CN115793745A - Temperature control method and device of power module, medium, chip and air conditioner - Google Patents
Temperature control method and device of power module, medium, chip and air conditioner Download PDFInfo
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- CN115793745A CN115793745A CN202211516654.0A CN202211516654A CN115793745A CN 115793745 A CN115793745 A CN 115793745A CN 202211516654 A CN202211516654 A CN 202211516654A CN 115793745 A CN115793745 A CN 115793745A
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- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Abstract
The disclosure relates to a temperature control method, a temperature control device, a medium, a chip and an air conditioner of a power module, wherein the method comprises the following steps: acquiring the temperature of the power module; determining the temperature increment of the power module in each period according to the acquired temperature; and if the number of cycles meeting a preset condition is greater than or equal to M in N continuous cycles, controlling the power module to enter an over-temperature protection mode, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold value, and N is greater than M. Through the technical scheme, in N continuous periods, if the temperature increment of the power module in the period is larger than or equal to M of the period number of the increment threshold value, the power module is controlled to enter an over-temperature protection mode, so that the temperature of the power module is prevented from being rapidly increased, the power module is prevented from being over-temperature, the safety of the power module in the using process is improved, and the possibility of damage of the power module caused by over-temperature is reduced.
Description
Technical Field
The present disclosure relates to the field of control, and in particular, to a temperature control method, device, medium, chip and air conditioner for a power module.
Background
The power module is a module formed by combining, encapsulating and sealing power electronic devices according to certain functions. During use, the power module releases a large amount of heat, which needs to be dissipated. If the heat dissipation is not timely, not only the risk that the power module is damaged, but also potential safety hazards exist. Therefore, how to protect the power module, reduce the risk of the power module damage caused by poor heat dissipation, and reduce the potential safety hazard of the power module in the use process is an urgent problem to be solved.
Disclosure of Invention
In order to overcome the problems in the related art, the present disclosure provides a temperature control method, device, medium, chip and air conditioner for a power module.
According to a first aspect of an embodiment of the present disclosure, there is provided a method for controlling a temperature of a power module, including:
acquiring the temperature of the power module;
determining the temperature increment of the power module in each period according to the acquired temperature;
and if the number of cycles meeting a preset condition is greater than or equal to M in N continuous cycles, controlling the power module to enter an over-temperature protection mode, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold value, and N is greater than M.
Optionally, if the number of cycles meeting the preset condition is greater than or equal to M in the consecutive N cycles, controlling the power module to enter an over-temperature protection mode includes:
determining whether to enter over-temperature protection judgment;
and under the condition of entering the over-temperature protection judgment, if the number of cycles meeting the preset condition is more than or equal to M in continuous N cycles, controlling the power module to enter an over-temperature protection mode.
Optionally, the determining whether to enter an over-temperature protection decision includes:
and under the condition that the over-temperature protection judgment is not entered, if the temperature increment of the power module in a period is greater than the increment threshold value, the over-temperature protection judgment is determined to be entered.
Optionally, the method further comprises:
and under the condition of entering the over-temperature protection judgment, if the number of cycles meeting the preset condition is less than M in continuous N cycles, exiting the over-temperature protection judgment.
Optionally, the acquiring the temperature of the power module includes:
acquiring the voltage of a thermistor in the power module;
determining the resistance value of the thermistor according to the voltage of the thermistor;
determining the temperature of the thermistor according to the resistance value of the thermistor;
and determining the temperature of the power module according to the temperature of the thermistor.
Optionally, the determining the temperature of the power module according to the temperature of the thermistor includes:
determining a temperature of the thermistor as a temperature of the power module;
alternatively, the first and second liquid crystal display panels may be,
and determining the temperature of the power module according to the corresponding relation and the temperature of the thermistor, wherein the corresponding relation is the corresponding relation between the temperature of the thermistor and the temperature of the power module.
Optionally, the power module is for a compressor, the method further comprising:
periodically acquiring the working frequency of the compressor;
determining the increment threshold according to the working frequency.
Optionally, the power module stops operating in an over-temperature protection mode.
According to a second aspect of an embodiment of the present disclosure, there is provided a temperature control device of a power module, including:
a first acquisition module configured to acquire a temperature of the power module;
a first determination module configured to determine a temperature increment of the power module in each period according to the acquired temperature;
the first control module is configured to control the power module to enter an over-temperature protection mode if the number of cycles meeting a preset condition is greater than or equal to M in N consecutive cycles, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold value, and N is greater than M.
According to a third aspect of the embodiments of the present disclosure, there is provided a temperature control device of a power module, including:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
acquiring the temperature of the power module;
determining the temperature increment of the power module in each period according to the acquired temperature;
and if the number of cycles meeting a preset condition is greater than or equal to M in N continuous cycles, controlling the power module to enter an over-temperature protection mode, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold value, and N is greater than M.
According to a fourth aspect of embodiments of the present disclosure, there is provided a computer-readable storage medium having stored thereon computer program instructions, which when executed by a processor, implement the steps of the temperature control method of the power module provided by the first aspect of the present disclosure.
According to a fifth aspect of embodiments of the present disclosure, there is provided a chip comprising a processor and an interface; the processor is used for reading instructions to execute the steps of the temperature control method of the power module provided by the first aspect of the disclosure.
According to a sixth aspect of an embodiment of the present disclosure, there is provided an air conditioner including a controller; the controller is configured to perform the temperature control method of the power module provided by the first aspect of the present disclosure.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
through the technical scheme, in N continuous periods, if the temperature increment of the power module in the period is larger than or equal to the period number of the increment threshold value and is larger than or equal to M, the power module is controlled to enter an over-temperature protection mode, so that the temperature of the power module is prevented from being rapidly increased, the power module is prevented from being over-temperature, the safety of the power module in the using process is improved, and the possibility of damage of the power module due to over-temperature is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a flow chart illustrating a method of temperature control of a power module according to an exemplary embodiment.
FIG. 2 is a block diagram illustrating a temperature control arrangement of a power module according to one exemplary embodiment.
Fig. 3 is a block diagram illustrating an apparatus for performing a method of temperature control of a power module according to an example embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
It should be noted that all the actions of acquiring signals, information or data in the present application are performed under the premise of complying with the corresponding data protection regulation policy of the country of the location and obtaining the authorization given by the owner of the corresponding device.
FIG. 1 is a flow chart illustrating a method of temperature control of a power module according to an exemplary embodiment. As shown in fig. 1, the temperature control method of the power module includes steps S101 to S103.
In step S101, the temperature of the power module is acquired.
The Power Module may be a Power electronic device, for example, the Power Module may be an Intelligent Power Module (IPM). In step S101, the temperature of the power module is acquired. The temperature of the power module may refer to a junction temperature of the power module. The temperature of the power module may be periodically acquired. The period length for obtaining the temperature of the power module may be preset. For example, the period duration may be preset to be 5ms, that is, in step S101, the temperature of the power module may be acquired every 5 ms.
In step S102, the temperature increment of the power module in each period is determined according to the acquired temperature.
The temperature increase of the power module during a cycle may be an amount of change in the temperature of the power device at the end of the current cycle relative to the temperature at the end of the previous cycle. For example, at the end of the last cycle, the temperature of the power module is 39.8 ℃, at the end of the current cycle, the temperature of the power module is 40 ℃, the temperature variation of the power device in the current cycle is 0.2 ℃ (40 ℃ -39.8 ℃ =0.2 ℃), that is, the temperature increment of the power module in the current cycle is 0.2 ℃.
In step S103, if the number of cycles satisfying the preset condition is greater than or equal to M in consecutive N cycles, the power module is controlled to enter the over-temperature protection mode, where the preset condition is that the temperature increment of the power module in the cycle is greater than the increment threshold, and N > M.
N and M are positive integers, and the values of N and M may be preset. For example, in one embodiment, the value of N may be preset to 5 and the value of M may be preset to 3.
The over-temperature protection mode may be a preset operation mode of the power module, for preventing the power module from being over-temperature. The increment threshold may be preset, for example, the increment threshold may be set to 0.15 ℃.
Next, the implementation of step S103 will be exemplified. For example, according to the determination in steps S101 and S102, the temperature of the power module is increased by 0.10 ℃, 0.20 ℃ and 0.10 ℃ in 5 consecutive periods including the current period (i.e. the current period and 4 consecutive periods before the current period), and the temperature of the power module is increased by more than 0.15 ℃ in 3 periods in the 5 consecutive periods, so that the power module can be controlled to enter the over-temperature protection mode.
Through the technical scheme, in N continuous periods, if the temperature increment of the power module in the period is larger than or equal to M of the period number of the increment threshold value, the power module is controlled to enter an over-temperature protection mode, so that the temperature of the power module is prevented from being rapidly increased, the power module is prevented from being over-temperature, the safety of the power module in the using process is improved, and the possibility of damage of the power module caused by over-temperature is reduced.
In another embodiment, if the number of cycles satisfying the predetermined condition is greater than or equal to M in consecutive N cycles, the controlling the power module to enter the over-temperature protection mode includes:
determining whether to enter over-temperature protection judgment;
and under the condition of entering the over-temperature protection judgment, if the number of cycles meeting the preset condition is more than or equal to M in continuous N cycles, controlling the power module to enter an over-temperature protection mode.
The condition for entering the over-temperature protection determination may be preset. For example, it may be preset that the over-temperature protection determination is entered when the temperature of the power module is higher than a temperature threshold. For example, the temperature threshold may be set to 60 ℃, and the over-temperature protection determination may be entered when the temperature of the power module is higher than 60 ℃, and the over-temperature protection determination may be exited when the temperature of the power module is lower than 60 ℃.
For example, in each period before the current period, the temperature of the power module is less than 60 ℃, it may not be determined whether to control the power module to enter the over-temperature protection mode, and in the current period, the temperature of the power module is 60.1 ℃, it is determined to enter the over-temperature protection determination (i.e., it is determined whether to control the power module to enter the over-temperature protection mode).
In one embodiment, after N consecutive cycles have elapsed since the cycle for determining the over-temperature protection is entered, it may be determined whether the number of cycles satisfying the preset condition in the N cycles is greater than or equal to M; and if the periodicity meeting the preset condition is more than or equal to M, controlling the power module to enter an over-temperature protection mode.
For example, when the temperature of the power module reaches 60 ℃, it is determined to enter an over-temperature protection determination (whether to enter an over-temperature protection mode is determined), and after 5 cycles, it is determined whether or not the number of cycles satisfying the preset condition is greater than or equal to 3 in 5 cycles from the cycle when the power module reaches 60 ℃ to the 4 th cycle after the power module reaches 60 ℃. And if so, controlling the power module to enter an over-temperature protection mode.
In this embodiment, it is determined whether to enter the over-temperature protection determination for the power module, and if it is determined that the over-temperature protection determination for the power module is entered, it is determined whether to control the power module to enter the over-temperature protection mode. In this way, computer computing power can be saved. In addition, whether the power module is subjected to over-temperature protection judgment is determined, so that the power module is prevented from being protected under an unnecessary condition, and the working stability of the power module is improved.
In yet another embodiment, determining whether to enter an over-temperature protection decision includes:
and under the condition that the over-temperature protection judgment is not entered, if the temperature increment of the power module in one period is larger than the increment threshold, the entering of the over-temperature protection judgment is determined.
In one embodiment, the presence of a temperature increase of the power module over a period greater than an increase threshold may be determined as a condition for entering a determination of over-temperature protection.
For example, if the temperature increment of the power module is less than the increment threshold in each cycle before the current cycle, the condition for entering the over-temperature protection decision is not met in each cycle before the current cycle. In the current period, the temperature increment of the power module is 0.2 ℃, the temperature increment is higher than the increment threshold value by 0.15 ℃, the temperature increment of the power module reaches the judgment condition of over-temperature protection, the over-temperature protection judgment is carried out, and whether the power module is controlled to enter the over-temperature protection mode or not is judged. And if the number of the cycles meeting the preset condition is more than or equal to 3 in the current cycle and 4 cycles after the current cycle, controlling the power module to enter an over-temperature protection mode.
In this embodiment, when the temperature increment of the power module in a period is greater than the increment threshold, which indicates that the power module may have poor heat dissipation, the temperature increment of the power module in a period is greater than the increment threshold as a condition for entering the over-temperature protection determination, and whether the power module needs to be controlled to enter the over-temperature protection mode is determined in time, so that the power module can be better protected, and the power module can be prevented from being damaged to a greater extent.
In a further embodiment, the method further comprises:
and under the condition of entering the over-temperature protection judgment, if the number of cycles meeting the preset condition is less than M in continuous N cycles, exiting the over-temperature protection judgment.
For example, if the temperature increment of the power module is 0.2 ℃ and is higher than the increment threshold value by 0.15 ℃ in the current period, the over-temperature protection determination of the power module is performed, and whether to control the power module to enter the over-temperature protection mode is determined. And if the number of the cycles meeting the preset condition is less than 3 in the current cycle and 4 cycles after the current cycle, controlling to quit over-temperature protection judgment.
In one embodiment, after exiting the over-temperature protection determination, if the condition for entering the over-temperature protection determination is reached again (e.g., the temperature increment of the power module is greater than or equal to the increment threshold again), the over-temperature protection determination for the power module may be entered again.
In this embodiment, after entering the over-temperature protection determination, if the number of cycles satisfying the preset condition is less than M in consecutive N cycles, it may be considered that the heat dissipation effect of the power module is better, and the over-temperature protection determination on the power module is timely exited, so that the computational power of the computer is saved.
In yet another embodiment, obtaining the temperature of the power module comprises:
acquiring the voltage of a thermistor in the power module;
determining the resistance value of the thermistor according to the voltage of the thermistor;
determining the temperature of the thermistor according to the resistance value of the thermistor;
the temperature of the power module is determined based on the temperature of the thermistor.
Inside the power module, a thermistor may be provided, and a voltage of the thermistor may be detected and a resistance value of the thermistor may be determined. Since the change of temperature can affect the resistance of the thermistor and thus the voltage division of the thermistor in the circuit, and since the circuit structure inside the power module is known, the resistance of the thermistor can be determined according to the voltage of the thermistor.
According to the self characteristics of the thermistor, the resistance value of the thermistor is related to the temperature of the thermistor, and the resistance values of the thermistor at different temperatures can be measured in advance to determine the corresponding resistance values of the thermistor at different temperatures. In this way, in the process of implementing the temperature control method of the power module provided by the present disclosure, the temperature of the thermistor can be determined according to the thermistor resistance value.
Because the resistance value of the thermistor inside the power module is influenced by the power module in the working process of the power module, the temperature of the power module can be determined according to the temperature of the thermistor.
In this embodiment, the resistance value of the thermistor is determined according to the voltage of the thermistor inside the power module, and the temperature of the thermistor is determined according to the resistance value of the thermistor, so as to obtain the temperature of the power module. Therefore, the temperature of the power module which is difficult to measure can be obtained by converting the voltage of the thermistor which is easy to measure, the method is simple, and the temperature of the power module can be effectively obtained.
In yet another embodiment, determining the temperature of the power module from the temperature of the thermistor includes:
determining the temperature of the thermistor as the temperature of the power module;
alternatively, the first and second electrodes may be,
and determining the temperature of the power module according to the corresponding relation and the temperature of the thermistor, wherein the corresponding relation is the corresponding relation between the temperature of the thermistor and the temperature of the power module.
Since the thermistor is inside the power module, the temperature of the thermistor can be approximately regarded as the temperature of the power module, and thus, in one embodiment, the temperature of the thermistor can be determined as the temperature of the power module.
In yet another embodiment, the correspondence of the temperature of the thermistor to the temperature of the power module may be predetermined. The temperature of the corresponding power module when the thermistor is at different temperatures can be measured in a laboratory in advance, and the corresponding relationship is established according to the measured thermistor temperature and the temperature of the power module. For example, it was previously measured that the temperature of the power module was 40.8 ℃ when the temperature of the thermistor was 40.5 ℃; when the temperature of the thermistor is 80.5 ℃, the temperature of the power module is 81 ℃. Then, in the preset correspondence, the temperature of the power module corresponding to the temperature of the thermistor being 40.5 ℃ is 40.8 ℃. The temperature of the power module corresponding to the thermistor temperature of 80.5 c is 81 c. Therefore, in the implementation process of the temperature control method of the power module provided by the disclosure, the temperature of the power module can be determined according to the temperature of the thermistor and the corresponding relation.
In one embodiment, a characteristic curve describing the relationship between the temperature of the thermistor and the temperature of the power module may be fitted according to the corresponding relationship, that is, a characteristic curve with the temperature of the thermistor as an abscissa and the temperature of the power module as an ordinate is fitted, and an expression of the characteristic curve (the temperature of the thermistor is an independent variable and the temperature of the power module is a dependent variable) is determined. In performing the temperature control method of the power module provided by the present disclosure, the temperature of the power module may be determined according to the temperature of the thermistor using a predetermined expression.
In this embodiment, a method of determining a temperature of a power module from a temperature of a thermistor is provided. Since the temperature of the thermistor is approximate to the temperature of the power module, the temperature of the thermistor is determined as the temperature of the power module, and the temperature of the power module can be determined simply and quickly. The temperature of the power module is determined according to the corresponding relation and the temperature of the thermistor, so that the more accurate temperature of the power module can be determined, the determined temperature increment of the power module is more accurate, the power module can be better protected, and the possibility of damage of the power module is reduced.
In yet another embodiment, the power module is for a compressor, the method further comprising:
periodically acquiring the working frequency of the compressor;
an incremental threshold is determined based on the operating frequency.
The operating frequency of the compressor may be periodically acquired, and a period duration of a period for acquiring the operating frequency of the compressor may be equal to a period duration of a period for acquiring the temperature of the power module. For example, in step S101, the temperature of the power module is obtained once every period, and the operating frequency of the compressor can be obtained once every period.
The increment threshold for each cycle may be determined based on the frequency of the compressor acquired for that cycle. For example, the operating frequency of the compressor can be preset to f 1 When, with f 1 Corresponding incremental threshold value of t 1 When the operating frequency of the compressor is f 2 When (f) 2 Greater than f 1 ) And f is and 2 corresponding incremental threshold value of t 2 . In the implementation process of the temperature control method for the power module provided by the disclosure, the increment threshold value can be determined according to the working frequency of the compressor acquired in the period, and the determined increment threshold value corresponding to the period is compared with the temperature increment of the power module in the period to judge whether the temperature increment of the power module in the period is greater than the increment threshold value (namely, judgeWhether the current period meets a preset condition).
In this embodiment, the increment threshold is determined according to the operating frequency of the compressor, and because the on-off times of the devices inside the power module in one period are different under different operating frequencies of the compressor, when the operating frequency of the compressor is higher, the on-off times of the devices inside the power module in one period are more, the more heat is generated by the power module, and the larger temperature increment is generated by the power module. In the embodiment, the increment threshold is determined according to the working frequency of the compressor, and the working condition of the compressor is considered while the temperature rising speed of the power module is prevented from being too high, so that the power module is prevented from being frequently controlled to enter the over-temperature protection mode when the working frequency of the compressor is higher. Therefore, the power module can be protected, and the use experience of a user can be considered.
In yet another embodiment, the power module ceases operation in the over-temperature protection mode.
For example, when the power module is controlled to enter the over-temperature protection mode, the Micro Controller Unit (MCU) may be controlled to send a power module protection signal (the power module protection signal may be a level signal defined by a developer, for example, when the power module protection signal is "0", the power module operates, and when the power module protection signal is "1", the power module stops operating), so that the power module stops operating.
In this embodiment, the power module stops working in the over-temperature protection mode, so that the temperature of the power module can be prevented from further rising, the temperature of the power module is prevented from exceeding the highest temperature that the power module can tolerate, the power module is prevented from being damaged due to over-temperature, and the service life of the power module is prolonged.
FIG. 2 is a block diagram illustrating a temperature control arrangement of a power module according to an exemplary embodiment. As shown in fig. 2, the temperature control apparatus 200 of the power module includes a first obtaining module 201, a first determining module 202, and a first control module 203.
The first acquisition module 201 is configured to acquire the temperature of the power module.
The first determination module 202 is configured to determine a temperature increment of the power module per cycle based on the acquired temperature.
The first control module 203 is configured to control the power module to enter the over-temperature protection mode if the number of cycles satisfying a preset condition is greater than or equal to M in consecutive N cycles, where the preset condition is that a temperature increment of the power module in the cycle is greater than an increment threshold, and N > M.
In yet another embodiment, the first control module 203 includes a first determination submodule and a control submodule.
The first determination submodule is configured to determine whether to enter an over-temperature protection decision.
The control submodule is configured to, under the condition of entering the over-temperature protection judgment, control the power module to enter the over-temperature protection mode if the number of cycles meeting the preset condition is greater than or equal to M in N consecutive cycles.
In yet another embodiment, the first determination submodule is further configured to determine to enter the over-temperature protection decision if an increase in temperature of the power module over a period is greater than an increase threshold without entering the over-temperature protection decision.
In yet another embodiment, the temperature control device 200 of the power module further comprises a second control module.
The second control module is configured to exit the over-temperature protection determination if the number of cycles satisfying the preset condition is less than M in consecutive N cycles, under the condition that the over-temperature protection determination is entered.
In yet another embodiment, the first obtaining module 201 includes an obtaining sub-module, a second determining sub-module, a third determining sub-module, and a fourth determining sub-module.
The acquisition submodule is configured to acquire a voltage of a thermistor inside the power module.
The second determination submodule is configured to determine a resistance value of the thermistor according to a voltage of the thermistor.
The third determination submodule is configured to determine a temperature of the thermistor based on a resistance value of the thermistor.
The fourth determination submodule is configured to determine a temperature of the power module from the temperature of the thermistor.
In yet another embodiment, the fourth determination submodule includes a fifth determination submodule or a sixth determination submodule.
The fifth determination submodule is configured to determine a temperature of the thermistor as a temperature of the power module.
The sixth determining submodule is configured to determine the temperature of the power module according to a corresponding relationship and the temperature of the thermistor, wherein the corresponding relationship is a corresponding relationship between the temperature of the thermistor and the temperature of the power module.
In yet another embodiment, the power module is used for a compressor, and the temperature control apparatus 200 of the power module further includes a second obtaining module and a second determining module.
The second acquisition module is configured to periodically acquire an operating frequency of the compressor.
The second determination module is configured to determine the delta threshold as a function of the operating frequency.
In yet another embodiment, the power module ceases operation in the over-temperature protection mode.
With regard to the apparatus in the above-described embodiment, the specific manner in which each module performs the operation has been described in detail in the embodiment related to the method, and will not be elaborated here.
Through the technical scheme, in N continuous periods, if the temperature increment of the power module in the period is larger than or equal to M of the period number of the increment threshold value, the power module is controlled to enter an over-temperature protection mode, so that the temperature of the power module is prevented from being rapidly increased, the power module is prevented from being over-temperature, the safety of the power module in the using process is improved, and the possibility of damage of the power module caused by over-temperature is reduced.
The present disclosure also provides a temperature control device of a power module, including:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
acquiring the temperature of a power module;
determining the temperature increment of the power module in each period according to the acquired temperature;
and if the number of cycles meeting the preset condition is greater than or equal to M in N continuous cycles, controlling the power module to enter an over-temperature protection mode, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold value, and N is greater than M.
The present disclosure also provides a computer readable storage medium having stored thereon computer program instructions which, when executed by a processor, implement the steps of the method of temperature control of a power module provided by the present disclosure.
The present disclosure also provides a chip comprising a processor and an interface; the processor is used for reading instructions to execute the steps of the temperature control method of the power module provided by the disclosure.
The present disclosure also provides an air conditioner, comprising a controller; the controller is configured to perform the steps of the temperature control method of the power module provided by the present disclosure.
Fig. 3 is a block diagram illustrating an apparatus 800 for performing a method of temperature control of a power module according to an example embodiment. For example, the apparatus 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, an exercise device, a personal digital assistant, and the like.
Referring to fig. 3, the apparatus 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input/output interface 812, a sensor component 814, and a communication component 816.
The processing component 802 generally controls overall operation of the device 800, such as operations associated with display, telephone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to perform all or a portion of the steps of the power module temperature control method described above. Further, the processing component 802 can include one or more modules that facilitate interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate interaction between the multimedia component 808 and the processing component 802.
The memory 804 is configured to store various types of data to support operations at the apparatus 800. Examples of such data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, and so forth. The memory 804 may be implemented by any type or combination of volatile or non-volatile memory devices, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disks.
The multimedia component 808 includes a screen that provides an output interface between the device 800 and a user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive an input signal from a user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundary of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front facing camera and/or a rear facing camera. The front camera and/or the rear camera may receive external multimedia data when the device 800 is in an operation mode, such as a photographing mode or a video mode. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.
The audio component 810 is configured to output and/or input audio signals. For example, audio component 810 includes a Microphone (MIC) configured to receive external audio signals when apparatus 800 is in an operational mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signals may further be stored in the memory 804 or transmitted via the communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.
The input/output interface 812 provides an interface between the processing component 802 and peripheral interface modules, which may be keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to: a home button, a volume button, a start button, and a lock button.
The sensor assembly 814 includes one or more sensors for providing various aspects of state assessment for the device 800. For example, the sensor assembly 814 may detect the open/closed status of the device 800, the relative positioning of components, such as a display and keypad of the device 800, the sensor assembly 814 may also detect a change in the position of the device 800 or a component of the device 800, the presence or absence of user contact with the device 800, the orientation or acceleration/deceleration of the device 800, and a change in the temperature of the device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.
The communication component 816 is configured to facilitate communications between the apparatus 800 and other devices in a wired or wireless manner. The apparatus 800 may access a wireless network based on a communication standard, such as WiFi,2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 further includes a Near Field Communication (NFC) module to facilitate short-range communications. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID) technology, infrared data association (IrDA) technology, ultra Wideband (UWB) technology, bluetooth (BT) technology, and other technologies.
In an exemplary embodiment, the apparatus 800 may be implemented by one or more Application Specific Integrated Circuits (ASICs), digital Signal Processors (DSPs), digital Signal Processing Devices (DSPDs), programmable Logic Devices (PLDs), field Programmable Gate Arrays (FPGAs), controllers, micro-controllers, microprocessors or other electronic components for performing the above-described temperature control method of the power module.
In an exemplary embodiment, a non-transitory computer readable storage medium including instructions, such as the memory 804 including instructions, executable by the processor 820 of the device 800 to perform the method of temperature control of a power module described above is also provided. For example, the non-transitory computer readable storage medium may be a ROM, a Random Access Memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
The apparatus may be a part of a stand-alone electronic device, for example, in an embodiment, the apparatus may be an Integrated Circuit (IC) or a chip, where the IC may be one IC or a collection of multiple ICs; the chip may include, but is not limited to, the following categories: a GPU (Graphics Processing Unit), a CPU (Central Processing Unit), an FPGA (Field Programmable Gate Array), a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an SOC (System on Chip, SOC, system on Chip, or System on Chip), and the like. The integrated circuit or chip can be used to execute executable instructions (or codes) to implement the temperature control method of the power module. Where the executable instructions may be stored in the integrated circuit or chip or may be retrieved from another device or apparatus, for example, where the integrated circuit or chip includes a processor, a memory, and an interface for communicating with other devices. The executable instructions may be stored in the memory, and when executed by the processor, implement the temperature control method of the power module described above; alternatively, the integrated circuit or chip may receive executable instructions through the interface and transmit the executable instructions to the processor for execution, so as to implement the temperature control method of the power module.
In another exemplary embodiment, a computer program product is also provided, which comprises a computer program executable by a programmable apparatus, the computer program having code portions for performing the above-described method for temperature control of a power module when executed by the programmable apparatus.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice in the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (12)
1. A method of temperature control of a power module, comprising:
acquiring the temperature of the power module;
determining the temperature increment of the power module in each period according to the acquired temperature;
and if the number of cycles meeting a preset condition is greater than or equal to M in N continuous cycles, controlling the power module to enter an over-temperature protection mode, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold value, and N is greater than M.
2. The method of claim 1, wherein if the number of cycles satisfying the predetermined condition is greater than or equal to M in the consecutive N cycles, controlling the power module to enter the over-temperature protection mode comprises:
determining whether to enter over-temperature protection judgment;
and under the condition of entering the over-temperature protection judgment, if the number of cycles meeting the preset condition is more than or equal to M in continuous N cycles, controlling the power module to enter an over-temperature protection mode.
3. The method of claim 2, wherein the determining whether to enter an over-temperature protection decision comprises:
and under the condition that the over-temperature protection judgment is not entered, if the temperature increment of the power module in a period is greater than the increment threshold value, the over-temperature protection judgment is determined to be entered.
4. The method of claim 2, further comprising:
and under the condition of entering the over-temperature protection judgment, if the number of cycles meeting the preset condition is less than M in continuous N cycles, exiting the over-temperature protection judgment.
5. The method of claim 1, wherein the obtaining the temperature of the power module comprises:
acquiring the voltage of a thermistor in the power module;
determining the resistance value of the thermistor according to the voltage of the thermistor;
determining the temperature of the thermistor according to the resistance value of the thermistor;
and determining the temperature of the power module according to the temperature of the thermistor.
6. The method of claim 5, wherein said determining the temperature of the power module from the temperature of the thermistor comprises:
determining a temperature of the thermistor as a temperature of the power module;
alternatively, the first and second electrodes may be,
and determining the temperature of the power module according to the corresponding relation and the temperature of the thermistor, wherein the corresponding relation is the corresponding relation between the temperature of the thermistor and the temperature of the power module.
7. The method of claim 1, wherein the power module is for a compressor, the method further comprising:
periodically acquiring the working frequency of the compressor;
and determining the increment threshold according to the working frequency.
8. The method of claim 1, wherein the power module ceases operation in the over-temperature protection mode.
9. A temperature control apparatus for a power module, characterized by performing the control method according to any one of claims 1 to 8, comprising:
a first acquisition module configured to acquire a temperature of the power module;
a first determination module configured to determine a temperature increment of the power module in each period according to the acquired temperature;
the first control module is configured to control the power module to enter an over-temperature protection mode if the number of cycles meeting a preset condition is greater than or equal to M in N continuous cycles, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold, and N is greater than M;
or, comprising:
a processor;
a memory for storing processor-executable instructions;
wherein the processor is configured to:
acquiring the temperature of the power module;
determining the temperature increment of the power module in each period according to the acquired temperature;
and if the number of cycles meeting a preset condition is greater than or equal to M in N continuous cycles, controlling the power module to enter an over-temperature protection mode, wherein the preset condition is that the temperature increment of the power module in the cycle is greater than an increment threshold value, and N is greater than M.
10. A computer-readable storage medium, on which computer program instructions are stored, which program instructions, when executed by a processor, carry out the steps of the method according to any one of claims 1 to 8.
11. A chip comprising a processor and an interface; the processor is configured to read instructions to perform the method of any one of claims 1-8.
12. An air conditioner, characterized by comprising a controller; the controller is configured to perform the method of any one of claims 1-8.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211516654.0A CN115793745A (en) | 2022-11-29 | 2022-11-29 | Temperature control method and device of power module, medium, chip and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211516654.0A CN115793745A (en) | 2022-11-29 | 2022-11-29 | Temperature control method and device of power module, medium, chip and air conditioner |
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| CN115793745A true CN115793745A (en) | 2023-03-14 |
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| CN202211516654.0A Pending CN115793745A (en) | 2022-11-29 | 2022-11-29 | Temperature control method and device of power module, medium, chip and air conditioner |
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| Country | Link |
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| CN (1) | CN115793745A (en) |
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- 2022-11-29 CN CN202211516654.0A patent/CN115793745A/en active Pending
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