CN115762375A

CN115762375A - Circuit board, preparation method thereof and display device

Info

Publication number: CN115762375A
Application number: CN202211534241.5A
Authority: CN
Inventors: 赵辉
Original assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Chengdu BOE Optoelectronics Technology Co Ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-03-07

Abstract

The application provides a circuit board, a circuit board preparation method and a display panel, and relates to the technical field of display. The circuit board comprises a driving circuit, wherein the driving circuit comprises a crystal oscillator module, a signal input end, a signal output end, a power line, a grounding wire and a switch module; the crystal oscillator module comprises a first pin, a grounding pin, a third pin and a fourth pin; the first pin is electrically connected with the signal input end, the grounding pin is electrically connected with the grounding wire, the third pin is electrically connected with the signal output end, and the fourth pin is electrically connected with the first end of the switch module; the crystal oscillator module comprises one of an active crystal oscillator and a passive crystal oscillator; therefore, the driving circuit of the active crystal oscillator and the passive crystal oscillator can be compatible with the same circuit board, and the cost for selecting the driving circuit board of the active crystal oscillator and the passive crystal oscillator is reduced.

Description

Circuit board, preparation method thereof and display device

Technical Field

The application relates to the technical field of display, in particular to a circuit board, a manufacturing method of the circuit board and a display device.

Background

With the diversification of the folding display technology, the demand for the folding display product to be used together with the stylus pen is gradually increased. Whether the display product can support the function of the stylus pen is related to a circuit board of the display product. The circuit board comprises a driving circuit for driving the handwriting pen, the crystal oscillator is an essential device of the driving circuit, the crystal oscillator comprises an active crystal oscillator and a passive crystal oscillator, the active crystal oscillator and the passive crystal oscillator have differences in price, performance and the like, and the active crystal oscillator and the passive crystal oscillator are applied to display devices of different types.

In the related art, different circuit boards are respectively designed for driving circuits provided with an active crystal oscillator and a passive crystal oscillator, so that the design and preparation costs of the circuit boards are high, and the application range of the same circuit board in a display device is limited.

Disclosure of Invention

Embodiments of the present application provide a circuit board, a circuit board manufacturing method, and a display panel, so that a passive crystal oscillator driving circuit and an active crystal oscillator driving circuit can be simultaneously on the same circuit board, thereby reducing the cost of the circuit board and improving the application range thereof. The embodiment of the application adopts the following technical scheme:

in a first aspect, a circuit board is provided, which includes a substrate and a driving circuit located on the substrate, where the driving circuit includes a crystal oscillator module, a signal input terminal, a signal output terminal, a power line, a ground line, and a switch module;

the crystal oscillator module comprises a first pin, a second pin, a third pin and a fourth pin;

the first pin is electrically connected with the signal input end, the second pin is electrically connected with the grounding wire, the third pin is electrically connected with the signal output end, and the fourth pin is electrically connected with the first end of the switch module;

the crystal oscillator module comprises one of an active crystal oscillator and a passive crystal oscillator;

in the case that the crystal oscillator module comprises the passive crystal oscillator, the second end of the switch module is electrically connected with the grounding wire;

and under the condition that the crystal oscillator module comprises the active crystal oscillator, the second end of the switch module is electrically connected with the power line.

In some embodiments of the present application, in a case where the crystal oscillator module includes the passive crystal oscillator, the driving circuit further includes a first filtering module and a second filtering module;

the first filtering module is electrically connected with the first pin, and the second filtering module is electrically connected with the third pin.

In some embodiments of the present application, the first filtering module comprises a first capacitor and the second filtering module comprises a second capacitor;

a first end of the first capacitor is electrically connected with the first pin, and a second end of the first capacitor is electrically connected with the grounding wire;

the first end of the second capacitor is electrically connected with the third pin, and the second end of the second capacitor is electrically connected with the grounding wire.

In some embodiments of the present application, in a case that the crystal oscillator module includes an active crystal oscillator, the driving circuit further includes a voltage stabilizing module electrically connected to the power line through the switch module;

the voltage stabilization module is configured to stabilize a voltage of the power line input signal.

In some embodiments of the present application, the voltage regulation module includes a third capacitor;

the first end of the third capacitor is electrically connected with the first end of the switch module, and the second end of the third capacitor is electrically connected with the grounding wire.

In some embodiments of the present application, where the crystal oscillator module comprises a passive crystal oscillator, the switch module comprises a first resistor; a first end of the first resistor is electrically connected with the fourth pin, and a second end of the first resistor is electrically connected with the grounding wire;

in the case that the crystal oscillator module comprises an active crystal oscillator, the switch module comprises a second resistor;

the first end of the second resistor is electrically connected with the fourth pin, and the second end of the second resistor is electrically connected with the power line.

In some embodiments of the present application, the first resistance comprises a 0 ohm resistance and the second resistance comprises a 0 ohm resistance.

In some embodiments of the present application, the circuit board further comprises:

a first conductive layer on one side of the substrate, including the power line;

the second conducting layer is positioned on one side, far away from the substrate, of the first conducting layer and comprises the grounding wire;

the third conducting layer is positioned on one side, far away from the substrate, of the second conducting layer, and the first conducting layer, the second conducting layer and the third conducting layer are arranged in an insulating mode; the third conductive layer comprises a plurality of conductive pad groups; the conductive pad group comprises a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than the orthographic projection area of each other conductive pad group on the substrate; the crystal oscillator conductive pad group comprises a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad, wherein the first conductive pad is electrically connected with the first pin, the second conductive pad is electrically connected with the second pin, the third conductive pad is electrically connected with the third pin, and the fourth conductive pad is electrically connected with the fourth pin; the second conductive pad is also electrically connected with the ground line.

In some embodiments of the present application, the set of conductive pads further comprises a first set of conductive pads located on a side of the third conductive pad distal from the second conductive pad;

the first conductive pad group comprises two conductive pads, one of the two conductive pads is electrically connected with the third conductive pad, and the other conductive pad is electrically connected with the grounding wire.

In some embodiments of the present application, the conductive pad groups further include a second conductive pad group and a third conductive pad group, the second conductive pad group is located on a side of the third conductive pad group away from the crystal oscillator conductive pad group; the orthographic projection of the second conductive pad group on the substrate is overlapped with the orthographic projection of the power line on the substrate;

wherein the second conductive pad group and the third conductive pad group respectively include two conductive pads, one of the conductive pads of the second conductive pad group is electrically connected to the power line, and the other of the conductive pads of the second conductive pad group is electrically connected to the fourth conductive pad;

one of the conductive pads of the third conductive pad group is electrically connected to the ground line, and the other of the conductive pads of the second conductive pad group is electrically connected to the fourth conductive pad.

In some embodiments of the present application, the set of conductive pads further includes a fourth set of conductive pads, the fourth set of conductive pads being located on a side of the first conductive pad remote from the second conductive pad, the fourth set of conductive pads including two conductive pads, one of the conductive pads in the fourth set of conductive pads being electrically connected to the first conductive pad, the other of the conductive pads in the fourth set of conductive pads being electrically connected to the ground line.

In some embodiments of the present application, in a case that the crystal oscillator module includes the passive crystal oscillator, the driving circuit includes a first capacitor, a second capacitor, and a first resistor, the first conductive pad group is electrically connected to the second capacitor, the third conductive pad group is electrically connected to the first resistor, and the fourth conductive pad group is electrically connected to the first capacitor;

under the condition that the crystal oscillator module comprises the active crystal oscillator, the driving circuit comprises a third capacitor and a second resistor, the second conductive pad group is electrically connected with the second resistor, and the third conductive pad group is electrically connected with the third capacitor;

wherein the third capacitor and the first resistor share the third conductive pad set, and the third conductive pad set is electrically connected to one of the third capacitor or the first resistor.

In some embodiments of the present application, the conductive pad sets further include a fifth conductive pad set located on a side of the fourth conductive pad set away from the crystal oscillator conductive pad set;

wherein the fifth conductive pad group includes two conductive pads, one of the conductive pads is electrically connected to the fourth conductive pad, and the other conductive pad is electrically connected to the ground line.

In some embodiments of the present application, in a case where the crystal oscillator module includes the passive crystal oscillator, the driving circuit includes a first capacitor, a second capacitor, and a first resistor, the first conductive pad group is electrically connected to the second capacitor, the third conductive pad group is electrically connected to the first resistor, and the fourth conductive pad group is electrically connected to the first capacitor;

under the condition that the crystal oscillator module comprises the active crystal oscillator, the driving circuit comprises a third capacitor and a second resistor, the second conductive pad group is electrically connected with the second resistor, and the fifth conductive pad group is electrically connected with the third capacitor.

In some embodiments of the present application, the circuit board further includes a first protective layer between the third conductive layer and each component, the first protective layer including a plurality of openings;

in the case that the crystal oscillator module comprises the passive crystal oscillator, the area defined by the orthographic projection of the outline of the opening on the substrate is respectively overlapped with the orthographic projection of the crystal oscillator conductive pad group, the first conductive pad group, the third conductive pad group and the fourth conductive pad group on the substrate;

under the condition that the crystal oscillator module comprises the active crystal oscillator, the area defined by the orthographic projection of the outline of the opening on the substrate is respectively overlapped with the orthographic projection of the crystal oscillator conductive pad group, the orthographic projection of the second conductive pad group and the orthographic projection of the third conductive pad group on the substrate.

In some embodiments of the present application, the circuit board further includes a second protection layer, where the second protection layer is located on a side of the third conductive layer and the components away from the substrate;

under the condition that the crystal oscillator module comprises the passive crystal oscillator, the second protective layer covers all the components and the second conductive pad group;

under the condition that the crystal oscillator module comprises the active crystal oscillator, the second protective layer covers all the components, the first conductive pad group and the fourth conductive pad group.

In some embodiments of the present application, the circuit board further includes a first protective layer located between the third conductive layer and each component, the first protective layer including a plurality of openings;

under the condition that the crystal oscillator module comprises the active crystal oscillator, the area defined by the orthographic projection of the outline of the opening on the substrate is respectively overlapped with the orthographic projection of the crystal oscillator conductive pad group, the orthographic projection of the second conductive pad group and the orthographic projection of the fifth conductive pad group on the substrate.

under the condition that the crystal oscillator module comprises the passive crystal oscillator, the second protective layer covers all the components, the second conductive pad group and the fifth conductive pad group;

and under the condition that the crystal oscillator module comprises the active crystal oscillator, the second protective layer covers all the components, the first conductive pad group, the third conductive pad group and the fourth conductive pad group.

In a second aspect, an embodiment of the present application provides a display device including the circuit board of any one of the first aspects.

In a third aspect, an embodiment of the present application provides a method for preparing a circuit board, which is applied to prepare the circuit board according to any one of the first aspect, and the method includes:

providing a substrate of the circuit board;

forming a first conductive layer on one side of the substrate, including a power line;

forming a second conductive layer, wherein the second conductive layer is positioned on one side, away from the substrate, of the first conductive layer and comprises a grounding wire;

forming a third conductive layer, wherein the third conductive layer is positioned on one side of the second conductive layer, which is far away from the substrate, and comprises a plurality of conductive pad groups; the conductive pad group comprises a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than the orthographic projection area of each other conductive pad group on the substrate; the crystal oscillator conductive pad group comprises a first conductive pad, a second conductive pad, a third conductive pad and a fourth conductive pad, wherein the first conductive pad is electrically connected with the first pin, the second conductive pad is electrically connected with the second pin, the third conductive pad is electrically connected with the third pin, and the fourth conductive pad is electrically connected with the fourth pin; the first conducting layer, the second conducting layer and the third conducting layer are arranged in an insulating mode;

and electrically connecting each component with each conductive pad group.

The embodiment of the application provides a circuit board, a preparation method thereof and a display device, wherein the circuit board comprises a substrate and a driving circuit positioned on the substrate, and the driving circuit comprises a crystal oscillator module, a signal input end, a signal output end, a power line, a grounding wire and a switch module; the crystal oscillator module comprises a first pin, a second pin, a third pin and a fourth pin; the first pin is electrically connected with the signal input end, the second pin is electrically connected with the grounding wire, the third pin is electrically connected with the signal output end, and the fourth pin is electrically connected with the first end of the switch module; the crystal oscillator module comprises one of an active crystal oscillator and a passive crystal oscillator; under the condition that the crystal oscillator module comprises a passive crystal oscillator, the second end of the switch module is electrically connected with the grounding wire; under the condition that the crystal oscillator module comprises an active crystal oscillator, the second end of the switch module is electrically connected with a power line; therefore, the passive crystal oscillator driving circuit and the active crystal oscillator driving circuit can be arranged on the same circuit board, the design and preparation cost of the circuit board is reduced, and the application range of the circuit board is widened.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a circuit diagram of a passive crystal oscillator driving circuit in the related art according to an embodiment of the present application;

fig. 2 is a circuit diagram of an active crystal driving circuit according to the related art provided by an embodiment of the present application;

fig. 3 is a circuit diagram of a driving circuit according to an embodiment of the present application;

fig. 4 is a circuit diagram of a driving circuit provided in an embodiment of the present application in a case that a passive crystal oscillator is included;

fig. 5 is a circuit diagram of a driving circuit provided in an embodiment of the present application in a case that an active crystal oscillator is included;

fig. 6 is a schematic top view of a circuit board before components are not disposed according to an embodiment of the present disclosure;

fig. 7 is a schematic top view of another circuit board provided with no component according to an embodiment of the present disclosure;

fig. 8 is a flowchart of a circuit board manufacturing method according to an embodiment of the present application;

FIG. 9 is a schematic diagram of a top view of the circuit board of FIG. 6 with a passive crystal oscillator mounted thereon;

FIG. 10 is a schematic top view of the circuit board shown in FIG. 9 with a second passivation layer disposed thereon;

fig. 11 is a schematic top view of the circuit board shown in fig. 6 and provided with an active crystal oscillator;

FIG. 12 is a schematic top view illustrating a second passivation layer disposed on the circuit board shown in FIG. 11;

fig. 13 is a schematic top view of the circuit board shown in fig. 7 after a passive crystal oscillator and a first protection layer are disposed thereon;

fig. 14 is a schematic top view of the circuit board shown in fig. 7 with the active crystal oscillator and the first protective layer disposed thereon.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Throughout the specification and claims, the term "comprising" is to be interpreted in an open, inclusive sense, i.e., as "including, but not limited to," unless the context requires otherwise. In the description herein, the terms "one embodiment," "some embodiments," "example," "certain examples," or "some examples" or the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In addition, it should also be noted that when introducing elements of the present application and the embodiments thereof, the articles "a," "an," "the," and "said" are intended to mean that there are one or more of the elements; "plurality" means two or more unless otherwise specified; the terms "comprising," "including," "containing," and "having" are intended to be inclusive and mean that there may be additional elements other than the listed elements; the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or order of formation.

In this specification, "electrically connected" includes a case where constituent elements are connected together by an element having some kind of electrical action. The "element having a certain electric function" is not particularly limited as long as it can transmit and receive an electric signal between connected components. Examples of the "element having some kind of electric function" include not only an electrode and a wiring but also a switching element such as a transistor, a resistor, an inductor, a capacitor, other elements having various functions, and the like.

In this specification, the polygon is not a strict meaning, and may be an approximate triangle, rectangle, trapezoid, pentagon, hexagon, or the like, and some small deformations caused by tolerances may exist, and there may be chamfers, fillets, arc edges, and deformations, and the like.

The embodiment of the present application provides an equivalent circuit diagram of a driving circuit of a passive crystal oscillator in the related art, and referring to fig. 1, the driving circuit includes: the circuit comprises a passive crystal oscillator X1, a first capacitor C1, a second capacitor C2, a signal input end 101 and a signal output end 102.

In the figure, the passive crystal oscillator X1 includes four pins, wherein the pin 2 and the pin 4 are grounded, the pin 1 is an input pin, and the pin 1 is electrically connected with the signal input terminal 101; pin 3 is an output pin, and pin 3 is electrically connected to the signal output terminal 102.

The pin 1 is electrically connected with the first capacitor C1, the pin 2 is electrically connected with the second capacitor C2, the first capacitor C1 and the second capacitor C2 jointly play a role in filtering, and the frequency of an alternating voltage signal applied between an input pin and an output pin of the passive crystal oscillator X1 can be kept within a certain range.

The signal input by the signal input terminal 101 may be an alternating voltage signal of an external circuit, and after the alternating voltage signal is input into the passive crystal oscillator X1, the passive crystal oscillator X1 can generate a more stable resonance single-frequency signal, and the signal is transmitted to the signal output terminal 102 through the output pin.

The signal input terminal 101 (XTAL/CLK _ EN) and the signal output terminal 102 (XTAL/CLK _ IN) are named for the driving circuit of the passive Crystal Oscillator, and since the passive Crystal Oscillator X1 is a non-polar element with 2 active pins, and needs to generate an oscillation signal by means of a clock circuit, and cannot oscillate itself, an interface called an External Crystal Oscillator interface (XTAL) needs to be provided IN the driving circuit of the passive Crystal Oscillator, wherein the signal input terminal 101 (XTAL/CLK _ EN) is electrically connected to the clock circuit, receives a clock signal (CLK signal) transmitted from the clock circuit, and the signal output terminal 102 (XTAL/CLK _ IN) is electrically connected to a target application circuit of the driving circuit of the passive Crystal Oscillator. Illustratively, the signal output terminal 102 (XTAL/CLK _ IN) may be electrically connected to a driving chip of the display device. Note that the passive crystal oscillator X1 is not directional, and the pin 1 and the pin 3 can be interchanged.

An embodiment of the present application provides an equivalent circuit diagram of a driving circuit of an active crystal oscillator in the related art, and as shown in fig. 2, the driving circuit includes: an active crystal oscillator X2, a third capacitor C3, a signal input terminal 101, a signal output terminal 102 and a power line (CLK _ VDD).

IN the figure, the active crystal oscillator X2 includes four pins, IN which an input pin 1 (IN) is electrically connected to the signal input terminal 101, a ground pin 2 (GND) is grounded, an output pin 3 (OUT) is electrically connected to the signal output terminal 102, and a power supply pin 4 (VDD) is electrically connected to the power supply line 103.

The active crystal oscillator X2 is a complete resonant oscillator, and can output a stable oscillation signal with good quality without inputting other signals, although power is required to be supplied. IN fig. 2, since the active crystal oscillator X2 does Not need to input other signals, the input pin 1 (IN) is also called a dead pin (Not Connected, NC), and does Not affect the output of the active crystal oscillator X2 signal.

The existing driving circuits of the passive crystal oscillator X1 and the active crystal oscillator X2 are different, corresponding circuit boards need to be manufactured respectively when the circuit boards are manufactured, the two circuit boards cannot be compatible or shared, and the design and preparation costs are high.

Based on this, the embodiment of the present application provides a circuit board, as shown in fig. 3, the circuit board includes a substrate and a driving circuit located on the substrate, the driving circuit includes a crystal oscillator module X, a signal input terminal 101, a signal output terminal 102, a power line 103, a ground line 104 and a switch module S;

the crystal oscillator module X comprises a first pin 1, a second pin 2, a third pin 3 and a fourth pin 4;

the first pin 1 is electrically connected with the signal input end 101, the second pin 2 is electrically connected with the grounding wire 104, the third pin 3 is electrically connected with the signal output end 102, and the fourth pin 4 is electrically connected with the first end of the switch module S;

the crystal oscillator module X comprises one of an active crystal oscillator X2 and a passive crystal oscillator X1;

in the case that the crystal oscillator module X includes the passive crystal oscillator X1, the second end of the switch module S is electrically connected to the ground line 104;

in the case where the crystal oscillator module X includes the active crystal oscillator X2, the second terminal of the switch module S is electrically connected to the power line 103.

In some embodiments, the substrate of the Circuit board may be a Flexible substrate, in which case, the Circuit board may be a Flexible Printed Circuit (FPC), wherein the material of the Flexible substrate may include polyimide, methyl methacrylate, polycarbonate, or the like; in other embodiments, the substrate of the circuit board may be a rigid substrate, and the material of the rigid substrate may include glass and silicon materials.

In an exemplary embodiment, the switch module S may include a component having a switching function, for example, the switch module S may include any one of an electronic switch, a 0 ohm resistor, and a transistor.

In the circuit board provided by the embodiment of the present application, whether the crystal oscillator module X is electrically connected to the power line 103 (for example, a VDD line) is controlled by the switch module S, and in a case that the crystal oscillator module X includes the active crystal oscillator X2 and the active crystal oscillator X2 is electrically connected to the power line 103 by the switch module S, a driving circuit on the circuit board is an active driving circuit; in the case that the crystal oscillator module X includes the passive crystal oscillator X1, and the passive crystal oscillator X1 is not electrically connected to the power line 103 through the switch module S, the driving circuit on the circuit board is a passive driving circuit.

Two cases where the circuit board includes the active crystal oscillator X2 or the passive crystal oscillator X1 are specifically described below:

first, in the case where the driving circuit provided on the circuit board is a driving circuit of the passive crystal oscillator X1, the arrangement on the circuit board is as follows:

under the condition that the crystal oscillator module X comprises a passive crystal oscillator X1, the first pin 1 is electrically connected with the signal input end 101, and the signal input end 101 is electrically connected with the external circuit, so that the signal of the external circuit can be input; the second pin 2 is electrically connected with the grounding wire 104, and the third pin 3 is electrically connected with the signal output end 102; the fourth pin 4 is electrically connected with the first end of the switch module S; the second terminal of the switch module S is electrically connected to the ground line 104.

Secondly, in the case where the driving circuit provided on the circuit board is a driving circuit of the passive crystal oscillator X1, the arrangement on the circuit board is as follows:

under the condition that the crystal oscillator module X comprises an active crystal oscillator X2, the first pin 1 is electrically connected with the signal input end 101, and the signal input end 101 is disconnected from an external circuit; the second pin 2 is electrically connected with the grounding wire 104, and the third pin 3 is electrically connected with the signal output end 102; the fourth pin 4 is electrically connected with the first end of the switch module S; a second terminal of the switch module S is electrically connected to the power line 103. At this time, the first pin 1 is a blank pin.

In an exemplary embodiment, the switch module S may include two parallel-connected switch devices, wherein first ends of the two switch devices are electrically connected to the fourth pin 4 of the crystal oscillator module X, a second end of one switch device is electrically connected to the ground line 104, and a second end of the other switch device is electrically connected to the power line 103.

For example, in the case that the crystal oscillator module X includes the passive crystal oscillator X1, the first ends of the two switching devices are electrically connected to the fourth pin 4 of the crystal oscillator module X, the second end of one switching device is electrically connected to the ground line 104, and the second end of the other switching device is disconnected from the power line 103;

illustratively, in the case that the crystal oscillator module X includes the active crystal oscillator X2, the first ends of the two switching devices are electrically connected to the fourth pin 4 of the crystal oscillator module X, the second end of one switching device is disconnected from the ground line 104, and the second end of the other switching device is electrically connected to the power line 103.

The circuit board provided by the embodiment of the application comprises a substrate and a driving circuit positioned on the substrate, wherein the driving circuit comprises a crystal oscillator module X, a signal input end 101, a signal output end 102, a power line 103, a grounding wire 104 and a switch module S; the crystal oscillator module X comprises a first pin 1, a second pin 2, a third pin 3 and a fourth pin 4; the first pin 1 is electrically connected with the signal input end 101, the second pin 2 is electrically connected with the grounding wire 104, the third pin 3 is electrically connected with the signal output end 102, and the fourth pin 4 is electrically connected with the first end of the switch module S; the crystal oscillator module X comprises one of an active crystal oscillator X2 and a passive crystal oscillator X1; in the case that the crystal oscillator module X includes the passive crystal oscillator X1, the second end of the switch module S is electrically connected to the ground line 104; in the case that the crystal oscillator module X includes the active crystal oscillator X2, the second end of the switch module S is electrically connected to the power line 103; therefore, the passive crystal oscillator driving circuit and the active crystal oscillator driving circuit can be arranged on the same circuit board, the design and preparation cost of the circuit board is reduced, and the application range of the circuit board is widened.

In some embodiments of the present application, in the case that the crystal oscillator module X includes the passive crystal oscillator X1, the driving circuit further includes a first filtering module and a second filtering module;

the first filtering module is electrically connected to the first pin 101, and the second filtering module is electrically connected to the third pin 102.

The passive crystal oscillator X1 needs to work in a state of keeping resonance, and needs to keep voltage signals applied to two ends of the input pin and the output pin to have a certain frequency, and by providing the first filtering module and the second filtering module, the voltage signals applied to two effective pins (the first pin 101 and the third pin 102) of the crystal oscillator module X can be kept within a certain range of frequency, so as to filter noise signals.

In an exemplary embodiment, the first filtering module and the second filtering module may respectively include a capacitor, wherein the two capacitors may be referred to as matching capacitors, and in practical applications, the frequency of the alternating voltage signal input to the passive crystal oscillator X1 may be adjusted by adjusting the capacitance value of the matching capacitors.

In the embodiment of the application, under the condition that the crystal oscillator module X comprises the passive crystal oscillator X1, the driving circuit further comprises a first filtering module and a second filtering module; the first filtering module is electrically connected with the first pin 101, and the second filtering module is electrically connected with the third pin 102; therefore, signals with stable frequency can be provided at two ends of the input pin and the output pin of the passive crystal oscillator X1, and stable resonance of the passive crystal oscillator X1 is realized, so that the driving circuit of the passive crystal oscillator X1 of the circuit board is ensured to work normally.

In some embodiments of the present application, the first filtering module comprises a first capacitor C1 and the second filtering module comprises a second capacitor C2;

a first end of the first capacitor C1 is electrically connected to the first pin 1, and a second end of the first capacitor C2 is electrically connected to the ground line 104 (GND);

a first end of the second capacitor C2 is electrically connected to the third pin 3, and a second end of the second capacitor C2 is electrically connected to the ground line 104.

The capacitance values of the first capacitor C1 and the second capacitor C2 are not limited, and may be determined according to the resonant frequency of the passive crystal oscillator X1, for example, for the passive crystal oscillator X1 with the resonant frequency of 16MHz, the capacitance value of the first capacitor may be set to 6-10pF, for example, 8pF; the capacitance value of the second capacitor may be set to 6-10pF, for example 8pF.

For example, the capacitance values of the first capacitor C1 and the second capacitor C2 may be set to be the same.

The withstand voltage values of the first capacitor C1 and the second capacitor C2 are not limited herein, and may be determined according to the design of the driving circuit. Here, the maximum value of the instantaneous voltage that can be received between the capacitor electrodes is referred to as a withstand voltage value of the capacitor.

For example, the withstand voltage value of the first capacitor C1 may range from 4V to 8V, such as 5V, 5.5V, 6V, 6.3V, 6.5V, 7V, 7.5V, 7.8V, 8V.

Illustratively, the withstand voltage value of the second capacitor C2 may be in a range of 4-8V, such as 5V, 5.5V, 6V, 6.3V, 6.5V, 7V, 7.5V, 7.8V, 8V.

In the embodiment of the application, the first filtering module comprises a first capacitor C1, and the second filtering module comprises a second capacitor C2; a first end of the first capacitor C1 is electrically connected with the first pin 1, and a second end of the first capacitor C2 is electrically connected with the ground line 104; a first end of the second capacitor C2 is electrically connected with the third pin 3, and a second end of the second capacitor C3 is electrically connected with the grounding wire; therefore, signals with stable frequency can be provided at two ends of the input pin and the output pin of the passive crystal oscillator X1, and stable resonance of the passive crystal oscillator X1 is realized, so that the driving circuit of the passive crystal oscillator X1 on the circuit board is ensured to work normally.

In some embodiments of the present application, in the case that the crystal oscillator module X includes an active crystal oscillator X2, the driving circuit further includes a voltage stabilizing module, and the voltage stabilizing module is electrically connected to the power line 103 through the switch module S; the voltage stabilization module is configured to stabilize the voltage of the input signal of the power line 103.

The active crystal oscillator X2 needs to work in a power supply state, and in order to avoid the voltage fluctuation of the input signal of the power line 103 from affecting the active crystal oscillator X2, a voltage stabilizing module is arranged to be electrically connected with the power line 103 through a switch module S.

When the voltage of the signal input by the power line 103 is higher than the voltage required by the active crystal oscillator X2, the voltage stabilizing module stores the redundant electric quantity, so that the voltage of the active crystal oscillator X2 remains unchanged; when the voltage of the input signal of the power line 103 is lower than the voltage required by the active crystal oscillator X2, the voltage stabilizing module releases electric quantity to the active crystal oscillator X2; the voltage of the active crystal oscillator X2 can be made to be constant to some extent with fluctuations in the input signal voltage of the power supply line 103.

For example, the voltage stabilizing module may include a capacitor, and the voltage stabilizing module stabilizes the voltage of the input signal of the power line 103 through the capacitor.

In the embodiment of the application, when the crystal oscillator module X includes the active crystal oscillator X2, the driving circuit further includes a voltage stabilizing module, and the voltage stabilizing module is electrically connected to the power line 103 through the switch module S; the voltage stabilizing module is configured to stabilize the voltage of the input signal of the power line 103; therefore, a stable power supply signal can be provided for the active crystal oscillator X2, and stable operation of the active crystal oscillator X2 is further realized.

In some embodiments of the present application, the voltage stabilization module includes a third capacitor C3; a first end of the third capacitor C3 is electrically connected to the first end of the switch module S, and a second end of the third capacitor C3 is electrically connected to the ground line 104.

When the voltage of the input signal of the power line 103 is higher than the voltage required by the active crystal oscillator X2, the power line 103 charges the third capacitor C3, so that the voltage of the active crystal oscillator X2 is kept stable; when the voltage of the input signal of the power line 103 is lower than the voltage required by the active crystal oscillator X2, the third capacitor C3 discharges to the active crystal oscillator X2; the voltage of the active crystal oscillator X2 can be made to be constant to some extent with the fluctuation of the input signal voltage of the power line 103.

Here, neither the withstand voltage value nor the capacitance value of the third capacitor C3 is limited.

Illustratively, the capacitance value of the third capacitor C3 may be in the range of 0.05-0.2 μ F, e.g., 0.08 μ F, 0.1 μ F, 0.15 μ F, 0.18 μ F.

The withstand voltage value of the third capacitor C2 may range from 4 to 8V, for example, 5V, 5.5V, 6V, 6.3V, 6.5V, 7V, 7.5V, 7.8V, 8V. In the embodiment of the application, the voltage stabilizing module comprises a third capacitor C3; a first end of the third capacitor C3 is electrically connected to the fourth pin 103, and a second end of the third capacitor C3 is electrically connected to the ground line 104; and a stable power supply signal is provided for the active crystal oscillator X2 through the third capacitor C3, so that the stable work of the active crystal oscillator X2 is realized.

In some embodiments of the present application, as shown in fig. 5, in the case where the crystal oscillator module X includes a passive crystal oscillator X1, the switch module S includes a first resistor R1; a first end of the first resistor R1 is electrically connected to the fourth pin 4, and a second end of the first resistor R1 is electrically connected to the ground line 104;

as shown in fig. 4, in the case where the crystal oscillator module X includes the active crystal oscillator X2, the switch module S includes a second resistor R2; a first end of the second resistor R2 is electrically connected to the fourth pin 4, and a second end of the second resistor R2 is electrically connected to the power line 103;

in an exemplary embodiment, when the crystal oscillator module X includes the passive crystal oscillator X1, the fourth pin 4 is electrically connected to the ground line 104 through the first resistor R1, and the second resistor R2 is disconnected; in the case that the crystal oscillator module X includes the active crystal oscillator X2, the fourth pin 4 is electrically connected to the power line 103 through the second resistor R2, and the first resistor R1 is disconnected.

In practical applications, the first resistor R1 may be electrically disconnected by not welding, and the second resistor R2 may be electrically disconnected by not welding.

The 0 ohm resistor is not a resistor with a resistance value of 0, the 0 ohm resistor is actually a resistor with a very small resistance value, and the conduction or disconnection between the driving circuit on the circuit board and a power line (such as a VDD line) can be controlled through the 0 ohm resistor, so that the driving circuit on the circuit board can be set as the driving circuit of the active crystal oscillator X2 or the driving circuit of the passive crystal oscillator X1, the driving circuit of the active crystal oscillator X2 or the driving circuit of the passive crystal oscillator X1 can be arranged on the same circuit board, the design and preparation cost of the circuit board is reduced, and the application range of the circuit board is widened.

In some embodiments of the present application, as shown in fig. 6 or 7, the circuit board further includes:

a first conductive layer D1 on one side of the substrate, including a power line 103;

the second conducting layer D2 is positioned on one side, far away from the substrate, of the first conducting layer D1 and comprises a grounding wire 104;

the third conducting layer D3 is positioned on one side, far away from the substrate, of the second conducting layer D2, and the first conducting layer D1, the second conducting layer D2 and the third conducting layer D3 are arranged in an insulating mode; the third conductive layer D3 includes a plurality of conductive pad groups; the conductive pad group comprises a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than that of other conductive pad groups on the substrate; the crystal oscillator conductive pad group comprises a first conductive pad S1, a second conductive pad S2, a third conductive pad S3 and a fourth conductive pad S4, wherein the first conductive pad S1 is electrically connected with the first pin 1, the second conductive pad S2 is electrically connected with the second pin 2, the third conductive pad S3 is electrically connected with the third pin 3, and the fourth conductive pad S4 is electrically connected with the fourth pin 4; the second conductive pad S2 is also electrically connected to the ground line 104.

It should be noted that, in fig. 6 and fig. 7, only a partial line segment of the ground line 104 is drawn, and other line segments of the ground line 104 may be determined according to the design of the traces in the circuit board, which is not limited herein. In fig. 6 and 7, the crystal module X and other components are not shown in order to clearly show the electrical connection relationship of the conductive pad sets.

Here, the materials of the first conductive layer D1, the second conductive layer D2, and the third conductive layer D3 are not limited.

For example, the materials of the first conductive layer D1, the second conductive layer D2, and the third conductive layer D3 may each include a metal, for example, at least one of aluminum, copper, molybdenum, titanium, and tin.

For example, the conductive pad includes a pad, and the conductive pad may be electrically connected to a pin of the component, and a process of connecting the pin of the component to the pad is called a Mount, or called a Surface Mount Technology (SMT) chip. The detailed process of the component printing can refer to the description in the related art, and is not described herein again.

The first conductive layer D1, the second conductive layer D2 and the third conductive layer D3 can be electrically connected through vias, for example, the circles in the conductive pads represent vias, for example, the conductive pad S32 is electrically connected to the power line 103 through a via, and the conductive pad S12 is electrically connected to the ground line 104 through a via.

In other embodiments, the positions of the first conductive layer D1 and the second conductive layer D2 may be interchanged, for example, the first conductive layer D1 may also be located on the side of the second conductive layer D2 away from the substrate, and at this time, the positions of the vias need to be properly adjusted to ensure that the conductive pads are connected with the corresponding traces in a matching manner.

In the third conductive layer D3, one conductive pad group and one component are electrically connected, and one conductive pad group may include a plurality of conductive pads.

It should be noted that, as shown in fig. 6 or fig. 7, the third conductive layer D3 further includes a plurality of connection traces, and the conductive pad groups may be electrically connected through the connection trace located in the third conductive layer D3; of course, in other embodiments, the groups of conductive pads may also be electrically connected together by designing vias, which may be determined according to the design space of the circuit board.

The crystal oscillator conductive pad group comprises four conductive pads, and the arrangement shape of the four conductive pads is determined according to the shape of the crystal oscillator module X.

The arrangement positions of the four conductive pads included in the crystal oscillator conductive pad group may be arranged according to the positions of the pins of the crystal oscillator module X, for example, the first conductive pad S1, the second conductive pad S2, the third conductive pad S3, and the fourth conductive pad S4 may be arranged in a counterclockwise direction, or the first conductive pad S1, the second conductive pad S2, the third conductive pad S3, and the fourth conductive pad S4 may be arranged in a clockwise direction.

Because the orthographic projection area of the crystal oscillator module X on the substrate is larger than that of other components on the substrate, the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than that of other conductive pad groups on the substrate, and other conductive pad groups of the circuit board can be arranged around the crystal oscillator conductive pad group to save the arrangement space as far as possible.

The shape of the four conductive pads of the crystal oscillator conductive pad set is determined according to the specific process and the shape of the pins of the crystal oscillator module X, including but not limited to a rectangle; the areas of the four conductive pads of the crystal oscillator conductive pad set are determined according to a specific process and the area of the pin of the crystal oscillator module X, which is not specifically limited in this embodiment of the present invention.

In an exemplary embodiment, the conductive pad may include a pad.

In addition, the circuit board further includes a lead of the signal input end 101 and a lead of the signal output end 102, and the positions of the conductive layers where the lead of the signal input end 101 and the lead of the signal output end 102 are located are not specifically limited in the embodiment of the present application, for example, fig. 6 shows a schematic diagram where the lead of the signal output end 102 is located on the third conductive layer D3;

in some embodiments, the leads of the signal input 101 and the leads of the signal output 102 may be located on the third conductive layer D3, or, in other embodiments, the leads of the signal input 101 and the leads of the signal output 102 may be located on the first conductive layer D1, or, in still other embodiments, the leads of the signal input 101 and the leads of the signal output 102 may be located on the second conductive layer D2.

The lead of the signal input line 101 is electrically connected to the first conductive pad S1, and the lead of the signal output terminal 102 is electrically connected to the third conductive pad S3.

In the embodiment of the application, the crystal oscillator conductive pad group can be electrically connected with the passive crystal oscillator X1 and also can be electrically connected with the active crystal oscillator X2, so that the driving circuit of the active crystal oscillator X2 and the passive crystal oscillator X1 compatible with the same circuit board can be realized, the cost of selecting the driving circuit board of the active crystal oscillator X2 and the passive crystal oscillator X1 is reduced, and the requirements of display products on driving circuit boards with different performances and prices can be better met.

In some embodiments of the present application, the conductive pad group further includes a first conductive pad group G1, the first conductive pad group G1 is located on a side of the third conductive pad S3 away from the second conductive pad S2;

the first conductive pad group G1 includes two conductive pads, one of the two conductive pads (e.g., the conductive pad S11) is electrically connected to the third conductive pad S3, and the other conductive pad (e.g., the conductive pad S12) is electrically connected to the ground line 104.

Since the conductive pad S11 of the first conductive pad group is electrically connected to the third conductive pad S3, the first conductive pad group is located near the third conductive pad S3, so that the design space of the circuit board can be reduced, and the size of the circuit board can be reduced.

For example, the first conductive pad group G1 may be disposed at a side of the third conductive pad S3 far from the second conductive pad S2; alternatively, the first conductive pad group G1 may be disposed on a side of the third conductive pad S3 away from the fourth conductive pad S4.

The conductive pad S12 is electrically connected to the ground line 104, which may be a via hole disposed on the insulating layer at the conductive pad S12 and electrically connected to the ground line 104 located on the second conductive layer D2, or may also be a via hole disposed at another position and electrically connected to the ground line 104 located on the second conductive layer D2, and the conductive pad S12 is electrically connected to the ground line 104 through a connection trace and a via hole.

The minimum distance between the first conductive pad group G1 and the crystal oscillator conductive pad group may be determined according to a process, and for example, the minimum distance between the first conductive pad group G1 and the crystal oscillator conductive pad group may be in a range of 0.2 to 0.5mm, and for example, the minimum distance may be 0.4mm. The minimum distance between the conductive pad S11 and the conductive pad S12 of the first conductive pad group G1 is determined according to the process, and for example, the minimum distance between the conductive pad S11 and the conductive pad S12 may range from 0.1 mm to 0.3mm, and for example, the minimum distance may be 0.2mm. The following minimum distance between any two of the second conductive pad group G2, the third conductive pad group G3, the fourth conductive pad group G4, and the fifth conductive pad group G5, and the direct minimum distance between two adjacent conductive pads in the same conductive pad group are similar to the above case, and will not be described again.

Under the condition that crystal oscillator module X includes passive crystal oscillator X1, first conductive pad group G1 and second electric capacity C2 electricity are connected, under the condition that crystal oscillator module X includes active crystal oscillator X2, first conductive pad group G1 is not connected with second electric capacity C2 electricity, can realize that same circuit board is compatible active crystal oscillator X2 and passive crystal oscillator X1's drive circuit, has reduced the area of circuit board, has reduced the cost of circuit board.

In some embodiments of the present application, as shown in fig. 6 and 7, the conductive pad groups further include a second conductive pad group G2 and a third conductive pad group G3, where the second conductive pad group G2 is located on a side of the third conductive pad group G3 away from the crystal oscillator conductive pad group; the orthographic projection of the second conductive pad group G2 on the substrate is overlapped with the orthographic projection of the power line 103 on the substrate;

the second conductive pad group G2 and the third conductive pad group G3 respectively include two conductive pads, one conductive pad (e.g., the conductive pad S22) of the second conductive pad group G2 is electrically connected to the power line 103, and the other conductive pad (e.g., the conductive pad S21) of the second conductive pad group G2 is electrically connected to the fourth conductive pad S4;

one of the pads (e.g., the pad S32) of the third group G3 is electrically connected to the ground line 104, and the other pad (e.g., the pad S31) of the second group G2 is electrically connected to the fourth pad S4.

In an exemplary embodiment, since the conductive pad S21 of the second conductive pad group G2 is electrically connected to the fourth conductive pad S4, the second conductive pad group G2 may be disposed near the fourth conductive pad S4 of the crystal oscillator conductive pad group, and thus, a design space of the circuit board may be reduced. Specifically, the second group of pads G2 may be disposed on a side of the fourth pad S4 away from the third pad S3; alternatively, the second conductive pad group G2 may be located on a side of the fourth conductive pad S4 far from the first conductive pad S1.

In addition, considering that the conductive pad S22 in the second conductive pad group G2 is electrically connected to the power line 103, in order to consider the design positions of the two conductive pads in the second conductive pad group G2, the design space of each conductive pattern is reasonably utilized as much as possible, so that the second conductive pad group G2 is disposed on the side of the third conductive pad group G3 away from the crystal oscillator conductive pad group; the orthographic projection of the second conductive pad group G2 on the substrate is overlapped with the orthographic projection of the power supply line 103 on the substrate.

It should be noted that the overlapping means that: at least partially overlapping.

As shown in fig. 6 or fig. 7, the circle drawn at the position of the conductive pad S22 represents the Via located between the conductive pad S22 and the power line 103.

Since the conductive pad S21 of the second conductive pad group G2 and the conductive pad S31 of the third conductive pad group G3 are electrically connected to the fourth conductive pad S4, as shown in fig. 6 and 7, the conductive pad S21 can be electrically connected to the fourth conductive pad S4 through the conductive pad S31.

In the case where the circuit board does not include the fifth conductive pad group G5, as shown in fig. 7, the conductive pad S32 in the third conductive pad group G3 is electrically connected to the ground line 104 through the ground Via-GND; in the case where the circuit board includes the fifth conductive pad group G5, as shown in fig. 6, the conductive pad S32 in the third conductive pad group G3 is electrically connected to the ground line 104 through the conductive pad S52 in the fifth conductive pad group G5.

It should be noted that, in the top view of the circuit board provided in the embodiment of the present application, only a part of the line segments of the ground line 104 are drawn, and the remaining part of the line segments may be arranged according to actual situations, which is not limited herein. For example, in fig. 7, the orthographic projection of the ground Via-GND on the substrate may be arranged to overlap the orthographic projection of the ground line 104 on the substrate; for another example, in fig. 6, an orthogonal projection of the conductive pad S52 in the fifth conductive pad group G5 on the substrate may be set to overlap an orthogonal projection of the ground line 104 on the substrate.

In the embodiment of the application, when the crystal oscillator module X includes the passive crystal oscillator X1, the second conductive pad group G2 is not electrically connected to the second resistor R2, and the third conductive pad group G3 is electrically connected to the first resistor R1; under the condition that the crystal oscillator module X comprises the active crystal oscillator X2, the second conductive pad group G2 is electrically connected with the second resistor R2, and the third conductive pad group G3 is not electrically connected with the first resistor R1, so that the driving circuit of the same circuit board compatible with the active crystal oscillator X2 and the passive crystal oscillator X1 can be realized, the area of the circuit board is reduced, and the cost of the circuit board is reduced.

In some embodiments of the present application, as shown in fig. 6 or fig. 7, the conductive pad group further includes a fourth conductive pad group G4, the fourth conductive pad group G4 is located on a side of the first conductive pad S1 away from the second conductive pad S2, the fourth conductive pad group G4 includes two conductive pads, one conductive pad (e.g., the conductive pad S41) of the fourth conductive pad group G4 is electrically connected to the first conductive pad S1, and the other conductive pad (e.g., the conductive pad S42) of the fourth conductive pad group G4 is electrically connected to the ground line 104.

It should be noted that the conductive pad in the fourth conductive pad group G4 (e.g., the conductive pad S42) can be electrically connected to the ground line 104 through a via (at the position marked by the circle on the conductive pad S42). The following describes the electrical connection between each conductive pad group and the component when the driving circuit is disposed on the circuit board, for two different design circuit boards (circuit boards) as shown in fig. 6 or fig. 7:

the first method comprises the following steps: taking the circuit board structure shown in fig. 7 as an example:

in some embodiments of the present application, as shown in fig. 13, in a case that the crystal oscillator module X includes a passive crystal oscillator X1, the crystal oscillator conductive pad group is electrically connected to the passive crystal oscillator X1, the driving circuit includes a first capacitor C1, a second capacitor C2 and a first resistor R1, the first conductive pad group G1 is electrically connected to the second capacitor C2, the third conductive pad group G3 is electrically connected to the first resistor R1, and the fourth conductive pad group G4 is electrically connected to the first capacitor C1;

under the condition that the crystal oscillator module X includes the active crystal oscillator X2, as shown in fig. 14, the crystal oscillator conductive pad group is electrically connected to the active crystal oscillator X2, the driving circuit further includes a third capacitor C3 and a second resistor R2, the second conductive pad group G2 is electrically connected to the second resistor R2, and the third conductive pad group G3 is electrically connected to the third capacitor C3;

the third capacitor C3 in the active crystal oscillator X2 driving circuit and the first resistor R1 in the passive crystal oscillator X1 driving circuit share the third conductive pad group G3, and the third conductive pad group G3 is electrically connected to one of the third capacitor C3 or the first resistor R1.

Fig. 13 is a top view structural diagram after components in the driving circuit of the passive crystal oscillator X1 are disposed on the circuit board shown in fig. 7; fig. 14 is a plan view structural view after components in the drive circuit of the active crystal oscillator X2 are provided on the circuit board shown in fig. 7.

It should be noted that, before the components of the driving circuit are arranged, the structures of the circuit boards shown in fig. 6 and fig. 7 may be referred to as circuit boards, and it is understood that the circuit board provided with the passive crystal oscillator X1 driving circuit shown in fig. 13 and the circuit board provided with the active crystal oscillator X2 driving circuit shown in fig. 14 may share the same circuit board shown in fig. 7.

In the case that the crystal oscillator module X includes the passive crystal oscillator X1, the specific circuit and electrical connection manner of the driving circuit of the passive crystal oscillator X1 may refer to the foregoing description; in the case that the crystal oscillator module X includes the active crystal oscillator X2, the detailed circuit and the electrical connection manner of the driving circuit of the active crystal oscillator X2 may refer to the foregoing description, which is not described herein again.

In the circuit board provided by the embodiment of the application, the third conductive pad group G3 is shared by the third capacitor C3 in the active crystal oscillator X2 driving circuit and the first resistor R1 in the passive crystal oscillator X1 driving circuit, so that one conductive pad group can be designed less, the design space of the circuit board is reduced to a great extent, and the design size of the circuit board is reduced.

And the second method comprises the following steps: taking the structure of the circuit board as shown in fig. 6 as an example:

in some embodiments of the present application, as shown in fig. 6, the conductive pad group further includes a fifth conductive pad group G5, where the fifth conductive pad group G5 is located on a side of the fourth conductive pad group G4 away from the crystal oscillator conductive pad group;

the fifth conductive pad group G5 includes two conductive pads, one of the conductive pads (e.g., the conductive pad S51) is electrically connected to the fourth conductive pad S4, and the other conductive pad (e.g., the conductive pad S52) is electrically connected to the ground line 104.

It should be noted that, in practical application, the position of the fifth conductive pad group G5 may be adjusted according to the areas where the second conductive pad group G2, the third conductive pad group G3, and the fourth conductive pad group G4 are located, so as to reasonably utilize the space. For example, the fifth conductive pad group G5 may be disposed on a side of the fourth conductive pad S4 away from the first conductive pad S1.

As shown in fig. 6, the conductive pad S52 in the fifth conductive pad group G5 may be electrically connected to the ground line 104 through the Via-GND.

In some embodiments of the present application, as shown in fig. 9, in a case that the crystal oscillator module X includes a passive crystal oscillator X1, the crystal oscillator conductive pad group is electrically connected to the passive crystal oscillator X1, the driving circuit further includes a first capacitor C1, a second capacitor C2, and a first resistor R1, the first conductive pad group G1 is electrically connected to the second capacitor C2, the third conductive pad group G3 is electrically connected to the first resistor R1, and the fourth conductive pad group G4 is electrically connected to the first capacitor C1; the circuit board shown in fig. 9 is a top view structural diagram in which the components of the passive crystal oscillator X1 driving circuit are disposed on the circuit board shown in fig. 6;

in the case that the crystal oscillator module X includes the active crystal oscillator X2, as shown in fig. 10, the crystal oscillator conductive pad group is electrically connected to the active crystal oscillator X2, the driving circuit further includes a third capacitor C3 and a second resistor R2, the second conductive pad group G2 is electrically connected to the second resistor R2, and the fifth conductive pad group G5 is electrically connected to the third capacitor C3. The circuit board shown in fig. 10 is a plan view structural view in which the components of the active crystal oscillator X2 drive circuit are provided on the circuit board shown in fig. 6.

The circuit board provided with the passive crystal oscillator X1 driving circuit as shown in fig. 9 and the circuit board provided with the active crystal oscillator X2 driving circuit as shown in fig. 10 may share the same circuit board as shown in fig. 6. Therefore, the driving circuit of the passive crystal oscillator X1 and the driving circuit of the active crystal oscillator X2 can be arranged on the same circuit board, the design and preparation cost of the circuit board is reduced, and the application range of the circuit board is widened.

For the circuit board without the fifth conductive pad group G5 shown in fig. 7, in some embodiments of the present application, as shown in fig. 13 and fig. 14, the circuit board further includes a first protective layer B1, the first protective layer B1 is located between the third conductive layer D3 and each component, and the first protective layer B1 includes a plurality of openings (not marked);

as shown in fig. 13, in the case that the crystal oscillator module X includes a passive crystal oscillator X1, the regions defined by the orthographic projections of the outer contours of the openings on the substrate respectively overlap with the orthographic projections of the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3 and the fourth conductive pad group G4 on the substrate; thus, each opening exposes a crystal oscillator conductive pad group (electrically connected to the passive crystal oscillator X1), a first conductive pad group G1 (electrically connected to the second capacitor C2), a third conductive pad group G3 (electrically connected to the first resistor R1), and a fourth conductive pad group G4 (electrically connected to the first capacitor C1); the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3 and the fourth conductive pad group G4 are respectively and electrically connected with the corresponding components.

As shown in fig. 14, in the case that the crystal oscillator module X includes the active crystal oscillator X2, the regions defined by the orthographic projections of the outer contours of the openings on the substrate overlap with the orthographic projections of the crystal oscillator conductive pad group, the second conductive pad group G2, and the third conductive pad group G3 on the substrate, respectively. Thus, each opening exposes the crystal oscillator conductive pad group (electrically connected to the active crystal oscillator X2), the second conductive pad group G2 (electrically connected to the second resistor R2), and the third conductive pad group G3 (electrically connected to the third capacitor C3).

The material of the first protective layer B1 includes a Solder Resist insulating protective material, and specifically, the material of the first protective layer includes a Solder Resist ink (PSR), and the first protective layer is also referred to as a PSR layer.

In practical application, the first protection layer B1 is formed before component parts are fabricated (before soldering), the plurality of openings in the first protection layer B1 expose the corresponding conductive pad groups for electrical connection with the component parts, and the first protection layer B1 can protect each component part and the wires in the circuit board, so that the reliability risk of the circuit board is low.

For the circuit board without the fifth conductive pad group G5 as shown in fig. 7, in some embodiments of the present application, the circuit board further includes a second protection layer B2, where the second protection layer B2 is located on the third conductive layer D3 and a side of each component away from the substrate; it is understood that after the component parts are fabricated, the second protective layer B2 is formed; at this time, the second protective layer B2 can cover each component and the conductive pattern;

under the condition that the crystal oscillator module X comprises the passive crystal oscillator X1, no component is arranged on the second conductive pad G2, and the second protective layer B2 covers each component and the second conductive pad group G2;

under the condition that the crystal oscillator module X comprises an active crystal oscillator X2, components are not arranged on the first conductive pad group G1 and the fourth conductive pad group G4, and the second protective layer B2 covers the components, the first conductive pad group G1 and the fourth conductive pad group G4.

In an exemplary embodiment, the material of the second protective layer B2 may be resin or glue.

Illustratively, the material of the second protective layer B2 includes an insulating sealant, and the circuit board can be protected from moisture, gas and the like to some extent by using the insulating sealant.

The second protective layer B2 emphasizes protection of the exposed conductive pad not electrically connected to the component.

Under the condition that the thickness of the second protective layer B2 is relatively thin, due to the influence of the protruding components on the leveling property of the material of the second protective layer B2, a phenomenon of material aggregation of the second protective layer B2 (for example, aggregation of an insulating sealant) may occur, and the protective effect may be reduced, so in practical application, the second protective layer B2 may include two sub-layers, and the two sub-layers are prepared in two steps (namely, twice gluing), so that the conductive pad which is not subjected to component printing is completely covered, and the reliability of the circuit board is improved.

Note that, for a circuit board in which the fifth conductive pad group G5 is not provided as in fig. 7, only the first protective layer B1 may be provided; alternatively, only the second protective layer B2 may be provided; alternatively, the first protective layer B1 and the second protective layer B2 may be provided at the same time, and may be determined according to the requirements of the use environment of the circuit board.

In the circuit board that the embodiment of this application provided, through setting up first protective layer B1 or second protective layer B2, can play the guard action to each components and parts and conducting pattern in the circuit board to improve the reliance of circuit board, prolong the life of circuit board.

For the circuit board provided with the fifth conductive pad group G5 as in fig. 6, in some embodiments of the present application, the circuit board further includes a first protection layer B1, the first protection layer B1 is located between the third conductive layer D3 and each component, and the first protection layer B1 includes a plurality of openings; in the embodiment of the present application, a top view structure diagram after the first protection layer B1 is disposed on the circuit board shown in fig. 6 is not provided, and the film layer position relationship here may refer to the top view structure diagram shown in fig. 13 or fig. 14.

Under the condition that the crystal oscillator module X comprises a passive crystal oscillator X1, the area defined by the orthographic projection of the outline of the opening on the substrate is respectively overlapped with the orthographic projection of the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3 and the fourth conductive pad group G4 on the substrate; thus, each opening exposes a crystal oscillator conductive pad group (electrically connected with the passive crystal oscillator X1), a first conductive pad group G1 (electrically connected with the second capacitor C2), a third conductive pad group G3 (electrically connected with the first resistor R1), and a fourth conductive pad group G4 (electrically connected with the first capacitor C1); the crystal oscillator conductive pad group, the first conductive pad group G1, the third conductive pad group G3 and the fourth conductive pad group G4 are respectively and electrically connected with the corresponding components.

In the case that the crystal oscillator module X includes the active crystal oscillator X2, the area defined by the orthographic projection of the outline of the opening on the substrate is overlapped with the orthographic projection of the crystal oscillator conductive pad group, the second conductive pad group G2 and the fifth conductive pad group G5 on the substrate, respectively. In this way, each opening exposes the crystal oscillator conductive pad group (electrically connected to the active crystal oscillator X2), the second conductive pad group G2 (electrically connected to the second resistor R2), and the fifth conductive pad group G5 (electrically connected to the third capacitor C3). The crystal oscillator conductive pad group, the second conductive pad group G2 and the fifth conductive pad group G5 are respectively and electrically connected with the corresponding components.

For the circuit board provided with the fifth conductive pad group G5 as shown in fig. 6, in some embodiments of the present application, as shown in fig. 10 and 12, the circuit board further includes a second protective layer B2, where the second protective layer B2 is located on the third conductive layer D3 and a side of each component away from the substrate; it is understood that after the component parts are fabricated, the second protective layer B2 is formed; at this time, the second protective layer B2 can cover each component and the conductive pattern;

as shown in fig. 10, in the case where the crystal oscillator module X includes the passive crystal oscillator X1, the second protective layer B2 covers each component, the second conductive pad group G2, and the fifth conductive pad group G5;

as shown in fig. 12, in the case where the crystal oscillator module X includes the active crystal oscillator X2, the second protective layer B2 covers each component, the first conductive pad group G1, the third conductive pad group G3, and the fourth conductive pad group G4.

Under the condition that the thickness of the second protection layer B2 is relatively thin, due to the influence of the protruding components on the leveling property of the material of the second protection layer B2, a phenomenon of material aggregation of the second protection layer B2 (for example, aggregation of an insulating sealant) may occur, and the protection effect may be reduced, so in practical application, the second protection layer B2 may include two sub-layers, and the two sub-layers are prepared in two steps (i.e., twice gluing), so that the conductive pad without being processed is completely covered, and the reliability of the circuit board is improved.

Note that, for the circuit board provided with the fifth conductive pad group G5 as in fig. 6, only the first protective layer B1 may be provided; alternatively, only the second protective layer B2 may be provided; alternatively, the first protective layer B1 and the second protective layer B2 may be provided at the same time, and may be determined according to the requirements of the use environment of the circuit board.

In the circuit board provided in the embodiment of the present application, as shown in fig. 6 and 7, the second conductive layer D2 further includes a plurality of mark pattern groups, and except for the crystal oscillator conductive pad group, one mark pattern group is disposed on the periphery of each of the other conductive pad groups, and taking the first conductive pad group G1 as an example, the mark patterns M1 and M2 are respectively disposed on the outer sides of the two conductive pads of the first conductive pad group G1. The shapes of the mark patterns M1 and M2 in fig. 6 and 7 are merely exemplary shapes, and the specific shapes of the mark patterns are not limited and may be adjusted according to the design space.

Of course, the circuit board may also include other structures and components, and only the structures and components related to the invention will be described herein, and the other structures and components included therein may be referred to as those described in the related art.

Embodiments of the present application provide a display device comprising a circuit board as described in the foregoing.

In an exemplary embodiment, the display device includes a circuit board and a display panel.

The display device provided by the embodiment of the present application may be an OLED (Organic Light Emitting Diode) display device, wherein the OLED display device may include a glass-based OLED display device and a silicon-based OLED display device. Of course, the Display device may be an LCD (Liquid Crystal Display) Display device.

In addition, the display device may be a display device such as a display, and any product or component having a display function such as a television, a digital camera, a mobile phone, a tablet computer, or the like including the display device.

The embodiment of the application provides a display device, which comprises a circuit board, wherein the circuit board comprises a driving circuit, and the driving circuit comprises a crystal oscillator module X, a signal input end 101, a signal output end 102, a power line 103, a grounding wire 104 and a switch module S; the crystal oscillator module X comprises a first pin 1, a second pin 2, a third pin 3 and a fourth pin 4; the first pin 1 is electrically connected with the signal input end 101, the second pin 2 is electrically connected with the grounding wire 104, the third pin 3 is electrically connected with the signal output end 102, and the fourth pin 4 is electrically connected with the first end of the switch module S; the crystal oscillator module X comprises one of an active crystal oscillator X2 and a passive crystal oscillator X1; in the case that the crystal oscillator module X includes the passive crystal oscillator X1, the second end of the switch module S is electrically connected to the ground line 104; under the condition that the crystal oscillator module X comprises an active crystal oscillator X2, a second end of the switch module S is electrically connected with the power line 103; therefore, the passive crystal oscillator driving circuit and the active crystal oscillator driving circuit can be arranged on the same circuit board, the design and preparation cost of the circuit board is reduced, and the application range of the circuit board is widened.

An embodiment of the present application provides a method for manufacturing a circuit board, as shown in fig. 8, applied to manufacture the circuit board as described in the foregoing, the method including:

s801, providing a substrate of the circuit board;

for flexible circuit boards, the substrate comprises a flexible substrate, illustratively, the material of the flexible substrate comprises polyimide or mylar; alternatively, for a rigid circuit board, the substrate includes a rigid substrate, and the material of the rigid substrate includes a silicon material or the like, for example.

S802, forming a first conductive layer D1 which is positioned on one side of the substrate and comprises a power line 103;

the first conductive layer D1 includes a metal material, and the metal material includes copper, aluminum, nickel, gold, silver, an alloy, and the like.

The thickness of the first conductive layer D1 is determined according to a specific process.

After the first conductive layer D1 is formed, a first insulating layer is formed and an opening is formed in the first insulating layer.

S803, forming a second conductive layer D2 which is positioned on one side of the first conductive layer D1 away from the substrate and comprises the grounding wire 104;

the material of the second conductive layer D2 includes a metal material, and for example, the metal material includes copper, aluminum, nickel, gold, silver, an alloy, and the like.

The thickness of the second conductive layer D2 is determined according to a specific process.

After the second conductive layer D2 is formed, a second insulating layer is formed, and a hole is formed in the second insulating layer.

S804, forming a third conducting layer D4 which is positioned on one side, far away from the substrate, of the second conducting layer D2 and comprises a plurality of conducting pad groups; the conductive pad group comprises a crystal oscillator conductive pad group, and the orthographic projection area of the crystal oscillator conductive pad group on the substrate is larger than that of other conductive pad groups on the substrate; the crystal oscillator conductive pad group comprises a first conductive pad S1, a second conductive pad S2, a third conductive pad S3 and a fourth conductive pad S4, wherein the first conductive pad S1 is electrically connected with the first pin 1, the second conductive pad S2 is electrically connected with the second pin 2, the third conductive pad S3 is electrically connected with the third pin 3, and the fourth conductive pad S4 is electrically connected with the fourth pin 4; the first conducting layer D1, the second conducting layer D2 and the third conducting layer D3 are arranged in an insulating mode;

the material of the third conductive layer D3 includes a metal material, and for example, the metal material includes copper, aluminum, nickel, gold, silver, an alloy, and the like.

The thickness of the third conductive layer D3 is determined according to a specific process.

And S805, electrically connecting the component with each conductive pad group.

In an exemplary embodiment, the component and each of the conductive pad sets may be electrically connected together through a soldering process.

In an exemplary embodiment, after forming the third conductive layer D4 in step S804 and before electrically connecting the component and each conductive pad set together in step S805, the method further includes:

s806, determining whether the circuit board needs to use a driving circuit of an active crystal oscillator X2 or a driving circuit of a passive crystal oscillator X1;

step S805 of electrically connecting the component and each of the conductive pad sets includes:

and S8051, electrically connecting the corresponding component and the conductive pad group together according to the determined type of the driving circuit.

The types of the driving circuit include a driving circuit using an active crystal oscillator X2 or a driving circuit using a passive crystal oscillator X1. Components included in the driving circuit of the active crystal oscillator X2 and components included in the driving circuit of the passive crystal oscillator X1 may refer to the foregoing description, and are not described herein again.

In addition, in practical applications, in order to shorten the production cycle of the circuit board, it may be determined that the protective layer (e.g., the first protective layer B1 described in the foregoing) is formed before the component mounting or the protective layer (e.g., the second protective layer B2 described in the foregoing) is formed after the component mounting according to the fact that it is determined that the circuit board needs to use the driving circuit of the active crystal oscillator X2 or the driving circuit of the passive crystal oscillator X1 in step S806.

Of course, the first protective layer B1 and the second protective layer B2 may be provided at the same time.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A circuit board is characterized by comprising a substrate and a driving circuit positioned on the substrate, wherein the driving circuit comprises a crystal oscillator module, a signal input end, a signal output end, a power line, a grounding wire and a switch module;

2. The driving circuit according to claim 1, wherein in a case where the crystal oscillator module comprises the passive crystal oscillator, the driving circuit further comprises a first filtering module and a second filtering module;

3. The driving circuit of claim 2, wherein the first filtering module comprises a first capacitor and the second filtering module comprises a second capacitor;

and a first end of the second capacitor is electrically connected with the third pin, and a second end of the second capacitor is electrically connected with the grounding wire.

4. The driving circuit according to claim 1, wherein in a case where the crystal oscillator module includes an active crystal oscillator, the driving circuit further includes a voltage stabilizing module electrically connected to the power line through the switching module;

5. The driving circuit of claim 4, wherein the voltage regulation module comprises a third capacitor;

6. The drive circuit according to claim 1,

in the case where the crystal oscillator module comprises a passive crystal oscillator, the switch module comprises a first resistor; a first end of the first resistor is electrically connected with the fourth pin, and a second end of the first resistor is electrically connected with the grounding wire;

7. The driver circuit of claim 6, wherein the first resistance comprises a 0 ohm resistance and the second resistance comprises a 0 ohm resistance.

8. The circuit board of any one of claims 1-7, further comprising:

9. The circuit board of claim 8, wherein the set of conductive pads further comprises a first set of conductive pads located on a side of the third conductive pad distal from the second conductive pad;

the first conductive pad group comprises two conductive pads, one of the two conductive pads is electrically connected with the third conductive pad, and the other conductive pad is electrically connected with the ground line.

10. The circuit board of claim 9, wherein the conductive pad set further comprises a second conductive pad set and a third conductive pad set, the second conductive pad set being located on a side of the third conductive pad set away from the crystal oscillator conductive pad set; the orthographic projection of the second conductive pad group on the substrate is overlapped with the orthographic projection of the power line on the substrate;

wherein the second conductive pad group and the third conductive pad group respectively comprise two conductive pads, one of the conductive pads of the second conductive pad group is electrically connected with the power line, and the other of the conductive pads of the second conductive pad group is electrically connected with the fourth conductive pad;

one of the conductive pads of the third conductive pad set is electrically connected to the ground line, and the other of the conductive pads of the second conductive pad set is electrically connected to the fourth conductive pad.

11. The circuit board of claim 10, wherein the set of conductive pads further comprises a fourth set of conductive pads located on a side of the first conductive pad remote from the second conductive pad, the fourth set of conductive pads comprising two conductive pads, one of the conductive pads in the fourth set of conductive pads being electrically connected to the first conductive pad, and the other of the conductive pads in the fourth set of conductive pads being electrically connected to the ground line.

12. The circuit board of claim 11,

under the condition that the crystal oscillator module comprises the passive crystal oscillator, the driving circuit comprises a first capacitor, a second capacitor and a first resistor, the first conductive pad group is electrically connected with the second capacitor, the third conductive pad group is electrically connected with the first resistor, and the fourth conductive pad group is electrically connected with the first capacitor;

13. The circuit board of claim 11, wherein the set of conductive pads further comprises a fifth set of conductive pads located on a side of the fourth set of conductive pads away from the set of crystal oscillator conductive pads;

wherein the fifth conductive pad set comprises two conductive pads, one of the conductive pads is electrically connected to the fourth conductive pad, and the other conductive pad is electrically connected to the ground line.

14. The circuit board of claim 13,

15. The circuit board of claim 12, further comprising a first protective layer between the third conductive layer and the components, the first protective layer comprising a plurality of openings;

16. The circuit board of claim 12, further comprising a second passivation layer on the third conductive layer and a side of each component away from the substrate;

and under the condition that the crystal oscillator module comprises the active crystal oscillator, the second protective layer covers all the components, the first conductive pad group and the fourth conductive pad group.

17. The circuit board of claim 14, further comprising a first protective layer between the third conductive layer and the components, the first protective layer comprising a plurality of openings;

in the case that the crystal oscillator module comprises the passive crystal oscillator, the orthographic projection of the outline of the opening on the substrate defines an area overlapping with the orthographic projection of the crystal oscillator conductive pad group, the first conductive pad group, the third conductive pad group and the fourth conductive pad group on the substrate respectively;

under the condition that the crystal oscillator module comprises the active crystal oscillator, the area defined by the orthographic projection of the outer contour of the opening on the substrate is respectively overlapped with the orthographic projection of the crystal oscillator conductive pad group, the orthographic projection of the second conductive pad group and the orthographic projection of the fifth conductive pad group on the substrate.

18. The circuit board of claim 14, further comprising a second protective layer on the third conductive layer and a side of each component away from the substrate;

19. A display device, characterized by comprising a circuit board according to any one of claims 1-18.

20. A method for manufacturing a circuit board, which is applied to manufacture the circuit board according to any one of claims 8 to 18, the method comprising:

providing a substrate of the circuit board;

forming a second conductive layer, wherein the second conductive layer is positioned on one side, far away from the substrate, of the first conductive layer and comprises a grounding wire;

and electrically connecting each component with each conductive pad group.