CN115712318A - Heating device and motor vehicle with a heating device - Google Patents

Heating device and motor vehicle with a heating device Download PDF

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Publication number
CN115712318A
CN115712318A CN202211012322.9A CN202211012322A CN115712318A CN 115712318 A CN115712318 A CN 115712318A CN 202211012322 A CN202211012322 A CN 202211012322A CN 115712318 A CN115712318 A CN 115712318A
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CN
China
Prior art keywords
heating
heating element
heating device
diode
terminal
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Pending
Application number
CN202211012322.9A
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Chinese (zh)
Inventor
蒂姆·基林格
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Mahle International GmbH
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Mahle International GmbH
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Filing date
Publication date
Application filed by Mahle International GmbH filed Critical Mahle International GmbH
Publication of CN115712318A publication Critical patent/CN115712318A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00Details of electric heating devices
    • H05B1/02Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227Applications
    • H05B1/023Industrial applications
    • H05B1/0236Industrial applications for vehicles

Abstract

The invention relates to an electric heating device (1), in particular for a motor vehicle. The heating device (1) comprises at least one heating element (2) which can be energized and which, when energized, emits heating heat. Furthermore, the heating device (1) comprises at least one semiconductor diode (4) electrically connected to the heating element (2) in the parallel circuit (3) for reducing or suppressing voltage peaks induced in or at the heating element (2).

Description

Heating device and motor vehicle with a heating device
Technical Field
The present invention relates to an electric heating device and a motor vehicle having such an electric heating device.
Background
Electric heating devices are used in many ways in modern motor vehicles. Such conventional electric heating devices typically include one or more electric heating elements that, when energized, dissipate heat to their surroundings.
Disclosure of Invention
The purpose of the invention is: an improved embodiment is created for an electric heating device, which is characterized by an improved operational reliability. In particular, an electrical heating device is to be provided which has an improved protection against undesired voltage peaks.
This object is achieved by the subject matter of the independent claims. Preferred embodiments are the subject of the dependent claims.
The basic idea of the invention is therefore: the electric heating device is provided with a parallel circuit having a first electrical branch and a second electrical branch which are connected in parallel to each other. In this case, an electrical heating element is arranged in the first electrical branch, which electrical heating element generates heat when energized. An electrical semiconductor diode is arranged in the second electrical branch.
Since the heating element has an inductance L, the current I through the heating element changes according to the law of induction U Ind = -L dI/dt induced voltage U in the heating element Ind . In this case, a voltage U is induced Ind With a supply voltage U for generating an electric heating current I through the heating element Ver The opposite polarity.
Since a very high induced voltage U can be induced in the heating element in the case of a correspondingly sufficiently high current change dI/dt of the heating element and a correspondingly high inductance L of the heating element Ind There is therefore a risk that the heating element, the electronics unit or the entire heating device is damaged or even destroyed completely.
This is counteracted by the semiconductor diode, which is necessary according to the invention, changing from an electrically off-state to an electrically on-state in the event of an induced voltage being induced at the heating element. Thus, a current flows through the semiconductor diode in the conducting direction, which current causes a reduction in the induced voltage induced in the heating element.
In this way, undesired voltage peaks in the heating element can be counteracted. In the ideal case, it can even be ensured that: the voltage dropped at the heating element does not reach the maximum permissible voltage value beyond which the danger of damage or destruction of the heating element is encountered. This in turn improves the operational reliability of the heating device.
The electrical heating device according to the invention comprises at least one heating element which is energizable and which, when energized, emits heating heat to the surroundings. Currently, an electric heating element is understood to be any electric component whose function is intended to: in operation (i.e. when energized), heating heat is generated and emitted in a targeted manner, which heating heat is used as heating or useful heat. Rather than electronic components that do not primarily generate heat but dissipate energy in operation and thus generate (virtually undesirable) waste heat.
The electrical heating elements described herein can be heating coils, or electrical heating resistors, among others.
It goes without saying that two or more such electric heating elements can also be provided, which can then be electrically connected in parallel or in series with one another. In case at least three such heating elements are provided, a combination of electrical series and electrical parallel is also conceivable.
Furthermore, the heating device according to the invention comprises a parallel circuit, which preferably has a first electrical branch and a second electrical branch arranged electrically in parallel with the first electrical branch, wherein the heating element is then associated with the first electrical branch of the parallel circuit.
According to the invention, the heating device comprises an electrical semiconductor diode which is arranged in the second branch of the parallel circuit, in turn arranged at least electrically in parallel with the electrical heating element, for reducing or even suppressing the (induced) voltage induced in or at the heating element.
According to one advantageous development, the parallel circuit comprises an electrically positive terminal and an electrically negative terminal, between which (in an electrically connected manner with both terminals) a first electrical branch and a second electrical branch are arranged. In this refinement, the second electrical branch is electrically connected in parallel with the first electrical branch, preferably with the first branch end electrically connected to the positive terminal, and preferably with the second branch end electrically connected to the negative terminal. Correspondingly, the second electrical branch is also electrically connected, preferably at the first branch end, to the positive terminal and, preferably, at the second branch end, to the negative terminal.
In this refinement, the at least one heating element is arranged in the first electrical branch and the at least one semiconductor diode is arranged in the second electrical branch. Such an electronic circuit arrangement is particularly simple and therefore inexpensive to implement, and it is also possible to simply connect the heating element and the semiconductor diode to a voltage supply (internal or external).
In practice, at least one semiconductor diode is arranged in the off direction between the positive and negative terminals. This means that: the diode positive terminal is electrically connected with the negative terminal of the parallel circuit, and the diode negative terminal is electrically connected with the positive terminal of the parallel circuit.
According to a further advantageous development, the ohmic resistor is arranged in a parallel circuit (electrically in parallel with the at least one electric heating element and electrically in series with the at least one semiconductor diode), preferably in the first branch. In this way, the overload of the semiconductor diode can be counteracted.
According to another preferred embodiment, the semiconductor diode comprises a semiconductor-semiconductor contact or a metal-semiconductor. For the case of semiconductor-semiconductor contacts to be used, the recommended material system is silicon or silicon germanium, gallium arsenide or silicon carbide, so that the semiconductor diode can be constructed as a silicon diode or as a silicon germanium diode. For the case where semiconductor-metal contacts are to be used, lithium can also be used when the semiconductor is combined with a suitable metal in order to form a schottky diode.
According to a further preferred embodiment, the at least one semiconductor diode is designed as a zener diode. Such zener diodes operate in the range of their electrical breakdown voltage and can also be used to counteract voltage peaks of the same polarity as the supply voltage.
According to a further advantageous development, two zener diodes are arranged in the parallel circuit electrically in parallel with the at least one electric heating element and electrically in series with one another. In this refinement, a first zener diode of the two zener diodes in the blocking direction and a second zener diode of the two zener diodes in the conducting direction are arranged between the positive terminal and the negative terminal. This makes it possible to cancel voltage peaks which are induced and have not only one but two polarities.
According to a further advantageous development, the heating device comprises a voltage source having a supply positive terminal and a supply negative terminal for providing a supply voltage between the supply positive terminal and the supply negative terminal. In this variant, the positive supply terminal is electrically connected to the positive terminal of the parallel circuit and the negative supply terminal is electrically connected to the negative terminal of the parallel circuit.
According to a preferred embodiment, the at least one heating element comprises or is a heating rack or coil or a thick film resistive heating module ("TFR").
The invention also relates to a motor vehicle, in particular an electric vehicle, having at least one vehicle component which can be heated by means of the heating device according to the invention described above. The advantages of the heating device according to the invention described above are therefore also transferred to the motor vehicle according to the invention.
Further important features and advantages of the invention emerge from the dependent claims, the figures and the associated description of the figures with reference to the figures.
It goes without saying that the features mentioned above and those yet to be explained below can be used not only in the respectively given combination but also in other combinations or alone without departing from the scope of the invention.
Drawings
Preferred embodiments of the invention are illustrated in the figures and are explained in more detail in the following description, in which the same reference signs refer to identical or similar or functionally identical components.
Schematically showing:
FIG. 1 shows an example of a heating device according to the invention in circuit diagram form, with a silicon diode
Fig. 2 shows a variant of the example of fig. 1, with a zener diode,
fig. 3 shows a modification of the example of fig. 2, which has two zener diodes.
Detailed Description
Fig. 1 shows an example of an electrical heating device 1 for a motor vehicle according to the invention in an electrical circuit diagram.
The heating device 1 comprises a parallel circuit 3 formed by electrically conductive paths. All of the conductive paths 15 shown in fig. 1 can be realized, for example, by corresponding conductor tracks on a printed circuit board. According to fig. 1, the parallel circuit 3 comprises a positive electrical terminal 5a and an electrical negative terminal 5b, which are electrically connected to each other via a first electrical branch 10a and via a second electrical branch 10b (electrically parallel to the first electrical branch).
The second electrical branch 10b is electrically connected to the positive terminal 5a and the negative terminal 5b in electrical parallel with the first electrical branch 10 a. For this purpose, the two first branch ends 11a of the two branches 10a, 10b are electrically connected to each other and to the positive terminal 5 a. Likewise, the two second branch ends 11b of the two branches 10a, 10b are electrically connected to each other and to the negative terminal 5 b. The electric heating element 2 is arranged in the first electric branch 10 a.
The heating device 1 comprises a heating element 2 which is energizable and which emits heating heat when energized. The heating element 2 is arranged in the first electrical branch 10 a. The heating element 2 can be a heating grid or a heating coil or a thick film resistive heating module. The heating element 2 has (at least depending on the different operating states, such as switching frequency, edge steepness and operating temperature) an inductance of L > 0.
The heating device 1 further comprises a semiconductor diode 4 arranged electrically in parallel with the heating element 2 to reduce or suppress voltage peaks induced in or at the heating element 2. The semiconductor diode 4 is arranged in the second electrical branch 10b. The semiconductor diode 4 can be designed as a silicon diode or as a schottky diode. For this purpose, the semiconductor diode 4 can comprise a semiconductor-semiconductor contact or a metal-semiconductor contact.
The semiconductor diode 4 has a diode positive terminal 12a and a diode negative terminal 12b in a conventional manner, and is configured such that it allows a current flow in the conduction direction DR, i.e., from the diode positive terminal 12a to the diode negative terminal 12b, and blocks a current flow from the diode negative terminal 12b to the diode positive terminal 12a, i.e., in the cutoff direction SR.
The semiconductor diode 4 is disposed between the positive terminal 5a and the negative terminal 5b in the off direction SR. Thus, the diode positive terminal 12a is electrically associated with the negative terminal 5b and the diode negative terminal 12 is electrically associated with the positive terminal 5 a. In normal operation of the heating device 1, therefore, the heating current I can flow only through the first electrical branch 10a with the heating element 2 and not through the second electrical branch 10b with the semiconductor diode 4 which is switched off.
The heating device 1 can optionally comprise an (integrated) voltage source 8 with a positive supply terminal 9a and a negative supply terminal 9b for providing a supply voltage U between the positive supply terminal 9a and the negative supply terminal 9b Vers
In this modification, the power supply positive terminal 9a is electrically connected to the positive terminal 5a of the parallel circuit 3. Accordingly, the power supply negative terminal 9b is electrically connected to the negative terminal 5b of the parallel circuit 3. In case the voltage source 8 is correctly connected to both terminals 5a, 5b, the potential at the positive terminal 5a is larger than the potential at the negative terminal 5 b. In this way, a (heating) current I is generated which flows from the positive terminal 5a to the negative terminal 5 b.
Since the heating element 2 has an inductance L, the current I through the heating element 2 changes according to the law of induction U Ind = -L dI/dt induced voltage U at heating element 2 Ind
In this case, a voltage U is induced Ind Having a supply voltage U Vers The opposite polarity. Since a very high induced voltage U can be induced at the heating element 2 in the case of a correspondingly high current change dI/dt and a correspondingly high inductance L of the heating element 2 Ind There is therefore a risk that the heating element 2 is damaged or even completely destroyed.
This is counteracted by the semiconductor diode 4, which is due to the induced voltage U induced at the heating element 2 Ind And is converted to an electrically conductive state. Thus, a compensation current I can flow through the semiconductor diode in the conducting direction DR, which compensation current causes the induced voltage U Ind Is reduced. Therefore, undesired voltage peaks can be cancelled out.
In an ideal case, it is possible to achieve: the voltage dropped at the heating element 2 does not reach the maximum permissible voltage value beyond which the risk of damage or destruction of the heating element 2 is encountered. In this way, the operational reliability of the entire heating device 1 is improved.
In the example of fig. 1, the ohmic resistor 6 is arranged in the second branch 10b of the parallel circuit 3, i.e. is arranged electrically in parallel with the electrical heating element 2 of the first branch 10a and electrically in series with the semiconductor diode 4 and thus between the two branch ends 11a, 11b of the second branch 10b. In this way, the overload of the semiconductor diode 4 can be counteracted. In a simplified variant, the ohmic resistor 6 can also be omitted.
Fig. 2 shows a variant of the circuit arrangement 1 from fig. 1 in the region of the second branch 5 b. Therefore, the semiconductor diode 4 is also configured as a zener diode 7. In the example of fig. 2, an ohmic resistor 6 as shown in fig. 1 can optionally also be provided (omitted from fig. 2 for clarity).
Fig. 3 shows a modification of the variant according to fig. 2. In the example of fig. 3, not only a single zener diode 7 is provided in the second branch 10b. More precisely, two zener diodes 7a, 7b are arranged electrically in series with one another as semiconductor diodes 4.
Here, a first zener diode 7a of the two zener diodes in the off direction SR and a second zener diode 7b of the two zener diodes in the on direction DR are disposed between the positive terminal 5a and the negative terminal 5 b. Also in the example of fig. 3, an ohmic resistor 6 as shown in fig. 1 can optionally be provided (omitted in fig. 3 for clarity).

Claims (10)

1. An electric heating device (1), in particular for a motor vehicle,
-having at least one heating element (2) that can be energized and that emits heating heat when energized,
-having at least one semiconductor diode (4) electrically connected in a parallel circuit (3) with the heating element (2) for reducing or suppressing voltage peaks induced in or at the heating element (2).
2. The heating apparatus as set forth in claim 1,
it is characterized in that the preparation method is characterized in that,
the parallel circuit (3) comprises a positive terminal (5 a) and an electric negative terminal (5 b), between which a first electric branch (10 a) and a second electric branch (5 b) are arranged in an electrically connected manner with the two terminals (5 a, 5 b),
-wherein the second electrical branch (10 b) is electrically connected with the positive terminal (5 a) and the negative terminal (5 b) in an electrically parallel manner with the first electrical branch (10 a),
-wherein said at least one heating element (2) is arranged in said first electrical branch (10 a) and said at least one semiconductor diode (4) is arranged in said second electrical branch (10 b).
3. The heating device according to claim 1 or 2,
it is characterized in that the preparation method is characterized in that,
at least one semiconductor diode (4) is arranged between the positive terminal (5 a) and the negative terminal (5 b) in a cut-off direction (SR).
4. Heating device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
an ohmic resistor (6) is arranged in the parallel circuit (3) in electrical parallel with the at least one electric heating element (2) and in electrical series with the at least one semiconductor diode.
5. Heating device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the at least one heating element (2) has an inductance of L > 0.
6. Heating device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
-the at least one semiconductor diode (4) is configured as a silicon diode or as a schottky diode; or/and
-the at least one semiconductor diode (4) is configured as a zener diode (7).
7. Heating device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
-two Zener diodes (7 a, 7 b) as semiconductor diodes are arranged in the parallel circuit (3) electrically in parallel with the at least one electric heating element (2) and electrically in series with each other,
-a first zener diode (7 a) of said two zener diodes in the cut-off direction (SR) and a second zener diode (7 b) of said two zener diodes in the conduction direction (SR) are arranged between said positive terminal (5 a) and said negative terminal (5 b).
8. Heating device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
-the heating device (1) comprises a voltage source (8) having a positive supply terminal (9 a) and a negative supply terminal (9 b) for providing a supply voltage (U) between the positive supply terminal (9 a) and the negative supply terminal (9 b) Vers ),
-the supply positive terminal (9 a) is electrically connected with the positive terminal (5 a) of the parallel circuit (3) and the supply negative terminal (9 b) is electrically connected with the negative terminal (5 b) of the parallel circuit (3).
9. Heating device according to one of the preceding claims,
it is characterized in that the preparation method is characterized in that,
the at least one heating element (2) comprises or is a heating grid or heating coil or a thick film resistive heating module ("TFR"), for example a PTC heating element.
10. A motor vehicle, in particular an electric vehicle,
-having at least one vehicle component which can be heated by means of a heating device (1) according to one of the preceding claims.
CN202211012322.9A 2021-08-23 2022-08-23 Heating device and motor vehicle with a heating device Pending CN115712318A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021209236.5A DE102021209236A1 (en) 2021-08-23 2021-08-23 Heating device and motor vehicle with heating device
DE102021209236.5 2021-08-23

Publications (1)

Publication Number Publication Date
CN115712318A true CN115712318A (en) 2023-02-24

Family

ID=85132573

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211012322.9A Pending CN115712318A (en) 2021-08-23 2022-08-23 Heating device and motor vehicle with a heating device

Country Status (2)

Country Link
CN (1) CN115712318A (en)
DE (1) DE102021209236A1 (en)

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Publication number Publication date
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