CN115764077A

CN115764077A - Electronic equipment and method for improving battery performance

Info

Publication number: CN115764077A
Application number: CN202211523796.XA
Authority: CN
Inventors: 王阳; 殷进超
Original assignee: Guangdong Genius Technology Co Ltd
Current assignee: Guangdong Genius Technology Co Ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-03-07

Abstract

The application relates to the technical field of new energy, in particular to an electronic device and a method for improving performance of a battery. An electronic device, the electronic device comprising: a housing; a battery located in the housing; a temperature detection element; the mainboard is arranged in the shell and is electrically connected with the battery, and the temperature detection element is electrically connected with the mainboard; and the heat conduction piece is arranged on the mainboard and used for conducting the heat of the mainboard to the battery when the temperature of the battery is lower than a temperature threshold value. The application provides an electronic equipment, self generate heat and heat the battery when accessible mainboard operation, like this, need not additionally to set up heating devices such as resistance wire in electronic equipment and heat the battery, therefore, on the one hand, be convenient for carry out miniaturized design to electronic equipment, on the other hand, can also reduce electronic equipment's cost. In another aspect, battery power may also be conserved.

Description

Electronic equipment and method for improving battery performance

Technical Field

The application relates to the technical field of new energy, in particular to an electronic device and a method for improving performance of a battery.

Background

In recent years, electronic devices such as smartphones and smartwatches are increasingly integrated into the lives of everyone. With the increasing adhesion of people to electronic devices, the requirements on the performance of electronic devices are higher and higher.

When the electronic device is in a low-temperature environment, which causes a battery in the electronic device to be in the low-temperature environment, a direct Current impedance (DCR) of the battery is significantly increased, and in this case, when the electronic device opens some high-voltage applications such as a camera or a display screen, a situation that the camera cannot normally shoot or the display screen cannot normally display occurs, which seriously affects the use experience of the electronic device.

On the basis, in the related art, a heating device such as a resistance wire is usually arranged in the electronic device to heat the battery, however, when the heating device is arranged in the electronic device, on one hand, the heating device occupies the space of the electronic device, which results in that the electronic device cannot be miniaturized, and on the other hand, the extra arrangement of the heating device also increases the cost of the electronic device.

Disclosure of Invention

The application discloses an electronic device and a method for improving battery performance, which can realize miniaturization design of the electronic device and reduce the cost of the electronic device.

In order to achieve the above object, in a first aspect, the present application discloses an electronic device comprising:

a housing;

a battery located in the housing;

a temperature detecting element in the case for detecting a temperature of the battery;

the mainboard is arranged in the shell and is electrically connected with the battery, and the temperature detection element is electrically connected with the mainboard; and

the heat conduction piece is arranged on the mainboard and used for conducting heat of the mainboard to the battery when the temperature of the battery is lower than a temperature threshold value.

Since the temperature detection element and the battery are both located in the case, the temperature of the battery can be detected by the temperature detection element. After the temperature of battery is detected to temperature detecting element, because the heat-conduction spare sets up on the mainboard, consequently, when the temperature of battery is less than the temperature threshold, the heat-conduction spare can be with heat conduction to battery on the mainboard, make the temperature of battery rise gradually, and then can avoid the temperature of battery to hang down and lead to the condition emergence that the DCR (direct Current Resistance) of battery is showing to increase, thereby can avoid when electronic equipment opens some high voltage application such as camera or display screen, the condition emergence that the camera can't normally shoot or the unable normal demonstration of display screen appears, can promote electronic equipment's use and experience.

Because the mainboard is at the in-process of operation, can produce the phenomenon of generating heat usually, this application sets up on the mainboard through making heat conduction spare, and make when the battery temperature is less than the temperature threshold, heat conduction to the battery through heat conduction spare with the mainboard, also be, self is generated heat and is heated the battery when the accessible mainboard moves, like this, need not additionally to set up heating devices such as resistance wire in electronic equipment and heat the battery, therefore, on the one hand, be convenient for carry out miniaturized design to electronic equipment, on the other hand, electronic equipment's cost can also be reduced. In yet another aspect, battery power may be conserved.

Optionally, the thermal conductor is an SMA element.

When the heat conduction piece is the SMA piece, the stability of the heat conduction piece can be ensured because the SMA piece technology is mature.

Optionally, the SMA piece is an SMA sheet, the SMA sheet includes a first surface and a second surface that are disposed opposite to each other, the first surface is disposed on the main board, the second surface is disposed opposite to the battery, the main board is configured to control the second surface to contact with the battery when the temperature of the battery is lower than a temperature threshold value, so as to conduct heat of the main board to the battery, and control the second surface to disconnect from the battery when the temperature of the battery is higher than or equal to the temperature threshold value.

Through making the second surface set up with the battery relatively, the first surface sets up in the mainboard, and the second surface sets up with the battery relatively, and the mainboard can be when the temperature of battery is less than the temperature threshold value control second surface and battery contact, like this, can be so that SMA spare and the area of contact of battery great, so set up, on the one hand, can be better with heat conduction to the battery that the mainboard produced, on the other hand, also can make being heated more evenly of each position department of battery.

In a second aspect, the present application discloses a method for improving battery performance, where the method is applied to an electronic device as recited in any one of the first aspects, and the method includes:

acquiring the temperature of the battery;

if the temperature of the battery is lower than the temperature threshold value, the heat of the mainboard is controlled to be conducted to the battery through the heat conduction piece.

First, the temperature of the battery can be acquired, after the temperature of the battery is acquired, whether the temperature of the battery is lower than a temperature threshold value can be judged according to the temperature of the battery, when the temperature of the battery is lower than the temperature threshold value, the mainboard can control the heat conduction piece to conduct heat on the mainboard to the battery through the heat conduction piece, so that the temperature of the battery is gradually increased, the situation that the DCR (direct Current Resistance) of the battery is remarkably increased due to the fact that the temperature of the battery is too low can be avoided, the situation that the camera cannot normally shoot or the display screen cannot normally display when the electronic equipment opens some high-voltage applications such as the camera or the display screen can be avoided, and the use experience of the electronic equipment can be improved.

Optionally, if the temperature of the battery is lower than a temperature threshold, controlling to conduct heat of the main board to the battery through the thermal conductor includes:

and if the temperature of the battery is lower than the temperature threshold, controlling the target device of the mainboard to operate so that the temperature of the mainboard is higher than or equal to the temperature threshold, and controlling the heat of the mainboard to be transmitted to the battery through the heat conduction piece.

Firstly, when the temperature of the battery is lower than the temperature threshold, the operation of a target device of the mainboard can be controlled, the target device can generate heat in the operation process of the target device, the temperature of the mainboard can be higher than or equal to the temperature threshold by the heat generated by the target device, and when the temperature of the mainboard is higher than or equal to the temperature threshold, the heat of the mainboard can be conducted to the battery through the heat conduction piece. So set up, can avoid because the temperature of mainboard is less than the condition emergence that temperature threshold can't heat for the battery.

Optionally, if the temperature of the battery is lower than the temperature threshold, controlling the deformable thermal conductor to be in contact with the battery includes:

if the temperature of the battery is lower than the temperature threshold value, judging whether the deformable heat conduction piece is in contact with the battery or not;

controlling the deformable thermal conductor to be in contact with the battery when the deformable thermal conductor is disconnected from the battery.

When the temperature of the battery is lower than the temperature threshold value, whether the deformable heat conduction piece is in contact with the battery is judged firstly, and when the deformable heat conduction piece is disconnected from the battery, the deformable heat conduction piece is controlled to be in contact with the battery. Compared with the mode that whether the deformable heat conduction piece is in contact with the battery or not is not judged, and the deformable heat conduction piece is directly controlled to be in contact with the battery, the situation that the deformable heat conduction piece is repeatedly controlled to be in contact with the battery can be avoided.

Optionally, the controlling the deformable thermal conductor to be in contact with the battery if the temperature of the battery is lower than the temperature threshold comprises:

when the temperature of the battery is lower than the temperature threshold value, acquiring the residual electric quantity of the battery;

when the residual capacity is smaller than a capacity threshold value, controlling the deformable heat conduction piece to be in contact with the battery.

Since the increase of the DCR of the battery is related to the remaining capacity of the battery in addition to the temperature of the battery. In general, in some cases, although the temperature of the battery is lower than the temperature threshold, the DCR of the battery does not increase sharply and the performance of the battery is not greatly affected due to the high remaining capacity of the battery. Therefore, when the temperature of the battery is lower than the temperature threshold, the remaining capacity of the battery can be further acquired. When the residual capacity is smaller than the capacity threshold value, the thermal radiation heating element is controlled to start and heat the battery. Therefore, the situation that the deformable heat conduction piece wastes the electric quantity of the battery in the deformation process can be avoided by controlling the deformable heat conduction piece to be in contact with the battery when the residual electric quantity is larger than or equal to the electric quantity threshold value.

Optionally, if the temperature of the battery is lower than a temperature threshold, controlling the target device of the motherboard to operate so that the temperature of the motherboard is higher than or equal to the temperature threshold includes:

acquiring environmental parameters, wherein the environmental parameters comprise one or more of environmental temperature and environmental heat conductivity coefficient;

determining the operating power of the target device according to the environmental parameters;

controlling the target device to operate at the operating power such that the temperature of the motherboard is greater than or equal to the temperature threshold.

The operating power of the target device is determined according to the environmental parameters, so that the temperature rise speeds of the battery at different environmental temperatures are approximately the same, and the performance stability of the battery can be better ensured.

Optionally, the method further comprises:

and if the temperature of the battery is higher than or equal to the temperature threshold value, controlling the heat of the mainboard to stop being conducted to the battery through the heat conduction piece.

When the temperature of the battery is higher than or equal to the temperature threshold value, the heat of the main board is controlled to stop being conducted to the battery through the heat conduction piece. Therefore, on one hand, the purpose of saving electric quantity can be achieved, and on the other hand, the situation that the performance of the battery is reduced due to overhigh temperature of the battery can be avoided.

Compared with the prior art, the beneficial effect of this application lies in:

since both the temperature detection element and the battery are located in the case, the temperature of the battery can be detected by the temperature detection element. After the temperature of battery is detected to temperature detecting element, because the heat-conducting piece sets up on the mainboard, consequently, when the temperature of battery is less than the temperature threshold value, the heat-conducting piece can be with heat conduction to battery on the mainboard, make the temperature of battery rise gradually, and then can avoid the temperature of battery to hang down the condition that leads to the DCR (direct Current Resistance) of battery to show to increase to take place, thereby can avoid when electronic equipment opens some high voltage applications such as camera or display screen, the condition that the camera can't normally shoot or the unable normal demonstration of display screen takes place for the appearance, can promote electronic equipment's use experience.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure;

FIG. 2 isbase:Sub>A cross-sectional view of the electronic device of FIG. 1 at location A-A (the thermal conductor is in contact with the battery);

FIG. 3 isbase:Sub>A cross-sectional view of the electronic device of FIG. 1 at location A-A (with the thermal conductor disconnected from the battery);

fig. 4 is a schematic structural diagram of a battery provided in an embodiment of the present application;

FIG. 5 isbase:Sub>A cross-sectional view of another electronic device provided in an embodiment of the present application at location A-A (thermal conductor in contact with battery);

FIG. 6 isbase:Sub>A cross-sectional view of yet another electronic device provided in an embodiment of the present application at location A-A (thermal conductor in contact with battery);

fig. 7 is a flowchart of a method for improving battery performance according to an embodiment of the present disclosure;

fig. 8 is a flowchart of another method for improving battery performance according to an embodiment of the present disclosure.

Description of the main reference numerals

1-a shell;

2-a battery;

3-a temperature detection element;

4, a main board;

5-a heat conductor; 51-a first surface; 52-a second surface;

6-screen;

100-an electronic device.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the present application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as the case may be.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Moreover, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific type and configuration may or may not be the same), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solutions of the present application will be further described with reference to the following specific embodiments and accompanying drawings.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present disclosure. Fig. 2 isbase:Sub>A cross-sectional view of the electronic device 100 of fig. 1 atbase:Sub>A locationbase:Sub>A-base:Sub>A.

Referring to fig. 1 and 2, the electronic device 100 includes: the battery pack includes a case 1, a battery 2, a temperature detection element 3, a main board 4, and a heat conductor 5. Wherein the battery 2 is located in the housing 1. A temperature detection element 3 is located in the case 1 for detecting the temperature of the battery 2. The main board 4 is disposed in the housing 1 and electrically connected to the battery 2, and the temperature detecting element 3 is electrically connected to the main board 4. The heat conductor 5 is disposed on the main board 4 and is used for conducting heat of the main board 4 to the battery when the temperature of the battery 2 is lower than a temperature threshold value.

In the embodiment of the present application, since the temperature detection element 3 and the battery 2 are both located in the case 1, the temperature of the battery 2 can be detected by the temperature detection element 3. After temperature detecting element 3 detects the temperature of battery 2, because heat conduction spare 5 sets up on mainboard 4, consequently, when the temperature of battery 2 is less than the temperature threshold, heat conduction spare 5 can be with heat conduction to battery 2 on mainboard 4, make the temperature of battery 2 rise gradually, and then can avoid the temperature of battery 2 to hang down the condition that leads to the DCR (direct Current Resistance) of battery to show to increase to take place, thereby can avoid when electronic equipment opens some high voltage applications such as camera or display screen, the condition that the camera can't normally shoot or the display screen can't normally show appears and takes place, can promote electronic equipment's use experience.

It is worth noting that, because the mainboard 4 usually generates heat in the operation process, the heat conduction piece 5 is arranged on the mainboard 4, and when the temperature of the battery is lower than the temperature threshold value, the heat conduction piece 5 conducts the heat of the mainboard 4 to the battery, that is, the battery 2 is heated by the heat generated by the mainboard 4 when the mainboard 4 operates, so that the battery is not required to be additionally heated by heating devices such as a resistance wire in the electronic equipment, and therefore, on one hand, the electronic equipment is conveniently miniaturized, and on the other hand, the cost of the electronic equipment can be reduced. On the other hand, the power of the battery 2 can be saved.

The temperature threshold may be understood as a temperature range suitable for the performance of the battery 2, specifically, the temperature threshold may be any value in the range of 20 ℃ to 50 ℃, for example, the temperature threshold may be 20 ℃,30 ℃ or 50 ℃, and the embodiment of the present application is not limited thereto.

In addition, the electronic device may be a watch, a mobile phone, or any other possible electronic device, and the electronic device is not limited in the embodiment of the present application.

The battery 2 may be a silicon negative electrode battery, which is a battery using a silicon-carbon compound having a high silicon content as a battery negative electrode material. Of course, the battery 2 may be another battery, for example, the battery 2 may also be a graphite negative electrode battery, and the like, which is not limited in this embodiment of the present application.

When the battery 2 is a silicon cathode battery, since the cut-off voltage of the silicon cathode battery is 2.8V, in general, the silicon cathode battery needs to be discharged to 2.8V to completely release the electric quantity, and compared with the 3.4V cut-off voltage of the common graphite cathode battery, the cut-off voltage of the silicon cathode battery is obviously lower.

However, the inventor researches and finds that when the battery 2 is in a low-voltage and low-temperature state, the DCR of the battery 2 is significantly increased, and when the temperature of the battery 2 is in the temperature threshold, the DCR of the battery 2 is significantly decreased, so that the heating of the battery 2 through the main board 4 according to the temperature of the battery 2 detected by the temperature detection element 3 is particularly important for ensuring the normal operation of the battery 2, especially for ensuring the normal operation of the silicon negative electrode battery.

Illustratively, the inventors found that when the battery 2 is in a low-voltage and low-temperature state, the DCR of the battery 2 may even be as high as 500 milliohms, which seriously affects the normal operation of the battery 2. Whereas when the temperature of the battery 2 is the temperature threshold, the inventors found that the DCR of the battery 2 will be greatly reduced.

In some embodiments, referring to fig. 2 and 3, the thermal conductor 5 is a deformable thermal conductor electrically connected to the main board 4, and the main board 4 is configured to control the deformable thermal conductor to contact the battery 2 to conduct heat of the main board 4 to the battery 2 when the temperature of the battery 2 is lower than a temperature threshold, and to control the deformable thermal conductor to disconnect from the battery 2 when the temperature of the battery 2 is higher than or equal to the temperature threshold.

In this embodiment, since the deformable heat conductor is electrically connected to the main board 4, the main board 4 can control the deformable heat conductor to be in contact with or disconnected from the battery 2 according to the temperature of the battery 2.

Specifically, when the temperature of the battery 2 is lower than the temperature threshold, the main board 4 may control the deformable heat conductor to be in contact with the battery 2, and after the deformable heat conductor is in contact with the battery 2, the heat of the main board 4 may be conducted to the battery 2 through the deformable heat conductor.

When the temperature of the battery 2 is higher than or equal to the temperature threshold, the main board 4 can control the deformable heat conduction member to be disconnected from the battery 2, and after the deformable heat conduction member is disconnected from the battery 2, the heat on the main board 4 cannot be continuously conducted to the battery 2 through the deformable heat conduction member, so that the performance reduction of the battery 2 caused by the overhigh temperature of the battery 2 can be avoided.

It should be noted that by controlling the deformable heat conductor to be disconnected from the battery 2 when the temperature of the battery 2 is higher than or equal to the temperature threshold, it is possible to avoid a situation in which, when the main board 4 is overheated, heat is directly conducted to the battery 2 through the deformable heat conductor, resulting in overheating of the battery 2 as well. It is also possible to avoid the occurrence of the situation where the temperature of the battery 2 is directly conducted to the main board 4 through the deformable heat-conducting member when the main board 4 is excessively cooled. Colloquially, through making control flexible heat conduction piece and battery 2 disconnection when the temperature of battery 2 is higher than or equal to the temperature threshold, can avoid battery 2 as middle heat conduction body with flexible heat conduction piece, and then can avoid battery 2 and mainboard 4 to carry out the condition of frequent heat exchange and take place for the temperature of battery 2 is more stable, and is controlled more easily.

In some embodiments, the deformable thermal conductor is an SMA (Shape Memory Alloys) member.

The SMA is an alloy material which can completely eliminate the deformation of the SMA at a lower temperature after being heated and can restore the original shape of the SMA before the deformation, namely the SMA has a memory effect.

When the deformable heat conduction piece is an SMA piece, the stability of the heat conduction piece 5 can be ensured because the SMA piece technology is mature.

When the deformable thermal conductor is an SMA element, the principle that the SMA element is controlled by the main board 4 to be in contact with or disconnected from the battery 2 may be as follows:

for some electronic devices with OIS (Optical Image Stabilizer) functionality, an OIS drive is usually already integrated in the main board 4, so that the SMA element can be controlled to be in or out of contact with the battery 2 by connecting the OIS drive to the SMA element.

When the deformable heat conduction piece is the SMA piece, the contact or disconnection of the SMA piece and the battery 2 can be controlled by directly utilizing OIS driving under the condition that the electronic equipment has an OIS function, and the deformable heat conduction piece is very convenient.

For some electronic devices without OIS function, the SMA device may be powered by the battery 2, and driven by PWM (Pulse Width Modulation) to drive the full bridge, and then the output of the full bridge is connected to two ends of the SMA device to drive the SMA device to contact or disconnect the battery 2.

Of course, the SMA element may be driven to contact or disconnect the battery 2 by other means, which is not limited in the embodiment of the present application.

In some embodiments, referring to fig. 2, the SMA member is an SMA sheet, the SMA sheet includes a first surface 51 and a second surface 52 which are oppositely disposed, the first surface 51 is disposed on the main plate 4, the second surface 52 is disposed opposite to the battery 2, the main plate 4 is used for controlling the second surface 52 to be in contact with the battery when the temperature of the battery 2 is lower than a temperature threshold value, and controlling the second surface 52 to be disconnected from the battery when the temperature of the battery 2 is higher than or equal to the temperature threshold value.

Through making second surface 52 and battery 2 set up relatively, first surface 51 sets up in mainboard 4, and second surface 52 and battery 2 set up relatively, and mainboard 4 can be when the temperature of battery 2 is less than the temperature threshold value control second surface 52 and battery contact, like this, can make the area of contact of SMA spare and battery 2 great, so set up, on the one hand, can be better conduct the heat that mainboard 4 produced to battery 2, on the other hand, also can make the more even that is heated of each position department of battery 2.

In some embodiments, referring to fig. 3 and 4, the temperature detection element 3 is attached to the battery 2. By attaching the temperature detection element 3 to the battery 2, on the one hand, the temperature detection element 3 can be made to directly contact the battery 2, and therefore, the temperature of the battery 2 can be detected more accurately. On the other hand, compared with the case where the temperature detecting element 3 is disposed at a distance from the battery 2, the space inside the electronic device can be saved, and the space waste caused by the temperature detecting element 3 can be avoided. On the other hand, the temperature detection element 3 and the battery 2 can form a whole, and the modular management of each component in the electronic equipment is facilitated.

In order to make the temperature detection element 3 objectively reflect the temperature of the battery 2, in some embodiments, referring to fig. 2, the temperature detection element 3 is disposed away from the second surface 52, and by disposing the temperature detection element 3 away from the second surface 52, it can be avoided that the temperature detection element 3 is directly covered by the second surface 52, which causes the temperature near the temperature detection element 3 to be higher than the actual temperature of the battery 2, and further causes the temperature detected by the temperature detection element 3 to be higher than the actual temperature of the battery 2. That is, by disposing the temperature detection element 3 away from the second surface 52, the temperature detected by the temperature detection element 3 can be made closer to the actual temperature of the battery 2.

In some embodiments, the Temperature detecting element 3 is an NTC (Negative Temperature Coefficient) resistor. By making the temperature detection element 3 an NTC resistor, on the one hand, the technology for detecting the temperature by the NTC resistor is mature, and on the other hand, the detection accuracy of the NTC resistor is high, so that the detection accuracy of the temperature detection element 3 can be improved while the performance stability of the temperature detection element 3 is ensured.

When the electronic device includes the screen 6, there may be various positions among the battery 2, the main board 4 and the screen 6, for example, in one possible implementation manner, referring to fig. 5, the battery 2, the main board 4 and the screen 6 may be sequentially stacked according to an order of the screen 6 and the main board 4. Through making screen 6, mainboard 4 and battery 2 stack up the setting in proper order, can be so that battery 2 is comparatively close to casing 1, be convenient for the change to battery 2.

In another possible implementation manner, referring to fig. 6, the screen 6, the battery 2, and the motherboard 4 may be sequentially stacked in sequence, and the motherboard 4 may be closer to the housing 1 by sequentially stacking the screen 6, the battery 2, and the motherboard 4 in sequence, so as to facilitate heat dissipation of the motherboard 4.

Example two

Fig. 7 is a flowchart of a method for improving battery performance according to an embodiment of the present disclosure.

Referring to fig. 7, the method may be applied to the electronic device of any one of the above embodiments, and the method includes:

step 701: the temperature of the battery is acquired.

Step 702: if the temperature of the battery is lower than the temperature threshold value, the heat of the mainboard is controlled to be conducted to the battery through the heat conduction piece.

In the embodiment of the application, at first, can acquire the temperature of battery, after acquiring the temperature of battery, can judge whether the temperature of battery is less than the temperature threshold according to the temperature of battery, when the temperature of battery is less than the temperature threshold, the mainboard can control heat conduction spare and conduct the heat on the mainboard to the battery through the heat-conduction spare, make the temperature of battery rise gradually, and then can avoid the temperature of battery to hang down and lead to the condition emergence of the DCR (direct Current Resistance) of battery showing the increase, thereby can avoid when electronic equipment opens some high voltage applications such as camera or display screen, the condition that the camera can't normally shoot or the unable normal demonstration of display screen takes place, can promote electronic equipment's use experience.

and if the temperature of the battery is lower than the temperature threshold, controlling the target device of the mainboard to operate so that the temperature of the mainboard is higher than or equal to the temperature threshold, and controlling the heat of the mainboard to be conducted to the battery through the heat conduction piece.

Optionally, the heat conductor in the electronic device is a deformable heat conductor, the deformable heat conductor is disposed on the motherboard and electrically connected to the motherboard, and the heat of the motherboard is controlled to be conducted to the battery through the heat conductor, including:

if the temperature of the battery is lower than the temperature threshold value, the deformable heat conduction piece is controlled to be in contact with the battery so as to conduct the heat of the mainboard to the battery through the deformable heat conduction piece.

if the temperature of the battery is lower than the temperature threshold value, judging whether the heat conduction piece is in contact with the battery or not;

when the thermal conductor is disconnected from the battery, the thermal conductor is controlled to be in contact with the battery.

Optionally, the method further comprises:

if the temperature of the battery is higher than or equal to the temperature threshold value, the heat of the main board is controlled to stop being conducted to the battery through the heat conduction piece.

All the optional technical solutions can be combined arbitrarily to form an optional embodiment of the present application, which is not described in detail herein.

Referring to fig. 8, the method may be applied to the electronic device of any one of the above embodiments, and the method includes:

step 801: the temperature of the battery is acquired.

The temperature of the battery may be detected by the temperature detection element, and the electronic apparatus may acquire the temperature of the battery from the temperature detection element after the temperature detection element detects the temperature of the battery.

Step 802: if the temperature of the battery is lower than the temperature threshold value, the heat of the mainboard is controlled to be conducted to the battery through the heat conduction piece.

Specifically, a temperature threshold may be stored in the electronic device in advance, and then, the difference between the temperature of the battery acquired by the electronic device and the temperature threshold may be made, and when the difference between the temperature of the battery and the temperature threshold is smaller than 0, it may be determined that the temperature of the battery is lower than the temperature threshold. When the difference between the temperature of the battery and the temperature threshold is greater than or equal to 0, the temperature of the battery is considered to be greater than or equal to the temperature threshold. That is, by subtracting the temperature of the battery acquired by the electronic device from the temperature threshold, it can be determined whether the temperature of the battery is lower than the temperature threshold.

Of course, it may also be determined whether the temperature of the battery is lower than the temperature threshold by other methods, which is not limited in the embodiment of the present application.

The temperature threshold may be any value within a range of 20 ℃ to 50 ℃, for example, the temperature threshold may be 20 ℃,30 ℃ or 50 ℃, which is not limited in the embodiment of the present application.

Under the condition that whether the temperature of the battery is lower than the temperature threshold value or not can be judged, if the temperature of the battery is lower than the temperature threshold value, the heat of the mainboard is controlled to be conducted to the battery through the heat conduction piece.

Specifically, in some embodiments, if the temperature of the battery is below the temperature threshold, controlling the conduction of heat from the motherboard to the battery through the thermal conductor may be accomplished by the following step 8021A:

step 8021A: and if the temperature of the battery is lower than the temperature threshold, controlling the target device of the mainboard to operate so that the temperature of the mainboard is higher than or equal to the temperature threshold, and controlling the heat of the mainboard to be conducted to the battery through the heat conduction piece.

In this embodiment, first, when the temperature of the battery is lower than the temperature threshold, the target device of the motherboard may be controlled to operate, and in the operation process of the target device, the target device may generate heat, and the heat generated by the target device may make the temperature of the motherboard higher than or equal to the temperature threshold, and when the temperature of the motherboard is higher than or equal to the temperature threshold, the heat of the motherboard may be conducted to the battery through the thermal conduction member. So set up, can avoid because the temperature of mainboard is less than the condition emergence that the temperature threshold value can't heat for the battery.

The target device may be a CPU (Central Processing Unit) or other components that can generate heat during operation, and the embodiment of the present application is not limited herein.

In some embodiments, the heat conduction element in the electronic device is a deformable heat conduction element, the deformable heat conduction element is disposed on the motherboard and electrically connected to the motherboard, and when the heat conduction element in the electronic device is a deformable heat conduction element, the deformable heat conduction element is disposed on the motherboard and electrically connected to the motherboard, step 802 can be implemented by step 8021B:

step 8021B: if the temperature of the battery is lower than the temperature threshold value, the deformable heat conduction piece is controlled to be in contact with the battery, so that the heat of the main board is conducted to the battery through the deformable heat conduction piece.

Through making flexible heat conduction spare and battery contact, flexible heat conduction spare can regard as the heat-conducting medium between battery and the mainboard to use, like this, the heat of mainboard can be through the faster conduction to the battery of flexible heat conduction spare, and then can make the programming rate of battery faster to the condition that the temperature of avoiding the battery that can be better crosses lowly and lead to the DCR of battery to show the increase takes place.

In some embodiments, if the temperature of the battery is lower than the temperature threshold, controlling the deformable heat conductor to contact with the battery to conduct the heat of the motherboard to the battery through the deformable heat conductor may be implemented by the following steps 80211A-80212A:

step 80211A: and if the temperature of the battery is lower than the temperature threshold value, judging whether the deformable heat conduction piece is in contact with the battery.

In one possible implementation manner, whether the deformable heat conductor is in contact with the battery can be judged by acquiring the state of a driving circuit for driving the deformable heat conductor to be disconnected from the battery contact.

In another possible implementation manner, a contact sensor may be disposed on a surface of the battery facing the deformable heat conduction member, and the contact sensor may detect whether the deformable heat conduction member is in contact with itself, so as to achieve a purpose of determining whether the deformable heat conduction member is in contact with the battery.

Specifically, when contact sensor detects that flexible heat conduction spare contacts with self, can judge that flexible heat conduction spare and battery contact, when contact sensor detects that flexible heat conduction spare and self break off, can judge that flexible heat conduction spare and battery break off.

Step 80212A: when the deformable heat conductor is disconnected from the battery, the deformable heat conductor is controlled to be in contact with the battery.

In this embodiment, when the temperature of the battery is lower than the temperature threshold, it is first determined whether the deformable heat conductor is in contact with the battery, and when the deformable heat conductor is found to be disconnected from the battery, the deformable heat conductor is controlled to be in contact with the battery. Compared with the mode that whether the deformable heat conduction piece is in contact with the battery or not is judged without judging, and the deformable heat conduction piece is directly controlled to be in contact with the battery, the situation that the deformable heat conduction piece is repeatedly controlled to be in contact with the battery can be avoided.

In some embodiments, if the temperature of the battery is below the temperature threshold, controlling the deformable thermal conductor to contact the battery may be accomplished by:

step 80211B-step 80212B implements:

step 80211B: and when the temperature of the battery is lower than the temperature threshold value, acquiring the residual capacity of the battery.

When the electronic device determines that the temperature of the battery is lower than the temperature threshold, the remaining capacity of the battery can be directly read from a battery management module of the battery.

Step 80212B: and when the residual capacity is smaller than the capacity threshold value, controlling the deformable heat conduction piece to be in contact with the battery.

In some embodiments, the electronic device may have a power threshold pre-stored therein. Under the condition that an electric quantity threshold value can be prestored in the electronic equipment, the difference between the residual electric quantity and the electric quantity threshold value can be made, and when the difference between the residual electric quantity and the electric quantity threshold value is smaller than 0, the fact that the residual electric quantity is smaller than the electric quantity threshold value can be judged. When the difference between the remaining capacity and the capacity threshold is greater than or equal to 0, it is determined that the remaining capacity is greater than or equal to the capacity threshold. That is, by subtracting the remaining power from the power threshold, it can be determined whether the remaining power is smaller than the power threshold.

Of course, it may also be determined whether the remaining power is smaller than the power threshold by other ways, which is not limited in the embodiment of the present application.

Since the increase of the DCR of the battery is related to the remaining capacity of the battery in addition to the temperature of the battery. In general, in some cases, although the temperature of the battery is lower than the temperature threshold, the DCR of the battery does not increase sharply and the performance of the battery is not greatly affected due to the high remaining capacity of the battery. Therefore, when the temperature of the battery is lower than the temperature threshold, the remaining capacity of the battery can be further acquired. When the residual electric quantity is smaller than the electric quantity threshold value, the thermal radiation heating element is controlled to start heating the battery. Therefore, the situation that the deformable heat conduction piece wastes the electric quantity of the battery in the deformation process can be avoided by controlling the contact of the deformable heat conduction piece and the battery when the residual electric quantity is larger than or equal to the electric quantity threshold value.

The threshold value of the electric quantity may be 10% or 20%, and the like, which is not limited in the embodiment of the present application.

In some embodiments, if the temperature of the battery is lower than the temperature threshold, controlling the target device of the motherboard to operate so that the temperature of the motherboard is higher than or equal to the temperature threshold may be implemented by the following steps 8021A1 to 8021A3:

step 8021A1: obtaining environmental parameters, wherein the environmental parameters comprise one or more of environmental temperature and environmental heat conductivity coefficient.

The environmental thermal conductivity can be obtained through experiments, and in some embodiments, the environmental thermal conductivity can be obtained through experiments and then stored in the electronic device in advance, so that the electronic device can obtain the environmental thermal conductivity.

The ambient temperature may be obtained by the electronic device accessing the internet, and in other embodiments, a second temperature sensor for obtaining the ambient temperature may be further disposed on the electronic device, so that the electronic device may obtain the ambient temperature from the second temperature sensor.

Step 8021A2: and determining the operating power of the target device according to the environmental parameters.

In a possible implementation manner, a corresponding relationship between the environmental parameter and the operating power of the target device may be stored in the electronic device in advance, so that after the electronic device obtains the environmental parameter, the operating power of the target device may be matched from the corresponding relationship. That is, the electronic device may determine the operating power of the target device according to the environmental parameter.

The correspondence between the environmental parameter and the operating power of the target device may be measured through a large number of experiments, or may be calculated through an empirical formula, which is not limited in the embodiments of the present application.

Of course, in another possible implementation manner, the operating power of the target device may also be determined in other manners according to the environmental parameter, and this embodiment is not listed here.

It should be noted that, because it takes a certain time for the temperature of the battery to rise to the temperature threshold value in the process of heating the battery by the motherboard, theoretically, the higher the temperature rise speed of the battery is, the better the DCR of the battery can be prevented from rising sharply.

Considering that the faster the temperature rise speed of the battery is, the larger the operating power of the target device needs to be, based on this, only the temperature rise of the battery at a preset speed needs to be ensured, and the operating power of the target device does not need to be increased for improving the temperature rise speed, which causes waste of the electric quantity of the battery.

When the ambient temperatures are different, the operating power of the target device will be different in order to ensure that the battery can be warmed up at a preset rate, which mainly takes into account the problem of energy dissipation at different ambient temperatures.

For example, if the battery temperature is 0 ℃, the temperature threshold is 20 ℃, and the ambient temperature is 10 ℃, in this case, if the battery needs to be heated at the preset speed, the operating power of the target device is 1W, then, if the ambient temperature is changed from 10 ℃ to-10 ℃ without changing other parameters, then, considering heat dissipation in different environments, it is obvious that the operating power of the target device needs to be greater than 1W, and it is only possible to ensure that the motherboard can heat the battery at the preset speed.

Based on this, the operating power of the target device is determined according to the environmental parameters, the temperature rise speed of the battery can be ensured to be approximately the same under different environmental temperatures, and the stability of the performance of the battery can be further ensured.

Step 8021A3: the target device is controlled to operate at the operating power so that the temperature of the motherboard is higher than or equal to the temperature threshold.

By controlling the target device to operate at the operating power, the temperature of the battery can be increased to the temperature threshold value at a higher speed, the large waste of electric quantity can not be caused, the balance is obtained between the temperature increasing speed and the electric quantity consumption, and the use experience of the electronic equipment is better.

Step 803: and if the temperature of the battery is higher than or equal to the temperature threshold value, controlling the heat of the main board to stop being conducted to the battery through the heat conduction piece.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that the electronic device comprises:

a housing;

a battery located in the housing;

a thermal conductor disposed on the motherboard, the thermal conductor being configured to conduct heat from the motherboard to the battery when the temperature of the battery is below a temperature threshold.

2. The electronic device of claim 1, wherein the thermal conductor is a deformable thermal conductor electrically connected to the motherboard, the motherboard configured to control the deformable thermal conductor to contact the battery to conduct heat from the motherboard to the battery when the temperature of the battery is below a temperature threshold, and to control the deformable thermal conductor to disconnect from the battery when the temperature of the battery is above or equal to the temperature threshold.

3. The electronic device of claim 2, wherein the deformable heat conductor is an SMA element.

4. The electronic device of claim 3, wherein the SMA piece is an SMA sheet comprising a first surface and a second surface disposed opposite to each other, the first surface being disposed on the motherboard, the second surface being disposed opposite to the battery, the motherboard being configured to control the second surface to contact the battery to conduct heat from the motherboard to the battery when a temperature of the battery is below a temperature threshold, and to control the second surface to disconnect from the battery when the temperature of the battery is above or equal to the temperature threshold.

5. A method for improving battery performance, the method being applied to the electronic device of any one of claims 1-4, the method comprising:

acquiring the temperature of the battery;

and if the temperature of the battery is lower than a temperature threshold value, controlling the heat of the mainboard to be conducted to the battery through the heat conductor.

6. The method of claim 5, wherein controlling the conduction of heat from the motherboard to the battery via the thermal conductor if the temperature of the battery is below a temperature threshold comprises:

7. The method of claim 5, wherein the heat conductor in the electronic device is a deformable heat conductor disposed on and electrically connected to the motherboard, and wherein the heat of the motherboard is conducted to the battery through the heat conductor, comprising:

8. The method of claim 7, wherein said controlling the deformable thermal conductor to contact the battery if the temperature of the battery is below the temperature threshold comprises:

9. The method of claim 7, wherein said controlling the deformable thermal conductor to contact the battery if the temperature of the battery is below the temperature threshold comprises:

10. The method of claim 6, wherein if the temperature of the battery is lower than a temperature threshold, controlling the target device of the motherboard to operate such that the temperature of the motherboard is higher than or equal to the temperature threshold comprises:

obtaining environmental parameters, wherein the environmental parameters comprise one or more of environmental temperature and environmental heat conductivity coefficient;

11. The method according to any one of claims 5-10, further comprising: