CN115734143A - Earphone reliability evaluation method and device, readable storage medium and electronic equipment - Google Patents
Earphone reliability evaluation method and device, readable storage medium and electronic equipment Download PDFInfo
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Abstract
A method, a device, a readable storage medium and an electronic device for evaluating the reliability of an earphone are provided, wherein the method comprises the steps of determining each target structural part to be evaluated in a plurality of structural parts of the earphone; determining the current failure rate of each target structural part according to the constituent elements of each target structural part, and determining the current total failure rate of the earphone according to the current failure rate of each target structural part; obtaining a design value of the mean failure time interval of the earphone, and determining the total target failure rate of the earphone according to the design value; acquiring fault influence factor information of each target structural part, and determining the failure rate ratio of each target structural part according to the fault influence factor information; determining the target failure rate of each target structural part according to the failure rate ratio of each target structural part and the total target failure rate of the earphone; comparing the current total failure rate and the total target failure rate of the earphone, and comparing the current failure rate and the target failure rate of each standard structural part; and determining whether the reliability of the machine is qualified or not according to the comparison result.
Description
Technical Field
The present invention relates to the field of earphone technologies, and in particular, to an earphone reliability evaluation method, an apparatus, a readable storage medium, and an electronic device.
Background
With the development of electronic technology, electronic products such as computers, mobile phones, tablet computers, wearable devices and the like have become an essential part of people's lives. Along with that, the earphone also becomes a demand product of people. The earphone is an important product form of the contemporary audio product, and under increasingly severe market competition, the quality and reliability of the earphone are more and more emphasized.
In the prior art, the reliability of the headset is usually predicted at the design stage of the headset. Headset reliability is expected to be assessed primarily by human assessment, for example using expert scoring. At present, the reliability estimation method is not perfect, and the accuracy of the obtained reliability estimation result is low.
Disclosure of Invention
In view of the above, it is desirable to provide a method and an apparatus for evaluating reliability of a headset, a readable storage medium, and an electronic device, which are directed to the problem of inaccurate evaluation of reliability of a headset in the prior art.
A method for evaluating reliability of an earphone comprises the following steps,
acquiring the earphone model of an earphone, and determining each target structural part to be evaluated in a plurality of structural parts of the earphone according to the earphone model;
determining the current failure rate of each target structural part according to the constituent elements of each target structural part, and determining the current total failure rate of the earphone according to the current failure rate of each target structural part;
acquiring a design value of the mean time between failures of the earphone, and determining the total target failure rate of the earphone according to the design value;
acquiring fault influence factor information of each target structural part, and determining failure rate ratio of each target structural part according to the fault influence factor information;
determining the target failure rate of each target structural part according to the failure rate proportion of each target structural part and the total target failure rate of the earphone;
comparing the current total failure rate and the total target failure rate of the earphone, and comparing the current failure rate and the target failure rate of each target structural part;
and determining whether the reliability of the earphone is qualified or not according to the comparison result.
Further, in the method for evaluating reliability of an earphone, the step of obtaining the fault influence factor information of each target structural component includes:
acquiring a configuration file of the earphone, wherein the configuration file comprises fault influence factor information of a plurality of structural parts, and the fault influence factor information comprises the scores of the plurality of fault influence factors;
and extracting the fault influence factor information of each target structural part from the configuration file.
Further, in the above method for evaluating reliability of an earphone, a calculation formula of a failure rate ratio of the target structural member is:
wherein, C i Failure rate ratio, omega, for i target structural members i The score number f of the ith target structural member ij The score of the jth influence factor of the ith target structural part, n is the number of the target structural parts, and M is the number of the influence factors.
Further, in the method for evaluating reliability of an earphone, the failure influence factors include complexity, technical development level, importance, and usage environment conditions.
Further, in the above method for evaluating reliability of an earphone, a calculation formula of a target failure rate of the target structural member is:
wherein, the first and the second end of the pipe are connected with each other,
target failure rate of ith target structural member, C i The failure rates of the i target structural members are proportional,
is the total target failure rate of the headset.
Further, in the method for evaluating reliability of an earphone, the step of determining whether the reliability of the earphone is qualified according to the comparison result includes:
and when the current total failure rate of the earphone is less than the total target failure rate and the current failure rate of each target structural part is less than the target failure rate, determining that the reliability of the earphone is qualified.
The invention also discloses a device for evaluating the reliability of the earphone, which comprises,
the target structure part determining module is used for acquiring the earphone model of the earphone and determining each target structure part to be evaluated in the multiple structure parts of the earphone according to the earphone model;
the current failure rate determining module is used for determining the current failure rate of each target structural part according to the constituent elements of each target structural part and determining the current total failure rate of the earphone according to the current failure rate of each target structural part;
the first target failure rate determining module is used for acquiring a design value of the mean failure time interval of the earphone and determining the total target failure rate of the earphone according to the design value;
the failure rate ratio determining module is used for acquiring the fault influence factor information of each target structural part and determining the failure rate ratio of each target structural part according to the fault influence factor information;
the second target failure rate determining module is used for determining the target failure rate of each target structural part according to the failure rate proportion of each target structural part and the total target failure rate of the earphones;
the comparison module is used for comparing the current total failure rate and the total target failure rate of the earphone, and comparing the current failure rate and the target failure rate of each target structural part;
and the reliability determining module is used for determining whether the reliability of the earphone is qualified or not according to the comparison result.
Further, in the above apparatus for evaluating reliability of a headphone, the failure rate ratio determining module is configured to:
acquiring a configuration file of the earphone, wherein the configuration file comprises fault influence factor information of a plurality of structural parts, and the fault influence factor information comprises the scores of the plurality of fault influence factors;
and extracting the fault influence factor information of each target structural part from the configuration file.
The invention also discloses a computer-readable storage medium on which a computer program is stored which, when executed by a processor, implements the method of any of the above.
The invention also discloses an electronic device, which comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor realizes the method of any one of the above items when executing the computer program.
In the invention, a plurality of target structural parts to be evaluated of the earphone are determined, and the current failure rate of each target structural part is determined; determining failure rate occupation ratio of each key structural component (namely a target structural component) based on the fault influence shadow, and determining target failure rate of each target structural component based on a mean fault time interval design value; and comparing the total current failure rate and the total target failure rate of each target structural part, comparing the current failure rate and the corresponding target failure rate of each target structural part, and determining whether the reliability of the earphone is qualified or not based on the comparison result. The reliability of the earphone is evaluated through the total failure rate of the earphone and the failure rate of each key structural part, the influence of all the key structural parts on the reliability of the earphone is comprehensively considered, the reliability evaluation accuracy of the earphone is improved, and the efficiency is higher compared with that of a traditional manual evaluation method.
Drawings
Fig. 1 is a flowchart of a method for evaluating reliability of an earphone according to a first embodiment of the present invention;
fig. 2 is a flowchart of a method for evaluating reliability of an earphone according to a second embodiment of the present invention;
fig. 3 is a block diagram of a reliability evaluation device for earphones according to a third embodiment of the present invention;
fig. 4 is a schematic structural diagram of an electronic device in an embodiment of the invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
These and other aspects of embodiments of the invention will be apparent with reference to the following description and attached drawings. In the description and drawings, particular embodiments of the invention have been disclosed in detail as being indicative of some of the ways in which the principles of the embodiments of the invention may be practiced, but it is understood that the scope of the embodiments of the invention is not limited correspondingly. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
Fig. 1 shows a method for evaluating reliability of an earphone according to a first embodiment of the present invention, which includes steps S11 to S17.
And S11, acquiring the earphone model of the earphone, and determining each target structural part to be evaluated in the multiple structural parts of the earphone according to the earphone model.
The method of the embodiment can be used for evaluating the reliability of various types of earphones, and is usually carried out before the earphones leave a factory. Different types of earphones have different design and connection structures, and structural parts influencing the reliability of the earphones are not completely the same. Therefore, when the reliability of the earphone is detected, a target structure to be evaluated in the earphone needs to be determined according to the model of the earphone.
For example, for a conventional wireless headset, the target structural components affecting the reliability of the headset are mainly a power management circuit, an audio processing circuit, an audio power amplifier and a headset component subsystem. During specific implementation, a reliability model of the wireless earphone is established, and the reliability model is formed by a power supply management circuit, an audio processing circuit, an audio power amplifier and an earphone component subsystem. When any target structural part of the earphone fails, the function of the product is incomplete, and therefore the evaluation model is a series model.
And S12, determining the current failure rate of each target structural part according to the constituent elements of each target structural part, and determining the current total failure rate of the earphone according to the current failure rate of each target structural part.
After the earphone is designed, the component composition of each target structural component is known, and the specification and failure rate of the components are also known. And calculating the current failure rate of each target structural member according to the failure rate and the number of the components of the target structural member. The current total failure rate of the headset is equal to the sum of the current failure rates of the respective target structures.
And S13, acquiring a design value of the mean time interval between failures of the earphone, and determining the total target failure rate of the earphone according to the design value.
The Mean Time Between Failure (MTBF) of the earphones is generally used to evaluate the reliability of the earphones, and the Mean Time Between Failure (MTBF) of each type of earphone is set with a design value, which is empirically set. And when the actual value of the mean time between failures of the earphone is detected to be larger than the designed value, the reliability of the earphone is qualified.
For convenience of calculation, in the present embodiment, the reliability of the headset is evaluated based on the failure rate, and the total target failure rate of the headset can be calculated according to the average failure time interval, where the calculation formula is as follows:
And S14, acquiring fault influence factor information of each target structural part, and determining the failure rate ratio of each target structural part according to the fault influence factor information.
And S15, determining the target failure rate of each target structural part according to the failure rate proportion of each target structural part and the total target failure rate of the earphone.
Specifically, the step of obtaining the fault influence factor information of each target structural component includes:
acquiring a configuration file of the earphone, wherein the configuration file comprises fault influence factor information of a plurality of structural parts, and the fault influence factor information comprises the scores of the plurality of fault influence factors;
and extracting the fault influence factor information of each target structural part from the configuration file.
The earphone is pre-configured with fault influence factor information of a plurality of structural parts, and the fault influence factor information of each structural part comprises scores of the plurality of fault influence factors. And extracting the scores of the fault influence factors of the target structural parts from the configuration file.
The earphone reliability influence mainly considers four influence factors: complexity, technology development level, importance, and usage environment conditions. In practice, the score for each factor may be between 1 and 10.
a) The complexity is mainly evaluated according to the number of components and parts of the product and the difficulty of assembly among the components and parts, the most complex is evaluated by 10 points, and the simplest is evaluated by 1 point;
b) The technical development level is mainly evaluated according to the current technical level and maturity of the product components, the lowest level is rated as 10, and the highest level is rated as 1;
c) The importance degree is mainly evaluated according to the importance degree of the components of the product, the lowest importance degree is evaluated by 10 points, and the highest importance degree is evaluated by 1 point;
d) The use environment condition is mainly evaluated according to the harsh condition of the environment in which the product components are used. During operation, the test piece is subjected to extremely harsh and harsh environmental conditions on a scale of 10, and the environmental conditions are rated 1 relatively best.
Specifically, the calculation formula of the failure rate ratio of the target structural member is as follows:
wherein, C i Failure rate ratio, omega, for i target structural members i The score number f of the ith target structural member ij The score number of the jth influence factor of the ith target structural part is shown, n is the number of the target structural parts, and M is the number of the influence factors.
And distributing the failure rate for each target structural part according to the failure rate ratio of each target structural part. Thus, the target failure rate assigned to each target structure
Comprises the following steps:
wherein, C i The failure rates of the i target structural components are proportional,
is the total target failure rate of the headset.
And S16, comparing the current total failure rate and the total target failure rate of the earphone, and comparing the current failure rate and the target failure rate of each target structural part.
And S17, determining whether the reliability of the earphone is qualified or not according to the comparison result.
And comparing the current failure rate of the earphone with the total target failure rate, comparing the current failure rate of each target structural part with the target failure rate, and determining that the reliability of the earphone is qualified when the current total failure rate of the earphone is less than the total target failure rate and the current failure rate of each target structural part is less than the target failure rate.
In the embodiment, a plurality of target structural parts to be evaluated of the earphone are determined, and the current failure rate of each target structural part is determined; determining failure rate occupation ratio of each key structural component (namely a target structural component) based on the fault influence shadow, and determining target failure rate of each target structural component based on a mean fault time interval design value; and comparing the total current failure rate and the total target failure rate of each target structural part, comparing the current failure rate and the corresponding target failure rate of each target structural part, and determining whether the reliability of the earphone is qualified or not based on the comparison result. In the embodiment, the reliability of the earphone is evaluated through the total failure rate of the earphone and the failure rate of each key structural part, the influence of all key structural parts on the reliability of the earphone is comprehensively considered, the reliability evaluation accuracy of the earphone is improved, and the efficiency is higher compared with that of a traditional artificial evaluation method.
Referring to fig. 2, a method for evaluating reliability of an earphone according to a second embodiment of the present invention includes steps S21 to S28.
Step S21, obtaining the earphone model of the earphone, and determining each target structural part to be evaluated in the multiple structural parts of the earphone according to the earphone model.
And S22, determining the current failure rate of each target structural part according to the constituent elements of each target structural part, and determining the current total failure rate of the earphone according to the current failure rate of each target structural part.
For a conventional wireless earphone, target structural components influencing the reliability of the earphone are mainly power management circuits, audio processing circuits, audio power amplifiers and earphone component subsystems. After the earphone is designed, the component composition of each target structural component is known, and the specification and failure rate of the components are also known. And calculating the current failure rate of each target structural member according to the failure rate and the number of the components of the target structural member. The current total failure rate of the headset is equal to the sum of the current failure rates of the respective target structures.
For example, in a wireless headset, important components of a power management circuit include a power management IC, a thirteen-core connector, a common-mode inductor, an EMI filter, an ESD diode, a resistor, a capacitor, and the like. Failure rate of each component λ = λ p * n, wherein λ p N is the number of components, which is the failure rate of the components. The statistical examples of failure rates of the power management circuit module are shown in table 1.
TABLE 1 statistical table of failure rates of important components of power management circuit
As can be seen from table 1, the current failure rate of the power management circuit is: lambda 1 ＝24.0777×10 -6 /h。
Important components of the audio processor circuit include an audio processor, a touch key, a transformer, a crystal oscillator, an EMI filter, an ESD diode, a resistor, a capacitor, etc., and failure rate statistics are shown in table 2.
The current failure rate of the audio processing circuit is: lambda 2 ＝74.54178×10 -6 /h。
Table 2 failure rate statistical table for important components of audio processing circuit
Important components of the audio power amplifier circuit comprise an audio power amplifier, an EMI filter, a diode, a resistor and a capacitor, and the failure rate statistics are shown in Table 3.
The current failure rate of the audio power amplifier circuit is as follows: lambda [ alpha ] 3 ＝12.1803×10 -6 /h。
TABLE 3 statistical table for failure rate of important components of audio power amplification circuit
Important components of the headset component subsystem include pickup Mic, bone conduction microphone, dual-unit balanced armature receiver, ESD diode, resistor, and capacitor, and the failure rate statistics are shown in table 4.
The current failure rate of the headset component subsystem is: lambda [ alpha ] 4 ＝41.881×10 -6 /h。
Table 4 statistical table for failure rate of important element and device in earphone assembly subsystem
It should be noted that the mechanical subsystem of the earphone includes a control box, an earphone body, etc., and its reliability is also approximately 1, i.e. its current failure rate λ 5 ＝0。
From the aboveCurrent total failure rate of the headset:
and S23, acquiring a design value of the mean failure time interval of the earphone, and determining the total target failure rate of the earphone according to the design value.
According to engineering experience, the reliability distribution index should take its specified value and leave a certain margin, e.g. the Mean Time Between Failure (MTBF) design value s =950h, the amount of the catalyst is, according to the formula,
the calculated total target failure rate was 1052.632 × 10 -6 In terms of hours.
Step S24, obtaining a configuration file of the earphone, wherein the configuration file comprises fault influence factor information of a plurality of structural parts, and the fault influence factor information comprises the grading number of the plurality of fault influence factors. The fault influencing factors include complexity, technology development level, importance and use environment conditions.
And S25, extracting the fault influence factor information of each target structural part from the configuration file, and determining the failure rate ratio of each target structural part according to the fault influence factor information.
And S26, determining the target failure rate of each target structural part according to the failure rate ratio of each target structural part and the total target failure rate of the earphones.
The failure rate ratio of the target structural member is calculated according to the formula:
wherein, C i Failure rate ratio, omega, for i target structural members i The score number f of the ith target structural member ij The j =1 represents the complexity, j =2 represents the technical development level, j =3 represents the importance, j =4 represents the use environment condition, and n is the number of the target structural components.
Thus, the target failure rate assigned to each target structure
Comprises the following steps:
wherein, C i The failure rates of the i target structural components are proportional,
is the total target failure rate of the headset.
The target failure rates assigned to each target structure of the product based on the statistical calculations are shown in table 5.
TABLE 5
And S27, comparing the current total failure rate and the total target failure rate of the earphone, and comparing the current failure rate and the target failure rate of each target structural part.
And S28, when the current total failure rate of the earphone is less than the total target failure rate and the current failure rate of each target structural part is less than the target failure rate, determining that the reliability of the earphone is qualified.
The current total failure rate and the total target failure rate of the earphones, and the current failure rate and the target failure rate statistics of each target structure are shown in table 6.
TABLE 6
As can be seen from table 6, the current total failure rate of the earphone is much smaller than the total target failure rate, and the current failure rate of each target structural member is smaller than the corresponding target failure rate. Therefore, the reliability of the earphone meets the requirement.
Referring to fig. 3, a headset reliability evaluating apparatus according to a third embodiment of the present invention includes,
the target structure part determining module 31 is configured to obtain an earphone model of an earphone, and determine each target structure part to be evaluated in a plurality of structure parts of the earphone according to the earphone model;
a current failure rate determining module 32, configured to determine a current failure rate of each target structural component according to a constituent element of each target structural component, and determine a current total failure rate of the earphone according to the current failure rate of each target structural component;
a first target failure rate determining module 33, configured to obtain a design value of a mean-time-to-failure interval of the earphone, and determine a total target failure rate of the earphone according to the design value;
a failure rate ratio determining module 34, configured to obtain fault influence factor information of each target structural component, and determine a failure rate ratio of each target structural component according to the fault influence factor information;
a second target failure rate determining module 35, configured to determine a target failure rate of each target structural component according to a failure rate ratio of each target structural component and a total target failure rate of the earphone;
a comparison module 36, configured to compare the current total failure rate and the total target failure rate of the earphone, and compare the current failure rate and the target failure rate of each target structural component;
and a reliability determining module 37, configured to determine whether the reliability of the earphone is qualified according to the comparison result.
Further, in the above apparatus for evaluating reliability of an earphone, the failure rate ratio determining module is configured to:
acquiring a configuration file of the earphone, wherein the configuration file comprises fault influence factor information of a plurality of structural parts, and the fault influence factor information comprises the scores of the plurality of fault influence factors;
and extracting the fault influence factor information of each target structural part from the configuration file.
The earphone reliability evaluation device provided by the embodiment of the invention has the same implementation principle and technical effect as the method embodiment, and for brief description, the corresponding content in the method embodiment can be referred to where the device embodiment is not mentioned.
Referring to fig. 4, an electronic device according to an embodiment of the present invention is further provided, which includes a processor 10, a memory 20, and a computer program 30 stored in the memory and executable on the processor, and when the processor 10 executes the computer program 30, the method for evaluating the reliability of the earphone is implemented.
The electronic device may be, but is not limited to, a personal computer, a mobile phone, and other computer devices. The processor 10 may be, in some embodiments, a Central Processing Unit (CPU), controller, microcontroller, microprocessor or other data Processing chip for executing program codes stored in the memory 20 or Processing data.
The memory 20 includes at least one type of readable storage medium including flash memory, hard disks, multimedia cards, card-type memory (e.g., SD or DX memory, etc.), magnetic memory, magnetic disks, optical disks, and the like. The memory 20 may in some embodiments be an internal storage unit of the electronic device, for example a hard disk of the electronic device. The memory 20 may also be an external storage device of the electronic device in other embodiments, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), and the like, provided on the electronic device. Further, the memory 20 may also include both an internal storage unit and an external storage device of the electronic apparatus. The memory 20 may be used not only to store application software installed in the electronic device, various types of data, and the like, but also to temporarily store data that has been output or is to be output.
Optionally, the electronic device may further comprise a user interface, a network interface, a communication bus, etc., the user interface may comprise a Display (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface may further comprise a standard wired interface, a wireless interface. Alternatively, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, an OLED (Organic Light-Emitting Diode) touch device, or the like. The display, which may also be referred to as a display screen or display unit, is suitable, among other things, for displaying information processed in the electronic device and for displaying a visualized user interface. The network interface may optionally include a standard wired interface, a wireless interface (e.g., a WI-FI interface), typically used to establish a communication link between the device and other electronic devices. The communication bus is used to enable connection communication between these components.
It should be noted that the configuration shown in fig. 4 does not constitute a limitation of the electronic device, and in other embodiments the electronic device may include fewer or more components than shown, or some components may be combined, or a different arrangement of components.
The present invention also proposes a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the headset reliability evaluation method as described above.
Those of skill in the art will understand that the logic and/or steps represented in the flowcharts or otherwise described herein, e.g., an ordered listing of executable instructions that can be viewed as implementing logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus (e.g., a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or execute the instructions). For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device.
More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, various steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for evaluating reliability of an earphone, comprising,
acquiring the earphone model of an earphone, and determining each target structural part to be evaluated in a plurality of structural parts of the earphone according to the earphone model;
determining the current failure rate of each target structural part according to the constituent elements of each target structural part, and determining the current total failure rate of the earphone according to the current failure rate of each target structural part;
acquiring a design value of the mean time between failures of the earphone, and determining the total target failure rate of the earphone according to the design value;
acquiring fault influence factor information of each target structural part, and determining failure rate ratio of each target structural part according to the fault influence factor information;
determining the target failure rate of each target structural part according to the failure rate ratio of each target structural part and the total target failure rate of the earphone;
comparing the current total failure rate and the total target failure rate of the earphone, and comparing the current failure rate and the target failure rate of each target structural part;
and determining whether the reliability of the earphone is qualified or not according to the comparison result.
2. The method for evaluating reliability of an earphone according to claim 1, wherein the step of obtaining information on the fault impact factor of each of the target structures comprises:
acquiring a configuration file of the earphone, wherein the configuration file comprises fault influence factor information of a plurality of structural parts, and the fault influence factor information comprises the scores of the plurality of fault influence factors;
and extracting the fault influence factor information of each target structural part from the configuration file.
3. The method of claim 2, wherein the failure rate ratio of the target structure is calculated by the formula:
wherein, C i Failure rate ratio, omega, for i target structural members i The score number f of the ith target structural member ij The score number of the jth influence factor of the ith target structural part is shown, n is the number of the target structural parts, and M is the number of the influence factors.
4. The headset reliability evaluation method of claim 2 wherein the failure impact factors include complexity, technology development level, importance, and usage environment conditions.
5. The method of claim 1, wherein the target failure rate of the target structure is calculated by the formula:
wherein, the first and the second end of the pipe are connected with each other,
target failure rate of ith target structural member, C i The failure rates of the i target structural members are proportional,
is the total target failure rate of the headset.
6. The headset reliability assessment method according to claim 1, wherein the step of determining whether the reliability of the headset is qualified according to the comparison result comprises:
and when the current total failure rate of the earphone is less than the total target failure rate and the current failure rate of each target structural part is less than the target failure rate, determining that the reliability of the earphone is qualified.
7. An earphone reliability evaluation device is characterized by comprising,
the target structure part determining module is used for acquiring the earphone model of the earphone and determining each target structure part to be evaluated in the multiple structure parts of the earphone according to the earphone model;
a current failure rate determining module, configured to determine a current failure rate of each target structural component according to a constituent element of each target structural component, and determine a current total failure rate of the earphone according to the current failure rate of each target structural component;
the first target failure rate determining module is used for acquiring a design value of a mean failure time interval of the earphone and determining the total target failure rate of the earphone according to the design value;
the failure rate ratio determining module is used for acquiring the failure influence factor information of each target structural part and determining the failure rate ratio of each target structural part according to the failure influence factor information;
a second target failure rate determining module, configured to determine a target failure rate of each target structural component according to a failure rate ratio of each target structural component and a total target failure rate of the earphone;
the comparison module is used for comparing the current total failure rate and the total target failure rate of the earphone, and comparing the current failure rate and the target failure rate of each target structural part;
and the reliability determining module is used for determining whether the reliability of the earphone is qualified or not according to the comparison result.
8. The headset reliability assessment device of claim 7, wherein the failure rate to duty ratio determination module is to:
acquiring a configuration file of the earphone, wherein the configuration file comprises fault influence factor information of a plurality of structural parts, and the fault influence factor information comprises the scores of the plurality of fault influence factors;
and extracting the fault influence factor information of each target structural part from the configuration file.
9. A computer-readable storage medium, on which a computer program is stored which, when being executed by a processor, carries out the method according to any one of claims 1 to 6.
10. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, wherein the processor implements the method of any of claims 1 to 6 when executing the computer program.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116136979A (en) * | 2023-04-19 | 2023-05-19 | 睿至科技集团有限公司 | Prediction method and system based on big data |
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