CN115744964A - Novel production process of large-particle copper sulfate - Google Patents
Novel production process of large-particle copper sulfate Download PDFInfo
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- CN115744964A CN115744964A CN202211620768.XA CN202211620768A CN115744964A CN 115744964 A CN115744964 A CN 115744964A CN 202211620768 A CN202211620768 A CN 202211620768A CN 115744964 A CN115744964 A CN 115744964A
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- Prior art keywords
- copper
- copper sulfate
- waste liquid
- etching waste
- temperature
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- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 title claims abstract description 50
- 229910000365 copper sulfate Inorganic materials 0.000 title claims abstract description 49
- 239000002245 particle Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 claims abstract description 65
- 239000010949 copper Substances 0.000 claims abstract description 65
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000005530 etching Methods 0.000 claims abstract description 47
- 239000002699 waste material Substances 0.000 claims abstract description 46
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 29
- 239000002994 raw material Substances 0.000 claims abstract description 29
- 238000002425 crystallisation Methods 0.000 claims abstract description 25
- 230000008025 crystallization Effects 0.000 claims abstract description 25
- 239000013078 crystal Substances 0.000 claims abstract description 20
- 238000001914 filtration Methods 0.000 claims abstract description 16
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims abstract description 15
- 235000011114 ammonium hydroxide Nutrition 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 43
- 239000000243 solution Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 239000012452 mother liquor Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- WIVXEZIMDUGYRW-UHFFFAOYSA-L copper(i) sulfate Chemical compound [Cu+].[Cu+].[O-]S([O-])(=O)=O WIVXEZIMDUGYRW-UHFFFAOYSA-L 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000000967 suction filtration Methods 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 239000005752 Copper oxychloride Substances 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- HKMOPYJWSFRURD-UHFFFAOYSA-N chloro hypochlorite;copper Chemical compound [Cu].ClOCl HKMOPYJWSFRURD-UHFFFAOYSA-N 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ZURAKLKIKYCUJU-UHFFFAOYSA-N copper;azane Chemical compound N.[Cu+2] ZURAKLKIKYCUJU-UHFFFAOYSA-N 0.000 description 1
- 238000005008 domestic process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention belongs to the technical field of copper sulfate preparation, and provides a novel production process of large-particle copper sulfate, which comprises the following steps: s1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid is more than or equal to 10%; s2, continuously reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride; s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid in a ratio of 7: 3 to 8: 2 into the basic copper chloride obtained in the step S2 as a raw material, reacting for a preset time under the conditions of preset rotating speed, temperature and pH to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product; and S4, performing a cooling crystallization test on the primary crystallization product in the S3 to obtain a secondary crystallization product. The copper sulfate preparation process has the characteristics of reasonable design, low production cost, small pollution and the like.
Description
Technical Field
The invention belongs to the technical field of copper sulfate preparation, and particularly relates to a novel production process of large-particle copper sulfate.
Background
Copper sulfate is one kind of copper salt in copper compound and has wide use. At present, the domestic process for producing copper sulfate mainly comprises two methods: one is a sulfuric acid synthesis method after etching and neutralization of circuit board etching solution, and the raw materials are wastes in the circuit board industry, so the quantity is large.
Chinese application No. CN202110080063.2 discloses a production process for producing high-purity copper sulfate by a pressurization method, comprising the following steps: (1) adding grade A or No. 1 cathode copper, copper sulfate mother liquor and concentrated sulfuric acid into a reaction kettle; (2) filling air into the chemical liquid in the reaction kettle to enable oxygen in the air to participate in the reaction, pressurizing the chemical liquid, reacting a part of copper material with sulfuric acid to generate copper sulfate, generating cuprous sulfate in the other part of copper material, releasing heat in the chemical liquid during the chemical reaction process, controlling the temperature of the chemical liquid to be 80-95 ℃, and reacting for 6-8 hours to generate sulfate precipitate; (3) filtering out sulfate precipitate and copper scraps; (4) adding hydrogen peroxide into the filtered mixed solution and boiling to convert cuprous sulfate into copper sulfate; (5) automatically cooling the copper sulfate solution until the temperature is reduced to room temperature, and crystallizing the copper sulfate in the solution; (6) filtering to obtain copper sulfate crystals, drying, and drying to obtain the final high-purity copper sulfate product with high purity and good quality. However, the method has the disadvantages of various production equipment, single function, low selection and incapability of producing large-particle copper sulfate. However, the copper sulfate preparation process disclosed in the patent also has the problems of complex process, environmental pollution and the like.
Disclosure of Invention
The invention provides a novel production process of large-particle copper sulfate, and aims to solve the problems in the background technology.
The invention is realized in this way, a new production technology of large-particle copper sulfate, comprising the following steps:
s1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid is more than or equal to 10%;
s2, reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid in a ratio of 7: 3 to 8: 2 into the basic copper chloride obtained in the step S2 as a raw material, reacting for a preset time under the conditions of preset rotating speed, temperature and pH to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Preferably, in S3, the rotation speed is in the range of 50-80r/min, the temperature is in the range of 70-100 ℃, the pH value is in the range of 0.1-0.5, and the time is in the range of 0.5-2 h.
Preferably, the rotational speed in S3 is 65r/min.
Preferably, the temperature in S3 is in particular 80 ℃.
Preferably, the pH value in S3 is in particular 0.3.
Preferably, the time period in S3 is specifically 1h.
Preferably, in S4, the secondary crystallized product is centrifuged to obtain a copper sulfate product.
Compared with the prior art, the invention has the beneficial effects that: the novel production process of large-particle copper sulfate disclosed by the invention has the characteristics that basic copper chloride is generated by using the copper-containing etching waste liquid and 25% ammonia water, then copper sulfate is generated by using the basic copper chloride and 98% concentrated sulfuric acid, and impurities (metal impurities and salt) are reduced in the production process by using the basic copper chloride as an intermediate, so that the process has the advantages of reasonable design, low production cost, small pollution and the like.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention provides a technical scheme that: a novel production process of large-particle copper sulfate comprises the following steps:
s1, selecting copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid is more than or equal to 10%. In this step, the copper content in the copper-containing etching waste liquid is preferably 20%, 30% and 40% in percentage. And the content of copper in the copper-containing etching waste liquid is less than 10 percent, which affects the subsequent production of copper sulfate.
And S2, reacting the copper-containing etching waste liquid with 25% ammonia water continuously under the conditions of preset rotating speed, temperature and pH value for preset time, and filtering to obtain the copper oxychloride. In the step, reaction conditions are controlled to generate basic copper chloride crystals, when a certain amount of crystals are generated, the crystals are discharged into a suction filtration tank, suction filtration is carried out, mother liquor of the crystals is pumped away, tap water and steam condensate water are used for washing products, three-stage countercurrent washing is adopted, and concentrated washing liquid is discharged; and (4) classifying and collecting the crystallization mother liquor and the concentrated washing liquor, and respectively transferring the crystallization mother liquor and the concentrated washing liquor to a copper-ammonium recovery treatment working section to carry out copper and ammonium recovery treatment. And (4) centrifuging and spin-drying the washed basic copper chloride crystal to obtain a basic copper chloride product.
And S3, adding 98% concentrated sulfuric acid and 70% sulfuric acid in a ratio of 7: 3 to 8: 2 into the basic copper chloride obtained in the step S2 as a raw material, reacting for a preset time under the conditions of preset rotating speed, temperature and pH to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product. In this step, the reaction principle of basic copper chloride and sulfuric acid has a chemical formula of 2Cu (OH) 3 Cl＋3H 2 SO 4 = 3CuSO 4 ＋ CuCl 2 ＋6H 2 O。
And S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Preferably, in S3, the rotation speed is in the range of 50-80r/min, the temperature is in the range of 70-100 ℃, the pH value is in the range of 0.1-0.5, and the time is in the range of 0.5-2 h.
Specifically, in S3, the rotating speed is 65r/min.
Specifically, the temperature in S3 is specifically 80 ℃.
Specifically, the pH value in S3 is specifically 0.3.
Specifically, the time period in S3 is specifically 1h.
Specifically, in S4, the secondary crystallization product is subjected to centrifugal separation to obtain a copper sulfate product.
In order to better illustrate the invention, the following examples are provided.
Example 1
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting for 1 hour at a rotating speed of 65r/min, at 80 ℃ and under the condition that the pH value is 0.3, so as to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Example 2
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, continuously reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting continuously for 1.5 hours at a rotating speed of 65r/min, at 80 ℃ and at a pH value of 0.3 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallization product in the S3 to obtain a secondary crystallization product.
Example 3
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting for 2 hours at a rotating speed of 65r/min, at 80 ℃ and under the condition that the pH value is 0.3, so as to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Example 4
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, continuously reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting for 1 hour at a rotation speed of 60r/min, at 80 ℃ and at a pH value of 0.3 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product, wherein the ratio of the concentrated sulfuric acid to the sulfuric acid is 7: 3 to 8: 2;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Example 5
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, continuously reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting for 1 hour at a rotation speed of 70r/min, at 80 ℃ and at a pH value of 0.3 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product, wherein the ratio of the concentrated sulfuric acid to the sulfuric acid is 7: 3 to 8: 2;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Example 6
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, continuously reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting for 1 hour at a rotation speed of 80r/min, at 80 ℃ and at a pH value of 0.3 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product, wherein the ratio of the concentrated sulfuric acid to the sulfuric acid is 7: 3 to 8: 2;
and S4, performing a cooling crystallization test on the primary crystallization product in the S3 to obtain a secondary crystallization product.
Example 7
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting for 1 hour at a rotating speed of 65r/min at 70 ℃ and a pH value of 0.3 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product, wherein the ratio of the concentrated sulfuric acid to the sulfuric acid is 7: 3 to 8: 2;
and S4, performing a cooling crystallization test on the primary crystallization product in the S3 to obtain a secondary crystallization product.
Example 8
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, continuously reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting continuously for 1 hour at a rotation speed of 65r/min and a pH value of 0.3 at 90 ℃ in a ratio of 7: 3 to 8: 2 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Example 9
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, continuously reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting continuously for 1 hour at a rotation speed of 65r/min and a pH value of 0.3 at 100 ℃ in a ratio of 7: 3 to 8: 2 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
Example 10
S1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid accounts for 10%;
s2, reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid into the basic copper chloride obtained in the step S2 as a raw material, reacting for 1 hour at a rotation speed of 65r/min and a pH value of 0.2 at 90 ℃ in a ratio of 7: 3 to 8: 2 to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The novel production process of the large-particle copper sulfate is characterized by comprising the following steps of:
s1, selecting a copper-containing etching waste liquid as a raw material, wherein the copper content of the copper-containing etching waste liquid is more than or equal to 10%;
s2, reacting the copper-containing etching waste liquid with 25% ammonia water for a preset time under the conditions of preset rotating speed, temperature and pH value, and filtering to obtain basic copper chloride;
s3, adding 98% concentrated sulfuric acid and 70% sulfuric acid in a ratio of 7: 3 to 8: 2 into the basic copper chloride obtained in the step S2 as a raw material, reacting for a preset time under the conditions of preset rotating speed, temperature and pH to obtain a copper sulfate solution, and cooling to a specific temperature to obtain a primary crystal product;
and S4, performing a cooling crystallization test on the primary crystallized product in the S3 to obtain a secondary crystallized product.
2. The novel process for producing large particle copper sulfate as claimed in claim 1, wherein the rotation speed is in the range of 50 to 80r/min, the temperature is in the range of 70 to 100 ℃, the pH is in the range of 0.1 to 0.5, and the time is in the range of 0.5 to 2 hours in S3.
3. The novel process for producing large-particle copper sulfate as claimed in claim 2, wherein the rotation speed in S3 is 65r/min.
4. The novel process for producing large particle copper sulfate as claimed in claim 2, wherein the temperature in S3 is 80 ℃.
5. The novel process for producing large particle copper sulfate as claimed in claim 2, wherein the pH value in S3 is 0.3.
6. The novel process for producing large particle copper sulfate as claimed in claim 2, wherein the time period in S3 is 1 hour.
7. The novel process for producing large-particle copper sulfate as claimed in claim 1 or 2, wherein the second crystallized product is centrifuged to obtain a copper sulfate product in S4.
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| CN114314637A (en) * | 2021-12-31 | 2022-04-12 | 东江环保股份有限公司 | Method for preparing high-purity copper sulfate from acidic copper chloride etching waste liquid |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114314637A (en) * | 2021-12-31 | 2022-04-12 | 东江环保股份有限公司 | Method for preparing high-purity copper sulfate from acidic copper chloride etching waste liquid |
Non-Patent Citations (1)
| Title |
|---|
| 刘华等: "碱性蚀刻废液制备硫酸铜的研究", 《化学工程与装备》, no. 05, pages 22 - 26 * |
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