CN115717943A - Vacuum cavity sealing temperature measuring device and wafer processing equipment - Google Patents
Vacuum cavity sealing temperature measuring device and wafer processing equipment Download PDFInfo
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- CN115717943A CN115717943A CN202211437742.1A CN202211437742A CN115717943A CN 115717943 A CN115717943 A CN 115717943A CN 202211437742 A CN202211437742 A CN 202211437742A CN 115717943 A CN115717943 A CN 115717943A
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- 238000007789 sealing Methods 0.000 title claims abstract description 135
- 238000003825 pressing Methods 0.000 claims abstract description 51
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000009529 body temperature measurement Methods 0.000 abstract description 6
- 238000010276 construction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 13
- 238000009434 installation Methods 0.000 description 11
- 230000007774 longterm Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- -1 perfluoro Chemical group 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a vacuum cavity sealing temperature measuring device and wafer processing equipment, and relates to the technical field of temperature measurement, wherein the vacuum cavity sealing temperature measuring device comprises a thermocouple fixing seat, a thermocouple fixing cap, a thermocouple body, a first sealing ring and a second sealing ring, and the thermocouple fixing seat is detachably arranged on the wall of a vacuum cavity; the first sealing ring is annularly arranged around the thermocouple body, and the first sealing ring is pressed between the thermocouple fixing seat and the vacuum cavity wall; the second sealing ring is arranged between the thermocouple fixing seat and the thermocouple fixing cap in a pressing mode. Realized double-deck sealed through first sealing washer and second sealing washer, guaranteed that the thermocouple body wears to establish the position of vacuum cavity wall and outer isolated mutually, avoided the emergence of gas leakage phenomenon, thermocouple fixing base and thermocouple locking cap all adopt detachable construction simultaneously, can take apart when the thermocouple body takes place to damage and change, easily dismouting, greatly reduced the replacement cost.
Description
Technical Field
The invention relates to the technical field of temperature measurement, in particular to a vacuum cavity sealing temperature measurement device and wafer processing equipment.
Background
In the vacuum industry, a high-temperature heating system and a vacuum temperature measuring system are often used in the manufacturing process, so that a thermocouple is generally used for measuring temperature, the thermocouple penetrates through a vacuum cavity, the probe part of the thermocouple measures temperature in the vacuum high-temperature cavity, the tail part of the thermocouple is in an atmospheric environment, and the tail part of the thermocouple is connected with an instrument to display a temperature value. The key point for installing the thermocouple is that the thermocouple is sealed with the vacuum cavity, and the phenomenon of air leakage cannot occur.
In the prior art, the thermocouple and the cavity are usually arranged in an integrated manner, namely, a fixed integrated structure is adopted to ensure the sealing performance, the disassembly cannot be realized, and if the thermocouple is damaged, the replacement cost is too high. Simultaneously, small gap appears in integrative setting in long-term use easily, leads to sealed effect unsatisfactory.
Disclosure of Invention
The invention aims to provide a vacuum cavity sealing temperature measuring device and wafer processing equipment, which can ensure the sealing effect, are easy to disassemble and assemble and greatly reduce the replacement cost of a thermocouple.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a vacuum chamber sealing temperature measuring device, comprising:
the thermocouple fixing seat is detachably arranged on the wall of the vacuum cavity;
the thermocouple fixing cap is detachably connected with the end part of the thermocouple fixing seat;
the thermocouple body penetrates through the thermocouple fixing cap and the thermocouple fixing seat and is used for extending into the vacuum cavity wall;
the first sealing ring is arranged on one side, away from the thermocouple fixing cap, of the thermocouple fixing seat in a surrounding mode and used for being pressed between the thermocouple fixing seat and the vacuum cavity wall in a pressing mode so that the thermocouple fixing seat is in sealing joint with the vacuum cavity wall;
and the second sealing ring is sleeved on the thermocouple body in a sealing manner, and is arranged between the thermocouple fixing seat and the thermocouple fixing cap in a pressing manner, so that the thermocouple fixing seat, the thermocouple fixing cap and the thermocouple body are in sealing joint.
In optional embodiment, the thermocouple fixing base includes the installation department, connects convex part and mounting, one side of installation department is used for attached on the vacuum cavity wall, connect the convex part with the opposite side of installation department is connected, the thermocouple body wears to locate the installation department with connect the convex part, the mounting hole has still been seted up on the installation department, the mounting assembly is in the mounting hole, and be used for with the connection can be dismantled to the vacuum cavity wall, first sealing washer sets up the installation department is kept away from connect one side of convex part, and be used for supporting to hold on the vacuum cavity wall.
In an optional embodiment, the thermocouple fixing cap includes a connection ring portion and a press-fit portion, which are integrally disposed, the connection ring portion is sleeved outside the connection convex portion and detachably connected to the connection convex portion, the press-fit portion is connected to one end of the connection ring portion and is used for being engaged with one end of the connection convex portion, which is far away from the installation portion, the thermocouple body is disposed through the press-fit portion, and the second surface sealing ring is disposed on an inner side of the press-fit portion and abuts against one end of the connection convex portion, which is far away from the installation portion.
In an optional embodiment, the pressing portion is provided with a threading hole for the thermocouple body to pass through, an edge of one end of the threading hole close to the connecting convex portion is further provided with an outward-expanding pressing inclined surface, and the second seal ring abuts against the pressing inclined surface and abuts against the connecting convex portion and the thermocouple body simultaneously under the pressing effect of the pressing inclined surface.
In an optional embodiment, a threading hole through which the thermocouple body passes is formed in the pressing portion, a pressing groove is formed in the inner side of the pressing portion, the pressing groove is located at an edge of one end, close to the connecting convex portion, of the threading hole and is communicated with the threading hole, and the second sealing ring is arranged in the pressing groove and abuts against the connecting convex portion and the thermocouple body simultaneously under the pressing effect of the bottom wall of the pressing groove.
In an alternative embodiment, the outer circumferential surface of the connecting convex portion is provided with an external thread, the inner side of the connecting ring portion is provided with an internal thread, and the connecting ring portion is in threaded connection with the connecting convex portion.
In an alternative embodiment, the outer contour of the connecting ring portion is a regular hexagon.
In an alternative embodiment, a sealing ring groove is formed in one side, away from the connecting convex part, of the mounting part, and the first sealing ring is arranged in the sealing ring groove in a protruding mode.
In optional embodiment, the thermocouple body includes connector, connecting wire and silicon chip, connecting wire's one end with the connector is connected, the other end with the silicon chip is connected, the silicon chip is used for setting up the inboard of vacuum cavity wall, connecting wire passes in proper order the thermocouple locking cap with the thermocouple fixing base, first sealing washer ring is established around the connecting wire, the second sealing washer cover is established on the connecting wire.
In a second aspect, the present invention provides a wafer processing apparatus, including a vacuum chamber and the vacuum chamber sealing temperature measuring device according to any one of the foregoing embodiments, wherein the vacuum chamber has a vacuum chamber wall, the thermocouple fixing base is detachably mounted on the vacuum chamber wall, and the thermocouple body extends into the vacuum chamber wall to detect a temperature in the vacuum chamber.
The beneficial effects of the embodiment of the invention include, for example:
according to the vacuum cavity sealing temperature measuring device provided by the embodiment of the invention, the thermocouple fixing seat is detachably arranged on the wall of the vacuum cavity, the thermocouple fixing cap is detachably connected with the thermocouple fixing seat, and the thermocouple body penetrates through the thermocouple fixing cap and the thermocouple fixing seat and extends into the inner side of the wall of the vacuum cavity to realize temperature measurement. The first sealing ring is annularly arranged around the thermocouple body, and is pressed between the thermocouple fixing seat and the vacuum cavity wall, so that the thermocouple fixing seat is in sealing connection with the vacuum cavity wall, the second sealing ring is sleeved on the thermocouple body, and is pressed between the thermocouple fixing seat and the thermocouple fixing cap, so that the thermocouple fixing seat, the thermocouple fixing cap and the thermocouple body are in sealing connection, double-layer sealing is realized through the first sealing ring and the second sealing ring, the condition that the thermocouple body penetrates through the vacuum cavity wall is isolated from the outside, the occurrence of air leakage is avoided, meanwhile, the thermocouple fixing seat and the thermocouple fixing cap both adopt detachable structures, the thermocouple body can be detached for replacement when damaged, the disassembly and assembly are easy, and the replacement cost is greatly reduced. Compared with the prior art, the vacuum cavity sealing temperature measuring device provided by the invention can ensure the sealing effect, is easy to disassemble and assemble, and greatly reduces the replacement cost of the thermocouple.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a vacuum chamber sealing temperature measuring device according to a first embodiment of the present invention;
FIG. 2 is an assembly view of a vacuum chamber sealed temperature measuring device according to a first embodiment of the present invention;
FIG. 3 is a schematic view of the connection structure of the thermocouple fixing seat in FIG. 1;
FIG. 4 is a schematic view showing a connection structure of the thermocouple securing cap of FIG. 1;
FIG. 5 is a schematic view showing a coupling structure of a thermocouple fixing cap in another embodiment.
Icon: 100-sealing the vacuum cavity to measure the temperature; 110-thermocouple fixing seats; 111-a mounting portion; 113-a connecting boss; 115-a fixing member; 117-sealing ring groove; 130-thermocouple fixing cap; 131-a connecting ring portion; 133-a press fit; 135-pressing the inclined plane; 137-a pressing groove; 150-a thermocouple body; 151-a connector; 153-connecting wires; 155-silicon chip; 170-first sealing ring; 190-a second sealing ring; 200-vacuum cavity wall.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
As disclosed in the background art, the temperature thermocouple in the prior art is usually integrated directly on the vacuum chamber, for example, a hole is formed on the wall of the vacuum chamber, and the hole is filled with a high temperature resistant filler or colloid after passing through the thermocouple, so that the thermocouple and the vacuum chamber can be integrated. The structure is very difficult to disassemble and assemble, particularly when the thermocouple is damaged, the replacement is very troublesome, and the chamber is easily damaged when the thermocouple is forcibly disassembled, so that the replacement cost is too high. Meanwhile, in the long-term use process, due to the fact that different materials are adopted between the thermocouple and the wall of the vacuum cavity, separation is possible to occur, and then a small gap is formed between the thermocouple and the wall of the vacuum cavity, the sealing effect is affected, and the air leakage phenomenon is prone to occurring.
In order to solve the above problems, the present invention provides a novel vacuum chamber sealing temperature measuring device and a wafer processing apparatus, and it should be noted that, in a non-conflicting manner, features in the embodiments of the present invention may be combined with each other.
First embodiment
Referring to fig. 1 to 3, the present embodiment provides a vacuum chamber sealing temperature measuring device 100, which can ensure a sealing effect, and is easy to disassemble and assemble, thereby greatly reducing the replacement cost of a thermocouple.
The embodiment provides a vacuum cavity sealing temperature measuring device 100, which comprises a thermocouple fixing seat 110, a thermocouple fixing cap 130, a thermocouple body 150, a first sealing ring 170 and a second sealing ring 190, wherein the thermocouple fixing seat 110 is used for being detachably mounted on a vacuum cavity wall 200; the thermocouple fixing cap 130 is detachably connected to an end of the thermocouple fixing base 110; the thermocouple body 150 is inserted into the thermocouple fixing cap 130 and the thermocouple fixing base 110, and is extended into the vacuum cavity wall 200; the first sealing ring 170 is annularly arranged around the thermocouple body 150, and the first sealing ring 170 is arranged at one side of the thermocouple fixing seat 110 far away from the thermocouple fixing cap 130 and is used for being pressed between the thermocouple fixing seat 110 and the vacuum chamber wall 200 so as to enable the thermocouple fixing seat 110 to be in sealing joint with the vacuum chamber wall 200; the second sealing ring 190 is hermetically sealed on the thermocouple body 150, and the second sealing ring 190 is press-fitted between the thermocouple fixing seat 110 and the thermocouple fixing cap 130, so that the thermocouple fixing seat 110, the thermocouple fixing cap 130 and the thermocouple body 150 are in sealing engagement.
The sealed temperature measuring device 100 of vacuum cavity provided by the embodiment is suitable for wafer processing equipment, the wafer processing equipment further comprises the vacuum cavity, the vacuum cavity is provided with a vacuum cavity wall 200, a through hole is formed in the vacuum cavity wall 200, and the thermocouple body 150 can measure the internal temperature of the vacuum cavity. In this embodiment, the thermocouple fixing base 110 is detachably installed on the vacuum chamber wall 200, the thermocouple fixing cap 130 is detachably connected to the thermocouple fixing base 110, and the thermocouple body 150 penetrates through the thermocouple fixing cap 130 and the thermocouple fixing base 110 and extends into the inner side of the vacuum chamber wall 200 to measure temperature. The first sealing ring 170 is annularly arranged around the thermocouple body 150 and is pressed between the thermocouple fixing seat 110 and the vacuum cavity wall 200, so that the thermocouple fixing seat 110 is in sealing joint with the vacuum cavity wall 200, the second sealing ring 190 is sleeved on the thermocouple body 150 and is pressed between the thermocouple fixing seat 110 and the thermocouple fixing cap 130, so that the thermocouple fixing seat 110, the thermocouple fixing cap 130 and the thermocouple body 150 are in sealing joint, double-layer sealing is realized through the first sealing ring 170 and the second sealing ring 190, the condition that the thermocouple body 150 penetrates through the vacuum cavity wall 200 and is isolated from the outside is ensured, the occurrence of air leakage is avoided, meanwhile, the thermocouple fixing seat 110 and the thermocouple fixing cap 130 are of detachable structures, the thermocouple body 150 can be detached and replaced when damaged, the disassembly and assembly are easy, and the replacement cost is greatly reduced.
The sealing joint mentioned in the present embodiment means that there is no air gap between the two joined parts, i.e. the sealing joint can be achieved. Moreover, the thermocouple fixing base 110 and the thermocouple fixing cap 130 are both made of SUS304, so that the manufacturing is convenient.
In this embodiment, the thermocouple fixing seat 110 includes a mounting portion 111, a connecting protrusion 113 and a fixing member 115, one side of the mounting portion 111 is used for being attached to the vacuum cavity wall 200, the connecting protrusion 113 is connected to the other side of the mounting portion 111, the thermocouple body 150 penetrates through the mounting portion 111 and the connecting protrusion 113, a mounting hole is further formed in the mounting portion 111, the fixing member 115 is assembled in the mounting hole and is detachably connected to the vacuum cavity wall 200, and the first sealing ring 170 is disposed on one side of the mounting portion 111 away from the connecting protrusion 113 and is used for abutting against the vacuum cavity wall 200. Specifically, the mounting portion 111 and the connecting protrusion 113 are integrally disposed, and both the mounting portion 111 and the connecting protrusion 113 are provided with through holes for the thermocouple body 150 to pass through, the outer diameter of the connecting protrusion 113 is smaller than the outer diameter of the mounting portion 111, the through holes are located at the center positions of the mounting portion 111 and the connecting protrusion 113, and the connecting protrusion 113 is also located at the center position of the mounting portion 111, so as to ensure a better mounting alignment effect.
In this embodiment, the fixing member 115 may be a screw, and a screw hole is correspondingly formed in the vacuum cavity wall 200, and the fixing of the mounting portion 111 is achieved by driving the screw into the screw hole. Furthermore, with the installation of the screw, the screw can apply stress to the installation part 111 towards the inner side of the vacuum cavity wall 200, so that the installation part 111 can also be provided with the first sealing ring 170, the periphery of the through hole of the vacuum cavity wall 200 can be sealed by the first sealing ring 170, and the air leakage phenomenon is avoided.
In this embodiment, a sealing ring groove 117 is formed on a side of the mounting portion 111 away from the connecting protrusion 113, and the first sealing ring 170 is protruded into the sealing ring groove 117. Specifically, the sealing ring groove 117 is annularly disposed around the through hole on the mounting portion 111, and the fixing member 115 is located outside the sealing ring groove 117, wherein the outer diameter of the first sealing ring 170 needs to be greater than the depth of the sealing ring groove 117, so as to ensure that the first sealing ring 170 can protrude out of the sealing ring groove 117 and abut against the vacuum chamber wall 200.
Preferably, in this embodiment, the first sealing ring 170 and the second sealing ring 190 both use perfluoro sealing rings, so that the first sealing ring 170 and the second sealing ring 190 can resist high temperature more. Of course, the material of the first seal ring 170 and the second seal ring 190 is not particularly limited.
The thermocouple body 150 comprises a connecting head 151, a connecting wire 153 and a silicon wafer 155, wherein one end of the connecting wire 153 is connected with the connecting head 151, the other end of the connecting wire 153 is connected with the silicon wafer 155, the silicon wafer 155 is arranged on the inner side of the vacuum chamber wall 200, the connecting wire 153 sequentially penetrates through the thermocouple fixing cap 130 and the thermocouple fixing seat 110, the first sealing ring 170 is annularly arranged around the connecting wire 153, and the second sealing ring 190 is sleeved on the connecting wire 153. Specifically, the connector 151 is used for connecting with an external device to achieve a temperature measurement function, the silicon chip 155 is disposed in the vacuum cavity, and the sensing probe senses the temperature of the silicon chip 155 inside the vacuum cavity to achieve temperature sensing, and the specific temperature measurement principle related to the thermocouple body 150 may refer to the existing thermocouple and is not limited herein.
Referring to fig. 4, in the present embodiment, the thermocouple fixing cap 130 includes a connecting ring portion 131 and a pressing portion 133 that are integrally disposed, the connecting ring portion 131 is sleeved outside the connecting protrusion 113 and detachably connected to the connecting protrusion 113, the pressing portion 133 is connected to an end of the connecting ring portion 131 and is configured to be engaged with an end of the connecting protrusion 113 away from the mounting portion 111, the thermocouple body 150 is disposed through the pressing portion 133, and the second surface sealing ring is disposed inside the pressing portion 133 and abuts against an end of the connecting protrusion 113 away from the mounting portion 111. Specifically, the connecting ring portion 131 is fixed outside the connecting protrusion 113 in a snap-fit manner, so as to drive the pressing portion 133 to press against the end of the connecting protrusion 113, and the second sealing ring 190 is disposed between the pressing portion 133 and the end face of the connecting protrusion 113, so as to achieve the sealing joint between the pressing portion 133 and the connecting protrusion 113.
In this embodiment, the pressing portion 133 is provided with a threading hole for the thermocouple body 150 to pass through, an edge of one end of the threading hole close to the connecting protrusion 113 is further provided with an outward-expanding pressing inclined surface 135, and the second sealing ring 190 abuts against the pressing inclined surface 135 and abuts against the connecting protrusion 113 and the thermocouple body 150 simultaneously under the pressing effect of the pressing inclined surface 135. By providing the pressing inclined plane 135, downward and inward stress on the second sealing ring 190 can be realized in the pressing process of the pressing portion 133, so that the second sealing ring 190 can be pressed against the end surface of the connecting protrusion 113, and the second sealing ring 190 can be pressed against the surface of the thermocouple body 150, thereby realizing sealing of the bottom surface and the side surface.
In another preferred embodiment of the present invention, as shown in fig. 5, the pressing portion 133 is provided with a threading hole for the thermocouple body 150 to pass through, the inner side of the pressing portion 133 is provided with a pressing groove 137, the pressing groove 137 is located at an end edge of the threading hole close to the connecting protrusion 113 and is communicated with the threading hole, and the second sealing ring 190 is disposed in the pressing groove 137 and is pressed against the connecting protrusion 113 and the thermocouple body 150 simultaneously under the pressing effect of the bottom wall of the pressing groove 137.
It should be noted that both the end surface of the inner side of the pressing portion 133 and the end surface of the connecting protrusion 113 require high mechanical flatness and high mechanical smoothness, and are mainly used for matching the second seal ring 190 to ensure air tightness.
In the present embodiment, the outer circumferential surface of the connection convex portion 113 is provided with male threads, the inner side of the connection ring portion 131 is provided with female threads, and the connection ring portion 131 is screwed with the connection convex portion 113. Specifically, threaded connection between the connection ring portion 131 and the connection convex portion 113 can ensure that the fixing effect is better while the dismounting is convenient. Of course, in other preferred embodiments of the present invention, the connecting ring portion 131 can also be directly fastened to the connecting protrusion 113 to achieve the fixing.
In the present embodiment, the outer contour of the connecting ring portion 131 is a regular hexagon. That is, the thermocouple fixing cap 130 is a hexagonal cap body, which is convenient to be screwed by a wrench or other tools. Of course, the outer contour of the connecting ring 131 can also be rectangular or have another shape that facilitates screwing.
In summary, in the vacuum chamber sealing temperature measuring device 100 provided in this embodiment, the thermocouple fixing base 110 is detachably mounted on the vacuum chamber wall 200, the thermocouple fixing cap 130 is detachably connected to the thermocouple fixing base 110, and the thermocouple body 150 penetrates through the thermocouple fixing cap 130 and the thermocouple fixing base 110 and extends into the inner side of the vacuum chamber wall 200 to measure temperature. The first sealing ring 170 is annularly arranged around the thermocouple body 150 and is pressed between the thermocouple fixing seat 110 and the vacuum cavity wall 200, so that the thermocouple fixing seat 110 is in sealing connection with the vacuum cavity wall 200, the second sealing ring 190 is sleeved on the thermocouple body 150 and is pressed between the thermocouple fixing seat 110 and the thermocouple fixing cap 130, so that the thermocouple fixing seat 110, the thermocouple fixing cap 130 and the thermocouple body 150 are in sealing connection, double-layer sealing is realized through the first sealing ring 170 and the second sealing ring 190, the thermocouple body 150 is ensured to be isolated from the outside at the position where the thermocouple body 150 penetrates through the vacuum cavity wall 200, the occurrence of an air leakage phenomenon is avoided, meanwhile, the thermocouple fixing seat 110 and the thermocouple fixing cap 130 are of detachable structures, and the thermocouple body 150 can be detached and replaced when damaged, so that the thermocouple body is easy to disassemble and assemble, and the replacement cost is greatly reduced. Compared with the prior art, the vacuum cavity sealing temperature measuring device 100 provided by the embodiment can ensure the sealing effect, is easy to disassemble and assemble, and greatly reduces the replacement cost of the thermocouple.
Second embodiment
The present embodiment provides a wafer processing apparatus, which includes a vacuum chamber and a vacuum chamber sealing temperature measuring device 100, wherein the basic structure and principle of the vacuum chamber sealing temperature measuring device 100 and the generated technical effects are the same as those of the first embodiment, and for brief description, reference may be made to corresponding contents in the first embodiment for parts not mentioned in the present embodiment.
In this embodiment, the wafer processing apparatus includes a vacuum chamber and a vacuum chamber sealing temperature measuring device 100, the vacuum chamber has a vacuum chamber wall 200, the vacuum chamber sealing temperature measuring device 100 includes a thermocouple fixing seat 110, a thermocouple fixing cap 130, a thermocouple body 150, a first sealing ring 170 and a second sealing ring 190, and the thermocouple fixing seat 110 is detachably mounted on the vacuum chamber wall 200; the thermocouple fixing cap 130 is detachably connected to an end of the thermocouple fixing base 110; the thermocouple body 150 is inserted through the thermocouple fixing cap 130 and the thermocouple fixing base 110, and is adapted to extend into the vacuum chamber wall 200; the first sealing ring 170 is annularly arranged around the thermocouple body 150, and the first sealing ring 170 is arranged at one side of the thermocouple fixing seat 110 far away from the thermocouple fixing cap 130 and is used for being pressed between the thermocouple fixing seat 110 and the vacuum chamber wall 200 so as to enable the thermocouple fixing seat 110 to be in sealing joint with the vacuum chamber wall 200; the second sealing ring 190 is hermetically sealed on the thermocouple body 150, and the second sealing ring 190 is press-fitted between the thermocouple fixing seat 110 and the thermocouple fixing cap 130, so that the thermocouple fixing seat 110, the thermocouple fixing cap 130 and the thermocouple body 150 are in sealing engagement.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. The utility model provides a vacuum cavity seals temperature measuring device which characterized in that includes:
the thermocouple fixing seat is detachably arranged on the wall of the vacuum cavity;
the thermocouple fixing cap is detachably connected with the end part of the thermocouple fixing seat;
the thermocouple body penetrates through the thermocouple fixing cap and the thermocouple fixing seat and is used for extending into the vacuum cavity wall;
the first sealing ring is arranged on one side, away from the thermocouple fixing cap, of the thermocouple fixing seat in a surrounding mode and used for being pressed between the thermocouple fixing seat and the vacuum cavity wall in a pressing mode so that the thermocouple fixing seat is in sealing joint with the vacuum cavity wall;
and the second sealing ring is sleeved on the thermocouple body in a sealing manner, and is arranged between the thermocouple fixing seat and the thermocouple fixing cap in a pressing manner, so that the thermocouple fixing seat, the thermocouple fixing cap and the thermocouple body are in sealing joint.
2. The vacuum cavity sealing temperature measuring device according to claim 1, wherein the thermocouple fixing seat comprises a mounting portion, a connecting convex portion and a fixing member, one side of the mounting portion is used for being attached to the vacuum cavity wall, the connecting convex portion is connected with the other side of the mounting portion, the thermocouple body is arranged in the mounting portion in a penetrating mode and the connecting convex portion, a mounting hole is further formed in the mounting portion, the fixing member is assembled in the mounting hole and used for being detachably connected with the vacuum cavity wall, and the first sealing ring is arranged on one side, away from the connecting convex portion, of the mounting portion and used for being abutted to the vacuum cavity wall.
3. The sealed temperature measuring device for the vacuum cavity according to claim 2, wherein the thermocouple fixing cap comprises a connecting ring portion and a pressing portion which are integrally arranged, the connecting ring portion is sleeved outside the connecting convex portion and detachably connected with the connecting convex portion, the pressing portion is connected with one end of the connecting ring portion and is used for being connected with one end of the connecting convex portion, which is far away from the mounting portion, the thermocouple body is arranged in the pressing portion in a penetrating manner, and the second sealing ring is arranged on the inner side of the pressing portion and abuts against one end of the connecting convex portion, which is far away from the mounting portion.
4. The vacuum cavity sealing temperature measuring device according to claim 3, wherein the pressing portion is provided with a threading hole for the thermocouple body to pass through, an edge of one end of the threading hole close to the connecting convex portion is further provided with an outward-expanding pressing inclined surface, and the second sealing ring abuts against the pressing inclined surface and abuts against the connecting convex portion and the thermocouple body simultaneously under the pressing action of the pressing inclined surface.
5. The vacuum cavity sealing temperature measuring device according to claim 4, wherein the press-fit portion is provided with a threading hole for the thermocouple body to pass through, a press-fit groove is formed inside the press-fit portion, the press-fit groove is located at an end edge of the threading hole close to the connecting protrusion and is communicated with the threading hole, and the second sealing ring is arranged in the press-fit groove and is simultaneously abutted against the connecting protrusion and the thermocouple body under the press-fit action of the bottom wall of the press-fit groove.
6. The sealed temperature measuring device of claim 3, wherein the outer circumference of the connecting protrusion is provided with an external thread, the inner side of the connecting ring is provided with an internal thread, and the connecting ring is in threaded connection with the connecting protrusion.
7. The sealed temperature measuring device of claim 6, wherein the connecting ring has a regular hexagonal outer profile.
8. The vacuum cavity sealing temperature measuring device according to claim 2, wherein a sealing ring groove is formed in a side of the mounting portion away from the connecting protrusion, and the first sealing ring is protruded in the sealing ring groove.
9. The sealed temperature measuring device for the vacuum cavity according to any one of claims 1 to 8, wherein the thermocouple body comprises a connector, a connecting lead and a silicon wafer, one end of the connecting lead is connected with the connector, the other end of the connecting lead is connected with the silicon wafer, the silicon wafer is arranged on the inner side of the vacuum cavity wall, the connecting lead sequentially penetrates through the thermocouple fixing cap and the thermocouple fixing seat, the first sealing ring is annularly arranged around the connecting lead, and the second sealing ring is sleeved on the connecting lead.
10. Wafer processing equipment comprising a vacuum chamber and a vacuum chamber sealed temperature measuring device according to any one of claims 1 to 9, the vacuum chamber having a vacuum chamber wall, the thermocouple mount being removably mounted on the vacuum chamber wall, the thermocouple body extending into the vacuum chamber wall for sensing the temperature within the vacuum chamber.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211437742.1A CN115717943A (en) | 2022-11-17 | 2022-11-17 | Vacuum cavity sealing temperature measuring device and wafer processing equipment |
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| CN202211437742.1A CN115717943A (en) | 2022-11-17 | 2022-11-17 | Vacuum cavity sealing temperature measuring device and wafer processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116207020A (en) * | 2023-05-06 | 2023-06-02 | 无锡邑文电子科技有限公司 | Photoresist removing equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116207020A (en) * | 2023-05-06 | 2023-06-02 | 无锡邑文电子科技有限公司 | Photoresist removing equipment |
| CN116207020B (en) * | 2023-05-06 | 2023-08-18 | 无锡邑文电子科技有限公司 | Photoresist removing equipment |
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Address after: 214000 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province Applicant after: Wuxi Yiwen Microelectronics Technology Co.,Ltd. Address before: 214000 Guanshan Road, Xinwu District, Wuxi City, Jiangsu Province Applicant before: WUXI YIWEN ELECTRONIC TECHNOLOGY Co.,Ltd. |