CN115685687A - Image acquisition temperature control device and method and photoetching machine - Google Patents

Abstract

The embodiment of the invention provides an image acquisition temperature control device, a method and a photoetching machine, wherein the embodiment of the invention provides the image acquisition temperature control device which comprises the following components: the image acquisition unit and the fixing frame are used for fixing the image acquisition unit; a first temperature detection unit for detecting a temperature of the fixing frame; and the position detection module is used for detecting the displacement of the fixed frame and adjusting the target value of the temperature detected by the first temperature detection unit based on the displacement of the fixed frame. The embodiment of the invention provides an image acquisition temperature control device, an image acquisition temperature control method and a photoetching machine, which take the position information of a fixed frame as a direct judgment basis of the thermal expansion degree of the fixed frame, and give a target value of temperature adjustment according to the position change information of the fixed frame, thereby ensuring the imaging quality and the position precision of an image acquisition unit.

Description

Image acquisition temperature control device and method and photoetching machine

Technical Field

The invention relates to the technology of photoetching machines, in particular to an image acquisition temperature control device and method and a photoetching machine.

Background

The CCD camera is a common device for detection and measurement in the field of semiconductors, and the functions of alignment, image capture and the like of the photoetching machine are realized by the photographing principle of the CCD camera. But simultaneously, the heat of the CCD camera also influences the high-precision measurement, so that the measurement result is accurate. Meanwhile, too high temperature can also affect the stability of the performance of the camera. And other heat-sensitive components in the lithography machine can be affected, for example, the stability and uniformity of the temperature of the optical path of the interferometer are affected, so that the measurement of the interferometer is inaccurate, and the alignment repeatability is poor.

At present, two main ways are available for heat dissipation of a CCD camera inside a photoetching machine. In the first mode, a pumping casing is additionally arranged around the CCD camera, and heat generated by the CCD camera is taken away in a thermal pumping mode, the heat dissipation mode mainly adopts a forced convection mode of heat dissipation fins and a fan, and the mode can only generally maintain the temperature of the CCD camera not to be too high (cannot be lower than the ambient temperature), so that the CCD camera cannot be failed or damaged due to too high temperature. This approach is clearly not satisfactory for high precision measurements and high precision equipment. In the second mode, a water jacket is added around the shell of the CCD camera, the heat emitted by the CCD camera is taken away through the water jacket, and the temperature of the CCD camera cannot be completely controlled to the required temperature due to the fact that the water jacket is limited by space and small in water amount and the heat conduction problem between the water jacket and the CCD camera. The temperature of the CCD camera can be reduced only by reducing the water temperature, the liquid cooling mode is used on equipment and needs to be added with some accessory equipment such as a water chilling unit and the like, meanwhile, a low-temperature circulating water pipeline needs to be treated, otherwise, a large amount of condensed water is separated out, and therefore the method still has many defects in engineering realization. And this kind of cooling method can't realize the accurate control by temperature change of multiunit CCD camera.

Disclosure of Invention

The embodiment of the invention provides an image acquisition temperature control device, an image acquisition temperature control method and a photoetching machine, which take the position information of a fixed frame as a direct judgment basis of the thermal expansion degree of the fixed frame, and give a target value of temperature adjustment according to the position change information of the fixed frame, thereby ensuring the imaging quality and the position accuracy of an image acquisition unit.

In a first aspect, an embodiment of the present invention provides an image capturing temperature control device, including:

the device comprises an image acquisition unit and a fixing frame for fixing the image acquisition unit;

a first temperature detection unit for detecting a temperature of the fixing frame;

and the position detection module is used for detecting the displacement of the fixed frame and adjusting the target value of the temperature detected by the first temperature detection unit based on the displacement of the fixed frame.

Optionally, the system further comprises a refrigeration unit and a feedback control unit, wherein the feedback control unit adjusts the temperature of the refrigeration unit according to the measurement result of the first temperature detection unit.

Optionally, the refrigeration unit is disposed on the fixed frame and/or the image capture unit.

Optionally, the refrigeration unit includes a semiconductor refrigerator, the semiconductor refrigerator includes a hot end and a cold end opposite to each other, and when the refrigeration unit is disposed on the fixed frame, the cold end is located between the hot end and the fixed frame; when the refrigeration unit is arranged on the image acquisition unit, the cold end is positioned between the hot end and the image acquisition unit.

Optionally, the heat pipe further comprises a heat conducting unit, and the heat conducting unit is arranged on one side, far away from the cold end, of the hot end.

Optionally, the fixed frame is provided with a flow passage; the refrigeration unit comprises a semiconductor refrigerator and a cold-end heat exchanger;

the semiconductor refrigerator comprises a hot end and a cold end which are opposite, and the cold end is positioned between the hot end and the cold end heat exchanger; and the cold end heat exchanger is connected with the runner water way.

Optionally, the position detection module includes an X-direction laser displacement sensor and/or a Y-direction laser displacement sensor.

Optionally, the fixed frame includes a main board and a plurality of protrusions disposed on the main board, and the protrusions are located between the image capturing unit and the main board;

the image acquisition temperature control device comprises a plurality of image acquisition units and a plurality of first temperature detection units;

the number of any two of the image acquisition unit, the protrusion and the first temperature detection unit is equal.

Optionally, the system further comprises a water cooling plate, a circulating water control device and a second temperature detection unit, wherein the water cooling plate is located on one side, away from the image acquisition unit, of the fixed frame and is connected with the circulating water control device in a water way;

and the second temperature detection unit is used for detecting the temperature of the water cooling plate.

In a second aspect, an embodiment of the present invention provides a lithography machine, including the image acquisition temperature control device according to the first aspect.

In a third aspect, an embodiment of the present invention provides an image capturing temperature control device method based on the image capturing temperature control device in the first aspect, including:

detecting the temperature of the fixed frame by adopting a first temperature detection unit;

detecting the displacement of the fixed frame by adopting a position detection module;

the target value of the temperature detected by the first temperature detection unit is adjusted based on the displacement of the fixed frame.

In the prior art, only the imaging quality of the image acquisition unit is concerned with temperature control adjustment, the position of the image acquisition unit is not detected, and the situation that the imaging quality reaches the standard but the position still drifts can occur. In the embodiment of the invention, the position information can be provided in real time by detecting the position change of the fixed frame, and the position information of the fixed frame is used as a direct judgment basis for the thermal expansion degree of the fixed frame instead of an indirect judgment basis of temperature detection, so that the problem of correction coefficients existing in indirect judgment is solved, and particularly, after the alignment system of the photoetching machine is initialized and the photoetching machine system runs for a long time, the appropriate correction coefficients are not set in the indirect judgment basis. Further, a target value of temperature adjustment may be given according to the position change information of the fixing frame, and the target value of temperature adjustment may be issued to the first temperature detecting unit. When the first temperature detection unit detects that the temperature of the fixed frame is less than the target value, the temperature of the fixed frame can be increased; when the first temperature detection unit detects that the temperature of the fixed frame is greater than the target value, the fixed frame can be cooled, and therefore the imaging quality and the position accuracy of the image acquisition unit are guaranteed.

Drawings

FIG. 1 is a schematic diagram of the off-axis thermal expansion results of a lithography machine alignment system without preheating a CCD camera;

FIG. 2 is a schematic diagram showing the off-axis thermal expansion results of the CCD camera after the lithography machine alignment system is preheated for 2 hours;

FIG. 3 is a schematic diagram showing the off-axis thermal expansion result of the CCD camera after the water temperature of the water jacket of the CCD camera is reduced to 16 ℃;

FIG. 4 is a schematic diagram of an image capturing temperature control device according to an embodiment of the present invention;

FIG. 5 is a schematic top view of the image capture unit, the mounting frame and the position detection module;

FIG. 6 is a schematic diagram of another image acquisition temperature control device according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of another image-capturing temperature control device according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of another image-capturing temperature control device according to an embodiment of the present invention;

FIG. 9 is a schematic diagram of another image-capturing temperature control device according to an embodiment of the present invention;

FIG. 10 is a schematic top view of the image capturing unit and the fixing frame;

FIG. 11 is a schematic diagram of another image-capturing temperature control device according to an embodiment of the present invention;

FIG. 12 is a schematic diagram of another image-capturing temperature control device according to an embodiment of the present invention;

FIG. 13 is a schematic diagram of another embodiment of an image acquisition temperature control device;

fig. 14 is a flowchart of another image-capturing temperature-controlling method according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings, not all of them.

FIG. 1 is a schematic diagram showing the off-axis thermal expansion result of a lithography machine alignment system without preheating a CCD camera, referring to FIG. 1, after the alignment subsystem is initialized, the off-axis thermal expansion of the CCD camera is directly tested, and the maximum value of the off-axis thermal expansion of 6 CCD cameras exceeds 300nm. FIG. 2 is a schematic diagram showing the off-axis thermal expansion result of the CCD camera after the alignment system of the lithography machine is preheated for 2 hours, referring to FIG. 2, the alignment subsystem is initialized, and after the alignment subsystem is preheated for 2 hours, the maximum value of the off-axis thermal expansion of 6 CCD cameras is reduced to about 150 nm. Fig. 3 is a schematic diagram showing the off-axis thermal expansion result of the CCD camera after the water temperature of the water jacket of the CCD camera is reduced to 16 ℃, and referring to fig. 3, the maximum value of the off-axis thermal expansion of the 6 CCD cameras is controlled to be about 50nm after the water temperature of the water jacket of the CCD camera is reduced to 16 ℃.

The heating of the CCD camera has great influence on the fixed support, so that the measuring reference is changed. The problem is mainly in the following two aspects: first, the rapid temperature rise of the CCD camera at the beginning of its operation causes a large change in the positional relationship with each other due to thermal expansion. Second, the temperature of the CCD camera continues to rise during operation, and the thermal expansion takes a considerable time to stabilize. The product cannot accept the heat expansion magnitude or the heat engine time, and meanwhile, the heat generation of the CCD camera has certain influence on the interferometer measurement. It will be appreciated that devices other than CCD cameras for image acquisition can also suffer from heat generation.

Fig. 4 is a schematic diagram of an image capturing temperature control device according to an embodiment of the present invention, and referring to fig. 4, the image capturing temperature control device includes an image capturing unit 10, a fixing frame 20, a first temperature detecting unit 31, and a position detecting module 40. The image acquisition unit 10 is used for image acquisition. The fixing frame 20 is used to fix the image pickup unit 10. The first temperature sensing unit 31 is used to sense the temperature of the fixing frame 20, and the first temperature sensing unit 31 may be fixed to the fixing frame 20, or the first temperature sensing unit 31 may not be fixed to the fixing frame 20, and the first temperature sensing unit 31 is disposed adjacent to the fixing frame 20. The position detection module 40 is configured to detect a displacement of the fixed frame 20 and adjust a target value of the temperature detected by the first temperature detection unit 31 based on the displacement of the fixed frame 20.

In the prior art, only the temperature control adjustment of the imaging quality of the image acquisition unit 10 is concerned, and the position of the image acquisition unit 10 is not detected, so that the situation that the imaging quality reaches the standard but the position still drifts may occur. In the embodiment of the present invention, the position information provided in real time by detecting the position change of the fixed frame 20 is used as a direct judgment basis for the degree of thermal expansion of the fixed frame 20, rather than an indirect judgment basis of temperature detection, so that there is no problem of correction coefficient existing in indirect judgment, and particularly, after the initialization of the alignment system of the lithography machine and the long-time operation of the lithography machine system, an appropriate correction coefficient is not set in the indirect judgment basis. Further, a target value of temperature adjustment may be given according to the position change information of the fixing frame 20, and the target value of temperature adjustment may be issued to the first temperature detecting unit 31. When the first temperature detection unit 31 detects that the temperature of the fixing frame 20 is less than the target value, the fixing frame 20 may be warmed; when the first temperature detection unit 31 detects that the temperature of the fixed frame 20 is greater than the target value, the fixed frame 20 may be cooled down, thereby ensuring the imaging quality and the positional accuracy of the image capturing unit 10.

Fig. 5 is a schematic top view of the image capturing unit, the fixing frame and the position detecting module, referring to fig. 4 and 5, the fixing frame 20 includes a main board 21 and a plurality of protrusions 22 disposed on the main board 21, the protrusions 22 are located between the image capturing unit 10 and the main board 21, and the protrusions 22 are used for supporting and fixing the image capturing unit 10. A projection 22 may be provided on one main plate 21 and one image pickup unit 10 may be fixed. In another embodiment, at least two protrusions 22 may be disposed on one main plate 21, and each protrusion 22 fixes one image capturing unit 10, so that a plurality of image capturing units 10 may simultaneously acquire images of a plurality of objects (e.g., marks).

As shown in fig. 4 and 5, deformation due to thermal expansion mainly occurs on the main plate 21, and therefore, the position detection module 40 can be specifically used to detect displacement of the main plate 21 in the fixed frame 20. The first temperature detecting unit 31 may be used to detect the temperature of the protrusion 22 in the fixing frame 20, and may also be used to detect the temperature of the main plate 21 in the fixing frame 20.

Fig. 6 is a schematic diagram of another image capturing temperature control device according to an embodiment of the present invention, and referring to fig. 6, the image capturing temperature control device further includes a refrigeration unit 50 and a feedback control unit 60. The feedback control unit 60 adjusts the temperature of the refrigerating unit 50 according to the measurement result of the first temperature detecting unit 31. In the embodiment of the present invention, the feedback control unit 60 collects the temperature detected by the first temperature detection unit 31, and the feedback control unit 60 controls the refrigeration temperature of the refrigeration unit 50 according to the collected temperature, so that the refrigeration temperature of the refrigeration unit 50 approaches to the target value of the temperature detected by the first temperature detection unit 31, thereby implementing fast closed-loop feedback control. Illustratively, the target value of the temperature adjustment given according to the positional change information of the fixing frame 20 is 10 ℃. If the temperature detected by the first temperature detecting unit 31 is 9 ℃, the feedback control unit 60 controls the refrigerating temperature of the refrigerating unit 50, so that the refrigerating unit 50 heats the image capturing unit 10. If the temperature detected by the first temperature detecting unit 31 is 11 ℃, the feedback control unit 60 controls the refrigerating temperature of the refrigerating unit 50, so that the refrigerating unit 50 refrigerates the image capturing unit 10.

Alternatively, referring to fig. 6, the cooling unit 50 is provided on the image pickup unit 10. The refrigeration unit 50 controls the temperature of the image capturing unit 10, and when the image capturing unit 10 needs to be refrigerated, the heat generated by the image capturing unit 10 is taken away, and the heat generated by the image capturing unit 10 and transferred to the fixed frame 20 is reduced, so that the thermal expansion of the fixed frame 20 is slowed down or even avoided, and the position change of the image capturing unit 10 caused by the thermal expansion of the fixed frame 20 is slowed down or even avoided. When the image capturing unit 10 needs to be heated, the amount of heat generated by taking away the image capturing unit 10 is reduced, and the thermal expansion of the fixing frame 20 reaches a preset thermal expansion degree, so that the installation position reference of the image capturing unit 10 is not changed, and the position accuracy of the image capturing unit 10 is improved. In another embodiment, the refrigeration unit 50 may be further disposed on the fixed frame 20, and the refrigeration unit 50 performs temperature control on the fixed frame 20, so that when the image capturing unit 10 needs to be refrigerated, heat conducted from the image capturing unit 10 to the fixed frame 20 is taken away, and the heat in the fixed frame 20 is reduced. In yet another embodiment, one refrigeration unit 50 is disposed on the image capture unit 10 and another refrigeration unit 50 is disposed on the fixed frame 20.

Alternatively, referring to fig. 6, refrigeration unit 50 includes a semiconductor refrigerator 53, semiconductor refrigerator 53 including opposite warm 52 and cold 51 ends, cold 51 end being located between warm 52 and fixed frame image capture unit 10. In the embodiment of the present invention, the refrigeration unit 50 includes a semiconductor refrigerator 53, the cold end 51 of the semiconductor refrigerator 53 is adjacent to the image capturing unit 10, the cold end 51 of the semiconductor refrigerator 53 takes away heat generated by the image capturing unit 10, reduces the temperature of the image capturing unit 10, and implements temperature adjustment of the image capturing unit 10, thereby reducing heat generated by the image capturing unit 10 and transferred to the fixed frame 20, and implementing temperature adjustment of the fixed frame 20. In other embodiments, when the refrigeration unit 50 is disposed on the fixed frame 20, the cold end 51 may also be located between the hot end 52 and the fixed frame 20 to carry away heat conducted from the image capturing unit 10 to the fixed frame 20, thereby reducing the heat in the fixed frame 20.

Fig. 7 is a schematic diagram of another image capturing temperature control device according to an embodiment of the present invention, and referring to fig. 7, the image capturing temperature control device further includes a heat conducting unit 70, where the heat conducting unit 70 is disposed on a side of the hot end 52 away from the cold end 51. In the embodiment of the present invention, the image capturing temperature control device further includes a heat guiding unit 70, and the heat guiding unit 70 is disposed on one side of the hot end 52 of the refrigeration unit 50 and is used for taking away heat of the hot end 52 of the refrigeration unit 50. That is, the heat generated by the image capturing unit 10 is absorbed by the cold end 51 of the refrigeration unit 50, transmitted from the cold end 51 of the refrigeration unit 50 to the hot end 52 of the refrigeration unit 50, and further transmitted to the outside of the refrigeration unit 50 by the heat conducting-out unit 70.

Alternatively, referring to fig. 4 and 5, the position detection module 40 includes an X-direction laser displacement sensor 41 and a Y-direction laser displacement sensor 42. Here, the X-direction laser displacement sensor 41 is configured to detect a displacement of the fixed frame 20 in the X direction, that is, a change in position of the fixed frame 20 in the X direction. The Y-direction laser displacement sensor 42 is used to detect displacement of the fixed frame 20 in the Y direction, that is, to detect a change in position of the fixed frame 20 in the Y direction. The X-direction and the Y-direction may be perpendicular to each other. In other embodiments, the position detection module 40 may include only one of the X-direction laser displacement sensor 41 and the Y-direction laser displacement sensor 42.

Fig. 8 is a schematic view of another image capturing temperature control device according to an embodiment of the present invention, and referring to fig. 8, a fixing frame 20 includes a main board 21 and a plurality of protrusions 22 disposed on the main board 21, and the protrusions 22 are disposed between the image capturing unit 10 and the main board 21. The image acquisition temperature control device comprises a plurality of image acquisition units 10 and a plurality of first temperature detection units 31, wherein the number of any two of the image acquisition units 10, the bulges 22 and the first temperature detection units 31 is equal. In the embodiment of the present invention, one first temperature detection unit 31 is provided for each image pickup unit 10, so that the first temperature detection unit 31 can detect the temperature of the bosses 22 for carrying the image pickup unit 10, so that the thermal expansion of each boss 22 (i.e., the thermal expansion of the main plate 21 in the vicinity of the first temperature detection unit 31) can be detected and controlled in a targeted manner, and a target value of temperature adjustment is given based on the positional change information. Thereby solving the problem of the change in the reference due to the thermal expansion of the image pickup units 10 with respect to each other.

Exemplarily, as shown in fig. 8, the image capturing temperature control device includes 2 image capturing units 10, 2 protrusions 22, and 2 first temperature detecting units 31, which is not limited thereto.

Further, as shown in fig. 8, the image capturing temperature control device includes a plurality of cooling units 50, a plurality of feedback control units 60, and a plurality of heat deriving units 70, and the number of any two of the image capturing units 10, the protrusions 22, the first temperature detecting units 31, the cooling units 50, the feedback control units 60, and the heat deriving units 70 is equal.

Illustratively, as shown in fig. 8, the image capture unit 10 may be used to acquire an image of a mark 84 on a glass substrate. The plurality of image pickup units 10 may respectively acquire images of the plurality of marks 84 on the glass substrate.

Optionally, referring to fig. 8, the image capturing temperature control device further includes a water cooling plate 81, a circulating water control device 82, and a second temperature detecting unit 32. The water cooling plate 81 is located on one side of the fixed frame 20 far away from the image acquisition unit 10, and the water cooling plate 81 is connected with a water path of the circulating water control device 82. The second temperature detecting unit 32 is used for detecting the temperature of the water cooling plate 81. In the embodiment of the present invention, a water-cooling plate 81 is further disposed on a side of the fixed frame 20 away from the image acquisition unit 10, a second temperature detection unit 32 for detecting a temperature of the water-cooling plate 81 is disposed on a side close to the water-cooling plate 81, and a circulating water control device 82 controls a target value of a detection temperature of the second temperature detection unit 32 to be the same as target values of detection temperatures of temperature detection units at other positions, so as to ensure temperature uniformity of a workpiece stage area on the lower surface of the main board 21, and reduce or even avoid an influence on interferometer measurement caused by a difference between a temperature of the image acquisition unit 10 and an ambient temperature.

Optionally, referring to fig. 8, the image capturing temperature control device further includes an image capturing assembly housing 83, the image capturing unit 10 and the fixing frame 20 are located in the image capturing assembly housing 83, and the image capturing assembly housing 83 blocks an opening of the image capturing assembly housing 83.

Fig. 9 is a schematic view of another image capturing temperature control device according to an embodiment of the present invention, fig. 10 is a schematic view of a top structure of an image capturing unit and a fixing frame, and referring to fig. 9 and 10, a flow passage (not shown in fig. 9 and 10) is formed in the fixing frame 20, that is, a pipeline for water flow is disposed in the fixing frame 20. Refrigeration unit 50 includes a semiconductor refrigerator 53 and a cold side heat exchanger 54. Semiconductor refrigerator 53 includes opposite warm and cold ends 52 and 51, cold end 51 being located between warm end 52 and cold end heat exchanger 54. Cold side heat exchanger 54 is in waterway connection with the flow channels of fixed frame 20. In the embodiment of the present invention, a flow passage for circulating water is formed inside the fixing frame 20 by punching. Cold side heat exchanger 54 is in waterway connection with the flow channels of fixed frame 20. Cold end heat exchanger 54 is adjacent to cold end 51 of semiconductor refrigerator 53 such that cold end 51 of semiconductor refrigerator 53 refrigerates the water flow in cold end heat exchanger 54, and the cold water in cold end heat exchanger 54 passes into the flow channel of fixed frame 20 to carry away the heat conducted by image capturing unit 10 to fixed frame 20, thereby reducing the heat in fixed frame 20 and adjusting the temperature of fixed frame 20.

Illustratively, referring to fig. 9 and 10, the protrusions 22 in the fixed frame 20 define flow channels.

Fig. 11 is a schematic diagram of another image capturing temperature control device according to an embodiment of the present invention, and referring to fig. 11, the feedback control unit 60 adjusts the temperature of the cooling unit 50 according to the measurement result of the first temperature detecting unit 31. Specifically, the feedback control unit 60 adjusts the cold output of the cold end 51 of the semiconductor refrigerator 53 according to the measurement result of the first temperature detection unit 31, so as to control the refrigeration temperature of the cold end heat exchanger 54, and make the refrigeration temperature of the refrigeration unit 50 approach the target value of the temperature detected by the first temperature detection unit 31, thereby implementing fast closed-loop feedback control.

Fig. 12 is a schematic diagram of another image capturing temperature control device according to an embodiment of the present invention, and referring to fig. 12, the image capturing temperature control device further includes a heat guiding unit 70, where the heat guiding unit 70 is disposed on a side of the hot end 52 away from the cold end 51. The heat guiding-out unit 70 is disposed at the hot side 52 of the refrigeration unit 50, and is used for taking away heat of the hot side 52 of the refrigeration unit 50.

Illustratively, referring to fig. 12, heat removal unit 70 includes a warm side heat exchanger that shares the same water inlet as cold side heat exchanger 54. Namely, one path of circulating water with fixed temperature is divided into two parts, and one part of circulating water enters the cold end heat exchanger 54 to realize cold water preparation; the other part enters the hot side heat exchanger to finish the heat radiation of the semiconductor refrigerator 53.

Fig. 13 is a schematic diagram of another image capturing temperature control device according to an embodiment of the present invention, and referring to fig. 13, the image capturing temperature control device includes a plurality of image capturing units 10, a plurality of protrusions 22, and a plurality of first temperature detecting units 31, where the number of any two of the image capturing units 10 and the first temperature detecting units 31 of the protrusions 22 is equal. In the embodiment of the present invention, the image capturing temperature control device may further include a plurality of refrigeration units 50, the number of the refrigeration units 50 is equal to the number of the protrusions 22 in the fixed frame 20, each protrusion 22 is correspondingly provided with one refrigeration unit 50 for refrigerating, and cold water circulating in the cold-end heat exchanger 54 in the refrigeration unit 50 only passes through a flow channel of the corresponding protrusion 22.

Exemplarily, referring to fig. 1 to 13, the image pickup unit 10 includes a CCD camera or a CMOS camera. The first temperature detection unit 31 and the second temperature detection unit 32 each include a temperature sensor. The feedback control unit 60 includes a semiconductor chiller controller.

The embodiment of the invention also provides a photoetching machine which comprises the image acquisition temperature control device in the embodiment. The lithographic machine may also comprise a workpiece table, a lithographic projection objective, etc., as is well known in the art.

Based on the same technical concept, an embodiment of the present invention further provides an image capturing temperature control device method based on the image capturing temperature control device, including:

and S110, detecting the temperature of the fixed frame by adopting a first temperature detection unit.

And S120, detecting the displacement of the fixed frame by adopting a position detection module.

And S130, adjusting a target value of the temperature detected by the first temperature detection unit based on the displacement of the fixed frame.

The image acquisition temperature control device method provided by the embodiment of the invention is based on the image acquisition temperature control device in the embodiment. The temperature of the fixed frame is detected by the first temperature detection unit, the displacement of the fixed frame is detected by the position detection module, the target value of the temperature detected by the first temperature detection unit is adjusted based on the displacement of the fixed frame, so that the position information of the fixed frame is used as a direct judgment basis for the thermal expansion degree of the fixed frame, and the target value of temperature adjustment is given according to the position change information of the fixed frame, thereby ensuring the imaging quality and the position accuracy of the image acquisition unit.

It is to be noted that the foregoing description is only exemplary of the invention and that the principles of the technology may be employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious modifications, rearrangements, combinations and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (11)

1. An image acquisition temperature control device, comprising:

the image acquisition unit and the fixing frame are used for fixing the image acquisition unit;

a first temperature detection unit for detecting a temperature of the fixing frame;

and the position detection module is used for detecting the displacement of the fixed frame and adjusting the target value of the temperature detected by the first temperature detection unit based on the displacement of the fixed frame.

2. The image capturing temperature control device according to claim 1, further comprising a cooling unit and a feedback control unit that adjusts a temperature of the cooling unit based on a measurement result of the first temperature detection unit.

3. The image capturing temperature control device of claim 2, wherein the cooling unit is disposed on the fixed frame and/or the image capturing unit.

4. The image capturing temperature control device of claim 3, wherein the refrigeration unit includes a semiconductor refrigerator, the semiconductor refrigerator including opposite hot and cold ends, the cold end being located between the hot end and the fixed frame when the refrigeration unit is disposed on the fixed frame; when the refrigeration unit is arranged on the image acquisition unit, the cold end is positioned between the hot end and the image acquisition unit.

5. The image acquisition temperature control device of claim 4, further comprising a heat deriving unit disposed on a side of the hot end away from the cold end.

6. The image acquisition temperature control device according to claim 2, wherein the fixed frame is provided with a flow passage; the refrigeration unit comprises a semiconductor refrigerator and a cold-end heat exchanger;

the semiconductor refrigerator comprises a hot end and a cold end which are opposite, and the cold end is positioned between the hot end and the cold end heat exchanger; and the cold end heat exchanger is connected with the runner water way.

7. The image acquisition temperature control device of claim 1, wherein the position detection module comprises an X-direction laser displacement sensor and/or a Y-direction laser displacement sensor.

8. The image capturing temperature control device of claim 1, wherein the fixing frame includes a main plate and a plurality of protrusions disposed on the main plate, the protrusions being located between the image capturing unit and the main plate;

the image acquisition temperature control device comprises a plurality of image acquisition units and a plurality of first temperature detection units;

the number of any two of the image acquisition unit, the protrusion and the first temperature detection unit is equal.

9. The image acquisition temperature control device according to claim 1, further comprising a water cooling plate, a circulating water control device and a second temperature detection unit, wherein the water cooling plate is positioned on one side of the fixed frame away from the image acquisition unit and is connected with the circulating water control device in a water way;

and the second temperature detection unit is used for detecting the temperature of the water cooling plate.

10. A lithography machine comprising an image acquisition temperature control device according to any one of claims 1 to 9.

11. An image capturing temperature control device method based on the image capturing temperature control device according to any one of claims 1 to 9, comprising:

detecting the temperature of the fixed frame by adopting a first temperature detection unit;

detecting the displacement of the fixed frame by adopting a position detection module;

the target value of the temperature detected by the first temperature detection unit is adjusted based on the displacement of the fixed frame.

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