CN115799125A - Stability detection system for semiconductor wafer transmission - Google Patents
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Abstract
The invention provides a stability detection system for semiconductor wafer transmission, which relates to the technical field of wafer transmission and specifically comprises the following steps: the transmission information acquisition module acquires transmission information in the transmission process of the semiconductor wafer and transmits the transmission information to the data analysis module, and the data analysis module acquires data parameters in the transmission process based on the analysis of the transmission information; the acquired data parameters are transmitted to a stable calculation module, and the stable calculation module receives the data parameters to solve stable data; the obtained stable data are transmitted to a data analysis module, and the data analysis module classifies the obtained stable parameters to obtain a stable threshold value; the stability judgment module is used for judging the stability based on the stability threshold value, and the invention analyzes the transmission of the semiconductor wafer on the horizontal plane and the inclined plane based on the numerical value of the transmission information, so that the semiconductor wafer is stably transmitted after being processed, and the stability of the transmission of the semiconductor wafer is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer transmission, in particular to a stability detection system for semiconductor wafer transmission.
Background
The circle refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and the original material thereof is silicon. And after dissolving the high-purity polycrystalline silicon, doping silicon crystal seed crystals, and then slowly pulling out to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 8 inches and 12 inches.
The main processing modes of the wafer are sheet processing and batch processing, i.e. 1 or more wafers are processed simultaneously. As semiconductor feature sizes become smaller and smaller, processing and measurement equipment becomes more and more advanced, so that new data characteristics appear in wafer processing. Meanwhile, the characteristic size is reduced, so that the influence of the particle number in the air on the quality and reliability of the processed wafer is increased during wafer processing, the particle number has new data characteristics along with the improvement of cleanness, and the semiconductor wafer needs to be transmitted in the processing process.
In the prior art, when the semiconductor wafer is transferred at different speeds in the transferring process, the stability of the semiconductor wafer in the transferring process is changed, and the stability of the semiconductor wafer cannot be detected and controlled based on the transferring surface and the transferring speed of the semiconductor wafer in the transferring process, so that a stability detection system for transferring the semiconductor wafer is lacked to solve the existing problems.
Disclosure of Invention
The invention aims to provide a stability detection system for semiconductor wafer transmission, which can be used for acquiring transmission information in the transmission process of a semiconductor wafer, analyzing the horizontal plane and inclined plane transmission of the semiconductor wafer based on the numerical value of the transmission information, detecting and analyzing the stability in different operation states based on different operation states, and adjusting the transmission speed in the transmission process of the semiconductor wafer based on detection and analysis data, so that the semiconductor wafer can be stably transmitted after being processed, and the transmission stability of the semiconductor wafer can be improved.
In order to realize the purpose, the invention is realized by the following technical scheme: a stability detection system for semiconductor wafer transmission comprises a transmission information acquisition module, a data analysis module, a stability calculation module, a stability judgment module, a transmission management module, an alarm module and a server; the transmission information acquisition module, the data analysis module, the stability calculation module, the stability judgment module, the transmission management module and the alarm module are respectively in data connection with the server;
the transmission information acquisition module acquires transmission information in the semiconductor wafer transmission process, transmits the transmission information to the data analysis module, and the data analysis module acquires data parameters in the transmission process based on transmission information analysis;
the acquired data parameters are transmitted to a stable calculation module, and the stable calculation module receives the data parameters to solve the stable data;
the obtained stable data are transmitted to a data analysis module, and the data analysis module classifies the obtained stable parameters to obtain a stable threshold value;
the stability threshold value is transmitted to a stability judging module, the stability judging module judges the stability based on the stability threshold value, and the judging result is transmitted to a server;
and the server controls the transmission management module to carry out transmission management or controls the alarm module to give an alarm to regulate the transmission device based on the judgment result.
Further, the transmission information comprises movement information, height change information and transmission speed information, and the movement information, the height change information and the transmission speed information are transmitted to the data analysis module;
the data analysis module analyzes transmission information changes generated during horizontal linear transmission and inclined transmission of the semiconductor wafer based on the transmission state of the semiconductor wafer.
Further, a height value generated during horizontal linear transmission of the semiconductor wafer is obtained, and the data analysis module obtains the height value generated in the transportation process of the semiconductor wafer based on the height change information; the method comprises the following specific steps:
the method comprises the steps that infrared rays are arranged at the position of every 1mm at one end of the top of a semiconductor wafer in the conveying process, an inductor is arranged at the other end of the top of the semiconductor wafer, induction information is transmitted to a server corresponding to the inductor if the inductor does not induce the infrared rays in the conveying process, the server acquires a plurality of height values according to the height values of the inductor in the conveying process of the semiconductor wafer, and the height values are n, wherein the height values are H1, H2, H3, 8230, hn;
acquiring a speed value of the semiconductor wafer in the conveying process based on the conveying speed information, setting the maximum conveying speed to be SDmax, acquiring moving distance values of the semiconductor wafer at different speeds according to the moving information by changing the speed value, thereby obtaining a plurality of moving distance values, arranging the acquired moving distance values in a sequence from small to large, acquiring a minimum moving distance value, acquiring the maximum speed value corresponding to the minimum moving distance value, setting the maximum speed value as the minimum conveying speed, and setting the minimum speed to be SDmin; obtaining the semiconductor wafer acceleration value based on the minimum speed and the most initial acceleration value, wherein the semiconductor wafer acceleration value is SDmin; when the speed change is performed in the later stage, the acceleration value is made smaller than SDmin.
Further, a height value generated during oblique transmission of the semiconductor wafer is obtained, the height of a transmission point is defined as a first height, the height of a receiving point is defined as a second height, if the first height is smaller than the second height, the semiconductor wafer is judged to be transported from bottom to top, when the semiconductor wafer is transported, moving distance values of the semiconductor wafer at different speeds are obtained through changing of speed values, a plurality of moving distance values are obtained accordingly, the obtained moving distance values are arranged in a sequence from small to large, a minimum moving distance value is obtained, a maximum speed value corresponding to the minimum moving distance value is obtained, and the maximum speed value is set as the maximum speed of transmission.
Further, if the first height is larger than the second height, the semiconductor wafer is judged to be transported from top to bottom, during transportation, the moving distance values of the semiconductor wafer at different speeds are obtained through changing of speed values, a plurality of moving distance values are obtained, the changing directions of the plurality of distance values are obtained, the obtained plurality of moving distance values are arranged according to the obtaining sequence, the change of the moving distance values is observed, if the changing direction is the same as the conveying direction, the initial speed value is judged to be small, if the changing direction is opposite to the conveying direction, the initial speed value is judged to be large, the moving distance values are analyzed based on the changing characteristics of the moving distance values, the horizontal coordinate is used as the speed value, the vertical coordinate is used as the moving distance value to be a rectangular plane coordinate system, the corresponding moving distance value is expressed in the rectangular plane coordinate system, a curve smooth connection graph is formed, the speed value corresponding to the moving distance value at the lowest point is selected as the initial speed value, and the initial speed value is the minimum speed.
Further, when the semiconductor wafer is in inclined transmission, a straight line perpendicular to the inclined plane is made, an installation surface parallel to the straight line is arranged on one side of the straight line, the straight line is translated to the installation surface, the intersection point of the bottom of the straight line and the installation surface is the lowest distance of the inclined plane, the thickness of the semiconductor wafer is obtained, the intersection point is measured by taking the intersection point as the lowest point to obtain the thickness intersection point, infrared rays are arranged at the thickness intersection point and the top end of the thickness intersection point at intervals of 1mm, an inductor is arranged at the other end of the thickness intersection point, if the inductor does not sense the infrared rays in the conveying process, sensing information is transmitted to a server corresponding to the inductor, and the server obtains height values generated in the conveying process of the semiconductor wafer according to the inductor to obtain a plurality of height values;
and acquiring a moving distance value and a height value generated when the speed between the minimum speed value and the maximum speed value is changed, defining the moving distance value and the height value as data parameters, and transmitting the data parameters to the stability calculation module.
Further, the stable calculation module receives the data parameters, and obtains a moving distance value and a height value in the data parameters;
the stable calculation module acquires a height value and a moving distance value generated during horizontal linear transmission of the semiconductor wafer; acquiring a horizontal stability reference value when the semiconductor wafer moves horizontally;
the stable calculation module acquires a height value and a moving distance value generated during the inclined transmission of the semiconductor wafer; acquiring a horizontal stable reference value when the semiconductor wafer moves horizontally;
when the semiconductor wafer is transported from top to bottom, deleting height values which have the same moving direction and the same transmission direction of the moving distance value and correspondingly occur, acquiring the moving distance value with the opposite changing direction and the transmission direction, and acquiring a lower inclination stable reference value when the semiconductor wafer is inclined and moved;
and defining the acquired plurality of horizontal stable reference values, the plurality of upper inclined stable reference values and the plurality of lower inclined stable reference values as stable data, and transmitting the stable data to the data analysis module.
Further, the data analysis module receives a plurality of stable horizontal reference values for analysis and classification, and the specific classification is as follows:
the data analysis module arranges the acquired multiple horizontal stable reference values in a descending order;
acquiring a horizontal transmission distance, setting the transmission distance as n, and setting the ratio of the maximum offset distance and the transmission distance of the semiconductor wafer during horizontal transmission as 1/n + k; the maximum offset distance when moving is n/n + k; obtaining the thickness of the semiconductor wafer, and setting the thickness of the semiconductor wafer to be JYhd; the maximum height distance of the semiconductor wafer during the transfer is 1/JYhd; obtaining a critical level reference value based on the maximum offset distance being n/n + k and the maximum height distance being 1/JYhd;
according to the plurality of horizontal stability reference values and the critical horizontal reference value, dividing the numerical value of which the horizontal reference value is smaller than the critical horizontal reference value into a horizontal first stability threshold value and a horizontal second stability threshold value in sequence according to the arrangement sequence, and dividing the numerical value of which the horizontal reference value is larger than the critical horizontal reference value into a horizontal third stability threshold value;
k is a balance coefficient, and a balance value is carried out according to the value of n during value taking;
the data analysis module receives a plurality of inclined stable reference values for analysis and classification, and the specific classification is as follows:
acquiring the maximum transmission speed YQXSDmax, acquiring the height value at the speed based on the maximum transmission speed, and setting the acquired height value as follows: qxHxsmax; acquiring a critical upper-inclination reference value based on YQXSDmax and qxHxsmax;
dividing the numerical value of which the inclined reference value is smaller than the critical inclined reference value into an inclined first stable threshold value and an inclined second stable threshold value in sequence according to the arrangement sequence, and dividing the numerical value of which the inclined reference value is larger than the critical inclined reference value into an inclined third stable threshold value;
the data analysis module receives a plurality of declination stable reference values for analysis and classification, and the specific classification is as follows:
the data analysis module arranges the obtained plurality of lower inclination stable reference values in a sequence from small to large;
acquiring a transmitted minimum speed EQXSDmin, acquiring a height value at the speed based on the transmitted minimum speed, and setting the acquired height value as follows: qxHsxmin; acquiring a minimum down-tilt reference value based on the EQXSDmin and qxHsxmin;
sequentially dividing a plurality of lower-inclination stable reference values which are greater than the lower-inclination minimum reference value into a lower-inclination first stable threshold value, a lower-inclination second stable threshold value and a lower-inclination third stable threshold value according to the arrangement sequence;
and defining a horizontal first stable threshold, a horizontal second stable threshold, a horizontal third stable threshold, an upward inclined first stable threshold, an upward inclined second stable threshold, an upward inclined third stable threshold, a downward inclined first stable threshold, a downward inclined second stable threshold and a downward inclined third stable threshold which are obtained by analysis as stable thresholds, and conveying the stable thresholds to a stable judgment module.
Further, the stability judgment module receives a stability threshold for judgment, which specifically includes:
if the numerical value obtained in the transmission process of the semiconductor wafer is between a horizontal first stable threshold value, an upward inclined first stable threshold value or a downward inclined first stable threshold value, judging that the semiconductor wafer is stably transmitted;
if the value obtained in the transmission process of the semiconductor wafer is between the horizontal second stable threshold value, the upward-inclined second stable threshold value or the downward-inclined second stable threshold value, judging that the semiconductor wafer is transmitted with sliding deviation, and performing normal transmission;
and if the value obtained in the transmission process of the semiconductor wafer is between the horizontal third stable threshold, the upward-inclined third stable threshold or the downward-inclined third stable threshold, judging that the semiconductor wafer is dangerous to transmit, and transmitting the judgment result to the server, wherein the judgment result cannot be normally transmitted.
Furthermore, the server receives the judgment result and judges that the semiconductor wafer is stably transferred, the transfer speed of the transfer device is not adjusted, and the server receives the judgment result and controls the transfer management module to carry out transfer management when the sliding deviation occurs and normal transfer can be carried out, so that the transfer speed in the transfer process is limited, and the transfer speed is prevented from being increased continuously; and the server receives the judgment result and transmits the danger, and controls the alarm module to send an alarm to adjust the transmission speed of the transmission device when normal transmission cannot be carried out.
The invention has the beneficial effects that: according to the invention, the transmission information of the semiconductor wafer in the transmission process is acquired, the transmission of the semiconductor wafer on the horizontal plane and the inclined plane is analyzed based on the numerical value of the transmission information, the stability in different operation states is detected and analyzed based on different operation states, and the transmission speed in the transmission process of the semiconductor wafer is adjusted based on the detection and analysis data, so that the semiconductor wafer is stably transmitted after being processed, and the transmission stability of the semiconductor wafer is improved;
the invention can adjust the speed according to the maximum transmission speed by setting the maximum transmission speed, and can obtain the transmission moving distance value and the height value of the semiconductor wafer at different speeds to judge the stability of the semiconductor wafer in the conveying process.
Advantages of additional aspects of the invention will be set forth in part in the description of the embodiments which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a block diagram of a stability detection system for semiconductor wafer transfer according to the present invention;
FIG. 2 is a diagram of method steps in a stability inspection system for semiconductor wafer transfer in accordance with the present invention.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention.
The embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, the present invention provides a stability detection system for semiconductor wafer transfer, which includes a transfer information acquisition module, a data analysis module, a stability calculation module, a stability determination module, a transfer management module, an alarm module and a server; the transmission information acquisition module, the data analysis module, the stability calculation module, the stability judgment module, the transmission management module and the alarm module are respectively in data connection with the server;
the specific scheme is as follows: the transmission information acquisition module acquires transmission information in the transmission process of the semiconductor wafer and transmits the transmission information to the data analysis module, and the data analysis module acquires data parameters in the transmission process based on the analysis of the transmission information;
the transmission information comprises movement information, height change information and transmission speed information, and the movement information, the height change information and the transmission speed are transmitted to the data analysis module;
the data analysis module analyzes transmission information changes generated during horizontal linear transmission and inclined transmission of the semiconductor wafer based on the transmission state of the semiconductor wafer:
acquiring a height value generated during horizontal linear transmission of the semiconductor wafer, and acquiring the height value generated in the transportation process of the semiconductor wafer by the data analysis module based on the height change information; the method comprises the following specific steps:
arranging infrared rays at the position of every 1mm at one end of the top of the semiconductor wafer in the conveying process, arranging a sensor at the other end of the semiconductor wafer, if the sensor does not sense the infrared rays in the conveying process, transmitting sensing information to a server corresponding to the sensor, and acquiring a plurality of height values by the server according to the height values generated in the conveying process of the semiconductor wafer by the sensor, wherein the number of the height values is n, and the height values are H1, H2 and H3 \8230, H8230, hn;
acquiring a speed value of the semiconductor wafer in the conveying process based on the conveying speed information, setting the maximum conveying speed to be SDmax, acquiring moving distance values of the semiconductor wafer at different speeds according to the moving information by changing the speed value, thereby obtaining a plurality of moving distance values, arranging the plurality of acquired moving distance values in a sequence from small to large, acquiring a minimum moving distance value, acquiring a maximum speed value corresponding to the minimum moving distance value, setting the maximum speed value as the minimum conveying speed, and setting the minimum speed to be SDmin; obtaining the semiconductor wafer acceleration value based on the minimum speed and the most initial acceleration value, wherein the semiconductor wafer acceleration value is SDmin; when the speed is changed in the later period, the acceleration value is smaller than SDmin;
wherein: hz is H1, H2, H3 \8230, 8230, hn;
it should be noted that, when the semiconductor wafer is transferred, the speed is low during the initial transfer, and the semiconductor wafer does not shift, when the semiconductor wafer is obtained, the speed is gradually increased when the transmission speed is changed, and the semiconductor wafer shifts during the transfer, and based on the variation value of the shift, the maximum speed value corresponding to the case where the shift does not change is the minimum speed of the semiconductor wafer during the transfer process;
acquiring a height value generated during the inclined transmission of the semiconductor wafer, defining the height of a transmission point as a first height, defining the height of a receiving point as a second height, if the first height is smaller than the second height, judging that the semiconductor wafer is transported from bottom to top, acquiring moving distance values of the semiconductor wafer at different speeds by changing the speed value during the transportation, thereby obtaining a plurality of moving distance values, arranging the plurality of acquired moving distance values in a sequence from small to large, acquiring a minimum moving distance value, acquiring a maximum speed value corresponding to the minimum moving distance value, setting the maximum speed value as the maximum speed of the transmission, and setting the maximum speed as YQXSDmax; acquiring based on the maximum speed and the most initial acceleration value, wherein the acceleration value of the semiconductor wafer is YQXSDmax; when the speed is changed in the later period, the acceleration value is smaller than YQXSDmax;
if the first height is larger than the second height, the semiconductor wafer is judged to be transported from top to bottom, when the semiconductor wafer is transported, moving distance values of the semiconductor wafer at different speeds are obtained through changing of speed values, a plurality of moving distance values are obtained, the changing directions of the distance values are obtained, the obtained moving distance values are arranged according to the obtaining sequence, the change of the moving distance values is observed, if the changing direction is the same as the conveying direction, the initial speed value is judged to be small, if the changing direction is opposite to the conveying direction, the initial speed value is judged to be large, the moving distance values are analyzed based on the changing characteristics of the moving distance values, a horizontal coordinate is used as the speed value, a vertical coordinate is used as the moving distance value and is used as a plane rectangular coordinate system, the corresponding moving distance value is expressed in the plane rectangular coordinate system, a moving distance value graph is formed through curve smooth connection, the speed value corresponding to the moving distance value at the lowest point is selected as the initial speed value, the initial speed value is set as EQXSin, and the minimum speed is set as EQXSin; acquiring the minimum speed and the most initial acceleration value based on the minimum speed, wherein the acceleration value of the semiconductor wafer is EQXSDin; when the speed is changed in the later period, the acceleration value is smaller than EQXSDmin;
when the semiconductor wafer is in inclined transmission, a straight line perpendicular to the inclined plane is made, a mounting surface parallel to the straight line is arranged on one side of the straight line, the straight line is translated to the mounting surface, the intersection point of the bottom of the straight line and the mounting surface is the lowest distance of the inclined plane, the thickness of the semiconductor wafer is obtained, the intersection point is measured by taking the intersection point as the lowest point, infrared rays are arranged at the intersection point of the thickness and the top end of the intersection point at intervals of 1mm, an inductor is arranged at the other end of the intersection point, if the inductor does not sense the infrared rays in the conveying process, the induction information is conveyed to a server corresponding to the inductor, the server obtains a plurality of height values according to the height values generated in the conveying process of the semiconductor wafer by the inductor, and the height values are obtained, wherein the number of the height values is n, and the height values are respectively Hqx1, hqx2 and Hqx3 \8230, hqx3 \8230andHqx n;
the analysis is carried out based on a plurality of height values, and when the semiconductor wafer is transported from bottom to top, the height values are qxHxs1, qxHxs2 and qxHxs3 \ 8230 \ 8230; qxHxsn;
when the semiconductor wafer is transported from top to bottom, the plurality of height values are qxHsx1, qxHsx2, qxHsx3 \8230, 8230and qxHsxn, respectively;
acquiring a moving distance value and a height value generated when the speed between the minimum speed value and the maximum speed value is changed, and setting the moving distance value as YDJLz; the height value is Hz; defining the moving distance value and the height value as data parameters, and transmitting the data parameters to a stable calculation module;
the acquired data parameters are transmitted to a stable calculation module, and the stable calculation module receives the data parameters to solve the stable data;
the stability calculation module receives the data parameters and acquires a moving distance value and a height value in the data parameters;
the stable calculation module acquires a height value and a moving distance value generated during horizontal linear transmission of the semiconductor wafer;
the moving distance value of the horizontal linear transmission is set as follows: SPYDJLz; obtaining a plurality of moving distance values based on different transmission speeds respectively as follows: SPYDJLz1, SPYDJLz2, SPYDJLz3 \8230, 8230, SPYDJLzs;
the height values are set as: h; combining a plurality of height values which are respectively H1, H2 and H3 \8230 \ 8230and Hn; acquiring a horizontal stability reference value when the semiconductor wafer moves horizontally, wherein the horizontal stability reference value is set as follows: SPWDCKZ; for a specific reference value, see the following equation:
SPWDCKZ=H×（1+SPYDJLz）；
the method comprises the following steps of (1) substituting SPYDJLz1, SPYDJLz2, SPYDJLz3 \8230, SPYDJLzs, H1, H2 and H3 \8230, H8230and Hn into a plurality of horizontal stable reference values;
the stable calculation module acquires a height value and a moving distance value generated during the inclined transmission of the semiconductor wafer;
when the semiconductor wafer is transported from bottom to top, the moving distance value of the inclined transmission is set as follows: yqxydllz; the obtained plurality of moving distance values based on the difference of the transmission speeds are respectively: YQXYDYBJLz 1, YQXYDYBJLz 2, YQXYDYBJLz 3 \ 8230, \8230, YQXYDYBJLzs;
the height values are set as: qxHxs; combining a plurality of height values of qxHxs1, qxHxs2 and qxHxs3 \ 8230 \8230; \8230and qxHxsn; acquiring a horizontal stability reference value when the semiconductor wafer moves horizontally, wherein the horizontal stability reference value is set as follows: YQXWDCKZ; for a specific reference value, refer to the following formula:
YQXWDCKZ=qxHxs×（1+YQXYDJLz）；
YQXYDJLz1, YQXYDJLz2, YQXYDJLz3 \ 8230, yQXYDJLzs, qxHxs1, qxHxs2, qxHxs3 \ 8230, qxHxsn, qxHxsn are brought into the reference values to obtain a plurality of inclined tilt stable reference values;
when the semiconductor wafer is transported from top to bottom, deleting height values which are the same in moving direction and conveying direction and occur correspondingly to the moving distance values, acquiring the moving distance values with the changing direction opposite to the conveying direction, and setting the moving distance values of inclined transmission as follows: yqxydllz; the obtained plurality of moving distance values based on the difference of the transmission speeds are respectively: EQXYYDJLz 1, EQXYYDJLz 2, EQXYDQLz 3 \8230, 8230, EQXYYDJLzs;
the height values are set as: qxHsx; combining a plurality of height values of qxHsx1, qxHsx2, qxHsx3 \8230; \8230andqxHsxn; acquiring a lower inclination stable reference value when the semiconductor wafer is in inclined movement, wherein the horizontal stable reference value is set as follows: eQXWDCKZ; for a specific reference value, see the following equation:
EQXWDCKZ=qxHsx×（1+YQXYDJLz）；
EQXYYDJLz 1, EQXYYDJLz 2, EQXYYDJLz 3 \8230 \ 8230, EQXYYDJLzs, qxHsx1, qxHsx2, qxHsx3 \8230 \ 8230and qxHsxn are brought into the reference values for obtaining a plurality of downward inclination stability;
wherein s is a number value of the movement distance values;
defining the obtained multiple horizontal stable reference values, multiple upper inclined stable reference values and multiple lower inclined stable reference values as stable data, and transmitting the stable data to a data analysis module;
the obtained stable data are transmitted to a data analysis module, the data analysis module classifies the obtained stable parameters, and a stable threshold value is obtained through classification;
the data analysis module receives a plurality of horizontal stability reference values for analysis and classification, and the specific classification is as follows:
the data analysis module arranges the acquired multiple horizontal stable reference values in a descending order;
acquiring a horizontal transmission distance, setting the transmission distance as n, and setting the ratio of the maximum offset distance of the semiconductor wafer during horizontal transmission to the transmission distance as 1/n + k; the maximum offset distance when moving is n/n + k; acquiring the thickness of the semiconductor wafer, and setting the thickness of the semiconductor wafer to be JYhd; the maximum height distance of the semiconductor wafer during the transfer is 1/JYhd; obtaining a critical horizontal reference value based on the maximum offset distance being n/n + k and the maximum height distance being 1/JYhd;
according to the plurality of horizontal stability reference values and the critical horizontal reference value, dividing the numerical value of which the horizontal reference value is smaller than the critical horizontal reference value into a horizontal first stability threshold value and a horizontal second stability threshold value in sequence according to the arrangement sequence, and dividing the numerical value of which the horizontal reference value is larger than the critical horizontal reference value into a horizontal third stability threshold value;
k is a balance coefficient, and a balance value is carried out according to the value of n during value taking;
the data analysis module receives a plurality of inclined stable reference values for analysis and classification, and the specific classification is as follows:
acquiring the maximum speed YQXSDmax of transmission, acquiring the altitude value at the speed based on the maximum speed of transmission, and setting the acquired altitude value as: qxHxsmax; acquiring a critical upper-inclination reference value based on YQXSDmax and qxHxsmax;
dividing the numerical value of which the inclined reference value is smaller than the critical inclined reference value into an inclined first stable threshold value and an inclined second stable threshold value in sequence according to the arrangement sequence, and dividing the numerical value of which the inclined reference value is larger than the critical inclined reference value into an inclined third stable threshold value;
the data analysis module receives a plurality of downward-inclined stable reference values for analysis and classification, and the specific classification is as follows:
the data analysis module arranges the obtained plurality of lower inclination stable reference values in a descending order;
acquiring a transmitted minimum speed EQXSDmin, acquiring a height value at the speed based on the transmitted minimum speed, and setting the acquired height value as follows: qxHsxmin; acquiring a minimum down-tilt reference value based on the EQXSDmin and qxHsxmin;
sequentially dividing a plurality of lower-inclination stable reference values which are greater than the lower-inclination minimum reference value into a lower-inclination first stable threshold value, a lower-inclination second stable threshold value and a lower-inclination third stable threshold value according to the arrangement sequence;
defining a horizontal first stability threshold, a horizontal second stability threshold, a horizontal third stability threshold, an upward slope first stability threshold, an upward slope second stability threshold, an upward slope third stability threshold, a downward slope first stability threshold, a downward slope second stability threshold and a downward slope third stability threshold obtained by analysis as stability thresholds, and transmitting the stability thresholds to a stability judgment module;
the stability threshold value is transmitted to a stability judging module, the stability judging module judges the stability based on the stability threshold value, and the judging result is transmitted to a server;
the stability judgment module receives the stability threshold value for judgment, and the method specifically comprises the following steps:
if the value obtained in the transmission process of the semiconductor wafer is between the horizontal first stable threshold value, the upward-inclined first stable threshold value or the downward-inclined first stable threshold value, judging that the transmission of the semiconductor wafer is stable;
if the value obtained in the transmission process of the semiconductor wafer is between the horizontal second stable threshold value, the upward-inclined second stable threshold value or the downward-inclined second stable threshold value, judging that the semiconductor wafer is transmitted with sliding deviation, and performing normal transmission;
if the value obtained in the transmission process of the semiconductor wafer is between the horizontal third stable threshold, the upward-inclined third stable threshold or the downward-inclined third stable threshold, judging that the semiconductor wafer is dangerous to transmit and cannot be normally transmitted;
and the server controls the transmission management module to carry out transmission management or controls the alarm module to give an alarm to regulate the transmission device based on the judgment result.
The server receives the judgment result and judges that the semiconductor wafer is stably transferred, the transfer speed of the transfer device is not adjusted, and the server receives the judgment result and controls the transfer management module to carry out transmission management when the sliding deviation occurs and normal transmission can be carried out, so that the transmission speed in the transfer process is limited and the transfer speed is prevented from being increased continuously; and the server receives the judgment result and transmits the danger, and controls the alarm module to send an alarm to adjust the transmission speed of the transmission device when normal transmission cannot be carried out.
The working principle is as follows: in the process of distributing and managing the site investigation tasks, the method specifically comprises the following steps:
step S1: acquiring transmission information in the transmission process of the semiconductor wafer, and transmitting the transmission information to a data analysis module, wherein the data analysis module acquires data parameters in the transmission process based on the analysis of the transmission information;
the transmission information comprises movement information, height change information and transmission speed information, and the movement information, the height change information and the transmission speed are transmitted to the data analysis module;
the data analysis module analyzes transmission information changes generated during horizontal linear transmission and inclined transmission of the semiconductor wafer based on the transmission state of the semiconductor wafer:
the height value generated during horizontal linear transmission of the semiconductor wafer is obtained, and the data analysis module obtains the height value generated in the transportation process of the semiconductor wafer based on the height change information, and the method comprises the following specific steps:
step S11: arranging infrared rays at the position of every 1mm at one end of the top of the semiconductor wafer in the conveying process, arranging an inductor at the other end of the semiconductor wafer, and if the inductor does not induce the infrared rays in the conveying process, transmitting induction information to a server corresponding to the inductor;
step S12: the server acquires a plurality of height values according to the height values generated in the process of conveying the semiconductor wafer by the inductor, wherein the number of the height values is n, and the height values are H1, H2 and H3, 8230, 8230and Hn respectively;
step S13: acquiring a speed value of the semiconductor wafer in the conveying process based on the conveying speed information, setting the maximum conveying speed to be SDmax, acquiring moving distance values of the semiconductor wafer at different speeds according to the moving information by changing the speed value, thereby obtaining a plurality of moving distance values, and arranging the acquired moving distance values in a sequence from small to large;
step S14: acquiring a minimum moving distance value, acquiring a maximum speed value corresponding to the minimum moving distance value, setting the maximum speed value as a minimum transmission speed, and setting the minimum speed as SDmin; obtaining the semiconductor wafer acceleration value based on the minimum speed and the most initial acceleration value, wherein the semiconductor wafer acceleration value is SDmin; when the speed is changed in the later period, the acceleration value is smaller than SDmin;
step S15: acquiring a height value generated during the inclined transmission of the semiconductor wafer, defining the height of a transmission point as a first height, defining the height of a receiving point as a second height, and if the first height is smaller than the second height, judging that the semiconductor wafer is transported from bottom to top;
step S16: when the semiconductor wafer is transported from bottom to top, the moving distance values of the semiconductor wafer at different speeds are obtained by changing the speed values, so that a plurality of moving distance values are obtained, the obtained moving distance values are arranged from small to large to obtain a minimum moving distance value, and a maximum speed value corresponding to the minimum moving distance value is obtained and set as a maximum speed for transmission;
step S17: if the first height is larger than the second height, judging that the semiconductor wafer is transported from top to bottom, acquiring moving distance values of the semiconductor wafer at different speeds by changing speed values during transportation, thereby obtaining a plurality of moving distance values, acquiring the change directions of the plurality of distance values, arranging the plurality of acquired moving distance values according to the acquired sequence, observing the change of the moving distance values, if the change direction is the same as the conveying direction, judging that the initial speed value is smaller, if the change direction is opposite to the conveying direction, judging that the initial speed value is larger, analyzing the moving distance values based on the change characteristics of the moving distance values, taking the horizontal coordinate as the speed value and the vertical coordinate as the moving distance value to be used as a rectangular plane coordinate system, representing the corresponding moving distance values in the rectangular plane coordinate system, forming a moving distance value graph by curve smooth connection, selecting the speed value corresponding to the moving distance value at the lowest point as the initial speed value, and taking the initial speed value as the minimum speed;
step S2: the acquired data parameters are transmitted to a stable calculation module, and the stable calculation module receives the data parameters to solve the stable data;
when the stable calculation module acquires stable data, the specific steps are as follows:
step S21: the stability calculation module receives the data parameters and acquires a moving distance value and a height value in the data parameters; the stability calculation module acquires a height value and a moving distance value generated when the semiconductor wafer is horizontally and linearly driven, and acquires a horizontal stability reference value when the semiconductor wafer is horizontally moved;
step S22: the stable calculation module acquires a height value and a moving distance value generated during the inclined transmission of the semiconductor wafer; when the semiconductor wafer is transported from bottom to top, acquiring a horizontal stable reference value when the semiconductor wafer moves horizontally;
step S23: when the semiconductor wafer is transported from top to bottom, deleting height values which have the same moving direction and the same transmission direction of the moving distance value and correspondingly occur, acquiring the moving distance value with the opposite changing direction and the transmission direction, and acquiring a lower inclination stable reference value when the semiconductor wafer is inclined and moved;
step S24: defining the obtained multiple horizontal stable reference values, multiple upper inclined stable reference values and multiple lower inclined stable reference values as stable data, and transmitting the stable data to a data analysis module;
and step S3: the obtained stable data are transmitted to a data analysis module, the data analysis module classifies the obtained stable parameters, and a stable threshold value is obtained through classification;
and step S4: and the server controls the transmission management module to carry out transmission management or controls the alarm module to give an alarm to adjust the transmission device based on the judgment result.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media having computer-usable program code embodied in the medium. The storage medium may be implemented by any type of volatile or nonvolatile storage device or combination thereof, such as a Static Random Access Memory (SRAM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), an Erasable Programmable Read-Only Memory (EPROM), a Programmable Read-Only Memory (PROM), a Read-Only Memory (ROM), a magnetic Memory, a flash Memory, a magnetic disk, or an optical disk.
The above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The stability detection system for semiconductor wafer transmission is characterized by comprising a transmission information acquisition module, a data analysis module, a stability calculation module, a stability judgment module, a transmission management module, an alarm module and a server; the transmission information acquisition module, the data analysis module, the stability calculation module, the stability judgment module, the transmission management module and the alarm module are respectively in data connection with the server;
the transmission information acquisition module acquires transmission information in the semiconductor wafer transmission process, transmits the transmission information to the data analysis module, and the data analysis module acquires data parameters in the transmission process based on transmission information analysis;
the acquired data parameters are transmitted to a stable calculation module, and the stable calculation module receives the data parameters to solve the stable data;
the obtained stable data are transmitted to a data analysis module, and the data analysis module classifies the obtained stable parameters to obtain a stable threshold value;
the stability threshold value is transmitted to a stability judging module, the stability judging module judges the stability based on the stability threshold value, and the judging result is transmitted to a server;
and the server controls the transmission management module to carry out transmission management or controls the alarm module to give an alarm to regulate the transmission device based on the judgment result.
2. The system of claim 1, wherein the transfer information comprises movement information, height variation information, and transfer speed information, and the movement information, the height variation information, and the transfer speed are transmitted to the data analysis module;
the data analysis module analyzes transmission information changes generated during horizontal linear transmission and inclined transmission of the semiconductor wafer based on the transmission state of the semiconductor wafer.
3. The system of claim 2, wherein the height value generated during the horizontal linear motion of the semiconductor wafer is obtained, and the data analysis module obtains the height value generated during the transportation of the semiconductor wafer based on the height variation information; the method comprises the following specific steps:
the method comprises the steps that infrared rays are arranged at the position of every 1mm at one end of the top of a semiconductor wafer in the conveying process, an inductor is arranged at the other end of the top of the semiconductor wafer, induction information is transmitted to a server corresponding to the inductor if the inductor does not induce the infrared rays in the conveying process, the server acquires a plurality of height values according to the height values of the inductor in the conveying process of the semiconductor wafer, and the height values are n, wherein the height values are H1, H2, H3, 8230, hn;
acquiring a speed value of the semiconductor wafer in the conveying process based on the conveying speed information, setting the maximum conveying speed to be SDmax, acquiring moving distance values of the semiconductor wafer at different speeds according to the moving information by changing the speed value, thereby obtaining a plurality of moving distance values, arranging the acquired moving distance values in a sequence from small to large, acquiring a minimum moving distance value, acquiring the maximum speed value corresponding to the minimum moving distance value, setting the maximum speed value as the minimum conveying speed, and setting the minimum speed to be SDmin; obtaining the semiconductor wafer acceleration value based on the minimum speed and the most initial acceleration value, wherein the semiconductor wafer acceleration value is SDmin; when the speed change is performed in the later stage, the acceleration value is made smaller than SDmin.
4. The system of claim 2, wherein the height value generated during the tilting of the semiconductor wafer is obtained, the height of the transfer point is defined as a first height, the height of the receiving point is defined as a second height, if the first height is smaller than the second height, it is determined that the semiconductor wafer is transported from bottom to top, and during the transportation, the moving distance values of the semiconductor wafer at different speeds are obtained by changing the speed values, so as to obtain a plurality of moving distance values, the obtained moving distance values are arranged in order from small to large, the minimum moving distance value is obtained, the maximum speed value corresponding to the minimum moving distance value is obtained, and the minimum moving distance value is set as the maximum speed of the transfer.
5. The system of claim 4, wherein if the first height is greater than the second height, the semiconductor wafer is determined to be transported from top to bottom, and during the transportation, the moving distance values of the semiconductor wafer at different speeds are obtained by changing the speed values, so as to obtain a plurality of moving distance values, the changing directions of the plurality of distance values are obtained, the obtained moving distance values are arranged according to the obtaining sequence, the change of the moving distance values is observed, if the changing direction is the same as the transporting direction, the initial speed value is determined to be smaller, if the changing direction is opposite to the transporting direction, the initial speed value is determined to be larger, the moving distance values are analyzed based on the change characteristics of the moving distance values, the horizontal coordinate is used as the speed value, the vertical coordinate is used as the moving distance value to be a rectangular plane coordinate system, the corresponding moving distance values are represented in the rectangular plane coordinate system, a graph of the moving distance values is formed by smooth curve connection, the speed value corresponding to the moving distance value at the lowest point is selected as the initial speed value, and the initial speed value is the minimum speed value.
6. The system of claim 2, wherein during the tilt drive of the semiconductor wafer, a straight line perpendicular to the inclined plane is formed, a mounting surface parallel to the straight line is disposed on one side of the straight line, the straight line is translated to the mounting surface, an intersection point of the bottom of the straight line and the mounting surface is a minimum distance of the inclined plane, the thickness of the semiconductor wafer is obtained, the intersection point is measured as a minimum point, infrared rays are disposed at intervals of 1mm at the intersection point and a top end of the intersection point, a sensor is disposed at the other end of the intersection point, and if the sensor does not sense the infrared rays during the transport process, the sensor transmits sensing information to the server, and the server obtains height values according to the height values generated during the transport process of the semiconductor wafer by the sensor, and obtains a plurality of height values;
and acquiring a moving distance value and a height value generated when the speed between the minimum speed value and the maximum speed value is changed, defining the moving distance value and the height value as data parameters, and transmitting the data parameters to a stable calculation module.
7. The system of claim 5, wherein the stability calculation module receives data parameters, and obtains a distance traveled value and a height value from the data parameters;
the stable calculation module acquires a height value and a moving distance value generated during horizontal linear transmission of the semiconductor wafer; acquiring a horizontal stability reference value when the semiconductor wafer moves horizontally;
the stable calculation module acquires a height value and a moving distance value generated during the inclined transmission of the semiconductor wafer; acquiring a horizontal stable reference value when the semiconductor wafer moves horizontally;
when the semiconductor wafer is transported from top to bottom, deleting height values which are the same in the moving direction and the conveying direction of the moving distance value and correspondingly occur, acquiring the moving distance value with the changing direction opposite to the conveying direction, and acquiring a lower inclination stable reference value when the semiconductor wafer is inclined and moved;
and defining the acquired plurality of horizontal stable reference values, the plurality of upper inclined stable reference values and the plurality of lower inclined stable reference values as stable data, and transmitting the stable data to the data analysis module.
8. The system of claim 7, wherein the data analysis module receives a plurality of horizontal stability reference values for analysis and classification, the classification comprising:
the data analysis module arranges the acquired multiple horizontal stable reference values in a descending order;
acquiring a horizontal transmission distance, setting the transmission distance as n, and setting the ratio of the maximum offset distance and the transmission distance of the semiconductor wafer during horizontal transmission as 1/n + k; the maximum offset distance when moving is n/n + k; acquiring the thickness of the semiconductor wafer, and setting the thickness of the semiconductor wafer to be JYhd; the maximum height distance of the semiconductor wafer during the transfer is 1/JYhd; obtaining a critical level reference value based on the maximum offset distance being n/n + k and the maximum height distance being 1/JYhd;
according to the plurality of horizontal stability reference values and the critical horizontal reference value, dividing the numerical value of which the horizontal reference value is smaller than the critical horizontal reference value into a horizontal first stability threshold value and a horizontal second stability threshold value in sequence according to the arrangement sequence, and dividing the numerical value of which the horizontal reference value is larger than the critical horizontal reference value into a horizontal third stability threshold value;
the data analysis module receives a plurality of inclined stable reference values for analysis and classification, and the specific classification is as follows:
acquiring the maximum speed YQXSDmax of transmission, acquiring the altitude value at the speed based on the maximum speed of transmission, and setting the acquired altitude value as: qxHxsmax; acquiring a critical upper-inclination reference value based on YQXSDmax and qxHxsmax;
dividing the numerical value of which the inclined reference value is smaller than the critical inclined reference value into an inclined first stable threshold value and an inclined second stable threshold value in sequence according to the arrangement sequence, and dividing the numerical value of which the inclined reference value is larger than the critical inclined reference value into an inclined third stable threshold value;
the data analysis module receives a plurality of declination stable reference values for analysis and classification, and the specific classification is as follows:
the data analysis module arranges the obtained plurality of lower inclination stable reference values in a sequence from small to large;
acquiring a transmitted minimum speed EQXSDm, acquiring a height value at the speed based on the transmitted minimum speed, and setting the acquired height value as follows: qxHsxmin; acquiring a minimum down-tilt reference value based on the EQXSDmin and the qxHsxmin;
sequentially dividing a plurality of lower-inclination stable reference values which are greater than the minimum lower-inclination reference value into a lower-inclination first stable threshold value, a lower-inclination second stable threshold value and a lower-inclination third stable threshold value according to the arrangement sequence;
and defining a horizontal first stable threshold, a horizontal second stable threshold, a horizontal third stable threshold, an upward inclined first stable threshold, an upward inclined second stable threshold, an upward inclined third stable threshold, a downward inclined first stable threshold, a downward inclined second stable threshold and a downward inclined third stable threshold which are obtained by analysis as stable thresholds, and conveying the stable thresholds to a stable judgment module.
9. The system of claim 8, wherein the stability determination module receives a stability threshold for determining the stability, as follows:
if the value obtained in the transmission process of the semiconductor wafer is between the horizontal first stable threshold value, the upward-inclined first stable threshold value or the downward-inclined first stable threshold value, judging that the transmission of the semiconductor wafer is stable;
if the value obtained in the transmission process of the semiconductor wafer is between the horizontal second stable threshold value, the upward-inclined second stable threshold value or the downward-inclined second stable threshold value, judging that the semiconductor wafer is transmitted with sliding deviation, and performing normal transmission;
and if the numerical value obtained in the transmission process of the semiconductor wafer is between the horizontal third stable threshold, the upward-inclined third stable threshold or the downward-inclined third stable threshold, judging that the semiconductor wafer is dangerous to transmit, and transmitting the judgment result to the server, wherein the judgment result cannot be normally transmitted.
10. The system as claimed in claim 9, wherein the server receives the determination result to determine that the semiconductor wafer is stably transferred, and does not adjust the transfer speed of the transfer device, and when the server receives the determination result and has a slip deviation, and can perform normal transfer, the server controls the transfer management module to perform transmission management, so as to limit the transmission speed during the transfer process and prevent the transfer speed from increasing; and the server receives the judgment result and transmits the danger, and controls the alarm module to send an alarm to adjust the transmission speed of the transmission device when normal transmission cannot be carried out.
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