CN115819728A - Epoxy resin composition for coating dry type transformer coil and preparation method thereof - Google Patents
Epoxy resin composition for coating dry type transformer coil and preparation method thereof Download PDFInfo
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- CN115819728A CN115819728A CN202211412696.XA CN202211412696A CN115819728A CN 115819728 A CN115819728 A CN 115819728A CN 202211412696 A CN202211412696 A CN 202211412696A CN 115819728 A CN115819728 A CN 115819728A
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- anhydride
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- 239000000203 mixture Substances 0.000 title claims abstract description 46
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 title claims abstract description 9
- 238000000576 coating method Methods 0.000 title claims abstract description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims abstract description 108
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 65
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 64
- 150000008064 anhydrides Chemical class 0.000 claims abstract description 59
- 239000005011 phenolic resin Substances 0.000 claims abstract description 59
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 59
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- 239000000945 filler Substances 0.000 claims description 15
- 150000008065 acid anhydrides Chemical class 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 4
- 239000012745 toughening agent Substances 0.000 claims description 4
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 3
- 239000003085 diluting agent Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000002383 tung oil Substances 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 abstract description 20
- 239000000463 material Substances 0.000 abstract description 17
- -1 phenolic aldehyde Chemical class 0.000 abstract description 9
- 238000004132 cross linking Methods 0.000 abstract description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 27
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 14
- 239000000047 product Substances 0.000 description 14
- 230000009477 glass transition Effects 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 238000006266 etherification reaction Methods 0.000 description 5
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- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
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- 239000004416 thermosoftening plastic Substances 0.000 description 3
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- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000151 polyglycol Polymers 0.000 description 2
- 239000010695 polyglycol Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011343 solid material Substances 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
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- 239000003814 drug Substances 0.000 description 1
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- 238000010292 electrical insulation Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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Images
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/10—Process efficiency
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The application discloses an epoxy resin composition for coating a dry type transformer coil and a preparation method thereof, wherein the composition comprises the following components: a resin component and a curing agent component; wherein the curing agent component comprises: butanol etherified phenolic resin modified anhydride. The butanol etherified phenolic resin modified anhydride can be used for curing epoxy, free phenolic aldehyde can also be used for curing epoxy, and double cross-linking curing provides better performance for a cured product, so that the addition amount of the accelerator is greatly reduced. The phenolic aldehyde modified material ensures that a cured product has good toughness and very high heat resistance value.
Description
Technical Field
The application relates to the technical field of epoxy resin, in particular to an epoxy resin composition for coating a dry-type transformer coil and a preparation method thereof.
Background
The excellent physical mechanical and electrical insulation properties of epoxy resins, their adhesion to various materials, and their flexibility in the process of use are not available with other thermosets. Therefore, the material can be made into coating, composite materials, casting materials, adhesives, mould pressing materials and injection molding materials, and can be widely applied to various fields of national economy.
The prior art discloses a production method of a low-temperature-resistant epoxy composite material, which endows the composite material with better toughness through the increase of a carbon chain, so that the low-temperature resistance of a cured product is greatly improved. However, because the modifier uses the polyglycol, the crosslinking density of a cured product is obviously reduced, the glass transition temperature of a final product is greatly reduced, the application range of the composite material is greatly limited, and the heat-resistant product cannot be used.
Disclosure of Invention
In order to solve the above-mentioned disadvantages in the art, the present application provides an epoxy resin composition for coating a dry type transformer coil and a method for preparing the same.
According to one aspect of the present application, there is provided an epoxy resin composition for coating a coil of a dry type transformer, the composition comprising: a resin component and a curing agent component;
wherein the curing agent component comprises: butanol etherified phenolic resin modified anhydride.
Further, the resin component includes: 30-40 parts of bisphenol A epoxy resin
1-8 parts of diluent
1-8 parts of toughening agent
30-50 parts of filler;
the curing agent component comprises:
40-60 parts by weight of butanol etherified phenolic resin modified anhydride
40-60 parts of filler
0.002-0.005 weight portion of accelerant.
According to some embodiments of the present application, the butanol etherified phenolic resin modified anhydride is prepared by reacting a butanol etherified phenolic resin with an anhydride;
optionally, the anhydride is a liquid anhydride;
optionally, the liquid anhydride is selected from the group consisting of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, tung oil anhydride.
According to some embodiments of the present application, the butanol etherified phenolic resin is a butanol etherified phenolic resin having a weight average molecular weight of 240 to 500 prepared by reacting phenol, formaldehyde and butanol.
According to some embodiments of the present application, the mass ratio of the butylated phenolic resin to the acid anhydride is 0.2-0.3:1, the reaction temperature is 120-180 ℃, and the reaction time is 3-5h.
According to another aspect of the present application, there is also provided a method for preparing the above epoxy resin composition, comprising:
preparing a curing agent component;
preparing a resin component;
respectively preheating the resin component and the curing agent component in a drying room at 60-80 ℃ for 1-3 hours, and mixing to obtain the curing agent.
According to some embodiments of the present application, the curing agent component is prepared by: uniformly mixing butanol etherified phenolic resin modified anhydride, a filler and an accelerator, wherein the mixing temperature is 50-75 ℃, and the stirring time is 10-30min;
preparing a resin component: uniformly mixing bisphenol A epoxy resin, a diluent, a toughening agent and a filler, wherein the mixing temperature is 55-75 ℃, and the viscosity (25 ℃) of the resin component is 8000-13000cp.
According to some embodiments of the present application, the weight ratio of the resin component to the curing agent component is 1 (0.8-1.2);
the mixing vacuum degree of the resin component and the curing agent component is-0.1 MPa.
According to another aspect of the present application, there is provided a method of manufacturing a heat-resistant dry type transformer coil, including:
pouring the epoxy resin composition onto a transformer coil, and heating and curing to obtain the epoxy resin composition;
wherein, the heating solidification is a curve type temperature rise, comprising: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2-5h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 1-3h; and in the third stage, heating to 110-140 ℃ and preserving heat for 6-10h to obtain the dry type transformer coil.
According to yet another aspect of the present application, there is provided a heat-resistant dry type transformer coil prepared by the above method.
Compared with the prior art, the application at least comprises the following beneficial effects:
according to an embodiment of the present application, there is provided an epoxy resin composition for coating a coil of a dry type transformer, the composition including: a resin component and a curing agent component; the curing agent component comprises: butanol etherified phenolic resin modified acid anhydride.
The application provides a preparation method of butanol etherification phenolic resin modified anhydride curing agent, which is prepared from butanol etherification phenolic resin and anhydride under specific reaction conditions. Structurally, the rigid ring of the phenolic resin provides high heat resistance, the methylene on the butanol provides toughness, meanwhile, the anhydride can be used for curing epoxy, the free phenolic aldehyde can also be used for curing epoxy, and double cross-linking curing provides better performance for a cured product.
The application provides an epoxy resin composition, which comprises the butanol etherified phenolic resin modified anhydride curing agent, and can greatly reduce the addition amount of an accelerant when the epoxy resin composition is prepared.
The application provides a preparation method of an epoxy resin composition, the mixing temperature of the composition is 60-80 ℃, the viscosity of a system is low, the operability is good, and the permeability of a cured product is improved.
Drawings
Fig. 1 is a flowchart of a heat-resistant dry-fried transformer coil according to the present application.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the embodiments of the present application, and it should be understood that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It is specifically noted that similar alternatives and modifications will be apparent to those skilled in the art for the present application, which are deemed to be included herein. It will be apparent to the skilled artisan that modifications, variations or appropriate alterations and combinations of the methods and applications described herein may be made to implement and apply the techniques of the present application without departing from the content, spirit and scope of the application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments.
If the specific conditions are not indicated, the method is carried out according to the conventional conditions or the conditions suggested by the manufacturer, and the raw material medicines or auxiliary materials and the reagents or instruments used by the method are conventional products which can be obtained commercially.
The present application is described in detail below.
The glass transition temperature (Tg) is the temperature at which the glass state changes into the high-elastic state. The glass transition is the inherent property of amorphous polymer materials, is the macroscopic manifestation of the transition of the motion form of polymers, and directly influences the service performance and the process performance of the materials, so the glass transition is the main content of polymer physical research for a long time. The main characteristic is the heat-resistant performance of the material.
Phenolic resin is a high-TG heat-resistant material with strong rigidity, and phenolic resin is also a high-temperature curing agent of epoxy resin, but because the thermoplastic phenolic resin is a solid material, the thermoplastic phenolic resin is generally used in high-temperature die-casting products such as copper-clad plates and the like, and cannot be used as a casting material. The application provides a liquid phenolic aldehyde modified anhydride material, so that a cured product has good toughness and very high TG.
The phenolic aldehyde modified anhydride material is prepared by reacting butanol etherified phenolic resin with liquid anhydride, and the reaction mainly comprises the step of carrying out addition reaction on hydroxyl on phenolic aldehyde and anhydride groups of the anhydride to obtain the liquid phenolic aldehyde modified anhydride. Among them, the rigid ring on the phenolic resin provides high heat resistance, and the methylene group on butanol provides toughness.
The traditional toughening agent selects the polyalcohol, the toughening is mainly enhanced by a carbon chain, and only one long carbon chain is provided, so that the crosslinking density of a system is reduced, and the glass transition temperature is greatly reduced. The butanol etherified phenolic aldehyde is phenolic resin obtained by reacting phenol, formaldehyde and butanol, namely benzene rings provide heat resistance, and carbon chains of the butanol provide toughness, so that the glass transition temperature of the product cannot be greatly reduced while the toughness is improved.
The modified epoxy composition of the present application is composed of a resin component and a curing agent component.
The curing agent component comprises:
40-60 parts by weight of butanol etherified phenolic resin modified anhydride
40-60 parts of filler
0.002-0.005 weight portion of accelerant.
The two components are respectively preheated in a drying room at 60 ℃ for 12 hours, then added into a final mixing tank according to the proportion of 1; curing is carried out according to a curing curve of 5h at 80 ℃, 2h at 100 ℃ and 12-18h at 130 ℃.
The butanol etherified phenolic resin modified anhydride is prepared by butanol etherified phenolic resin with the weight average molecular weight of 240-500, which is prepared by reacting phenol, formaldehyde and butanol, and if the molecular weight is too small, the resin cross-linking density is low, the strength of the castable is poor, and the viscosity of the composition with the too high molecular weight influences permeation, so that bubbles appear in the product, the strength is influenced, and the partial discharge of a transformer is also influenced.
In order to achieve better curing of the epoxy with the anhydride, the prior art typically adds an accelerator in an amount of 2% to 4% of the curing agent component. Or in order to shorten the curing time, the modified acid anhydride epoxy resin composition also comprises a latent accelerator, and the latent accelerator is 1 to 5.5 parts by weight. The modified anhydride curing agent can cure epoxy by anhydride, can also cure epoxy by free phenolic aldehyde, and gives better performance to a cured product by double cross-linking curing, so that the addition amount of the accelerator is greatly reduced, and only 2-5 per mill of the curing agent component needs to be added; meanwhile, the temperature of the early-stage material mixing is increased, the problem of slow reaction in the initial stage can be solved, the higher the temperature is, the lower the viscosity of the product system is, the better the operability is, and the permeability of the product can also be improved.
The application relates to a production method of a high-toughness high-heat-resistance dry-type transformer, which comprises the following steps: the transformer comprises a transformer base, a coil and an iron core, wherein the coil and the iron core are vertically arranged on the base, the coil is completely coated by a modified epoxy composite material, the upper part of the iron core is fixed by a clamping piece, and the clamping piece is provided with a lifting ring and a pin.
The present application will be described in detail with reference to specific examples.
Examples 1 to 1
The preparation method of the butanol etherification phenolic resin modified anhydride curing agent comprises the following steps:
(1) Mixing phenol and formaldehyde according to the proportion of 1
(2) The weight average molecular weight of the butanol etherified phenolic resin is about 240;
(3) The mass ratio is 0.2: the butanol etherified phenolic resin of 1 reacts with methyl tetrahydrophthalic anhydride at 120 ℃ for 5 hours to obtain the butanol etherified phenolic resin modified anhydride curing agent.
Examples 1 to 2
The preparation method of the butanol etherification phenolic resin modified anhydride curing agent comprises the following steps:
(1) Mixing phenol and formaldehyde according to the proportion of 1
(2) The weight average molecular weight of the butanol etherified phenolic resin is about 350;
(3) The mass ratio is 0.3: the butanol etherified phenolic resin of 1 reacts with methyl hexahydrophthalic anhydride at 150 ℃ for 4 hours to obtain the butanol etherified phenolic resin modified anhydride curing agent.
Examples 1 to 3
The preparation of the butanol etherified phenolic resin modified anhydride curing agent comprises the following steps:
(1) Mixing phenol and formaldehyde according to the proportion of 1
(2) The weight average molecular weight of the butanol etherified phenolic resin is about 500;
(3) The mass ratio is 0.25: the butanol etherified phenolic resin of 1 and tung oil anhydride react for 3 hours at 180 ℃ to obtain the butanol etherified phenolic resin modified anhydride curing agent.
Comparative examples 1 to 1
Preparation of butanol etherified phenolic resin modified anhydride curing agent with weight average molecular weight of 600:
the procedure was as in examples 1-3 except that phenol and formaldehyde were mixed in the ratio of 1.
Comparative examples 1 to 2
Preparation of butanol etherified phenolic resin modified anhydride curing agent with weight average molecular weight of 200:
the procedure was as in examples 1-3 except that phenol and formaldehyde were mixed in the ratio of 1.
Comparative examples 1 to 3
Preparation of phenolic resin modified anhydride curing agent:
(1) A phenolic resin;
(2) The mass ratio is 0.2:1 with methyl tetrahydrophthalic anhydride at 120 ℃ for 5h.
The unmodified phenolic resin is connected through methyl, although the heat resistance is good, the brittleness is high, and the butanol etherified phenolic resin not only has a rigid ring and has excellent heat resistance, but also has ether bonds to improve the toughness of the material.
Comparative examples 1 to 4
Preparing a butanol etherification phenolic resin modified anhydride curing agent:
(1) Butanol etherified phenolic resin with the weight average molecular weight of 350, which is prepared by the reaction of phenol, formaldehyde and butanol;
(2) The mass ratio is 0.2:1, reacting the butanol etherified phenolic resin with tetrahydrophthalic anhydride at 120 ℃ for 5 hours. The curing agent reactant is in the form of a paste.
Example 2-1
Modified epoxy composition containing Butanol-etherified phenolic resin-modified acid anhydride curing agent of example 1-1
The curing agent consists of a resin component and a curing agent component:
curing agent component:
40 parts by weight of butanol etherified phenolic resin modified anhydride
40 parts by weight of filler
0.002 weight part of accelerant.
Setting curing time: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 1h; and in the third stage, the temperature is increased to 110-140 ℃ and is kept for 6h to obtain the dry type transformer coil.
Examples 2 to 2
Modified epoxy composition containing Butanol-etherified phenolic resin-modified anhydride curing agent of example 1-2
The curing agent consists of a resin component and a curing agent component:
curing agent component:
40 parts by weight of butanol etherified phenolic resin modified anhydride
60 parts by weight of filler
0.005 part by weight of accelerator.
Setting curing time: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 1h; and in the third stage, the temperature is increased to 110-140 ℃ and is kept for 6h to obtain the dry type transformer coil.
Examples 2 to 3
Modified epoxy composition containing Butanol-etherified phenolic resin modified anhydride curing agent of examples 1 to 3
Curing agent component:
50 parts by weight of butanol etherified phenolic resin modified acid anhydride
50 parts by weight of filler
0.0034 parts by weight of accelerator.
Setting curing time: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 1h; and in the third stage, the temperature is increased to 110-140 ℃ and is kept for 6h to obtain the dry type transformer coil.
Comparative example 2-1
Modified epoxy composition containing Butanol-etherified phenolic resin modified anhydride curing agent of comparative examples 1 to 1
The curing agent consists of a resin component and a curing agent component:
curing agent component:
50 parts by weight of butanol etherified phenolic resin modified acid anhydride
50 parts by weight of filler
0.002 weight part of accelerant.
Setting curing time: direct 110 ℃ curing for 15h
The weight average molecular weight of the modified anhydride is too high, so that the viscosity of the composition is too high to influence permeation, and bubbles appear in the product.
Comparative examples 2 to 2
Modified epoxy composition containing Butanol-etherified phenolic resin modified anhydride curing agent of comparative examples 1 to 2
The curing agent consists of a resin component and a curing agent component:
curing agent component:
50 parts by weight of butanol etherified phenolic resin modified acid anhydride
50 parts by weight of filler
0.002 weight portion of accelerant.
Setting curing time: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 3h; and in the third stage, the temperature is increased to 110-140 ℃ and is kept for 10 hours, and then the dry type transformer coil is obtained.
The weight average molecular weight of the modified anhydride is too small, so that the resin has low crosslinking density and poor strength of the casting material.
Comparative examples 2 to 3
Modified epoxy composition with chemically modified polycarbonate anhydride curing agent
The chemically modified polycarbonic anhydride is a reaction product of a polycarbonic anhydride and a diol or a polyglycol or a reaction product of a polycarbonic anhydride and a compound containing two carboxyl groups.
The modified epoxy composition is composed of a resin component and a curing agent component:
curing agent component:
40 parts by weight of chemically modified polycarbonate anhydride
60 parts by weight of filler
0.005 part by weight of accelerator.
Setting curing time: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 3h; and in the third stage, the temperature is increased to 110-140 ℃ and is kept for 10 hours, and then the dry type transformer coil is obtained.
Comparative examples 2 to 4
The modified epoxy composition is composed of a resin component and a curing agent component;
curing agent component:
40 parts by weight of thermoplastic phenolic resin
40 parts by weight of filler
0.001 part by weight of accelerator.
Setting curing time: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 3h; and in the third stage, the temperature is increased to 110-140 ℃ and is kept for 10 hours, and then the dry type transformer coil is obtained.
The composition prepared by the component is a solid material and cannot be used as a casting material.
Application example
A heat-resistant dry-fried transformer coil was prepared using the epoxy resin composition of example 2-1.
Pouring the epoxy resin composition prepared in the example 2-1 onto a transformer coil, heating and curing, and raising the temperature to 75 ℃ in the first stage and preserving the temperature for 4 hours; in the second stage, the temperature is raised to 98 ℃ and is kept for 2h; and in the third stage, the temperature is increased to 115 ℃ and is kept for 6 hours, and the heat-resistant dry-type transformer coil is obtained.
Comparative application example
A heat-resistant dry-fried transformer coil was prepared using the epoxy resin composition of example 2-1.
The epoxy resin composition prepared in example 2-1 was poured onto a transformer coil, and cured by heating at 110 ℃ for 10 hours.
This application example adopts a segmentation heating methods, leads to this reaction solidification very fast, and three binding post fracture phenomena appear in binding post department during the die sinking.
Test examples
The properties of the modified epoxy composition containing a butanol etherified phenolic resin modified acid anhydride of the present application were tested by the following method.
TG value test: detection method IEC61006
And (3) toughness testing: the test pieces were tested in accordance with ISO Standard 527 (tensile strength) ISO178 (flexural strength) using a universal tester.
| TG value of ℃ | Flexural Strength N | Tensile Strength N | Curing time h | |
| Example 2-1 | 78 | 92 | 82 | 9 |
| Examples 2 to 2 | 79 | 97 | 86 | 9 |
| Examples 2 to 3 | 79 | 102 | 94 | 9 |
| Comparative example 2-1 | 67 | 73 | 64 | 15 |
| Comparative examples 2 to 2 | 65 | 76 | 69 | 15 |
| Comparative examples 2 to 3 | 66 | 72 | 62 | 15 |
From the above table data, it can be seen that the modified epoxy composition TG containing the butylated phenolic resin modified anhydride of the present invention is high, but the toughness is still good, and the material has such high tensile strength while maintaining high TG, and the excellent properties of the material are exhibited. Meanwhile, the curing agent can obviously shorten the curing time, and the epoxy resin composition has good heat resistance and highest strength.
The above description of the embodiments is only intended to help understand the method of the present application and its core ideas. It should be noted that, for those skilled in the art, without departing from the principle of the present application, the present application can also make several improvements and modifications, and those improvements and modifications also fall into the protection scope of the claims of the present application.
Claims (10)
1. An epoxy resin composition for coating a dry type transformer coil, the composition comprising: a resin component and a curing agent component;
wherein the curing agent component comprises: butanol etherified phenolic resin modified anhydride.
2. The epoxy resin composition according to claim 1,
the resin component includes:
the curing agent component comprises:
40-60 parts by weight of butanol etherified phenolic resin modified anhydride
40-60 parts of filler
0.002-0.005 weight portion of accelerant.
3. The epoxy resin composition of claim 1, wherein the butanol etherified phenolic resin modified anhydride is prepared by reacting a butanol etherified phenolic resin with an anhydride;
preferably, the acid anhydride is a liquid acid anhydride;
preferably, the liquid anhydride is selected from the group consisting of methyl tetrahydrophthalic anhydride, methyl hexahydrophthalic anhydride, tung oil anhydride.
4. The epoxy resin composition of claim 3, wherein the butylated phenolic resin has a weight average molecular weight of 240-500.
5. The epoxy resin composition of claim 3, wherein the mass ratio of the butylated phenolic resin to the anhydride is 0.2-0.3:1, the reaction temperature is 120-180 ℃, and the reaction time is 3-5h.
6. A method for preparing the epoxy resin composition according to any one of claims 1 to 5, comprising:
preparing a curing agent component;
preparing a resin component;
respectively preheating the resin component and the curing agent component in a drying room at 60-80 ℃ for 1-3 hours, and mixing to obtain the curing agent.
7. The method of claim 6, wherein the curing agent component is prepared by: uniformly mixing butanol etherified phenolic resin modified anhydride, a filler and an accelerator, wherein the mixing temperature is 50-75 ℃, and the stirring time is 10-30min;
preparing a resin component: uniformly mixing bisphenol A epoxy resin, a diluent, a toughening agent and a filler, wherein the mixing temperature is 55-75 ℃, and the viscosity of the resin component is 8000-13000cp.
8. The method according to claim 7, wherein the weight ratio of the resin component to the curing agent component is 1 (0.8-1.2);
the mixing vacuum degree of the resin component and the curing agent component is-0.1 MPa.
9. A preparation method of a heat-resistant dry-type transformer coil is characterized by comprising the following steps:
pouring the epoxy resin composition of any one of claims 1 to 5 onto a transformer coil, and heating and curing to obtain the epoxy resin composition;
wherein, the heating solidification is a curve type temperature rise, comprising: in the first stage, the temperature is raised to 70-85 ℃ and is kept for 2-5h; in the second stage, the temperature is raised to 95-105 ℃ and is kept for 1-3h; and in the third stage, the temperature is increased to 110-140 ℃ and is kept for 6-10h to obtain the dry type transformer coil.
10. A heat resistant dry-type transformer coil prepared by the method of claim 9.
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| CN202211412696.XA CN115819728A (en) | 2022-11-11 | 2022-11-11 | Epoxy resin composition for coating dry type transformer coil and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211412696.XA CN115819728A (en) | 2022-11-11 | 2022-11-11 | Epoxy resin composition for coating dry type transformer coil and preparation method thereof |
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Effective date of registration: 20240722 Address after: 250204 Diao Town Industrial Economic Development Zone, Zhangqiu District, Jinan City, Shandong Province Applicant after: SHANDONG SHENGQUAN NEW MATERIAL Co.,Ltd. Country or region after: China Address before: 250204 Diao Town Industrial Economic Development Zone, Zhangqiu District, Jinan City, Shandong Province Applicant before: SHANDONG SHENGQUAN NEW MATERIAL Co.,Ltd. Country or region before: China Applicant before: BEIJING MECHANICAL AND ELECTRICAL ENGINEERING GENERAL DESIGN DEPARTMENT |