CN115764434A

CN115764434A - Electronic device and method of manufacturing the same

Info

Publication number: CN115764434A
Application number: CN202111031270.5A
Authority: CN
Inventors: 刘丰; 梁英; 郭翔; 于超伟
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-09-03
Filing date: 2021-09-03
Publication date: 2023-03-07

Abstract

An electronic device and a method of manufacturing the same are provided. The electronic equipment comprises an electric connection structure for realizing electric conduction between a first electronic device and a second electronic device. The electrical connection structure includes a first structural member including a conductive material, the first structural member including a first end portion, a second end portion, and a middle portion. The first end portion is closer to the first electronic device than the second end portion. The intermediate portion is located between the first end portion and the second end portion, and at least a portion of the intermediate portion has a cross-sectional area that is less than a maximum cross-sectional area of the first end portion and less than a maximum cross-sectional area of the second end portion. Thus, the electrical connection structure of the present application easily compensates for deformation of the electronic device. Moreover, the impedance of the electric connection structure is easy to adjust, and the impedance consistency of the high-speed link of the electronic equipment at the position of the electric connection structure and other parts of the high-speed link can be realized, so that the link insertion loss is reduced, and the requirement of the electronic equipment on high-speed data transmission is met.

Description

Electronic device and method of manufacturing the same

Technical Field

The present application relates to an electrical connection structure between electronic devices of an electronic apparatus, and a method of manufacturing the electronic apparatus.

Background

Currently, as the development of high-speed electronic equipment at 112Gbps (112 gigabits of data per second) and 224Gbps evolves, the density of electronic devices in the high-speed electronic equipment rises sharply, and at the same time, the high-speed link loss of the electronic equipment needs to be reduced. The loss of the high-speed link mainly includes insertion loss caused by impedance discontinuity parts in the link, such as an electrical connection structure between a chip package and a printed circuit board, an electrical connection structure between printed circuit boards, an electrical connection structure between chip packages, and the like. At these electrical connection structures, different link devices must be electrically connected through structural members, solder joints, pins, or the like to achieve electrical continuity. In high-speed electronic equipment, the morphological characteristics of the electrical connection structures themselves have a crucial influence on the performance of high-speed links.

Fig. 1A is a schematic diagram illustrating a partial structure of an electronic device, in which an electrical connection structure for electrically connecting a first circuit board 10 and a second circuit board 20 by using solder balls 30 is illustrated. As shown in fig. 1A, the electronic apparatus includes a first circuit board 10, a second circuit board 20, and solder balls 30 disposed between the first circuit board 10 and the second circuit board 20. The first circuit board 10 has first pads 10p for soldering the solder balls 30, and the second circuit board 20 has second pads 20p for soldering the solder balls 30. The solder balls 30 are solder balls, and the solder balls 30 are fixed between the first pads 10p and the second pads 20p by reflow soldering, so as to electrically connect the first circuit board 10 and the second circuit board 20. In such a high-speed electronic device, the solder ball 30 is used as an electrical connection structure (solder joint) between circuit boards, but the impedance of the solder ball 30 is low due to the shape of the solder ball 30 itself, and is not matched with the impedance at other parts of the link of the electronic device, and the insertion loss is rapidly increased due to such an impedance discontinuity part, and the requirement of high-speed data transmission of the electronic device cannot be satisfied. In addition, in the case where the first circuit board 10 and the second circuit board 20 are thermally deformed, the solder balls 30 having a small size in the thickness direction T are difficult to compensate for the thermal deformation of the first circuit board 10 and the second circuit board 20, which may cause reliability problems such as solder joints between the circuit boards being broken and dropped. The technique using the solder balls 30 as the electrical connection structure is not only used for electrical connection between circuit boards, but also often used for electrical connection between chip packages and circuit boards, and also cannot meet the requirement of high-speed links of high-speed electronic devices.

Fig. 1B is a schematic diagram showing a partial structure of another electronic device, in which an electrical connection structure for achieving electrical conduction between the first circuit board 10 and the second circuit board 20 by using solder balls 30 in combination with copper pillars 40 is shown. As shown in fig. 1B, the electronic apparatus includes a first circuit board 10, a second circuit board 20, and solder balls 30 and copper pillars 40 disposed between the first circuit board 10 and the second circuit board 20. Similarly to the structure in fig. 1A, the first circuit board 10 has first pads 10p for soldering the solder balls 30, and the second circuit board 20 has second pads 20p for soldering the copper pillars 40. In such a high-speed electronic apparatus, a structural member formed by bonding the solder ball 30 to the copper pillar 40 is used as an electrical connection structure (solder joint) between circuit boards. Although the electrical connection structure has a large dimension in the thickness direction T, which can compensate for thermal deformation of the first circuit board 10 and the second circuit board 20 and improve reliability of solder joints, the copper pillar 40 greatly increases the impedance of the structural member, so that the impedance of the structural member is discontinuous with that of other portions of the link. Moreover, tests show that it is difficult to adjust the impedance of the electrical connection structure by adjusting the size of the electrical connection structure, so that it is difficult to achieve impedance consistency of links in high-speed electronic equipment, and the requirement of high-speed data transmission of the electronic equipment cannot be met.

Disclosure of Invention

In view of the above, an electronic device is provided, in which an electrical connection structure between electronic devices can compensate for deformation of the electronic devices, and impedance consistency between the electrical connection structure and other parts of a link is easily achieved, so as to meet the requirement of high-speed data transmission of the electronic device. A manufacturing method for such an electronic device is also proposed.

Therefore, the following technical scheme is adopted in the application.

In a first aspect, embodiments of the present application provide an electronic apparatus, which includes a first electronic device, a second electronic device, and an electrical connection structure, located between the first electronic device and the second electronic device, for electrically connecting the first electronic device and the second electronic device,

the electrical connection structure is fixed with respect to the first electronic device and the second electronic device, and includes a first structural member including a conductive material, the first structural member including a first end portion, a second end portion, and an intermediate portion, the first end portion being located closer to the first electronic device than the second end portion, the intermediate portion being located between the first end portion and the second end portion, at least a part of the intermediate portion having a cross-sectional area smaller than a maximum cross-sectional area of the first end portion and smaller than a maximum cross-sectional area of the second end portion.

By adopting the technical scheme, compared with the scheme of only adopting the solder balls as the electric connection structure between the electronic devices in the background art, the electric connection structure can be configured to have a longer length, and the deformation of the electronic devices is easily compensated. In addition, the first structural member of the electric connection structure adopts a structure with a thinner middle part and thicker two end parts, so that the impedance of the electric connection structure is easy to adjust, the impedance of the high-speed link of the electronic equipment at the position of the electric connection structure can be consistent with the impedance of other parts of the high-speed link, the link insertion loss is reduced, and the requirement of the electronic equipment on high-speed data transmission is met.

In a possible embodiment according to the first aspect, the first end portion comprises a first cylindrical portion, the second end portion comprises a second cylindrical portion, the intermediate portion comprises an intermediate cylindrical portion, the first cylindrical portion, the second cylindrical portion and the intermediate cylindrical portion are coaxially fixed together, the first cylindrical portion has a cross-sectional area larger than a cross-sectional area of the intermediate cylindrical portion, and the second cylindrical portion has a cross-sectional area larger than a cross-sectional area of the intermediate cylindrical portion.

By adopting the technical scheme, the step structure can be realized between the end part and the middle part to construct the electric connection structure, so that the electric connection structure can be constructed into a dumbbell structure, and the dumbbell structure is easy to manufacture and beneficial to large-scale industrial production. And such a regularly shaped first structural element facilitates quantifying the magnitude of its impedance.

In one possible embodiment according to the first aspect, the first end portion comprises a first taper and the second end portion comprises a second taper, the first taper having a cross-sectional area that decreases towards the middle portion and the second taper having a cross-sectional area that decreases towards the middle portion.

By adopting the technical scheme, the electric connection structure is constructed by forming the tapered shapes at the two end parts, so that the electric connection structure can be constructed into a spindle structure, and the spindle structure is easy to manufacture and beneficial to large-scale industrial production.

In a possible embodiment according to the first aspect, the first tapered portion and the second tapered portion are each in the shape of a circular truncated cone, the intermediate portion comprises an intermediate cylindrical portion, and the first tapered portion, the second tapered portion and the intermediate cylindrical portion are coaxially fixed together.

By adopting the technical scheme, the first structural member is easy to process and manufacture, and is beneficial to large-scale industrial production. And such a regularly shaped first structural element facilitates quantifying the magnitude of its impedance.

In one possible embodiment according to the first aspect, the first tapered portion comprises a first large diameter end and a first small diameter end, the second tapered portion comprises a second large diameter end and a second small diameter end, the diameter of the first large diameter end is equal to the diameter of the second large diameter end, the diameter of the first small diameter end is equal to the diameter of the second small diameter end, and the height of the first tapered portion is equal to the height of the second tapered portion,

the diameter of the middle cylindrical part is smaller than that of the first large-diameter end of the first tapered part, and the diameter of the middle cylindrical part is smaller than that of the second large-diameter end of the second tapered part.

By adopting the technical scheme, the first structural member is easier to process and manufacture, and is beneficial to large-scale industrial production. Furthermore, the first and second tapers are defined to be completely symmetrical in size and shape, without the problem of reverse installation when the first structural member is applied.

In one possible embodiment according to the first aspect, the diameter of the intermediate cylindrical portion is equal to the diameter of the first and second small diameter ends.

By adopting the technical scheme, the first structural member is easier to process and manufacture, and is beneficial to large-scale industrial production.

In one possible embodiment according to the first aspect, the electrical connection structure further comprises a second structure member comprising an electrically conductive material, the second structure member being located between the second electronic device and the first structure member, the second structure member being arranged in series with the first structure member.

By adopting the technical scheme, the function of the electric connection structure for compensating the deformation of the electronic device and easily adjusting the impedance of the electric connection structure can be further exerted, and the first structural member can be matched with different second structural members for use.

In one possible embodiment according to the first aspect,

the second structural member has the same shape as the first structural member; or

The second structural member is in a shape that a central part bulges towards the radial outer side, so that the cross-sectional area of the central part of the second structural member is larger than that of other parts; or

The cross-sectional area of the second structural member is always constant, and the cross-sectional areas of the parts, connected with each other, of the second structural member and the first structural member are equal.

By adopting the technical scheme, the first structural member can be combined with different second structural members to form an electric connection structure, so that the electric connection structure is suitable for different application scenes.

In one possible implementation according to the first aspect, the electronic device further comprises a conductive connection layer containing a solder paste, a copper paste, a conductive ink, and/or a conductive paste.

By adopting the technical scheme, the compensation of the deformation of the first electronic device and the second electronic device by the electric connection structure can be improved under the condition that the electric connection structure ensures that the first electronic device and the second electronic device are reliably electrically conducted.

In one possible embodiment according to the first aspect, the electronic apparatus further includes a third electronic device, and the first structural member is embedded in the third electronic device, and both end surfaces of the first structural member are flush with both side surfaces of the third electronic device.

By adopting the technical scheme, a scheme of combining the first structural member with the electronic device is provided, and the application scene of the technology of the application is expanded.

In one possible implementation manner according to the first aspect, the electronic apparatus further includes a pad that covers both side end faces of the first structural member.

By adopting the above technical solution, in the solution of combining the first structural member with the electronic device, the first structural member is advantageous in connection reliability between the first structural member and other devices as an electrical connection structure.

In one possible embodiment according to the first aspect, the first electronic device is a chip, a wafer, a chip package or a circuit board, and the second electronic device is a chip, a wafer, a chip package or a circuit board.

The application scenario for which the technical scheme of the application is particularly applicable is defined.

In a second aspect, an embodiment of the present application provides a manufacturing method of the above electronic device, where the manufacturing method includes:

a machine-shaping step in which the first structural member is made by machining; and

a first structural member planting step of printing a conductive connection layer on a surface of the first electronic device, disposing one end of the first structural member on the conductive connection layer, and solder-fixing the first structural member to the first electronic device by soldering.

A method for facilitating the planting of a first structural element on an electronic device is presented.

In a possible embodiment according to the second aspect, the machining comprises die casting, cutting or injection molding.

Alternative machining methods are proposed which enable the first structural part to be machined, which can be adapted to different application scenarios.

In one possible embodiment according to the second aspect, the electrically conductive connection layer comprises solder paste.

The conductive connecting layer made of the solder paste is beneficial to reliably realizing the electrical conduction between the first structural component and the first electronic device.

In one possible embodiment according to the second aspect, the manufacturing method further comprises:

a second structural member planting step of, after the first structural member planting step, disposing a second structural member at the other end of the first structural member and fixing the second structural member to the first structural member.

A method of planting a second structure on the basis of the method of planting a first structure on an electronic device is proposed.

In one possible embodiment according to the second aspect, in the second structure planting step, the second structure is fixed to the second electronic device before the second structure is disposed at the other end of the first structure.

For the method of planting the second structure, in an alternative, the second structure and the first structure may be fixed to each other before the second structure is fixed to the second electronic device, to be suitable for different manufacturing scenarios.

In a third aspect, an embodiment of the present application provides a manufacturing method of the above electronic device, where the manufacturing method includes:

a modeling step of making a mold using an insulating material, the mold including an injection hole for making the first structural member, and fixing the mold to the first electronic device such that a predetermined portion of the first electronic device seals one end of the injection hole;

a material injection curing step of injecting a conductive material from the other end of the injection hole, and curing the conductive material injected into the injection hole to form the first structural member; and

a mold removing step of removing the mold after the conductive material is cured, the first structural member being fixed to the first electronic device.

Another method for facilitating the planting of a first structural member on an electronic device is presented.

In one possible embodiment according to the third aspect, the conductive material is cured by reflow, high temperature heating or photo-curing methods.

An alternative to easily curing the conductive material is proposed.

In a fourth aspect, an embodiment of the present application provides a manufacturing method of the above electronic device, where the manufacturing method includes:

a substrate manufacturing step of manufacturing a substrate serving as a third electronic device, the substrate having conductive layers formed on both sides thereof, and a through-hole formed in the substrate;

a hole forming step of forming the through hole into a shape matching the shape of the first structural member, and plating a conductive material on the side wall of the formed through hole;

and a filling and plating step, wherein the through hole is filled with a molding material, and conductive layers which are flush with the conductive layer of the substrate are formed on two sides of the first structural member formed by the molding material by utilizing the plug hole plating technology.

A method of easily integrating a first structural member with an electronic device is proposed.

In one possible embodiment according to the fourth aspect, the manufacturing method further includes a pad forming step in which pads are formed on both sides of the first structural member by etching using the conductive layer.

The pads on both sides of the first structural member enable electrical connection to be made with the other two electronic devices after integration with the electronic devices.

These and other aspects of the present application will be more readily apparent from the following description of the embodiment(s).

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features, and aspects of the application and, together with the description, serve to explain the principles of the application.

Fig. 1A is a schematic diagram showing a partial structure of an electronic apparatus, in which an electrical connection structure for achieving electrical conduction between a first circuit board and a second circuit board by using solder balls is shown.

Fig. 1B is a schematic diagram showing a partial structure of another electronic apparatus, in which an electrical connection structure for achieving electrical conduction between a first circuit board and a second circuit board by bonding a copper post with a solder ball is shown.

Fig. 2 is a schematic diagram showing a partial structure of an electronic apparatus according to a first embodiment of the present application, in which an electrical connection structure of the present application is mainly shown.

Fig. 3 is a schematic diagram showing a partial structure of an electronic apparatus according to a second embodiment of the present application, in which an electrical connection structure of the present application is mainly shown.

Fig. 4 is a schematic diagram showing a partial structure of an electronic apparatus according to a third embodiment of the present application, in which a configuration in which an electrical connection structure of the present application is integrated with a circuit board is mainly shown.

Fig. 5 is a schematic diagram showing a partial structure of an electronic apparatus according to a fourth embodiment of the present application, in which an electrical connection structure of the present application is mainly shown.

Fig. 6 is a schematic diagram showing a partial structure of an electronic apparatus according to a fifth embodiment of the present application, in which an electrical connection structure of the present application is mainly shown.

Fig. 7 is a schematic diagram showing a partial structure of an electronic apparatus according to a sixth embodiment of the present application, in which an electrical connection structure of the present application is mainly shown.

Fig. 8A and 8B are schematic views showing a first manufacturing method for explaining an electronic apparatus according to the present application.

Fig. 9A to 9D are schematic views showing a second manufacturing method for explaining an electronic apparatus according to the present application.

Fig. 10A to 10C are schematic views showing a third manufacturing method for explaining an electronic apparatus according to the present application.

Fig. 11A to 11F are schematic views showing a fourth manufacturing method for explaining an electronic apparatus according to the present application.

Description of the reference numerals

10 first circuit board 10p first land 20 second circuit board 20p second land 30 solder ball 40 copper column T thickness direction

1 first electronic device 1p first land 2 second electronic device 2p second land 3 first structure member 31 first tapered portion 32 second tapered portion 33 middle cylindrical portion 34 first cylindrical portion 35 second cylindrical portion 4 central portion 42 upper end portion 5 conductive connecting layer 6 circuit board 6p land 6c conductive layer 6h through hole M die h1 injection hole.

Detailed Description

Various exemplary embodiments, features and aspects of the present application will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.

The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.

In addition, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present application. It will be understood by those skilled in the art that the present application may be practiced without some of these specific details. In some instances, methods, means, elements well known to those skilled in the art have not been described in detail so as not to obscure the present application.

In the present application, the description of the orientation such as "up" and "down" described in the present application is not intended to limit the use posture of the electrical connection structure of the present application, but is merely for convenience of explanation of the structure.

First, the technical idea of the present application will be explained. In the existing high-speed electronic apparatus, the structure and shape of the electrical connection structure (e.g., solder joint) between two electronic devices are not favorable for achieving the impedance uniformity of the entire link of the electronic apparatus, and the electrical connection structure is also required to have the ability to supplement a certain amount of deformation of the electronic devices. Therefore, the inventors of the present application have made studies and experiments to find that an electrical connection structure including a structural member having a thin middle portion and thick end portions can effectively solve the above-mentioned problems and achieve a desired object.

The following describes the structure of an electronic apparatus according to a first embodiment of the present application.

(Structure of electronic apparatus according to first embodiment of the present application)

As shown in fig. 2, in the present embodiment, an electronic apparatus according to the first embodiment of the present application includes a first electronic device (e.g., a first circuit board), a second electronic device (e.g., a second circuit board), an electrical connection structure, and a conductive connection layer 5. The electric connection structure is fixed relative to the first electronic device and the second electronic device, is positioned between the first electronic device and the second electronic device and is used for realizing electric conduction between the first electronic device and the second electronic device.

In the present embodiment, as shown in fig. 2, the first electronic device is provided with a first pad 1p, and the second electronic device is provided with a second pad 2p opposed to the first pad 1 p. The first pad 1p and the second pad 2p may be printed on the base bodies of the first electronic device and the second electronic device using a conductive material such as a metal.

In the present embodiment, as shown in fig. 2, the electrical connection structure includes a first structural member 3 including a conductive material and a second structural member 4 including a conductive material, and the first structural member 3 and the second structural member 4 are arranged in series in a longitudinal direction of the electrical connection structure.

The first structural member 3 includes a first tapered portion 31 (first end portion), a second tapered portion 32 (second end portion), and an intermediate cylindrical portion 33 (intermediate portion) formed as one body in the length direction of the electrical connection structure, whereby the first structural member 3 is formed as a spindle-shaped structure having both end portions tapered toward the intermediate portion. The first tapered portion 31 and the second tapered portion 32 are both in the shape of a circular truncated cone, which is a rotating body with a central axis, and all cross sections including the central axis are in the shape of the same isosceles trapezoid, and the side edges of the isosceles trapezoid can be straight lines or curved lines. The first structural member 3 is located closer to the first electronic component than the second structural member 4, and the intermediate cylindrical portion 33 is located between the first tapered portion 31 and the second tapered portion 32. The first tapered portion 31, the second tapered portion 32, and the intermediate cylindrical portion 33 are arranged coaxially. In an alternative, the first tapered portion 31, the second tapered portion 32, and the intermediate cylindrical portion 33 may also be configured in a non-coaxial manner.

The first tapered portion 31 is fixed to the first pad 1p by the conductive connection layer 5, and the cross-sectional area of the first tapered portion 31 gradually decreases from the conductive connection layer 5 toward the intermediate cylindrical portion 33. The first tapered portion 31 includes a first large diameter end (end of the circular truncated cone shape having a larger cross-sectional area) and a first small diameter end (end of the circular truncated cone shape having a smaller cross-sectional area). A first large-diameter end of the first tapered portion 31 is fixed to the land 1p of the first electronic device via the conductive connection layer 5, and a first small-diameter end of the first tapered portion 31 is directly fixed to the intermediate cylindrical portion 33. The cross-sectional area of the second tapered portion 32 gradually decreases toward the intermediate cylindrical portion 33. The second tapered portion 32 includes a second large diameter end (the end of the truncated cone shape having the larger cross-sectional area) and a second small diameter end (the end of the truncated cone shape having the smaller cross-sectional area). A second large-diameter end of the second tapered portion 32 is fixed to the second structural member 4, and a second small-diameter end of the second tapered portion 32 is fixed to the intermediate cylindrical portion 33. The intermediate cylindrical portion 33 is located between the first tapered portion 31 and the second tapered portion 32, and the cross-sectional area of the intermediate cylindrical portion 33 is constantly constant from the first tapered portion 31 toward the second tapered portion 32.

The first tapered portion 31, the second tapered portion 32, and the intermediate cylindrical portion 33 are all circular in cross section. The diameter of the first large diameter end of the first tapered portion 31 and the diameter of the second large diameter end of the second tapered portion 32 may be equal, the diameter of the first small diameter end of the first tapered portion 31 and the diameter of the second small diameter end of the second large diameter portion may be equal, and the height (dimension in the above-described length direction) of the first tapered portion 31 and the height (dimension in the above-described length direction) of the second tapered portion 32 may be equal. That is, the first tapered portion 31 and the second tapered portion 32 have a completely symmetrical structure and size. In addition, although in the present embodiment, the diameter of the intermediate cylindrical portion 33 is equal to the diameters of the first and second small diameter ends, in an alternative, it is sufficient if the diameter of the intermediate cylindrical portion 33 is smaller than the diameter of the first large diameter end of the first tapered portion 31 and the diameter of the intermediate cylindrical portion 33 is smaller than the diameter of the second large diameter end of the second tapered portion 32.

In the present embodiment, as shown in fig. 2, the second structural member 4 is located between the second electronic device and the first structural member 3, and the cross-sectional areas of the portions where the second structural member 4 and the first structural member 3 are connected to each other may be equal. Specifically, the second structural member 4 includes a central portion 41, a lower end portion 42, and an upper end portion 43 that are integrally formed. The second structural member 4 is formed in a shape in which the central portion 41 bulges out toward the radial outside, so that the cross-sectional area at the central portion 41 of the second structural member 4 is larger than the cross-sectional areas of both the lower end portion 42 and the upper end portion 43. The cross-sectional area of the lower end portion 42 gradually decreases from the central portion 41 toward the first structural member 3, and the cross-sectional area of the upper end portion 43 gradually decreases from the central portion 41 toward the second pad 2p. It is understood that the second structural member 4 having the above-described shape is actually a final shape formed after solder ball bonding such as a solder ball.

In the present embodiment, as shown in fig. 2, the conductive connection layer 5 is located between the first structural member 3 (specifically, the first tapered portion 31) and the first pad 1p, and is used for realizing stable and reliable electrical conduction between the first structural member 3 and the first pad 1 p. In an alternative, the conductive connection layer 5 may be formed of a conductive material including solder paste, copper paste, conductive ink, and/or conductive paste. In practice, the conductive connection layer 5 may be formed by soldering with a conductive material previously coated on the first pad 1 p.

Therefore, compared with the scheme that only solder balls are adopted as the electric connection structure between the electronic devices in the background art, the length of the electric connection structure is larger, and the deformation of the electronic devices can be effectively compensated. Moreover, the first structural member 3 adopts a spindle structure with a middle cylindrical part and two side tapered parts, so that the impedance of the electric connection structure is easy to adjust, the impedance consistency of the high-speed link of the electronic equipment at the electric connection structure part and other parts of the high-speed link can be realized, the link insertion loss is reduced, and the requirement of the electronic equipment on high-speed data transmission is met. And the electric connection structure has a specific structure which is easy to process, and is beneficial to large-scale industrial production.

The following describes the structure of an electronic apparatus according to a second embodiment of the present application.

(Structure of electronic apparatus according to second embodiment of the present application)

As shown in fig. 3, the electrical connection structure of the electronic apparatus according to the second embodiment of the present application is substantially the same as that of the electronic apparatus according to the first embodiment of the present application, and the difference therebetween will be mainly described below.

In the present embodiment, as shown in fig. 3, the second structural member 4 is arranged in series with the first structural member 3, but the shape of the second structural member 4 is different from that of the first embodiment, the second structural member 4 has a cylindrical shape whose cross-sectional area is constant, and an example of the second structural member 4 may be a copper pillar or the like. The cross-sectional area of the second structural member 4 is equal to the cross-sectional area at the second large-diameter end of the second tapered portion 32 of the first structural member 3, which facilitates the fabrication of the entire electrical connection structure. Although the structure of the second structural member 4 is different from that of the first embodiment, the present embodiment can achieve the same effects as the first embodiment. It is understood that the first structural member 3 may be used in combination with other structural members of various shapes, based on the inclusion of the first structural member 3.

The following describes the structure of an electronic apparatus according to a third embodiment of the present application.

(Structure of electronic apparatus according to third embodiment of the present application)

As shown in fig. 4, the electrical connection structure of the electronic apparatus according to the three embodiments of the present application is substantially the same as that of the electronic apparatus according to the first embodiment of the present application, and the difference therebetween is mainly described below.

In the present embodiment, as shown in fig. 4, the electrical connection structure is integrated with a third electronic device (e.g., the circuit board 6). Specifically, an electrical connection structure is buried in the circuit board 6, the electrical connection structure including the spindle-shaped first structural member 3. Both side end surfaces of the first structural member 3 are flush with both side surfaces of the circuit board 6. The electronic apparatus further includes a pad 6p, and the pad 6p covers both end surfaces of the first structural member 3, and can be electrically connected to other electronic devices through the pad 6p. The integration of the electrical connection structure into the circuit board 6 also enables an easy impedance adjustment, so that the link impedance of the high-speed electronic device can be kept as uniform as possible.

The following describes the structure of an electronic apparatus according to a fourth embodiment of the present application.

(Structure of electronic apparatus according to fourth embodiment of the present application)

In the present embodiment, as shown in fig. 5, an electrical connection structure of an electronic apparatus according to a fourth embodiment of the present application includes a first structural member 3 containing a conductive material. The first structural member 3 includes a first cylindrical portion 34 (first end portion), a second cylindrical portion 35 (second end portion), and an intermediate cylindrical portion 33 (intermediate portion) which are formed integrally, whereby the first structural member 3 is formed in a dumbbell structure in which both end portions and the intermediate portion constitute a step structure. The first cylindrical portion 34, the second cylindrical portion 35, and the intermediate cylindrical portion 33 each have a cylindrical shape. The intermediate cylindrical portion 33 is located between the first cylindrical portion 34 and the second cylindrical portion 35, and the first cylindrical portion 34 is located on the side of the first electronic component than the second cylindrical portion 35 after the electrical connection structure is mounted in place. The cross-sectional area of the first cylindrical portion 34 and the cross-sectional area of the second cylindrical portion 35 are both larger than the cross-sectional area of the intermediate cylindrical portion 33, and the cross-sectional areas of both the first cylindrical portion 34 and the second cylindrical portion 35 are equal. The first cylindrical portion 34, the second cylindrical portion 35, and the intermediate cylindrical portion 33 are coaxially arranged. In an alternative, the first cylindrical portion 34, the second cylindrical portion 35, and the intermediate cylindrical portion 33 may also be configured in a non-coaxial manner.

Therefore, compared with the scheme that only the solder balls are adopted as the electric connection structure between the electronic devices in the background art, the length of the electric connection structure is larger, and the deformation of the electronic devices can be effectively compensated. Moreover, since the first structural member 3 has a dumbbell structure in which the middle portion is a thin cylindrical portion and the two end portions are thick cylindrical portions, it is easy to adjust the impedance of the electrical connection structure and quantify the size of the barrier, and it is possible to achieve the impedance consistency of the high-speed link of the electronic device at the electrical connection structure portion and other portions of the high-speed link, thereby reducing the link insertion loss and satisfying the requirements of the electronic device for high-speed data transmission. And the electric connection structure has a specific structure which is easy to process, and is beneficial to large-scale industrial production.

The following describes the structure of an electronic apparatus according to a fifth embodiment of the present application.

(Structure of electronic apparatus according to fifth embodiment of the present application)

In the present embodiment, as shown in fig. 6, the electrical connection structure of the electronic apparatus according to the fifth embodiment of the present application is substantially the same as that of the electronic apparatus according to the first embodiment of the present application, and the difference therebetween will be mainly described below.

In the present embodiment, as shown in fig. 6, the electrical connection structure includes a first structural member 3 containing a conductive material and a second structural member 4 containing a conductive material. The first structural member 3 includes a first cylindrical portion 34 and a first tapered portion 31 (the first cylindrical portion 34 and the first tapered portion 31 constitute a first end portion), a second cylindrical portion 35 and a second tapered portion 32 (the second cylindrical portion 35 and the second tapered portion 32 constitute a second end portion), and an intermediate cylindrical portion 33 (an intermediate portion) which are formed in one body. The sections are arranged in a coaxial manner, in the alternative, they may also be arranged in a non-coaxial manner. The first tapered portion 31 is formed in a circular truncated cone shape, a first large diameter end of the first tapered portion 31 is connected to the first cylindrical portion 34, a cross-sectional area of the first large diameter end is equal to a cross-sectional area of the first cylindrical portion 34, a first small diameter end of the first tapered portion 31 is connected to the intermediate cylindrical portion 33, and a cross-sectional area of the first small diameter end is equal to a cross-sectional area of the intermediate cylindrical portion 33. The second tapered portion 32 has a second large-diameter end connected to the second cylindrical portion 35, the second large-diameter end having a cross-sectional area equal to that of the second cylindrical portion 35, a second small-diameter end connected to the intermediate cylindrical portion 33, the second small-diameter end having a cross-sectional area equal to that of the intermediate cylindrical portion 33. In the present embodiment, the first end portion and the second end portion of the first structural member 3 are formed in a completely symmetrical shape in structure and size. The second structural member 4 has the same structure as the second structural member 4 of the first embodiment, and the second structural member 4 is arranged in series with the first structural member 3. Thus, the electrical connection structure of the present embodiment can exert the same effects as those of the first embodiment.

The following describes a structure of an electronic apparatus according to a sixth embodiment of the present application.

(Structure of electronic apparatus according to sixth embodiment of the present application)

As shown in fig. 7, the electrical connection structure of an electronic apparatus according to the fifth embodiment of the present application includes a first structural member 3 and a second structural member 4 having the same structure, and the first structural member 3 and the second structural member 4 are arranged in series. In the present embodiment, the first structural member 3 and the second structural member 4 each have the same shape as the first structural member 3 of the first embodiment. Thus, the electrical connection structure of the present embodiment can also exhibit the same effects as those of the first embodiment.

Several specific structures of the electrical connection structure of the electronic device according to the present application have been described above, and a method of manufacturing the electronic device according to the present application is described below.

(first manufacturing method of electronic device according to the present application)

In a first manufacturing method, the manufacturing method includes a machine-shaping step, a first structural member planting step, and a second structural member planting step.

In the machine shaping step, the first structural member 3 having a spindle shape is produced by, for example, machining. Machining includes, but is not limited to, die casting, cutting, or injection molding, among others.

In the first structural member planting step, as shown in fig. 8A, a conductive connection layer 5 (made of, for example, solder paste or other flux) is printed on a surface of a first electronic device 1 (for example, a first circuit board), then one end of a first structural member 3 is disposed on the conductive connection layer 5, and the first structural member 3 is solder-fixed to the first electronic device 1 via the conductive connection layer 5 by means of soldering such as reflow soldering.

In the second structural member planting step, as shown in fig. 8B, after the first structural member planting step, the second structural member 4 such as a solder ball is disposed at the other end of the first structural member 3, and the second structural member 4 is fixed to the first structural member 3. The second structural member 4 may be fixed to the first structural member 3 by welding, low temperature ball-planting technique, or laser ball-planting technique.

The assembly completed with the above steps may be finally mounted to a second electronic device (e.g., a second circuit board), so that an electrical connection structure between the two electronic devices is finally formed with the solder ball bonded spindle.

It is understood that the second structural member 4 such as a solder ball shown in fig. 8B may take the shape of the second structural member 4 shown in fig. 2, i.e., a drum shape, after the second electronic device and the first electronic device are connected together via the above-described electrical connection structure.

A second manufacturing method of the electronic device according to the present application is explained below.

(second manufacturing method of electronic device according to the present application)

In the second manufacturing method, the manufacturing method also includes a machine-shaping step, a first structural member planting step, and a second structural member planting step.

In the first structural member planting step, as shown in fig. 9A, a conductive connection layer 5 (made of, for example, solder paste or other flux) is printed on the first land 1p of the first electronic device 1 (for example, the first circuit board), then, as shown in fig. 9B, one end of the first structural member 3 is disposed on the conductive connection layer 5, and the first structural member 3 is solder-fixed to the first electronic device 1 via the conductive connection layer 5 by means of soldering such as reflow soldering.

In the second structure mounting step, as shown in fig. 9C, after the first structure mounting step and before the second structure 4 is mounted on the first structure 3, the second structure 4 such as a solder ball is fixed to the second electronic device 2 (e.g., a second circuit board), then solder is sprayed on the other end of the first structure 3, and the second structure 4 is disposed on the other end of the corresponding first structure 3, and the second structure 4 is fixed to the first structure 3.

Thus, as shown in fig. 9D, the steps are finally completed to form the solder ball bonded spindle to form an electrical connection structure between two electronic devices.

A third method of manufacturing an electronic device according to the present application is explained below.

(third manufacturing method of electronic device according to the present application)

In a third method of manufacture, the method of manufacture includes a modeling step, a material injection curing step, and a demolding step.

In the molding step, as shown in fig. 10A, a mold M is made of an insulating material such as polyimide, and the mold M includes an injection hole h1 corresponding to the shape of the first structural member 3. The mold M is mounted on the first electronic device 1 (e.g., first circuit board) and fixed together with the first electronic device 1 by bonding or the like such that the first land 1p of the first electronic device 1 seals one end of the injection hole h1. Solder paste, flux, or the like is then printed on the first pads 1 p.

In the material injection curing step, as shown in fig. 10B, a conductive material (e.g., conductive paste, copper paste, or sintered conductive powder) is injected from the other end of the injection hole h1, and the conductive material is brushed flat against the surface of the mold M. Then, the conductive material injected into the injection hole h1 is cured by a method such as reflow, high-temperature heating, or photo-curing to form the first structural member 3 having a spindle shape.

In the mold removing step, as shown in fig. 10C, the mold M is removed after the conductive material is cured, and the first structural member 3 is molded and fixed to the first electronic device 1.

A fourth manufacturing method of the electronic device according to the present application is explained below.

(fourth manufacturing method of electronic device according to the present application)

In a fourth manufacturing method, the manufacturing method includes a substrate making step, a hole forming step, a fill-plating step, and a pad forming step.

In the substrate fabrication step, as shown in fig. 11A, a substrate (circuit board 6, which may also be referred to as an optical core board) serving as a third electronic device is fabricated, and conductive layers 6c are formed on both side surfaces of the substrate. Further, as shown in fig. 11B, a through hole 6h penetrating in the thickness direction of the substrate is formed in the substrate.

In the hole forming step, as shown in fig. 11C, depth-controlling tapered portions are processed at both end portions of the through-hole 6h with a drill having a special angle, thereby forming the through-hole 6h into a shape matching the spindle shape of the first structural member 3, and a conductive material is plated on the side wall of the formed through-hole 6h by a method such as copper deposition plating.

In the filling and plating step, as shown in fig. 11D, the molding material is filled into the through-hole 6h to form the first structural member 3 having a spindle shape. Further, as shown in fig. 11E, conductive layers 6c flush with the substrate are formed on both sides of the first structural member 3 formed of the molding material by the via hole plating technique.

In the pad forming step, as shown in fig. 11F, pads 6p are formed on both sides of the first structural member 3 with the conductive layer 6c by etching.

The assembly completed with the above steps can be finally electrically connected to other electronic devices.

The foregoing has outlined exemplary embodiments of the detailed description of the present application and related modifications, as well as additional descriptions that follow.

i. It can be understood that the electronic device of the present application may be an electronic device such as a switch or a router, and may also be applied to a high-rate data transmission scenario such as a data center cluster.

in the above embodiments, different embodiments and modifications thereof capable of achieving the object of the present application are described, and it is understood that aspects and features of the embodiments and the modifications thereof may be combined with each other to form a new aspect if there is no contradiction.

The structural member of the electrical connection structure of the present application may be made of metal paste, conductive powder, and conductive sintered material to have conductive properties. The material of the structural member of the electrical connection structure may be rigid or elastic.

it can be understood that the electronic device according to the present application can achieve the consistency of impedance in the link by using the electrical connection structure having the special structure, ensure the transmission speed of data in the link, and reduce the insertion loss.

v. the manufacturing methods in the above specific embodiments are all directed to manufacturing methods of an electrical connection structure including a spindle-shaped first structural member, and it is understood that, for an electrical connection structure including a first structural member including other shapes (for example, a dumbbell shape), a similar manufacturing method may also be employed for manufacturing.

The electrical connection structure of the electronic device according to the present invention includes a structure body having a thin middle portion and thick end portions, and thus can easily realize impedance matching of the link of the electronic device according to the present invention, and is not limited to the specific shape described in the above specific embodiment.

It is to be understood that the electrical connection structure of the present application can be used for electronic devices with relatively large size (such as chip packages and circuit boards) and also can be used for electronic devices with relatively small size (such as chips and wafers, where chips refer to unpackaged bare chips and wafers can be semiconductor boards before and after dicing). That is, the first electronic device may be a chip, a wafer, a chip package, or a circuit board, and the second electronic device may be a chip, a wafer, a chip package, or a circuit board. However, the third electronic device is most suitably in the form of a circuit board in the solution integrated with the electrical connection structure of the present application.

While the present application has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed application, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

The foregoing description of the embodiments of the present application has been presented for purposes of illustration and description and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. An electronic device, comprising a first electronic device, a second electronic device, and an electrical connection structure, wherein the electrical connection structure is located between the first electronic device and the second electronic device for electrically connecting the first electronic device and the second electronic device,

2. The electronic device of claim 1, wherein the first end portion comprises a first cylindrical portion, the second end portion comprises a second cylindrical portion, the middle portion comprises a middle cylindrical portion, the first cylindrical portion, the second cylindrical portion, and the middle cylindrical portion are coaxially secured together, a cross-sectional area of the first cylindrical portion is larger than a cross-sectional area of the middle cylindrical portion, and a cross-sectional area of the second cylindrical portion is larger than a cross-sectional area of the middle cylindrical portion.

3. The electronic device of claim 1, wherein the first end portion comprises a first taper and the second end portion comprises a second taper, the first taper tapering in cross-sectional area toward the middle portion and the second taper tapering in cross-sectional area toward the middle portion.

4. The electronic device of claim 3, wherein the first tapered portion and the second tapered portion are each in the shape of a circular truncated cone, the middle portion includes a middle cylindrical portion, and the first tapered portion, the second tapered portion, and the middle cylindrical portion are coaxially fixed together.

5. The electronic device of claim 4, wherein the first tapered portion includes a first large diameter end and a first small diameter end, wherein the second tapered portion includes a second large diameter end and a second small diameter end, wherein the first large diameter end has a diameter equal to the diameter of the second large diameter end, wherein the first small diameter end has a diameter equal to the diameter of the second small diameter end, and wherein the first tapered portion has a height equal to the height of the second tapered portion,

6. The electronic device of claim 5, wherein a diameter of the intermediate cylindrical portion is equal to a diameter of the first and second small diameter ends.

7. The electronic device according to any one of claims 1 to 6, wherein the electrical connection structure further comprises a second structural member comprising a conductive material, the second structural member being located between the second electronic component and the first structural member, the second structural member being arranged in series with the first structural member.

8. The electronic device of claim 7,

The cross-sectional area of the second structural member is always unchanged, and the cross-sectional areas of the parts, connected with each other, of the second structural member and the first structural member are equal.

9. The electronic device of claim 7, further comprising a conductive connection layer comprising a solder paste, a copper paste, a conductive ink, and/or a conductive paste.

10. The electronic apparatus according to any one of claims 1 to 6, further comprising a third electronic device, wherein the first structural member is embedded in the third electronic device, and both side end surfaces of the first structural member are flush with both side surfaces of the third electronic device.

11. The electronic apparatus according to claim 10, further comprising a pad covering both side end faces of the first structural member.

12. The electronic device of any of claims 1-6, wherein the first electronic device is a chip, a wafer, a chip package, or a circuit board, and the second electronic device is a chip, a wafer, a chip package, or a circuit board.

13. A method of manufacturing the electronic device according to any one of claims 1 to 12, characterized in that the method of manufacturing comprises:

14. The method of manufacturing an electronic device according to claim 13, wherein the machining includes die casting, cutting, or injection molding.

15. The method of manufacturing an electronic device according to claim 13, wherein the conductive connection layer contains solder paste.

16. The method for manufacturing an electronic device according to any one of claims 13 to 15, further comprising:

17. The method of manufacturing an electronic device according to claim 16, wherein in the second structural member planting step, the second structural member is fixed to the second electronic component before the second structural member is disposed at the other end of the first structural member.

18. A method of manufacturing the electronic device according to any one of claims 1 to 12, characterized in that the method of manufacturing comprises:

a material injection curing step of injecting a conductive material from the other end of the injection hole and curing the conductive material injected into the injection hole to form the first structural member; and

19. The method for manufacturing an electronic device according to claim 18, wherein the conductive material is cured by a reflow, high-temperature heating, or photo-curing method.

20. A method of manufacturing an electronic device according to claim 10 or 11, the method comprising:

21. The method according to claim 20, further comprising a pad formation step in which pads are formed on both sides of the first structural member with the conductive layer by etching.