CN115762958A - Laminated three-dimensional inductor - Google Patents
Laminated three-dimensional inductor Download PDFInfo
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- CN115762958A CN115762958A CN202211512815.9A CN202211512815A CN115762958A CN 115762958 A CN115762958 A CN 115762958A CN 202211512815 A CN202211512815 A CN 202211512815A CN 115762958 A CN115762958 A CN 115762958A
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Abstract
The invention discloses a laminated three-dimensional inductor which comprises a plurality of layers of substrates made of insulating materials, wherein a 1/4-3/4 annular transmission channel is arranged on the same side of each substrate, and two adjacent layers of transmission channels form a complete ring; only one end of each transmission channel is provided with a hole, and the hole ends and the non-hole ends of two adjacent transmission channels are arranged in a staggered mode; a plurality of substrates are stacked, and adjacent conveying channels are communicated at the opening to form a spiral structure. The invention does not depend on magnetic core winding, has wide application range and low fault tolerance rate, and reduces the volume of the medium and high power inductor.
Description
Technical Field
The invention belongs to the technical field of inductors, and relates to a laminated three-dimensional inductor.
Background
The inductance is all components and parts that each field all needs such as electron, electricity, communication, energy storage, however traditional inductance comprises air core coil or magnetic core coil mostly, has characteristics such as bulky, heavy, use scene are restricted. Therefore, the plane combination feels attention of the parties. The existing planar/chip type laminated inductor is formed by various coil structures and metal support structures, the structure is large in size and inconvenient to use, the wire diameter or the thickness of a conductive coil needs to be increased when the overcurrent capacity is provided, and the design and the production are inconvenient.
Disclosure of Invention
In order to solve the problems, the invention provides a laminated three-dimensional inductor which is not wound by a magnetic core, has wide application range and low fault tolerance, reduces the volume of a medium-power inductor and a high-power inductor, and solves the problems in the prior art.
The technical scheme adopted by the invention is that the laminated three-dimensional inductor comprises a plurality of layers of substrates made of insulating materials, wherein a 1/4-3/4 annular transmission channel is arranged on the same side of each substrate, and two adjacent layers of transmission channels form a complete annular shape; only one end of each transmission channel is provided with a hole, and the hole ends and the non-hole ends of two adjacent transmission channels are arranged in a staggered mode; a plurality of substrates are stacked, and adjacent conveying channels are communicated at the opening hole to form a spiral structure.
Furthermore, each transmission channel's one end is equipped with the through-hole, and the through-hole is not seted up to the other end, and the position that corresponds with the through-hole on the adjacent base plate is equipped with the through-hole pad, and the through-hole pad is located the heteropleural side of base plate with transmission channel, and at through-hole pad department reflow soldering intercommunication transmission channel on two adjacent base plates, guarantee that alternating current forms complete circulation way.
Further, a metal conducting layer is covered on the substrate to obtain a transmission channel.
Further, the transmission channel is 1/2 annular, and the adjacent transmission channel is 1/2 annular; or the transmission channel is in a 1/4 ring shape, and the adjacent transmission channel is in a 3/4 ring shape.
Furthermore, the adjacent upper and lower layers of transmission channels are both 3/4 annular.
Furthermore, a hollow area is arranged in the middle of the substrate.
Further, the substrate is a PCB.
Furthermore, the positions of the substrates, which are not provided with the transmission channels, are symmetrically provided with the laminated auxiliary structures, so that the distance between two adjacent substrates is ensured to be consistent.
Furthermore, the width of the transmission channel is 0.1mm-100mm, and the diameter of the through hole is 0.1mm-100mm.
Furthermore, the substrate and the transmission channel form a circuit board, the thickness of the single-layer circuit board is 0.02mm-50mm, and the distance between two adjacent substrates is 0.1mm-20mm.
The beneficial effects of the invention are:
1. the embodiment of the invention does not depend on the winding of the magnetic core, thereby avoiding the problem of magnetic ring inductance; the width and the thickness of the circuit board can be adjusted (1-20 mm) to meet the application of different rated currents and meet various circuits from low frequency to high frequency, and the application range is wide.
2. The structural design of the embodiment of the invention can achieve accurate assembly through standard reflow soldering, and the fault tolerance rate is much lower than that of the manually or mechanically wound enameled wire magnetic ring inductor.
3. The embodiment of the invention greatly reduces the volume of the medium-high power inductor (larger than 0.5A), and is especially suitable for various consumer electronic products, such as mobile phones, intelligent watches, intelligent glasses, tablet computers, notebooks and the like.
4. The embodiment of the invention can meet the requirement of large current (less than 20A) according to design, and can meet the requirement of high Q value (more than 3) without a magnetic core.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 shows the top copper layer distribution of the circuit board according to embodiment 1 of the present invention.
Fig. 2 shows the bottom copper layer distribution of the circuit board according to embodiment 1 of the present invention.
Fig. 3 is an exploded view of example 1 of the present invention.
Fig. 4 is an exploded view from another perspective of example 1 of the present invention.
Fig. 5 is a side view of embodiment 1 of the present invention.
Fig. 6 is an electromagnetic field profile of an operating state of embodiment 1 of the present invention.
Fig. 7 shows simulated inductance values of example 1 of the present invention.
Fig. 8 is a diagram showing an embodiment 1 of the present invention.
FIG. 9 is a diagram showing an embodiment 2 of the present invention.
FIG. 10 is a drawing showing a welded article according to example 1 of the present invention.
Fig. 11 is a physical diagram of the entire structure of embodiment 1 of the present invention.
Fig. 12 is a side view of embodiment 1 of the present invention.
Fig. 13 is a side view of embodiment 4 of the present invention.
In the figure, 1, a substrate, 2, a through hole, 3, a transmission channel, 4, a laminated auxiliary structure, 5, a hollow area, and 6, a through hole bonding pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the case of the example 1, the following examples are given,
a laminated three-dimensional inductor is shown in figures 1-2 and comprises a plurality of layers of copper-clad circuit boards, wherein each copper-clad circuit board comprises a substrate 1, a 1/2 annular transmission channel 3 is arranged on the same side of each substrate 1, copper layers are arranged on the surfaces of the transmission channels 3, the transmission channels 3 on two adjacent layers of substrates 1 are symmetrically arranged, a through hole 2 is formed in one end of each transmission channel 3, the through hole 2 is not formed in the other end of each transmission channel 3, and the open ends and the non-open ends of two adjacent transmission channels 3 are arranged in a staggered mode; a plurality of substrates 1 are laminated, and adjacent transmission channels 3 are conductively communicated at through holes 2 to form a spiral structure.
As shown in fig. 3, 4, 5, and 8, after the multiple copper-clad circuit boards are stacked, through hole pads 6 are arranged at positions corresponding to the through holes 2 on the adjacent substrates 1, the through hole pads 6 and the transmission channels 3 are located at opposite sides of the substrates 1, stitch welding is applied at the through hole pads 6, and the welding columns penetrate through the corresponding through holes 2 to communicate the transmission channels 3 on the two adjacent substrates 1, so that it is ensured that the alternating current forms a complete flow loop. Two adjacent copper-clad circuit boards are symmetrical about the centroid center (namely, one copper-clad circuit board can be overlapped after rotating 180 degrees around the centroid center), and a plurality of copper-clad circuit board stacked layers form a spiral structure. The inductor pieces can be directly welded together for use, and the volume of the whole inductor is greatly reduced, as shown in figures 11-12. Meanwhile, the magnetic field flow range is smaller, and the electromagnetic interference to other devices is reduced. The technology of high-speed and small-range flow of magnetic field is applied.
The middle part of the copper-clad circuit board is provided with a hollow area 5, and the middle hollow design is a uniform compression technology for meeting the requirement that a strong electromagnetic field can penetrate through a conductive metal passage to form a magnetic circuit and close a magnetic circuit.
The substrate 1 is an insulating layer; in the embodiment, the substrate 1 of the copper-clad circuit board is a PCB, so that the copper-clad circuit board is easy to produce, use and match and low in cost; alternating current power and signals form a closed loop through the transmission channel 3 on the surface of the PCB and the welding columns in the through holes 2 to generate a strong electromagnetic field closed loop, and the required inductance value and Q value are met.
The position of the substrate 1, which is not provided with the transmission channel 3, is symmetrically provided with the laminated auxiliary structure 4, and the distance between the upper side and the lower side is consistent, so that the laminated auxiliary structure is ensured to exist on both sides of the upper PCB and the lower PCB; the laminate auxiliary structure 4 is a copper sheet in the embodiment.
The transmission channel 3 of the single-layer copper-clad circuit board determines the size of current which can pass through and the inductance value of the single layer is increased, the width of the transmission channel 3 is 0.1mm-100mm in the embodiment, and the temperature rise is caused when the copper sheet current of the PCB is increased, but the temperature rise can be overcome by increasing the width of the copper sheet; the thickness of the single-layer copper-clad circuit board is 0.02mm-50mm, and the single-layer copper-clad circuit board is difficult to process and high in price when the thickness exceeds the range; the thickness of the substrate 1 is the basic thickness of the PCB board. The distance range of the two adjacent substrates 1 is 0.1mm-20mm, the attenuation of an electromagnetic field generated by a transmission channel is small in the range, the three-dimensional inductance loss provided by the patent can be ensured to be low, and meanwhile, a magnetic conductive material can be added between the two substrates, so that the inductance value and the Q value are increased.
The through holes 2 determine the current magnitude through connecting different layers of sheets (whole inductance sheets) and the mechanical supporting strength of the whole inductance, and the diameter of the through holes 2 in the embodiment is 0.1mm-100mm. The through hole is used for current transmission and heat conduction of the upper plate and the lower plate and is adjusted according to different real scenes.
The embodiment of the invention can design the inductors suitable for different frequencies, can cover the range of 10Hz to 100GHz, and can effectively reduce the volume of the laminated three-dimensional inductor if the magnetic conduction material with corresponding frequency characteristics is used. And magnetic conductive materials are pasted on the outermost upper layer and the outermost lower layer of the inductor to form a high-efficiency magnetic loop, so that the physical volume is reduced.
Inductance values can be increased through different layers of the copper-clad circuit board, and test data are shown in table 1;
TABLE 1PCB inductor fabrication
| Number of layers | 500KHz | 6.78 |
| 4 | 0.285μh | 0.250 |
| 5 | 0.28μh | 0.330 |
| 6 | 0.367μh | 0.350 |
| 7 | 0.36μh | 0.360 |
| 9 | 0.44μh | 0.428 |
| 10 | 0.44μh | 0.459μh |
| 15 | 0.749μh | 0.622 |
| 16 | 0.75μh | 0.66μh |
| 17 | 0.86μh | 0.90 |
| 18 | 0.88μh | 0.94μh |
| 19 | 0.97μh | 1.02 |
| 20 | 0.99μh | 1.27μh |
| 21 | 1.09μh | 1.32 |
| 22 | 1.12μh | 1.39μh |
| 23 | 1.21μh | 1.40 |
| 24 | 1.32μh | 1.39μh |
| 25 | 1.36μh | 1.42 |
| 26 | 1.39μh | 1.48μh |
| 27 | 1.46μh | 1.47 |
| 28 | 1.47μh | 1.63μh |
| 29 | 1.57μh | 1.71μh |
As can be seen from fig. 6, the electric field generated when the PCB multilayer inductor operates uniformly surrounds the copper-clad via.
As can be seen from fig. 7, the simulated inductance value and the measured inductance value of the PCB are completely the same in inductance value at the corresponding frequency point. The ordinate in fig. 7 is the inductance value in H.
In the case of the example 2, the following examples are given,
a transmission channel 3 on a certain substrate 1 is in a 3/4 ring shape, as shown in figure 9, a copper layer is arranged on the surface of the transmission channel 3, and the copper layer can be replaced by a silver layer or other conductive metal layers; the transmission channel 3 adjacent to the transmission channel 3 with the 3/4 ring shape is 1/4 ring shape, and the transmission channels 3 on the upper layer and the lower layer must ensure to form a complete ring-shaped passage.
In the case of the example 3, the following examples are given,
the adjacent upper and lower layers of transmission channels 3 are 3/4 annular, or the adjacent upper and lower layers of transmission channels 3 are overlapped in projection, the adjacent transmission channels 3 rotate backwards by 90 degrees, the adjacent transmission channels 3 are in conductive communication at the through holes 2, and the upper and lower layers of transmission channels 3 form a complete annular passage; the inductance is increased under the condition of limited product thickness; by increasing or decreasing the width of the transmission channel 3, the power level through the inductor or the temperature rise of the inductor is adjusted. Under the same area, the bandwidth of the embodiment 1 and the embodiment 2 is wider, and the heat dissipation performance is better.
In the case of the example 4, the following examples are given,
as shown in fig. 13, a magnetic conductive material is added between two adjacent substrates 1 in example 1, and the inductance and Q value of the inductor are increased by increasing the electromagnetic field flowing capacity (magnetic flux) between the substrates 1.
The structural unit of the embodiment of the invention is a copper-clad circuit board (see figure 10) with the same structure, after the copper-clad circuit board is rotated 180 degrees and stitch-welded to a required inductance value, the whole body is directly used as a chip component to be welded on other electric boards, and the PCB inductor can be used independently; or the magnetic core and the two wires are used as a common magnetic ring inductor, so that the size of the PCB is greatly reduced, and the passing power is improved.
The embodiment of the invention takes the conventional PCB as a design basis, and meets the requirements of different sizes, conductive current and inductance value through the design of the conductive circuit; different inductance values can be realized only by welding a plurality of same substrates. Therefore, the high-power high-Q-value inductor is redefined, the traditional hollow inductor and magnetic inductor modes are eliminated, and the copper-clad PCB with the specific structure in the embodiment of the invention replaces the complex coil winding, special materials and process manufacturing in the traditional inductor mode. The embodiment of the invention does not need to be wound by a magnetic core, has no temperature rise problem caused by magnetic loss, avoids the problems of magnetic ring inductance, such as enameled wire enamel skin cracking, and the width and the thickness of the copper-clad circuit board can be adjusted to meet the application of different rated currents so as to meet the application of different rated currents, and does not need to replace a magnetic ring with a large diameter and a thicker enameled wire like the magnetic ring inductance wound by a common machine, thereby causing the waste of space and materials.
The laminated three-dimensional inductor can be applied to all fields needing inductors, such as consumer electronics, household appliances, automobiles, industry, aerospace, military industry and the like.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. A laminated three-dimensional inductor comprises a plurality of layers of substrates (1) made of insulating materials, and is characterized in that a 1/4-3/4 annular transmission channel (3) is arranged on the same side of each substrate (1), and the two adjacent layers of transmission channels (3) form a complete ring; only one end of each transmission channel (3) is provided with a hole, and the hole ends and the non-hole ends of two adjacent transmission channels (3) are arranged in a staggered mode; a plurality of substrates (1) are stacked, and adjacent conveying channels (3) are communicated at the opening to form a spiral structure.
2. A stacked three-dimensional inductor according to claim 1, wherein each transmission channel (3) has a through hole (2) at one end and no through hole (2) at the other end, a through hole pad (6) is disposed on the adjacent substrate (1) at a position corresponding to the through hole (2), the through hole pad (6) and the transmission channel (3) are located on opposite sides of the substrate (1), and the transmission channels (3) on the adjacent two substrates (1) are connected by reflow soldering at the through hole pad (6) to ensure that the alternating current forms a complete current loop.
3. A stacked three-dimensional inductor according to claim 1, wherein said substrate (1) is covered with a metal conductive layer to form said transmission channel (3).
4. A stacked three-dimensional inductor according to claim 1, wherein the transmission channels (3) are 1/2 ring-shaped, and the adjacent transmission channels (3) are 1/2 ring-shaped; or the transmission channel (3) is in a 1/4 ring shape, and the adjacent transmission channel (3) is in a 3/4 ring shape.
5. A stacked three-dimensional inductor as claimed in claim 1, wherein the transmission channels (3) of the adjacent upper and lower layers are 3/4 ring-shaped.
6. A stacked three-dimensional inductor according to claim 1, wherein the substrate (1) is provided with a hollow region (5) in the middle.
7. A stacked three-dimensional inductor according to claim 1, wherein the substrate (1) is a PCB.
8. A stacked three-dimensional inductor as claimed in claim 1, wherein the substrate (1) is provided with a plurality of auxiliary stacked structures (4) at symmetrical positions without the transmission channel (3) to ensure the uniform spacing between two adjacent substrates (1).
9. A stacked three-dimensional inductor according to claim 2, wherein the width of the transmission channel (3) is 0.1mm-100mm, and the diameter of the through hole (2) is 0.1mm-100mm.
10. A stacked three-dimensional inductor as claimed in claim 1, wherein the substrates (1) and the transmission channels (3) form a circuit board, the thickness of the single-layer circuit board is 0.02mm-50mm, and the distance between two adjacent substrates (1) is in the range of 0.1mm-20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211512815.9A CN115762958A (en) | 2022-11-28 | 2022-11-28 | Laminated three-dimensional inductor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211512815.9A CN115762958A (en) | 2022-11-28 | 2022-11-28 | Laminated three-dimensional inductor |
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| Publication Number | Publication Date |
|---|---|
| CN115762958A true CN115762958A (en) | 2023-03-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211512815.9A Pending CN115762958A (en) | 2022-11-28 | 2022-11-28 | Laminated three-dimensional inductor |
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- 2022-11-28 CN CN202211512815.9A patent/CN115762958A/en active Pending
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