CN115798779A - Organic composition for conductor paste and preparation method thereof - Google Patents
Organic composition for conductor paste and preparation method thereof Download PDFInfo
- Publication number
- CN115798779A CN115798779A CN202211492419.4A CN202211492419A CN115798779A CN 115798779 A CN115798779 A CN 115798779A CN 202211492419 A CN202211492419 A CN 202211492419A CN 115798779 A CN115798779 A CN 115798779A
- Authority
- CN
- China
- Prior art keywords
- resin
- organic composition
- mixed solvent
- conductor paste
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 76
- 239000004020 conductor Substances 0.000 title claims abstract description 47
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 100
- 239000011347 resin Substances 0.000 claims abstract description 100
- 230000032683 aging Effects 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000001856 Ethyl cellulose Substances 0.000 claims abstract description 12
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229920001249 ethyl cellulose Polymers 0.000 claims abstract description 12
- 235000019325 ethyl cellulose Nutrition 0.000 claims abstract description 12
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 10
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 9
- 229920000120 polyethyl acrylate Polymers 0.000 claims abstract description 9
- -1 pentaerythritol ester Chemical class 0.000 claims abstract description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims abstract description 7
- 239000004926 polymethyl methacrylate Substances 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims abstract description 4
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims abstract description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 4
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims abstract description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000005011 phenolic resin Substances 0.000 claims abstract description 4
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 4
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 4
- 239000004417 polycarbonate Substances 0.000 claims abstract description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 4
- AZIQALWHRUQPHV-UHFFFAOYSA-N prop-2-eneperoxoic acid Chemical compound OOC(=O)C=C AZIQALWHRUQPHV-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000012046 mixed solvent Substances 0.000 claims description 36
- 239000012752 auxiliary agent Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- 239000004359 castor oil Substances 0.000 claims description 6
- 235000019438 castor oil Nutrition 0.000 claims description 6
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 claims description 6
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 5
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 229940116411 terpineol Drugs 0.000 claims description 5
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000000787 lecithin Substances 0.000 claims description 4
- 235000010445 lecithin Nutrition 0.000 claims description 4
- 229940067606 lecithin Drugs 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229940057847 polyethylene glycol 600 Drugs 0.000 claims description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 3
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- PRXRUNOAOLTIEF-ADSICKODSA-N Sorbitan trioleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC[C@@H](OC(=O)CCCCCCC\C=C/CCCCCCCC)[C@H]1OC[C@H](O)[C@H]1OC(=O)CCCCCCC\C=C/CCCCCCCC PRXRUNOAOLTIEF-ADSICKODSA-N 0.000 claims description 3
- 241000779819 Syncarpia glomulifera Species 0.000 claims description 3
- 125000003158 alcohol group Chemical group 0.000 claims description 3
- 229960000541 cetyl alcohol Drugs 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002285 corn oil Substances 0.000 claims description 3
- 235000005687 corn oil Nutrition 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000003350 kerosene Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 239000001739 pinus spp. Substances 0.000 claims description 3
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 229940036248 turpentine Drugs 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 11
- 238000004090 dissolution Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000012776 electronic material Substances 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 6
- 238000009472 formulation Methods 0.000 description 5
- 239000000314 lubricant Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000013008 thixotropic agent Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000006184 cosolvent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical group N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229940093635 tributyl phosphate Drugs 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical group O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 102220043159 rs587780996 Human genes 0.000 description 1
Images
Landscapes
- Conductive Materials (AREA)
Abstract
The invention relates to the technical field of analysis electronic materials, in particular to an organic composition for conductor paste and a preparation method thereof. The first resin of the composition is one of ethyl cellulose, hydroxyethyl cellulose, phenolic resin, polyvinyl alcohol and polyvinyl butyral; the second resin is one of phenolic hydroxyl acrylate, polymethyl methacrylate, polyethyl acrylate and polycarbonate; the third resin is hydrogenated rosin pentaerythritol ester. The organic composition has good dissolution characteristic, elasticity and structural strength, and also has proper viscosity; the preparation method can eliminate the non-uniformity of acting force among resin systems in the physical mixing process by aging, and is beneficial to the stable exertion of the functions of all components; the conductor paste prepared by the organic composition has good printing property.
Description
Technical Field
The invention relates to the technical field of analysis electronic materials, in particular to an organic composition for conductor paste and a preparation method thereof.
Background
With the rapid development of the electronic industry, various electronic components have a trend of small volume and high performance. In the application field of ceramic electronic components, higher functionality while more compact volume is required, and therefore thinner and thinner multilayer ceramic devices are being designed. In order to realize the electrical functions of multilayer ceramic board devices, circuit layout is often performed on green ceramic sheets by using a screen printing method, so as to realize the circuit conduction function inside components. For example, in high/low temperature co-fired ceramic processes, printed conductor circuits and metal/ceramic co-firing are the most critical processes.
In the screen printing process of the conductor paste, the key factor influencing the circuit quality is the printability of the conductor paste, and the conductor paste is required to have better fluidity, film-forming property, thixotropy and screening capability, and the capability is almost realized by the organic composition in the conductor paste. This portion of the organic composition, otherwise known as a record, includes solvents, tackifiers, thixotropic agents, flow control agents, lubricants, leveling agents, and the like. The mixture of the organic matters is mixed with metal conductor powder, and the conductor slurry used for screen printing can be obtained through means of three-roll dispersion, high-speed homogenate and the like.
At present, the preparation method of organic matters in the conductor paste in the related art usually uses an organic system consisting of ethyl cellulose and terpineol. The conductor pastes prepared from such organic compositions obtained with a single functional phase generally suffer from the disadvantages of difficult viscosity adjustment, and incompatible flowability and thixotropy, limiting the resolution and reliability of the conductor lines after screen printing.
Disclosure of Invention
The invention aims to provide an organic composition for conductor paste and a preparation method thereof.
The technical scheme for solving the technical problems is as follows:
the invention provides an organic composition for conductor paste, which comprises a first resin, a second resin, a third resin and a mixed solvent; wherein the first resin is one of ethyl cellulose, hydroxyethyl cellulose, phenolic resin, polyvinyl alcohol and polyvinyl butyral; the second resin is one of phenolic hydroxyl acrylate, polymethyl methacrylate, polyethyl acrylate and polycarbonate; the third resin is hydrogenated rosin pentaerythritol ester.
The invention also comprises the following further technical scheme:
further, the first resin is ethyl cellulose or polyvinyl butyral, and the second resin is polymethyl methacrylate or polyethylacrylate;
3-8 parts of the first resin, 2-4 parts of the second resin and 1-10 parts of the third resin.
Further, the mixed solvent includes a first mixed solvent and a second mixed solvent; the first mixed solvent is one of terpineol, turpentine and kerosene, and the second mixed solvent is one of diethylene glycol butyl ether, diethylene glycol butyl ether acetate and ethylene glycol ethyl ether acetate;
the mass portion of the first mixed solvent is 15-40 parts, and the mass portion of the second mixed solvent is 10-20 parts.
The coating further comprises an auxiliary agent, wherein the auxiliary agent is 5-20 parts by mass.
Further, the auxiliary agent is 2,2,4-1,3-pentanediol monoisooctanoate, 2,2,4-1,3-pentanediol diisooctanoate, castor oil, hydrogenated castor oil, isobutyric acid, polyamide wax powder, polyethylene glycol 600, and the additive contains C 5 -C 20 One or more of acrylate with alcohol structure, lecithin, corn oil, acetone, hexadecanol, tributylphosphate, and span 85.
The invention also provides a preparation method of the organic composition, which comprises the following steps:
s1, fully mixing the first resin, the second resin and the third resin, and mixing the mixture with the mixed solvent to obtain a mixture;
s2, heating the mixture obtained in the step S1 to a first temperature and stirring until the first resin, the second resin and the third resin are completely dissolved;
and S3, cooling the mixture obtained in the step S2 to a second temperature, and then aging to obtain the organic composition.
Further, in the step S2, the first temperature is less than or equal to a glass transition temperature of the first resin.
Further, in the step S3, the second temperature is 30-50 ℃.
Further, in said step S3, the aging time is 24-48 h.
The invention also provides a conductor paste, which comprises metal conductor powder and the organic composition; the metal conductor powder is one or more of gold, silver, copper, tungsten and molybdenum.
The beneficial effects of the invention are as follows:
(1) The organic composition for the conductor paste has good dissolution characteristics, good elasticity and structural strength by using the first resin and the second resin and utilizing different properties of the first resin and the second resin, and the third resin can adjust the integral viscosity of the organic composition;
(2) According to the organic composition for the conductor paste, the first mixed solvent has certain viscosity, the overall viscosity of the organic composition can be adjusted, and the viscosity adjustment is facilitated;
(3) According to the organic composition for the conductor paste, the first mixed solvent and the second mixed solvent are used, gradient volatilization can be realized in the ceramic sintering and glue removing stage, and cracking, deformation and surface damage of lines of the conductor paste are avoided;
(4) According to the preparation method of the organic composition for the conductor paste, the resin components can be completely dissolved by heating, the non-uniformity of acting force among resin systems in the physical mixing process can be eliminated by aging, and the stable exertion of the functions of all components is facilitated;
(5) The conductor paste disclosed by the invention has good printability, so that conductor lines after screen printing have good resolution and reliability.
Drawings
Fig. 1 is a circuit pattern printed by the conductive paste of each example in the organic composition for a conductive paste of the present invention.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
The organic composition for conductor paste of the present invention comprises a first resin, a second resin, a third resin and a mixed solvent; wherein the first resin is one of ethyl cellulose, hydroxyethyl cellulose, phenolic resin, polyvinyl alcohol and polyvinyl butyral; the second resin is one of phenolic hydroxyl acrylate, polymethyl methacrylate, polyethyl acrylate and polycarbonate; the third resin is hydrogenated rosin pentaerythritol ester.
The organic composition of the invention has good printing performance. Specifically, the first resin is a main tackifier, and can realize the regulation and control of the viscosity of the organic composition. The second resin functions to make spatial vacancy intersections with the network formed by the first resin, to impart good elasticity and structural strength to the organic composition, and in the conductive paste in which the organic composition is mixed with the metal powder, the second resin can increase the elastic modulus of the organic composition in the conductive paste, thereby facilitating the high-resolution printing of the conductive paste. The third resin can be inserted into the space network of the first resin to regulate and control the molecular chain motion of the first resin, so that the integral viscosity of the organic composition can be regulated.
Preferably, the first resin is ethyl cellulose or polyvinyl butyral; further preferably, the weight average molecular weight of the ethylcellulose or polyvinyl butyral does not exceed 15 ten thousand.
Preferably, the second resin is polymethyl methacrylate or polyethyl acrylate; further preferably, the second resin is polyethylacrylate having a molecular weight of 2000 to 20000.
Preferably, the mixed solvent includes a first mixed solvent and a second mixed solvent; wherein the first mixed solvent is one of terpineol, turpentine and kerosene, and the second mixed solvent is one of diethylene glycol butyl ether, diethylene glycol butyl ether acetate and ethylene glycol ethyl ether acetate.
The first mixed solvent has certain viscosity, can adjust the overall viscosity of the organic composition, and is favorable for viscosity regulation. The second mixed solvent is a good solvent of the resin system.
The invention uses two mixed solvents, can volatilize in a gradient manner in the ceramic sintering glue discharging stage, and avoids cracking, deformation and surface damage of conductor slurry lines.
Preferably, in order to achieve better printing performance of the conductor paste, the organic composition of the present invention further comprises an auxiliary agent; the auxiliary agent comprises a thixotropic agent, a film-forming agent flow control agent, a lubricating agent, a leveling agent, a cosolvent, a surfactant and the like. Specifically, specific kinds of various auxiliaries are as follows:
the thixotropic agent is one of hydrogenated castor oil or polyamide wax powder; the film forming agent is one of 2,4-1, 3-pentanediol monoisooctanoate and 2,4-1, 3-pentanediol diisocaprylate; the flow control agent is cetyl alcohol; the lubricant is one of castor oil and polyethylene glycol, preferably polyethylene glycol 600; the leveling agent comprises C 5 -C 20 The acrylic acid esters of (1) alcohol structure; the cosolvent is one of acetone or butanone; the surfactant is one of tributyl phosphate, span 85, corn oil, lecithin and isobutyric acid.
Preferably, the mass portions of the components are that the first mixed solvent is 15-40 parts, the second mixed solvent is 10-20 parts, the first resin is 3-8 parts, the second resin is 2-4 parts, the third resin is 1-10 parts, and the auxiliary agent is 5-20 parts.
Preferably, in the organic composition, the first mixed solvent is terpineol 40 parts by weight, the second mixed solvent is diethylene glycol monobutyl ether 20 parts by weight, the first resin is ethyl cellulose 6 parts by weight, the second resin is polyethylacrylate 2 parts by weight, the third resin is hydrogenated rosin pentaerythritol ester 8 parts by weight, the leveling agent is cetyl alcohol 4 parts by weight, the cosolvent is butanone 2 parts by weight, the lubricant is polyethylene glycol 600 3 parts by weight, the surfactant is lecithin 3 parts by weight, the thixotropic agent is polyamide wax 2 parts by weight; the film forming agent is 2,4-1, 3-pentanediol monoisooctanoate, and the mass portion is 10 portions.
The preparation method of the organic composition comprises the following steps:
s1, fully mixing the first resin, the second resin and the third resin, and mixing with a mixed solvent to obtain a mixture.
Preferably, in step S1, the first resin, the second resin and the third resin are added into a mixer for mixing for 30min.
S2, heating the mixture obtained in the step S1 to a first temperature and stirring until the first resin, the second resin and the third resin are fully dissolved; wherein the first temperature is less than or equal to the glass transition temperature of the first resin.
During the mixing process, sufficient dissolution of each resin is required by heating, but too high a temperature may cause accelerated aging of the resin, affecting the properties of the final conductor paste. Therefore, limiting the first temperature of heating to less than or equal to the glass transition temperature of the first resin ensures both sufficient dissolution of the resin and prevention of its degradation.
Preferably, in step S2, the resins and the mixed solvent are heated and stirred in a stirring kettle, and stirring is continued for 2 hours.
And S3, cooling the mixture obtained in the step S2 to a second temperature, and then aging to obtain the organic composition.
In the above steps, the purpose of aging is to eliminate the non-uniformity of the acting force between the resin systems in the physical mixing process, which is helpful for the stable exertion of the functions of each component.
Preferably, the aging time is 24-48 h; an excessively long aging time will lead to inevitable volatilization of the solvent, deviating from the predetermined viscosity of the embodiment.
Preferably, the second temperature is 30-50 ℃; more preferably, the second temperature is 50 ℃.
Preferably, in step S3, after the temperature is reduced to the second temperature and before aging, an auxiliary agent may be added to the mixture. After the resin is dissolved, the temperature is reduced, and then the auxiliary agent is added, so that the auxiliary agent can be prevented from losing functions at high temperature.
The conductor paste of the present invention comprises a metal conductor powder and the organic composition as described above; the metal conductor powder is one or more of gold, silver, copper, tungsten and molybdenum.
The effects of the present invention will be specifically described below with reference to specific examples.
The organic composition of example 1-8 was prepared using the formulation of the organic composition and the preparation method of the present invention, respectively, while the organic composition of comparative example 1-4 was prepared using the preparation method of the present invention, the formulation of the comparative example being different from the formulation of the present invention. Comparative example 5 the preparation of the organic composition was effected in the following order: the solvent is uniformly mixed with other additives except the first resin, and the first resin is finally added.
The specific formulations of the examples and comparative examples are shown in table 1:
TABLE 1 formulation of organic compositions of example 1-8 and comparative example 1-5
Conductive pastes were prepared using the organic compositions of the above-described examples and comparative examples, respectively. Wherein the metal powder of the conductive paste is silver powder. Mixing silver powder (average particle diameter D50=1.4 μm) and the organic composition in a mass ratio of 80 to 20, carrying out three-roll grinding and dispersion for multiple times, and aging for 24h to obtain corresponding silver paste.
It should be noted that the aging step is a second aging, that is, the aging step in the preparation of the organic composition according to the present invention is a first aging, and the second aging is performed again in the preparation of the conductive paste using the organic composition.
Viscosity measurements were performed on each silver paste using an antopa MCR302e rheometer, recording a shear rate of 0.1s -1 And 10s -1 The viscosity value of the slurry; then, circuit printing was performed on green ceramic tape of P-BS1001 type by means of screen printing, and the line resolution and surface quality were analyzed.
Specific test results of the conductive pastes prepared using the respective examples and comparative examples are shown in table 2.
Table 2 specific test results of conductive pastes prepared in examples and comparative examples
For conductive paste, at 0.1s -1 And 10s -1 Should have a higher and lower viscosity, respectively, which gives it better sink resistance, screening and printability.
As can be seen from Table 2, in the specific implementation process, the conductive paste with excellent performance can be obtained by using the resin system of the invention to compound the organic composition. In the embodiments 1 to 3, organic carriers with different viscosities are obtained by adjusting the contents of different ethyl cellulose and hydrogenated rosin pentaerythritol ester, and the functions of the first resin, the second resin and the third resin are compounded to finally obtain conductor slurry with excellent line resolution and line quality; by replacing ethyl cellulose with polyvinyl butyral, the better printing properties of the conductor paste were maintained as in examples 4-5. In addition, conductor pastes with better printing performance in different viscosity ranges can also be obtained by properly adjusting the ratio of the solvent components in the system, as in examples 6-8.
In comparative examples 1-4, however, acrylic resin and hydrogenated rosin pentaerythritol ester were not used to functionally compound with tackifying resin, making it less printable than the single component.
In addition, comparative example 5 realizes the preparation of the organic composition in the following order: the solvent is uniformly mixed with other additives except the first resin, and finally the first resin is added. The implementation process finds that the first resin can not be dissolved, which is because the first resin can not fully contact with solvent molecules due to the volume effect generated by the auxiliary agent dissolved in the system firstly after the powder resin is added, so that the organic composition is not uniform, the viscosity, thixotropy and fluidity are influenced, and the printing quality of the conductor paste is poor.
In addition, the conductive paste prepared by the organic composition of the invention is respectively printed with the same circuit pattern test effect, the printed circuit pattern is shown as the attached figure 1, and the circuit pattern is a conducting circuit pattern of a certain electric signal module. According to the embodiment and the comparative example, the conductor paste with proper viscosity, thixotropy, fluidity and other functions can be prepared according to the organic composition disclosed by the invention, so that the conductor paste with better printing line resolution and surface quality can be obtained. Solves the problems of viscosity regulation and printing defects when using resin components with single function. Thus, according to the present invention, an organic composition of a conductive paste advantageous for achieving better printing performance can be prepared.
In the description of the present invention, it should be noted that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to imply that the number of the indicated technical features is significant. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. An organic composition for a conductor paste, characterized by comprising a first resin, a second resin, a third resin and a mixed solvent; wherein the first resin is one of ethyl cellulose, hydroxyethyl cellulose, phenolic resin, polyvinyl alcohol and polyvinyl butyral; the second resin is one of phenolic hydroxyl acrylate, polymethyl methacrylate, polyethyl acrylate and polycarbonate; the third resin is hydrogenated rosin pentaerythritol ester.
2. The organic composition for conductor paste according to claim 1, wherein the first resin is ethyl cellulose or polyvinyl butyral, and the second resin is polymethyl methacrylate or polyethylacrylate;
the mass portion of the first resin is 3-8, the mass portion of the second resin is 2-4, and the mass portion of the third resin is 1-10.
3. The organic composition for conductor paste according to claim 2, wherein the mixed solvent comprises a first mixed solvent and a second mixed solvent; the first mixed solvent is one of terpineol, turpentine and kerosene, and the second mixed solvent is one of diethylene glycol butyl ether, diethylene glycol butyl ether acetate and ethylene glycol ethyl ether acetate;
the mass portion of the first mixed solvent is 15-40 parts, and the mass portion of the second mixed solvent is 10-20 parts.
4. The organic composition for conductor paste according to claim 3, further comprising an auxiliary agent, wherein the auxiliary agent is 5 to 20 parts by mass.
5. The organic composition for conductive paste according to claim 4, wherein the auxiliary agent is 2,2,4-1,3-pentanediol monoisooctanoate, 2,2,4-1,3-pentanediol diisooctanoate, castor oil, hydrogenated castor oil, isobutyric acid, polyamide wax powder, polyethylene glycol 600, C-containing 5 -C 20 One or more of acrylate with alcohol structure, lecithin, corn oil, acetone, cetyl alcohol, tributyl phosphate and span 85.
6. A process for the preparation of an organic composition according to any of claims 1-5, comprising the steps of:
s1, mixing the first resin, the second resin and the third resin, and adding the mixed solvent to obtain a mixture;
s2, heating the mixture obtained in the step S1 to a first temperature, and stirring until the first resin, the second resin and the third resin are completely dissolved;
and S3, cooling the mixture obtained in the step S2 to a second temperature, and then aging to obtain the organic composition.
7. The method of claim 6, wherein the first temperature is less than or equal to the glass transition temperature of the first resin in step S2.
8. The method according to claim 6, wherein said second temperature is 30-50 ℃ in said step S3.
9. The method for preparing an organic composition as defined in claim 6, wherein the aging time in step S3 is 24-48 h.
10. A conductor paste comprising a metal conductor powder and the organic composition as claimed in any one of claims 1-5; the metal conductor powder is one or more of gold, silver, copper, tungsten and molybdenum.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211492419.4A CN115798779A (en) | 2022-11-25 | 2022-11-25 | Organic composition for conductor paste and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211492419.4A CN115798779A (en) | 2022-11-25 | 2022-11-25 | Organic composition for conductor paste and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115798779A true CN115798779A (en) | 2023-03-14 |
Family
ID=85441593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211492419.4A Pending CN115798779A (en) | 2022-11-25 | 2022-11-25 | Organic composition for conductor paste and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN115798779A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120059126A (en) * | 2010-11-30 | 2012-06-08 | 삼성전기주식회사 | Inner electrode paste composition for gravure printing, multilayer ceramic capacitor using the same and a manufacturing method thereof |
JP2014002992A (en) * | 2012-06-14 | 2014-01-09 | Pelnox Ltd | Electroconductive paste composition for laser etching |
CN110223799A (en) * | 2019-06-17 | 2019-09-10 | 常州宝邦新能源材料有限公司 | A kind of electrocondution slurry and with its manufactured semiconductor device |
US20220013248A1 (en) * | 2018-11-21 | 2022-01-13 | Heraeus Nexensos Gmbh | Improved noble-metal pastes for screen-printed electrode structures |
CN113990552A (en) * | 2021-10-20 | 2022-01-28 | 南方电网科学研究院有限责任公司 | Organic carrier for low-temperature co-fired ceramic electrode silver paste and preparation method and application thereof |
CN114430851A (en) * | 2019-10-25 | 2022-05-03 | 太阳帕斯特有限责任公司 | Conductive paste for N-type solar cell, method for manufacturing N-type solar cell, and N-type solar cell |
-
2022
- 2022-11-25 CN CN202211492419.4A patent/CN115798779A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120059126A (en) * | 2010-11-30 | 2012-06-08 | 삼성전기주식회사 | Inner electrode paste composition for gravure printing, multilayer ceramic capacitor using the same and a manufacturing method thereof |
JP2014002992A (en) * | 2012-06-14 | 2014-01-09 | Pelnox Ltd | Electroconductive paste composition for laser etching |
US20220013248A1 (en) * | 2018-11-21 | 2022-01-13 | Heraeus Nexensos Gmbh | Improved noble-metal pastes for screen-printed electrode structures |
CN110223799A (en) * | 2019-06-17 | 2019-09-10 | 常州宝邦新能源材料有限公司 | A kind of electrocondution slurry and with its manufactured semiconductor device |
CN114430851A (en) * | 2019-10-25 | 2022-05-03 | 太阳帕斯特有限责任公司 | Conductive paste for N-type solar cell, method for manufacturing N-type solar cell, and N-type solar cell |
CN113990552A (en) * | 2021-10-20 | 2022-01-28 | 南方电网科学研究院有限责任公司 | Organic carrier for low-temperature co-fired ceramic electrode silver paste and preparation method and application thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR910005524B1 (en) | Copper conductor compositions | |
KR960001353B1 (en) | Method for making multilayer electronic circuits | |
US7037448B2 (en) | Method of producing a conductor paste | |
JP4355010B2 (en) | Conductive paste for laminated electronic components | |
US5242623A (en) | Screen-printable thick film paste composition | |
CN114334216B (en) | Thick film conductor paste | |
JPH0321659A (en) | Electroconductive copper composition | |
DE102017008633B4 (en) | Conductive paste for bonding and method using them | |
CN113903497B (en) | Isolation medium slurry and preparation method thereof | |
CN115798779A (en) | Organic composition for conductor paste and preparation method thereof | |
US5618470A (en) | Electrically conductive paste | |
US5431718A (en) | High adhesion, solderable, metallization materials | |
US5622547A (en) | Vehicle system for thick film inks | |
CN115083657B (en) | Low-temperature curing conductive silver paste and preparation method and application thereof | |
JP2018049940A (en) | Conductive paste for joining | |
US8562808B2 (en) | Polymer thick film silver electrode composition for use as a plating link | |
US4070200A (en) | Compositions containing diethylene glycol ether | |
EP0291064B1 (en) | Conductive paste composition | |
CN115954134B (en) | Resistance paste and preparation method thereof | |
JP2006190491A (en) | Conductive paste for ceramic electronic components and ceramic electronic components | |
CN115424761A (en) | Tungsten slurry for HTCC substrate and preparation method thereof | |
JP3343368B2 (en) | Conductive metal paste | |
JP4189792B2 (en) | Conductive composition | |
CN116013684A (en) | MLCC multi-solvent system inner electrode slurry and method for preparing capacitor by using same | |
JP2009283362A (en) | Conductive composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |