CN115710483A - Preparation method of UV-curable three-proofing adhesive - Google Patents
Preparation method of UV-curable three-proofing adhesive Download PDFInfo
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- CN115710483A CN115710483A CN202211341742.1A CN202211341742A CN115710483A CN 115710483 A CN115710483 A CN 115710483A CN 202211341742 A CN202211341742 A CN 202211341742A CN 115710483 A CN115710483 A CN 115710483A
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- resin
- curing type
- preparation
- proofing
- proofing adhesive
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- 239000000853 adhesive Substances 0.000 title claims abstract description 37
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 238000003848 UV Light-Curing Methods 0.000 claims abstract description 26
- 238000002156 mixing Methods 0.000 claims abstract description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 14
- 239000010703 silicon Substances 0.000 claims abstract description 14
- 238000003756 stirring Methods 0.000 claims abstract description 11
- -1 acrylic ester Chemical class 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 8
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 5
- 239000003054 catalyst Substances 0.000 claims abstract description 5
- 150000002009 diols Chemical class 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims abstract description 5
- 229920000570 polyether Polymers 0.000 claims abstract description 5
- 239000012895 dilution Substances 0.000 claims abstract description 4
- 238000010790 dilution Methods 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000007873 sieving Methods 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 229920002545 silicone oil Polymers 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- MTEZSDOQASFMDI-UHFFFAOYSA-N 1-trimethoxysilylpropan-1-ol Chemical compound CCC(O)[Si](OC)(OC)OC MTEZSDOQASFMDI-UHFFFAOYSA-N 0.000 claims description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 4
- 239000003292 glue Substances 0.000 abstract 2
- 239000011259 mixed solution Substances 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- SEKZHGKCVMOJSY-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl 2-methylprop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C(C)=C SEKZHGKCVMOJSY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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Abstract
The invention relates to the technical field of UV-curing type three-proofing glue, in particular to a preparation method of UV-curing type three-proofing glue, which comprises the following steps: the method comprises the following steps: preparing organic silicon UV resin, and mixing epoxy organic silicon UV resin and modified organic silicon UV resin according to the ratio of 2: 1; step two: preparing acrylic ester, namely mixing a monoisocyanate monomer, polyether diol and a catalyst according to the ratio of 3: 2: 1; step three: preparing UV curing type three-proofing adhesive, mixing and stirring organic silicon UV resin and acrylic ester according to the ratio of 2: 1, adding a quantitative diluent for dilution to obtain a primary mixed solution, and adding a photoinitiator to obtain the UV curing type three-proofing adhesive; step four: and (3) performing subsequent treatment, namely continuously stirring the prepared UV-curing type three-proofing adhesive for 1 hour to ensure that the materials in the reaction kettle are completely and uniformly stirred, finally sieving the materials through a 100-mesh sieve, and packaging to obtain a finished product. The preparation process disclosed by the invention is simple in flow, short in preparation time and high in efficiency, and the prepared UV-curing type three-proofing adhesive is free from environmental pollution.
Description
Technical Field
The invention relates to the technical field of UV-curing type three-proofing adhesives, in particular to a preparation method of a UV-curing type three-proofing adhesive.
Background
The three-proofing adhesive is also called as circuit board protective adhesive or coating adhesive, wherein the three-proofing adhesive is organic silicon modified resin and is used for protecting a circuit board and related equipment thereof from being corroded by severe environment, so that the service life of a product is prolonged, and the safety and reliability in use are ensured. Most of the existing three-proofing adhesives contain organic solvents, and have the disadvantages of environmental pollution, complex preparation process, long preparation time and low efficiency.
Disclosure of Invention
The invention aims to provide a preparation method of a UV-curing type three-proofing adhesive, which solves the problems that most of the existing three-proofing adhesives contain organic solvents, cause environmental pollution, complex preparation process, long preparation time and low efficiency.
In order to achieve the purpose, the invention provides the following technical scheme: a preparation method of UV-curing type three-proofing adhesive comprises the following steps:
the method comprises the following steps: preparing organosilicon UV resin, mixing epoxy organosilicon UV resin and modified organosilicon UV resin according to the ratio of 2: 1, wherein the epoxy organosilicon UV resin is formed by mixing hydroxy silicone oil, gamma-glycidyl ether oxypropyl trimethoxy silane and gamma-mono (methacryloyloxy) propyl trimethoxy silane according to the ratio of 8: 2: 1, and the modified organosilicon UV resin is formed by mixing hydroxy silicone oil and gamma- (methacryloyloxy) propyl trimethoxy silane according to the ratio of 3: 1;
step two: preparing acrylate, namely mixing a monoisocyanate monomer, polyether diol and a catalyst according to the ratio of 3: 2: 1;
step three: preparing UV-curing type three-proofing adhesive, mixing and stirring the prepared organic silicon UV resin and acrylic ester according to the ratio of 2: 1, adding a quantitative diluent for dilution to obtain a primary mixed liquid, and adding a photoinitiator into the primary mixed liquid to obtain the UV-curing type three-proofing adhesive;
step four: and (4) performing subsequent treatment, namely continuously stirring the UV-curing type three-proofing adhesive prepared in the step three for 1 hour to ensure that the materials in the reaction kettle are completely and uniformly stirred, finally sieving the materials through a 100-mesh sieve, and packaging to obtain a finished product.
Preferably, the hydroxy silicone oil in the first step is low molecular weight dihydroxy terminated hydroxy silicone oil.
Preferably, the acrylate in the second step is a low viscosity tetrafunctional acrylate.
Preferably, the diluent in the third step is a low viscosity UV type silicone resin.
Preferably, the photoinitiator consists of aminoketone initiator and other photoinitiators, wherein the aminoketone initiator accounts for 70-85 wt% of the total weight of the photoinitiators.
Preferably, the stirring temperature in the fourth step is 45-65 ℃.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention provides a preparation method of UV-curing type three-proofing adhesive, which comprises the following steps: the method comprises the following steps: preparing organic silicon UV resin; step two: preparing acrylic ester; step three: preparing UV-curing type three-proofing adhesive; step four: and (2) performing subsequent treatment, wherein the organic silicon UV resin in the step one is prepared by mixing epoxy organic silicon UV resin and modified organic silicon UV resin according to the ratio of 2: 1, and the acrylic ester in the step two is prepared by mixing monoisocyanate monomer, polyether diol and catalyst according to the ratio of 3: 2: 1. The preparation process disclosed by the invention is simple in flow, short in preparation time and high in efficiency, and the prepared UV-curing type three-proofing adhesive is an environment-friendly product, has no pollution to the environment and good environmental friendliness, can effectively reduce the consumption of pollutants to be treated, and is worthy of great popularization and application.
Drawings
FIG. 1 is a flow chart of the preparation process of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention: a preparation method of UV-curing type three-proofing adhesive comprises the following steps:
step one S1: preparing organosilicon UV resin, and mixing epoxy organosilicon UV resin and modified organosilicon UV resin according to a ratio of 2: 1, wherein the epoxy organosilicon UV resin is formed by mixing hydroxy silicone oil, gamma-glycidyl ether oxypropyl trimethoxy silane and gamma- (methacryloyloxy) propyltrimethoxy silane according to a ratio of 8: 2: 1, and the modified organosilicon UV resin is formed by mixing hydroxy silicone oil and gamma- (methacryloyloxy) propyltrimethoxy silane according to a ratio of 3: 1;
step two S2: preparing acrylic ester, namely mixing a monoisocyanate monomer, polyether diol and a catalyst according to the ratio of 3: 2: 1;
step three, S3: preparing UV-curing type three-proofing adhesive, mixing and stirring the prepared organic silicon UV resin and acrylic ester according to the ratio of 2: 1, adding a quantitative diluent for dilution to obtain a primary mixed liquid, and adding a photoinitiator into the primary mixed liquid to obtain the UV-curing type three-proofing adhesive;
step four S4: and (4) performing subsequent treatment, namely continuously stirring the UV-curing type three-proofing adhesive prepared in the step three for 1 hour to ensure that the materials in the reaction kettle are completely and uniformly stirred, finally sieving the materials through a 100-mesh sieve, and packaging to obtain a finished product.
Wherein the hydroxyl silicone oil in the step one is low molecular weight dihydroxy terminated hydroxyl silicone oil, the acrylate in the step two is low viscosity tetrafunctional acrylate, the diluent in the step three is low viscosity UV type organic silicon resin, and the stirring temperature in the step four is 45-65 ℃.
It should be noted that, in the present invention, the photoinitiator is composed of aminoketone initiator and other photoinitiators, wherein the aminoketone initiator accounts for 70wt% to 85wt% of the total amount of the photoinitiator.
In conclusion, the preparation method of the UV-curing type three-proofing adhesive provided by the invention has the advantages of simple preparation process flow, short preparation time and high efficiency, the prepared UV-curing type three-proofing adhesive is an environment-friendly product, is free from environmental pollution and good in environmental protection, can effectively reduce the consumption of pollutants, and is worthy of wide popularization and application.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A preparation method of UV curing type three-proofing adhesive is characterized by comprising the following steps: the method comprises the following steps:
the method comprises the following steps: preparing organosilicon UV resin, mixing epoxy organosilicon UV resin and modified organosilicon UV resin according to the ratio of 2: 1, wherein the epoxy organosilicon UV resin is formed by mixing hydroxy silicone oil, gamma-glycidyl ether oxypropyl trimethoxy silane and gamma- (methacryloyloxy) propyl trimethoxy silane according to the ratio of 8: 2: 1, and the modified organosilicon UV resin is formed by mixing hydroxy silicone oil and gamma- (methacryloyloxy) propyl trimethoxy silane according to the ratio of 3: 1;
step two: preparing acrylic ester, namely mixing a monoisocyanate monomer, polyether diol and a catalyst according to the ratio of 3: 2: 1;
step three: preparing UV-curing type three-proofing adhesive, mixing and stirring the prepared organic silicon UV resin and acrylic ester according to the ratio of 2: 1, adding a quantitative diluent for dilution to obtain a primary mixed liquid, and adding a photoinitiator into the primary mixed liquid to obtain the UV-curing type three-proofing adhesive;
step four: and (4) performing subsequent treatment, namely continuously stirring the UV-curing type three-proofing adhesive prepared in the step three for 1 hour to ensure that the materials in the reaction kettle are completely and uniformly stirred, finally sieving the materials through a 100-mesh sieve, and packaging to obtain a finished product.
2. The preparation method of the UV-curable three-proofing adhesive according to claim 1, characterized by comprising the following steps: the hydroxyl silicone oil in the step one is low-molecular-weight dihydroxy-terminated hydroxyl silicone oil.
3. The preparation method of the UV-curable three-proofing adhesive according to claim 1, characterized by comprising the following steps: the acrylate in the second step is low-viscosity tetrafunctional acrylate.
4. The preparation method of the UV-curable three-proofing adhesive according to claim 1, characterized by comprising the following steps: the diluent in the third step is low-viscosity UV type organic silicon resin.
5. The preparation method of the UV-curable three-proofing adhesive according to claim 1, characterized by comprising the following steps: the photoinitiator consists of aminoketone initiator and other photoinitiators, wherein the aminoketone initiator accounts for 70-85 wt% of the total amount of the photoinitiator.
6. The preparation method of the UV-curable three-proofing adhesive according to claim 1, characterized by comprising the following steps: the stirring temperature in the fourth step is 45-65 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211341742.1A CN115710483A (en) | 2022-10-28 | 2022-10-28 | Preparation method of UV-curable three-proofing adhesive |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211341742.1A CN115710483A (en) | 2022-10-28 | 2022-10-28 | Preparation method of UV-curable three-proofing adhesive |
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| Publication Number | Publication Date |
|---|---|
| CN115710483A true CN115710483A (en) | 2023-02-24 |
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| CN202211341742.1A Pending CN115710483A (en) | 2022-10-28 | 2022-10-28 | Preparation method of UV-curable three-proofing adhesive |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0361978A2 (en) * | 1988-09-30 | 1990-04-04 | Westinghouse Electric Corporation | Improvements in or relating to resin compositions curable with ultraviolet light |
| KR101609687B1 (en) * | 2015-05-19 | 2016-04-06 | (주)필스톤 | Method for preparing adhesive composition for uv-curable |
| CN109370507A (en) * | 2018-11-01 | 2019-02-22 | 烟台信友新材料有限公司 | A kind of three proofings adhesive and preparation method thereof of low viscosity environmental protection UV/ moisture dual cure |
| CN109796930A (en) * | 2019-02-27 | 2019-05-24 | 华南理工大学 | A kind of organosilicon three proofings glue and the preparation method and application thereof |
| CN111100595A (en) * | 2019-12-23 | 2020-05-05 | 烟台信友新材料有限公司 | LED (light-emitting diode) cured ultraviolet curing adhesive for curved screen pasting film |
| CN112552866A (en) * | 2020-12-29 | 2021-03-26 | 烟台信友新材料有限公司 | UV-LED and moisture dual-curing environment-friendly three-proofing adhesive and preparation method thereof |
| CN113372816A (en) * | 2021-05-21 | 2021-09-10 | 无锡时生高分子科技有限公司 | Solvent-free UV (ultraviolet) curing type organic silicon three-proofing adhesive |
| US20210332219A1 (en) * | 2020-04-28 | 2021-10-28 | Shenzhen Zhinengpai Technology Co., Ltd | Bio-based UV-curable 3D printed resin and preparation method thereof |
-
2022
- 2022-10-28 CN CN202211341742.1A patent/CN115710483A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0361978A2 (en) * | 1988-09-30 | 1990-04-04 | Westinghouse Electric Corporation | Improvements in or relating to resin compositions curable with ultraviolet light |
| KR101609687B1 (en) * | 2015-05-19 | 2016-04-06 | (주)필스톤 | Method for preparing adhesive composition for uv-curable |
| CN109370507A (en) * | 2018-11-01 | 2019-02-22 | 烟台信友新材料有限公司 | A kind of three proofings adhesive and preparation method thereof of low viscosity environmental protection UV/ moisture dual cure |
| CN109796930A (en) * | 2019-02-27 | 2019-05-24 | 华南理工大学 | A kind of organosilicon three proofings glue and the preparation method and application thereof |
| CN111100595A (en) * | 2019-12-23 | 2020-05-05 | 烟台信友新材料有限公司 | LED (light-emitting diode) cured ultraviolet curing adhesive for curved screen pasting film |
| US20210332219A1 (en) * | 2020-04-28 | 2021-10-28 | Shenzhen Zhinengpai Technology Co., Ltd | Bio-based UV-curable 3D printed resin and preparation method thereof |
| CN112552866A (en) * | 2020-12-29 | 2021-03-26 | 烟台信友新材料有限公司 | UV-LED and moisture dual-curing environment-friendly three-proofing adhesive and preparation method thereof |
| CN113372816A (en) * | 2021-05-21 | 2021-09-10 | 无锡时生高分子科技有限公司 | Solvent-free UV (ultraviolet) curing type organic silicon three-proofing adhesive |
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