CN115696847A - Immersion cooling system and immersion cooling method - Google Patents

Immersion cooling system and immersion cooling method Download PDF

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Publication number
CN115696847A
CN115696847A CN202210147926.8A CN202210147926A CN115696847A CN 115696847 A CN115696847 A CN 115696847A CN 202210147926 A CN202210147926 A CN 202210147926A CN 115696847 A CN115696847 A CN 115696847A
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China
Prior art keywords
cooling
valve
immersion
bath
cooling bath
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Pending
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CN202210147926.8A
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Chinese (zh)
Inventor
林威志
张仁俊
简燕辉
陈家兴
陈立修
蔡文
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Delta Electronics Inc
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Delta Electronics Inc
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Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to US17/804,567 priority Critical patent/US20230027917A1/en
Priority to EP22179418.3A priority patent/EP4124192A1/en
Publication of CN115696847A publication Critical patent/CN115696847A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

The invention provides an immersion cooling system, which comprises a cooling tank, a shell and a valve. The cooling bath is configured to contain a cooling fluid and an electronic device immersed in the cooling fluid. The housing covers one side of the cooling tank to form a closed space. The valve has two ports respectively communicated with the closed space and the part of the cooling groove above the cooling liquid, and is configured to be opened when the air pressure of the cooling groove exceeds an upper limit value.

Description

Immersion cooling system and immersion cooling method
Technical Field
The present disclosure relates to an immersion cooling system and an immersion cooling method.
Background
Generally, when an immersion cooling system is used to dissipate heat from electronic equipment, the pressure of the immersion cooling system varies with the load of the electronic equipment. The boiling point of the cooling liquid is increased when the system pressure is too high, which is not favorable for heat dissipation of electronic equipment, and the external air or moisture is easy to permeate when the system pressure is too low. In addition, too high or too low a system pressure may cause structural damage/deformation of the system. Therefore, controlling the pressure of the immersion cooling system is an important issue.
Disclosure of Invention
Accordingly, an objective of the present disclosure is to provide an immersion cooling system capable of effectively controlling the system pressure.
To achieve the above objects, according to some embodiments of the present disclosure, an immersion cooling system includes a cooling bath, a housing, and a first valve. The cooling tank is configured to contain a cooling fluid and an electronic device immersed in the cooling fluid. The housing covers one side of the cooling tank to form a closed space. The first valve has two ports respectively communicated with the closed space and the part of the cooling groove above the cooling liquid, and is configured to be opened when the air pressure of the cooling groove exceeds a first upper limit value.
In one or more embodiments of the present disclosure, the immersion cooling system further includes a pressure sensor and a controller. The pressure sensor is configured to provide a sensing signal indicative of an air pressure of the cooling bath. The controller is configured to determine whether the air pressure of the cooling tank exceeds a first upper limit value based on the sensing signal, and actuate the first valve to open when the air pressure of the cooling tank is determined to exceed the first upper limit value.
In one or more embodiments of the present disclosure, the immersion cooling system further includes a safety valve. The safety valve is provided with a part with two ports respectively communicated with the closed space and the cooling groove position above the cooling liquid, and the safety valve is configured to be automatically opened when the air pressure of the cooling groove exceeds a second upper limit value. The second upper limit value is greater than the first upper limit value.
In one or more embodiments of the present disclosure, the immersion cooling system further includes a condenser and a recovery pipe. The condenser is disposed in the enclosed space and configured to condense vaporized coolant in the enclosed space. The recovery pipeline is connected with the closed space and the cooling tank and is configured to guide cooling liquid generated by condensation of the condenser to flow into the cooling tank.
In one or more embodiments of the present disclosure, the immersion cooling system further comprises a condenser. The condenser is disposed in the cooling tank and configured to perform a condensing operation including condensing the vaporized cooling liquid. When the first valve is closed, the condenser is configured to accelerate or decelerate the condensing operation as the pressure in the cooling tank changes.
In one or more embodiments of the present disclosure, the submerged cooling system further includes an expansion device in communication with a portion of the cooling slot above the cooling fluid. When the first valve is closed, the expansion device is configured to change volume as the air pressure in the cooling tank changes.
In one or more embodiments of the present disclosure, the immersion cooling system further comprises a condenser. The condenser is configured to condense vapor flowing to the expansion device when the pressure of the cooling bath exceeds a threshold. The threshold value is smaller than a first upper limit value.
In one or more embodiments of the present disclosure, the immersion cooling system further comprises a second valve. The second valve has two ports respectively communicated with the cooling tank and the ambient environment outside the cooling tank and the shell, and is configured to be opened in response to the air pressure of the cooling tank being lower than a lower limit value.
According to some embodiments of the present disclosure, an immersion cooling method includes: immersing the electronic device in a cooling liquid in a cooling bath; providing a shell, wherein the shell covers one side of the cooling groove to form a closed space; and opening the first valve to enable the gas to flow from the cooling tank to the closed space in response to the gas pressure of the cooling tank exceeding a first upper limit value.
In one or more embodiments of the present disclosure, the step of opening the first valve comprises: receiving a sensing signal from the pressure sensor, the sensing signal indicating the air pressure of the cooling bath; determining whether the air pressure of the cooling tank exceeds a first upper limit value based on the sensing signal; and if the judgment result is yes, driving the first valve to open.
In one or more embodiments of the present disclosure, the immersion cooling method further comprises: and providing a safety valve, wherein the safety valve is provided with a part with two ports respectively communicated with the closed space and the cooling groove position above the cooling liquid, and the safety valve is configured to be automatically opened when the air pressure of the cooling groove exceeds a second upper limit value, wherein the second upper limit value is greater than the first upper limit value.
In one or more embodiments of the present disclosure, the immersion cooling method further comprises: condensing the vaporized coolant in the enclosed space; and guiding the condensed cooling liquid in the closed space to flow into the cooling tank.
In one or more embodiments of the present disclosure, the immersion cooling method further comprises: the second valve is opened in response to the pressure in the cooling bath being below a lower limit to allow gas to flow from the ambient environment outside the cooling bath and the housing to the cooling bath.
In one or more embodiments of the present disclosure, the immersion cooling method further comprises: before opening the first valve, the air pressure in the cooling tank is controlled by a first condenser located in the cooling tank or an expansion device in communication with the cooling tank.
In one or more embodiments of the present disclosure, the immersion cooling method further comprises: at least a portion of the vapor flowing from the cooling bath to the expansion device is condensed by the second condenser when the pressure in the cooling bath exceeds a threshold. The threshold value is smaller than a first upper limit value.
In summary, in the immersion cooling system of the present disclosure, when the air pressure inside the cooling tank is too high, the air in the cooling tank is exhausted to the closed space on one side of the cooling tank and not directly exhausted to the atmosphere, so that the loss of the vaporized cooling liquid can be avoided. The vaporized cooling liquid collected in the closed space can be recycled to the cooling tank for reuse.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the present disclosure more comprehensible, the following description is given with reference to the accompanying drawings:
FIG. 1 is a schematic diagram illustrating an immersion cooling system according to an embodiment of the present disclosure;
FIG. 2 is a flow chart illustrating an immersion cooling method according to an embodiment of the present disclosure;
FIG. 3 is a flow chart illustrating an immersion cooling method according to another embodiment of the present disclosure.
The reference numbers illustrate:
10 immersion cooling system
11: conveying pipeline
13: filter
15: flow meter
17,77 check valve
20 cooling tank
30 cooling liquid
35 vaporized coolant
41,42,72 condenser
50: shell
56 closed space
61,63 valve
62 safety valve
64 flow control valve
70 recovery system
74 recovery pipeline
80 controller
90 expansion device
100,200 immersion cooling method
101,102,103,104,201,202 Process
E electronic device
PT01, PT02 pressure sensor
Detailed Description
For a more complete and complete description of the present disclosure, reference is made to the accompanying drawings and the various embodiments described below. The components in the drawings are not to scale and are provided merely to illustrate the present disclosure. Numerous implementation details are described below to provide a thorough understanding of the present disclosure, however, it will be appreciated by one skilled in the art that the present disclosure may be practiced without one or more of the implementation details, and thus, such details should not be used to limit the present disclosure.
Referring to FIG. 1, an immersion cooling system 10 includes a cooling bath 20, the cooling bath 20 configured to contain a cooling fluid 30 and one or more electronic devices E immersed in the cooling fluid 30. The electronic device E is, for example, a computer server or a data storage device, and generates heat during operation. The cooling fluid 30 is configured to contact the electronic device E and absorb heat from the electronic device E to assist in cooling the electronic device E. The cooling fluid 30 is a non-conductive liquid, such as a dielectric liquid.
As shown in fig. 1, in some embodiments, the cooling liquid 30 in the cooling tank 20 absorbs heat from the electronic device E to be partially vaporized, and the portion of the cooling tank 20 above the cooling liquid 30 contains the vaporized cooling liquid 35. The immersion cooling system 10 further includes a condenser 41, the condenser 41 being disposed in the cooling bath 20 and configured to perform a condensing operation including condensing the vaporized cooling liquid 35. In the two-phase cooling method, the cooling liquid 30 repeats the process of absorbing heat from the electronic device E to vaporize and being converted back to a liquid state by the condenser 41, thereby assisting the electronic device E in dissipating heat.
Generally, the air pressure inside the cooling bath 20 is positively correlated with the load of the electronic device E. Specifically, when the load of the electronic device E increases (for example, when the amount of calculation of the electronic device E increases), the electronic device E generates a large amount of heat per unit time, and the coolant 30 is vaporized more rapidly, and the air pressure in the cooling tank 20 increases accordingly. On the contrary, when the load of the electronic device E is reduced, the electronic device E generates less heat per unit time, so that the vaporization of the cooling liquid 30 is slowed, and the air pressure of the cooling bath 20 is lowered.
As shown in FIG. 1, the immersion cooling system 10 also includes a housing 50. The housing 50 covers one side of the cooling bath 20 to form an enclosed space 56, and the enclosed space 56 has a fixed volume. In the illustrated embodiment, the housing 50 covers the top of the cooling bath 20. In some embodiments, the housing 50 may comprise metal, glass, acrylic, other suitable materials, or any combination thereof.
As shown in FIG. 1, the immersion cooling system 10 also includes a valve 61. The valve 61 has two ports respectively communicating the closed space 56 and the portion of the cooling bath 20 above the cooling liquid 30 (i.e., the space in the cooling bath 20 having the vaporized cooling liquid 35). The valve 61 is configured to switch between an open state and a closed state. When valve 61 is in the open state, valve 61 allows gas to flow between enclosed space 56 and cooling bath 20. When the valve 61 is in the closed state, the valve 61 prevents gas from flowing between the enclosed space 56 and the cooling bath 20.
As described above, the valve 61 is configured to open in response to the gas pressure in the cooling bath 20 exceeding the first upper limit value, so that the gas flows from the cooling bath 20 to the enclosed space 56, thereby reducing the gas pressure in the cooling bath 20. Thus, the structural damage of the cooling tank 20 can be avoided, and the over-high boiling point of the cooling liquid 30 can be avoided, which leads to poor heat dissipation of the electronic device E. The gas flowing from the cooling bath 20 to the closed space 56 contains the vaporized cooling liquid 35, and may contain other gas, such as air or water vapor, mixed into the vaporized cooling liquid 35.
In the immersion cooling system 10 of the present disclosure, when the air pressure inside the cooling bath 20 is too high, the air in the cooling bath 20 is discharged to the closed space 56 at one side of the cooling bath 20 without being directly discharged to the atmosphere, and thus, the loss of the vaporized cooling liquid 35 can be prevented. The vaporized coolant 35 collected in the enclosed space 56 can be recycled to the cooling bath 20 for reuse.
As shown in FIG. 1, in some embodiments, the immersion cooling system 10 further includes a recovery system 70, the recovery system 70 including a condenser 72 and a recovery line 74. The condenser 72 is disposed in the enclosed space 56 and is configured to condense the vaporized coolant 35 in the enclosed space 56. The recovery line 74 has opposite ends, one end connected to the enclosed space 56 and the other end connected to the cooling bath 20. Recovery line 74 is configured to direct the flow of cooling fluid 30 condensed by condenser 72 into cooling bath 20. In some embodiments, the recycling line 74 includes a check valve 77, and the check valve 77 is configured to prevent backflow of the cooling fluid 30 or the vaporized cooling fluid 35 from the cooling bath 20 to the enclosed space 56.
As shown in FIG. 1, in some embodiments, the immersion cooling system 10 further includes a pressure sensor PT02 and a controller 80. The pressure sensor PT02 is configured to provide a sensing signal indicative of the air pressure of the cooling bath 20. The controller 80 is communicatively connected to the pressure sensor PT02 and configured to receive a sensing signal from the pressure sensor PT 02. The controller 80 is also configured to determine whether the air pressure of the cooling bath 20 exceeds a first upper limit value based on the sensing signal. If the air pressure in the cooling tank 20 exceeds the first upper limit, the controller 80 actuates the valve 61 to open (e.g., the controller 80 may send a control signal to actuate the valve 61 to open). In some embodiments, the valve 61 is a solenoid valve. In some embodiments, the pressure sensor PT02 is configured to measure the air pressure difference between the cooling bath 20 and the enclosed space 56.
As shown in FIG. 1, in some embodiments, the immersion cooling system 10 further includes a relief valve 62. The relief valve 62 has a portion whose both ports communicate with the closed space 56 and the cooling bath 20 above the coolant 30, respectively, and the relief valve 62 is configured to be automatically opened when the air pressure of the cooling bath 20 exceeds a second upper limit value, which is larger than the first upper limit value. In this way, when the gas pressure in the cooling bath 20 further rises, the discharge of the gas in the cooling bath 20 into the enclosed space 56 can be accelerated. In addition, the provision of the relief valve 62 also improves the reliability of the pressure control mechanism of the immersion cooling system 10, and when the valve 61 fails, the gas in the cooling bath 20 can still be discharged to the enclosed space 56 through the relief valve 62. In some embodiments, the valve 61 and relief valve 62 are disposed in a conduit that communicates at one end with the cooling bath 20 and extends into the enclosed space 56.
As shown in FIG. 1, in some embodiments, the immersion cooling system 10 further includes a valve 63, the valve 63 has two ports respectively connected to the cooling bath 20 and the ambient environment outside the cooling bath 20 and the housing 50, and the valve 63 is configured to open in response to the air pressure in the cooling bath 20 being lower than a lower limit. Therefore, when the air pressure inside the cooling tank 20 is too low, the air in the surrounding environment can be introduced into the cooling tank 20, and the air pressure of the cooling tank 20 is increased to avoid the structural damage of the cooling tank 20.
In some embodiments, the valve 63 is a solenoid valve. In some embodiments, the controller 80 is configured to determine whether the air pressure in the cooling tank 20 is lower than the lower limit value based on the sensing signal provided by the pressure sensor PT02, and actuate the valve 63 to open when the air pressure in the cooling tank 20 is lower than the lower limit value (for example, the controller 80 may send a control signal to actuate the valve 63 to open). When the air pressure in the cooling bath 20 is not lower than the lower limit value, the valve 63 is closed.
In some embodiments, when the air pressure of the cooling bath 20 does not exceed the first upper limit value and is not lower than the lower limit value, the immersion cooling system 10 may perform other pressure control means to maintain the air pressure of the cooling bath 20. As shown in fig. 1, in some embodiments, when the valve 61 is closed (i.e., before the valve 61 is opened), the condenser 41 in the cooling tank 20 is configured to accelerate or decelerate the condensing operation as the air pressure in the cooling tank 20 changes, thereby controlling the air pressure in the cooling tank 20. In some embodiments, the controller 80 is configured to control the condenser 41 to accelerate or decelerate the condensing operation based on the sensing signal provided by the pressure sensor PT 02.
Specifically, when the air pressure in the cooling tank 20 rises but does not exceed the first upper limit value, the condenser 41 is configured to accelerate the condensing operation (for example, increase the amount of the vaporized cooling liquid 35 condensed per unit time or increase the heat removed from the cooling tank 20 per unit time) to lower the air pressure in the cooling tank 20. Conversely, when the pressure in the cooling tank 20 drops but is not below the lower limit, the condenser 41 is configured to slow the condensing operation (e.g., reduce the amount of vaporized cooling fluid 35 condensed per unit time or reduce the heat removed from the cooling tank 20 per unit time) to increase the pressure in the cooling tank 20.
As shown in fig. 1, in some embodiments, the condenser 41 is configured to receive the working fluid through the delivery pipe 11, condense the vaporized cooling liquid 35 back to a liquid state by heat exchange with the vaporized cooling liquid 35, and finally discharge the working fluid through the delivery pipe 11. In some embodiments, one or more flow control valves 64 are disposed on the delivery line 11, and the flow control valves 64 can regulate the flow of the working fluid through the condenser 41, thereby speeding up or slowing down the condensation process. In some embodiments, the flow control valve 64 is an electric motor valve. In some embodiments, the controller 80 is configured to operate the flow control valve 64 based on a sensing signal provided by the pressure sensor PT 02.
As shown in fig. 1, in some embodiments, a pressure sensor PT01 is further disposed on the conveying pipeline 11, and the pressure sensor PT01 is configured to measure the pressure of the working fluid. In some embodiments, a filter 13 is disposed on the conveying pipeline 11, and the filter 13 is configured to filter the working fluid before the working fluid flows into the condenser 41 to remove impurities therein. In some embodiments, the transfer line 11 is provided with a flow meter 15, the flow meter 15 being configured to measure the flow rate of the working fluid. In some embodiments, the delivery conduit 11 is provided with a check valve 17, the check valve 17 configured to prevent the working fluid from flowing backwards.
As shown in FIG. 1, in some embodiments, the immersion cooling system 10 further includes an expansion device 90, wherein the expansion device 90 is disposed outside the cooling bath 20 and the housing 50 and communicates with a portion of the cooling bath 20 above the cooling fluid 30. When valve 61 is closed, expansion device 90 is configured to change volume as the air pressure in cooling bath 20 changes. In some embodiments, the expansion device 90 comprises an elastomer, the inner space of which is in communication with the cooling reservoir 20. In response to the increase in air pressure in the cooling bath 20, the elastomer is configured to automatically expand (increase in volume) to decrease the air pressure in the cooling bath 20. In response to a drop in the air pressure in the cooling bath 20, the elastomer is configured to automatically contract (reduce the volume) to increase the air pressure in the cooling bath 20.
As shown in FIG. 1, in some embodiments, the immersion cooling system 10 further includes a condenser 42, the condenser 42 is connected between the cooling bath 20 and the expansion device 90, and the gas passes through the condenser 42 while flowing from the cooling bath 20 to the expansion device 90. The condenser 42 is activated and configured to condense vapor (including vaporized cooling liquid 35) flowing to the expansion device 90 when the pressure of the cooling bath 20 exceeds a threshold value, which is less than a first upper threshold value. With the above configuration, the load of the expansion device 90 can be reduced. In some embodiments, expansion device 90 is connected to cooling bath 20 by a line that passes through condenser 42. After the condenser 42 is started, the cooling liquid 30 condensed at the condenser 42 may flow back to the cooling bath 20 along the line.
In some embodiments, the controller 80 is configured to determine whether the air pressure of the cooling bath 20 exceeds the threshold based on the sensing signal provided by the pressure sensor PT02, and start the condenser 42 when the air pressure of the cooling bath 20 exceeds the threshold. When the air pressure in the cooling bath 20 does not exceed the threshold, the condenser 42 is turned off.
Referring to fig. 2, the immersion cooling method 100 of the present embodiment includes a control flow in response to an increase in air pressure in the cooling bath. Referring also to fig. 1, in step 101, the air pressure in the cooling tank 20 is controlled in such a manner that (i) the expansion device 90 communicating with the cooling tank 20 increases in volume as the air pressure in the cooling tank 20 increases and/or (ii) the condenser 41 in the cooling tank 20 accelerates the condensation operation as the air pressure in the cooling tank 20 increases.
As shown in fig. 1 and 2, if the pressure in the cooling bath 20 rises above a threshold, the immersion cooling method 100 proceeds to step 102, where the condenser 42 between the cooling bath 20 and the expansion device 90 is activated to condense at least a portion of the vapor flowing from the cooling bath 20 to the expansion device 90 in step 102.
As shown in fig. 1 and 2, if the gas pressure in the cooling bath 20 further increases beyond the first upper limit value, the immersion cooling method 100 proceeds to step 103, and in step 103, the valve 61 is opened to allow the gas to flow from the cooling bath 20 to the enclosed space 56 located at one side of the cooling bath 20.
As shown in fig. 1 and 2, if the gas pressure in the cooling bath 20 further rises above the second upper limit value, the immersion cooling method 100 proceeds to step 104, and in step 104, the safety valve 62 is opened to allow the gas to flow from the cooling bath 20 to the enclosed space 56.
Referring to fig. 3, the immersion cooling method 200 of the present embodiment includes a control flow in response to a decrease in the air pressure in the cooling bath. Referring also to fig. 1, in step 201, the air pressure of the cooling tank 20 is controlled by (i) reducing the volume of the expansion device 90 in communication with the cooling tank 20 as the air pressure of the cooling tank 20 decreases and/or (ii) slowing the condensing operation of the condenser 41 in the cooling tank 20 as the air pressure of the cooling tank 20 decreases.
As shown in FIGS. 1 and 3, if the pressure in the cooling bath 20 drops below a lower threshold, the immersion cooling method 200 proceeds to step 202, where the valve 63 is opened to allow gas to flow from the ambient environment outside the cooling bath 20 and the enclosed space 56 to the cooling bath 20 in step 202.
In summary, in the immersion cooling system of the present disclosure, when the air pressure inside the cooling tank is too high, the air in the cooling tank is exhausted to the closed space on one side of the cooling tank and not directly exhausted to the atmosphere, so that the loss of the vaporized cooling liquid can be avoided. The vaporized cooling liquid collected in the closed space can be recycled to the cooling tank for reuse.
Although the present disclosure has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the disclosure, and therefore, the scope of the disclosure should be determined only by the appended claims.

Claims (15)

1. An immersion cooling system, comprising:
a cooling tank configured to contain a cooling liquid and an electronic device immersed in the cooling liquid;
a housing covering one side of the cooling bath to form a closed space; and
a first valve having two ports respectively communicating the enclosed space and the portion of the cooling tank above the cooling liquid, the first valve being configured to open in response to the pressure of the cooling tank exceeding a first upper limit.
2. The immersion cooling system of claim 1, further comprising a pressure sensor configured to provide a sensing signal indicative of the air pressure of the cooling bath, and a controller configured to determine whether the air pressure of the cooling bath exceeds the first upper limit based on the sensing signal and to actuate the first valve to open when it is determined that the air pressure of the cooling bath exceeds the first upper limit.
3. The immersion cooling system of claim 2, further comprising a relief valve having two ports communicating with the enclosed space and a portion of the cooling slot above the cooling fluid, respectively, and configured to automatically open when the air pressure of the cooling slot exceeds a second upper limit value, wherein the second upper limit value is greater than the first upper limit value.
4. The immersion cooling system according to claim 1, further comprising a condenser disposed in the enclosed space and configured to condense the vaporized cooling liquid in the enclosed space, and a recovery line connecting the enclosed space and the cooling bath and configured to guide the cooling liquid resulting from condensation of the condenser to flow into the cooling bath.
5. The immersion cooling system of claim 1, further comprising a condenser disposed in the cooling bath and configured to perform a condensing operation including condensing the vaporized cooling liquid, wherein when the first valve is closed, the condenser is configured to accelerate or decelerate the condensing operation as the air pressure of the cooling bath changes.
6. The immersion cooling system of claim 1, further comprising an expansion device in communication with a portion of the cooling bath above the cooling liquid, wherein the expansion device is configured to change volume as the air pressure of the cooling bath changes when the first valve is closed.
7. The immersion cooling system of claim 6, further comprising a condenser, wherein the condenser is configured to condense vapor flowing to the expansion device when the gas pressure of the cooling bath exceeds a threshold, wherein the threshold is less than the first upper limit.
8. The immersion cooling system of claim 1, further comprising a second valve having two ports communicating with the cooling bath and an ambient environment outside the cooling bath and the housing, respectively, and configured to open in response to the air pressure of the cooling bath being below a lower limit.
9. An immersion cooling method, comprising:
immersing the electronic device in a cooling liquid in a cooling bath;
providing a housing covering one side of the cooling bath to form a closed space; and
and opening a first valve to enable gas to flow from the cooling tank to the closed space in response to the gas pressure of the cooling tank exceeding a first upper limit value.
10. The immersion cooling method of claim 9, wherein the step of opening the first valve includes:
receiving a sensing signal from a pressure sensor, the sensing signal indicating the air pressure of the cooling bath;
determining whether the air pressure of the cooling bath exceeds the first upper limit value based on the sensing signal; and
if the judgment result is yes, the first valve is driven to be opened.
11. The immersion cooling method of claim 10, further comprising:
providing a safety valve, wherein the safety valve is provided with two ports respectively communicated with the closed space and the part of the cooling groove above the cooling liquid, and the safety valve is configured to be automatically opened when the air pressure of the cooling groove exceeds a second upper limit value, and the second upper limit value is larger than the first upper limit value.
12. The immersion cooling method of claim 9, further comprising:
condensing the vaporized cooling liquid in the enclosed space; and
and guiding the condensed coolant in the closed space to flow into the cooling tank.
13. The immersion cooling method of claim 9, further comprising:
opening a second valve in response to the gas pressure in the cooling bath being below a lower threshold to allow gas to flow from an ambient environment external to the cooling bath and the housing to the cooling bath.
14. The immersion cooling method of claim 9, further comprising:
controlling the pressure of the cooling tank with a first condenser located in the cooling tank or an expansion device in communication with the cooling tank prior to opening the first valve.
15. The immersion cooling method of claim 14, further comprising:
condensing at least a portion of the vapor flowing from the cooling tank to the expansion device with a second condenser when the gas pressure of the cooling tank exceeds a threshold, wherein the threshold is less than the first upper limit.
CN202210147926.8A 2021-07-21 2022-02-17 Immersion cooling system and immersion cooling method Pending CN115696847A (en)

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EP22179418.3A EP4124192A1 (en) 2021-07-21 2022-06-16 Immersion cooling system and immersion cooling method

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