CN115819926A - Resin composition, adhesive film containing same and printed circuit board - Google Patents
Resin composition, adhesive film containing same and printed circuit board Download PDFInfo
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- CN115819926A CN115819926A CN202211622521.1A CN202211622521A CN115819926A CN 115819926 A CN115819926 A CN 115819926A CN 202211622521 A CN202211622521 A CN 202211622521A CN 115819926 A CN115819926 A CN 115819926A
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Abstract
The invention provides a resin composition, an adhesive film containing the resin composition and a printed circuit board, wherein the resin composition comprises the following components in parts by weight: 25-70 parts of resin, 30-60 parts of filler and 1-20 parts of polyaryl ether nitrile containing reactive side groups. The poly (arylene ether nitrile) flexibilizer containing the reactive side group is selected, so that the glue film and the resin-coated copper foil prepared from the resin composition can well solve the problem of poor toughness caused by the addition of the high-filling inorganic filler, have good toughness, and also have the characteristics of high Tg, high copper foil peeling strength, PCT resistance and the like, and can be applied to the printed circuit board of a multilayer laminated plate, particularly the printed circuit board of the multilayer laminated plate for manufacturing fine lines.
Description
Technical Field
The invention belongs to the technical field of resin adhesive films, and relates to a resin composition, an adhesive film containing the resin composition and a printed circuit board containing the resin composition.
Background
With the trend of light, thin, short, small, and multifunctional design of electronic information products, the printed circuit board serving as the main support of electronic components is also being increasingly used to provide high-density wiring, thin, fine aperture, and multi-dimensional stereo features. Since the substrate material largely determines the performance of the printed circuit board, a new generation of base material is urgently required to be developed.
Since the film without a reinforcing material or the resin-coated copper foil can be made thinner, have high-density wiring, have a fine pore diameter, and can be formed into a multi-dimensional shape, it is developed and applied as a new generation of base material. Because of the absence of reinforcing materials, highly filled inorganic fillers are generally added to improve the thermal expansion coefficient, chemical resistance, mechanical strength and the like of the adhesive film material. However, the toughness of the adhesive film is deteriorated due to the introduction of the high-filling inorganic filler, and in order to compensate the toughness, a toughening agent such as rubber and the like can be added for toughening, but the newly introduced toughening agent deteriorates other properties. How to improve the toughness of the adhesive film without reducing other properties, such as Tg, humidity resistance, etc., is the focus of research in this field.
Therefore, in the art, it is desired to develop a thin circuit material which can improve the toughness of a glue film when a highly-filled filler is added, and has high Tg, high copper foil peel strength, and good moisture and heat resistance.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a resin composition, and an adhesive film and a printed circuit board comprising the same.
In order to achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a resin composition, which comprises the following components in parts by weight:
25-70 parts of resin
30-60 parts of filler
1-20 parts of poly (arylene ether nitrile) flexibilizer containing reactive side groups.
The poly (arylene ether nitrile) flexibilizer containing the reactive side group is selected, so that the glue film and the resin-coated copper foil prepared from the resin composition can well solve the problem of poor toughness caused by the addition of the high-filling inorganic filler, have good toughness, and also have the characteristics of high Tg, high copper foil peeling strength, PCT resistance and the like, and can be applied to the printed circuit board of a multilayer laminated plate, particularly the printed circuit board of the multilayer laminated plate for manufacturing fine lines.
In the present invention, the content of the resin in the resin composition is 25 parts, 28 parts, 30 parts, 35 parts, 38 parts, 40 parts, 45 parts, 48 parts, 50 parts, 55 parts, 58 parts, 60 parts, 65 parts, 68 parts or 70 parts.
In the present invention, the content of the filler in the resin composition is 30 parts, 35 parts, 38 parts, 40 parts, 45 parts, 48 parts, 50 parts, 55 parts, 58 parts or 60 parts.
In the present invention, the content of the poly (arylene ether nitrile) flexibilizer containing the reactive side group is 1 part, 2 parts, 3 parts, 5 parts, 7 parts, 10 parts, 13 parts, 15 parts, 18 parts or 20 parts.
In the present invention, "parts" and "parts by weight" are each calculated as a solid content, and do not include a solvent, a dispersant, and the like therein.
Preferably, the pendant reactive group comprises any one or a combination of at least two of an epoxy group, a hydroxyl group, a carboxyl group, or an amine group. The poly (arylene ether nitrile) flexibilizer containing the reactive side group contains the side groups such as epoxy group, hydroxyl group, carboxyl group or amino group and the like, and the reactive side group can generate a crosslinking reaction with resin and/or a curing agent in the resin composition, so that the crosslinking density of the reaction is increased, and the prepared adhesive film has good toughness, high Tg (glass transition temperature), high copper foil peeling strength and improved PCT (PCT) resistance property. Preferably, the content of the reactive side groups may range from 10 to 500. Mu. Eq/g, such as 10. Mu. Eq/g, 20. Mu. Eq/g, 50. Mu. Eq/g, 80. Mu. Eq/g, 100. Mu. Eq/g, 150. Mu. Eq/g, 200. Mu. Eq/g, 250. Mu. Eq/g, 300. Mu. Eq/g, 350. Mu. Eq/g, 400. Mu. Eq/g, 450. Mu. Eq/g or 500. Mu. Eq/g, etc.
Preferably, the polyarylethernitrile containing pendant reactive groups has a number average molecular weight of 20000 to 200000, for example 20000, 30000, 50000, 80000, 100000, 130000, 150000, 180000 or 200000, as determined by gel permeation chromatography based on polystyrene calibration, under number average molecular weight test method GB/T21863-2008.
Preferably, the resin is any one of epoxy resin, phenoxy resin, cyanate ester, polyphenylene oxide, maleimide resin, hydrocarbon resin, acrylate resin, polyimide resin, silicone resin, polyester resin or polystyrene or a combination of at least two of the epoxy resin, the phenoxy resin, the cyanate ester, the polyphenylene oxide, the maleimide resin, the hydrocarbon resin, the acrylate resin, the polyimide resin, the silicone resin, the polyester resin or the polystyrene.
Preferably, the epoxy resin includes any one of or a combination of at least two of bisphenol a type epoxy resin, bisphenol F type epoxy resin, phosphorus-containing epoxy resin, MDI modified epoxy resin, novolac epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene-containing epoxy resin, or alicyclic epoxy resin.
Preferably, the filler is an inorganic filler.
Preferably, the filler is a silica-based filler, preferably spherical silica.
Preferably, the resin composition further comprises a curing agent comprising either or a combination of a phenolic resin or an active ester.
Preferably, the phenolic resin comprises any one of bisphenol a type phenolic resin, phenol type phenolic resin, biphenyl type phenolic resin, dicyclopentadiene type phenolic resin or naphthalene containing phenolic resin or a combination of at least two thereof.
In the present invention, when the main resin contains epoxy resin, the curing agent may be phenolic resin, active ester, etc., and thiol or amine (such as dicyandiamide or aromatic amine, etc.) curing agent is not suitable, which may result in poor PCT resistance after curing the adhesive film. Preferably, the curing agent is present in the resin composition in an amount of 10 to 30 parts by weight, such as 10 parts, 15 parts, 18 parts, 20 parts, 25 parts, 28 parts, or 30 parts.
In the present invention, a thermoplastic resin may be further added without affecting the overall performance of the resin composition, and examples of the thermoplastic resin include a polyvinyl acetal resin, a polyamideimide resin, a polyether sulfone resin, and a polysulfone resin.
In another aspect, the present invention provides a resin dope obtained by dissolving or dispersing the resin composition as described above in a solvent.
The solvent in the present invention is not particularly limited, and specific examples thereof include alcohols such as methanol, ethanol and butanol, ethers such as ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol and butyl carbitol, ketones such as acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone, aromatic hydrocarbons such as toluene, xylene and mesitylene, esters such as ethoxyethyl acetate and ethyl acetate, and nitrogen-containing solvents such as N, N-dimethylformamide, N-dimethylacetamide and N-methyl-2-pyrrolidone. The solvent may be used singly or in combination of two or more, and preferably an aromatic hydrocarbon solvent such as toluene, xylene or mesitylene is used in combination with a ketone solvent such as acetone, methyl ethyl ketone, methyl isobutyl ketone or cyclohexanone. The amount of the solvent to be used can be selected by those skilled in the art according to their own experience, so that the obtained resin glue solution has a viscosity suitable for use.
In another aspect, the present invention provides an adhesive film, which includes a release film, a resin composition as described above attached to the release film by coating and drying, and a protective film coated on the resin composition.
The adhesive film disclosed by the invention contains the resin composition, so that the adhesive film has better toughness and also has the characteristics of high Tg, high copper foil peeling strength, PCT resistance and the like.
Preferably, the thickness of the glue film is 5-300 μm, such as 5 μm, 8 μm, 10 μm, 20 μm, 30 μm, 50 μm, 80 μm, 100 μm, 150 μm, 180 μm, 200 μm, 230 μm, 250 μm, 280 μm or 300 μm, preferably 10-200 μm, further preferably 20-100 μm.
Preferably, the peel strength of the cured copper-plated copper foil after the adhesive film is cured is > 6.0N/cm, such as 6.2N/cm, 6.5N/cm, 6.8N/cm, 7.0N/cm, 7.2N/cm, 7.5N/cm, 7.8N/cm or 8.0N/cm, etc.
In another aspect, the present invention provides a resin-coated copper foil including a copper foil, and a resin layer and a protective film coated on the resin layer, the resin layer being the above-described resin composition attached to the copper foil after being coated and dried.
Preferably, the thickness of the resin layer is 5 to 300. Mu.m, such as 5. Mu.m, 8. Mu.m, 10. Mu.m, 20. Mu.m, 30. Mu.m, 50. Mu.m, 80. Mu.m, 100. Mu.m, 150. Mu.m, 180. Mu.m, 200. Mu.m, 230. Mu.m, 250. Mu.m, 280. Mu.m or 300. Mu.m, preferably 10 to 200. Mu.m, and more preferably 20 to 100. Mu.m.
Preferably, the copper foil has a thickness of 1 to 105 μm, such as 1 μm, 3 μm, 5 μm, 8 μm, 10 μm, 20 μm, 30 μm, 50 μm, 80 μm, 100 μm or 105 μm, preferably 3 to 35 μm, more preferably 5 to 18 μm.
In another aspect, the present invention provides a prepreg, which includes a substrate and the resin composition attached to the substrate after impregnation and drying.
The prepreg of the present invention may also be referred to as prepreg or bonding sheet, and the substrate of the present invention may also be referred to as reinforcement material.
Preferably, the substrate is E-glass fiber cloth, NE-glass fiber cloth, quartz glass fiber cloth, arylamine cloth or the like.
In another aspect, the present invention provides a laminate comprising at least one prepreg as described above.
In another aspect, the present invention provides a metal-clad laminate including one or at least two stacked prepregs as described above, and a metal foil on one side or both sides of the stacked prepregs.
Preferably, the metal foil is a copper foil.
In another aspect, the present invention provides a printed circuit board comprising one or at least two stacked prepregs as described above.
Compared with the prior art, the invention has the following beneficial effects:
the poly (arylene ether nitrile) flexibilizer containing the reactive side group is selected, so that the glue film and the resin-coated copper foil prepared from the resin composition can well solve the problem of poor toughness caused by the addition of the high-filling inorganic filler, have good toughness, and also have the characteristics of high Tg, high copper foil peeling strength, PCT resistance and the like, and can be applied to the printed circuit board of a multilayer laminated plate, particularly the printed circuit board of the multilayer laminated plate for manufacturing fine lines.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments. It should be understood by those skilled in the art that the examples are only for the understanding of the present invention and should not be construed as the specific limitations of the present invention.
Synthesis example 1
Adding diphenolic acid monomer, 2, 6-dichlorobenzonitrile monomer, potassium carbonate as a catalyst, toluene as a dehydrating agent and N-methylpyrrolidone as a first solvent into a container with a mechanical stirring device, a reflux condensing device and a nitrogen inlet and outlet according to a proportion, starting the mechanical stirring device and slowly introducing nitrogen into a mixed system; wherein the mass ratio of the diphenolic acid monomer, the 2, 6-dichlorobenzonitrile monomer and the catalyst is 1: 1; the volume ratio of the dehydrating agent to the first solvent is 1; slowly raising the temperature of the system to 170 ℃, keeping the temperature for 2 hours, keeping the reaction for 2 hours when the reaction system does not regenerate water and is taken out of the system, ensuring the reaction to be fully completed, then heating and stirring, pouring the product after the reaction into absolute ethyl alcohol, precipitating a solid, filtering, crushing, washing and drying the solid to obtain the polyarylethernitrile C1 containing the pendant carboxyl group, wherein the number average molecular weight is 56000.
Synthesis example 2
Adding a 4-aminophenylhydroquinone monomer, a 2, 6-dichlorobenzonitrile monomer, a catalyst potassium phosphate, a dehydrating agent xylene and a first solvent N, N-dimethylformamide into a container with a mechanical stirring device, a reflux condensing device and a nitrogen inlet and outlet according to a proportion, then starting the mechanical stirring device and slowly introducing nitrogen into a mixed system; wherein the mass ratio of the 4-aminophenylhydroquinone monomer, the 2, 6-dichlorobenzonitrile monomer and the catalyst is 1; the mass ratio of the dehydrating agent to the 4-aminophenyl hydroquinone monomer is 20:1; the volume ratio of the dehydrating agent to the first solvent is 1; slowly raising the temperature of the system to 160 ℃, keeping the temperature for 3 hours, keeping the reaction for 2 hours when the reaction system does not regenerate water and is taken out of the system, ensuring the reaction to be fully completed, then heating and stirring, pouring the product after the reaction into deionized water, precipitating a solid, filtering, crushing, washing and drying the solid to obtain the polyarylethernitrile C2 containing the side group amino, wherein the number average molecular weight is 83000.
Example 1
40 parts of epoxy resin (HEXION, EPR 627) and 19 parts of phenolic resin (Dow chemical, XZ 92741), 40 parts of silica (admatechs, 2050 MB), 1 part of toughener (polyarylethernitrile C1 containing pendant carboxyl groups) were added to a butanone solvent and stirred for 2 hours to form a solution with a solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured adhesive film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (the temperature is 100 ℃, the pressure is 0.5MPa, and the time is 1 min), tearing off the release film, carrying out surface treatment, and carrying out copper-melting electroplating to form the laminated printed circuit board with the circuit.
Example 2
34 parts of an epoxy resin (Nippon chemical, NC 3000H) and 16 parts of a phenol resin (HEXION, PHL 6635), 40 parts of silica (admatechs, 2050 MB), 10 parts of a toughening agent (polyarylethernitrile C1 containing pendant carboxyl groups) were added to a butanone solvent and stirred for 2 hours to form a solution having a solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Example 3
27 parts of an epoxy resin (Meiji, EPIKOTE 1001) and 13 parts of an active ester (Japan DIC, HPC-8000-65T), 40 parts of silica (admatechs, 2050 MB), 20 parts of a toughening agent (polyarylethernitrile C2 containing a pendant amino group) were added to a butanone solvent and stirred for 2 hours to form a solution having a solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Example 4
20 parts of cyanate ester (sand, BA 3000) and 30 parts of maleimide resin (CYTEC, M5250), 40 parts of silicon dioxide (admatechs, 2050 MB), 10 parts of flexibilizer (polyarylethernitrile C1 containing pendant carboxyl) are added into butanone solvent and stirred for 2 hours to form a solution with the solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Example 5
30 parts of polyphenylene ether (SABIC, MX 90) and 20 parts of hydrocarbon resin (Japan Caoda, B3000), 40 parts of silicon dioxide (admatechs, 2050 MB), 10 parts of flexibilizer (polyarylether nitrile C1 containing side carboxyl) are added into butanone solvent and stirred for 2 hours to form a solution with the solid content of 65 percent.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 3-5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Example 6
The difference from example 1 was that the phenolic resin (dow chemical, XZ 92741) was replaced with an equal part by weight of dicyandiamide (from basf).
Comparative example 1
40 parts of an epoxy resin (Nippon chemical, NC 3000H) and 20 parts of a phenol resin (HEXION, PHL 6635), 40 parts of silica (admatechs, 2050 MB) were added to a butanone solvent and stirred for 2 hours to form a solution having a solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Comparative example 2
39.5 parts of an epoxy resin (Japan chemical, NC 3000H) and 20 parts of a phenol resin (HEXION, PHL 6635), 40 parts of silica (admatechs, 2050 MB), 0.5 part of a toughening agent (polyarylethernitrile C1 containing pendant carboxyl groups) were added to a butanone solvent and stirred for 2 hours to form a solution having a solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Comparative example 3
23 parts of an epoxy resin (Nippon chemical, NC 3000H) and 12 parts of a phenol resin (HEXION, PHL 6635), 40 parts of silica (admatechs, 2050 MB), 25 parts of a toughening agent (polyarylethernitrile C1 containing pendant carboxyl groups) were added to a butanone solvent and stirred for 2 hours to form a solution having a solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Comparative example 4
34 parts of epoxy resin (Nippon chemical, NC 3000H) and 16 parts of phenol resin (HEXION, PHL 6635), 40 parts of silica (admatechs, 2050 MB), 10 parts of nitrile rubber (ZEON, nipol 1072 CG) were added to a butanone solvent and stirred for 2 hours to form a solution having a solid content of 65%.
And coating the solution on a release film, airing, and baking in an oven at 120 ℃ for 3-5 minutes to obtain the glue film of the semi-cured resin layer. And (3) laminating and curing the semi-cured glue film (with the thickness of 40 mu m) and the browned PCB (printed circuit board) (at the temperature of 100 ℃, under the pressure of 0.5MPa and for 1 min), tearing off the release film, performing surface treatment, and performing copper plating to form the laminated printed circuit board with the circuit.
Comparative example 5
The only difference from example 1 was that the pendant carboxyl group-containing polyarylene ether nitrile therein was replaced with an equal part by weight of a polyarylene ether nitrile (PEN-1100, CHUANCHENYOU) which did not contain a reactive pendant group.
Comparative example 6
The difference from example 1 is that the side group carboxyl group-containing polyarylene ether nitrile C1 was replaced with an equivalent weight part of modified polyether ketone (Yinbao, 1000P).
Comparative example 7
The difference from example 1 was that the pendant carboxyl group-containing polyarylene ether nitrile C1 was replaced with an equal part by weight of polyether sulfone (SOLVAY, 3600 RP).
The examples and comparative examples were tested for performance by the following methods:
(1) Bending-resistant times: the test was carried out according to the method defined in JIS C-6471, test conditions 0.5kg/0.8R;
(2) Copper foil peel strength: testing by an IPC-TM-650.4.9 method, and testing the peel strength of the copper foil layer plated with the surface copper;
(3) Fine line reliability: the percentage of short circuit of the test circuit after reflow soldering is not generated, when the percentage is more than 90 percent, the percentage is good, when the percentage is less than 80 percent, the percentage is poor, and the rest percentage is good;
(4) Resistance to PCT: curing the adhesive film, placing the adhesive film in a pressure cooker, treating the adhesive film for 2 hours at 121 ℃ and 2atm, soaking the adhesive film in a tin furnace at 288 ℃ for 5 minutes until no bubbling or layering occurs and recording as 1 time, repeating the soaking in the tin furnace until the adhesive film is stopped when bubbling or layering occurs, wherein the adhesive film is in a 'good' state when the times are more than 20 times, in a 'poor' state when the times are less than 5 times, and in a 'good' state when the other times are in a 'good' state;
(5) Tg (DSC): the test was carried out by IPC-TM-650.2.4.25 method.
The performance tests of the above examples and comparative examples are compared in tables 1 and 2 below.
TABLE 1
TABLE 2
As can be seen from tables 1 and 2, the adhesive films of examples 1 to 5 have high Tg, good toughness, high peel strength of copper foil, excellent PCT resistance, and excellent fine wiring reliability. Example 6 curing of epoxy with dicyandiamide curing agent worsened the PCT resistance and fine line reliability of the adhesive film.
Comparative example 1 the poly (arylene ether nitrile) flexibilizer containing the reactive side group is not added, the toughness is poor, and the peel strength of the copper foil is low; the dosage of the poly (arylene ether nitrile) toughening agent containing the reactive side group added in the comparative example 2 is too small, the toughness is not greatly improved, and the peeling strength of the copper foil is lower; comparative example 3 added too much poly (arylene ether nitrile) toughening agent containing reactive side groups, resulting in poor PCT resistance. Comparative example 4 the introduction of a nitrile rubber toughening agent results in a reduction in Tg and poor PCT resistance. In comparative example 5, where polyarylene ether nitrile containing no pendant group was used, the resistance to PCT was general; comparative examples 6 and 7 use other types of toughening resins and the copper foil has low peel strength, poor toughness and poor PCT resistance.
The applicant states that the resin composition of the present invention and the adhesive film and the printed circuit board comprising the same are illustrated by the above embodiments, but the present invention is not limited to the above embodiments, i.e. it is not meant that the present invention must be implemented by the above embodiments. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
Claims (10)
1. The resin composition is characterized by comprising the following components in parts by weight:
25-70 parts of resin
30-60 parts of filler
1-20 parts of poly (arylene ether nitrile) flexibilizer containing reactive side groups.
2. The resin composition of claim 1, wherein the pendant reactive group comprises any one or a combination of at least two of an epoxy group, a hydroxyl group, a carboxyl group, or an amine group;
preferably, the resin is any one of epoxy resin, phenoxy resin, cyanate ester, polyphenyl ether, maleimide resin, hydrocarbon resin, acrylate resin, polyimide resin, organic silicon resin, polyester resin or polystyrene or the combination of at least two of the epoxy resin, the phenoxy resin, the cyanate ester, the polyphenyl ether, the maleimide resin, the hydrocarbon resin, the acrylate resin, the polyimide resin, the organic silicon resin, the polyester resin or the polystyrene;
preferably, the epoxy resin comprises any one of or a combination of at least two of bisphenol A type epoxy resin, bisphenol F type epoxy resin, phosphorus-containing epoxy resin, MDI modified epoxy resin, novolac epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene-containing epoxy resin or alicyclic epoxy resin;
preferably, the filler is an inorganic filler;
preferably, the filler is a silica-based filler, preferably spherical silica.
3. The resin composition of claim 1 or 2, further comprising a curing agent comprising any one or a combination of two of a phenolic resin or an active ester;
preferably, the phenolic resin comprises any one of bisphenol a type phenolic resin, phenol type phenolic resin, biphenyl type phenolic resin, dicyclopentadiene type phenolic resin or naphthalene containing phenolic resin or a combination of at least two of the same;
preferably, the content of the curing agent in the resin composition is 10 to 30 parts by weight.
4. A resin dope obtained by dissolving or dispersing the resin composition according to any one of claims 1 to 3 in a solvent.
5. An adhesive film comprising a release film, the resin composition according to any one of claims 1 to 3 attached to the release film by coating and drying, and a protective film covering the resin composition;
preferably, the thickness of the adhesive film is 5-300 μm, preferably 10-200 μm, and further preferably 20-100 μm;
preferably, the peel strength of the copper-plated copper foil after the adhesive film is cured is more than 6.0N/cm.
6. A resin-coated copper foil comprising a copper foil, and a resin layer and a protective film coated on the resin layer, wherein the resin layer is the resin composition according to any one of claims 1 to 3 attached to the copper foil by coating and drying;
preferably, the thickness of the resin layer is 5 to 300 μm, preferably 10 to 200 μm, further preferably 20 to 100 μm;
preferably, the copper foil has a thickness of 1 to 105 μm.
7. A prepreg comprising a substrate and the resin composition according to any one of claims 1 to 3 attached to the substrate by impregnation drying.
8. A laminate comprising at least one prepreg according to claim 7.
9. A metal-clad laminate comprising one or at least two stacked prepregs according to claim 7, and a metal foil on one side or both sides of the stacked prepregs.
10. A printed circuit board comprising one or at least two superimposed prepregs according to claim 7.
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| CN202211622521.1A CN115819926A (en) | 2022-12-16 | 2022-12-16 | Resin composition, adhesive film containing same and printed circuit board |
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| CN202211622521.1A CN115819926A (en) | 2022-12-16 | 2022-12-16 | Resin composition, adhesive film containing same and printed circuit board |
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| CN115819926A true CN115819926A (en) | 2023-03-21 |
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| CN202211622521.1A Pending CN115819926A (en) | 2022-12-16 | 2022-12-16 | Resin composition, adhesive film containing same and printed circuit board |
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