CN115795630A - Parameterized editing and managing method and device for hot bridge nodes - Google Patents
Parameterized editing and managing method and device for hot bridge nodes Download PDFInfo
- Publication number
- CN115795630A CN115795630A CN202310022578.6A CN202310022578A CN115795630A CN 115795630 A CN115795630 A CN 115795630A CN 202310022578 A CN202310022578 A CN 202310022578A CN 115795630 A CN115795630 A CN 115795630A
- Authority
- CN
- China
- Prior art keywords
- bridge node
- thermal bridge
- hot
- relative position
- editing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000003860 storage Methods 0.000 claims description 26
- 238000007726 management method Methods 0.000 claims description 21
- 238000004590 computer program Methods 0.000 claims description 15
- 238000012217 deletion Methods 0.000 claims description 5
- 230000037430 deletion Effects 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 25
- 238000012545 processing Methods 0.000 description 23
- 238000004891 communication Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000006870 function Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 230000005236 sound signal Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
Landscapes
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
The disclosure relates to a parameterized editing and managing method and device for hot bridge nodes. The method comprises the following steps: setting a base point position in a drawing area of a thermal bridge node; acquiring position information and size information of each part of a thermal bridge node; determining a relative position expression parameter according to the position information and the size information; and according to the relative position expression parameters and the corresponding thermal bridge node patterns, obtaining a thermal bridge node model. According to the method and the device, the modified thermal bridge node model can be obtained only by modifying the relative position expression parameters in the drawing and modifying process, the drawing and modifying convenience of the thermal bridge node model is greatly improved, the working complexity and the working load are reduced, and the repeated utilization among different projects is facilitated.
Description
Technical Field
The disclosure relates to the technical field of green building simulation, in particular to a parameterized editing and managing method and device for a thermal bridge node.
Background
The key for accurately calculating the heat bridge heat transfer of the building envelope structure is the design key for building energy-saving optimization, and the key for realizing the accurate calculation is to solve the temperature field of the building heat bridge node according to the heat bridge node graph. The thermal bridge node diagram needs to express a detailed construction method at the position of a corresponding node, and each material layer is drawn according to the thickness of the material and is subjected to grid division convenient for heat transfer calculation. In the drawing, the material layers are drawn according to the respective thicknesses, the adjustment and editing of the thickness of the material layers are more complicated, the thickness of one material layer is changed, other layers of material blocks connected with the material layer are moved in sequence, otherwise, overlapping or missing positions occur, furthermore, the difference of each thermal bridge part of the building engineering is large, and the outer wall and the roof, the outer wall and the common floor slab, the outer wall and the raised floor slab, the outer wall and the outer wall, the outer wall and the inner wall, the periphery of a door and window opening and the like need to be drawn respectively, so that the condition of huge workload is caused.
Therefore, the drawing of the hot bridge node map is a very complicated process, each material layer block needs to be adjacent to each other and cannot be overlapped, the drawing process needs to be careful enough and great effort is consumed, each project needs to draw a plurality of hot bridge node maps for calculation, and the drawn hot bridge node maps cannot be reused due to different structures and parameters among different projects.
Disclosure of Invention
The disclosure provides a parameterization editing and managing method and device for a hot bridge node.
According to an aspect of the present disclosure, a parameterized editing and management method for a hot bridge node is provided, including:
setting a base point position in a drawing area of a thermal bridge node;
acquiring position information and size information of each part of the thermal bridge node;
determining relative position expression parameters of each part of the thermal bridge node relative to the base point position according to the position information and the size information of each part of the thermal bridge node, wherein the relative position expression parameters represent the boundary position of each part under the condition that the base point position is taken as a reference;
and obtaining a thermal bridge node model according to the relative position expression parameters and the thermal bridge node patterns corresponding to the relative position expression parameters.
In some embodiments of the present disclosure, the method further comprises:
when receiving the editing information of the relative position expression parameters, determining updated relative position expression parameters according to the editing information;
adjusting the hot-bridge node pattern according to the updated relative position expression parameters to obtain an updated hot-bridge node pattern;
and obtaining an updated thermal bridge node model according to the updated thermal bridge node pattern and the updated relative position expression parameters.
In some embodiments of the present disclosure, the method further comprises:
and adding the hot bridge node model into a hot bridge node database for classified storage.
In some embodiments of the disclosure, the method further comprises:
and carrying out any one of deletion, editing and replacement on the plurality of hot bridge node models in the hot bridge node database.
In some embodiments of the present disclosure, the method further comprises:
selecting a target thermal bridge node model from the thermal bridge node database according to the type of the required thermal bridge node;
editing the relative position expression parameters of the target thermal bridge node model to obtain a thermal bridge node model to be inserted;
and inserting the hot bridge node model to be inserted into a building model.
In some embodiments of the present disclosure, the editing the relative position expression parameter of the target thermal bridge node model to obtain the to-be-inserted thermal bridge node model includes:
determining a relative position expression parameter of the target thermal bridge node model according to the received editing information of the relative position expression parameter of the target thermal bridge node model;
and updating the hot bridge node pattern of the target hot bridge node model according to the relative position expression parameters of the target hot bridge node model to obtain the hot bridge node model to be inserted.
In some embodiments of the present disclosure, the base point position is located in a lower left corner region of the drawing area.
According to another aspect of the present disclosure, there is provided a parameterized editing and managing apparatus for a hot bridge node, including:
the base point position module is used for setting a base point position in a drawing area of the thermal bridge node;
the information acquisition module is used for acquiring position information and size information of each part of the thermal bridge node;
a parameter module, configured to determine, according to the position information and the size information of each part of the thermal bridge node, a relative position expression parameter of each part of the thermal bridge node with respect to the base point position, where the relative position expression parameter represents a relative position of a boundary position of each part with respect to the base point position;
and the model obtaining module is used for obtaining a thermal bridge node model according to the relative position expression parameters and the corresponding thermal bridge node patterns.
In some embodiments of the disclosure, the apparatus further comprises: the modification module is used for determining the updated relative position expression parameters according to the editing information when the editing information of the relative position expression parameters is received; adjusting the hot-bridge node pattern according to the updated relative position expression parameters to obtain an updated hot-bridge node pattern; and obtaining an updated thermal bridge node model according to the updated thermal bridge node pattern and the updated relative position expression parameters.
In some embodiments of the disclosure, the apparatus further comprises: and the database module is used for adding the hot bridge node model into a hot bridge node database for classified storage.
In some embodiments of the disclosure, the apparatus further comprises: and the database processing module is used for carrying out any one of deletion, editing and replacement on the plurality of hot bridge node models in the hot bridge node database.
In some embodiments of the disclosure, the apparatus further comprises: the calling module is used for selecting a target hot bridge node model in the hot bridge node database according to the type of the required hot bridge node; editing the relative position expression parameters of the target thermal bridge node model to obtain a thermal bridge node model to be inserted; and inserting the hot bridge node model to be inserted into a building model.
In some embodiments of the disclosure, the calling module is further to: determining a relative position expression parameter of the target thermal bridge node model according to the received edit information of the relative position expression parameter of the target thermal bridge node model; and updating the hot bridge node pattern of the target hot bridge node model according to the relative position expression parameters of the target hot bridge node model to obtain the hot bridge node model to be inserted.
In some embodiments of the present disclosure, the base point position is located in a lower left corner region of the drawing area.
According to an aspect of the present disclosure, there is provided a parameterized editing and management device for a hot bridge node, including: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to invoke the memory-stored instructions to perform the above-described method.
According to an aspect of the present disclosure, there is provided a computer readable storage medium having stored thereon computer program instructions which, when executed by a processor, implement the above-described method.
According to the parameterized editing and management method of the thermal bridge node, each part of the thermal bridge node can be parameterized and drawn, relative position expression parameters of each part relative to the base point position are obtained, and then the thermal bridge node model is represented through the relative position expression parameters, so that in the drawing and modifying processes, the modified thermal bridge node model can be obtained only by modifying the relative position expression parameters. And a hot bridge node database can be established, when the hot bridge node model is used in different projects, the hot bridge node model can be searched in the hot bridge node database, and the hot bridge node model suitable for the new project can be obtained only by modifying the relative position expression parameters, so that the use convenience of the hot bridge node model is greatly improved, the work complexity and the work load are reduced, and the hot bridge node model can be conveniently recycled among different projects.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. Other features and aspects of the present disclosure will become more apparent from the following detailed description of exemplary embodiments with reference to the attached drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure,
FIG. 1 illustrates a flow diagram of a method for parameterized editing and management of hot bridge nodes in accordance with an embodiment of the present disclosure;
FIG. 2 illustrates a schematic diagram of a thermal bridge node diagram according to an embodiment of the present disclosure;
FIG. 3 shows a schematic diagram of a thermal bridge node model according to an embodiment of the present disclosure;
FIG. 4 illustrates a schematic diagram of a thermal bridge node database according to an embodiment of the present disclosure;
FIG. 5 illustrates a parameterized editing and management apparatus for a hot bridge node according to an embodiment of the present disclosure;
FIG. 6 illustrates a block diagram of a parameterized editing and management apparatus of a hot bridge node in accordance with an embodiment of the present disclosure;
fig. 7 shows a block diagram of an electronic device in accordance with an embodiment of the disclosure.
Detailed Description
Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
The term "and/or" herein is merely an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the term "at least one" herein means any one of a plurality or any combination of at least two of a plurality, for example, including at least one of a, B, and C, and may mean including any one or more elements selected from the group consisting of a, B, and C.
Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present disclosure. It will be understood by those skilled in the art that the present disclosure may be practiced without some of these specific details. In some instances, methods, means, elements and circuits that are well known to those skilled in the art have not been described in detail so as not to obscure the present disclosure.
Aiming at the problems that the drawing and modifying process of a thermal bridge node graph is complex and the thermal bridge node graph cannot be repeatedly utilized among different projects in the related technology, the disclosure provides a parameterized editing and managing method for thermal bridge nodes.
Fig. 1 is a flowchart illustrating a parameterized editing and management method of a hot bridge node according to an embodiment of the present disclosure, where the method includes, as shown in fig. 1:
s11, setting a base point position in a drawing area of a thermal bridge node;
s12, acquiring position information and size information of each part of the thermal bridge node;
step S13, determining relative position expression parameters of each part of the thermal bridge node relative to the base point position according to the position information and the size information of each part of the thermal bridge node, wherein the relative position expression parameters represent the relative positions of the boundary positions of each part relative to the base point position;
and S14, obtaining a thermal bridge node model according to the relative position expression parameters and the corresponding thermal bridge node patterns.
In some embodiments of the present disclosure, in step S11, a base point position may be set in the drawing area of the thermal bridge node. In an example, the base point position may be located in a lower left corner region of the drawing region, e.g., a coordinate point consisting of a leftmost position and a lowermost position of a thermal bridge node. Of course, the base point position may be located at other positions, such as the center of the drawing area, and the like, which is not limited by the present disclosure.
In some embodiments of the present disclosure, in step S12, position information and size information of various portions of the thermal bridge node may be acquired. In an example, in a thermal bridge node diagram, dimension information (e.g., length, height, thickness, etc.) of each portion (e.g., each member, or each material layer, etc.) may be labeled, and based on the dimensions and the adjacency relationship between each portion, position information of each portion may be determined.
In some embodiments of the present disclosure, in step S13, a conversion may be performed based on the position information and the size information obtained in the above steps, so as to convert into a relative position expression parameter with respect to the base point position, that is, a boundary position of each portion with the base point position as a reference.
FIG. 2 illustrates a schematic diagram of a thermal bridge node diagram according to an embodiment of the present disclosure. Taking the thermal bridge node in fig. 2 as an example, the lower left corner position thereof may be used as the base point position, and the length of the boundary of each portion in the horizontal direction may be a, B, C, D, E, and the length in the vertical direction may be a, B, C, D, based on the base point position.
In some embodiments of the present disclosure, in step S14, the thermal bridge node model may be generated by using the relative position expression parameters and the corresponding thermal bridge node graph thereof.
FIG. 3 illustrates a schematic diagram of a thermal bridge node model according to an embodiment of the disclosure, which may include a thermal bridge node graph, as shown in FIG. 3, along with various relative position expression parameters. Further, the material type of the thermal bridge node may also be included, and the disclosure does not limit the information included in the thermal bridge node model. Further, various relative position expression parameters may be displayed on the right side of the page to the thermal bridge node model, e.g., a =600, b =200, c =40, d =560, e =60; a =500, b =100, c =50, d =200 in mm, and each relative position expression parameter can be edited and updated.
In some embodiments of the present disclosure, the method further comprises: when receiving the editing information of the relative position expression parameters, determining updated relative position expression parameters according to the editing information; adjusting the hot-bridge node pattern according to the updated relative position expression parameters to obtain an updated hot-bridge node pattern; and obtaining an updated thermal bridge node model according to the updated thermal bridge node pattern and the updated relative position expression parameters.
In some embodiments of the present disclosure, the worker may input edit information at the display position of each relative position expression parameter on the right side of fig. 3, that is, re-input the numerical value of each relative position expression parameter.
In some embodiments of the present disclosure, the computer may obtain an updated relative position expression parameter based on the inputted edit information, i.e., the inputted new numerical value, for example, changing a to 700, or changing b to 120, etc., which is not limited by the present disclosure.
In some embodiments of the present disclosure, the computer may adjust the hot-bridge node pattern based on the updated relative position expression parameter, i.e., change the length of a to an updated value, change the length of b to an updated value, etc., and after the hot-bridge node pattern and the relative position expression parameter are updated, an updated hot-bridge node model may be obtained.
In some embodiments of the present disclosure, to facilitate reuse of the thermal bridge node model between different projects, a thermal bridge node database may be built. The method further comprises the following steps: and adding the hot bridge node model into a hot bridge node database for classified storage. That is, the above-mentioned hot-bridge node model may be saved into the hot-bridge node database for classified saving, that is, based on the type of the hot-bridge node model, the saving location in the hot-bridge node database is determined, so that the hot-bridge node model can be saved at the saving location.
Fig. 4 is a schematic diagram of a hot-bridge node database according to an embodiment of the present disclosure, and as shown in fig. 4, the above hot-bridge node model may be saved in an outer wall-roof folder in the hot-bridge node database, so that the hot-bridge node model may be called by other projects. In addition, different types of thermal bridge node models can be stored for many times in engineering practice, so that a thermal bridge node database is perfected.
In some embodiments of the present disclosure, the method further comprises: and carrying out any one of deletion, editing and replacement on the plurality of hot bridge node models in the hot bridge node database. In an example, each thermal bridge node model in the thermal bridge node database may be deleted, e.g., a thermal bridge node model of a certain type may be deleted if it is outdated or if it has a design defect and is no longer suitable for use in future building designs. In an example, a certain thermal bridge node model can be edited, for example, a thermal bridge node graph is edited, or relative position expression parameters of the thermal bridge nodes are edited, and the like. In an example, the hot bridge node model may be updated, e.g., a new hot bridge node model may be used to replace a certain hot bridge node model in the hot bridge node database. In an example, the hot-bridge node model may also be newly built in the hot-bridge node database, for example, an empty template may be newly built in a certain folder in the hot-bridge node database, a hot-bridge node graph is drawn, and relative position expression parameters are set, so as to obtain the hot-bridge node model. The present disclosure does not limit the type of processing.
In some embodiments of the present disclosure, when the hot-bridge node model in the hot-bridge node database is invoked in a project, the method further comprises: selecting a target thermal bridge node model from the thermal bridge node database according to the type of the required thermal bridge node; editing the relative position expression parameters of the target thermal bridge node model to obtain a thermal bridge node model to be inserted; and inserting the hot bridge node model to be inserted into a building model.
In some embodiments of the present disclosure, the target thermal-bridge node model may first be looked up in a thermal-bridge node database, e.g., the target thermal-bridge node model may be looked up according to the type of thermal-bridge node desired. In an example, if the type of the required hot bridge node is a hot bridge node at an outer wall-inner partition, then the target hot bridge node model may be looked up in the folder in the hot bridge node database.
In some embodiments of the present disclosure, after the target thermal bridge node model is selected, the relative position expression parameters may be set, that is, the relative position expression parameters are edited to input the required parameters, and the computer may obtain the thermal bridge node model to be inserted after receiving the set relative position expression parameters. The method comprises the following steps: determining a relative position expression parameter of the target thermal bridge node model according to the received editing information of the relative position expression parameter of the target thermal bridge node model; and updating the hot bridge node pattern of the target hot bridge node model according to the relative position expression parameters of the target hot bridge node model to obtain the hot bridge node model to be inserted.
In some embodiments of the present disclosure, the editing information, e.g., a new numerical value, received by the computer for the relative position expression parameter may be used as the relative position expression parameter of the target hot-bridge node model, and the hot-bridge node pattern may be automatically adjusted based on the relative position expression parameter, so that the size and position of each part of the adjusted hot-bridge node pattern match the relative position expression parameter, thereby updating the hot-bridge node model and obtaining the hot-bridge node model to be inserted.
In some embodiments of the present disclosure, the hot bridge node model to be inserted may be inserted into the building model, enabling fast modeling and drawing. When facing different building models, only need set up the parameter of heat bridge node model, can obtain the heat bridge node model that is applicable to different building models, need not to redraw heat bridge node model, reduce work load by a wide margin, promote the convenience of use. And after the parameters of the thermal bridge node model are set, the method can be used in the calculation processes of building energy-saving calculation, condensation checking calculation and the like.
According to the parameterized editing and management method of the thermal bridge node, each part of the thermal bridge node can be parameterized and drawn, relative position expression parameters of each part relative to the base point position are obtained, and then the thermal bridge node model is represented through the relative position expression parameters, so that in the drawing and modifying processes, the modified thermal bridge node model can be obtained only by modifying the relative position expression parameters. And a hot bridge node database can be established, when the hot bridge node model is used in different projects, the hot bridge node model can be searched in the hot bridge node database, and the hot bridge node model suitable for the new project can be obtained only by modifying the relative position expression parameters, so that the use convenience of the hot bridge node model is greatly improved, the work complexity and the work load are reduced, and the hot bridge node model can be conveniently recycled among different projects.
Fig. 5 shows a parameterized editing and management apparatus for a hot bridge node according to an embodiment of the present disclosure, including:
a base point position module 11, configured to set a base point position in a drawing area of a thermal bridge node;
an information obtaining module 12, configured to obtain position information and size information of each part of the thermal bridge node;
a parameter module 13, configured to determine, according to the position information and the size information of each part of the thermal bridge node, a relative position expression parameter of each part of the thermal bridge node with respect to the base point position, where the relative position expression parameter represents a relative position of a boundary position of each part with respect to the base point position;
and a model obtaining module 14, configured to obtain a thermal bridge node model according to the relative position expression parameter and the thermal bridge node graph corresponding to the relative position expression parameter.
In some embodiments of the present disclosure, the apparatus further comprises: the modification module is used for determining updated relative position expression parameters according to the editing information when the editing information of the relative position expression parameters is received; adjusting the hot-bridge node pattern according to the updated relative position expression parameters to obtain an updated hot-bridge node pattern; and obtaining an updated thermal bridge node model according to the updated thermal bridge node pattern and the updated relative position expression parameters.
In some embodiments of the present disclosure, the apparatus further comprises: and the database module is used for adding the hot bridge node model into a hot bridge node database for classified storage.
In some embodiments of the present disclosure, the apparatus further comprises: and the database processing module is used for carrying out any one of deletion, editing and replacement on the plurality of hot bridge node models in the hot bridge node database.
In some embodiments of the present disclosure, the apparatus further comprises: the calling module is used for selecting a target hot bridge node model in the hot bridge node database according to the type of the required hot bridge node; editing the relative position expression parameters of the target thermal bridge node model to obtain a thermal bridge node model to be inserted; and inserting the hot bridge node model to be inserted into a building model.
In some embodiments of the disclosure, the calling module is further to: determining a relative position expression parameter of the target thermal bridge node model according to the received edit information of the relative position expression parameter of the target thermal bridge node model; and updating the hot bridge node pattern of the target hot bridge node model according to the relative position expression parameter of the target hot bridge node model to obtain the hot bridge node model to be inserted.
In some embodiments of the present disclosure, the base point position is located in a lower left corner region of the drawing area.
In some embodiments, functions of or modules included in the apparatus provided in the embodiments of the present disclosure may be used to execute the method described in the above method embodiments, and specific implementation thereof may refer to the description of the above method embodiments, and for brevity, will not be described again here.
Embodiments of the present disclosure also provide a computer-readable storage medium having stored thereon computer program instructions, which when executed by a processor, implement the above-mentioned method. The computer readable storage medium may be a non-volatile computer readable storage medium.
An embodiment of the present disclosure further provides an electronic device, including: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to invoke the memory-stored instructions to perform the above-described method.
Embodiments of the present disclosure also provide a computer program product, which includes computer readable code, and when the computer readable code runs on a device, a processor in the device executes instructions for implementing the cloud application management method provided in any of the above embodiments.
The embodiments of the present disclosure also provide another computer program product for storing computer readable instructions, where the instructions, when executed, cause a computer to perform the operations of the cloud application management method provided in any of the embodiments.
The electronic device may be provided as a terminal, server, or other form of device.
Fig. 6 illustrates a block diagram of a parameterized editing and management apparatus 800 of a hot bridge node according to an embodiment of the present disclosure. For example, the device 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, an exercise device, a personal digital assistant, and the like.
Referring to fig. 6, device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output interface 812, a sensor component 814, and a communication component 816.
The processing component 802 generally controls overall operation of the device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing components 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the methods described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operation at the device 800. Examples of such data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
A power supply component 806 provides power to the various components of the device 800. The power components 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the device 800.
The multimedia component 808 includes a screen that provides an output interface between the device 800 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense an edge of a touch or slide action, but also detect a duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. The front-facing camera and/or the rear-facing camera may receive external multimedia data when the device 800 is in an operating mode, such as a shooting mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, the audio component 810 includes a Microphone (MIC) configured to receive external audio signals when the device 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The input/output interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor assembly 814 includes one or more sensors for providing various aspects of state assessment for the device 800. For example, the sensor assembly 814 may detect the open/closed state of the device 800, the relative positioning of components, such as a display and keypad of the device 800, the sensor assembly 814 may also detect a change in the position of the device 800 or components within the device 800, the presence or absence of user contact with the device 800, orientation or acceleration/deceleration of the device 800, and a change in the temperature of the device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object in the absence of any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
In an exemplary embodiment, the device 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), digital Signal Processors (DSPs), digital Signal Processing Devices (DSPDs), programmable Logic Devices (PLDs), field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described methods.
In an exemplary embodiment, a non-transitory computer-readable storage medium, such as the memory 804, is also provided that includes computer program instructions executable by the processor 820 of the device 800 to perform the above-described methods.
Fig. 7 illustrates a block diagram of an electronic device 1900 in accordance with an embodiment of the disclosure. For example, the electronic device 1900 may be provided as a server. Referring to fig. 7, electronic device 1900 includes a processing unit 1922, which further includes one or more processors and memory resources, represented by storage unit 1932, for storing instructions, e.g., applications, that are executable by processing unit 1922. The application programs stored in the storage unit 1932 may include one or more modules each corresponding to a set of instructions. Further, processing unit 1922 is configured to execute instructions to perform the above-described method.
The electronic device 1900 may further include a power module 1926 configured to perform power management of the electronic device 1900, a wired or wireless network interface 1950 configured to connect the electronic device 1900 to a network, and an I/O interface 1958. The electronic device 1900 may operate based on an operating system, such as Windows Server, stored in memory 1932 TM ，Mac OS X TM ，Unix TM , Linux TM ，FreeBSD TM Or the like.
In an exemplary embodiment, a non-volatile computer-readable storage medium, such as the storage unit 1932, is also provided that includes computer program instructions that are executable by the processing unit 1922 of the electronic device 1900 to perform the above-described method.
The present disclosure may be systems, methods, and/or computer program products. The computer program product may include a computer-readable storage medium having computer-readable program instructions embodied thereon for causing a processor to implement various aspects of the present disclosure.
The computer-readable storage medium may be a tangible device that can hold and store the instructions for use by the instruction execution device. The computer readable storage medium may be, for example, but not limited to, an electronic memory device, a magnetic memory device, an optical memory device, an electromagnetic memory device, a semiconductor memory device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a Static Random Access Memory (SRAM), a portable compact disc read-only memory (CD-ROM), a Digital Versatile Disc (DVD), a memory stick, a floppy disk, a mechanical coding device, such as punch cards or in-groove projection structures having instructions stored thereon, and any suitable combination of the foregoing. Computer-readable storage media as used herein is not to be construed as transitory signals per se, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through a waveguide or other transmission medium (e.g., optical pulses through a fiber optic cable), or electrical signals transmitted through electrical wires.
The computer-readable program instructions described herein may be downloaded from a computer-readable storage medium to a respective computing/processing device, or to an external computer or external storage device over a network, such as the internet, a local area network, a wide area network, and/or a wireless network. The network may include copper transmission cables, fiber optic transmission, wireless transmission, routers, firewalls, switches, gateway computers and/or edge servers. The network adapter card or network interface in each computing/processing device receives computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in the respective computing/processing device.
Computer program instructions for carrying out operations of the present disclosure may be assembler instructions, instruction Set Architecture (ISA) instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source or object code written in any combination of one or more programming languages, including an object oriented programming language such as Smalltalk, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The computer-readable program instructions may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a Local Area Network (LAN) or a Wide Area Network (WAN), or the connection may be made to an external computer (for example, through the Internet using an Internet service provider). In some embodiments, aspects of the disclosure are implemented by personalizing an electronic circuit, such as a programmable logic circuit, a Field Programmable Gate Array (FPGA), or a Programmable Logic Array (PLA), with state information of computer-readable program instructions, which can execute the computer-readable program instructions.
Various aspects of the present disclosure are described herein with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the disclosure. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer-readable program instructions.
These computer-readable program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions/acts specified in the flowchart and/or block diagram block or blocks. These computer-readable program instructions may also be stored in a computer-readable storage medium that can direct a computer, programmable data processing apparatus, and/or other devices to function in a particular manner, such that the computer-readable medium storing the instructions comprises an article of manufacture including instructions which implement the function/act specified in the flowchart and/or block diagram block or blocks.
The computer readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer, other programmable apparatus or other devices implement the functions/acts specified in the flowchart and/or block diagram block or blocks.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
The computer program product may be embodied in hardware, software or a combination thereof. In an alternative embodiment, the computer program product is embodied in a computer storage medium, and in another alternative embodiment, the computer program product is embodied in a Software product, such as a Software Development Kit (SDK), or the like.
The foregoing description of the embodiments of the present disclosure has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or improvements to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. A parameterized editing and management method for hot bridge nodes is characterized by comprising the following steps:
setting a base point position in a drawing area of a thermal bridge node;
acquiring position information and size information of each part of the thermal bridge node;
determining relative position expression parameters of each part of the thermal bridge node relative to the base point position according to the position information and the size information of each part of the thermal bridge node, wherein the relative position expression parameters represent the boundary position of each part under the condition that the base point position is taken as a reference;
and obtaining a thermal bridge node model according to the relative position expression parameters and the thermal bridge node patterns corresponding to the relative position expression parameters.
2. The method for parameterized editing and management of a hot bridge node according to claim 1, further comprising:
when receiving the editing information of the relative position expression parameters, determining the updated relative position expression parameters according to the editing information;
adjusting the hot-bridge node pattern according to the updated relative position expression parameters to obtain an updated hot-bridge node pattern;
and obtaining an updated thermal bridge node model according to the updated thermal bridge node pattern and the updated relative position expression parameters.
3. The method for parameterized editing and management of a hot bridge node according to claim 1, further comprising:
and adding the hot bridge node model into a hot bridge node database for classified storage.
4. The method for parameterized editing and management of a hot bridge node according to claim 3, further comprising:
and carrying out any one of deletion, editing and replacement on the plurality of hot bridge node models in the hot bridge node database.
5. The method for parameterized editing and management of a hot bridge node according to claim 3, further comprising:
selecting a target thermal bridge node model from the thermal bridge node database according to the type of the required thermal bridge node;
editing the relative position expression parameters of the target thermal bridge node model to obtain a thermal bridge node model to be inserted;
and inserting the hot bridge node model to be inserted into a building model.
6. The parameterized editing and management method for the thermal bridge node according to claim 5, wherein the editing of the relative position expression parameters of the target thermal bridge node model to obtain the thermal bridge node model to be inserted comprises:
determining a relative position expression parameter of the target thermal bridge node model according to the received editing information of the relative position expression parameter of the target thermal bridge node model;
and updating the hot bridge node pattern of the target hot bridge node model according to the relative position expression parameters of the target hot bridge node model to obtain the hot bridge node model to be inserted.
7. The method for parametric editing and managing thermal bridge nodes of claim 1, wherein the base point position is located in a lower left corner region of the drawing area.
8. A parameterized editing and managing apparatus for a hot bridge node, comprising:
the base point position module is used for setting a base point position in a drawing area of the thermal bridge node;
the information acquisition module is used for acquiring the position information and the size information of each part of the thermal bridge node;
a parameter module, configured to determine, according to the position information and the size information of each part of the thermal bridge node, a relative position expression parameter of each part of the thermal bridge node with respect to the base point position, where the relative position expression parameter represents a relative position of a boundary position of each part with respect to the base point position;
and the model obtaining module is used for obtaining a thermal bridge node model according to the relative position expression parameters and the thermal bridge node patterns corresponding to the relative position expression parameters.
9. A parameterized editing and managing device for a hot bridge node, comprising:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to invoke the memory-stored instructions to perform the method of any one of claims 1 to 7.
10. A computer-readable storage medium having computer program instructions stored thereon which, when executed by a processor, implement the method of any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310022578.6A CN115795630A (en) | 2023-01-08 | 2023-01-08 | Parameterized editing and managing method and device for hot bridge nodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310022578.6A CN115795630A (en) | 2023-01-08 | 2023-01-08 | Parameterized editing and managing method and device for hot bridge nodes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115795630A true CN115795630A (en) | 2023-03-14 |
Family
ID=85428709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310022578.6A Pending CN115795630A (en) | 2023-01-08 | 2023-01-08 | Parameterized editing and managing method and device for hot bridge nodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115795630A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114357574A (en) * | 2021-12-20 | 2022-04-15 | 万翼科技有限公司 | Component editing method, device, equipment and storage medium based on parameterized drive |
-
2023
- 2023-01-08 CN CN202310022578.6A patent/CN115795630A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114357574A (en) * | 2021-12-20 | 2022-04-15 | 万翼科技有限公司 | Component editing method, device, equipment and storage medium based on parameterized drive |
Non-Patent Citations (4)
| Title |
|---|
| ARVYDAS KUBLICKAS: "The software for calculating thermal bridges with an integrated FEM solver" * |
| 戴绍斌;倪青荣;马保国;黄俊;: "自保温体系外墙中柱热桥影响区域分析" * |
| 谭伟;闫增峰;孙立新;林海燕;: "利用ANSYS计算异型围护结构中的热桥线传热系数" * |
| 谷胜军;刘蔚巍;黄文杰;龚继如;: "城轨车辆综合传热系数快速算法及软件开发" * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3136658B1 (en) | Method, device, terminal device, computer program and recording medium for changing emoticon in chat interface | |
| EP3335863A1 (en) | 3d printing data generation method and device | |
| CN108900693A (en) | Window display method and device | |
| US20160314164A1 (en) | Methods and devices for sharing cloud-based business card | |
| CN109934240B (en) | Feature updating method and device, electronic equipment and storage medium | |
| EP2950486A1 (en) | Method and device for managing instant message | |
| CN114546460A (en) | Firmware upgrading method and device, electronic equipment and storage medium | |
| CN110989905A (en) | Information processing method and device, electronic equipment and storage medium | |
| CN114691115A (en) | Business process system generation method and device, electronic equipment and storage medium | |
| CN115908744B (en) | Method and device for sharing linkage of single body and total graph model data | |
| CN115391601B (en) | Video format detection method, index model construction method and device | |
| CN107680045B (en) | Picture stretching method and device | |
| CN115408763B (en) | BIM platform-based component generation method | |
| CN115795630A (en) | Parameterized editing and managing method and device for hot bridge nodes | |
| CN105630486B (en) | Typesetting method and device for desktop of intelligent terminal equipment | |
| EP3185515A1 (en) | Method and device for inputting information | |
| CN113869295A (en) | Object detection method and device, electronic equipment and storage medium | |
| CN113806779A (en) | System authority management method and device, electronic equipment and storage medium | |
| CN112306702B (en) | Data sharing method and device, electronic equipment and storage medium | |
| CN113391804A (en) | Page generation method and device, electronic equipment and storage medium | |
| CN112461245A (en) | Data processing method and device, electronic equipment and storage medium | |
| CN114494294B (en) | Method and device for processing earth surface coverage data, electronic equipment and storage medium | |
| CN117391038B (en) | Metal stack space information dividing method of chip layout and chip | |
| CN115774940A (en) | Building linear thermal bridge determination method and device, electronic equipment and storage medium | |
| EP2940981A2 (en) | Method and device for synchronizing photographs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20230314 |