CN115802591A - Circuit board with functional coating - Google Patents
Circuit board with functional coating Download PDFInfo
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- CN115802591A CN115802591A CN202211557195.0A CN202211557195A CN115802591A CN 115802591 A CN115802591 A CN 115802591A CN 202211557195 A CN202211557195 A CN 202211557195A CN 115802591 A CN115802591 A CN 115802591A
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- copper foil
- plate
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- supporting
- roll
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- 239000011248 coating agent Substances 0.000 title claims abstract description 19
- 238000000576 coating method Methods 0.000 title claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000010408 film Substances 0.000 claims abstract description 34
- 238000005507 spraying Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000001125 extrusion Methods 0.000 claims abstract description 26
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 17
- 238000010030 laminating Methods 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 230000008569 process Effects 0.000 claims abstract description 13
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 12
- 239000010409 thin film Substances 0.000 claims abstract description 5
- 230000005540 biological transmission Effects 0.000 claims description 11
- 230000006835 compression Effects 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000012545 processing Methods 0.000 abstract description 4
- 239000003292 glue Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 23
- 230000001105 regulatory effect Effects 0.000 description 11
- 230000003028 elevating effect Effects 0.000 description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229910001431 copper ion Inorganic materials 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Abstract
The invention discloses a circuit board with a functional coating, which relates to the technical field of circuit boards and comprises a first copper foil layer, a thin film layer, a semi-cured functional material layer and a second copper foil layer which are sequentially arranged from bottom to top; the circuit board is processed by the following process: firstly, sequentially placing a copper foil roll II, a film roll and a copper foil roll I on three unwinding rollers of a laminating machine, firstly, leveling and conveying the copper foil roll I through a leveling mechanism, simultaneously, adhering glue on the lower surface of the film roll through a gluing mechanism, and then pressing the film roll I and the copper foil roll I together through an extrusion mechanism I to obtain an FCCL single-sided board; the laminating machine is arranged, so that the laminating machine is convenient to be matched with the whole process, can perform multiple extrusion laminating, spraying and cutting, can realize automatic production, and is convenient to improve the working efficiency; meanwhile, the equipment is convenient for processing materials with different thicknesses, and the practicability is high.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board with a functional coating.
Background
At present, from a communication network to a terminal application, communication frequency is comprehensive and high-frequency, and high-speed and high-capacity applications are endless. In recent years, as wireless networks transition from 4G to 5G and 6G, network frequencies have been increasing. According to the 5G and 6G development route maps displayed in the related data, the communication frequency will be promoted in two stages in the future. The first stage aims to boost the communication frequency to 6GHz before 2020, and the second stage aims to further boost to 30-60GHz after 2020. In the aspect of market application, the signal frequency of terminal antennas such as smart phones is continuously improved, high-frequency application is more and more, and the requirements for high speed and large capacity are more and more. In order to adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications, the flexible board is used as an antenna and a transmission line in terminal equipment, and the technology is also upgraded.
In the preparation process, no matter the traditional multilayer flexible circuit board or the multilayer rigid-flexible circuit board, the problems of more process flows, complex manufacture, high cost, increased power consumption and signal transmission loss and the like in the aspect of circuit board performance generally exist; meanwhile, no automatic production equipment for the process is provided.
Disclosure of Invention
The invention aims to provide a circuit board with a functional coating, which solves the following technical problems: the traditional multilayer flexible circuit board is also a multilayer rigid-flexible circuit board, and generally has the problems of more process flows, complex manufacturing, high cost, increased power consumption and signal transmission loss and the like in the aspect of circuit board performance; meanwhile, no automatic production equipment for laminating the process is provided.
The purpose of the invention can be realized by the following technical scheme:
a circuit board with a functional coating comprises a first copper foil layer, a thin film layer, a semi-cured functional material layer and a second copper foil layer which are sequentially arranged from bottom to top;
the circuit board is processed by the following process:
firstly, sequentially placing a copper foil roll II, a film roll and a copper foil roll I on three unwinding rollers of a laminating machine, firstly leveling and conveying the copper foil roll I through a leveling mechanism, simultaneously adhering glue to the lower surface of the film roll through a gluing mechanism, and then pressing the film roll I and the copper foil roll I together through an extrusion mechanism I to obtain an FCCL single-sided board;
secondly, spraying a semi-solidified functional material on the upper surface of the film roll of the FCCL single-sided board through a spraying mechanism to form a semi-solidified functional material layer;
and step three, pressing the copper foil roll II and the upper surface of the semi-cured functional material layer together through the second extrusion mechanism to obtain the circuit board with the functional coating.
As a further scheme of the invention: the laminating machine comprises a conveying plate, two vertical plates are symmetrically installed on one side of the top of the conveying plate, three unwinding rollers are installed on the inner sides of the vertical plates, two copper foil rolls, a film roll and a copper foil roll are sequentially installed on the three unwinding rollers from top to bottom, a leveling mechanism, a gluing mechanism, an extrusion mechanism I, a spraying mechanism, an extrusion mechanism II and a cutting mechanism are sequentially arranged on the conveying plate, the first extrusion mechanism and the second extrusion mechanism are identical in structure, the second extrusion mechanism comprises two symmetrically installed supporting blocks, an air cylinder IV is arranged on the outer side of each supporting block II, a piston rod of the air cylinder IV extends into the corresponding supporting block II and is connected with the trapezoidal block I, a trapezoidal block II is arranged above the trapezoidal block I, a jacking rod is fixedly installed at the top of the trapezoidal block II, the jacking rod penetrates through the supporting blocks II and is connected with the top plates II, the bottom of the top plates II is connected with the compression rollers through springs II, heating elements are arranged inside the compression rollers, and supporting rollers are arranged below the compression rollers.
As a further scheme of the invention: and a third spring is sleeved between the inner walls of the tops of the second trapezoidal block and the second supporting block on the jacking rod, one end of the third spring is connected with the second trapezoidal block, and the other end of the third spring is connected with the second supporting block.
As a further scheme of the invention: the spraying mechanism comprises a first supporting block and a first spraying box, the first supporting block is symmetrically installed, the first spraying box is fixedly installed at the top of the first supporting block, a plurality of insertion pipes are fixedly installed at the bottom of the spraying box, an elevating pipe is inserted into the bottom of the insertion pipes, a nozzle is fixedly installed at the bottom of the elevating pipe, a gear is sleeved on the elevating pipe and connected with a rack of the horizontal device in a meshed mode, a second air cylinder is fixedly installed at one end of the rack, and the second air cylinder is fixedly installed on a side plate.
As a further scheme of the invention: and a third cylinder is symmetrically arranged at two ends of the bottom of the spraying box, a lifting plate is fixedly arranged on a piston rod of the third cylinder, and the lifting plate is rotationally connected with the lifting pipe.
As a further scheme of the invention: the utility model discloses a cutting mechanism, including installing the supporting seat on the delivery board, the top of supporting seat is connected with the transmission shaft through the bearing, the one end of transmission shaft is connected with rotating electrical machines, the other end fixed mounting of transmission shaft has the eccentric wheel, fixed mounting has the regulating spindle on the eccentric wheel, be connected with the eccentric rod that the slope set up through the axle sleeve on the regulating spindle, the tip swing joint of eccentric rod has the slip push pedal, slip push pedal and two sliding connection of backup pad of installing on the delivery board, fixed mounting has the joint piece in the slip push pedal, the connecting block through vertical setting and the one end swing joint of U type strip on the joint piece, the guide pulley is installed to the other end of U type strip, the trapezoidal plate adaptation of installation on guide pulley and the backup pad two, the inside being provided with of joint piece runs through and is provided with the lifter, on the lifter and be located the joint piece and cup jointed expanding spring, the top and the U type strip sliding connection of lifter, the bottom fixed mounting of lifter has the cutting knife.
As a further scheme of the invention: t-shaped grooves are formed in the eccentric wheel, adjusting screw rods are arranged inside the T-shaped grooves, and adjusting shafts are connected to the adjusting screw rods in a threaded mode.
As a further scheme of the invention: the leveling mechanism comprises a first supporting plate, springs are symmetrically arranged at the bottom of the first supporting plate, a first U-shaped strip is fixedly arranged at the bottom of the first spring, and a leveling roller is rotatably connected to the inside of the first U-shaped strip.
As a further scheme of the invention: the gluing mechanism comprises a first top plate, a first air cylinder is fixedly mounted at the top of the first top plate, a regulating roller is mounted at the end part of a piston rod of the first air cylinder, guide rods are mounted at two ends of the regulating roller and run through the first top plate, and a rubber roller is arranged below the regulating roller.
As a further scheme of the invention: the three unwinding rollers are arranged in a triangular shape, and every two unwinding rollers are aligned in parallel; the conveying plate is characterized in that side plates are fixedly mounted on two sides of the top of the conveying plate, and a plurality of guide rollers are arranged on the side plates in an arc shape.
The invention has the beneficial effects that:
according to the invention, the novel material layer structure of the circuit board with high-frequency characteristic and/or copper ion migration resistance can be prepared by arranging the semi-cured functional material layer with special performance on the FCCL single-sided board, and the novel material layer structure of the circuit board is taken as an integral structure and can be taken as a manufacturing material of the circuit board in the subsequent manufacturing process of the circuit board, and circuit board structures such as a single-layer circuit board, a multilayer flexible circuit board, a multilayer soft and hard combined board and the like can be manufactured through the subsequent processes such as direct hot pressing with other materials or the circuit board, so that great convenience is brought to the subsequent manufacturing of the circuit board, the manufacturing process is simplified, the manufacturing speed of the circuit board is accelerated, the processing time of the product is shortened, the processing capacity of the manufacturing process is improved, and the production cost is reduced; moreover, the product structure is optimized, and the product performance is improved.
The laminating machine is arranged, so that the laminating machine is convenient to be matched with the whole process, can perform multiple extrusion laminating, spraying and cutting, can realize automatic production, and is convenient to improve the working efficiency; meanwhile, the equipment is convenient for processing materials with different thicknesses, and the practicability is high.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic cross-sectional view of a circuit board according to the present invention;
FIG. 2 is a schematic view of the overall structure of the laminator of the present invention;
FIG. 3 is a schematic view of the overall construction of the flattening mechanism of the present invention;
FIG. 4 is a schematic view of the overall structure of the gluing mechanism of the present invention;
FIG. 5 is a schematic view of the overall construction of the spray mechanism of the present invention;
FIG. 6 is a schematic view of the overall construction of the pressing mechanism of the present invention;
FIG. 7 is a schematic view showing the internal structure of a second support block according to the present invention;
FIG. 8 is a schematic view showing the entire structure of the cutting mechanism of the present invention.
In the figure: 10. a first copper foil layer; 20. a thin film layer; 30. semi-curing the functional material layer; 40. a second copper foil layer; 1. a conveying plate; 11. a side plate; 12. a vertical plate; 13. a drive motor; 14. unwinding rollers; 15. a guide roller; 2. a leveling mechanism; 3. a gluing mechanism; 4. a first extrusion mechanism; 5. a spraying mechanism; 6. a second extrusion mechanism; 7. a cutting mechanism; 21. a first support plate; 22. a first spring; 23. a first U-shaped strip; 24. a leveling roller; 31. a rubber roller; 32. a first top plate; 33. a guide bar; 34. a first cylinder; 35. a regulating roller; 51. a first supporting block; 52. a spraying box; 53. a second air cylinder; 54. a rack; 55. a lifting plate; 56. a gear; 57. a nozzle; 58. inserting a tube; 59. a lifting pipe; 510. a third cylinder; 61. a second supporting block; 62. a second top plate; 63. a support roll; 64. a second spring; 65. pressing rollers; 66. a cylinder IV; 67. a first trapezoid block; 68. a second trapezoidal block; 69. a jacking rod; 610. a third spring; 71. a supporting seat; 72. a second support plate; 73. a drive shaft; 74. adjusting the screw rod; 75. an eccentric wheel; 76. a T-shaped groove; 77. an adjustment shaft; 78. an eccentric rod; 79. sliding the push plate; 710. u-shaped strips; 711. a clamping block; 712. a lifting rod; 713. a cutting knife; 714. a trapezoidal plate; 715. and (4) a guide wheel.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
Referring to fig. 1, the present invention is a circuit board with a functional coating, which includes a first copper foil layer 10, a thin film layer 20, a semi-cured functional material layer 30, and a second copper foil layer 10, which are sequentially disposed from bottom to top;
the circuit board is processed by the following process:
firstly, sequentially placing a copper foil roll II, a film roll and a copper foil roll I on three unwinding rollers 14 of a laminating machine, firstly, leveling and conveying the copper foil roll I through a leveling mechanism 2, enabling the copper foil to pass through the lower part of a leveling roller 24, driving the leveling roller 24 to lift through the reaction force of a spring I22, extruding and leveling the copper foil, simultaneously adhering colloid on the lower surface of the film roll through a gluing mechanism 3, enabling the film to pass through a position between a rubber roller 31 and an adjusting roller 35, gluing the bottom of the film, facilitating the lamination, then pressing the film roll I and the copper foil roll I together through a pressing mechanism I4, enabling a supporting roller 63 and a pressing roller 65 to pass through, extruding and pressing the film roll I and the pressing roller through a supporting roller 63 and the pressing roller 65 to form a combined layer, and extruding through the reaction force generated by a spring III 610 to obtain an FCCL single-panel;
secondly, spraying a semi-cured functional material on the upper surface of the film roll of the FCCL single-panel through a spraying mechanism 5, wherein the semi-cured functional material is an MPI film, an LCP film, a TFP film, a PTFE film, a copper ion migration resistant film, a Low-Dk high-frequency functional adhesive, a copper ion migration resistant adhesive or a semi-cured functional material with a copper ion migration resistant function to form a semi-cured functional material layer;
and step three, pressing the copper foil roll II and the upper surface of the semi-solidified functional material layer together through a second extrusion mechanism 6 to obtain the circuit board with the functional coating.
Example two
Referring to fig. 2, 6 and 7, the film laminating machine includes a conveying plate 1, two vertical plates 12 are symmetrically installed on one side of the top of the conveying plate 1, three unwinding rollers 14 are installed on inner sides of the two vertical plates 12, a copper foil roll two, a film roll and a copper foil roll one are sequentially installed on the three unwinding rollers 14 from top to bottom, a leveling mechanism 2, a gluing mechanism 3, an extrusion mechanism one 4, a spraying mechanism 5, an extrusion mechanism two 6 and a cutting mechanism 7 are sequentially arranged on the conveying plate 1, the extrusion mechanism one 4 and the extrusion mechanism two 6 are identical in structure, the extrusion mechanism two 6 includes two support blocks 61 symmetrically installed, a cylinder four 66 is fixedly installed on outer sides of the two support blocks two 61, a piston rod of the cylinder four 66 is extended into the support blocks two 61 and connected with the ladder block one 67, a ladder block two 68 is arranged above the ladder block one 67, a jacking rod 69 is fixedly installed on the top of the ladder block two 68, the jacking rod 69 is connected with a top plate 62, a compression roller 64 for heating the bottom of the two compression roller 65, and a compression roller 64 for heating the supporting roller 65 are arranged below.
A third spring 610 is sleeved on the jacking rod 69 and located between the second trapezoidal block 68 and the inner wall of the top of the second supporting block 61, a guide column is arranged inside the third spring 610, one end of the third spring 610 is connected with the second trapezoidal block 68, and the other end of the third spring 610 is connected with the second supporting block 61.
When the first copper foil roll and the film roll or the second copper foil roll and the semi-cured functional material are moved to an extrusion mechanism, the first copper foil roll and the film roll or the second copper foil roll and the semi-cured functional material pass through a position between a supporting roller 63 and a pressing roller 65, the first copper foil roll and the film roll or the second copper foil roll and the semi-cured functional material are extruded and pressed through the supporting roller 63 and the pressing roller 65 to form a combined layer, and a reaction force is generated through a spring III 610 to extrude the combined layer; when needs extrude different thickness materials, start cylinder four 66, promote trapezoidal block one 67, and then promote the lifter through trapezoidal block two 38 and go up and down, and then adjust the height of two roof 62, and then adjust the height of compression roller 65, facilitate the use, drive two roof 62 through spring three and reset.
EXAMPLE III
On the basis of the second implementation, please refer to fig. 5, the spraying mechanism 5 includes first support blocks 51 symmetrically installed, a spraying box 52 is fixedly installed on the top of the first support blocks 51, a plurality of insertion tubes 58 are fixedly installed on the bottom of the spraying box 52, an elevating tube 59 is inserted into the bottom of the insertion tubes 58, for example, the central tube is inserted into the elevating tube 59, so as to drive the elevating tube 59 to ascend and descend, and adjust the height of the nozzle, and spraying can be performed at the same time, a nozzle 57 is fixedly installed on the bottom of the elevating tube 59, a gear 56 is sleeved on the elevating tube 59, the gear 56 is engaged with a horizontally arranged rack 54, a second cylinder 53 is fixedly installed at one end of the rack 54, and the second cylinder 53 is fixedly installed on the side plate 11.
Three cylinders 510 are symmetrically installed at two ends of the bottom of the spraying box 52, a lifting plate 55 is fixedly installed on a piston rod of the three cylinders 510, the lifting plate 55 is rotatably connected with the lifting pipe 59, the lifting pipe 59 is conveniently driven to rotate and lift, and the spraying box is convenient to use.
Spraying a semi-solidified functional material through a nozzle 57, and naturally cooling to form a semi-solidified functional material layer; in the spraying process, the second air cylinder 53 can be started to push the rack 54 to move back and forth, so that the gear 56 is driven to rotate, the lifting pipe 59 is driven to rotate, the nozzle 57 is driven to rotate, and uniform spraying is carried out; and can start cylinder three 510, drive lifter plate 55 and go up and down, and then drive lift pipe 59 and nozzle 57 and go up and down, be convenient for be suitable for the copper foil or the material of different thickness.
Example four
On the basis of the third embodiment, please refer to fig. 8, the cutting mechanism 7 includes a supporting seat 71 installed on the conveying plate 1, the top of the supporting seat 71 is connected with a transmission shaft 73 through a bearing, one end of the transmission shaft 73 is connected with a rotating motor, the other end of the transmission shaft 73 is fixedly installed with an eccentric wheel 75, the eccentric wheel 75 is fixedly installed with an adjusting shaft 77, the adjusting shaft 77 is connected with an eccentric rod 78 obliquely arranged through a shaft sleeve, the end of the eccentric rod 78 is movably connected with a sliding push plate 79, the sliding push plate 79 is slidably connected with a supporting plate second 72 installed on the conveying plate 1, a clamping block 711 is fixedly installed on the sliding push plate 79, the clamping block 711 is movably connected with one end of the U-shaped bar 710 through a vertically arranged connecting block, the other end of the U-shaped bar 710 is installed with a guide wheel 715, the guide wheel 715 is adapted to a trapezoidal plate 714 installed on the supporting plate second 72, a lifting rod 712 is provided with a through-arranged inside, a telescopic spring is arranged on the lifting rod 712 and is sleeved on the clamping block 711, so as to drive the lifting rod 712 to reset, the top of the lifting rod 712 is connected with a sliding rod 710, and a cutting knife 713 is fixedly installed on the bottom of the lifting rod 710.
The T-shaped groove 76 is formed in the eccentric wheel 75, the adjusting screw rod 74 is arranged in the T-shaped groove 76, the adjusting screw rod 74 is connected with the adjusting shaft 77 through threads, the adjusting screw rod 74 rotates through rotation of a wrench, the adjusting shaft 77 is driven to lift, the reciprocating motion distance of the eccentric rod 78 is adjusted, and circuit boards of different thicknesses can be conveniently cut.
When the molded circuit board moves below the cutting mechanism 7, the rotating motor is started to drive the transmission shaft 73 to rotate, so as to drive the eccentric wheel 75 to rotate, the eccentric wheel 75 drives the eccentric rod 78 to reciprocate, the eccentric rod 78 drives the clamping block 711 to move, and in the process that the guide wheel 715 on the clamping block 711 contacts with the trapezoidal plate 714, the U-shaped strip drives the lifting rod 712 to descend, so as to drive the cutting knife 713 to perform reciprocating cutting.
EXAMPLE five
Referring to fig. 2-4, the leveling mechanism 2 includes a first supporting plate 21, a first spring 22 is symmetrically installed at the bottom of the first supporting plate 21, a guide post is installed in the first spring 22, a first U-shaped strip 23 is fixedly installed at the bottom of the first spring 22, and a leveling roller 24 is rotatably connected inside the first U-shaped strip 23. The copper foil passes through from flattening roller 24 below, drives flattening roller 24 through the reaction force of spring 22 and goes up and down, and it is level and smooth to extrude the copper foil, and subsequent laminating of being convenient for is suitable for the film of different thickness simultaneously.
Beat and glue mechanism 3 and include roof 32, the top fixed mounting of roof 32 has cylinder 34, regulating roller 35 is installed to the tailpiece of the piston rod portion of cylinder 34, guide bar 33 is all installed at the both ends of regulating roller 35, guide bar 33 runs through roof 32, the below of regulating roller 35 is provided with rubber roll 31, passes the film from passing between rubber roll 31 and the regulating roller 35, carries out the rubber coating to the bottom of film, and the laminating of being convenient for, through the setting of regulating roller 35, the rubber coated effect of being convenient for is better, is suitable for the film after the difference.
The three unwinding rollers 14 are arranged in a triangular shape, so that a single unwinding roller 14 can be driven to rotate through a chain, every two unwinding rollers 14 are aligned in parallel, every two unwinding rollers 14 are connected through a cross-shaped shaft in an inserting mode, synchronous driving rotation is facilitated, a driving motor 12 is arranged on one vertical plate, the driving motor 12 can drive each unwinding roller 14 independently, a gear can be sleeved at the end of each unwinding roller 14 and located in the vertical plate, the three gears are connected through the chain, one gear is driven to rotate through the driving motor 12, a plurality of unwinding rollers 14 can be driven to rotate synchronously, the other vertical plate 12 is connected with the conveying plate 1 in a sliding mode, the vertical plate 12 can be pushed to move through an air cylinder, reels can be placed on the unwinding rollers 14 conveniently, and the use is facilitated; the conveying device is characterized in that side plates 11 are fixedly mounted on two sides of the top of the conveying plate 1, and a plurality of guide rollers 15 are arranged on the side plates 11 in an arc shape. The second copper foil is passed under the plurality of guide rollers 15 to be guided.
Although one embodiment of the present invention has been described in detail, the description is only for the purpose of illustrating the preferred embodiments of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. A circuit board with a functional coating is characterized by comprising a first copper foil layer (10), a thin film layer (20), a semi-cured functional material layer (30) and a second copper foil layer (10) which are sequentially arranged from bottom to top;
the circuit board is processed by the following process:
firstly, sequentially placing a copper foil roll II, a film roll and a copper foil roll I on three unwinding rollers (14) of a laminating machine, firstly, leveling and conveying the copper foil roll I through a leveling mechanism (2), simultaneously, adhering colloid on the lower surface of the film roll through a gluing mechanism (3), and then pressing the film roll I and the copper foil roll I together through an extrusion mechanism I (4) to obtain an FCCL single-sided board;
secondly, spraying a semi-solidified functional material on the upper surface of the film roll of the FCCL single-sided board through a spraying mechanism (5) to form a semi-solidified functional material layer;
and step three, pressing the copper foil roll II and the upper surface of the semi-cured functional material layer together through a second extrusion mechanism (6) to obtain the circuit board with the functional coating.
2. The circuit board with the functional coating according to claim 1, wherein the laminating machine comprises a conveying plate (1), two vertical plates (12) are symmetrically installed on one side of the top of the conveying plate (1), three unwinding rollers (14) are installed on the inner sides of the two vertical plates (12), a copper foil roll II, a film roll and a copper foil roll I are sequentially installed on the three unwinding rollers (14) from top to bottom, a leveling mechanism (2), a gluing mechanism (3), a first extrusion mechanism (4), a spraying mechanism (5), a second extrusion mechanism (6) and a cutting mechanism (7) are sequentially arranged on the conveying plate (1), the first extrusion mechanism (4) and the second extrusion mechanism (6) are identical in structure, the second extrusion mechanism (6) comprises a second symmetrically installed supporting block (61), a fourth air cylinder (66) is arranged on the outer sides of the two supporting blocks (61), a piston rod of the fourth air cylinder (66) extends into the second supporting block (61) and is connected with the first trapezoidal block (67), a second trapezoidal block (68) is arranged above the first trapezoidal block (67), a top plate (68) is fixedly installed on the top of the two supporting blocks (61), a top plate (69) is connected with a top lifting rod (62), and a top plate (69) of the two lifting block (64) is connected with a top plate (69), the heating element is arranged inside the compression roller (65), and the supporting roller (63) is arranged below the compression roller (65).
3. The circuit board with the functional coating according to claim 2, wherein a third spring (610) is sleeved on the jacking rod (69) and located between the second trapezoidal block (68) and the inner wall of the top of the second supporting block (61), one end of the third spring (610) is connected with the second trapezoidal block (68), and the other end of the third spring is connected with the second supporting block (61).
4. The circuit board with the functional coating according to claim 2, wherein the spraying mechanism (5) comprises a first supporting block (51) which is symmetrically installed, a spraying box (52) is fixedly installed at the top of the first supporting block (51), a plurality of inserting pipes (58) are fixedly installed at the bottom of the spraying box (52), a lifting pipe (59) is inserted into the bottom of each inserting pipe (58), a nozzle (57) is fixedly installed at the bottom of each lifting pipe (59), a gear (56) is sleeved on each lifting pipe (59), the gear (56) is meshed with a horizontally arranged rack (54) and is connected with a second cylinder (53), and the second cylinder (53) is fixedly installed on the side plate (11).
5. The wiring board with functional coating according to claim 4, characterized in that the bottom of the spraying box (52) has three cylinders (510) symmetrically installed at both ends, the piston rod of the three cylinders (510) is fixedly installed with a lifting plate (55), and the lifting plate (55) is rotatably connected with the lifting tube (59).
6. The circuit board with the functional coating according to claim 2, wherein the cutting mechanism (7) comprises a supporting base (71) mounted on the conveying plate (1), the top of the supporting base (71) is connected with a transmission shaft (73) through a bearing, one end of the transmission shaft (73) is connected with a rotating motor, the other end of the transmission shaft (73) is fixedly mounted with an eccentric wheel (75), an adjusting shaft (77) is fixedly mounted on the eccentric wheel (75), the adjusting shaft (77) is connected with an obliquely arranged eccentric rod (78) through a shaft sleeve, the end of the eccentric rod (78) is movably connected with a sliding push plate (79), the sliding push plate (79) is slidably connected with a second supporting plate (72) mounted on the conveying plate (1), a clamping block (711) is fixedly mounted on the sliding push plate (79), the clamping block (711) is movably connected with one end of the U-shaped strip (710) through a vertically arranged connecting block, the other end of the U-shaped strip (710) is mounted with a lifting rod (712), the clamping block (715) is adapted to a ladder-mounted on the second supporting plate (72), the clamping block (711) is arranged in a telescopic rod (712), the lifting rod (712) is arranged on the lifting rod (712), and the lifting rod (712) is arranged on the top of the clamping block (712), and a cutting knife (713) is fixedly arranged at the bottom of the lifting rod (712).
7. The circuit board with a functional coating according to claim 6, wherein a T-shaped groove (76) is formed in the eccentric wheel (75), an adjusting screw rod (74) is arranged inside the T-shaped groove (76), and an adjusting shaft (77) is connected to the adjusting screw rod (74) in a threaded manner.
8. A circuit board with functional coating according to claim 2, characterized in that the leveling mechanism (2) comprises a first supporting plate (21), the first supporting plate (21) is symmetrically provided with a first spring (22) at the bottom, the first spring (22) is fixedly provided with a first U-shaped strip (23) at the bottom, and the leveling roller (24) is rotatably connected to the inside of the first U-shaped strip (23).
9. The circuit board with the functional coating according to claim 2, wherein the gluing mechanism (3) comprises a first top plate (32), a first cylinder (34) is fixedly mounted at the top of the first top plate (32), an adjusting roller (35) is mounted at the end of a piston rod of the first cylinder (34), guide rods (33) are mounted at two ends of the adjusting roller (35), the guide rods (33) penetrate through the first top plate (32), and a rubber roller (31) is arranged below the adjusting roller (35).
10. A functional-coated circuit board according to claim 2, characterized in that three unwinding rollers (14) are arranged in a triangle, and every two unwinding rollers (14) are aligned in parallel; both sides of the top of the conveying plate (1) are fixedly provided with side plates (11), and the side plates (11) are arc-shaped and provided with a plurality of guide rollers (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557195.0A CN115802591A (en) | 2022-12-06 | 2022-12-06 | Circuit board with functional coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211557195.0A CN115802591A (en) | 2022-12-06 | 2022-12-06 | Circuit board with functional coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115802591A true CN115802591A (en) | 2023-03-14 |
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ID=85417944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211557195.0A Pending CN115802591A (en) | 2022-12-06 | 2022-12-06 | Circuit board with functional coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115802591A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201515555U (en) * | 2009-10-15 | 2010-06-23 | 广东生益科技股份有限公司 | Prepreg |
| CN110682631A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Preparation method of novel material layer structure of circuit board and product thereof |
| CN115139587A (en) * | 2021-03-30 | 2022-10-04 | Jsr株式会社 | Electromagnetic wave shielding laminate and method for manufacturing same, shielded printed wiring board and method for manufacturing same, semiconductor package, and electronic device |
-
2022
- 2022-12-06 CN CN202211557195.0A patent/CN115802591A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201515555U (en) * | 2009-10-15 | 2010-06-23 | 广东生益科技股份有限公司 | Prepreg |
| CN110682631A (en) * | 2019-08-23 | 2020-01-14 | 李龙凯 | Preparation method of novel material layer structure of circuit board and product thereof |
| CN115139587A (en) * | 2021-03-30 | 2022-10-04 | Jsr株式会社 | Electromagnetic wave shielding laminate and method for manufacturing same, shielded printed wiring board and method for manufacturing same, semiconductor package, and electronic device |
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Country or region after: China Address after: B113, Comprehensive Building, 3rd Branch of Leibai Zhongcheng Life Science Park, No. 22 Jinxiu East Road, Jinsha Community, Kengzi Street, Pingshan District, Shenzhen City, Guangdong Province, 518118 Applicant after: Shida new material (Shenzhen) Co.,Ltd. Address before: 518118 3rd Floor, Building A1, No. 9 Songzikeng Reservoir Road, Laokeng Community, Longtian Street, Pingshan District, Shenzhen, Guangdong Applicant before: Shida new material (Shenzhen) Co.,Ltd. Country or region before: China |