CN115695964A

CN115695964A - Electronic circuit unit and imaging unit

Info

Publication number: CN115695964A
Application number: CN202211187585.3A
Authority: CN
Inventors: 童毅
Original assignee: Changzhou Lianying Zhirong Medical Technology Co ltd
Current assignee: Changzhou Lianying Zhirong Medical Technology Co ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-02-03

Abstract

The invention provides an electronic circuit unit and a camera unit, wherein the electronic circuit unit comprises: the front surface of the circuit substrate is used for arranging a camera sensor, at least one first groove is formed in the position, close to the front surface, of the side surface of the circuit substrate, and at least one second groove is formed in the position, close to the back surface of the circuit substrate, of the side surface of the circuit substrate; the first electronic component is arranged in the corresponding first groove; and the second electronic component is arranged in the corresponding second groove. Therefore, the distance between the electronic component and the camera sensor can be greatly reduced, the image quality of the acquired image is improved, the length of the hard part applied to the camera unit is greatly shortened, and the pain of the detected person is relieved.

Description

Electronic circuit unit and imaging unit

Technical Field

The present invention relates to the technical field of electronic circuit devices, and in particular, to an electronic circuit unit and a camera unit.

Background

In the related art, the distance between the electronic component in the electronic circuit unit and the image sensor is long, which results in an increase in impedance, noise is easily generated during high-speed signal transmission, the image sensor cannot be stably driven, the image quality of the obtained image is poor, and the hard portion is long due to the long arrangement position of the electronic component in the electronic circuit unit, which increases the pain of the subject.

Disclosure of Invention

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic circuit unit that can greatly reduce the distance between an electronic component and a camera sensor, thereby improving the quality of an image obtained, greatly reducing the length of a hard portion when applied to a camera unit, and alleviating the pain of a subject.

The technical scheme adopted by the invention is as follows:

an electronic circuit unit comprising: the front surface of the circuit substrate is used for arranging a camera sensor, at least one first groove is formed in the position, close to the front surface, of the side surface of the circuit substrate, and at least one second groove is formed in the position, close to the back surface of the circuit substrate, of the side surface of the circuit substrate; the first electronic component is arranged in the corresponding first groove; and the second electronic component is arranged in the corresponding second groove.

In an embodiment of the invention, a first electrode is disposed in the first groove, and the first electronic component is soldered on the first electrode. In an embodiment of the invention, a second electrode is disposed in the second groove, and the second electronic component is soldered to the second electrode.

In an embodiment of the present invention, the first electronic component is a passive component in an image pickup driving circuit.

In an embodiment of the present invention, the second electronic component is an active device in an image pickup driving circuit.

In an embodiment of the present invention, a plurality of third grooves are further formed on a side surface of the circuit substrate, a plurality of positioning portions are formed on a back surface of the circuit substrate, the plurality of positioning portions are correspondingly communicated with the plurality of third grooves, and the electronic circuit unit further includes: the first cable is arranged corresponding to the third groove, penetrates through the corresponding positioning part and is arranged in the corresponding third groove at one end.

In an embodiment of the present invention, a third electrode is disposed in the third groove, and one end of the first cable is soldered to the third electrode.

In an embodiment of the invention, the third grooves are circumferentially arranged along a side surface of the circuit substrate.

In an embodiment of the invention, the plurality of third grooves are mutually independent grooves formed in a side plane of the circuit substrate.

In an embodiment of the invention, the third grooves are grooves formed twice on the basis of the strip-shaped grooves on the side surface of the circuit substrate.

In one embodiment of the present invention, the positioning portion is not communicated with and is internally communicated with the side portion of the corresponding third groove.

In one embodiment of the present invention, the positioning portion communicates with both a side portion and an inside portion of the corresponding third groove.

In one embodiment of the invention, the electronic circuit unit further comprises: one or more second cables, wherein one end of each second cable is communicated with one end of the corresponding first cable.

A fourth electrode is arranged in the third groove, one end of the second cable is welded on the fourth electrode, and the fourth electrode is communicated with the third electrode arranged in the third groove.

An electronic circuit unit comprising: the front surface of the circuit substrate is used for arranging a camera sensor, and the side surface of the circuit substrate is provided with at least one first groove; and the first electronic component is arranged in the corresponding first groove.

An image pickup unit, characterized by comprising: the electronic circuit unit and the image sensor described above.

The invention has the beneficial effects that:

the invention can reduce the distance between the electronic component and the camera unit, thereby not only improving the image quality of the acquired image, but also greatly shortening the length of the hard part when the camera unit is applied, and relieving the pain of the detected person.

Drawings

FIG. 1 is a schematic structural diagram of an electronic circuit unit according to an embodiment of the present invention;

FIG. 2a is a cross-sectional view of an electronic circuit unit with electronic components soldered to the bottom of a recess according to one embodiment of the present invention;

FIG. 2b is a cross-sectional view of an electronic circuit unit with electronic components soldered to the sides of a recess according to one embodiment of the present invention;

FIG. 3a is a schematic view of a third recess configured as a polygonal shaped cavity according to an embodiment of the present invention;

FIG. 3b is a schematic view of a third recess configured as a circular cavity in accordance with an embodiment of the present invention;

FIG. 4a is a schematic diagram of an embodiment of the present invention in which the third recess is a hole and the third electrode is a planar connection electrode;

FIG. 4b is a schematic diagram of one embodiment of the present invention where the third recess is a cavity and the third electrode is a circular groove shaped connecting electrode;

FIG. 5a is a schematic diagram of an embodiment of the present invention in which the third recess is open-shaped and the third electrode in the third recess is a planar connection electrode;

FIG. 5b is a schematic diagram of the third groove being open-ended and the third electrode in the third groove being a convex polygon connecting electrode according to an embodiment of the invention;

FIG. 5c is a schematic diagram of an embodiment of the invention in which the third groove is open-ended and the third electrode in the third groove is a recessed quadrilateral connecting electrode;

FIG. 5d is a schematic diagram of an embodiment of the present invention where the third groove is open-ended and the third electrode in the third groove is a concave circular groove-shaped connecting electrode;

fig. 6 is a schematic view illustrating that one ends of the second cable and the first cable are integrally connected to each other and then inserted into the positioning portion to be welded and communicated through the third groove according to an embodiment of the present invention.

FIG. 7 is a schematic diagram of an electronic circuit unit according to an embodiment of the invention;

FIG. 8a is a cross-sectional view of an electronic circuit unit in which electronic components according to another embodiment of the present invention are soldered to the bottom of a groove;

FIG. 8b is a cross-sectional view of an electronic circuit unit in which an electronic component according to another embodiment of the present invention is soldered to a side of a recess;

FIG. 9a is a schematic view of a third recess configured as a polygonal shaped cavity according to another embodiment of the present invention;

FIG. 9b is a schematic view of a third recess configured as a circular cavity in accordance with another embodiment of the present invention;

FIG. 10a is a schematic view of another embodiment of the present invention, in which the third recess is a hole and the third electrode is a planar connection electrode;

FIG. 10b is a schematic view of another embodiment of the present invention where the third recess is a cavity and the third electrode is a circular groove-shaped connecting electrode;

FIG. 11a is a schematic diagram of a third recess having an open shape and a planar connection electrode in the third recess according to another embodiment of the present invention;

FIG. 11b is a schematic diagram of a third recess having an open shape and a third electrode in the third recess being a convex polygon connecting electrode according to another embodiment of the present invention;

FIG. 11c is a schematic diagram of a third recess having an open shape and a recessed quadrilateral connecting electrode in the third recess according to another embodiment of the present invention;

FIG. 11d is a schematic view of a third groove being open-ended and a third electrode in the third groove being a connecting electrode in the shape of a concave circular groove according to another embodiment of the present invention;

fig. 12 is a schematic structural diagram of an image pickup unit according to an embodiment of the present invention;

fig. 13 is a schematic configuration diagram of an endoscope according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the related art, the electronic circuit unit is formed of two circuit boards, and the axial length dimension is increased, so that the hard portion is relatively long, the tip of the endoscope is not flexible during the internal operation, and the pain of the patient can be increased by the long hard portion when the endoscope is inserted into the human body. Moreover, when the electronic component is mounted on the back surface of one circuit substrate and is far away from the position of the image sensor, the impedance of the lead is increased, and noise is easily generated during high-speed signal transmission, and the image sensor cannot be stably driven, so that the image quality of the acquired image is poor.

Therefore, the invention provides an electronic circuit unit, which adopts a circuit substrate, and the side surface of the circuit substrate close to an image pickup sensor is provided with a concave part for accommodating electronic components required by the action close to the image pickup element, thereby not only improving the image quality of the acquired image, but also greatly shortening the length of a hard part of the endoscope head structure, increasing the flexibility of bending the front end of the endoscope during operation, relieving the pain of a detected person, and simultaneously simplifying the manufacturing process and the manufacturing cost.

Fig. 1 is a schematic structural diagram of an electronic circuit unit according to an embodiment of the present invention.

Specifically, as shown in fig. 1, the electronic circuit unit of the embodiment of the present invention may include: a circuit substrate 100, a first electronic component 200, and a second electronic component 300.

The front surface of the circuit substrate 100 is used for arranging the camera sensor 21, the side surface of the circuit substrate 100 adjacent to the front surface is provided with at least one first groove 110, the side surface of the circuit substrate 100 adjacent to the back surface of the circuit substrate 100 is provided with at least one second groove 120, wherein the number of the first grooves 110 and the number of the second grooves 120 can be calibrated according to actual requirements, of course, the number of the first grooves 110 and the number of the second grooves 120 can be larger than the actual requirements for standby, and the specific number is not limited; the first electronic components 200 are disposed in the corresponding first grooves 110, wherein as a possible implementation manner, one first electronic component 200 may be disposed in one first groove 110, and as another possible implementation manner, a plurality of first electronic components 200 may also be disposed in one first groove 110, which may be specifically set according to actual application requirements; the second electronic components 300 are disposed in the corresponding second grooves 120, wherein as a possible implementation manner, one second electronic component 300 may be disposed in one second groove 120, and as another possible implementation manner, a plurality of second electronic components 300 may also be disposed in one second groove 120, which may be specifically set according to actual application requirements. As shown in fig. 1, the center of the circuit board 100 is set as the origin of coordinates, the surface in the positive x-axis direction is the front surface, the surface in the negative x-axis direction is the back surface, and the surfaces in the positive y-axis direction and the negative y-axis direction and the positive z-axis direction and the negative z-axis direction are the side surfaces.

Specifically, as shown in fig. 2, a light receiving portion is formed on the front surface of the image sensor 21, a plurality of protruding portions 22 are provided on the back surface of the image sensor 21 (wherein one surface of the image sensor 21 close to the front surface of the circuit board 100 is a back surface, and one surface of the image sensor 21 away from the front surface of the circuit board 100 is a front surface), an image sensor connection electrode 23 is provided corresponding to each protruding portion 22, the back surface of the image sensor 21 is soldered to the front surface of the circuit board 100 via the protruding portions 22 and the image sensor connection electrode 23, the front surface of the circuit board 100 is in the projection plane of the image sensor 21, and a sealing resin 24 is filled between the image sensor 21 and the circuit board 100. Here, the projection of the first recess 110 on the front surface of the circuit substrate 100 does not overlap with the position of the image sensor connection electrode 23.

In an embodiment of the invention, as shown in fig. 2, a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered on the first electrode 111. Wherein the image sensor connection electrode 23 can be connected to the first electrode 111 through the through hole 25.

In an embodiment of the invention, as shown in fig. 2, a second electrode 121 is disposed in the second groove 120, and the second electronic component 300 is soldered on the second electrode 121. Wherein the image sensor connection electrode 23 can be connected to the second electrode 121 through the through hole 25.

Specifically, the first electrode 111 may be disposed on a connecting wall of the through hole 25 and the first groove 110, wherein the connecting wall may be disposed at various positions of the first groove 110 according to actual needs, as a possible embodiment, as shown in fig. 2a, the connecting wall is disposed on a bottom surface of the first groove 110, that is, the first electronic component 200 may be soldered on the bottom surface of the first groove 110. As shown in fig. 2b, the connecting wall may be disposed at a side of the first recess 110, i.e. the first electronic component 200 may be soldered at a side of the first recess 110. The second electrode 121 may be disposed on a connecting wall of the through hole 25 and the second groove 120, wherein the connecting wall may be disposed at various positions of the second groove 120 according to actual needs, as a possible embodiment, as shown in fig. 2a, the connecting wall is disposed on a bottom surface of the second groove 120, that is, the second electronic component 300 may be soldered on the bottom surface of the second groove 120. As shown in fig. 2b, the connecting wall is disposed at a side of the second recess 120, i.e. the second electronic component 300 may be soldered at a side of the second recess 120.

The first electronic component 200 may be a passive component in the image pickup driving circuit, and the second electronic component 300 may be an active component in the image pickup driving circuit. That is, as one possible embodiment, passive devices in the image pickup drive circuit, such as a capacitor, a resistor, an inductor, and the like, may be housed in the first recess 110, and active devices in the image pickup drive circuit, such as a driver IC, a wave shaping circuit IC, a quartz vibrator, and the like, may be housed in the second recess 120, that is, components that need to be close to the image pickup sensor may be housed in the first recess 110, and components that need to be close to the cable may be housed in the second recess 120. In an embodiment of the present invention, the type of the passive device received in the first recess 110 may be further selected according to the operating characteristics of the passive device, such as the operating temperature, for example, during the operation of the resistor, the operating temperature is high, which may also affect the high-speed signal transmission, so that the image pickup device may not be stably driven, and the obtained image quality is poor, and therefore, the type of the passive device does not need to be received in the first recess 110, that is, in an embodiment of the present invention, the passive device that does not generate heat may be received in the first recess 110. As another possible embodiment, passive components in the image pickup drive circuit, such as a capacitor and the like, may be housed in the first recess 110, and active components in the image pickup drive circuit, such as a driver IC, a waveform shaping circuit IC, a quartz vibrator and the like, may be housed in the second recess 120. In one embodiment of the present invention, the type of passive components received in the first groove 110 may also be selected according to the operating characteristics of the passive components, such as the operating temperature.

Thus, the present invention employs a circuit board, the overall thickness of which is controlled within the projection area of the image pickup device, and electronic components required for the operation of the image pickup device are soldered to the side surface of the circuit board, thereby realizing the mounting of the electronic components at the closest position to the image pickup device, reducing the overall size, and enabling the miniaturization of the endoscope head structure. The diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, the front end of the endoscope is more flexibly bent when the endoscope is used for the operation in the body of a detected person, and the pain of a patient can be further reduced when the endoscope is inserted into the body. In addition, when the camera sensor is driven at a high speed and is in signal transmission, the first electronic component is closer to the camera sensor, so that the impedance is reduced, the noise is reduced, and an image with high image quality can be obtained.

In an embodiment of the present invention, as shown in fig. 1 and 2, the side surface of the circuit substrate 100 is further opened with a plurality of third grooves 130, the back surface of the circuit substrate is opened with a plurality of positioning portions 140, the plurality of positioning portions 140 are correspondingly communicated with the plurality of third grooves 130, and the electronic circuit unit further includes: the first cable 400, the first cable 400 and the third groove 130 are correspondingly arranged, the first cable 400 passes through the corresponding positioning part 140, and one end of the first cable 400 is arranged in the corresponding third groove 130.

Wherein, a third electrode 131 is disposed in the third groove 130, and one end of the first cable 400 is welded on the third electrode 131.

Specifically, the circuit board 100 may have a plurality of positioning portions 140 on the back surface thereof, and a plurality of third grooves 130 on the side surface of the circuit board 100. One end of the first cable 400 may be welded to the third electrode 131 in the third groove 130 after passing through the corresponding positioning part 140, wherein the positioning part 140 may be a positioning hole, and the positioning part 140 is used for positioning the first cable 400 passing through. Therefore, the corresponding first cables 400 which penetrate through the positioning part 140 are positioned, so that each cable is independent of the other, the short circuit of the welding point can be effectively avoided, and the lines are orderly and easily distinguished and checked.

The other end of the first cable 400 is connected to an external control system, the external control system is configured to supply power to the image sensor 21 and provide a pulse driving signal through the first cable 400, and the external control system is further configured to communicate with the image sensor 21 through the first cable 400 and receive a transmission image sent by the image sensor 21.

In one embodiment of the present invention, the plurality of third grooves 130 may be arranged circumferentially along the side surface of the circuit substrate 100.

It is understood that the plurality of third grooves 130 may be arranged along the side surface of the circuit substrate 100 in two ways.

In an embodiment of the invention, the plurality of third grooves 130 are independent grooves formed on the side surface plane of the circuit substrate 100.

Specifically, a plurality of independent grooves may be formed in the side surface plane of the circuit board 100, that is, the plurality of third grooves 130 may be holes. In an embodiment of the present invention, the shape of the third grooves 130 may be set according to practical applications. As a possible embodiment, as shown in fig. 3a, a plurality of third grooves 130 may be provided as polygonal cavities; as another possible embodiment, as shown in fig. 3b, a plurality of third grooves 130 may be provided as circular holes. In another embodiment of the present invention, when the third groove 130 is a cavity, the shape of the third electrode 131 disposed in the third groove 130 may also be set. As a possible implementation, as shown in fig. 4a, the third electrode 131 may be a planar connection electrode (coplanar with the stepped surface of the circuit board); as another possible embodiment, as shown in fig. 4b, the third electrode 131 may be a circular groove-shaped connection electrode (which is lower than the stepped surface of the wiring board). As other possible embodiments, the third electrode 131 disposed in the third groove 130 may have other forms, for example, a convex polygonal connecting electrode (the connecting electrode is higher than the step surface of the circuit board), or a concave quadrangular connecting electrode (the connecting electrode is lower than the step surface of the circuit board). Therefore, the plurality of third grooves 130 are arranged into a plurality of mutually independent grooves, so that the situation of short circuit of welding points can be effectively avoided, and lines can be neatly and easily distinguished and checked.

In another embodiment of the present invention, the plurality of third grooves 130 are grooves that are formed twice on the circuit substrate side surface in addition to the annular grooves.

Specifically, a strip-shaped groove may be formed on the side surface of the circuit substrate 100, wherein the strip-shaped groove penetrates through four surfaces of the side surface of the circuit substrate 100 to form a rectangular annular groove, and then, the strip-shaped groove is formed twice on the basis of the rectangular annular groove to obtain a plurality of third grooves 130, that is, the third grooves 130 are open. Wherein, the shape of the third electrode 131 disposed in the third groove 130 can be set according to practical application. As a possible implementation, as shown in fig. 5a, the third electrode 131 in the third recess 130 may be a planar connection electrode (coplanar with the stepped surface of the circuit board); as another possible embodiment, as shown in fig. 5b, the third electrode 131 in the third groove 130 may be a convex polygonal connecting electrode (the connecting electrode is higher than the stepped surface of the circuit board); as still another possible implementation, as shown in fig. 5c, the third electrode 131 in the third groove 130 may be a concave quadrilateral connecting electrode (the connecting electrode is lower than the stepped surface of the circuit board); as still another possible implementation, as shown in fig. 5d, the third electrode 131 in the third recess 130 may be a concave circular groove-shaped connection electrode (the connection electrode is lower than the stepped surface of the circuit board).

The third groove 130 and the third electrode 131 disposed in the third groove 130 are cooperatively disposed and are set according to actual requirements.

It should be noted that, based on different arrangement manners of the plurality of third grooves 130, the communication manners of the plurality of positioning portions 140 and the plurality of third grooves 130 may also be correspondingly arranged.

In one embodiment of the present invention, the position fixing part 140 is not communicated with the side part of the corresponding third groove 130, and is communicated with the inside.

Specifically, as a possible implementation manner, the plurality of third grooves 130 are independent grooves formed in the side surface plane of the circuit substrate, that is, the plurality of third grooves 130 are cavities, and the positioning holes 140 are not communicated with the side portions of the corresponding third grooves 130, that is, the positioning holes are in a through hole shape; as another possible embodiment, the plurality of third grooves 130 are grooves that are formed twice on the basis of the strip-shaped grooves on the side surface of the circuit substrate, that is, the plurality of third grooves 130 are open, and the positioning holes 140 are not communicated with the side portions of the corresponding third grooves 130, and are internally communicated, that is, the positioning holes 140 are through-hole shaped.

In another embodiment of the present invention, the positioning holes 140 communicate with both sides and the inside of the corresponding third grooves 130.

Specifically, as a possible implementation manner, the plurality of third grooves 130 are independent grooves formed on the side surface plane of the circuit substrate, that is, the plurality of third grooves 130 are holes, the positioning holes 140 are communicated with the side portions and the inside portions of the corresponding third grooves 130, that is, the positioning holes 140 are in an open shape; as another possible embodiment, the plurality of third grooves 130 are grooves that are formed twice on the basis of the strip-shaped grooves on the side surface of the circuit substrate, that is, the plurality of third grooves 130 are open-shaped, and the positioning holes 140 communicate with the side portions and the inside of the corresponding third grooves 130, that is, the positioning holes are open-shaped.

In one embodiment of the present invention, as shown in fig. 1, the electronic circuit unit may further include one or more second cables 500, and one end of each of the second cables 500 is communicated with one end of the corresponding first cable 400.

Specifically, as shown in fig. 1, the positioning grooves 150 are further formed on the side surface of the circuit substrate 100, wherein as a possible embodiment, the number of the positioning grooves 150 is the same as the number of the second cables 500, and the positioning grooves 150 are arranged in a one-to-one correspondence manner, and as another possible embodiment, the number of the positioning grooves 150 may be greater than the number of the second cables 500 for standby, and the positioning grooves can be directly called when the number of the second cables 500 is increased. One end of the second cable 500 is positioned through the positioning groove 150 and then welded to the third electrode 131, thereby being connected to one end of the corresponding first cable 400. Wherein, one end of the second cable 500 is arranged corresponding to one end of the first cable 400; the other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output an electrical signal. From this, fix a position the corresponding second cable 500 that passes through constant head tank 150 for every cable is independent each other, can avoid appearing the condition of welding point short circuit effectively, and neat easily distinguishs and the investigation circuit.

In an embodiment of the present invention, a fourth electrode (not shown in the drawings) is disposed in the third groove, one end of the second cable is soldered to the fourth electrode, and the fourth electrode is in communication with the third electrode disposed in the third groove.

Specifically, as a possible embodiment, two rows of third grooves may be formed on one side surface of the circuit substrate 100 where the positioning groove is formed, wherein the third electrode is disposed in one row of the third grooves, and the fourth electrode is disposed in the other row of the third grooves. The constant head tank of circuit substrate side corresponds the setting with second cable 500, and the one end of second cable 500 is earlier through the constant head tank location, then welds on the fourth electrode again, and the fourth electrode passes through the through-hole with the third electrode and links to each other to link to each other with the one end of corresponding first cable 400. As shown in fig. 6, one ends of the second cable 500 and the first cable 400 may be integrally connected to each other and then inserted into the positioning hole 140 to be in welding communication through the third groove 130.

It should be noted that, according to actual requirements, the positioning groove 150 may be configured in different shapes, wherein the positioning groove 150 may be configured in a circular groove shape.

In summary, according to the electronic circuit unit of the embodiment of the invention, the first groove is formed on the side surface of the circuit substrate near the front surface to accommodate the electronic component, so that the distance between the electronic component and the image sensor is reduced, the image quality of the acquired image is improved, the length of the hard part of the endoscope head structure is greatly shortened, and the pain of the subject is relieved.

It is understood that, in addition to the first recess 110 and the second recess 120 being provided on the side of the circuit substrate 100 to receive the first electronic component 200 and the second electronic component 300, respectively, in the above manner, the first recess 110 may be provided only on the side of the circuit substrate 100.

Correspondingly, the invention also provides an electronic circuit unit.

Specifically, as shown in fig. 7, the electronic circuit unit of the embodiment of the present invention may include: a circuit substrate 100 and a first electronic component 200.

The front surface of the circuit substrate 100 is used for arranging the camera sensor 21, and the side surface of the circuit substrate 100 is provided with at least one first groove 110, wherein the number of the first grooves 110 can be calibrated according to actual requirements, of course, more first grooves 110 can be arranged for standby than actual requirements, and the specific number is not limited; the first electronic component 200 is disposed in the corresponding first groove 110. As another possible implementation, a plurality of first electronic components 200 may also be disposed in one first groove 110, and specifically, the first electronic components 200 may be disposed according to actual application requirements. As shown in fig. 7, the center of the circuit board 100 is the origin of coordinates, the surface in the positive x-axis direction is the front surface, the surface in the negative x-axis direction is the back surface, and the surfaces in the positive y-axis direction and the negative y-axis direction and the positive z-axis direction and the negative z-axis direction are the side surfaces.

Specifically, as shown in fig. 8, a light receiving portion is formed on the front surface of the image sensor 21, a plurality of protruding portions 22 are provided on the back surface of the image sensor 21 (wherein one surface of the image sensor 21 close to the front surface of the circuit board 100 is a back surface, and one surface of the image sensor 21 away from the front surface of the circuit board 100 is a front surface), an image sensor connection electrode 23 is provided corresponding to each protruding portion 22, the back surface of the image sensor 21 is soldered to the front surface of the circuit board 100 via the protruding portions 22 and the image sensor connection electrode 23, the front surface of the circuit board 100 is in the projection plane of the image sensor 21, and a sealing resin 24 is filled between the image sensor 21 and the circuit board 100. Here, the projection of the first recess 110 on the front surface of the circuit substrate 100 does not overlap with the position of the image sensor connection electrode 23.

In an embodiment of the invention, as shown in fig. 8, a first electrode 111 is disposed in the first groove 110, and the first electronic component 200 is soldered on the first electrode 111. Wherein the image sensor connection electrode 23 can be connected to the first electrode 111 through the through hole 25.

Specifically, the first electrode 111 may be disposed on a connecting wall of the through hole 25 and the first groove 110, wherein the connecting wall may be disposed at various positions of the first groove 110 according to actual needs, as a possible embodiment, as shown in fig. 8a, the connecting wall is disposed on a bottom surface of the first groove 110, that is, the first electronic component 200 may be soldered on the bottom surface of the first groove 110. As shown in fig. 8b, the connecting wall is disposed at a side of the first recess 110, i.e. the first electronic component 200 may be soldered at a side of the first recess 110.

The first electronic component 200 may be a passive component in the image pickup driving circuit. That is, as a possible implementation manner, passive devices in the image pickup driving circuit, such as a capacitor, a resistor, an inductor, and the like, may be accommodated in the first recess 110, in an embodiment of the present invention, the first recesses 110 at different positions may be selected to be accommodated according to an operating characteristic of the passive device, such as an operating temperature, for example, during an operation of the resistor, the operating temperature is high, which may also affect high-speed signal transmission, thereby causing an inability to stably drive the image pickup element, and an obtained image quality is poor, therefore, the passive device of this type needs to be accommodated in the first recess 110 formed at a side surface of the circuit substrate 100 and near the back surface of the circuit substrate 100, that is, in an embodiment of the present invention, the passive device that does not generate heat may be accommodated in the first recess 110 formed at a side surface of the circuit substrate 100 and near the back surface of the circuit substrate 100, and the passive device that generates heat may be accommodated in the first recess 110 formed at a side surface of the circuit substrate 100 and near the back surface. It should be noted that the active device may also be accommodated in the first groove 110 formed on the side surface of the circuit substrate 100 adjacent to the back surface.

In the embodiment of the present invention, the arrangement of the other connecting devices and the arrangement of the components are the same except that the one row of the recesses for accommodating the electronic components is provided on the side surface of the circuit board 100, which is different from the two rows of the recesses for accommodating the electronic components provided on the side surface of the circuit board 100 in the above-described embodiment.

Specifically, in an embodiment of the present invention, as shown in fig. 7 and 8, the side surface of the circuit substrate 100 is further opened with a plurality of third grooves 130, the back surface of the circuit substrate is opened with a plurality of positioning portions 140, the plurality of positioning portions 140 are correspondingly communicated with the plurality of third grooves 130, and the electronic circuit unit further includes: the first cable 400, the first cable 400 and the third groove 130 are correspondingly arranged, the first cable 400 passes through the corresponding positioning part 140, and one end of the first cable 400 is arranged in the corresponding third groove 130.

It is understood that the plurality of third grooves 130 may be arranged circumferentially along the side surface of the circuit substrate 100 in two ways.

Specifically, a plurality of independent grooves, that is, the third grooves 130 may be holes, may be opened in the side surface plane of the circuit board 100. In an embodiment of the present invention, the shape of the third grooves 130 may be set according to practical applications. As a possible embodiment, as shown in fig. 9a, a plurality of third grooves 130 may be provided as polygonal cavities; as another possible embodiment, as shown in fig. 9b, a plurality of third recesses 130 may be provided as circular holes. In another embodiment of the present invention, when the third groove 130 is a cavity, the shape of the third electrode 131 disposed in the third groove 130 may also be set. As a possible implementation, as shown in fig. 10a, the third electrode 131 may be a planar connection electrode (coplanar with the stepped surface of the circuit board); as another possible embodiment, as shown in fig. 10b, the third electrode 131 may be a circular groove-shaped connection electrode (which is lower than the stepped surface of the wiring board). As other possible embodiments, the third electrode 131 disposed in the third groove 130 may have other forms, for example, a convex polygonal connecting electrode (the connecting electrode is higher than the step surface of the circuit board), or a concave quadrangular connecting electrode (the connecting electrode is lower than the step surface of the circuit board). Therefore, the plurality of third grooves 130 are arranged into a plurality of mutually independent grooves, so that the situation of short circuit of welding points can be effectively avoided, and lines can be neatly and easily distinguished and checked.

Specifically, a strip-shaped groove may be formed on the side surface of the circuit substrate 100, wherein the strip-shaped groove penetrates through four surfaces of the side surface of the circuit substrate 100 to form a rectangular annular groove, and then, the strip-shaped groove is formed twice on the basis of the rectangular annular groove to obtain a plurality of third grooves 130, that is, the third grooves 130 are open. Wherein, the shape of the third electrode 131 disposed in the third groove 130 can be set according to practical application. As a possible implementation, as shown in fig. 11a, the third electrode 131 in the third recess 130 may be a planar connecting electrode (coplanar with the stepped surface of the circuit board); as another possible implementation, as shown in fig. 11b, the third electrode 131 in the third groove 130 may be an upward convex polygonal connecting electrode (the connecting electrode is higher than the stepped surface of the circuit board); as still another possible implementation, as shown in fig. 11c, the third electrode 131 in the third groove 130 may be a concave quadrilateral connecting electrode (the connecting electrode is lower than the stepped surface of the circuit board); as still another possible implementation, as shown in fig. 11d, the third electrode 131 in the third recess 130 may be a concave circular groove-shaped connection electrode (the connection electrode is lower than the stepped surface of the circuit board).

Specifically, as a possible implementation manner, the plurality of third grooves 130 are independent grooves formed in the side plane of the circuit substrate, that is, the plurality of third grooves 130 are cavities, and the positioning holes 140 communicate with the side portions and the inside of the corresponding third grooves 130, that is, the positioning holes 140 are in the shape of openings; as another possible embodiment, the third grooves 130 are grooves formed twice on the basis of the strip-shaped grooves on the side surface of the circuit board, that is, the third grooves 130 are open, and the positioning holes 140 are communicated with the side portions and the inner portions of the corresponding third grooves 130, that is, the positioning holes are open.

In one embodiment of the present invention, as shown in fig. 7, the electronic circuit unit may further include one or more second cables 500, and one end of each of the second cables 500 is communicated with one end of the corresponding first cable 400.

Specifically, as shown in fig. 7, the positioning grooves 150 are further formed on the side surface of the circuit substrate 100, wherein as a possible embodiment, the number of the positioning grooves 150 is the same as the number of the second cables 500, and the positioning grooves 150 are arranged in a one-to-one correspondence manner, and as another possible embodiment, the number of the positioning grooves 150 may be greater than the number of the second cables 500 for standby, and the positioning grooves can be directly called when the number of the second cables 500 is increased. One end of the second cable 500 is positioned through the positioning groove 150 and then welded to the third electrode 131, thereby being connected to one end of the corresponding first cable 400. Wherein, one end of the second cable 500 is arranged corresponding to one end of the first cable 400; the other end of the second cable 500 is connected to the lens driver, and the second cable 500 is used to input or output an electrical signal. From this, fix a position the corresponding second cable 500 that passes through constant head tank 150 for every cable is independent each other, can avoid appearing the condition of welding point short circuit effectively, and neat easily distinguishs and the investigation circuit.

In an embodiment of the present invention, a fourth electrode (not shown in the figure) is disposed in the third groove, one end of the second cable is soldered to the fourth electrode, and the fourth electrode is communicated with the third electrode disposed in the third groove.

Specifically, as a possible embodiment, two rows of third grooves may be formed on one side surface of the circuit substrate 100 where the positioning groove is formed, wherein the third electrode is disposed in one row of the third grooves, and the fourth electrode is disposed in the other row of the third grooves. The constant head tank and the second cable of circuit substrate side correspond the setting, and the one end of second cable is earlier through the constant head tank location, then welds on the fourth electrode, and the fourth electrode passes through the through-hole with the third electrode and links to each other to link to each other with the one end of corresponding first cable 400. As shown in fig. 6, one ends of the second cable 500 and the first cable 400 may be connected to each other and then inserted into the positioning hole 140 to be in welding communication through the third groove 130.

When only one row of grooves for accommodating electronic components is provided on the side surface of the circuit board 100, that is, at least one first groove 110 is provided, the first groove 110 may be provided in the same row as the plurality of third grooves (130).

The invention adopts a circuit substrate, the whole thickness of the circuit substrate is controlled in the projection area of the image pickup element, and electronic components required by the action of the image pickup element are welded on the side surface of the circuit substrate, so that the electronic components are mounted at the position closest to the image pickup element, the whole size is shortened, and the structure miniaturization of the head part of the endoscope can be realized. The diameter is reduced, the length of the hard part of the endoscope head structure is also shortened, the front end of the endoscope is more flexibly bent when the endoscope is used for the operation in the body of a detected person, and the pain of a patient can be further reduced when the endoscope is inserted into the body. In addition, when the camera sensor is driven at a high speed and signals are transmitted, the first electronic component is closer to the camera sensor, so that the impedance is reduced, the noise is reduced, and a high-quality image can be obtained. In addition, the heating active device is arranged on the side surface, so that heat dissipation is facilitated, and the situation that the image quality is reduced due to heating of the active device can be effectively avoided.

In summary, according to the electronic circuit unit of the embodiment of the invention, the first groove is formed on the side surface of the circuit substrate near the front surface to accommodate the electronic component, so that the distance between the electronic component and the image sensor is reduced, the image quality of the acquired image is improved, the length of the hard part of the endoscope head structure is greatly shortened, and the pain of the detected person is relieved.

Corresponding to the electronic circuit unit of the above embodiment, the invention also provides a camera unit.

As shown in fig. 12, the image pickup unit of the embodiment of the present invention may include the electronic circuit unit and the image pickup sensor 21 described above. The first electronic component 200 and the second electronic component 300 are not shown.

The connection mode of the electronic circuit unit and the image sensor 21 is the same as that of the electronic circuit unit and the image sensor described in the above embodiments, and reference may be made to the explanation of the above embodiments, and details are not described here to avoid redundancy.

According to the camera unit provided by the embodiment of the invention, the first groove is formed on the side surface of the circuit substrate close to the front surface to accommodate the electronic component, so that the distance between the electronic component and the camera sensor is reduced, the image quality of the acquired image is improved, and the overall length of the camera unit is greatly shortened.

The invention also provides an endoscope head structure corresponding to the camera unit of the embodiment.

The endoscope head structure can comprise the camera shooting unit.

According to the endoscope head structure provided by the embodiment of the invention, the front surface of the circuit substrate close to the camera sensor is provided with the groove for accommodating the electronic component, so that the distance between the electronic component and the camera sensor is reduced, the image quality of the acquired image is improved, the length of the camera unit and the length of the hard part of the endoscope head structure when the endoscope head structure is assembled at the head end of an endoscope are greatly shortened, and the pain of a detected person is relieved.

The invention also provides an endoscope corresponding to the endoscope head structure of the embodiment.

As shown in fig. 13, an endoscope 1000 according to an embodiment of the present invention may include the endoscope head structure 1 described above.

In one embodiment of the present invention, as shown in fig. 13, the endoscope 1000 may further include an operation portion 2 and an insertion portion 3. The endoscope head structure 1 is provided at the distal end of the insertion section 3 of the endoscope 1000.

Here, an active device that generates heat may be provided in the operation portion 2.

According to the endoscope provided by the embodiment of the invention, the first groove is formed on the side surface of the circuit substrate close to the front surface to accommodate the electronic component, so that the distance between the electronic component and the image pickup sensor is reduced, the image quality of the acquired image is improved, the length of the hard part of the endoscope head structure is greatly shortened, and the pain of a detected person is relieved.

In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. The meaning of "plurality" is two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following technologies, which are well known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.

In addition, functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a separate product, may also be stored in a computer-readable storage medium.

The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

The active and passive components of the first or second electronic component mentioned above. Can be a wireless transmission device, a near-distance wireless transmission device, a WiFi device, a light transmission device and the like. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims

1. An electronic circuit unit, comprising:

the image sensor comprises a circuit substrate (100), wherein the front surface of the circuit substrate (100) is used for arranging an image sensor (21), at least one first groove (110) is formed in the position, close to the front surface, of the side surface of the circuit substrate (100), and at least one second groove (120) is formed in the position, close to the back surface of the circuit substrate (100), of the side surface of the circuit substrate (100);

the first electronic component (200), the first electronic component (200) is arranged in the corresponding first groove (110);

and the second electronic component (300) is arranged in the corresponding second groove (120).

2. Electronic circuit unit according to claim 1, characterized in that a first electrode (111) is arranged in the first recess (110), the first electronic component (200) being soldered onto the first electrode (111).

3. An electronic circuit unit according to claim 1, characterized in that a second electrode (121) is arranged in the second recess (120), and the second electronic component (300) is soldered to the second electrode (121).

4. An electronic circuit unit according to claim 1, characterized in that the first electronic component (200) is a passive component in an image drive circuit.

5. An electronic circuit unit according to claim 1, characterized in that the second electronic component (300) is an active device in an image drive circuit.

6. The electronic circuit unit according to claim 1, wherein a plurality of third grooves (130) are further formed on a side surface of the circuit substrate (100), a plurality of positioning portions (140) are formed on a back surface of the circuit substrate (100), and the plurality of positioning portions (140) are correspondingly communicated with the plurality of third grooves (130), the electronic circuit unit further comprising:

the first cable (400) is arranged corresponding to the third groove (130), the first cable (400) penetrates through the corresponding positioning part (140), and one end of the first cable is arranged in the corresponding third groove (130).

7. The electronic circuit unit according to claim 6, wherein a third electrode (131) is provided in the third recess (130), and one end of the first cable (400) is soldered to the third electrode (131).

8. The electronic circuit unit according to claim 7, wherein a plurality of the third grooves (130) are arranged circumferentially along a side surface of the circuit substrate (100).

9. The electronic circuit unit according to claim 8, wherein the plurality of third recesses (130) are independent recesses formed in a side surface plane of the circuit substrate (100).

10. The electronic circuit unit according to claim 8, wherein the plurality of third recesses (130) are recesses that are formed twice on the basis of a stripe-shaped recess formed in a side surface of the circuit substrate (100).

11. The electronic circuit unit according to claim 9 or 10, wherein the positioning portion (140) is not communicated with, and is communicated with, the side portion of the corresponding third groove (130).

12. The electronic circuit unit according to claim 9 or 10, wherein the positioning portion (140) communicates with both a side portion and an inside portion of the corresponding third groove (130).

13. The electronic circuit unit according to claim 6 or 7, further comprising:

one or more second cables (500), one end of each second cable (500) being communicated with one end of the corresponding first cable (400).

14. The electronic circuit unit according to claim 13, wherein a fourth electrode (132) is provided in the third recess (130), one end of the second cable (500) is soldered to the fourth electrode (132), and the fourth electrode (132) communicates with the third electrode (131) provided in the third recess (130).

15. An electronic circuit unit, comprising:

the camera shooting device comprises a circuit substrate (100), wherein the front surface of the circuit substrate (100) is used for arranging a camera shooting sensor (21), and the side surface of the circuit substrate (100) is provided with at least one first groove (110);

the first electronic component (200), first electronic component (200) set up in corresponding first recess (110).

16. An image pickup unit characterized by comprising: an electronic circuit unit according to claim 15 or any of claims 1-14 and a camera sensor.