CN115821107A - Etched lead frame copper casting blank and production method thereof - Google Patents
Etched lead frame copper casting blank and production method thereof Download PDFInfo
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- CN115821107A CN115821107A CN202211613276.8A CN202211613276A CN115821107A CN 115821107 A CN115821107 A CN 115821107A CN 202211613276 A CN202211613276 A CN 202211613276A CN 115821107 A CN115821107 A CN 115821107A
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- 239000010949 copper Substances 0.000 title claims abstract description 39
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 35
- 238000005266 casting Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 39
- 239000000956 alloy Substances 0.000 claims abstract description 39
- 239000000126 substance Substances 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 claims description 9
- 239000011777 magnesium Substances 0.000 claims description 8
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 6
- 150000002910 rare earth metals Chemical class 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052702 rhenium Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052785 arsenic Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 12
- 239000013078 crystal Substances 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 239000011159 matrix material Substances 0.000 abstract description 2
- 239000006104 solid solution Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 238000005096 rolling process Methods 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 229910017827 Cu—Fe Inorganic materials 0.000 description 3
- 238000003723 Smelting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000009749 continuous casting Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Abstract
The invention provides an etched lead frame copper casting blank and a production method thereof, and the etched lead frame copper casting blank comprises the following components: fe 1.8-2.4%, zn 0.8-1.2%, P0.02-0.05%, mg 0.01-0.03%, re0.01-1.2%, and Cu and inevitable impurities as the rest. Compared with the prior art, the invention has the following advantages: 1) The solid solution amount of the alloy elements in copper is obviously increased; 2) The crystal grains are greatly refined, the dislocation is reduced, and the structure is more stable; 3) The microsegregation of chemical components is obviously reduced; 4) The crystal defect density is greatly increased; 5) A new metastable phase structure is formed; 6) After aging treatment, the content of the second phase in the copper matrix is improved, and the dispersion strength is increased. The copper alloy for the lead frame produced by the invention has good wear resistance, corrosion resistance and excellent hot workability, is beneficial to production and manufacturing, and has relatively low alloy price and high production efficiency.
Description
Technical Field
The invention belongs to the field of copper alloy, and particularly relates to an etched lead frame copper casting blank and a production method thereof.
Background
The current era is the information era, and the development of the electronic information industry plays a decisive role. Semiconductor devices are the cornerstone of this pillar industry, where integrated circuit chips are the internal primary component. The lead frame has the main functions of providing a mechanical support carrier for the chip, serving as a conductive medium for connecting an external circuit, transmitting an electrical signal, and dissipating heat generated during the operation of the chip to the outside, and thus becomes a very critical component. Therefore, the package is required to have a series of comprehensive properties such as high strength, high electrical conductivity, good thermal conductivity, good weldability, corrosion resistance, plastic packaging property, oxidation resistance and the like, so that the requirements on the properties of the used materials are very strict.
In recent years, considerable research into Cu-Fe alloys has led to the development of a large number of practical alloys that meet the various performance requirements of IC frames. And the alloy is widely applied to the manufacture of IC frames due to excellent process performance and low cost, and is the mainstream alloy of the copper alloy lead frame material at present. Of the 3 grades of the produced Cu-Fe alloy, C194 alloy is a representative one.
However, the copper alloy of the C194 lead frame produced at present has the problems of uneven alloy structure, fine and dispersed precipitated phase and the like, and the conductivity, the strength, the plasticity and the like of the product can not meet the requirements.
In the prior art, patent publication No. CN 1940104A, published on 4.4.4.2007, "copper alloy for lead frame and manufacturing method thereof", discloses copper alloy in which FE is 2.0-2.6 WT%, ZN is 0.05-0.1 WT%, P is 0.01-0.03 WT%, MG is 0-0.05 WT%, RE is 0.01-1.5 WT%, and the manufacturing method comprises melting raw materials, injecting into a mold, and cooling at a cooling rate of 80 ℃/MIN or more within a temperature range from liquidus temperature to 400 ℃; hot rolling and rolling the casting blank at the heating temperature below 1000 ℃, and repeatedly carrying out cold rolling and two-stage continuous annealing at 300-600 ℃; cold rolling to make its thickness change amount reach above 40%, and annealing at 450 deg.C or below to obtain the final product. However, the tensile strength, hardness, elongation, conductivity and other properties of the copper alloy still cannot be low, and the requirements of the existing product on conductivity, strength, plasticity and the like cannot be met.
Disclosure of Invention
The invention aims to provide an etched lead frame copper casting blank and a production method thereof, wherein through component design and production process control, the alloy structure is uniform, precipitated phases are fine and dispersed, and the comprehensive performance is superior; and the alloy price is relatively low, and the production efficiency is high.
The specific technical scheme of the invention is as follows:
the etched lead frame copper casting blank comprises the following components in percentage by mass:
fe 1.8-2.4%, zn 0.8-1.2%, P0.02-0.05%, mg 0.01-0.03%, re0.01-1.2%, and the balance of Cu and inevitable impurities.
The inevitable impurities are at least one or more of As, sb, bi, pb, sn and Ni elements, and the total amount of the inevitable impurities is controlled to be less than 0.05wt%;
furthermore, in the components of the etched lead frame copper casting blank, the content of S is controlled to be below 25 ppm;
the etched lead frame copper casting blank has the tensile strength of more than 500MPa, the hardness of more than 100Hv, the conductivity of more than 65 percent IACS and the elongation of more than 6.5 percent, and can better meet various requirements of the electronic industry field on the performance of the lead frame material;
the invention provides a production method of an etched lead frame copper casting blank, which comprises the following steps:
1) Heating and melting the electrolytic copper, and then adding a copper-iron intermediate alloy;
2) After the copper-iron intermediate alloy is melted, adding the copper-phosphorus intermediate alloy with the mass being 1/3 of that of the required copper-phosphorus intermediate alloy, and preserving heat;
3) Adding magnesium simple substance, zinc simple substance and rare earth, melting, and keeping the temperature;
4) Adding the rest copper-phosphorus intermediate alloy, melting completely, and keeping the temperature;
5) And (5) casting.
In the step 1), electrolytic copper is heated and melted, and the temperature is controlled to be 1200-1300 ℃;
preserving the heat in the step 2) for 1-3min;
preserving the heat in the step 3) for 3-5min;
preserving the heat in the step 4) for 9-11min;
and 5) casting, namely casting a casting blank of 220 multiplied by 160 multiplied by 650 (mm) by using a small-sized vertical semi-continuous casting machine, performing primary cooling by using a casting mould and performing secondary cooling by using water drenching, wherein the temperature is reduced to be within the temperature range of 400 ℃, and the cooling rate is more than 80 ℃/min.
Furthermore, in the smelting process of the alloy, each element has burning loss with different degrees, and the burning loss rate of Fe is 1-3%, zn is 1-3%, P is 2-4%, mg is 15-25%, and Re is 20-40%; the topping should be given complementary during the course of the ingredients.
The design idea of the invention is as follows: magnesium is a surface active element in copper-based alloys. The addition of a small amount of magnesium has a deoxidizing effect on copper, can improve the high-temperature oxidation resistance of the alloy, refine cast crystal grains, reduce columnar crystals, improve the medium-temperature brittleness of the alloy and improve the hot-working performance. Therefore, the invention adds proper amount of Mg to improve the performance of the casting blank, and controls the adding amount of Mg to be 0.01-0.03%; rhenium Re is a chemical element, a chemical symbol Re, and is extremely important as an auxiliary material of the lead frame copper on the copper alloy; the chemical activity of the rare earth is very strong, the affinity with oxygen is far greater than that of copper, and rare earth oxide with higher melting point and lower density than that of copper is generated, so that the rare earth has good deoxidation effect; the rare earth and hydrogen are combined into hydride with low density, float up to the surface of copper liquid, and are decomposed again at high temperature to discharge hydrogen or are oxidized to enter slag to be removed; after Re is added into the alloy, second phase particles (simple substance iron) precipitated from the strip are fine and dispersed, and the size is 5-20 nm; in addition, the Re can be added to increase the recrystallization temperature of the alloy, thereby improving the high-temperature softening resistance of the alloy, and the softening temperature of the alloy is above 480 ℃. Through the adding sequence of the smelting raw materials, the burning loss is reduced, the components are uniformly mixed, the segregation is reduced, and the quality of a casting blank is improved.
The invention has the following advantages: the designed component system obviously increases the solid solution amount of alloy elements in copper; the crystal grains are greatly refined, the dislocation is reduced, and the structure is more stable; the microsegregation of chemical components is obviously reduced; the crystal defect density is greatly increased; a new metastable phase structure is formed; after aging treatment, the content of the second phase in the copper matrix is improved, and the dispersion strength is increased.
Compared with the prior art, the copper alloy for the lead frame produced by the invention has the advantages of uniform alloy structure, fine and dispersed precipitated phases and excellent comprehensive performance; the lead frame has good wear resistance, corrosion resistance and excellent hot workability, is beneficial to production and manufacture, and is an optimal material for producing electric and electronic components such as lead frames. The alloy of the product of the invention has relatively low price and high production efficiency.
Detailed Description
Example 1 to example 6
An etched copper ingot for a lead frame comprises the following components in percentage by mass, as shown in table 1, with the balance Cu not shown in table 1.
TABLE 1 composition (wt%) of copper alloy of each example and comparative example
The production method for etching the copper casting blank of the lead frame in each embodiment comprises the following steps:
1) In the smelting process of the alloy, each element has burning loss with different degrees, the burning loss rate of Fe is 1-3%, zn is 1-3%, P is 2-4%, mg is 15-25%, and Re is 20-40%; the topping should be given complementary during the course of the ingredients. Heating the electrolytic copper to 1200-1300 ℃ for melting, and then adding a copper-iron intermediate alloy;
2) After the copper-iron intermediate alloy is melted, adding the copper-phosphorus intermediate alloy with the mass being 1/3 of that of the required copper-phosphorus intermediate alloy, and keeping the temperature for 2min;
3) Adding magnesium simple substance, zinc simple substance and rare earth, melting, and keeping the temperature for 4min;
4) Adding the rest copper-phosphorus intermediate alloy, melting completely, and keeping the temperature for 10min;
5) Casting, casting a casting blank of 220 × 160 × 650 (mm) by using a small vertical semi-continuous casting machine, performing primary cooling by using a casting mold and performing secondary cooling by using water showering to reduce the liquidus to a temperature range of 400 ℃, wherein the cooling rate is more than 80 ℃/min.
The slab produced in each of the above examples was heated at a temperature ranging from 900 to 1000 ℃ in a thickness of 220mm, hot rolled and rolled to a thickness of 16mm, and hot rolling workability was evaluated from cracks on the surface and edges. After acid washing, the test material in which no crack was observed under an optical microscope of 50 times was evaluated as good, and the test material in which a crack was observed was evaluated as poor. The casting blank produced by the invention has no crack through the detection and observation. The finishing temperature of hot rolling and rolling is 700 ℃, water cooling is adopted, the temperature reduction rate is 20 ℃/s, the temperature is reduced to 50 ℃, and the grain size is controlled to be about 50 μm by the quenching way. Carrying out aging treatment on the thickness of the rolled steel after rough rolling of 1.4mm at 500 ℃ for 8h; and (3) performing pre-finish rolling and finish rolling to the thickness of 0.2mm, and performing low-temperature annealing at the annealing temperature of 180 ℃ for 4 hours to obtain a product for performance test.
And (3) cutting a test piece from the obtained strip, and measuring the tensile strength, the hardness, the elongation and the conductivity, wherein all performance indexes are measured according to the national standard. The results obtained above are reported in table 2.
TABLE 2 Properties of the examples
Obviously, the copper alloy has good hot workability, is beneficial to production and manufacture, particularly has the characteristics of excellent tensile strength, hardness, elongation, conductivity and the like, and is the best material for producing electric and electronic components such as lead frames and the like; the copper alloy belongs to the Cu-Fe series alloy.
The technical solutions of the present invention are further described by the specific embodiments, and the examples given are only application examples, which should not be construed as a limitation to the scope of the claims of the present invention.
Claims (10)
1. The etched lead frame copper casting blank is characterized by comprising the following components in percentage by mass:
Fe 1.8-2.4％、Zn 0.8-1.2％、P 0.02-0.05％、Mg 0.01-0.03％、Re
0.01-1.2%, and the balance of Cu and inevitable impurities.
2. The etched lead frame copper ingot according to claim 1, wherein the total amount of unavoidable impurities is less than 0.05wt%.
3. The etched lead frame copper ingot according to claim 1, wherein the inevitable impurities are at least one or more of As, sb, bi, pb, sn, ni elements.
4. The etched lead frame copper ingot according to claim 1, wherein the composition of the etched lead frame copper ingot is controlled to have an S content of 25ppm or less.
5. The etched lead frame copper ingot according to claim 1, wherein the etched lead frame copper ingot has a tensile strength of > 500MPa, a hardness of > 100Hv, an electrical conductivity of > 65% IACS, an elongation of > 6.5%.
6. A method for producing an etched lead frame copper ingot according to any one of claims 1 to 5, characterized in that it comprises the following steps:
1) Heating and melting the electrolytic copper, and then adding a copper-iron intermediate alloy;
2) After the copper-iron intermediate alloy is melted, adding the copper-phosphorus intermediate alloy with the mass being 1/3 of that of the required copper-phosphorus intermediate alloy, and preserving heat;
3) Adding magnesium simple substance, zinc simple substance and rare earth, melting, and keeping the temperature;
4) Adding the rest copper-phosphorus intermediate alloy, melting completely, and keeping the temperature;
5) And (5) casting.
7. The production method according to claim 6, wherein in the step 1), the electrolytic copper is melted by heating, and the temperature is controlled to be 1200-1300 ℃.
8. The method according to claim 6, wherein the heat-retaining is performed for 1-3min in the step 2).
9. The method according to claim 6, wherein the heat-retaining is performed for 3 to 5min in the step 3).
10. The method according to claim 6, wherein the heat-retaining is performed for 9-11min in the step 4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211613276.8A CN115821107A (en) | 2022-12-15 | 2022-12-15 | Etched lead frame copper casting blank and production method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211613276.8A CN115821107A (en) | 2022-12-15 | 2022-12-15 | Etched lead frame copper casting blank and production method thereof |
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| CN115821107A true CN115821107A (en) | 2023-03-21 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1932056A (en) * | 2006-09-27 | 2007-03-21 | 苏州有色金属加工研究院 | High temperature copper alloy for lead frame and its making process |
| CN1940104A (en) * | 2006-08-16 | 2007-04-04 | 苏州有色金属加工研究院 | Copper alloy for lead-wire frame and its production |
| CN104928521A (en) * | 2014-03-18 | 2015-09-23 | 株式会社神户制钢所 | Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility |
-
2022
- 2022-12-15 CN CN202211613276.8A patent/CN115821107A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940104A (en) * | 2006-08-16 | 2007-04-04 | 苏州有色金属加工研究院 | Copper alloy for lead-wire frame and its production |
| CN1932056A (en) * | 2006-09-27 | 2007-03-21 | 苏州有色金属加工研究院 | High temperature copper alloy for lead frame and its making process |
| CN104928521A (en) * | 2014-03-18 | 2015-09-23 | 株式会社神户制钢所 | Fe-p based copper alloy sheet excellent in strength, heat resistance and bending processibility |
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