CN115803122B - Method for producing laminated body - Google Patents
Method for producing laminated body Download PDFInfo
- Publication number
- CN115803122B CN115803122B CN202180046651.2A CN202180046651A CN115803122B CN 115803122 B CN115803122 B CN 115803122B CN 202180046651 A CN202180046651 A CN 202180046651A CN 115803122 B CN115803122 B CN 115803122B
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- Prior art keywords
- resin film
- laminate
- support material
- support
- film
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
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- 238000000034 method Methods 0.000 claims abstract description 49
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- 239000004642 Polyimide Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 6
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- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 3
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- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
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- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
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- 238000001704 evaporation Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
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- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
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- 238000007711 solidification Methods 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The application provides a method for manufacturing a laminate for a flexible touch sensor and a screen display without warping. The gist of the present application is also a method for producing a laminate of a resin film and a base material (base material a) for the purpose of laminating the resin film, the method comprising: a step (step A) of forming a resin film on the support material A; a step (step B) of bonding another support material B to a surface of the resin film opposite to the support material a to obtain a laminate; a step (step C) of peeling off the laminate obtained in the step B at the interface between the support material A and the resin film to obtain a laminate of the resin film and the support material B; a step (step D) of bonding a base material A to a surface of the laminate obtained in the step C on the opposite side of the support material B to obtain a laminate; and (c) peeling off the laminate obtained in the step D at the interface between the support material B and the resin film to obtain a laminate of the resin film and the base material a (step E), wherein Eb/(ea+eb) is 0.04 or less, where Ea is the elastic modulus of the resin film and Eb is the elastic modulus of the support material B.
Description
Technical Field
The present application relates to a method for manufacturing a laminate for a flexible touch sensor, a screen display, or the like.
Background
In recent years, for applications of flexibility to electronic terminals such as smart phones and tablet computers, it is demanded to thin image display members such as a resin film having a touch sensor function, an organic light emitting diode, a liquid crystal panel, and electronic paper in order to improve flexibility. As a method for producing the same, the following method is known: a thin and highly flexible electronic terminal is manufactured by forming a resin film such as polyimide or COP (cyclic olefin polymer) on a support material such as glass, forming electrodes for touch sensors on the resin film, peeling off the interface between the glass and the resin film, and then bonding the resin film to a substrate such as PET film, OLED panel, polarizing plate, color filter, TFT substrate, or cover glass (patent documents 1 to 3).
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2018-116859
Patent document 2: japanese patent application laid-open No. 2018-132768
Patent document 3: japanese patent application laid-open No. 2014-34590
Disclosure of Invention
Problems to be solved by the application
However, in recent years, demands for further thinning of touch sensors and image display members have been increasing, and thinner materials have been required for resin films and substrates used for these. In the method of forming a resin film such as polyimide or COP (cyclic olefin polymer) on a glass substrate and peeling the resin film from the glass substrate to laminate the resin film on a PET film or the like, which is known in the prior art, if the resin film is thinned, there is a problem that the resin film itself is split due to stress at the time of peeling or handling becomes difficult because of lack of toughness (japanese: コ).
Therefore, it is considered to directly form a resin film such as polyimide or COP (cyclic olefin polymer) on a PET film or the like to be targeted. However, for example, a polyimide film is generally obtained by coating and drying a polyimide dissolved in a solvent on a PET film and closing a ring if necessary, but a shrinkage stress is generated in the polyimide film due to volume shrinkage caused by evaporation of the solvent and dehydration reaction of the closed ring. The polyimide film has a problem of warping together with the thin PET film due to shrinkage stress of the polyimide film. This is similar to the lamination by melt casting used for polyolefin films and the like, and there is still a problem that shrinkage stress occurs in the resin film and warpage occurs in the laminate with the PET film due to volume shrinkage upon cooling and solidification of the molten resin.
Accordingly, an object of the present application is to provide a method for manufacturing a laminate by suppressing warpage of the laminate even when a material having high shrinkage is used.
Means for solving the problems
In order to solve the above problems, the present application mainly has the following configuration.
The present application provides a method for producing a laminate of a resin film and a base material (base material a) for the purpose of lamination with the resin film, the method comprising:
a step (step A) of forming a resin film on a support (support A);
a step (step B) of bonding another support material (support material B) to a surface of the resin film opposite to the side on which the support material a is provided, to obtain a laminate;
a step (step C) of peeling off the laminate obtained in the step B at the interface between the support material A and the resin film to obtain a laminate of the resin film and the support material B;
a step (step D) of bonding a base material a to a surface of the laminate obtained in the step C, the surface being opposite to the side on which the support material B is provided;
a step (step E) of peeling off the laminate obtained in the step D at the interface between the support material B and the resin film to obtain a laminate of the resin film and the base material A,
wherein Eb/(Ea+Eb) is 0.04 or less when Ea is the elastic modulus of the resin film and Eb is the elastic modulus of the support material B.
Effects of the application
According to the present application, even when a material having a high contractility is used, warpage of the laminate can be highly suppressed.
Drawings
Fig. 1 is a schematic diagram illustrating a method for manufacturing a laminate according to the first embodiment.
Fig. 2 is a schematic view showing an example of a jig for stretching the support material B according to the second embodiment, where (a) is a front view and (B) is a sectional view taken along A-A'.
Fig. 3 is a diagram illustrating a pattern of application of the conductive paste in the touch sensor fabricated in example 13.
Fig. 4 is a diagram schematically showing a touch sensor fabricated in example 13, (a) is a top view, and (b) is a side view when viewed from the a side.
Detailed Description
As a result of the study by the inventors of the present application, the following method for producing a laminate was devised: if a special treatment for relaxing the shrinkage stress is performed, warpage of the laminate can be suppressed even when a material having strong shrinkage is used, and also good operability can be achieved.
Hereinafter, a mode for carrying out the method for producing a laminate according to the present application (hereinafter, referred to as "embodiment") will be described. It should be noted that the drawings are schematic. The present application is not limited to the embodiments described below.
First embodiment
The method for producing a laminate according to the present embodiment is a method for producing a laminate of a resin film and a base material (base material a) for the purpose of laminating the resin film, and includes:
a step (step A) of forming a resin film on a support (support A);
a step (step B) of bonding another support material (support material B) to a surface of the resin film opposite to the side on which the support material a is provided, to obtain a laminate;
a step (step C) of peeling off the laminate obtained in the step B at the interface between the support material A and the resin film to obtain a laminate of the resin film and the support material B;
a step (step D) of bonding a base material a to a surface of the laminate obtained in the step C, the surface being opposite to the side on which the support material B is provided;
a step (step E) of peeling off the laminate obtained in the step D at the interface between the support material B and the resin film to obtain a laminate of the resin film and the base material A,
wherein Eb/(Ea+Eb) is 0.04 or less when Ea is the elastic modulus of the resin film and Eb is the elastic modulus of the support material B.
The method for producing a laminate according to the present embodiment is a method for producing a laminate of a resin film and a base material (base material a) for the purpose of lamination with the resin film.
Examples of the resin film include polyimide, COP, PEN (polyethylene naphthalate), PET (polyethylene terephthalate), PC (polycarbonate), and acrylic resin. Among them, polyimide is preferable from the viewpoints of bendability and optical characteristics. Further, transparent polyimide having a yellowness (YI value) of 0.0 to 2.0, preferably 0.0 to 1.5, is preferable. These may be laminated in two or more layers, or an electrode, a light-emitting layer, an inorganic thin film, or the like may be formed over a resin film.
The elastic modulus Ea of the resin film may be set to 0.04 or less as long as Eb/(ea+eb) described later, but may be 10 in view of the elastic modulus of the resin film that is generally available 8.5 Pa～10 9.8 Pa。
The elastic modulus Ea of the resin film can be obtained from the slope of the stress-strain curve by the method described in the examples using a tensile tester. The resin film can be obtained in the same manner even if two or more layers are laminated.
The thickness of the resin film is preferably 3 to 50. Mu.m. By setting the thickness of the resin film to 3 μm or more, the strength of the resin film is improved, and occurrence of cracks in the resin film can be prevented when the resin film is peeled off in step C. In addition, by setting the thickness of the resin film to 50 μm or less, high flexibility can be obtained.
Examples of the substrate a include a PET film, a PP (polypropylene) film, a PE (polyethylene) film, an OLED (Organic Light Emitting Diode; organic light emitting diode) panel, a polarizing plate, a color filter, a TFT (thin film transistor ) substrate, and a cover glass.
< procedure A >)
The method for producing a laminate according to the present embodiment includes a step of forming a resin film on a support (support a). As described above, the resin film is to shrink, but is fixed to the support material a and cannot shrink, so that residual stress is generated in the resin film and remains in the film.
As a method for forming the resin film, for example, a method of applying a varnish to the support a, drying the applied varnish, exposing the obtained dried film to light, and heating the exposed film is mentioned.
When the varnish is applied to the support a, the varnish may contain a resin or a resin precursor, or may contain a solvent. The type of the solvent is not particularly limited, and may be appropriately selected according to the solubility of the resin to be used and the coating method, and may be 1 or 2 or more solvents selected from ester solvents, ketone solvents, glycol ethers, aliphatic solvents, alicyclic solvents, aromatic solvents, alcohol solvents, and aqueous solvents. Specifically, N-dimethylacetamide, N-dimethylformamide, N-methyl-2-pyrrolidone, dimethylimidazolidinone, dimethylsulfoxide, gamma-butyrolactone, ethyl lactate, 2-dimethylaminoethanol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, ethylene glycol mono-N-propyl ether, diacetone alcohol, tetrahydrofurfuryl alcohol, propylene glycol monomethyl ether acetate, and the like can be mentioned.
Examples of the coating method of the varnish include spin coating using a rotator, spray coating, roll coating, screen printing, and coating using a blade coater, a die coater, a calender coater, a liquid meniscus coater, and a bar coater.
Examples of the method for drying the applied varnish include heat drying by an oven, a hot plate, infrared rays, and vacuum drying. It is preferable that the heat drying is performed in the range of 50 to 180 ℃ for 1 minute to several hours.
The resulting dried film was subjected to photo-curing based on exposure. In exposure, a mercury lamp, an LED, an LD, a xenon lamp, or the like can be used as a light source. Examples of the method for performing heat curing include heat drying by an oven, an inert oven, a hot plate, infrared rays, and vacuum drying.
Further, the film after exposure is heated. The heating temperature is preferably in the range of 100 to 300 ℃.
When the resin film is formed of two or more layers, the same operation can be repeated to laminate the resin films. The resin film used in the present application may be a resin film, and a structure made of a material other than a resin may be provided on the resin film within a range that does not hinder the effects of the present application. The electrode, the light-emitting layer, the inorganic thin film, and the like can be formed on the resin film by sputtering, vapor deposition, ion plating, screen printing, spin coater, slit die coater, gravure printing, flexographic printing, and the like.
As the support material a, glass, quartz, alumina, zirconia, SUS, polyimide, acrylic, or the like can be used. In step C described later, when the support material a and the resin film are peeled off by using a laser, a glass having high light transmittance and high heat resistance is preferable. Further, a release layer may be provided on the surface of the support material a. Since the release layer is provided, the adhesion force between the support a and the resin film is reduced, and thus the release can be performed with a small force in the step C, and the release can be performed easily.
< procedure B >)
The method for producing a laminate according to the present embodiment includes a step of bonding another support material (support material B) to a surface of a resin film on the opposite side of the resin film from the side on which the support material a is provided.
Examples of the support material B include Intelimer (registered trademark) Tape CS2350NA4, CS2325NA4, and CS2325NA3 (both manufactured by NITTA CORPORATION).
The elastic modulus Eb of the support material B may be such that Eb/(ea+eb) described later is 0.04 or less, but may be 10 in view of the elastic modulus of a resin film that is generally available 6.0 Pa～10 8.5 Pa. The elastic modulus Eb of the support material B was 10 6.0 Pa or more, the resin film can be supported without deformation. On the other hand, the elastic modulus Eb of the support material B was 10 8.5 Pa or less, the laminate of the resin film and the support B is shrunk together with the resin film in step C, and the residual stress of the resin film can be further reduced. The elastic modulus Eb of the support material B is more preferably 10 6.8 Pa or below.
The thickness of the support material B is preferably 15 μm to 500. Mu.m. By making the thickness of the support material B15 μm or more, handling becomes easy. On the other hand, by making the thickness of the support material B500 μm or less, the resin film is easily contracted together with the support material B in the step C, and thus the residual stress of the resin film can be further reduced. The thickness of the support material B is more preferably 30 μm or less.
In the method for producing a laminate according to the present embodiment, eb/(ea+eb) is 0.04 or less, where Ea is the elastic modulus of the resin film and Eb is the elastic modulus of the support material B. If Eb/(ea+eb) is greater than 0.04, the laminate of the resin film and the support B cannot be sufficiently shrunk in step C described later, and the residual stress of the resin film increases. As a result, in step E, warpage occurs after the laminate of the resin film and the base material a is formed.
< procedure C >)
The method for producing a laminate according to the present embodiment includes a step of peeling the laminate obtained in the step B at the interface between the support a and the resin film to obtain a laminate of the resin film and the support B. In this step, the resin film is separated from the support material a, and contracts together with the support material B due to residual stress. In the case where shrinkage is insufficient, a stress remains in the resin film.
Examples of the peeling method include a method of mechanical peeling and a method of irradiating laser light from the back surface of the support material a to the interface between the support material a and the resin film.
< procedure D >)
The method for producing a laminate according to the present embodiment includes a step of bonding a base material a to a surface of the laminate obtained in the step C on the opposite side of the side on which the support material B is provided, to obtain a laminate.
The laminate obtained in step C and the base material a can be bonded by using a bonding apparatus, fixing the surfaces opposite to the surfaces to be bonded with an adsorption table, bonding the surfaces to be bonded to each other, and then releasing the fixation. In the bonding, a member such as a screen mesh (screen mesh) that can be easily deformed is used as the suction table, and the member is bonded while being rubbed by a roller, a blade (blade), or the like, whereby bubbles or wrinkles can be prevented from being generated. Examples of the apparatus for bonding include a manual single-chip mounter SE650n (manufactured by CLIMB PRODUCTSCO., LTD).
< procedure E >)
The method for producing a laminate according to the present embodiment includes a step of peeling the laminate obtained in the step D at the interface between the support material B and the resin film to obtain a laminate of the resin film and the base material a. In this step, when the residual stress of the resin film is large, warpage occurs in the laminate of the resin film and the base material a, but when the residual stress of the resin film is small, warpage can be suppressed.
Second embodiment
The method for producing a laminate according to the present embodiment is a method for producing a laminate of a resin film and a base material (base material a) for the purpose of laminating the resin film, and includes:
a step (step A) of forming a resin film on a support (support A);
a step (step B) of bonding another support material (support material B) to a surface of the resin film opposite to the side on which the support material a is provided, to obtain a laminate;
a step (step C) of peeling off the laminate obtained in the step B at the interface between the support material A and the resin film to obtain a laminate of the resin film and the support material B;
a step (step F) of shrinking the laminate of the resin film and the support material B by 2000ppm or more;
a step (step D') of bonding a base material a to a surface of the laminate obtained in the step C opposite to the side on which the support material B is provided after the step F;
and (c) peeling the laminate obtained in the step D 'at the interface between the support material B and the resin film to obtain a laminate of the resin film and the base material a (step E').
The method for producing a laminate according to the present embodiment includes a step (step F) of shrinking the laminate of the resin film and the support material B by 2000ppm or more after the step C. By this step, the residual stress of the resin film is relaxed. If the shrinkage of the laminate of the resin film and the support B is less than 2000ppm, warpage is likely to occur when the laminate of the resin film and the base a is obtained in step E. The shrinkage of the laminate of the resin film and the support material B is more preferably 4000ppm or more.
As a method for shrinking the laminate of the resin film and the support B, there is mentioned: a method of reducing the temperature of the laminate of the resin film and the support material B; a method in which a laminate of a support material A and a resin film is bonded to a support material B which has been previously stretched, and the support material A is peeled off, and then the support material B to which the resin film is bonded is contracted; etc. Here, the meaning of extending the support material B is that the surface area is enlarged by applying heat or external force, and the residual stress of the bonded resin film is removed by restoration when the heat or external force is removed.
When the temperature of the laminate of the resin film and the support material B is reduced, the laminate of the resin film and the support material B can be set to 2000ppm or more by adjusting the temperature to be reduced according to the coefficient of thermal expansion of the support material B. Examples of the support material B include urethane gel, silicone gel, PMMA (polymethyl methacrylate), magnesium alloy AZ91, and the like. In addition, an adhesive layer may be provided on the support B. Thus, even a material having no adhesiveness can be used as the support material B.
In the step B, after the support material a and the resin film are bonded to each other at a constant temperature and the support material B is bonded to each other, when the laminate of the resin film and the support material B is contracted in the step F, the thermal expansion coefficient of the support material B is preferably 20ppm/K to 230 ppm/K. By setting the thermal expansion coefficient of the support material B to 20ppm/K or more, even a small temperature change can easily increase the dimensional change due to thermal expansion. On the other hand, by setting the thermal expansion coefficient of the support material B to 230ppm/K or less, the variation in dimensional change due to the temperature variation of the support material B can be reduced.
The temperature reduced upon cooling is preferably 10 ℃ to 150 ℃. By setting the temperature to 10 ℃ or higher, a material having a small thermal expansion coefficient can be used as the support material B. More preferably 30℃or higher. Further, by setting the temperature to 150 ℃ or lower, thermal degradation of the support material B can be suppressed. In addition, the temperature of the support material B can be raised and lowered in a short time. More preferably 100℃or lower.
When the laminate of the support material a and the resin film is bonded to the support material B which has been previously stretched, and the support material a is peeled off, and then the support material B to which the resin film has been bonded is contracted to contract the laminate of the resin film and the support material B by 2000ppm or more, a method of stretching the support material B using a jig and releasing the stretching after bonding is exemplified as a method of previously stretching the support material B and contracting it after bonding. The stretching amount in this case is preferably 0.2 to 1.5%. By setting the stretching amount to 0.2% or more, warpage can be further suppressed when a laminate of the resin film and the base material a is obtained in the step E. On the other hand, when the stretching amount is 1.5% or less, wrinkles and cracks can be prevented from occurring in the resin film during shrinkage in step F.
As the jig for stretching the support material B, for example, a jig shown in fig. 2 can be used. The clamp has the following functions: the clamp 23 can be moved outward from the center of the guide 22 by rotating the screw 21 while fixing the guide 22. Rotation of the clamp 23 is prevented by sandwiching a steel ball wetted with lubricating oil between the screw 21 and the clamp 23. By fixing the support material B24 with the jig 23, the support material B24 can be pulled outward from the center. The stretching of the support material B24 is preferably uniform in all directions.
The support material B may be a urethane gel sheet or the like.
< procedure D ', procedure E' >
The laminate after the step F can be subjected to the same method as described in the above steps D and E. Further, a laminate of the resin film and the base material a can be obtained.
In the present application, a functional structure such as a conductive pattern can be provided on the resin film obtained in step a. The resin film provided with the conductive pattern can be suitably used as a member for a touch sensor. Examples of the conductive pattern include a transparent conductive pattern such as Indium Tin Oxide (ITO) and an opaque conductive pattern formed by applying a conductive paste in which silver particles are dispersed in a resin. The conductive paste in which silver particles are dispersed can form various patterns by imparting photosensitivity, and is advantageous in terms of flexibility of the conductive pattern itself and adhesiveness to a resin film. The line width of the conductive pattern is preferably 1 μm to 9 μm, more preferably 1 μm to 5 μm.
Examples
The present application will be described in detail with reference to examples and comparative examples, but the mode of the present application is not limited to these.
< determination of elastic modulus >)
By the same procedure as described in example, a resin film having a total thickness of 10 μm was formed on an alkali-free glass substrate by forming a polyimide film having a thickness of 7 μm and a protective film having a thickness of 3 μm, and then a strip of a length of 50.4mm by a width of 10.1mm was cut into the resin film using a single blade razor and peeled off from the substrate, whereby a test piece of a resin film having a length of about 50mm by a width of about 10mm by a thickness of about 10 μm was obtained.
The elastic modulus was measured as follows: first, the width of the test piece was determined by a vernier caliper, the thickness of the test piece was determined by a micrometer, then, the test piece was pulled out by using a constant temperature bath internal stretching test apparatus AG-5kNI (manufactured by Shimadzu corporation) for the obtained strip-shaped test piece, and the test piece was fixed by chucks at about 10mm each at the top and bottom to have a test length of 30mm, and the test piece was stretched at 50mm/min, whereby the elastic modulus was calculated from the slope of a stress-strain curve having an elongation in the range of 0 to 2%. The test was performed 10 times to obtain an arithmetic average.
A test piece was also prepared for the support material B, and the elastic modulus was measured in the same manner as for the test piece cut into a strip shape having a length of about 50 mm. Times.10 mm.
< evaluation of warpage >
The laminate of the PET film and the resin film obtained in each of examples and comparative examples was placed on a stage with the PET film side down, and the maximum height from the stage was measured with a vernier caliper. The amount of warpage in the downward convex state is positive, and the amount of warpage in the upward convex state is negative. The measurement was performed on 10 sheets and an arithmetic average was obtained.
< determination of the proportion of resin in conductive Pattern >)
The laminate provided with the conductive pattern was cut using a single blade razor so that the cross section of the conductive pattern was not crushed, and then the cross section was smoothed by an ion milling device IB-9010CP (manufactured by japan electronics corporation), and the cross section was observed using a field emission type analytical scanning electron microscope JSM-7610F (manufactured by japan electronics corporation). The area occupied by the metal and the resin in the cross section was obtained by observation under the condition of having a contrast capable of recognizing the metal, the resin and the void, and the percentage was used as the volume occupancy in the cross section. The volume occupancy was obtained by obtaining the average value of 20 parts and 40 parts of the conductive patterns of the 1 st and 2 nd layers.
< evaluation of touch sensor >
The laminate provided with the conductive pattern was again restored to the original state by bending the conductive pattern to the inner side by 180 degrees with a radius of curvature of 3mm, then was again restored to the original state by bending the conductive pattern to the outer side by 180 degrees with a radius of curvature of 3mm, and after repeating this set of operations 5 ten thousand times, the following conductivity evaluation and appearance inspection were performed.
Conductivity evaluation
The resistance values were measured by connecting the two ends of the 20 and total 40 parts of the conductive patterns of the 1 st and 2 nd layers with a resistance meter (RM 3544; manufactured by HIOKI), and the average value, the maximum value, and the minimum value were obtained. If the upper limit of measurement of the resistance meter is 3.5mΩ or more, measurement cannot be performed, and the measurement is removed from calculation of the average value.
Appearance inspection
The conductive patterns of the 1 st layer and the 2 nd layer were judged to be acceptable when no crack, peeling, or disconnection occurred, and the other cases were judged to be unacceptable.
The materials used in each of the examples and comparative examples are as follows.
[ solvent ]
Dimethylethanolamine (dmea. Tokyo chemical industry Co., ltd.)
N-methylpyrrolidone (NMP. Tokyo chemical industry Co., ltd.)
Cellosolve acetate (cellosolve acetate) (CA. Tokyo chemical industry Co., ltd.)
[ epoxy resin ]
jeR828 (Mitsubishi Chemical Corporation)
[ photopolymerization initiator ]
IRGACURE369 (Ciba Japan K.K.)
[ silica Dispersion liquid ]
DMAC-ST (manufactured by Nissan chemical Co., ltd.).
Synthesis example 1
100g of NMP was charged into a 300ml separable flask under a nitrogen flow and heated and stirred to 55 ℃. 2.47g of 1, 4-bis (aminomethyl) cyclohexane and 4.31g of 3,3' -diaminodiphenyl sulfone were charged and dissolved in NMP. 9.77g of 4,4' -oxydiphthalic anhydride (ODPA) and 0.687 g of 1,2,3, 4-cyclobutane tetracarboxylic dianhydride (CBDA) were added to the solution, and the solution was stirred at 55℃for 90 minutes to effect polymerization. To the obtained solution, 3g of DMAC-ST as a silica dispersion was added, and the mixture was stirred at room temperature for 60 minutes to obtain a polyamic acid solution (A-1).
Synthesis example 2
To an acrylic copolymer (copolymerization ratio (mass part): 20/40/20/15) of ethylenediamine (hereinafter, "EA")/2-ethylhexyl methacrylate (hereinafter, "2-EHMA")/styrene (hereinafter, "St")/acrylic acid (hereinafter, "AA"), 5 parts by mass of glycidyl methacrylate (hereinafter, "GMA") were added and reacted to obtain a product
A reaction vessel under nitrogen was charged with 150g of DMEA and heated to 80℃using an oil bath. A mixture of 20g of EA, 40g of 2-EHMA, 20g of St, 15g of AA, 0.8g of 2,2' -azobisisobutyronitrile and 10g of DMEA was added dropwise thereto over 1 hour. After the completion of the dropwise addition, polymerization was further carried out for 6 hours. Then, 1g of hydroquinone monomethyl ether was added to stop the polymerization reaction. Next, a mixture of 5g of GMA, 1g of triethylbenzyl ammonium chloride and 10g of DMEA was added dropwise over 0.5 hour. After the completion of the dropwise addition, an additional 2 hours of addition reaction was carried out. The resulting reaction solution was purified with methanol to remove unreacted impurities, followed by vacuum drying for 24 hours to obtain an acrylic copolymer (B-1). The acid value of the obtained acrylic copolymer (B-1) was 103mgKOH/g.
Synthesis example 3
Into a 100mL clean bottle were charged 10.0g of the acrylic copolymer (B-1), 3.0g of Light Acrylate BP-4EA, 2.0g of epoxy jeR828, 0.6g of IRGACURE369, and 60.0g of DMEA, and mixed with "Thinky Mixer" (ARE-310;THINKY CORPORATION) to obtain 75.6g of a top coating solution (C-1).
Synthesis example 4
Into a 100mL clean bottle were placed 10.0g of an acrylic copolymer (B-1), 2.0g of Light Acrylate BP-4EA, 0.60g of IRGACURE369 (manufactured by Ciba Japan K.K.), 8.0g of CA, and the mixture was mixed with "Thinky Mixer" (manufactured under the trade name, ARE-310, THINKY CORPORATION), whereby 20.6g (total solid content: 61.2% by mass) of a photosensitive resin solution was obtained. 10.0g of the obtained photosensitive resin solution and 22.0g of Ag particles having an average particle diameter of 0.2 μm were mixed, and kneaded using 3 rolls of "EXAKT M-50" (trade name, manufactured by EXAKT Co., ltd.) to obtain 32.0g of a conductive paste (D-1).
Example 1
The polyamic acid solution (A-1) was applied over the entire surface of AN alkali-free glass substrate AN100 (manufactured by Asahi glass Co., ltd.) having a thickness of 0.7mm and a square of 150mm, and dried at 90℃for 15 minutes in a hot air oven. Then, the polyimide film was thermally cured at 260℃for 60 minutes in a hot air oven to form a polyimide film having a thickness of 7. Mu.m. The top coating solution (C-1) was applied over the entire surface of the polyimide film, and dried at 90℃for 8 minutes using a hot air oven. An exposure apparatus PEM-6M (Union Optical co., ltd.) was used to expose 200mJ/cm 2 (converted to 365nm wavelength), and then thermally cured at 230℃for 60 minutes in a hot air oven to form a protective film having a thickness of 3. Mu.m, thereby obtaining a resin film having a thickness of 10. Mu.m. Then, intelimer Tape CS2350NA4 (manufactured by NITTA CORPORATION) having a total thickness of 50 μm was bonded to the resin film in a square size of 150mm, and then the resin film and the Intemer Tape were peeled off from the glass substrate. Then, using a bonding apparatus SE650n (manufactured by CLIMB product co., ltd.) on the resin film side of the peeled product (peeled from the glass substrate)The release side) was laminated with a PET film having a self-adhesive property and a thickness of 50 μm. Further, by peeling the Intelimer Tape, a laminate in which a 50 μm PET film was laminated on a 10 μm resin film was obtained.
Example 2
The procedure of example 1 was repeated except that Intelimer Tape CS2325NA4 (manufactured by NITTA CORPORATION) having a total thickness of 25 μm was used instead of Intelimer Tape CS2350NA4 having a total thickness of 50. Mu.m.
Example 3
The procedure of example 1 was repeated except that Intelimer Tape CS2350NA3 was used instead of Intelimer Tape CS2350NA 4.
Comparative example 1
The same procedure as in example 1 was conducted except that PET was used instead of Intelimer Tape CS2325NA 4.
The evaluation results of examples 1 to 3 and comparative example 1 are shown in table 1.
Example 4
The polyamic acid solution (A-1) was applied over the entire surface of AN alkali-free glass substrate AN100 (manufactured by Asahi glass Co., ltd.) having a thickness of 0.7mm and a square of 150mm, and dried at 90℃for 15 minutes in a hot air oven. Then, the polyimide film was thermally cured at 260℃for 60 minutes in a hot air oven to form a polyimide film having a thickness of 7. Mu.m. The top coating solution (C-1) was applied over the entire surface of the polyimide film, and dried at 90℃for 8 minutes using a hot air oven. Then, an exposure apparatus PEM-6M (Union Optical Co., ltd.) was used to expose 200mJ/cm 2 (converted to 365nm wavelength), and then thermally cured at 230℃for 60 minutes in a hot air oven to form a protective film having a thickness of 3. Mu.m, thereby obtaining a resin film having a total thickness of 10. Mu.m. Then, the glass substrate and the resin film were held at 100℃and a urethane gel sheet (thermal expansion coefficient 93 ppm/K) having a thickness of 5mm and having self-adhesiveness, which had been heated to 100℃in advance, was bonded to the resin film. The urethane gel sheet and the resin film were separated from the interface between the glass substrate and the resin film while being kept at 100 ℃, and the urethane gel sheet and the resin film were cooled to 25 ℃. The peeled article was provided on the resin film side with a bonding apparatus SE650n (CLIMB product co., ltd.)A PET film having a self-adhesive thickness of 50 μm was bonded (to the release surface side of the glass substrate). By peeling the urethane gel sheet, a laminate in which a 50 μm PET film was laminated on a 10 μm resin film was obtained.
Example 5
The same procedure as in example 4 was carried out except that the temperature before bonding was changed from 100℃to 70 ℃.
Example 6
The same procedure as in example 4 was carried out except that the temperature before bonding was changed from 100℃to 120 ℃.
Example 7
The same procedure as in example 4 was conducted except that a silica gel sheet (thermal expansion coefficient 204 ppm/K) having a thickness of 5mm was used instead of the urethane gel sheet, and the temperature before bonding was changed from 100℃to 60 ℃.
Example 8
The same procedure as in example 4 was conducted except that PMMA (thermal expansion coefficient: 50 ppm/K) having a thickness of 0.5mm was used instead of the urethane gel sheet and the temperature before bonding was changed from 100℃to 115 ℃.
Example 9
The same procedure as in example 4 was conducted except that a magnesium alloy AZ91 sheet (thermal expansion coefficient: 28 ppm/K) having a thickness of 0.3mm was used instead of the urethane gel sheet, the temperature before bonding was changed from 100℃to 150℃and the temperature after bonding was changed from 25℃to 0 ℃.
Example 10
The procedure of example 4 was repeated except that the silicone gel sheet having a thickness of 5mm was used instead of the urethane gel sheet and the temperature before bonding was changed from 100℃to 35 ℃.
Comparative example 2
The same procedure as in example 4 was carried out except that the temperature before bonding was changed from 100℃to 25 ℃.
Comparative example 3
The procedure of example 4 was repeated except that the temperature before bonding was changed from 100℃to 30℃using a silica gel sheet having a thickness of 5mm instead of the urethane gel sheet.
The evaluation results of examples 4 to 10 and comparative examples 2 to 3 are shown in table 2.
Example 11
The polyamic acid solution (A-1) was applied over the entire surface of AN alkali-free glass substrate AN100 (manufactured by Asahi glass Co., ltd.) having a thickness of 0.7mm and a square of 150mm, and dried at 90℃for 15 minutes in a hot air oven. Then, the polyimide film was thermally cured at 260℃for 60 minutes in a hot air oven to form a polyimide film having a thickness of 7. Mu.m. The top coating solution (C-1) was applied over the entire surface of the polyimide film, and dried at 90℃for 8 minutes using a hot air oven. An exposure apparatus PEM-6M (Union Optical co., ltd.) was used to expose 200mJ/cm 2 (converted to 365nm wavelength), and then thermally cured at 230℃for 60 minutes in a hot air oven to form a protective film having a thickness of 3. Mu.m, thereby obtaining a resin film having a total thickness of 10. Mu.m. The urethane gel sheet was uniformly stretched by 0.69% in all directions in the plane direction using the jig shown in fig. 2. A urethane gel sheet in a state of being stretched by 0.69% was attached to the resin film. Then, the urethane gel sheet and the resin film are peeled off from the interface between the glass substrate and the resin film, and the urethane gel sheet and the resin film are contracted by releasing the tension of the urethane gel sheet. A PET film having a self-adhesive thickness of 50 μm was bonded to the resin film side (the side of the release surface from the glass substrate) of the release material. Further, the urethane gel sheet was peeled off to obtain a laminate in which a 50 μm PET film was laminated on a 10 μm resin film.
Example 12
The procedure of example 11 was repeated except that the amount of stretching of the urethane gel sheet was changed to 0.89%.
Comparative example 4
The procedure of example 11 was repeated except that the amount of stretching of the urethane gel sheet was changed to 0.15%.
The evaluation results of examples 11 to 12 and comparative example 4 are shown in table 3.
Example 13
On AN alkali-free glass substrate AN100 (Asahi glass substrate A. Sub.strain) having a thickness of 0.7mm and a square of 150mmThe polyamic acid solution (A-1) was applied to the entire surface of the film, and dried at 90℃for 15 minutes in a hot air oven. Then, the polyimide film was thermally cured at 260℃for 60 minutes in a hot air oven to form a polyimide film having a thickness of 7. Mu.m. The conductive paste (D-1) was coated on the entire surface of the polyimide film by a screen printer LS-150 (NEWLONG SEIMITSU KOGYO co., ltd., manufactured) and dried in a drying oven at 100 ℃ for 10 minutes to obtain a 1.0 μm coated film. A photomask having 20 patterns shown in FIG. 3 at 4mm intervals, each of which had a lattice-like light transmitting portion having a width of 3 μm and formed of a rhombic continuum having a diagonal length of 0.5mm and 1.5mm square light transmitting portions at both ends was arranged in the center of a substrate, and an exposure amount of 200mJ/cm was set using an exposure apparatus PEM-6M (Union Optical Co., ltd.) 2 (converted to 365nm wavelength), then, the substrate was immersed in a 0.1 mass% TMAH solution for 30 seconds to develop the substrate, and then, a rinsing treatment with ultrapure water was performed to obtain a precursor of the conductive pattern. Then, the resultant was thermally cured at 230℃for 60 minutes in a hot air oven to form a conductive pattern of layer 1 having a line width of 4.0. Mu.m. The top coating solution (C-1) was applied thereto in a range of 80mm by 85mm so as to cover only the lattice-like portion of the conductive pattern, and dried at 90℃for 8 minutes with a hot air oven. An exposure apparatus PEM-6M (Union Optical co., ltd.) was used to expose 200mJ/cm 2 (converted to 365nm wavelength), and then thermally cured at 230℃for 60 minutes in a hot air oven to form a protective film of layer 1 having a thickness of 3. Mu.m. The conductive pattern of layer 2 is formed on the protective film of layer 1 in a manner orthogonal to the conductive pattern of layer 1 in the same step as the conductive pattern of layer 1. The top coating solution (C-1) was applied thereto in a range of 80mm by 80mm so as to cover only the lattice-like portion of the conductive pattern, and dried at 90℃for 8 minutes with a hot air oven. An exposure apparatus PEM-6M (Union Optical co., ltd.) was used to expose 200mJ/cm 2 (converted to 365nm wavelength), and then thermally cured at 210℃for 60 minutes in a hot air oven to form a 2 nd protective film having a thickness of 2 μm, thereby forming a touch sensor having the structure shown in FIG. 4. Then, an Intel film having a total thickness of 50 μm was bonded to the touch sensor in a square 150mm sizeThe resin film and the Intelimer Tape were peeled off from the glass substrate after the im Tape CS2350NA4 (manufactured by NITTA CORPORATION). Then, a PET film having a thickness of 50 μm was laminated on the resin film side (the side of the peeled surface from the glass substrate) of the peeled product using a lamination apparatus SE650n (manufactured by CLIMB product co., ltd.). Further, by peeling the Intelimer Tape, a laminate in which a 50 μm PET film was laminated on the touch sensor was obtained.
The evaluation results of example 13 are shown in tables 4 and 5.
TABLE 1
TABLE 2
TABLE 3
TABLE 4
TABLE 5
Description of the reference numerals
11 support material A
12 resin film
13 support material B
14 substrate A
21. Screw bolt
22. Guide piece
23. Clamp
24 support material B
31. Light transmitting part of photomask
41. Polyimide film
42 layer 1 conductive pattern 43 layer 1 protective film
44 layer 2 conductive pattern 45 layer 2 protective film
Claims (8)
1. A method for producing a laminate of a resin film and a base material (base material a) for the purpose of lamination with the resin film, the method comprising:
a step (step A) of forming a resin film on a support (support A);
a step (step B) of bonding another support material (support material B) to a surface of the resin film opposite to the side on which the support material a is provided, to obtain a laminate;
a step (step C) of peeling off the laminate obtained in the step B at the interface between the support A and the resin film to obtain a laminate of the resin film and the support B;
a step (step D) of bonding a base material a to a surface of the laminate obtained in the step C, the surface being opposite to the side on which the support material B is provided;
a step (step E) of peeling off the laminate obtained in the step D at the interface between the support B and the resin film to obtain a laminate of the resin film and the base A,
wherein Eb/(Ea+Eb) is 0.04 or less when Ea is the elastic modulus of the resin film and Eb is the elastic modulus of the support material B.
2. A method for producing a laminate of a resin film and a base material (base material a) for the purpose of lamination with the resin film, the method comprising:
a step (step A) of forming a resin film on a support (support A);
a step (step B) of bonding another support material (support material B) to a surface of the resin film opposite to the side on which the support material a is provided, to obtain a laminate;
a step (step C) of peeling off the laminate obtained in the step B at the interface between the support A and the resin film to obtain a laminate of the resin film and the support B;
a step (step F) of shrinking the laminate of the resin film and the support material B by 2000ppm or more;
a step (step D') of bonding a base material a to a surface of the laminate obtained after the step F, the surface being opposite to the side on which the support material B is provided; and
and (c) peeling the laminate obtained in the step D 'at the interface between the support B and the resin film to obtain a laminate of the resin film and the base material a (step E').
3. The method for producing a laminate according to claim 2, wherein the method for shrinking the laminate of the resin film and the support material B in the step F is a method for reducing the temperature of the laminate of the resin film and the support material B.
4. The method for producing a laminate according to claim 2, wherein the step F of shrinking the laminate of the resin film and the support material B is performed by: the laminate of the support material a and the resin film is bonded to the support material B which has been previously extended, and the support material a is peeled off, and then the support material B to which the resin film is bonded is contracted.
5. The method for producing a laminate according to claim 3, wherein the method for reducing the temperature of the laminate is a method for reducing the temperature of the laminate by 20 to 150 ℃.
6. The method for producing a laminate according to any one of claims 1 to 5, wherein the resin film is a laminate of 2 or more layers including 1 or more layers made of a transparent polyimide, and wherein the resin film has an opaque conductive pattern having a line width of 1 μm to 9 μm.
7. The method for producing a laminate according to claim 6, wherein the opaque conductive pattern is formed of a mixture of a metal and a resin, and the proportion of the resin in the opaque conductive pattern is 30 to 80% by volume.
8. A component for a touch sensor, which uses the laminate obtained by the method for producing a laminate according to claim 6 or claim 7 as a component.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2020-129967 | 2020-07-31 | ||
| JP2020129967 | 2020-07-31 | ||
| PCT/JP2021/024926 WO2022024655A1 (en) | 2020-07-31 | 2021-07-01 | Method for manufacturing laminate |
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| CN115803122A CN115803122A (en) | 2023-03-14 |
| CN115803122B true CN115803122B (en) | 2023-12-01 |
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| JP (1) | JPWO2022024655A1 (en) |
| KR (1) | KR20230042210A (en) |
| CN (1) | CN115803122B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012063954A1 (en) * | 2010-11-10 | 2012-05-18 | 住友化学株式会社 | Methods for producing polarizing laminate film and polarizing plate |
| JP2019062088A (en) * | 2017-09-27 | 2019-04-18 | パナソニックＩｐマネジメント株式会社 | Solar cell module |
| JP2020093534A (en) * | 2018-12-03 | 2020-06-18 | 住友化学株式会社 | Laminate and manufacturing method thereof |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003113356A (en) * | 2001-10-01 | 2003-04-18 | Lintec Corp | Adhesive tape for bonding paper |
| JP4428908B2 (en) * | 2002-04-08 | 2010-03-10 | 日東電工株式会社 | Method for processing adherend using adhesive sheet |
| JP2004047975A (en) * | 2002-05-17 | 2004-02-12 | Semiconductor Energy Lab Co Ltd | Method of transferring laminate and method of manufacturing semiconductor device |
| JP5171332B2 (en) * | 2008-03-18 | 2013-03-27 | リンテック株式会社 | Release sheet, polarizing plate with release sheet, and substrate-less double-sided adhesive sheet |
| JP2012177084A (en) * | 2011-01-31 | 2012-09-13 | Dainippon Printing Co Ltd | Heat-resistant temporary adhesive composition and heat-resistant temporary adhesive tape |
| JP2013063606A (en) * | 2011-09-20 | 2013-04-11 | Fujimori Kogyo Co Ltd | Adhesive sheet laminated body |
| JP6580808B2 (en) | 2012-06-19 | 2019-09-25 | 日鉄ケミカル＆マテリアル株式会社 | Display device and manufacturing method thereof |
| JP6039297B2 (en) | 2012-08-07 | 2016-12-07 | 三井化学株式会社 | Polyimide film and method for producing the same |
| JP6356564B2 (en) * | 2014-09-29 | 2018-07-11 | リンテック株式会社 | Adhesive sheet |
| JP2018116859A (en) | 2017-01-19 | 2018-07-26 | 株式会社ジャパンディスプレイ | Manufacturing method of display device, and display device |
| JP7139141B2 (en) * | 2017-06-13 | 2022-09-20 | マクセル株式会社 | Double-sided adhesive tape and laminate of thin film member and supporting member |
| JP7273472B2 (en) * | 2018-08-27 | 2023-05-15 | 日東電工株式会社 | laminate |
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|---|---|---|---|---|
| WO2012063954A1 (en) * | 2010-11-10 | 2012-05-18 | 住友化学株式会社 | Methods for producing polarizing laminate film and polarizing plate |
| JP2019062088A (en) * | 2017-09-27 | 2019-04-18 | パナソニックＩｐマネジメント株式会社 | Solar cell module |
| JP2020093534A (en) * | 2018-12-03 | 2020-06-18 | 住友化学株式会社 | Laminate and manufacturing method thereof |
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| WO2022024655A1 (en) | 2022-02-03 |
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| JPWO2022024655A1 (en) | 2022-02-03 |
| TW202214446A (en) | 2022-04-16 |
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