CN115746756A - High-temperature-resistant acrylate pressure-sensitive adhesive and preparation method of acrylate pressure-sensitive adhesive - Google Patents

High-temperature-resistant acrylate pressure-sensitive adhesive and preparation method of acrylate pressure-sensitive adhesive Download PDF

Info

Publication number
CN115746756A
CN115746756A CN202211335165.5A CN202211335165A CN115746756A CN 115746756 A CN115746756 A CN 115746756A CN 202211335165 A CN202211335165 A CN 202211335165A CN 115746756 A CN115746756 A CN 115746756A
Authority
CN
China
Prior art keywords
monomer
sensitive adhesive
resistant
temperature
initiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202211335165.5A
Other languages
Chinese (zh)
Other versions
CN115746756B (en
Inventor
周永南
周霞
黄娟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Great Rich Technology Co Ltd
Original Assignee
Great Rich Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Great Rich Technology Co Ltd filed Critical Great Rich Technology Co Ltd
Priority to CN202211335165.5A priority Critical patent/CN115746756B/en
Publication of CN115746756A publication Critical patent/CN115746756A/en
Application granted granted Critical
Publication of CN115746756B publication Critical patent/CN115746756B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a high-temperature-resistant acrylate pressure-sensitive adhesive liquid which mainly comprises a polymerization main body, an initiator and a solvent, wherein the polymerization main body comprises a soft monomer, a hard monomer, a modified monomer and a heat-resistant monomer, the heat-resistant monomer accounts for 3-6% of the total mass of the polymerization main body, and the heat-resistant monomer comprises esterified modified lignin and ethylene glycol dimethacrylate. The high-temperature-resistant acrylate pressure-sensitive adhesive liquid comprises a heat-resistant monomer, wherein the heat-resistant monomer is used as a part of a polymerization main body, and the density of network crosslinking among polymerization monomers is controlled through the polymerization reaction of esterification modified lignin and ethylene glycol dimethacrylate with other polymerization monomers, so that the high-temperature resistance and the cohesion stability of the pressure-sensitive adhesive are improved.

Description

High-temperature-resistant acrylate pressure-sensitive adhesive and preparation method of acrylate pressure-sensitive adhesive
Technical Field
The invention relates to the technical field of pressure-sensitive adhesives, in particular to a high-temperature-resistant acrylate pressure-sensitive adhesive solution and a preparation method of the acrylate pressure-sensitive adhesive.
Background
With the rapid development of communication and electronic industries, the production of high frequency inductors is driven, and therefore, the carrier film, which is an auxiliary material in the processing process of the high frequency inductors, is increased. Wherein, 5G high frequency inductor processing is through high temperature treatment and processing condition require highly, and the performance requirement that uses the carrier membrane in the production process also increases thereupon. The carrier membrane according to the processing technology requirement of the high-frequency inductor is a high-thickness membrane, and simultaneously meets the requirement of excellent high-temperature stability in the high-temperature processing process. The stability includes non-delamination between the laminated structures, the dimensional stability of the film body and the maintenance of the functionality of each layer, especially the high temperature resistance of the adhesive layer, so that the stability of the carrier film in the whole processing process can be ensured and the dimensional stability of the carrier film can be further maintained.
Disclosure of Invention
One of the purposes of the invention is to overcome the defects in the prior art and provide a high-temperature-resistant acrylate pressure-sensitive adhesive solution, wherein the high-temperature resistance of the pressure-sensitive adhesive is improved by esterifying and modifying a heat-resistant monomer compounded by lignin and ethylene glycol dimethacrylate.
In order to realize the process effect, the technical scheme of the invention is as follows: the high-temperature-resistant acrylate pressure-sensitive adhesive liquid mainly comprises a polymerization main body, an initiator and a solvent, wherein the polymerization main body comprises a soft monomer, a hard monomer, a modified monomer and a heat-resistant monomer, the heat-resistant monomer accounts for 3-6% of the total mass of the polymerization main body, and the heat-resistant monomer comprises esterified modified lignin and ethylene glycol dimethacrylate.
The preferable technical scheme is as follows: the mass ratio of the esterification modified lignin to the ethylene glycol dimethacrylate is (0.2 to 0.6) to 1.
The preferable technical scheme is as follows: the mass ratio of the soft monomer to the hard monomer to the modified monomer is (16 to 30): 1: (1.2 to 4).
The preferable technical scheme is as follows: according to the mass parts, the pressure sensitive adhesive solution comprises 70 to 85 parts of soft monomer, 3~5 parts of hard monomer, 6 to 11 parts of modified monomer, 3~5 parts of heat-resistant monomer, 0.65 to 0.9 part of initiator and 110 to 180 parts of solvent.
The preferable technical scheme is as follows: the soft monomer is iso-octyl acrylate and/or butyl acrylate; the hard monomer is methyl methacrylate; the modified monomer is acrylic acid and hydroxyethyl acrylate.
The preferable technical scheme is as follows: the initiator is azobisisobutyronitrile and/or benzoyl peroxide.
The preferable technical scheme is as follows: the solvent is ethyl acetate.
The invention also aims to overcome the defects in the prior art and provide a preparation method of the acrylate pressure-sensitive adhesive, which comprises the following steps:
s1: mixing the polymerization main body in the high-temperature-resistant acrylate pressure-sensitive adhesive solution, and dividing the initiator into a first part of initiator and a second part of initiator;
s2: heating the solvent;
s3: dropwise adding the mixed polymerization main body of the S1, adding a first part of initiator, heating to be stable in a first section, and carrying out heat preservation reaction;
s4: and in the second stage, heating to be stable, adding a second part of initiator, and carrying out heat preservation reaction to obtain the acrylate pressure-sensitive adhesive.
The preferable technical scheme is as follows: the temperature of the first section is increased to 70-75 ℃, and the temperature of the second section is increased to 77-85 ℃.
The preferable technical scheme is as follows: the mass of the first part of initiator accounts for 4-10% of the total mass of the initiator.
The invention has the advantages and beneficial effects that:
the high-temperature-resistant acrylate pressure-sensitive adhesive liquid comprises a heat-resistant monomer, wherein the heat-resistant monomer is used as a part of a polymerization main body, and the density of network crosslinking among polymerization monomers is controlled through the polymerization reaction of esterification modified lignin and ethylene glycol dimethacrylate with other polymerization monomers, so that the high-temperature resistance and the cohesion stability of the pressure-sensitive adhesive are improved.
Detailed Description
The following further describes embodiments of the present invention with reference to examples. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Raw materials
Ethylene glycol dimethacrylate was produced by Guangzhou double bond chemical trade company;
isooctyl acrylate is manufactured by Shanghai friendship corporation;
butyl acrylate is manufactured by Shanghai friendship corporation;
methyl methacrylate is produced by taiwan tai plastic group of china;
acrylic acid is produced by taiwan tai plastic group;
hydroxyethyl acrylate was produced by LG group corporation of Korea;
azobisisobutyronitrile was produced by Jiangsu Kovar corporation;
benzoyl peroxide was produced by Jiangsu Kovar chemical Co., ltd;
calcium lignosulfonate, mclin chemical agents (96%, weight average molecular weight 528.61 g/mol);
acryloyl Chloride (AC), 96%, mclin chemical agents;
n, N-dimethylacetamide (DMAc), absolute ethyl alcohol, triethylamine (TEA), analytically pure, chemical reagents of the national drug group, inc.
Preparing esterification modified lignin:
in an ice-water bath, dissolving 10g of calcium lignosulfonate in a N, N-dimethylacetamide (DMAc) solution, fully stirring until the solution is uniform, adding 14g of Triethylamine (TEA) in an inert gas atmosphere, slowly adding an esterification reagent Acryloyl Chloride (AC), wherein the dropping time is 1h, the mass ratio of the calcium lignosulfonate to the acryloyl chloride is 1.3, heating after the dropping is finished, and the reaction temperature is 62 ℃ and the reaction time is 6h. And filtering the reaction product, precipitating in ethanol, centrifuging, washing, transferring to a 50 ℃ oven, and drying to constant weight for later use.
Polymeric host
The soft monomer is also called as a viscous monomer and is a main monomer for preparing the pressure-sensitive adhesive, and the soft monomer is mainly alkyl acrylate with 4 to 12 carbon atoms. Has the advantages of low glass transition temperature and good initial viscosity. Soft monomers include, but are not limited to, ethyl acrylate, butyl acrylate, and isooctyl acrylate. Further, the soft monomer is isooctyl acrylate, or a combination of isooctyl acrylate and butyl acrylate. Furthermore, the mass ratio of the isooctyl acrylate to the butyl acrylate is 1: (0.8 to 1.1).
Hard monomers, also referred to as cohesive monomers, are primarily acrylates or other ethylenic monomers. The effect is to produce homopolymers with higher glass transition temperatures and to copolymerize soft monomers. Hard monomers include, but are not limited to, methyl acrylate, methyl methacrylate, vinyl acetate, and styrene. Further, the hard monomer is methyl methacrylate.
The modifying monomer is also called crosslinking monomer or functional monomer, and refers to alkene monomer which has various reactive functional groups and can be copolymerized with soft monomer and hard monomer. Modifying monomers include, but are not limited to, acrylic acid, methacrylic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, acrylamide, methacrylamide, maleic acid, and maleic anhydride. Further, the modified monomer is acrylic acid and hydroxyethyl acrylate. Further, the mass ratio of acrylic acid to hydroxyethyl acrylate is (1~3): 1. further, the mass ratio of acrylic acid to hydroxyethyl acrylate is (1.5 to 3): 1.
n-vinylpyrrolidone (NVP), 4-Acryloylmorpholine (ACMO), ethylene Glycol Dimethacrylate (EGDMA) and trimethylolpropane triacrylate (TMPTA) are frequently used as heat-resistant monomers. The heat-resistant monomer accounts for the total mass of the main polymerization body, the monomer has too large polymerization molecular weight and too large crosslinking density, and further the pressure-sensitive adhesive is colloidal gel; too little pressure sensitive adhesive colloid has poor temperature resistance and can not meet the requirements of high temperature resistance and reduced permanent viscosity.
Solvent(s)
In the synthesis process of the acrylate pressure-sensitive adhesive, the solvent has an induction effect in the free radical decomposition process, so that the molecular weight of the polymer is influenced, and the bonding performance of the pressure-sensitive adhesive is further influenced. Further, the solvent is ethyl acetate.
Heat-resistant monomer
Further, the heat-resistant monomer is esterification modified lignin and ethylene glycol dimethacrylate. The amount of linear polymerization macromolecules of the ethylene glycol dimethacrylate and the esterification modified lignin is increased in the initial reaction stage, so that the heat resistance and the weather resistance of the pressure-sensitive adhesive are improved, the polymerization molecular weight is increased, the network crosslinking density is controlled, the cohesion stability and the sustained viscosity are ensured, and the high temperature resistance is better. The addition of the esterified modified lignin can improve the thermal stability of the polymeric substance. The consumption of the esterification modified lignin is too small, the molecular crosslinking is insufficient, the high temperature resistance at the temperature of more than 150 ℃ is poor, and the viscosity retention of the pressure-sensitive adhesive colloid is reduced; the consumption of the esterification modified lignin is too large, the reaction viscosity is increased too fast and is not easy to control, and the crosslinking density is too large, thereby having negative influence on the comprehensive performance of the pressure-sensitive adhesive colloid. The mass ratio of the esterification modified lignin to the ethylene glycol dimethacrylate is (0.2 to 0.6): 1. further, the mass ratio of the esterification modified lignin to the ethylene glycol dimethacrylate is (0.25 to 0.5): 1.
initiator
The use amount of the pressure-sensitive adhesive is too much, so that the molecular weight of the pressure-sensitive adhesive colloid is small, and the adhesive property is reduced; if too little, the reaction time is prolonged, the conversion rate of the monomers is low, and the residue is high. Further, the initiator is azobisisobutyronitrile and/or benzoyl peroxide. Further, the initiator is azobisisobutyronitrile.
Preparation method of acrylate pressure-sensitive adhesive
S1: mixing a soft monomer, a hard monomer, a modified monomer and a heat-resistant monomer in the pressure-sensitive adhesive solution, and dividing an initiator into a first initiator and a second initiator, wherein the mass of the first initiator accounts for 4-10% of the total mass of the initiators;
s2: heating a solvent ethyl acetate to the initial temperature of room temperature, and heating to 40-45 ℃;
s3: dropwise adding the mixed polymerization main body of the S1, adding a first part of initiator, heating to a stable temperature in a first period, heating to 70-75 ℃ in the first period, wherein the heating time is 0.5-1h, and carrying out heat preservation reaction for 2-2.5 h;
s4: and (3) heating to be stable in the second period, heating to be 77-85 ℃ in the second period, heating for 20-25min, adding a second initiator for 40-60min, and carrying out heat preservation reaction for 1.5-2h to obtain the acrylate pressure-sensitive adhesive.
Example 1
According to the mass portion, the main components of the high-temperature resistant acrylate pressure-sensitive adhesive solution are 82 parts of soft monomer, 4 parts of hard monomer, 10 parts of modified monomer, 4 parts of heat-resistant monomer, 0.75 part of initiator and 160 parts of solvent. The solvent is ethyl acetate, and the initiator is azobisisobutyronitrile.
The heat-resistant monomer is esterification modified lignin and ethylene glycol dimethacrylate. The mass ratio of the esterification modified lignin to the ethylene glycol dimethacrylate is 0.4:1.
the soft monomer is isooctyl acrylate and butyl acrylate, and the mass ratio of the isooctyl acrylate to the butyl acrylate is 1:1; the hard monomer is methyl methacrylate; the modified monomer is acrylic acid and hydroxyethyl acrylate, and the mass ratio of the acrylic acid to the hydroxyethyl acrylate is 1.8:1.
the preparation method of the acrylate pressure-sensitive adhesive comprises the following steps:
s1: mixing a soft monomer, a hard monomer, a modified monomer and a heat-resistant monomer according to a ratio, and dividing an initiator into a first initiator and a second initiator, wherein the mass of the first initiator accounts for 8% of the total mass of the initiator;
s2: heating the solvent ethyl acetate to 40 ℃ with the initial temperature of room temperature;
s3: dropwise adding the mixed polymerization main body of the S1, adding a first part of initiator, heating the first section to be stable, heating the first section to 72 ℃, keeping the temperature for reaction for 1h, and keeping the temperature for reaction for 2h;
s4: and (3) heating to be stable in the second stage, heating to 80 ℃ in the second stage, heating for 20min, adding a second part of initiator, dropwise adding the second part of initiator for 55min, and carrying out heat preservation reaction for 2h to obtain the acrylate pressure-sensitive adhesive.
Example 2
Example 2 is based on example 1, except that the mass ratio of the esterified modified lignin to the ethylene glycol dimethacrylate is unchanged, and the high-temperature resistant acrylate pressure sensitive adhesive solution mainly comprises 82 parts by mass of a soft monomer, 4 parts by mass of a hard monomer, 10 parts by mass of a modified monomer, 5 parts by mass of a heat resistant monomer, 0.75 part by mass of an initiator and 160 parts by mass of a solvent. The heat-resistant monomer accounts for 5% of the total mass of the main polymer. The process conditions were unchanged.
Example 3
Example 3 is based on example 1, except that the mass ratio of the esterified modified lignin to the ethylene glycol dimethacrylate is unchanged, and the high-temperature resistant acrylate pressure sensitive adhesive solution mainly comprises 75 parts by mass of a soft monomer, 3 parts by mass of a hard monomer, 9 parts by mass of a modified monomer, 5 parts by mass of a heat-resistant monomer, 0.75 part by mass of an initiator and 160 parts by mass of a solvent. The heat-resistant monomer accounts for 5.4% of the total mass of the main polymer. The process conditions were unchanged.
Example 4
Example 4 is based on example 1, with the difference that the main components of the high temperature resistant acrylate pressure sensitive adhesive solution are unchanged, and the mass ratio of the esterified modified lignin to the ethylene glycol dimethacrylate is 0.2:1. the process conditions were unchanged.
Example 5
Example 5 is based on example 1, with the difference that the main components of the high temperature resistant acrylate pressure sensitive adhesive solution are unchanged, and the mass ratio of the esterified modified lignin to the ethylene glycol dimethacrylate is 0.55:1. the process conditions were unchanged.
Example 6
Example 6 is based on example 2, except that the main components of the high temperature resistant acrylate pressure sensitive adhesive solution are unchanged, and the mass ratio of the esterified modified lignin to the ethylene glycol dimethacrylate is 0.3:1. the process conditions were unchanged.
Example 7
Example 7 is based on example 1 with the difference that the components are unchanged, the parts of the components added are unchanged, and the mass ratio of acrylic acid to hydroxyethyl acrylate in the modified monomer is 1:1. the process conditions were unchanged.
Example 8
Example 8 is based on example 1 except that the soft monomer is isooctyl acrylate and no portion of the added component is changed. The process conditions were unchanged.
Example 9
Example 9 is based on example 1 with the difference that the initiator is benzoyl peroxide. The process conditions were unchanged.
Example 10
Example 10 is based on example 1, except that the composition of the pressure-sensitive adhesive solution is unchanged, the first stage of temperature rise is not set, the mixed polymerization main body of S1 is added dropwise, the first part of initiator is added, the temperature is raised to 80 ℃, the temperature rise time is 1h, after the temperature is stabilized, the second part of initiator is added, the dropwise adding time of the second part of initiator is 55min, and the temperature is kept for 2h, so that the acrylate pressure-sensitive adhesive is prepared.
Example 11
Example 11 is based on example 1 with the difference that the first stage is warmed to 65 ℃ and the other process conditions are unchanged.
Example 12
Example 12 is based on example 1 with the difference that the second stage is warmed to 75 ℃ and the other process conditions are unchanged.
Comparative example 1
Comparative example 1 is based on example 1 with the difference that the heat resistant monomer is only an esterification modified lignin. The parts of all the components added into the pressure-sensitive adhesive solution are unchanged, and the process conditions are unchanged.
Comparative example 2
Comparative example 2 is based on example 1 with the difference that the heat-resistant monomer is only ethylene glycol dimethacrylate. The parts of the components added into the pressure-sensitive adhesive solution are unchanged, and the process conditions are unchanged.
Comparative example 3
Comparative example 3 is based on example 1, except that the high temperature resistant acrylate pressure sensitive adhesive solution mainly comprises, by mass, 70 parts of a soft monomer, 3 parts of a hard monomer, 10 parts of a modified monomer, 5.5 parts of a heat resistant monomer, 0.75 part of an initiator, and 160 parts of a solvent. The heat-resistant monomer accounts for 6.2% of the total mass of the main polymer. The mass ratio of the esterification modified lignin to the ethylene glycol dimethacrylate is unchanged.
Performance testing
(1) Peel strength: according to the standard GB/T2792-2014, a standard adhesive tape (25mm. About.200mm) is attached to a stainless steel plate wiped clean by alcohol, back-pressed by a press roll of 2kg, placed at room temperature for a period of time, tested by a peel force tester, measured for more than three times, and averaged.
(2) Permanent adhesion: according to the standard GB/T4851-2014, a standard adhesive tape (25 mm in width and 100mm in length) is attached to a stainless steel plate, the upper end of the standard adhesive tape is aligned with a standard line, the redundant part at the lower end of the standard adhesive tape is cut off, the stainless steel plate is placed at 150 ℃ for 30min after being subjected to back pressing for three times by a 2kg pressing roller, the stainless steel plate attached with a sample is vertically hung on a test frame and kept in a static state, a weight of 200g is hung below the test frame, and the time for which the adhesive tape falls represents the magnitude of the pressure-sensitive adhesive holding power. The same procedure was used to determine the tack strength after 30min at 180 ℃.
(3) High temperature resistance: wiping a stainless steel plate, uniformly sticking a pressure-sensitive adhesive sample with the specification of 25mm x 100mm on the stainless steel plate, putting the stainless steel plate into an oven, baking the stainless steel plate for 30min at the temperature of 150 ℃, taking out the stainless steel plate, cooling the stainless steel plate to room temperature, slowly stripping off an adhesive tape, observing the surface condition of the stainless steel plate, and mainly observing the deformation condition and the adhesive residue condition of the adhesive tape. The same method was used to test the tape for changes at 180 ℃.
The method for grading the residual glue condition comprises the following steps: the grades are classified into A, B, C, D four grades, grade a: no residue is left; b stage: the ratio of the residual area to the total area of the pressure-sensitive adhesive sample is 1% -5%; the ratio of the C-grade residual area to the total area of the pressure-sensitive adhesive sample is 6-30%; d stage: the ratio of the residual area to the total area of the pressure-sensitive adhesive sample is more than 31 percent.
The results of the performance tests of the examples and comparative examples are as follows:
Figure DEST_PATH_IMAGE001
the optimal performance satisfies: the 180 DEG peeling force is 220 to 280 g/25mm; the permanent viscous force at 150 ℃ is more than or equal to 62h, and the permanent viscous force at 180 ℃ is more than or equal to 55h; high temperature resistance, both of A grade at 150 ℃ and 180 ℃.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. The high-temperature-resistant acrylate pressure-sensitive adhesive liquid is characterized by mainly comprising a polymerization main body, an initiator and a solvent, wherein the polymerization main body comprises a soft monomer, a hard monomer, a modified monomer and a heat-resistant monomer, the heat-resistant monomer accounts for 3-6% of the total mass of the polymerization main body, and the heat-resistant monomer comprises esterified modified lignin and ethylene glycol dimethacrylate.
2. The high-temperature-resistant acrylate pressure-sensitive adhesive solution as claimed in claim 1, wherein the mass ratio of the esterified modified lignin to the ethylene glycol dimethacrylate is (0.2-0.6): 1.
3. The high-temperature-resistant acrylate pressure-sensitive adhesive solution as claimed in claim 1 or 2, wherein the mass ratio of the soft monomer to the hard monomer to the modified monomer is (16 to 30): 1: (1.2 to 4).
4. The high-temperature-resistant acrylate pressure-sensitive adhesive solution as claimed in claim 1 or 2, wherein the pressure-sensitive adhesive solution comprises, by mass, 70 to 85 parts of soft monomer, 3~5 parts of hard monomer, 6 to 11 parts of modified monomer, 3~5 parts of heat-resistant monomer, 0.65 to 0.9 part of initiator and 110 to 180 parts of solvent.
5. The high-temperature-resistant acrylate pressure-sensitive adhesive solution according to claim 4, wherein the soft monomer is isooctyl acrylate and/or butyl acrylate; the hard monomer is methyl methacrylate; the modified monomer is acrylic acid and hydroxyethyl acrylate.
6. The high-temperature-resistant acrylate pressure-sensitive adhesive solution according to claim 4, wherein the initiator is azobisisobutyronitrile and/or benzoyl peroxide.
7. The high-temperature-resistant acrylate pressure-sensitive adhesive solution according to claim 4, wherein the solvent is ethyl acetate.
8. The preparation method of the acrylate pressure-sensitive adhesive is characterized by comprising the following steps:
s1: mixing the high temperature resistant acrylate pressure sensitive adhesive of any one of claim 1~7 with a polymerization host, dividing the initiator into a first part initiator and a second part initiator;
s2: heating the solvent;
s3: dropwise adding the mixed polymerization main body of the S1, adding a first part of initiator, heating to be stable in a first section, and carrying out heat preservation reaction;
s4: and in the second stage, heating to be stable, adding a second part of initiator, and carrying out heat preservation reaction to obtain the acrylate pressure-sensitive adhesive.
9. The method for preparing the acrylate pressure-sensitive adhesive according to claim 8, wherein the temperature of the first section is raised to 70 to 75 ℃, and the temperature of the second section is raised to 77 to 85 ℃.
10. The method for preparing the acrylate pressure-sensitive adhesive according to claim 8, wherein the mass of the first part of the initiator accounts for 4-10% of the total mass of the initiator.
CN202211335165.5A 2022-10-28 2022-10-28 High-temperature-resistant acrylic ester pressure-sensitive adhesive liquid and preparation method of acrylic ester pressure-sensitive adhesive Active CN115746756B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211335165.5A CN115746756B (en) 2022-10-28 2022-10-28 High-temperature-resistant acrylic ester pressure-sensitive adhesive liquid and preparation method of acrylic ester pressure-sensitive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211335165.5A CN115746756B (en) 2022-10-28 2022-10-28 High-temperature-resistant acrylic ester pressure-sensitive adhesive liquid and preparation method of acrylic ester pressure-sensitive adhesive

Publications (2)

Publication Number Publication Date
CN115746756A true CN115746756A (en) 2023-03-07
CN115746756B CN115746756B (en) 2024-05-14

Family

ID=85355800

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211335165.5A Active CN115746756B (en) 2022-10-28 2022-10-28 High-temperature-resistant acrylic ester pressure-sensitive adhesive liquid and preparation method of acrylic ester pressure-sensitive adhesive

Country Status (1)

Country Link
CN (1) CN115746756B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1693342A (en) * 2005-04-30 2005-11-09 江苏工业学院 Process for preparing modified lignocellulose sulfonate graft copolymer
US20080033095A1 (en) * 2006-08-03 2008-02-07 Nitto Denko Corporation Method for producing aqueous pressure-sensitive adhesive composition
CN106590478A (en) * 2016-12-07 2017-04-26 哈尔滨工业大学无锡新材料研究院 High-temperature-resistant solvent-type acrylate pressure-sensitive adhesive and preparation method thereof
CN113583600A (en) * 2021-08-30 2021-11-02 江苏晶华新材料科技有限公司 High-temperature-resistant pressure-sensitive adhesive, preparation process and application thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1693342A (en) * 2005-04-30 2005-11-09 江苏工业学院 Process for preparing modified lignocellulose sulfonate graft copolymer
US20080033095A1 (en) * 2006-08-03 2008-02-07 Nitto Denko Corporation Method for producing aqueous pressure-sensitive adhesive composition
CN106590478A (en) * 2016-12-07 2017-04-26 哈尔滨工业大学无锡新材料研究院 High-temperature-resistant solvent-type acrylate pressure-sensitive adhesive and preparation method thereof
CN113583600A (en) * 2021-08-30 2021-11-02 江苏晶华新材料科技有限公司 High-temperature-resistant pressure-sensitive adhesive, preparation process and application thereof

Also Published As

Publication number Publication date
CN115746756B (en) 2024-05-14

Similar Documents

Publication Publication Date Title
US10414954B2 (en) Water-based pressure-sensitive adhesive compositions
CN105647087B (en) Curable compositions, contact adhesive, adhesive tape, adhesive article
US9399724B2 (en) Pressure-sensitive adhesives with (meth)acrylic-based elastomeric materials prepared using (2-isopropyl-5-methyl)hexyl (meth)acrylate
KR20140016842A (en) Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet and optical film
CN102492379A (en) Fog-resistant aqueous pressure-sensitive adhesive and polyethylene protection film containing same
CA2067969A1 (en) Method for making structured suspension psa beads
KR101675452B1 (en) Acrylic emulsion pressure sensitive adhesive agent with good low-temperature resistance and production method thereof
KR20190072421A (en) Aqueous acrylic adhesive for clothes and method for preparing the same
US10081745B1 (en) Water-based pressure-sensitive adhesive compositions
KR102671012B1 (en) Acrylic emulsion pressure sensitive adhesive composition
CN115746756A (en) High-temperature-resistant acrylate pressure-sensitive adhesive and preparation method of acrylate pressure-sensitive adhesive
JPH0155641B2 (en)
CN116063960A (en) Flame-retardant binding material for power battery module and preparation process and application thereof
CN115322705A (en) Ultrathin high-stripping polyacrylate pressure-sensitive adhesive and preparation method thereof
EP4045546B1 (en) Method for producing a removable pressure-sensitive adhesive (psa) and pressure-sensitive adhesive thus produced
JP2670055B2 (en) Pressure sensitive adhesive
KR20090112103A (en) Method for Preparing Starch-Acryl Copolymer Using Emulsifier-Free Emulsion Polymerization
KR102332742B1 (en) Acrylic emulsion pressure sensitive adhesive composition
KR100869483B1 (en) Release Coating and Process
KR20210148722A (en) Acrylic emulsion pressure snsitive adhesive composition
KR101350515B1 (en) Acrylic sticky adhesive composition of water dispersion
CN113201286A (en) High-filling modified polyacrylate optical adhesive composition, OCA pressure-sensitive adhesive tape and preparation method thereof
KR102625863B1 (en) Acrylic emulsion pressure snsitive adhesive composition
JP4366708B2 (en) Water-dispersed pressure sensitive adhesive for re-peeling
CN115491153B (en) Cross-linked aqueous acrylic ester segmented copolymer pressure-sensitive adhesive and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant