CN115799138A - Method for controlling positioning stop of semiconductor wafer on transmission device - Google Patents
Method for controlling positioning stop of semiconductor wafer on transmission device Download PDFInfo
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- CN115799138A CN115799138A CN202310057692.2A CN202310057692A CN115799138A CN 115799138 A CN115799138 A CN 115799138A CN 202310057692 A CN202310057692 A CN 202310057692A CN 115799138 A CN115799138 A CN 115799138A
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Abstract
The invention relates to a method for controlling the positioning and stopping of a semiconductor wafer on a transmission device, which is applied to the transmission device for transmitting the semiconductor wafer, wherein the transmission device comprises a driving motor and a plurality of transmission rollers which are synchronously controlled by the driving motor and distributed at intervals, and the method comprises the following steps: distributing a deceleration point, a stopping point and a wafer detection point in an area formed by all the transmission rollers in advance, wherein the deceleration point, the stopping point and the wafer detection point are distributed in sequence along the positive transmission direction of the transmission rollers; triggering a driving motor after detecting that the semiconductor wafer sequentially passes through a deceleration point, a stopping point and a wafer detection point; after the semiconductor wafer is detected to leave the deceleration point, controlling a driving motor to synchronously drive all transmission rollers to decelerate; after detecting that the semiconductor wafer leaves the stopping point, controlling the driving motor to synchronously drive all the conveying rollers to stop. The method and the device can reduce the probability of abnormal stop positioning of the semiconductor wafer during transmission, and ensure the positioning stability of the semiconductor wafer.
Description
Technical Field
The invention relates to the technical field of wafer transmission, in particular to a method for controlling the positioning and stopping of a semiconductor wafer on a transmission device.
Background
In semiconductor automation equipment, wafers are mostly transferred from a previous process to a next process by a robot, and in a manner that the robot transfers the wafers, the robot needs a high cost, and the wafers are gradually transferred by forming a production line through a series of rollers, so that the wafer transfer is widely used. When a semiconductor wafer is transported on the transport rollers, it may happen that a particular area needs to be stopped, or that a wafer backlog occurs upstream and downstream of an area where the wafer stops being transported forward.
Disclosure of Invention
In view of the above, the embodiments of the present disclosure provide a method for controlling a positioning stop of a semiconductor wafer on a transferring device, which can stably stop the semiconductor wafer on a transferring roller and avoid damage to the semiconductor wafer caused by forward punch.
The embodiment of the application provides a method for controlling the positioning and stopping of a semiconductor wafer on a transmission device, which is applied to the transmission device for transmitting the semiconductor wafer, wherein the transmission device comprises a driving motor and a plurality of transmission rollers which are synchronously controlled by the driving motor and distributed at intervals, and the method comprises the following steps:
pre-arranging a deceleration point, a stopping point and a wafer detection point in an area formed by all the transmission rollers, wherein the deceleration point, the stopping point and the wafer detection point are sequentially distributed along the positive transmission direction of the transmission rollers; wherein the passing or leaving of the semiconductor wafer from the deceleration point is detected by a first sensor mounted on the transport device; detecting, by a second sensor mounted on the transport device, that the semiconductor wafer passes or leaves the stopping point; detecting, by a third sensor mounted on the transfer device, that the semiconductor wafer passes or leaves the wafer detection point;
after the semiconductor wafer is detected to sequentially pass through the deceleration point, the stopping point and the wafer detection point, generating a low-level signal and triggering the driving motor;
if the driving motor is triggered, generating a high-level signal and controlling the driving motor to synchronously drive all the transmission rollers to decelerate after the semiconductor wafer is detected to leave the deceleration point;
after the semiconductor wafer is detected to leave the stopping point, generating a high level signal and controlling the driving motor to synchronously drive all the transmission rollers to stop;
the method further comprises the following steps:
pre-arranging limit points in the area, wherein the stop points and the limit points are distributed along the positive transmission direction, and the distance along the positive transmission direction is greater than a preset distance; detecting, by a fourth sensor mounted on the transport device, the semiconductor wafer passing or leaving the confinement point;
if the semiconductor wafer is detected to pass through the limit point, an alarm is sent out;
after the semiconductor wafer is detected to pass through the limiting point, if the first sensor or the second sensor still outputs a low-level signal after a preset time, all the transmission rollers are forced to stop;
if the first sensor, the second sensor, the third sensor or the fourth sensor detects that the semiconductor wafer passes through, outputting a low-level signal; if the first sensor, the second sensor, the third sensor or the fourth sensor detects that the semiconductor wafer leaves, a high-level signal is output; outputting a low level signal if the first sensor or the second sensor or the third sensor or the fourth sensor fails;
the first sensor, the second sensor, the third sensor and the fourth sensor are all normally ON signal sensors.
With reference to the present application, in an optional implementation manner, a distance from the wafer detecting point to the stopping point in the positive transport direction is greater than half of the preset distance, and is less than half of a distance from the limiting point to the stopping point in the positive transport direction.
In an optional embodiment, with reference to the present application, if the first sensor or the second sensor still outputs the low level signal after the preset time, the method includes:
and starting a timer, and judging that the first sensor or the second sensor still outputs a low-level signal after the preset time by comparing the timing time of the timer with the preset time.
With reference to the present application, in an optional implementation manner, the deceleration point, the stopping point, the wafer detecting point, and the limiting point are all centrally disposed in a direction perpendicular to the positive transport direction;
or the first sensor, the second sensor, the third sensor or the fourth sensor are accommodated in a gap formed by two adjacent conveying rollers.
Compared with signal control for determining the semiconductor wafer and then performing deceleration stop, the method for controlling the positioning stop of the semiconductor wafer on the transmission device provided by the embodiment of the application optimizes and designs the position of each point relative to the transmission direction of the semiconductor wafer, particularly generates a low-level signal when the wafer passes through by means of control signals generated by passing and leaving of the semiconductor wafer, can ensure that the first sensor and the second sensor switch the output level to a high-level signal when detecting that the semiconductor wafer leaves under the condition that only the third sensor is abnormal (the third sensor outputs the low-level signal), further control the driving motor to drive and roll to execute corresponding deceleration or stop actions, and output a high level when the third sensor does not detect the semiconductor wafer, further avoid interference in limiting the control of the driving motor by the first sensor and the second sensor, further distinguish whether the semiconductor wafer is detected or the third sensor is failed, namely, and overcome the problem that whether the semiconductor wafer is detected or the third sensor is failed at the present stage; and a fourth sensor is also arranged for forcing all the conveying rollers to stop so as to further ensure the reliable stop of the semiconductor wafer under the condition that the first sensor or the second sensor is abnormal. Obviously, according to the embodiment of the application, the probability that the semiconductor wafer stops abnormal positioning during transmission due to the fact that the first sensor, the second sensor and the third sensor are in fault can be reduced, and the positioning stability of the semiconductor wafer is ensured.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is a flowchart illustrating a method for controlling a positioning stop of a semiconductor wafer on a transfer device according to an embodiment of the present disclosure;
fig. 2 is a schematic view of an application scenario of a method for controlling a semiconductor wafer to stop positioning on a transport apparatus according to an embodiment of the present disclosure;
fig. 3 is a schematic view illustrating another application scenario of a method for controlling a semiconductor wafer to stop positioning on a transport apparatus according to an embodiment of the present disclosure;
in the figure: 1. a semiconductor wafer; 21. a drive motor; 22. a transmission roller; 31. a deceleration point; 32. a stopping point; 33. detecting points of the wafer; 34. a restriction site.
Detailed Description
In order to make the technical solution and advantages of the present invention more comprehensible, a detailed description is given below by way of specific examples. Wherein the figures are not necessarily to scale, and certain features may be exaggerated or minimized to show details of the features more clearly; unless defined otherwise, technical and scientific terms used herein have the same meaning as those in the technical field to which this application belongs.
In the related art, a semiconductor wafer (wafer) is positioned and stopped on a rotating transport roller at a specific station according to the actual requirement, and if the transport roller is not properly controlled, the wafer may be pushed forward. In the signal control for determining that the semiconductor wafer 1 is decelerated and stopped again, the controller receives a signal ON (high level signal) to control the motion state of the transfer roller, the signal becomes OFF → ON, and the signal ON can indicate that the wafer is detected, but the wafer is not detected (including the wafer is far away) or the signal OFF is detected when the sensor is faulty. That is, the current technology cannot distinguish a sensor failure, and once a sensor failure for detecting a semiconductor wafer fails to output a signal ON (high level signal), the wafer is at risk of being hit. It is apparent that in the related art, the OFF (low level signal) of the sensor output signal for detecting the semiconductor wafer may indicate that the wafer is not detected or that the sensor is failed, and the ON of the output signal indicates that the semiconductor wafer is detected. Only after the sensor outputs a high level signal, the signal for controlling the semiconductor wafer 1 to decelerate and stop will play a role of control, otherwise, the signal will not play a role, that is, when the semiconductor wafer is detected to be not detected or a fault occurs, the subsequent signal for decelerating and stopping will not play a role normally, and the subsequent operation of decelerating and stopping will be interfered naturally.
In the prior art, a sensor outputs a high-level signal to realize speed reduction and stop, when the sensor is abnormal or has a fault and a detection signal is not transmitted to a controller, a wafer transmitted by a transmission roller may cross a station needing to be stopped or rush out of a roller area, which all cause the condition that the wafer is easy to be abnormal when being positioned and stopped.
Based on this, as shown in fig. 1 and fig. 2, the present application provides a method for controlling the stop of positioning of a semiconductor wafer on a transport device, the method is applied to a transport device for transporting a semiconductor wafer 1, the transport device includes a driving motor and a plurality of transport rollers 22, the drive motor is synchronously controlled by the driving motor, the method includes:
step S001: the deceleration point 31, the stopping point 32 and the wafer detecting point 33 are arranged in advance in the area formed by all the transport rollers 22, wherein the deceleration point 31, the stopping point 32 and the wafer detecting point 33 are distributed in sequence along the positive transport direction of the transport rollers 22.
The deceleration point 31, the stop point 32 and the wafer detection point 33 are all arranged in the center in the vertical direction of the positive conveying direction. Different from the arrangement sequence of the wafer detection points 33, the deceleration points 31 and the stopping points 32 in the past, in the embodiment of the present application, the deceleration points 31, the stopping points 32 and the wafer detection points 33 are sequentially distributed along the forward transmission direction of the transmission roller 22, so that the signals received by the controller and passing through the wafer detection points 33 are different from the signals leaving the deceleration points 31 and the stopping points 32.
Step S002: after detecting that the semiconductor wafer 1 sequentially passes through the deceleration point 31, the stop point 32, and the wafer detection point 33, a low level signal is generated and the driving motor is triggered.
Wherein the semiconductor wafer 1 is detected to pass or leave the deceleration point 31 by a first sensor mounted on the transfer device; detecting the semiconductor wafer 1 passing or leaving the stopping point 32 by a second sensor mounted on the transporting device; the passage or departure of the semiconductor wafer 1 from the wafer detecting point 33 is detected by a third sensor mounted on the transfer device.
Step S003: if the driving motor is triggered, after detecting that the semiconductor wafer 1 leaves the deceleration point 31, a high level signal is generated and the driving motor is controlled to synchronously drive all the transport rollers 22 to decelerate.
Step S004: after detecting that the semiconductor wafer 1 leaves the stopping point 32, a high level signal is generated and the driving motor is controlled to synchronously drive all the transfer rollers 22 to stop.
In the present embodiment, the precondition for decelerating or stopping the transport rollers is that it is determined that the wafer is detected, the driving motor is triggered after the wafer is detected, and when it is detected that the wafer is far away from the deceleration point 31 or the stop point 32, the driving motor is directly controlled to synchronously control each transport roller 22.
It should be noted that, in this embodiment, the above-mentioned driving motor only controls a part of the transmission rollers 22 on one transmission line, and the number of the transmission rollers 22 may be determined empirically according to the point to be positioned and stopped; the other transmission rollers on the transmission line are independently controlled by other driving motors.
In the embodiment of the present application, the positions of the deceleration point 31, the stop point 32 and the wafer detection point 33 in the forward transmission direction relative to the semiconductor wafer 1 are optimally designed, and by means of the control signals generated by the passing and the separating of the semiconductor wafer 1, especially, the low level signal is generated when the wafer passes, it can be ensured that the first sensor and the second sensor switch the output level to the high level signal when detecting that the semiconductor wafer 1 leaves and further control the driving motor 21 to drive the transmission roller 22 to perform the corresponding deceleration or stop action even if only the third sensor is abnormal (the third sensor outputs the low level signal), and the high level signal is output when the third sensor does not detect the semiconductor wafer 1 and further does not interfere with and limit the control of the first sensor and the second sensor on the driving motor 21, and further, it cannot be identified whether the semiconductor wafer 1 or the third sensor is detected to have a fault, that is the difficult problem that it cannot be identified whether the semiconductor wafer 1 or the third sensor is detected to have a fault at the present stage is overcome.
As shown in fig. 3, the method further comprises:
arranging a limit point 34 in the area in advance, wherein the stop point 32 and the limit point 34 are distributed along the positive transmission direction, the distance along the positive transmission direction is greater than the preset distance, and the limit point 34 is arranged in the middle in the direction perpendicular to the positive transmission direction;
if it is detected that the semiconductor wafer 1 passes the limit point 34, an alarm is issued.
Further, the semiconductor wafer 1 passing or leaving the stopper point 34 is detected by a fourth sensor mounted on the transport device.
Further, the distance from the wafer detecting point 33 to the stopping point 32 in the positive transferring direction is greater than half of the preset distance and less than half of the distance from the limiting point 34 to the stopping point 32 in the positive transferring direction.
Alternatively, if the conveying roller 22 is used for conveying wafers of the same specification, the predetermined distance may be the diameter of the semiconductor wafer; if the conveying roller 22 is used for conveying wafers of multiple specifications, the predetermined distance may be the maximum diameter of the wafer.
In the present embodiment, the driving motor stops at a low speed, and the displacement of the forward stroke due to inertia is small, so that the wafer may stop before the limit point 34, thereby achieving the function of stopping and positioning.
However, if the fourth sensor detects that the semiconductor wafer 1 passes through the limit point 34, it indicates that the wafer does not have good stopping positioning, and may give an alarm to the operator if necessary to facilitate manual intervention by the operator, thereby ensuring that the wafer is stopped at a proper position manually when the wafer positioning is stopped abnormally.
Further, the method further comprises:
and if the first sensor or the second sensor or the third sensor or the fourth sensor fails, outputting a low-level signal. Specifically, when a certain sensor fails, the sensor outputs a low level signal.
Further, the method further comprises:
after detecting that the semiconductor wafer 1 passes the limit point 34, if the first sensor or the second sensor still outputs a low level signal for a predetermined time, all the transport rollers 22 are forced to stop.
In this embodiment, a fourth sensor is also provided to force all the transport rollers 22 to stop in case of abnormality of the first sensor or the second sensor, so as to further ensure reliable stop of the semiconductor wafer 1. Obviously, according to the embodiment of the application, the probability that the semiconductor wafer stops abnormal positioning during transmission due to the fact that the first sensor, the second sensor and the third sensor are in fault can be reduced, and the positioning stability of the semiconductor wafer is ensured.
Further, the first sensor, the second sensor, the third sensor, or the fourth sensor is accommodated in a gap formed between two adjacent conveying rollers 22. Specifically, first sensor, second sensor, third sensor, fourth sensor all establish in the clearance, are less than the transmission plane that the transmission gyro wheel formed, do not disturb the transportation of wafer, also can accurately detect the wafer when the detection mouth of each sensor is up.
If the first sensor, the second sensor, the third sensor or the fourth sensor detects that the semiconductor wafer 1 passes through, outputting a low-level signal; if the first sensor, the second sensor, the third sensor or the fourth sensor detects that the semiconductor wafer 1 leaves, a high level signal is output.
The first sensor, the second sensor, the third sensor and the fourth sensor are all normally ON signal sensors. The constant ON signal sensor outputs a low level signal when detecting a wafer, so that the safety clamping control of the equipment can be ensured even if the sensor is in fault or damaged.
In the embodiment, a first sensor and/or a second sensor closely related to the wafer positioning stop, such as a fault of the first sensor or the second sensor, may cause the wafer not to normally stop ON the transport rollers 22, where the first sensor and the second sensor both output level signals at a critical point where the wafer passes through or is away from, the first sensor may be defined as a deceleration sensor, and the second sensor may be defined as a stop sensor, where the deceleration sensor outputs a low level signal when detecting that the wafer passes through and outputs a high level signal when the wafer is away from, and the deceleration sensor is a normally ON signal sensor, and keeps a high level signal when the wafer is not detected, so to further ensure the wafer positioning safety and stability, if the 5s controller still receives a low level signal, all the transport rollers 22 are forcibly controlled to stop without changing to a high level signal. If the first sensor or the second sensor fails, the controller cannot normally receive a signal (high-level signal) for decelerating or stopping the wafer, and the wafer still moves forwards, so that the abnormal condition of the deceleration sensor or the stop sensor can be solved by setting a certain time.
Further, if the third sensor fails and the first sensor and the second sensor are normal, the third sensor still outputs a low signal, and the first sensor and the second sensor still output a high signal when the wafer leaves the deceleration point 31 and the stop point 32, and the high signal enables the driving motor to control the movement of each transfer roller 22.
When at least one of the first sensor, the second sensor and the third sensor is abnormal, if the third sensor fails, the third sensor outputs a low level signal, and under the condition that the first sensor and the second sensor are both normal, the first sensor and the second sensor can still be ensured to switch the output level to a high level signal when detecting that the semiconductor wafer 1 leaves, so as to control the driving motor 21 to drive the transmission roller 22 to execute corresponding actions of speed reduction or stop. Therefore, compared with the related art, the embodiment of the application still ensures that the first sensor and the second sensor enable the driving motor 21 to control the movement of each transmission roller 22 when the third sensor fails, so that the stop positioning of the semiconductor wafer 1 on the transmission rollers is more stable and reliable.
If the first sensor or the second sensor fails, regardless of whether the third sensor fails or not, the presence of the fourth sensor can forcibly control the stop of the transport roller 22 after a preset time period elapses after the semiconductor wafer 1 is detected to pass through the limit point 34, thereby further ensuring that the semiconductor wafer 1 can be safely stopped on the transport roller 22.
It should be noted that, the sensor failure mentioned in the embodiments of the present application may be any one or any combination of the first sensor, the second sensor, and the third sensor, unless otherwise specified. The fourth sensor is a bottom pocket solution for solving the problem of reliable stop provided when the first sensor, the second sensor and the third sensor are all abnormal, and therefore, the situation that the fourth sensor is in failure is not considered in the embodiment of the present application.
Specifically, if the first sensor or the second sensor still outputs the low level signal after the preset time, the method includes:
and starting a timer, and judging that the first sensor or the second sensor still outputs a low-level signal after the preset time by comparing the timing time of the timer with the preset time.
In other words, after the semiconductor wafer 1 is detected to pass through the limit point 34, the timer is used to count the time.
The present application is described in detail below with reference to a specific embodiment.
Before the wafer enters the positioning stop area, the deceleration sensor, the stop sensor, and the wafer detection sensor output signals ON (high level signals). The third sensor is used to detect whether the wafer passes or leaves the wafer detecting point 33, and may be defined as a wafer detecting sensor.
When the wafer enters the positioning stop area, the deceleration sensor, the stop sensor, and the wafer detection sensor sequentially output signals OFF (low level signals) as the wafer sequentially passes through the deceleration point 31, the stop point 32, and the wafer detection point 33.
When the wafer leaves the positioning stop area, firstly, the wafer leaves the deceleration point 31, the deceleration sensor outputs a signal ON, and the controller controls each transmission roller 22 to do deceleration movement after receiving the signal ON; then, the wafer continues to move forward and leave the stopping point 32, the sensor is stopped to output an ON signal, the controller receives the ON signal and controls each conveying roller 22 to stop, and when no abnormality exists, the wafer stops ON the conveying rollers 22, so that the stopping and the positioning are realized.
Compared with the "OFF → ON" in the related art, in which the initial level of the sensor is low and the level of the sensor failure output is also low, if the wafer is detected to be high after entering, the low level is output when the wafer is detected to be absent or the wafer is not detected or the sensor failure is detected, and whether the sensor fails or not is naturally distinguished.
The signal change of the embodiment of the application is "ON → OFF → ON", that is, the initial level of the sensor is high level, and the position distribution of the deceleration point 31, the stopping point 32 and the wafer detecting point 33 is combined, so that the positioning stop of the wafer can be realized in the third sensor regardless of whether a fault occurs, and the stability and reliability of the positioning stop are ensured.
In order to further ensure the stability of the wafer stop positioning, a limit point 34 is continuously arranged along the positive transmission direction, the driving motor 21 is forcibly controlled by detecting a low level signal output by a limit sensor when the wafer passes through the wafer limit point 34, so that the phenomenon of abnormal wafer stop when at least one of the first sensor and the second sensor fails is avoided, the reliability of the stop positioning is further ensured, a worker is informed to perform manual interference when the wafer is abnormal, and the wafer can be automatically stopped and positioned normally.
It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations encompassed by the claims, and that any combination of technical features described in the embodiments can be made without conflict. Various modifications and changes may also be made on the basis of the above embodiments without departing from the scope of the present disclosure. Likewise, various features of the above embodiments may be arbitrarily combined to form additional embodiments of the present invention that may not be explicitly described. Therefore, the above examples only represent some embodiments of the present invention, and do not limit the scope of the present invention.
Claims (4)
1. A method for controlling the positioning and stopping of a semiconductor wafer on a transport device, said method being applied to a transport device for transporting a semiconductor wafer (1), said transport device comprising a drive motor and a plurality of transport rollers (22) spaced apart and controlled synchronously by said drive motor, said method comprising:
arranging a deceleration point (31), a stopping point (32) and a wafer detection point (33) in an area formed by all the transmission rollers (22) in advance, wherein the deceleration point (31), the stopping point (32) and the wafer detection point (33) are distributed in sequence along the positive transmission direction of the transmission rollers (22); wherein the passing or leaving of the semiconductor wafer (1) past the deceleration point (31) is detected by a first sensor mounted on the transport device; -detecting the passing or leaving of the semiconductor wafer (1) past the stopping point (32) by means of a second sensor mounted on the transport device; detecting the passing or leaving of the semiconductor wafer (1) past the wafer detection point (33) by a third sensor mounted on the transport device;
after the semiconductor wafer (1) is detected to sequentially pass through the deceleration point (31), the stopping point (32) and the wafer detection point (33), generating a low-level signal and triggering the driving motor;
if the driving motor is triggered, after the semiconductor wafer (1) is detected to leave the deceleration point (31), generating a high-level signal and controlling the driving motor to synchronously drive all the conveying rollers (22) to decelerate;
after detecting that the semiconductor wafer (1) leaves the stopping point (32), generating a high level signal and controlling the driving motor to synchronously drive all the conveying rollers (22) to stop;
the method further comprises the following steps:
arranging limiting points (34) in the area in advance, wherein the stopping points (32) and the limiting points (34) are distributed along the positive transmission direction, and the distance along the positive transmission direction is larger than a preset distance; -detecting the passage or departure of the semiconductor wafer (1) from the confinement point (34) by means of a fourth sensor mounted on the transport device;
if the semiconductor wafer (1) is detected to pass through the limit point (34), an alarm is sent out;
after the semiconductor wafer (1) is detected to pass through the limit point (34), if the first sensor or the second sensor still outputs a low level signal after a preset time, all the transmission rollers (22) are forced to stop;
wherein if the first sensor or the second sensor or the third sensor or the fourth sensor detects that the semiconductor wafer (1) passes by, a low level signal is output; outputting a high level signal if the first sensor or the second sensor or the third sensor or the fourth sensor detects that the semiconductor wafer (1) is departing; outputting a low level signal if the first sensor or the second sensor or the third sensor or the fourth sensor fails;
the first sensor, the second sensor, the third sensor and the fourth sensor are all normally ON signal sensors.
2. The method of claim 1, wherein the wafer detection point (33) is more than half the preset distance from the stopping point (32) in the positive transport direction and less than half the distance from the stopping point (32) in the positive transport direction from the limit point (34).
3. The method of claim 1, wherein the first sensor or the second sensor outputting a low signal if the predetermined time has elapsed comprises:
and starting a timer, and judging that the first sensor or the second sensor still outputs a low-level signal after the preset time by comparing the timing time of the timer with the preset time.
4. The method according to claim 1, wherein the deceleration point (31), the stopping point (32), the wafer detection point (33) and the limit point (34) are all centrally arranged in a direction perpendicular to the positive transport direction;
or the first sensor, the second sensor, the third sensor or the fourth sensor are accommodated in a gap formed by two adjacent conveying rollers (22).
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| CN202310057692.2A CN115799138B (en) | 2023-01-16 | 2023-01-16 | Method for controlling positioning and stopping of semiconductor wafer on conveying device |
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| JP2003110286A (en) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Mounting machine |
| CN103025138A (en) * | 2011-09-27 | 2013-04-03 | 雅马哈发动机株式会社 | Substrate transfer apparatus, substrate transfer method, and surface mounter |
| CN103997883A (en) * | 2013-02-18 | 2014-08-20 | 松下电器产业株式会社 | Method for fixing substrate |
| CN109980048A (en) * | 2019-04-03 | 2019-07-05 | 杭州中为光电技术有限公司 | For the carrier plate location device in photovoltaic module production |
-
2023
- 2023-01-16 CN CN202310057692.2A patent/CN115799138B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110286A (en) * | 2001-09-28 | 2003-04-11 | Matsushita Electric Ind Co Ltd | Mounting machine |
| CN103025138A (en) * | 2011-09-27 | 2013-04-03 | 雅马哈发动机株式会社 | Substrate transfer apparatus, substrate transfer method, and surface mounter |
| CN103997883A (en) * | 2013-02-18 | 2014-08-20 | 松下电器产业株式会社 | Method for fixing substrate |
| CN109980048A (en) * | 2019-04-03 | 2019-07-05 | 杭州中为光电技术有限公司 | For the carrier plate location device in photovoltaic module production |
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