CN115781050A - Fixed tool suitable for diamond laser cutting - Google Patents
Fixed tool suitable for diamond laser cutting Download PDFInfo
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- CN115781050A CN115781050A CN202211595289.7A CN202211595289A CN115781050A CN 115781050 A CN115781050 A CN 115781050A CN 202211595289 A CN202211595289 A CN 202211595289A CN 115781050 A CN115781050 A CN 115781050A
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Abstract
The invention discloses a fixing jig suitable for diamond laser cutting, which comprises a base and a pressing assembly, wherein the pressing assembly is detachably connected with the base, the pressing assembly comprises a pressing plate used for pressing a diamond, the pressing plate is opposite to the top surface of the base, and a gap is formed between the pressing plate and the top surface of the base. In the invention, when the diamond to be cut is placed on the fixing jig, the diamond is clamped and fixed through the matching of the pressing plate and the top surface of the base, so that the diamond cannot be automatically cut when the diamond is cut to the tail end of the crystal by laser, the roughness of the tail end of the crystal is reduced, and the quality of the cut diamond seed crystal is ensured.
Description
Technical Field
The invention relates to the technical field of diamond processing, in particular to a fixing jig suitable for diamond laser cutting.
Background
The diamond has the characteristics of extremely high hardness and strength, ultra-high wear resistance, extremely high thermal conductivity and the like, and is applied to various fields of aerospace, medical treatment, optics, military and the like, the diamond generally grows through diamond seed crystals, MPCVD (microwave plasma chemical vapor deposition) is a common technical means for diamond crystal growth at present, the principle is that reaction gas forms various hydrocarbon activated groups under the excitation of microwaves, the activated groups generate a series of chemical reactions on the seed crystals and gradually generate adsorption, desorption, migration, diffusion and deposition on the surfaces of the seed crystals, and finally the diamond is obtained, so the seed crystals are the precondition for growing the diamond by the MPCVD method. The seed crystal is a small crystal having the same crystal orientation as the desired crystal, and is a seed for growing a single crystal, also called a seed crystal, and the diamond seed crystal can be obtained by cutting a single crystal diamond.
With the progress of science and technology and the urgent need of laser cutting of superhard materials, a novel laser application processing technology appears, namely water guide laser cutting, the water guide laser cutting machine can reduce cutting loss to a great extent, cutting lines are parallel, the parallelism of a cutting surface can be basically guaranteed, a caused heat damage layer is smaller than that of the traditional laser, but the water guide laser cutting machine is large in production cost, immature in technology, the roughness of the cutting surface is generally more than 400nm, and the roughness of the obtained diamond seed crystal cutting surface is higher.
Therefore, a conventional laser cutting machine is generally selected, a laser beam is focused by a focusing lens and then irradiated to the surface of a workpiece, and the high energy density of the laser is utilized to instantly gasify or melt the area of the workpiece irradiated by a focusing spot, so that a smooth cutting seam can be formed. Because the processing head does not need to be in direct contact with the processed material in work, the surface of a workpiece is not easy to scratch, follow-up processing is generally not needed, the cost is low, the technology is mature, the roughness of a cutting surface can be generally ensured to be about 200nm, but when the laser machine is used for cutting diamond, crystals can automatically fracture when the tail end of the diamond is about 10 percent, the roughness of the cutting surface at the tail end is increased, the quality of the obtained diamond seed crystal is poor, the requirement is not met, and the qualified diamond seed crystal can be obtained only by grinding and polishing the diamond.
Thus, the prior art has yet to be improved and enhanced.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a fixing jig suitable for diamond laser cutting, and aims to solve the problems that the roughness of a cutting surface at the tail end of a crystal is increased when a laser cutting machine cuts the crystal in the prior art, so that the quality of the obtained diamond seed crystal is poor and the obtained diamond seed crystal is not satisfactory.
The technical scheme adopted by the invention for solving the technical problem is as follows:
in a first aspect, an embodiment of the present invention provides a fixing jig suitable for diamond laser cutting, including:
a base;
the compressing assembly is detachably connected with the base and comprises a compressing plate used for compressing the diamond, and the compressing plate is opposite to the top surface of the base and has a gap between the compressing plate and the top surface of the base.
As a further improved technical scheme, the pressing assembly comprises a pressing piece and a locking piece, the pressing piece and the locking piece are detachably connected and respectively clamped on two opposite sides of the base, and the pressing plate is arranged on the pressing piece.
As a further improved technical scheme, the pressing piece comprises a base, a first clamping part and the pressing plate, one end of the first clamping part is fixedly connected with one side of the base, one end of the pressing plate is fixedly connected with the top of the base, the locking part comprises a connecting part and a second clamping part, and one end of the second clamping part is fixedly connected with the connecting part;
the connecting part is detachably connected with one side, far away from the first clamping part, of the base, and the first clamping part and the second clamping part are respectively clamped on two opposite sides of the base.
As a further improvement technical scheme, the above-mentioned fixed tool that is applicable to diamond laser cutting still includes:
a screw; the connecting portion are provided with first screw holes, one side of the base, which is close to the connecting portion, is provided with second screw holes, one ends of the screws penetrate through the first screw holes and are arranged in the second screw holes, and the other ends of the screws are arranged on the connecting portion.
As a further improved technical scheme, a fixing rod for fixing the base is arranged on the bottom surface of the base.
As a further improved technical scheme, the top surface of the base is an inclined surface.
As a further improved technical scheme, an included angle between the top surface of the base and the horizontal plane is 0.5-1.0 degrees.
As a further improved technical scheme, the pressing piece, the locking piece and the base are all made of copper.
As a further improved technical solution, the base, the first clamping portion and the pressing plate are integrally formed, and the connecting portion and the second clamping portion are integrally formed.
As a further improved technical scheme, the base abuts against one side of the base.
Compared with the prior art, the embodiment of the invention has the following advantages:
the embodiment of the invention provides a fixing jig suitable for diamond laser cutting, which comprises a base and a pressing assembly, wherein the pressing assembly is detachably connected with the base, the pressing assembly comprises a pressing plate used for pressing a diamond, the pressing plate is opposite to the top surface of the base, and a gap is formed between the pressing plate and the top surface of the base. In the invention, when the diamond to be cut is placed on the fixing jig, the diamond is clamped and fixed through the matching of the pressing plate and the top surface of the base, so that the diamond cannot be automatically cut when being cut to the tail end of the crystal by laser, the roughness of the tail end of the crystal is reduced, and the quality of the cut diamond seed crystal is ensured; meanwhile, in the fixing jig provided by the embodiment of the invention, the upper surface of the adopted base is the inclined surface, the inclined angle of the inclined surface is half of the laser divergence angle, the diamond is placed on the inclined surface and is pressed by the pressing plate, and only one of the two diamonds obtained after the diamond is cut by the laser needs to be subjected to secondary laser cutting.
Drawings
Fig. 1 is a schematic view of a first three-dimensional structure of a fixing jig suitable for diamond laser cutting according to the present invention;
fig. 2 is a schematic diagram of a second three-dimensional structure of a fixing jig suitable for diamond laser cutting according to the present invention;
FIG. 3 is a front view of the base of the present invention;
FIG. 4 is a schematic perspective view of a pressing member according to the present invention;
fig. 5 is a perspective view of the locking member of the present invention.
In the figure: 1. a base; 2. a compression assembly; 201. a compression member; 2011. a base; 2012. a first clamping portion; 2013. a compression plate; 2014. a second screw hole; 202. a locking member; 2021. a connecting portion; 2022. a second clamping portion; 2023. a first screw hole; 3. and (5) fixing the rod.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The diamond has the characteristics of extremely high hardness and strength, ultra-high wear resistance, extremely high thermal conductivity and the like, and is applied to various fields of aerospace, medical treatment, optics, military and the like, the diamond generally grows through diamond seed crystals, MPCVD (microwave plasma chemical vapor deposition) is a common technical means for diamond crystal growth at present, the principle is that reaction gas forms various hydrocarbon activated groups under the excitation of microwaves, the activated groups generate a series of chemical reactions on the seed crystals and gradually generate adsorption, desorption, migration, diffusion and deposition on the surfaces of the seed crystals, and finally the diamond is obtained, so the seed crystals are the precondition for growing the diamond by the MPCVD method. The seed crystal is a small crystal having the same crystal orientation as the desired crystal, and is a seed for growing a single crystal, also called a seed crystal, and the diamond seed crystal can be obtained by cutting a single crystal diamond. In the prior art, a plurality of cutting modes exist for diamond, but the common cutting mode which can meet the process requirements at present is laser cutting, because the roughness of the cutting surface of the diamond seed crystal obtained by the laser cutting is low, in the subsequent process step of seed crystal growth, the hydrocarbon activating group deposited on the surface of the seed crystal is influenced by the roughness of the cutting surface of the seed crystal, if the seed crystal is not polished, the dislocation defect can occur on the diamond film growing at the tail end of the diamond seed crystal, the quality of the obtained diamond is poor, when the roughness is lower, the polishing processing is not needed, the process and market requirements are met better, and the quality of the diamond obtained by the seed crystal growth is higher; however, laser cutting still has certain defects, when the diamond is cut, the tail end of the cutting surface of the seed crystal can automatically fracture and the roughness is extremely high, and laser cannot be adjusted and calibrated because a laser cutting machine is a standard part, so that the invention starts from an external tool and provides a fixed jig suitable for diamond laser cutting to solve the technical problems, such as the following embodiments.
The embodiment is as follows:
please refer to fig. 1-5. Among the fixed tool suitable for diamond laser cutting, including base 1 and compress tightly subassembly 2, compress tightly subassembly 2 with base 1 is detachable to be connected, compress tightly subassembly 2 including the pressure strip 2013 that is used for compressing tightly the diamond, pressure strip 2013 with base 1 top surface sets up relatively and has the clearance between the two.
As shown in fig. 1-3, in this embodiment, the fixed jig suitable for laser cutting of diamond includes a base 1 and a pressing component 2, the base 1 is in a rectangular or square shape, the pressing component 2 is detachably disposed on the base 1, a pressing plate 2013 used for being matched with the base 1 to press the diamond is disposed on the pressing component 2, the pressing plate 2013 on the pressing component 2 is located above the top surface of the base 1, the bottom surface of the pressing plate 2013 is a horizontal plane, a gap with a certain distance is formed between the pressing plate 2013 and the top surface of the base 1, the size of the gap can be adaptively adjusted according to requirements, and the gap is used for reserving a space to place the diamond. Before the diamond is cut, the pressing component 2 can be taken off from the base 1 or the pressing plate 2013 is moved to increase the gap width, then the diamond is placed on the top surface of the base 1, finally the pressing component 2 is fixed on the base 1 again to complete assembly, the diamond is pressed at the bottom of the pressing plate 2013, and the diamond is cut by laser. In the invention, when the diamond to be cut is placed on the fixing jig, the diamond is clamped and fixed through the matching of the pressing plate 2013 and the top surface of the base 1, so that the diamond cannot be automatically cut when being cut to the tail end of the crystal by laser, the roughness at the tail end of the crystal is reduced, and the quality of the cut diamond seed crystal is ensured.
As a further scheme, the pressing assembly 2 includes a pressing member 201 and a locking member 202, the pressing member 201 and the locking member 202 are detachably connected and respectively clamped on two opposite sides of the base 1, and the pressing plate 2013 is disposed on the pressing member 201. Specifically, when the pressing assembly 2 is detached from the base 1, the pressing member 201 and the locking member 202 must be detached first, the pressing plate 2013 on the pressing member 201 is used for pressing a diamond, the locking member 202 is used for being matched with the pressing member 201 and fixed on the base 1, and the pressing member 201 and the locking member are respectively abutted against two opposite sides of the base 1 and clamped on the base 1 together under matching.
As shown in fig. 4-5, as a further scheme, the pressing element 201 includes a base 2011, a first clamping portion 2012 and the pressing plate 2013, one end of the first clamping portion 2012 is fixedly connected to one side of the base 2011, one end of the pressing plate 2013 is fixedly connected to the top of the base 2011, the locking element 202 includes a connecting portion 2021 and a second clamping portion 2022, and one end of the second clamping portion 2022 is fixedly connected to the connecting portion 2021; the connecting portion 2021 is detachably connected to one side of the base 2011 far away from the first clamping portion 2012, the first clamping portion 2012 and the second clamping portion 2022 are respectively clamped on two opposite sides of the base 1, and the first clamping portion 2012 and the second clamping portion 2022 are rectangular metal plates.
In this embodiment, the fixing jig suitable for diamond laser cutting further includes a screw (not shown); the connecting portion 2021 is provided with a first screw hole 2023, one side of the base 2011 close to the connecting portion 2021 is provided with a second screw hole 2014, one end of the screw penetrates through the first screw hole 2023 and is arranged in the second screw hole 2014, and the other end of the screw is arranged on the connecting portion 2021. Specifically, the base 2011 is screwed with the connecting portion 2021 through a screw, internal threads are respectively arranged in the first screw hole 2023 and the second screw hole 2014, when two ends of the screw are respectively located in the first screw hole 2023 and the second screw hole 2014, the base 2011 is fixedly connected with the connecting portion 2021 through the screw, and at this time, the pressing member 201 and the locking member 202 are respectively clamped on two opposite sides of the base 1, when the diamond to be cut needs to be replaced, the screw is only required to be screwed out, then the pressing member 201 is lifted up to place the diamond to be cut, finally, the position of the pressing member 201 is restored, and the screw is screwed in again, so that the first clamping portion 2012 and the second clamping portion 2022 are clamped on the base 1 together, and at this time, the pressing assembly 2 cannot be moved. Furthermore, a rough surface or a line can be arranged on one side of the first clamping part 2012 and the second clamping part 2022 close to the base 1, so as to enhance the friction effect, thereby improving the structural stability between the pressing assembly 2 and the base 1.
As a further scheme, the bottom surface of the base 1 is provided with a fixing rod 3 for fixing the base 1. The fixing jig can be installed by inserting the fixing rod 3 into a corresponding limiting hole (the limiting hole can be a mounting hole formed in the laser cutting instrument). Furthermore, the fixing rod 3 is rectangular, and the corresponding limiting hole is also rectangular. Furthermore, the outer side of the lower end of the fixing rod 3 is provided with an external thread, an internal thread is arranged in a corresponding limiting hole, and after the fixing rod 3 stretches into the limiting hole, the external thread at the lower end and the internal thread in the limiting hole are connected in a threaded manner through rotation, so that the fixing rod 3 is further fixed.
Because the laser that the laser cutting appearance among the prior art used has the angle of divergence, can make upper and lower cutting surface all have inclination when cutting the diamond, because the technology demand, the seed crystal that the diamond cutting obtained generally requires to be regular hexahedron (the diamond that the seed crystal grows and obtains is also regular hexahedron, for example the diamond that is used for cutting also is regular hexahedron), consequently can not have the inclined plane, after the diamond through laser cutting is preliminary cut, still need carry out cutting once respectively just can excise the inclined plane to two blocks of diamonds that obtain, this method is comparatively troublesome, consuming time and work efficiency is low, consequently the invention has provided the fixed tool that is applicable to diamond laser cutting in order to solve above-mentioned problem, specifically as follows:
in this embodiment, the top surface of the base 1 is an inclined surface; and the included angle between the top surface of the base 1 and the horizontal plane is 0.5-1.0 degrees. Specifically, the top surface of the base 1 is a flat surface with a certain inclination angle, because the laser brightness angle in laser cutting on the market is generally 1.4 °, the inclination angle of the inclined surface in this embodiment is 0.7 °, after the diamond is cut by laser, only the upper diamond has an inclination angle, so that after the lower diamond is taken out, the gap between the pressing plate 2013 and the base 1 is readjusted, so that the pressing plate 2013 presses the diamond to be cut for the second time, the cut surface of the upper diamond left after the first laser cutting is placed on the top surface of the base 1, and then the diamond is cut again, so that the diamond seed crystal with a regular shape can be obtained, and therefore, two diamond seed crystals meeting the requirements can be obtained by cutting once after the diamond is cut, and compared with the prior art, one laser cutting is reduced. Consequently, in the fixed tool that this embodiment provided, the upper surface of the base 1 that adopts is the inclined plane, the inclination on this inclined plane is half of the angle that diverges for laser, place the diamond on the inclined plane and compressed tightly by pressure strip 2013, after the diamond is by laser cutting, only one needs to carry out the laser cutting of second time in two diamonds that obtain, consequently compare the cutting mode among the prior art, the number of times of laser cutting has been reduced, processing steps have been saved, it is long when having shortened processing, and then the work efficiency of laser cutting diamond has been improved.
In this embodiment, the pressing member 201, the locking member 202 and the base 1 are made of copper. Since high temperature is generated during laser cutting, heat dissipation can be accelerated by the copper base 1 and the copper pressing member 2.
As a further improved technical solution, the base 2011, the first clamping portion 2012 and the pressing plate 2013 are integrally formed, and the connecting portion 2021 and the second clamping portion 2022 are integrally formed, so that the pressing member 201 and the locking member 202 can be assembled conveniently.
As a further improved technical solution, the base 2011 abuts against one side of the base 1, after the base 2011 abuts against the base 1, the pressing member 201 cannot move towards the base 1, and at this time, three surfaces of the pressing member 2 abut against three different side surfaces of the base 1, so that the structural stability between the two surfaces is enhanced.
The assembly steps of the fixed jig suitable for diamond laser cutting are as follows:
firstly, a base 2011 on the pressing piece 201 is tightly attached to one side of a base 1, a first clamping part 2012 is tightly attached to the other side of the base, and the size of a gap between a pressing plate 2013 and the top surface of the base is adjusted;
secondly, attaching the connecting part 2021 on the locking member 202 to one side of the base 2011 departing from the first clamping part 2012, attaching the second clamping part 2022 to one side of the base 1 departing from the first clamping part 2012, and aligning the first screw hole 2023 with the second screw hole 2014;
and thirdly, screwing the screws into the first screw holes 2023 and the second screw holes 2014, fixedly connecting the pressing piece 201 and the locking piece 202, and clamping the pressing piece and the locking piece together at the side part of the base 1 to finish the assembly.
To sum up, the embodiment of the invention provides a fixing jig suitable for diamond laser cutting, which comprises a base 1 and a pressing component 2, wherein the pressing component 2 is detachably connected with the base 1, the pressing component 2 comprises a pressing plate 2013 used for pressing a diamond, and the pressing plate 2013 is arranged opposite to the top surface of the base 1 and has a gap therebetween. In the invention, when the diamond to be cut is placed on the fixing jig, the diamond is clamped and fixed through the matching of the pressing plate 2013 and the top surface of the base 1, so that the diamond cannot be automatically cut when being cut to the tail end of the crystal by laser, the roughness of the tail end of the crystal is reduced, and the quality of the cut diamond seed crystal is ensured. Meanwhile, in the fixing jig provided by the embodiment of the invention, the upper surface of the adopted base 1 is an inclined surface, the inclined angle of the inclined surface is half of the laser divergence angle, the diamond is placed on the inclined surface and is pressed by the pressing plate 2013, and only one of the two obtained diamonds needs to be subjected to secondary laser cutting after the diamond is subjected to laser cutting, so that compared with a cutting mode in the prior art, the number of times of primary laser cutting is reduced, the processing steps are saved, the processing time is shortened, and the working efficiency of laser cutting of the diamond is further improved.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are for purposes of illustration only and do not denote a single embodiment.
Naturally, the above-mentioned embodiments of the present invention are described in detail, but it should not be understood that the scope of the present invention is limited thereby, and other various embodiments of the present invention can be obtained by those skilled in the art without any inventive work based on the present embodiments, and the scope of the present invention is defined by the appended claims.
Claims (10)
1. The utility model provides a fixed tool suitable for diamond laser cutting which characterized in that includes:
a base;
the compressing assembly is detachably connected with the base and comprises a compressing plate used for compressing the diamond, and the compressing plate is opposite to the top surface of the base and has a gap between the compressing plate and the top surface of the base.
2. The fixing jig suitable for diamond laser cutting of claim 1, wherein the pressing assembly comprises a pressing piece and a locking piece, the pressing piece and the locking piece are detachably connected and respectively clamped on two opposite sides of the base, and the pressing plate is arranged on the pressing piece.
3. The fixing jig suitable for diamond laser cutting according to claim 2, wherein the pressing member comprises a base, a first clamping portion and the pressing plate, one end of the first clamping portion is fixedly connected with one side of the base, one end of the pressing plate is fixedly connected with the top of the base, the locking member comprises a connecting portion and a second clamping portion, and one end of the second clamping portion is fixedly connected with the connecting portion;
the connecting part is detachably connected with one side of the base, which is far away from the first clamping part, and the first clamping part and the second clamping part are respectively clamped on two opposite sides of the base.
4. The fixture suitable for diamond laser cutting according to claim 3, further comprising:
a screw; the connecting portion are provided with first screw holes, one side of the base, which is close to the connecting portion, is provided with second screw holes, one ends of the screws penetrate through the first screw holes and are arranged in the second screw holes, and the other ends of the screws are arranged on the connecting portion.
5. The fixture suitable for diamond laser cutting according to claim 1, wherein the bottom surface of the base is provided with a fixing rod for fixing the base.
6. The fixture suitable for diamond laser cutting according to claim 1, wherein the top surface of the base is an inclined surface.
7. The fixture suitable for diamond laser cutting according to claim 6, wherein the included angle between the top surface of the base and the horizontal plane is 0.5-1.0 °.
8. The fixture suitable for diamond laser cutting according to claim 3, wherein the pressing piece, the locking piece and the base are all made of copper.
9. The fixture suitable for diamond laser cutting according to claim 3, wherein the base is integrally formed with the first clamping portion and the pressing plate, and the connecting portion is integrally formed with the second clamping portion.
10. The fixture suitable for diamond laser cutting according to claim 3, wherein the base abuts against one side of the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211595289.7A CN115781050A (en) | 2022-12-13 | 2022-12-13 | Fixed tool suitable for diamond laser cutting |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211595289.7A CN115781050A (en) | 2022-12-13 | 2022-12-13 | Fixed tool suitable for diamond laser cutting |
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| CN115781050A true CN115781050A (en) | 2023-03-14 |
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| CN202211595289.7A Pending CN115781050A (en) | 2022-12-13 | 2022-12-13 | Fixed tool suitable for diamond laser cutting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116100169A (en) * | 2023-03-29 | 2023-05-12 | 杭州超然金刚石有限公司 | Diamond laser cutting machine |
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2022
- 2022-12-13 CN CN202211595289.7A patent/CN115781050A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116100169A (en) * | 2023-03-29 | 2023-05-12 | 杭州超然金刚石有限公司 | Diamond laser cutting machine |
| CN116100169B (en) * | 2023-03-29 | 2023-08-04 | 杭州超然金刚石有限公司 | Diamond laser cutting machine |
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