CN115691327A - Support film, flexible mother board, flexible display panel and manufacturing method thereof - Google Patents
Support film, flexible mother board, flexible display panel and manufacturing method thereof Download PDFInfo
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- CN115691327A CN115691327A CN202211203968.5A CN202211203968A CN115691327A CN 115691327 A CN115691327 A CN 115691327A CN 202211203968 A CN202211203968 A CN 202211203968A CN 115691327 A CN115691327 A CN 115691327A
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Abstract
The application discloses a support film, a flexible mother board, a flexible display panel and a manufacturing method thereof. Support the membrane and be used for supporting and the reinforcement flexible mother board, each flexible mother board includes the flexible daughter board that a plurality of intervals set up, support the membrane including range upon range of bond line and the substrate layer that sets up, the substrate layer is formed with hollow out construction, hollow out construction's opening is located the surface that the substrate layer is provided with the bond line, hollow out construction arranges along the attached direction of supporting the membrane attached on flexible mother board, and hollow out construction sets up between adjacent flexible daughter board. This application supports and is formed with hollow out construction on the membrane, and when directly attached big support membrane on flexible mother board, hollow out construction can slowly release stress, avoids stress accumulation, and during the laminating, glue for bonding can release, alleviate in hollow out construction when the laminating direction accumulation is followed in the pressurized for when cutting preparation monolithic, reduce unnecessary glue and accumulate and release stress, avoid the inflation.
Description
Technical Field
The present disclosure relates to the field of display device manufacturing technologies, and in particular, to a support film, a flexible mother substrate, a flexible display panel, and a method for manufacturing the flexible display panel.
Background
An organic light-emitting diode (OLED) has a thinner and lighter structure because it does not need a backlight structure, and has no liquid crystal self-luminous display mode, and has excellent color saturation and screen response speed, so that it is an ideal display device.
The OLED emits light by the action of current through the light emitting layer; the luminous layer is a flexible plate, curling easily occurs, supporting and reinforcing are needed through a support film, the existing manufacturing process needs to attach a large-piece protective film after the flexible plate is separated from a glass slide, after cutting and manufacturing of a single sub-plate are completed, the protective film is torn off and then attached to the support film, the protective film cannot be recycled as the process film, in order to save materials, cutting is considered after the flexible plate is separated from the glass slide and the large-piece support film is directly attached, however, the manufacturing process of directly attaching the large-piece support film can cause stress accumulation, stress release easily causes expansion when cutting is carried out, metal lead position deviation is caused, and bonding abnormity is easily generated when a subsequent electrode layer is bonded.
How to improve the supporting film and avoid the stress accumulation caused by the process of directly attaching the large supporting film becomes a problem to be solved urgently.
Disclosure of Invention
An object of the embodiments of the present application is to provide a support film, a flexible mother board, a flexible display panel and a manufacturing method thereof, so as to solve the problem of expansion caused by stress release during cutting due to stress accumulation caused by directly attaching a large support film.
In order to solve the technical problem, the first aspect of the present application provides a support film, the support film is used for supporting and reinforcing a flexible mother board, each flexible mother board includes a plurality of flexible daughter boards that are arranged at intervals, the support film includes a bonding layer and a substrate layer that are arranged in a stacked manner, the substrate layer is formed with a hollow structure, an opening of the hollow structure is located on the surface of the substrate layer provided with the bonding layer, the hollow structure is arranged along the attaching direction of the support film attached on the flexible mother board, and the hollow structure is arranged between adjacent flexible daughter boards.
In one possible embodiment, the hollow structure and the opening thereof are in the shape of a strip.
In a possible implementation mode, the hollow structures are arranged in multiple rows, the hollow structures in the same row extend in the same direction, the extending direction is perpendicular to the attaching direction of the support film, and the hollow structures in two adjacent rows are arranged in a staggered mode.
In one possible embodiment, the strip-shaped opening is kidney-shaped.
In a possible embodiment, the openings are in the form of curved or bent strips, the direction of curvature or bending of the openings being the same or opposite.
In a possible embodiment, a projection of a gap between adjacent hollow structures in the same column in the row direction is located on the hollow structures in the adjacent columns.
In one possible embodiment, the width of the strip-shaped openings increases from the edge of the surface of the substrate layer to the center of the surface of the substrate layer.
In order to solve the above technical problem, in a second aspect, an embodiment of the present application provides a flexible motherboard, which includes a flexible substrate, and the flexible motherboard further includes a support film, where the support film is the support film described in the foregoing embodiment, and the support film is attached to the flexible substrate through an adhesive layer.
In order to solve the foregoing technical problem, in a third aspect, an embodiment of the present application provides a method for manufacturing a flexible display panel, including: obtaining the flexible motherboard described in the above embodiment; and cutting the flexible mother board along the arrangement direction of the hollow structures to obtain a single flexible display panel.
In order to solve the above technical problem, in a fourth aspect, an embodiment of the present application provides a flexible display panel, where the flexible display panel is manufactured by the manufacturing method of the flexible display panel.
The application provides a support membrane, flexible mother board, flexible display panel and preparation method, this support membrane is used for supporting and the reinforcement to flexible mother board, each flexible mother board includes the flexible daughter board that a plurality of intervals set up, support membrane is including range upon range of bond layer and the substrate layer that sets up, the substrate layer is formed with hollow out construction, hollow out construction's opening is located the surface that the substrate layer was provided with the bond layer, hollow out construction arranges along the attached direction of support membrane attached on flexible mother board, and hollow out construction sets up between adjacent flexible daughter board. This application supports and is formed with hollow out construction on the membrane, and when directly attached the big piece support membrane on organic material layer, hollow out construction can slowly release stress, avoids stress accumulation, and during the laminating, glue for bonding can release, alleviate in hollow out construction when the laminating direction is accumulated along the pressurized for when cutting preparation monolithic, reduce unnecessary glue and accumulate and release stress, avoid the inflation.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic plan view of a first embodiment of a support film according to the present application;
FIG. 2 is a schematic cross-sectional structure of the support film of FIG. 1;
FIG. 3 is a schematic plan view of a second embodiment of the support film of the present application;
FIG. 4 is a schematic plan view of the support film of FIG. 3 attached to a flexible mother substrate;
FIG. 5 is a schematic plan view of a third embodiment of the support film of the present application;
FIG. 6 is a schematic plan view of a support film according to a fourth embodiment of the present invention;
FIG. 7 is a schematic plan view of a support film according to a fifth embodiment of the present invention;
FIG. 8 is a schematic plan view of a support film according to a sixth embodiment of the present application;
fig. 9 is a schematic structural diagram of an embodiment of the flexible motherboard of the present application.
Reference numerals: 100/200/300/400/500/600/700, support film; 110/210/310/410/510, hollow structure; 150. a flexible daughter board; 111/211/311/411/511/611, opening; 120. an adhesive layer; 130. a substrate layer; 140. a polyester film layer; 10. a flexible motherboard; 800. a flexible substrate.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and "a plurality" typically includes at least two, but does not exclude the presence of at least one, unless the context clearly dictates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that the terms "comprises," "comprising," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprise 8230; "do not exclude the presence of additional identical elements in any process, method, article, or apparatus that comprises the element.
In the existing manufacturing process of the flexible display panel, a large protective film needs to be attached after the organic material layer is separated from the glass, after cutting is completed, the protective film is torn off and then attached to the supporting film, and the protective film cannot be recycled in the process, so that material waste is caused. If the protection film is removed and the cutting is carried out after the large support film is directly attached, the problem of stress accumulation and expansion is easily caused, and the position deviation of the metal lead is caused.
In order to solve the problems, the application provides a supporting film, a flexible mother board, a flexible display panel and a manufacturing method of the flexible display panel. The following describes a support film, a flexible mother board, a flexible display panel and a method for manufacturing the same in detail with reference to the accompanying drawings and embodiments.
Referring to fig. 1 and 2, fig. 1 is a schematic plan view of a support film 100 according to a first embodiment of the present disclosure; fig. 2 is a schematic cross-sectional structure diagram of the support film 100 in fig. 1. In a first aspect of the present application, a support film 100 is provided. The support membrane 100 is used to support and reinforce the flexible motherboard.
The support film 100 includes an adhesive layer 120 and a substrate layer 130, which are stacked, and the hollow structure 110 is formed on the support film 100, and the hollow structure 110 is located on the substrate layer 130. The openings 111 of the hollow structures 110 are located on the surface of the substrate layer 130 on which the adhesive layer 120 is disposed, and the hollow structures 110 are arranged along the attaching direction of the support film 100 attached to the flexible motherboard. Specifically, the support film 100 is used to be attached to the flexible mother substrate, for preventing the flexible mother substrate from curling during processing, and for preventing the daughter board from curling after cutting and the daughter board from curling when processing the daughter board. The existing manufacturing process is that after a flexible mother board is cut into daughter boards with smaller sizes, a support film 100 is attached to the daughter boards with smaller sizes, and then subsequent processing is carried out, but a protective film is attached to the flexible mother board before cutting, the protective film needs to be torn off before the support film 100 is attached after cutting, and the protective film cannot be recycled as a process film, so that material waste is caused. If the attachment of the protection film is omitted before the flexible mother board is cut, the large-size support film 100 is directly attached to the flexible mother board and cut, stress accumulation and expansion are easily caused in the processes of attaching the large-size support film 100 and cutting, the metal lead is caused to be shifted, and the precision of the processed daughter board is not high enough. In this embodiment, the supporting film 100 is formed with a plurality of hollow structures 110, and when the supporting film 100 is attached to the mother board by glue, the stress is continuously released through the hollow structures 110 in the attaching direction, so as to avoid stress accumulation, and no matter from which direction the supporting film is attached, the redundant glue can flow into the hollow structures 110 from the openings 111 of the hollow structures 110, so that the accumulation of glue amount is also avoided. In the present embodiment, the attaching direction of the support film 100 is the row direction attaching, the hollow structures 110 are gradually distributed in the row direction of the support film 100, a plurality of rows of the hollow structures 110 are distributed in the row direction of the support film 100, the hollow structures 110 in each row are arranged in multiple sections, in other embodiments, the hollow structures 110 in each row may also be arranged in a single section or in other sections such as 2 sections, 4 sections, etc., the hollow structures are distributed from left to right, and when the support film 100 is attached to the flexible mother board, the support film is attached from left to right or from right to left.
In the present embodiment, the support film 100 includes an adhesive layer 120, a base material layer 130, and a polyester film layer 140, which are sequentially stacked; the hollow structure 110 is located on the substrate layer 130. The hollow structure 110 has an opening 111 on the surface of the substrate layer 130. Specifically, the adhesive layer 120 is coated on one side of the substrate layer 130, the adhesive layer 120 is used for adhering the support film 100 to the flexible motherboard, and in addition to the adhesion function, the adhesive layer 120 also supports the flexible motherboard after adhesion, wherein the adhesive layer 120 should be as thin as possible so as not to affect the folding and bending functions of the flexible motherboard and the cut daughter board. In this embodiment, the thickness of the adhesive layer 120 is preferably 15 micrometers to 25 micrometers, for example, 15 micrometers, 18 micrometers, 21 micrometers, 25 micrometers, and the like, and is not particularly limited. The advantage of maintaining the thickness of the adhesive layer 120 at 15-25 μm is to ensure the adhesion reliability of the support film 100 on the flexible mother board and avoid the influence of excessive thickness on the folding and bending functions of the flexible board. In this embodiment, the adhesive layer 120 is preferably an acrylic pressure sensitive adhesive having excellent low temperature adhesion resistance, and the support film 100 is adhered to the flexible mother substrate through the adhesive layer 120, so as to reduce the problem of loose adhesion, and in other embodiments, the adhesive layer 120 may be another adhesive material. Wherein, polyester film layer 140 is located the another side that substrate layer 130 was provided with bonding layer 120, and polyester film layer 140 is for releasing the type membrane, and for the optical film light transmissivity is good, has the characteristics of surfacing, the cleanliness factor is high, plays the effect of protecting substrate layer 130. The opening 111 of hollow out construction 110 is located the surface of substrate layer 130, specifically be located the surface of substrate layer 130 bonding adhesion layer 120, the design on substrate layer 130 bonding adhesion layer 120's surface is located to opening 111, when will supporting membrane 100 adhesion on flexible motherboard, the stress accumulation can release through the opening 111 of hollow out construction 110, in adhesion pressfitting in-process, unnecessary bonding layer 120's volume of gluing can not be caused the inflation by the extrusion accumulation, but directly the opening 111 through the contact flows into hollow out construction 110, the volume of gluing has been avoided and the volume of gluing is accumulated and is caused the inflation.
Be different from prior art, be formed with hollow out construction 110 on the support membrane 100 of this application, through the support membrane 100 of this application, directly attached cutting after on flexible mother board, saved the use of protection film, saved the material. Because support membrane 100 is last to have hollow out construction 110, when attached this support membrane 100 on the flexible mother board, in the attached direction, constantly release pressure through hollow out construction 110, avoid stress accumulation, during the laminating, glue for the bonding can release, alleviate in hollow out construction 110 when the laminating direction accumulation is followed in the pressurized for when cutting preparation monolithic, reduce unnecessary glue and accumulate and release stress, avoid the inflation.
Further, in some other embodiments, the adhesive layer 120 is also bonded to the other side of the substrate layer 130 with a second polyester film layer 140. When the support film 100 is not adhered to the flexible mother substrate, the second polyester film layer 140 covers the adhesive layer 120 to protect the adhesive layer 120, and when the support film 100 needs to be attached to the flexible mother substrate, the second polyester film layer 140 is torn off to leak out the adhesive layer 120, so that the support film 100 can be attached to the flexible mother substrate.
In some embodiments, the substrate layer 130 of the support film 100 may be a high temperature resistant polyester material or a polyimide material, and the like, which is not particularly limited.
Referring to fig. 3, fig. 3 is a schematic plan view of a support film 200 according to a second embodiment of the present invention. In this embodiment, the hollow structures 210 and the openings 211 thereof are strip-shaped, the hollow structures 210 are arranged in multiple rows, the hollow structures 210 in the same row extend in the same direction, the extending direction is perpendicular to the attaching direction of the support film 200, the hollow structures 210 in two adjacent rows are arranged in a staggered manner, and the projection of the gap between the adjacent hollow structures 210 in the same row in the row direction is located on the hollow structures 210 in the adjacent rows. Specifically, in the present embodiment, the strip-shaped openings 211 extend in the same direction, and the openings 211 in two adjacent columns are staggered, as shown in fig. 3, in the present embodiment, the extending direction of each opening 211 extends longitudinally, and in other embodiments, the extending direction of each opening 211 may also extend transversely, which is not limited specifically. As shown in fig. 3, the openings 211 extending longitudinally are designed, two adjacent columns of the openings 211 are staggered, the projections of the gaps between the adjacent hollow structures 210 in the same column in the row direction are located on the hollow structures 210 in the adjacent columns, and when the support film 200 is attached to the flexible mother board, the support film 200 is attached from left to right. Or attach the support membrane 200 from right to left, this attached direction, the accumulation is gone from left to right or is accumulated from right to left with gluing the volume, through this structural design, does not have all not to set up the hourglass region of opening 211 in the transverse direction of adjacent two ranks, ensures to attach the effect that supports membrane 200 and release stress from left to right or from right to left, for example the stress or unnecessary glue between two adjacent opening 211 clearances in same row can discharge through the opening 211 of adjacent row. In other embodiments, if the openings 211 of each stripe shape extend laterally and the two adjacent rows are staggered, the support film 200 is attached from top to bottom or the support film 200 is attached from bottom to top, so as to ensure that the openings 211 avoid the stress accumulation with the best effect.
Referring to fig. 4, fig. 4 is a schematic plan view illustrating the supporting film attached to the flexible mother substrate in fig. 3. The flexible mother board comprises a plurality of flexible daughter boards 150 arranged at intervals, and the hollow-out structures 210 are arranged between the adjacent flexible daughter boards 150. Specifically, the hollow structure 210 is located between two adjacent flexible daughter boards 150, and when the single board is cut and manufactured along the arrangement direction of the flexible mother board, the hollow structure 210 can reduce the accumulation of redundant glue and release stress during cutting, and avoid expansion.
Referring to fig. 5, fig. 5 is a schematic plan view of a support film 300 according to a third embodiment of the present application. Unlike the second embodiment, in the present embodiment, the strip-shaped opening 311 is waist-shaped, and specifically, the outer edges of the two ends of the opening 311 are arc-shaped. Specifically, there is the clearance between two adjacent bar form openings 311 of same column, and opening 311 is waist shape design, makes the outer edge design arc structure of opening 311 of the both sides in this clearance, is favorable to the unnecessary volume of gluing of clearance to flow into hollow out construction 310 along the arc limit, and does not have the stress concentration point, has further improved hollow out construction 310 and has avoided the effect of stress accumulation.
Referring to fig. 6, fig. 6 is a schematic plan view illustrating a support film 400 according to a fourth embodiment of the present invention. Unlike the previous embodiment, in this embodiment, the openings 411 are not only arranged in multiple rows, two adjacent rows of the openings 411 are staggered, each opening 411 is in a bent strip shape, and the bending directions of the openings 411 are the same. Specifically, opening 411 is the lines setting of buckling, makes opening 411's outer edge length longer, and when accumulated stress or unnecessary gluey volume moved to the outer edge of buckling opening 411, accumulated stress or unnecessary gluey volume can flow into hollow out construction 410 along the outer edge of buckling to attached direction slowly sliding gradually, slowly releases, makes the row glue slowly smooth and easy, and the row glue effect is better. In the present embodiment, the bending point of the bent opening 411 faces to the left, and when the support film 400 is attached, the best effect of releasing the stress and discharging the excess glue of the hollow structure 410 can be ensured by attaching from the left to the right. In other embodiments, the bending points of the bent openings 411 can also face to the right, so that the best effect of releasing the stress and discharging the excess adhesive of the hollow structure 410 can be ensured by attaching from the right to the left when attaching the support film 400. Further, in this embodiment, each opening 411 is a bent strip shape, in other embodiments, each opening 411 can also be a bent strip shape, the bending direction of each bent strip-shaped opening 411 is the same, and the accumulated stress or the excess glue amount can slowly slide along the bent outer edge toward the attaching direction and gradually flow into the hollow structure 410, so as to achieve the purpose of better releasing the stress and discharging the excess glue.
Referring to fig. 7, fig. 7 is a schematic plan view illustrating a support film 500 according to a fifth embodiment of the present invention. The embodiment is different from the fourth embodiment in that the bending directions of the openings 511 in the same row are the same, and the bending directions of the openings 511 in adjacent rows are opposite. Specifically, the design of the openings 511 in the adjacent rows in opposite bending directions makes the gel not flowing into the hollow structure 510 and the unreleased stress in a certain row more easily released from the openings 511 in the adjacent rows in opposite bending directions, and makes the support film 500 have the openings 511 bent in two directions at the same time, so that the support film 500 can be attached in two directions to ensure a good effect of releasing the stress and the gel.
Referring to fig. 8, fig. 8 is a schematic plan view of a support film 600 according to a sixth embodiment of the present application. Unlike the previous embodiment, in the present embodiment, the width of the strip-shaped opening 611 increases from the edge of the surface of the base material layer toward the center of the surface of the base material layer. It is easily understood that the more the substrate layer is located in the center region, the more stress and the more excess glue are accumulated when the support film 600 is attached and the mother board is cut. In this embodiment, the wider the strip-shaped opening 611 is, the more the stress and the amount of excess adhesive can be released, and the opening 611 is designed to allow each area on the surface of the support film 600 to uniformly release the stress and the amount of adhesive to be discharged during the attaching and cutting processes.
In addition, this embodiment can be arbitrarily combined with the first to fifth embodiments to form further embodiments, which are not described herein again. That is, the strip-shaped openings in any of the first to fifth embodiments may have a width that increases from the edge of the surface of the base material layer toward the center of the surface of the base material layer.
The hollow-out structures of the support film in the first to sixth embodiments are all manufactured by cutting with a cutting die. When the support film is cut to form the hollow structure, in one embodiment, a cutting die penetrates through the adhesive layer, the substrate layer and the polyester film layer of the support film, the hollow structure of the through hole is formed in the substrate layer, the penetrated polyester film layer is peeled off, and a new polyester film layer is adhered; and attaching a second polyester film layer for protecting the adhesive layer to the other surface of the adhesive layer to form a hollow structure of the through hole. Or in another embodiment, the cutting die penetrates through the adhesive glue layer of the support film and cuts the substrate layer in a depth-controlled manner, the hollow structure of the blind hole is formed on the substrate layer, the second polyester film layer for protecting the adhesive glue layer is attached to the other side of the adhesive glue layer, the hollow structure of the blind hole is formed, and the polyester film layer does not need to be replaced by a new polyester film layer. The above scheme for forming the hollow structure is not limited.
Referring to fig. 9, fig. 9 is a schematic structural diagram of an embodiment of the flexible motherboard 10 of the present application. In the present embodiment, the flexible motherboard 10 includes a flexible substrate 800 and a support film 700, and the support film 700 is the support film 700 described in the above embodiments. The support film 700 is attached to the flexible substrate 800 through the adhesive layer of the support film 700.
The flexible substrate 800 is extremely thin and is formed by coating on a slide glass, and before the support film 700 is attached to the flexible substrate 800, the material substrate of the cleaning machine is cleaned, and then the flexible substrate 800 is peeled off from the slide glass. Wherein the flexible substrate 800 is separated by laser separating a central region of the flexible substrate 800 and blade separating an edge region of the flexible substrate 800.
In this way, be formed with a plurality of hollow out construction on supporting membrane 700, hollow out construction's opening is located the attached one side at flexible substrate 800 of substrate that supports membrane 700, and when supporting membrane 700 attached on flexible substrate 800, from the attaching direction, the stress of accumulation and unnecessary volume of gluing constantly through opening discharge hollow out construction, have avoided stress and unnecessary volume of gluing accumulation to arouse the inflation, cause the not high enough problem of product precision.
Correspondingly, the present application also provides a method for manufacturing a flexible display panel, which includes: and obtaining the flexible mother board described in the above embodiment, and cutting the flexible mother board along the arrangement direction of the hollow structures to obtain a single flexible display panel.
The organic light emitting diode has no backlight structure, the flexible display panel is self-luminous by acting current on the flexible display panel, the structure for emitting light in the flexible display panel is formed by cutting a flexible substrate into single pieces, and the material of the flexible substrate can be organic molecules, organic polymers or polycrystalline silicon and the like, which is not limited specifically.
In some embodiments, the flexible mother substrate is cut along the arrangement direction of the hollow structures to obtain a single flexible display panel. Specifically, the flexible mother board is cut along the arrangement direction of the hollow structures, stress is released continuously through the hollow structures in the cutting process, the glue amount is discharged, and the precision error of the flexible display panel obtained by cutting due to stress expansion is avoided.
In this way, hollow out construction has on supporting the membrane in the flexible mother board, and when cutting, cutter pressure produced stress, and stress can pass through hollow out construction release, and the volume of gluing that stress caused flows and can pass through hollow out construction and discharge, can not produce the inflation problem, and the flexible display panel circuit that obtains is more accurate.
Correspondingly, the present application also provides a flexible display panel, which is manufactured by the manufacturing method of the flexible display panel described in the foregoing embodiment. The flexible display panel has no expansion problem in the manufacturing process and has accurate circuit.
The above description is only an embodiment of the present application, and is not intended to limit the scope of the present application, and all modifications, equivalents, or direct or indirect applications using the contents of the specification and drawings of the present application in other related fields are included in the scope of the present application.
Claims (10)
1. A support film is used for supporting and reinforcing flexible mother boards, each flexible mother board comprises a plurality of flexible daughter boards arranged at intervals, the support film comprises an adhesive layer and a base material layer which are arranged in a laminated mode, and the support film is characterized in that,
the substrate layer is formed with hollow out construction, hollow out construction's opening is located the substrate layer is provided with the surface of bond line, hollow out construction follows the support membrane is attached arrange in the attached direction on the flexible mother board, just hollow out construction sets up in adjacent between the flexible daughter board.
2. The support film of claim 1,
the hollow structure and the opening thereof are strip-shaped.
3. The support film of claim 2,
the hollow structures are arranged in multiple rows, the hollow structures in the same row extend in the same direction, the extending direction is perpendicular to the attaching direction of the support film, and the hollow structures in two adjacent rows are arranged in a staggered mode.
4. The support film of claim 3,
the strip-shaped opening is waist-shaped.
5. The support film of claim 3,
the openings are in a bent or bent strip shape, and the bending directions of the openings are the same or opposite.
6. The support film of claim 3,
the projection of the gaps between the hollow structures adjacent to each other in the same column in the row direction is positioned on the hollow structures adjacent to each other in the column direction.
7. The support film of claim 3,
the width of the strip-shaped opening increases gradually from the edge of the surface of the base material layer to the center of the surface of the base material layer.
8. A flexible mother board comprising a flexible substrate, characterized in that the flexible mother board further comprises a support film according to any one of claims 1 to 6, wherein the support film is attached to the flexible substrate by the adhesive layer.
9. A method for manufacturing a flexible display panel is characterized by comprising the following steps:
obtaining the flexible motherboard of claim 8;
and cutting the flexible mother board along the arrangement direction of the hollow structures to obtain the single flexible display panel.
10. A flexible display panel is characterized in that,
the flexible display panel manufactured by the method for manufacturing a flexible display panel according to claim 9.
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| CN107742476A (en) * | 2017-11-15 | 2018-02-27 | 京东方科技集团股份有限公司 | A kind of flexible display substrates motherboard and its cutting method, flexible display substrates, display device |
| CN107910296A (en) * | 2017-12-08 | 2018-04-13 | 京东方科技集团股份有限公司 | A kind of flexible display panels motherboard and its cutting method, flexible display panels, display device |
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