming method for imprinting metal template based on multi-layer structure silicon rubber core mold Download PDFInfo
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Abstract
The invention discloses a micro-electroforming forming method of an imprinted metal template based on a multi-layer structure silicon rubber mandrel, which comprises the following steps: 1. adding silver-coated copper powder into the polydimethylsiloxane prepolymer to prepare conductive silica gel slurry; 2. adding a curing agent into the PDMS conductive slurry, pouring the PDMS conductive slurry on the surface of the silicon template, and curing to form a PDMS conductive layer with a microstructure on the surface; 3. embedding and filling a hard metal substrate in a PDMS conducting layer and sealing the hard metal substrate by a PDMS insulating layer to obtain a multi-layer structure silicon rubber core mold; 4. electroplating and depositing in a cavity of the silicon rubber core mould with the multilayer structure by adopting micro-electroforming; 5. and (5) performing post-treatment after demolding. According to the invention, the silicon rubber core mold with the multilayer structure and excellent conductivity, rigidity and replication precision is prepared firstly, and then the micro electroforming replication is combined to form the imprinting metal template, so that the imprinting metal template with high quality can be prepared in a short process, low cost, high precision and small batch, the preparation cost of the imprinting template is reduced, and the preparation efficiency is improved.
Description
Technical Field
The invention belongs to the field of micro-manufacturing forming, and particularly relates to a micro-electroforming forming method of an imprinting metal template based on a multi-layer structure silicon rubber core mold.
Background
The imprinting technology has the characteristics of low cost, high yield, short manufacturing period and the like, and is widely applied to the fields of biomedicine, micro-electromechanical systems, sensors and the like. The principle of the imprinting technique is: the master template with the pattern is imprinted on the adhesive film under certain conditions, and then the pattern transfer is realized through processes of curing, demolding, photoresist removing and the like, wherein the master template with high quality is a prerequisite for accurate forming.
At present, a silicon template prepared by adopting an electron beam exposure or reactive ion etching technology is often used as an imprinting master template, but the high preparation cost and the complex forming process limit the further application of the silicon template. In addition, since silicon is brittle, it is easily damaged during imprinting, resulting in a short lifetime of the silicon template. Compared with a silicon template, the excellent mechanical property of the metal template can effectively reduce the damage of the micro-pattern in the imprinting process and prolong the service life of the template.
The imprinted metal template is usually formed by a micro electroforming technology, and comprises the process steps of photoresist core mold preparation, electroforming liquid preparation, electrodeposition, demolding, metal template post-treatment and the like, wherein the quality of the photoresist core mold determines the micro electroforming forming precision. However, the photoresist mandrel requires not only a large and expensive photolithography apparatus and a complicated manufacturing process during the manufacturing process, but also deformation of the photoresist mandrel occurs during the electroforming process, resulting in a decrease in the replication accuracy of the metal template.
Disclosure of Invention
The invention aims to solve the technical problem of providing a micro-electroforming forming method of an imprinted metal template based on a multi-layer silicon rubber core mold aiming at the defects of the prior art. According to the method, the multi-layer structure silicon rubber core mold is prepared by sequentially adopting conductive layer curing molding, hard metal substrate pre-embedding filling and insulating layer sealing, high copying forming precision and excellent conductivity are endowed to the multi-layer structure silicon rubber core mold, and the stamping metal template is prepared by combining micro electroforming, so that the forming quality of the stamping metal template is improved, the preparation cost is greatly reduced, the preparation efficiency is improved, and the problems of high preparation cost, complex process and the like of the traditional stamping silicon template are solved.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows: the micro-electroforming forming method of the imprinted metal template based on the multi-layer structure silicon rubber mandrel is characterized by comprising the following steps of:
step one, preparing conductive silica gel slurry: adding silver-coated copper powder as a high-conductivity filler into the polydimethylsiloxane prepolymer, and then ultrasonically dispersing the silver-coated copper powder in an ultrasonic cleaner for 60-120 min to uniformly disperse the silver-coated copper powder in the polydimethylsiloxane prepolymer to obtain PDMS (polydimethylsiloxane) conductive slurry;
step two, curing and forming the conductive layer: placing the PDMS conductive slurry obtained in the first step in a vacuum drying oven for 30-120 min, then adding a curing agent to form a mixed slurry, pouring the mixed slurry on the surface of a silicon template with a microstructure on the surface until the microstructure is completely filled, then placing the silicon template in an oven for low-temperature curing and forming, and forming a PDMS conductive layer with a microstructure on the surface of the silicon template; the volume of the curing agent in the mixed slurry is 10 percent of that of the PDMS conductive slurry;
step three, pre-embedding and filling the hard metal substrate: placing the hard metal substrate on the PDMS conductive layer with the microstructure on the surface, which is cooled to the room temperature in the step two, then pouring the insulating silica gel slurry onto the hard metal substrate, placing the hard metal substrate in an oven for low-temperature curing and forming, forming a PDMS insulating layer on the hard metal substrate, cooling to the room temperature, peeling the PDMS insulating layer from the silicon template, ultrasonically cleaning the PDMS conductive layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer, and blow-drying the PDMS insulating layer to obtain the multi-layer silicon rubber core mold consisting of the PDMS conductive layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer; the insulating silica gel slurry is prepared by uniformly mixing polydimethylsiloxane prepolymer and curing agent according to the volume ratio of 10;
step four, micro-electroforming of the stamped metal template: punching the upper end and the lower end of the multilayer structure silicon rubber core mold obtained in the third step, penetrating a metal lead for fixing, then immersing the core mold into micro electroforming solution as a cathode, selecting a metal plate as an anode, performing micro electroforming by adopting direct current until metal ions are deposited and cast in a cavity of the multilayer structure silicon rubber core mold, taking out the electroplated and deposited multilayer structure silicon rubber core mold, immersing the core mold into deionized water, performing ultrasonic cleaning and drying;
step five, demolding and post-processing the imprinted metal template: and (3) taking out the electroplated and deposited member in the multi-layer structure silicon rubber core model cavity subjected to the blown-dry electroplating and deposition in the fourth step by adopting a manual demolding mode, and carrying out post-treatment to obtain the imprinted metal template.
According to the invention, firstly, silver-coated copper powder is added into a Polydimethylsiloxane (PDMS) prepolymer to prepare PDMS conductive slurry, the silver-coated copper powder is used as a high conductive filler to endow PDMS with excellent conductivity, the copy forming precision of a multi-layer structure silicon rubber core mold is ensured by regulating the particle size of the silver-coated copper powder, then the PDMS conductive slurry is poured on the surface of a silicon template with a microstructure on the surface until the microstructure is completely filled, and the microstructure on the surface of the silicon template is copied through low-temperature curing forming, so that a PDMS conductive layer with a microstructure on the surface is formed on the silicon template, the method is convenient and rapid, the preparation cost of the multi-layer structure silicon rubber core mold is effectively reduced, and the preparation period is shortened; secondly, a hard metal substrate is placed on the PDMS conducting layer with the microstructure on the surface, so that the conductivity of the multi-layer structure silicon rubber core mold is improved on one hand, the rigidity of the multi-layer structure silicon rubber core mold is improved by utilizing the hardness characteristic of the hard metal substrate on the other hand, the multi-layer structure silicon rubber core mold is prevented from bending and deforming in the subsequent micro-electroforming process, and the forming quality of the stamping metal mold plate is improved; and thirdly, pouring the insulating silica gel slurry onto the hard metal substrate, performing low-temperature curing forming to form a PDMS insulating layer, and performing back insulation sealing by using the PDMS insulating layer to obtain the multi-layer silicon rubber core mold consisting of the PDMS conducting layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer, so that the power lines in the micro electroforming process are enriched in the cavity of the multi-layer silicon rubber core mold, and the forming efficiency of micro electroforming is improved.
The micro-electroforming forming method of the imprinted metal template based on the multilayer structure silicone rubber core mold is characterized in that the volume percentage of the silver-coated copper powder in the PDMS conductive slurry in the first step is 10% -50%. According to the invention, the content of the silver-coated copper powder in the PDMS conductive slurry is controlled, so that the silicone rubber core mold with the multilayer structure has excellent conductivity.
The micro-electroforming forming method of the imprinted metal template based on the multi-layer structure silicone rubber core mold is characterized in that the low-temperature curing forming temperature in the second step is 100 ℃ and the time is 40min; the temperature of the low-temperature curing forming in the third step is 100 ℃, and the time is 30min. According to the invention, the curing forming temperature and time of the conductive layer and the insulating layer are controlled, so that the cured PDMS conductive layer and the cured PDMS insulating layer have excellent mechanical properties.
The micro-electroforming forming method of the imprinted metal template based on the multilayer structure silicone rubber core mold is characterized in that in the third step, the hard metal substrate is made of nickel, titanium or copper. The method of the invention only needs to adopt the hard metal substrate made of the material; in particular, when a metal substrate having magnetism such as nickel is used, the magnetic assist of the metal substrate can be used for micro electroforming.
The micro electroforming forming method of the imprinted metal template based on the multilayer structure silicon rubber core mold is characterized in that in the fourth step, the micro electroforming solution is a solution of single metal, alloy or composite material, and the current density of micro electroforming by adopting direct current is 0.1A/dm 2 ～5A/dm 2 . When the micro electroforming solution is a solution containing a single metal element, a stamped single metal template is obtained through micro electroforming, when the micro electroforming solution is a solution containing an alloy, namely more than two metal elements, a stamped alloy template is obtained through micro electroforming, and when the micro electroforming solution is a solution of a composite material such as a metal element and other components, a stamped composite material template is obtained through micro electroforming; therefore, the invention is based on the multilayer silicon rubber core mold, adopts the electroforming solution with various compositions for deposition, is suitable for preparing various metal templates and meets different use requirements.
The micro electroforming forming method of the imprinting metal template based on the multilayer structure silicon rubber core mold is characterized in that the post treatment in the fifth step comprises low-temperature heat treatment and surface polishing treatment.
Compared with the prior art, the invention has the following advantages:
1. the method comprises the steps of preparing a PDMS conductive layer with a microstructure on the surface of a silicon template by adopting PDMS conductive slurry containing silver-coated copper powder high-conductivity filler, setting a hard metal substrate in a combined manner, and performing back insulation sealing by adopting a PDMS insulation layer to prepare a multi-layer structure silicon rubber core mold consisting of the PDMS conductive layer with the microstructure on the surface, the hard metal substrate and the PDMS insulation layer, endowing the multi-layer structure silicon rubber core mold with high copying forming precision and excellent conductivity, and combining micro electroforming deposition to obtain the stamping metal template, so that the forming quality of the stamping metal mold plate is improved.
2. According to the invention, the low-cost silver-coated copper powder is used as a high-conductivity filler to prepare the PDMS conductive slurry, and the PDMS conductive layer with the microstructure on the surface is prepared through low-temperature curing and forming, so that the silicon rubber core mold with the multilayer structure and excellent conductivity and high forming precision is obtained, and the preparation cost of the existing photoresist core mold is greatly reduced.
3. According to the invention, the hard metal substrate is embedded in the multi-layer silicon rubber core mold, so that the conductivity and rigidity of the core mold are effectively improved, the core mold is prevented from bending and deforming in the micro electroforming process, and the forming quality of the stamping metal mold is improved.
4. According to the invention, by controlling the structure of the silicone rubber core mold with a multilayer structure, the copying and forming precision of the core mold is improved, the forming efficiency is improved, the problems of high preparation cost, complex process and the like of the traditional imprinting silicon template are solved, and the imprinting metal template with high surface quality can be prepared in a short process, low cost and small batch.
The technical solution of the present invention is further described in detail by the accompanying drawings and examples.
Drawings
FIG. 1 is a schematic diagram of a process for preparing a silicone rubber core mold with a multi-layer structure according to the present invention.
Fig. 2 is a schematic diagram of a micro electroforming process based on a silicone rubber core mold with a multilayer structure.
FIG. 3 is a schematic representation of the demolding and post-treatment of an imprinted metal template prepared in accordance with the present invention.
FIG. 4 is a topographical view of an imprinted nickel template prepared in example 1 of the present invention.
Fig. 5 is a topography of the imprinted nickel-iron alloy template prepared in embodiment 2 of the present invention.
FIG. 6 is a topographical view of an imprinted nickel/alumina composite template prepared in example 3 of the present invention.
Description of reference numerals:
1-a silicon template; 2-a PDMS conducting layer; 3-a hard metal substrate;
4-PDMS insulating layer; 5, a silicon rubber core mold with a multilayer structure;
6-metal wire; 7-metal ions; 8-electroplating the deposited member;
and 9, stamping the metal template.
Detailed Description
Example 1
As shown in fig. 1 to 3, the present embodiment includes the following steps:
step one, preparing conductive silica gel slurry: adding 0.6mL of silver-coated copper powder with the particle size of 2 micrometers as a high-conductivity filler into 5.0mL of polydimethylsiloxane PDMS prepolymer, and then ultrasonically dispersing in an ultrasonic cleaner for 60min to uniformly disperse the silver-coated copper powder in the polydimethylsiloxane PDMS prepolymer to obtain PDMS conductive slurry;
step two, curing and forming the conductive layer: placing the PDMS conductive slurry obtained in the first step in a vacuum drying oven for 30min to remove air bubbles, then adding 0.5mL of curing agent to form mixed slurry, pouring the mixed slurry on the surface of a silicon template 1 with a microstructure on the surface until the microstructure is completely filled, then placing the silicon template 1 in an oven for low-temperature curing forming at 100 ℃ for 40min, and forming a PDMS conductive layer 2 with a microstructure on the surface of the silicon template 1; the whole size of the silicon template 1 is 2mm multiplied by 0.5mm, and a micro-channel structure with the width of 20 mu m is etched on the surface of the silicon template;
step three, pre-embedding and filling the hard nickel substrate: placing a hard metal substrate 3 on the PDMS conducting layer 2 which is cooled to room temperature and has the microstructure on the surface, pouring insulating silica gel slurry prepared by uniformly mixing 2mL of PDMS prepolymer and 0.2mL of curing agent onto the hard metal substrate 3, placing the insulating silica gel slurry into an oven to be cured and formed at low temperature of 100 ℃ for 30min, forming a PDMS insulating layer 4 on the hard metal substrate 3, cooling to room temperature, peeling from the silicon template 1, ultrasonically cleaning in ethanol, and blow-drying to obtain a multi-layer silicon rubber core mold 5 which is composed of the PDMS conducting layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer; the hard metal substrate 3 is a hard nickel substrate;
step four, micro-electroforming of the imprinted nickel template: punching the upper end and the lower end of the multilayer structure silicon rubber core mold 5 obtained in the third step, penetrating a metal lead 6 for fixation, then immersing the core mold into micro electroforming solution as a cathode, selecting a nickel sheet with the mass purity of more than 99 percent as an anode, and performing micro electroforming by adopting direct current through an electrochemical workstation until metal ions 7, namely nickel ions, in the micro electroforming solution are deposited and cast in a cavity of the multilayer structure silicon rubber core mold 5 to form an electroplating deposition component 8, namely a nickel template, taking out the electroplated and deposited multilayer structure silicon rubber core mold, immersing the core mold into deionized water, performing ultrasonic cleaning and drying;
the micro electroforming solution comprises the following components: 280g/L of nickel sulfate, 60g/L of nickel chloride, 40g/L of boric acid, 10g/L of saccharin and 0.6g/L of sodium dodecyl sulfate, and adjusting the pH value of the micro electroforming solution to 3.5 by adopting a dilute sulfuric acid solution; the temperature for micro-electroforming by direct current is 55 ℃, and the current density is 5A/dm 2 ；
Step five, demolding and post-processing the imprinted nickel template: and (3) taking out the electroplated and deposited member 8, namely the nickel template, in the multilayer-structure silicon rubber core model cavity 5 subjected to electroplating and deposition in the fourth step by adopting a manual demoulding mode, annealing for 90min at 200 ℃ in a tubular furnace to eliminate residual stress in the nickel template, and then performing surface polishing treatment to obtain an imprinted metal template 9, namely an imprinted nickel template.
Fig. 4 is a topographic map of the imprinted nickel template prepared in this embodiment, and as can be seen from fig. 4, the imprinted nickel template formed by the method of combining the silicone rubber core mold with the micro electroforming according to this embodiment has a complete and defect-free structure, and a micro channel structure of the silicon template 1 is completely copied, which indicates that the method of the present invention has high forming precision and good forming quality.
Example 2
As shown in fig. 1 to 3, the present embodiment includes the following steps:
step one, preparing conductive silica gel slurry: adding 3.5mL of silver-coated copper powder with the particle size of 2 micrometers as a high-conductivity filler into 8.0mL of polydimethylsiloxane PDMS prepolymer, and then ultrasonically dispersing for 90min in an ultrasonic cleaner to uniformly disperse the silver-coated copper powder in the polydimethylsiloxane PDMS prepolymer to obtain PDMS conductive slurry;
step two, curing and forming the conductive layer: placing the PDMS conductive slurry obtained in the first step in a vacuum drying oven for 60min to remove air bubbles, then adding 0.8mL of curing agent to form mixed slurry, pouring the mixed slurry on the surface of a silicon template 1 with a microstructure on the surface until the microstructure is completely filled, then placing the silicon template 1 in an oven for low-temperature curing forming for 40min at 100 ℃, and forming a PDMS conductive layer 2 with a microstructure on the surface of the silicon template 1; the whole size of the silicon template 1 is 6mm multiplied by 0.7mm, and a micro-channel structure with the width of 20 mu m is etched on the surface of the silicon template;
step three, pre-embedding and filling the hard titanium substrate: placing a hard metal substrate 3 on the PDMS conducting layer 2 which is cooled to room temperature and has the microstructure on the surface, pouring insulating silica gel slurry prepared by uniformly mixing 5mL of PDMS prepolymer and 0.5mL of curing agent onto the hard metal substrate 3, placing the insulating silica gel slurry into an oven to be cured and formed at low temperature of 100 ℃ for 30min, forming a PDMS insulating layer 4 on the hard metal substrate 3, cooling to room temperature, peeling from the silicon template 1, ultrasonically cleaning in ethanol, and blow-drying to obtain a multi-layer silicon rubber core mold 5 which is composed of the PDMS conducting layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer; the hard metal substrate 3 is a hard titanium substrate;
step four, micro-electroforming of the stamped nickel-iron alloy template: punching the upper end and the lower end of the multi-layer structure silicon rubber core mold 5 obtained in the third step, penetrating a metal lead 6 for fixation, then immersing the multi-layer structure silicon rubber core mold into micro electroforming solution as a cathode, selecting a nickel sheet and iron sheet combination with an area ratio of 4 as an anode, performing micro electroforming by adopting direct current through an electrochemical workstation until metal ions 7, namely nickel ions and iron ions in the micro electroforming solution are deposited and cast in a cavity of the multi-layer structure silicon rubber core mold 5 to form an electroplating deposition component 8, namely a nickel-iron alloy template, taking out the multi-layer structure silicon rubber core mold after electroplating deposition, immersing the multi-layer structure silicon rubber core mold into deionized water, performing ultrasonic cleaning and drying;
the micro electroforming solution comprises the following components: 300g/L of nickel sulfate, 10g/L of nickel chloride, 70g/L of ferrous sulfate, 35g/L of boric acid, 10g/L of saccharin, 0.6g/L of sodium dodecyl sulfate, 2g/L of glycine, 1g/L of ascorbic acid, 4g/L of glucose and 1g/L of sodium gluconate, and the pH value of the electroforming solution is adjusted to be 5 by adopting a dilute sulfuric acid solution; the temperature for micro-electroforming by adopting direct current is 50 ℃, and the current density is 3A/dm 2 ；
Step five, demolding and post-processing the stamped nickel-iron alloy template: and (3) taking out the electroplating deposition component 8, namely the nickel-iron alloy template, in the multilayer structure silicon rubber core model cavity 5 subjected to electroplating deposition and blow-drying in the fourth step by adopting a manual demoulding mode, annealing for 50min at 350 ℃ in a tube furnace to eliminate residual stress in the nickel-iron alloy template, and then performing surface polishing treatment to obtain an imprinting metal template 9, namely an imprinting nickel-iron alloy template.
Fig. 5 is a morphology diagram of the imprinted nickel-iron alloy template prepared in this embodiment, and as can be seen from fig. 5, the imprinted nickel-iron alloy template formed by combining the multi-layer structure silicone rubber mandrel with the micro electroforming method in this embodiment has a complete and defect-free structure, and completely replicates the micro-channel structure of the silicon template 1, which indicates that the method of the present invention has high forming precision and good forming quality.
Example 3
As shown in fig. 1 to 3, the present embodiment includes the following steps:
step one, preparing conductive silica gel slurry: adding 10mL of silver-coated copper powder with the particle size of 2 micrometers as a high-conductivity filler into 10mL of polydimethylsiloxane PDMS prepolymer, and then ultrasonically dispersing for 120min in an ultrasonic cleaner to uniformly disperse the silver-coated copper powder in the polydimethylsiloxane PDMS prepolymer to obtain PDMS conductive slurry;
step two, curing and forming the conductive layer: placing the PDMS conductive slurry obtained in the first step in a vacuum drying oven for 120min to remove air bubbles, then adding 1mL of curing agent to form mixed slurry, pouring the mixed slurry on the surface of a silicon template 1 with a microstructure on the surface until the microstructure is completely filled, then placing the silicon template 1 in an oven for low-temperature curing and forming for 40min at 100 ℃, and forming a PDMS conductive layer 2 with a microstructure on the surface of the silicon template 1; the whole size of the silicon template 1 is 20mm multiplied by 30mm multiplied by 0.2mm, and a micro-channel structure with the width of 20 mu m is etched on the surface of the silicon template;
step three, pre-embedding and filling the hard copper substrate: placing a hard metal substrate 3 on the PDMS conducting layer 2 which is cooled to room temperature and has the microstructure on the surface in the step two, pouring insulating silica gel slurry prepared by uniformly mixing 10mL of PDMS prepolymer and 1mL of curing agent onto the hard metal substrate 3, placing the insulating silica gel slurry into an oven, curing and forming the insulating silica gel slurry at a low temperature of 100 ℃ for 30min, forming a PDMS insulating layer 4 on the hard metal substrate 3, cooling to room temperature, peeling the insulating silica gel slurry from a silicon template 1, ultrasonically cleaning the insulating silica gel slurry in ethanol, and blow-drying the insulating silica gel slurry to obtain a multi-layer structure silicon rubber core mold 5 consisting of the PDMS conducting layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer; the hard metal substrate 3 is a hard copper substrate;
step four, micro-electroforming of the stamped nickel/aluminum oxide composite template: punching the upper end and the lower end of the multi-layer structure silicon rubber mandrel 5 obtained in the third step, penetrating a metal lead 6 for fixing, then immersing the multi-layer structure silicon rubber mandrel 5 into micro electroforming solution as a cathode, selecting a nickel sheet with the mass purity of more than 99% as an anode, performing micro electroforming by adopting direct current through an electrochemical workstation until metal ions 7 in the micro electroforming solution, namely alpha-alumina groups with charges and nickel ions deposit and cast in a cavity of the multi-layer structure silicon rubber mandrel 5 to form an electroplating deposition component 8, namely a nickel/alumina composite material template, taking out the electroplated and deposited multi-layer structure silicon rubber mandrel, immersing the multi-layer structure silicon rubber mandrel into deionized water, performing ultrasonic cleaning, and drying;
the micro electroforming solution comprises the following components: 280g/L of nickel sulfate, 60g/L of nickel chloride, 40g/L of boric acid, 10g/L of saccharin, 0.6g/L of sodium dodecyl sulfate and 20g/L of alpha-alumina powder with the particle size of 0.1 mu m, and adjusting the pH value of the electroforming solution to 3.5 by adopting a dilute sulfuric acid solution; the temperature for micro-electroforming by direct current is 55 ℃, and the current density is 0.1A/dm 2 ；
Step five, demolding and post-processing of the stamped metal template: and (3) taking out the electroplated and deposited member 8, namely the nickel/aluminum oxide composite material template, in the multilayer structure silicon rubber core model cavity 5 subjected to blown-dry electroplating and deposition in the fourth step by adopting a manual demolding mode, annealing for 60min at 500 ℃ in a tubular furnace to eliminate residual stress in the nickel/aluminum oxide composite material template, and then performing surface polishing treatment to obtain an imprinted metal template 9, namely an imprinted nickel/aluminum oxide composite material template.
Fig. 6 is a morphology diagram of the imprinting nickel/alumina composite template prepared in the embodiment, and as can be seen from fig. 6, the imprinting nickel/alumina composite template formed by combining the multi-layer structure silicone rubber core mold and the micro electroforming method in the embodiment has a complete and defect-free structure, and completely copies the micro channel structure of the silicon template 1, which indicates that the method of the present invention has high forming precision and good forming quality.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any simple modification, change and equivalent changes of the above embodiments according to the technical essence of the invention are still within the protection scope of the technical solution of the invention.
Claims (6)
1. The micro electroforming forming method of the imprinting metal template based on the multilayer structure silicon rubber mandrel is characterized by comprising the following steps of:
step one, preparing conductive silica gel slurry: adding silver-coated copper powder as a high-conductivity filler into the polydimethylsiloxane prepolymer, and then ultrasonically dispersing the silver-coated copper powder in an ultrasonic cleaner for 60-120 min to uniformly disperse the silver-coated copper powder in the polydimethylsiloxane prepolymer to obtain PDMS (polydimethylsiloxane) conductive slurry;
step two, curing and forming the conductive layer: placing the PDMS conductive slurry obtained in the step one in a vacuum drying oven for 30-120 min, then adding a curing agent to form a mixed slurry, pouring the mixed slurry on the surface of a silicon template with a microstructure on the surface until the microstructure is completely filled, then placing the silicon template in an oven for low-temperature curing and forming, and forming a PDMS conductive layer with a microstructure on the surface of the silicon template; the volume of the curing agent in the mixed slurry is 10 percent of that of the PDMS conductive slurry;
step three, pre-embedding and filling the hard metal substrate: placing the hard metal substrate on the PDMS conductive layer with the microstructure on the surface, which is cooled to the room temperature in the step two, then pouring the insulating silica gel slurry onto the hard metal substrate, placing the hard metal substrate in an oven for low-temperature curing and forming, forming a PDMS insulating layer on the hard metal substrate, cooling to the room temperature, peeling the PDMS insulating layer from the silicon template, ultrasonically cleaning the PDMS conductive layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer, and blow-drying the PDMS insulating layer to obtain the multi-layer silicon rubber core mold consisting of the PDMS conductive layer with the microstructure on the surface, the hard metal substrate and the PDMS insulating layer; the insulating silica gel slurry is prepared by uniformly mixing polydimethylsiloxane prepolymer and curing agent according to the volume ratio of 10;
step four, micro-electroforming of the stamped metal template: punching the upper end and the lower end of the multi-layer structure silicon rubber core mold obtained in the third step, penetrating a metal lead into the punched hole for fixing, then immersing the silicon rubber core mold into micro electroforming solution as a cathode, selecting a metal plate as an anode, carrying out micro electroforming by adopting direct current until metal ions are deposited and cast in a cavity of the multi-layer structure silicon rubber core mold, taking out the electroplated and deposited multi-layer structure silicon rubber core mold, immersing the core mold into deionized water, carrying out ultrasonic cleaning, and blow-drying;
step five, demolding and post-processing of the stamped metal template: and (3) taking out the electroplated and deposited member in the multi-layer structure silicon rubber core model cavity subjected to the blown-dry electroplating and deposition in the fourth step by adopting a manual demolding mode, and carrying out post-treatment to obtain the imprinted metal template.
2. The method for microelectroforming of the imprinted metal template based on the multi-layer structure silicone rubber mandrel as claimed in claim 1, wherein the volume percentage of the silver-coated copper powder in the PDMS conductive paste in the first step is 10% -50%.
3. The micro electroforming method for the imprinted metal template based on the multi-layer structure silicone rubber mandrel, according to claim 1, wherein the temperature for the low temperature curing forming in the second step is 100 ℃ and the time is 40min; the temperature of the low-temperature curing forming in the third step is 100 ℃, and the time is 30min.
4. The method for microelectroforming of the imprinted metal template based on the multi-layer structure silicone rubber mandrel as claimed in claim 1, wherein the material of the hard metal substrate in step three is nickel, titanium or copper.
5. The method for microelectroforming of an imprinted metal template based on a silicone rubber mandrel with a multi-layer structure according to claim 1, wherein the microelectroforming solution in step four is a solution of a single metal, an alloy or a composite material, and the current density for microelectroforming by direct current is 0.1A/dm 2 ～5A/dm 2 。
6. The method for microelectroforming of an imprinted metal template based on a multi-layered structure silicone rubber mandrel as claimed in claim 1, wherein the post-treatment in step five includes a low temperature heat treatment and a surface polishing treatment.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117646261A (en) * | 2024-01-30 | 2024-03-05 | 西安稀有金属材料研究院有限公司 | Limited domain electrodeposition method of metal grid line structure for photovoltaic power generation |
| CN117646261B (en) * | 2024-01-30 | 2024-04-05 | 西安稀有金属材料研究院有限公司 | Limited domain electrodeposition method of metal grid line structure for photovoltaic power generation |
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