CN115717855A - Chamfer machining specification error correction method - Google Patents
Chamfer machining specification error correction method Download PDFInfo
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- CN115717855A CN115717855A CN202211359197.9A CN202211359197A CN115717855A CN 115717855 A CN115717855 A CN 115717855A CN 202211359197 A CN202211359197 A CN 202211359197A CN 115717855 A CN115717855 A CN 115717855A
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Abstract
The invention relates to a method for correcting chamfer processing specification, which comprises the following steps: the method comprises the steps that firstly, diameter data and vertical diameter data of a finished wafer product are accurately measured on the finished wafer product by using a vernier caliper, so that the length of a reference surface is obtained, and information of the length of the reference surface is input into a system; secondly, acquiring the profile appearance of the chamfer through the information of the grinding wheel codes, and inputting the information of the profile appearance of the chamfer into a system; step three, inputting the length value of the reference surface of the sample wafer in the system, comparing the length value with the length specification of the reference surface of the wafer automatically taken in the system, and if the length value exceeds the specification, making an error-reporting prompt and stopping processing; and step four, inputting the information of the grinding wheel code in the system, calling the chamfer profile shape of the grinding wheel in the system, comparing the chamfer profile shape with the profile shape specification of the sample wafer, and if the read information does not accord with the profile shape specification, giving an error prompt and stopping processing.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a chamfer processing specification error correction method.
Background
In the semiconductor processing technology, the wafer chamfering mainly removes the edge stress of the silicon wafer and prevents the edge breakage and fragments after the manufacturing process. In the actual processing process, different chamfer specifications (mainly comprising chamfer appearance profiles and reference surface straight line lengths) need to be processed to meet the requirements of post-process manufacturing. In the chamfering process, due to the error set in the numerical control system by an operator, different specification parameters have no lack of specification processing errors, so that the wafer chamfering yield is low and the manufacturing cost is wasted.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a chamfer processing specification error correction method, which solves at least one technical problem.
The technical scheme of the invention is as follows: a method for correcting chamfer processing specification error is characterized by comprising the following steps:
the method comprises the steps that firstly, diameter data and vertical diameter data of a finished wafer product are accurately measured on the finished wafer product by using a vernier caliper, so that the length of a reference surface is obtained, and information of the length of the reference surface is input into a system;
secondly, acquiring the profile appearance of the chamfer through the information of the grinding wheel codes, and inputting the information of the profile appearance of the chamfer into a system;
step three, inputting the length value of the reference surface of the sample wafer in the system, comparing the length value with the length specification of the reference surface of the wafer automatically taken in the system, and if the length value exceeds the specification, making an error-reporting prompt and stopping processing;
inputting the information of the grinding wheel code in the system, calling the chamfer profile morphology of the grinding wheel in the system, comparing the profile morphology with the profile morphology specification of the sample wafer, and if the read information does not accord with the profile morphology specification, reporting an error to prompt and stopping processing.
The method mainly provides the functions of checking the chamfer profile shape of the chamfer specification and the length of the straight line of the reference surface and prompting correction. The length of the reference surface can not be accurately detected on the wafer due to the characteristics of the shape (the measurement accuracy is not enough and the technological requirements cannot be met), but the length of the current actual reference surface can be automatically calculated through the data of the actual measurement diameter and the vertical diameter (which can be accurately measured by using a vernier caliper) of the finished wafer and recorded into a system, and compared with the length specification of the reference surface of the wafer automatically called in the program, if the length of the reference surface exceeds the specification, an error-reporting prompt is made, and the processing is stopped. Because the profile shape of the chamfer is determined by the type of the grinding wheel (whetstone) used in the chamfer processing, the type information of the grinding wheel in the database can be retrieved through the information input of the grinding wheel code, and then compared with the specification of the profile shape of the wafer (the program automatically retrieves the batch number information of the wafer manufacturing), and if the respective read information does not accord with each other, an error is reported to prompt and the processing is stopped.
Further preferably, step three and step four may be simultaneously entered into the system. Thereby enabling faster inspection.
Preferably, the system is provided with four processing interfaces, namely a first processing interface, a second processing interface, a third processing interface and a fourth processing interface, wherein the first processing interface is provided with an input frame for inputting a sample wafer number, the second processing interface is provided with an input frame for inputting a sample wafer diameter and a sample wafer vertical diameter, the third processing interface is provided with a display screen for displaying an ideal wafer cost profile, and the fourth processing interface is provided with an input frame for inputting a grinding wheel code.
The invention optimizes the system so as to more simply and rapidly inspect the wafer, thereby saving the cost.
Preferably, the second interface and the fourth interface are both provided with display surfaces for making error-reporting prompts, and the display surfaces can display 'correct' or 'wrong'. So that the situation of the wafer can be known more clearly.
Further preferably, the system is provided with a storage module. Therefore, the data of each check can be stored, and the review is convenient.
Drawings
FIG. 1 is a display interface of the system;
FIG. 2 is another display interface of the system;
FIG. 3 is another display interface of the system.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Detailed description of the preferred embodiment 1
Referring to fig. 1, an interface schematic diagram of inputting a sample wafer number, a sample wafer diameter and a sample wafer vertical diameter, and a grinding wheel code on a system, fig. 2 is a schematic diagram of an interface when a point inspection calculation and confirmation is correct, fig. 3 is a schematic diagram of an interface when relevant data does not meet,
a chamfer machining specification error correction method comprises the following steps:
the method comprises the steps that firstly, diameter data and vertical diameter data of a finished wafer product are accurately measured on the finished wafer product by using a vernier caliper, so that the length of a reference surface is obtained, and information of the length of the reference surface is input into a system; secondly, acquiring the profile appearance of the chamfer through the information of the grinding wheel codes, and inputting the information of the profile appearance of the chamfer into a system; step three, inputting the length value of the reference surface of the sample wafer in the system, comparing the length value with the length specification of the reference surface of the wafer automatically taken in the system, and if the length value exceeds the specification, making an error-reporting prompt and stopping processing; and step four, inputting the information of the grinding wheel code in the system, calling the chamfer profile shape of the grinding wheel in the system, comparing the chamfer profile shape with the profile shape specification of the sample wafer, and if the read information does not accord with the profile shape specification, giving an error prompt and stopping processing.
The method mainly provides the functions of checking the chamfer profile shape of the chamfer specification and the length of the straight line of the reference surface and prompting correction. The length of the reference surface can not be accurately detected on the wafer due to the characteristics of the shape (the measurement accuracy is not enough and the technological requirements cannot be met), but the length of the current actual reference surface can be automatically calculated through the data of the actual measurement diameter and the vertical diameter (which can be accurately measured by using a vernier caliper) of the finished wafer and recorded into a system, and compared with the length specification of the reference surface of the wafer automatically called in the program, if the length of the reference surface exceeds the specification, an error-reporting prompt is made, and the processing is stopped. Because the profile shape of the chamfer is determined by the type of the grinding wheel (whetstone) used in the chamfer processing, the type information of the grinding wheel in the database can be called through the information input of the grinding wheel code, and then compared with the specification and the profile shape of the wafer (the program automatically calls the batch number information manufactured by the wafer), and if the read information does not accord with each other, an error is reported to prompt and the processing is stopped.
Further preferably, step three and step four may be simultaneously entered into the system. Thereby enabling faster inspection.
Preferably, the system is provided with four processing interfaces, namely a first processing interface, a second processing interface, a third processing interface and a fourth processing interface, wherein the first processing interface is provided with an input frame for inputting a sample wafer number, the second processing interface is provided with an input frame for inputting a sample wafer diameter and a sample wafer vertical diameter, the third processing interface is provided with a display screen for displaying an ideal wafer cost profile, and the fourth processing interface is provided with an input frame for inputting a grinding wheel code.
The invention optimizes the system so as to more simply and rapidly inspect the wafer, thereby saving the cost.
Preferably, the second interface and the fourth interface are both provided with display surfaces for making error-reporting prompts, and the display surfaces can display 'correct' or 'wrong'. So that the condition of the wafer can be known more clearly.
Further preferably, the system is provided with a storage module. Therefore, the data of each check can be stored, and the review is convenient.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements should also be considered as the protection scope of the present invention.
Claims (5)
1. A chamfer processing specification error correction method is characterized by comprising the following steps:
the method comprises the following steps that firstly, diameter data and vertical diameter data of a finished wafer product are accurately measured on the finished wafer product by using a vernier caliper, so that the length of a reference surface is obtained, and information of the length of the reference surface is input into a system;
secondly, acquiring the profile appearance of the chamfer through the information of the grinding wheel codes, and inputting the information of the profile appearance of the chamfer into a system;
step three, inputting the length value of the reference surface of the sample wafer in the system, comparing the length value with the length specification of the reference surface of the wafer automatically taken in the system, and if the length value exceeds the specification, making an error-reporting prompt and stopping processing;
and step four, inputting the information of the grinding wheel code in the system, calling the chamfer profile shape of the grinding wheel in the system, comparing the chamfer profile shape with the profile shape specification of the sample wafer, and if the read information does not accord with the profile shape specification, giving an error prompt and stopping processing.
2. The method of claim 1, wherein the method comprises: step three and step four can be input in the system at the same time.
3. The method of claim 1, wherein the method comprises: the system is provided with four processing interfaces which are a first processing interface, a second processing interface, a third processing interface and a fourth processing interface respectively, wherein an input frame for inputting a sample wafer number is arranged on the first processing interface, an input frame for inputting a sample wafer diameter and a sample wafer vertical diameter is arranged on the second processing interface, a display screen for displaying an ideal wafer cost profile is arranged on the third processing interface, and an input frame for inputting a grinding wheel code is arranged on the fourth processing interface.
4. The method of claim 1, wherein the method comprises: and display surfaces for making error prompt are arranged on the second interface and the fourth interface, and correct or wrong can be displayed on the display surfaces.
5. The method of claim 1, wherein the method comprises: the system is provided with a storage module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211359197.9A CN115717855A (en) | 2022-11-01 | 2022-11-01 | Chamfer machining specification error correction method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211359197.9A CN115717855A (en) | 2022-11-01 | 2022-11-01 | Chamfer machining specification error correction method |
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| Publication Number | Publication Date |
|---|---|
| CN115717855A true CN115717855A (en) | 2023-02-28 |
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| CN202211359197.9A Pending CN115717855A (en) | 2022-11-01 | 2022-11-01 | Chamfer machining specification error correction method |
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- 2022-11-01 CN CN202211359197.9A patent/CN115717855A/en active Pending
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