CN115685624A - Reflector plate, backlight module and preparation method thereof - Google Patents
Reflector plate, backlight module and preparation method thereof Download PDFInfo
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- CN115685624A CN115685624A CN202211386735.3A CN202211386735A CN115685624A CN 115685624 A CN115685624 A CN 115685624A CN 202211386735 A CN202211386735 A CN 202211386735A CN 115685624 A CN115685624 A CN 115685624A
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- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 239000011248 coating agent Substances 0.000 claims abstract description 36
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 7
- 239000004698 Polyethylene Substances 0.000 claims description 6
- -1 polyethylene Polymers 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 229920000098 polyolefin Polymers 0.000 claims description 6
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 6
- 239000004800 polyvinyl chloride Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007493 shaping process Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000008602 contraction Effects 0.000 abstract description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 238000005086 pumping Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 230000020169 heat generation Effects 0.000 description 1
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- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Abstract
The embodiment of the application discloses a reflector plate, a backlight module and a preparation method of the backlight module, wherein the reflector plate comprises a heat shrinkage substrate and a reflective coating, the reflective coating is arranged on one side surface of the heat shrinkage substrate, and the heat shrinkage rate of a preparation material of the heat shrinkage substrate is greater than or equal to 10%; the thermal contraction substrate can shrink when being heated, and the reflecting sheet with the larger thermal contraction rate is provided, so that when the reflecting sheet is attached to a non-luminous device, the contraction degree of the reflecting sheet after being heated is improved, and the phenomenon that the bulge at the non-luminous device is uneven is eliminated or relieved.
Description
Technical Field
The application relates to the technical field of display, in particular to a reflector plate, a backlight module and a preparation method of the backlight module.
Background
In order to make the light of the backlight more uniform in the plane, the reflectivity is generally increased by attaching a reflective sheet. However, the driving chips driven by the AM are uniformly distributed in the plane, and are generally black, which may affect the whole optics of the lamp panel, and the non-luminescent devices are displayed as dark clusters, and need to be shielded by a reflector plate; since the non-light emitting device is at least 30 micrometers higher than the light emitting device, the reflective sheet at the non-light emitting device has obvious uneven bulge, thereby affecting the light reflection effect.
Therefore, the existing backlight module has the technical problem that the reflector plate at the position of the non-luminous device is uneven.
Disclosure of Invention
The embodiment of the application provides a reflector plate, a backlight module and a backlight module preparation method, and can solve the technical problem that the reflector plate at the position of a non-luminous device of the existing backlight module is uneven in bulge.
The embodiment of the application provides a reflector plate, includes:
a heat-shrinkable substrate;
a reflective coating disposed on one side surface of the heat-shrinkable substrate;
wherein the heat shrinkage of the material from which the heat-shrinkable substrate is made is greater than or equal to 10%.
Optionally, in some embodiments of the present application, the heat shrinkable substrate is made of at least one of a multi-layer co-extruded polyolefin, polyvinyl chloride, and polyethylene.
Optionally, in some embodiments of the present application, the material for preparing the reflective coating further includes a flexible resin material.
The embodiment of the application provides a backlight unit, includes:
a substrate;
the LED lamp and the non-light-emitting device are arranged on the same side surface of the substrate;
the reflector plate according to any one of the above embodiments, wherein the reflector plate is disposed on a side of the non-light emitting device away from the substrate;
the reflecting sheet covers the LED lamp and the non-light-emitting device in the film thickness direction, and a gap between the reflecting sheet and the non-light-emitting device is smaller than or equal to a preset value.
Optionally, in some embodiments of the present application, at least one vacuum hole is disposed on the substrate, the vacuum hole is disposed through the substrate, and the vacuum hole is disposed away from the LED lamp and the non-light emitting device in the film thickness direction.
The embodiment of the application provides a backlight module preparation method, which comprises the following steps:
providing a substrate;
preparing a non-luminous device on the surface of one side of the substrate, and transferring and fixing the LED lamp on the same side;
providing a reflector plate as described in any of the above embodiments, and attaching the reflector plate to the whole surface of the non-light emitting device away from the substrate;
heating the reflector plate to a first preset temperature to enable the reflector plate to be shrunk and attached to the surface of the non-light-emitting device;
and cooling the reflector plate to a second preset temperature, and solidifying and shaping the reflector plate.
Optionally, in some embodiments of the present application, the first preset temperature ranges from 80 ℃ to 200 ℃, and the second preset temperature ranges from 20 ℃ to 70 ℃.
Optionally, in some embodiments of the present application, the method further includes: and forming at least one vacuum hole penetrating through the substrate in a mechanical cutting mode on the substrate, wherein the vacuum hole is arranged in the direction of the film thickness and avoids the non-light-emitting device and the LED lamp.
Optionally, in some embodiments of the present application, in the step of providing the reflective sheet, the step of: the reflective coating of the reflector plate is prepared by a magnetron sputtering method.
Optionally, in some embodiments of the present application, the step of attaching the reflective sheet to the whole surface of the non-light emitting device away from the substrate further includes: and adopting glue with the viscosity of more than or equal to 6000 mPa.s to attach the whole surface of the reflector plate to one side of the non-light-emitting device, which is far away from the substrate.
Has the beneficial effects that: by adopting the reflector plate with the thermal shrinkage rate of more than or equal to 10%, when the reflector plate is attached to the non-luminous device, the reflector plate is heated to shrink, so that the reflector plate is attached to the non-luminous device more tightly, and the distance between the reflector plate and the non-luminous device is smaller, thereby relieving the technical problem that the reflector plate at the position of the non-luminous device bulges unevenly in the conventional backlight module.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of a reflector sheet provided herein;
fig. 2 is a first cross-sectional view of a backlight module provided in the present application;
FIG. 3 is a second cross-sectional view of a backlight module provided in the present application
FIG. 4 is a third schematic cross-sectional view of a backlight module provided in the present application;
FIG. 5 is a flow chart of the steps of a reflector provided herein;
FIG. 6 is a schematic flow diagram of a reflector provided herein;
fig. 7A to 7C are flowcharts illustrating steps of the backlight module provided in the present application;
fig. 8 is a schematic flow chart of a backlight module provided in the present application.
Description of reference numerals:
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
Referring to fig. 1, the reflective sheet 40 provided in the present application includes a heat-shrinkable substrate 401 and a reflective coating 402, wherein the reflective coating 402 is disposed on one side surface of the heat-shrinkable substrate 401, and a heat shrinkage of a material for preparing the heat-shrinkable substrate 401 is greater than or equal to 10%.
Wherein the reflective coating 402 is used to reflect light.
It is understood that the heat shrinkable substrate 401 may shrink when heated, for example, when applied to the backlight module 1, the reflective sheet 40 may be more closely attached to the non-light emitting device 30.
In the embodiment, by providing the reflective sheet 40 with a larger thermal shrinkage ratio, the shrinkage degree of the reflective sheet 40 after being heated is increased during the bonding, so that the uneven bulging phenomenon at the non-light emitting device 30 is eliminated or alleviated.
The technical solution of the present application will now be described with reference to specific embodiments.
The embodiment of the present application is only illustrated by taking an example of the application of the reflective sheet 40 in the backlight module 1, and the inventive concept of the present application is also applicable to other application scenarios that adopt the reflective sheet 40 and have an uneven bulge problem, and the reflective sheet 40 can be applied to the application scenarios, so that the uneven bulge problem is alleviated.
In addition, the temperature, size, processing technology, selected materials, etc. of the present application are only described in the best or preferred embodiments, and other preferred or less preferred embodiments also belong to the protection scope of the present invention, and are not described herein again.
In one embodiment, the heat shrinkable substrate 401 is made of at least one of a multi-layer co-extruded polyolefin, polyvinyl chloride, and polyethylene.
And the heat shrinkage rates of the multilayer co-extruded polyolefin, the polyvinyl chloride and the polyethylene are all higher than that of the PET material.
In this embodiment, by limiting the preparation material of the heat shrinkable substrate 401, not only the heat shrinkable substrate 401 has a higher heat shrinkage rate, but also the material can keep good flatness when heated to shrink, thereby improving the uniformity of the reflected light of the reflective sheet 40.
In one embodiment, the reflective coating 402 is made of a material that further includes a flexible resin material.
Wherein the reflective coating 402 comprises a highly reflective material such as titanium dioxide.
It will be appreciated that the reflective coating 402, by comprising a flexible resin material, can be made flexible while having a certain heat shrinkage rate, and when the heat-shrinkable substrate 401 shrinks, the reflective coating 402 also shrinks to some extent, thereby further reducing the risk of the reflective coating 402 peeling off the heat-shrinkable substrate 401 when heated to shrink.
In this embodiment, the reflective coating 402 is doped with a flexible resin material, so that the reflective coating 402 shrinks in the same direction as the heat shrinkable substrate 401 when being heated, thereby avoiding the displacement and detachment of the film layer between the reflective coating 402 and the heat shrinkable substrate 401.
Referring to fig. 2 and 3, a backlight module 1 provided in an embodiment of the present application includes a substrate 10, an LED lamp 20, a non-light emitting device 30, and a reflective sheet 40 according to any of the embodiments, where the LED lamp 20 and the non-light emitting device 30 are disposed on the same side surface of the substrate 10, and the reflective sheet 40 is disposed on a side of the non-light emitting device 30 away from the substrate 10, where the reflective sheet 40 covers the LED lamp 20 and the non-light emitting device 30 in a film thickness direction, and a gap between the reflective sheet 40 and the non-light emitting device 30 is smaller than or equal to a predetermined value.
Referring to fig. 3, the center distance between adjacent LED lamps is d1, the maximum distance from the edge of the bulge of the reflector plate at any LED lamp to the side of the LED lamp near the bulge edge is d2, the predetermined value is d2, and d2 is less than or equal to 4.5%.
The non-light emitting device 30 may be a driving chip, a resistor, and the like, where the resistor is used to reduce a voltage drop and achieve a voltage stabilizing or current stabilizing effect.
It is understood that when d2 is greater than 4.5%; the application of the reflector plate and the backlight module set in any embodiment enables d2 to be less than or equal to 4.5 percent, so that the problem that the reflector plate bulges unevenly at the position of the non-light-emitting device is relieved.
In the present embodiment, with the reflective sheet 40 of any of the above embodiments, after being heated and shrunk, the gap between the reflective sheet 40 and the non-light emitting device 30 can be smaller than or equal to a preset value, so that the phenomenon of uneven bulging is not obvious or eliminated.
In one embodiment, the substrate 10 is not limited in kind to glass, printed circuit board, flexible circuit board.
In one embodiment, the adjacent LED lamps 20 may be equally spaced, thereby further improving the uniformity of the emitted light.
In one embodiment, the non-light emitting devices 30 and the light emitting devices may be of any type, number, or size without limitation.
The light emitting device may be the LED lamp 20, or may be another light emitting element.
The non-light emitting device 30 may be a driving chip, a resistor, or other devices.
The length and width of the LED lamp 20 may be 300 micrometers by 300 micrometers, and the length and width of the LED lamp 20 may also be 1000 micrometers by 500 micrometers.
In an embodiment, the driving method may be, without limitation, AM TFT driving, AM Micro IC, or PM driving.
In one embodiment, the reflector 40 may be hollowed out in any manner without limitation.
The holes 60 may be mechanically drilled, or the holes 60 may be laser drilled.
The heat generated by the mechanical hole digging 60 is less than that generated by the laser hole digging 60, which is beneficial to reducing the deformation of the reflector plate 40 and improving the production yield.
In one embodiment, the reflective sheet 40 may be attached by a manual method or a mechanical method without limitation.
In one embodiment, referring to fig. 4, at least one vacuum hole 50 is disposed on the substrate 10, the vacuum hole 50 is disposed through the substrate 10, and the vacuum hole 50 is disposed to avoid the LED lamp 20 and the non-light emitting device 30 in the film thickness direction.
The vacuum holes 50 are used for being matched with a vacuum-pumping process to enable gas to be pumped out from the vacuum holes 50, negative pressure is formed on one side, close to the substrate 10, of the reflector sheet 40, and the reflector sheet 40 is tightly attached to the non-light-emitting device 30 through the negative pressure.
The vacuum hole 50 in the substrate 10 is not limited to a vacuum pumping method.
It can be understood that, by providing the vacuum holes 50 on the substrate 10, the reflector 40 and the non-light emitting device 30 below can be more closely attached by utilizing the thermal shrinkage of the reflector 40 and the negative pressure adsorption of the vacuum holes 50, so as to alleviate the problem that the non-light emitting device 30 is uneven due to the height difference between the non-light emitting device 30 and the light emitting device being greater than 30 micrometers.
In the embodiment, at least one vacuum hole 50 is formed in the substrate 10, and a negative pressure is formed at the vacuum hole 50 by a vacuum pumping manner, so that the reflective sheet 40 can be better attached to the non-light emitting device 30, and the uneven bulge between the reflective sheet 40 and the non-light emitting device 30 is further alleviated.
In one embodiment, the reflective sheet 40 of any of the above embodiments has the function of shielding the devices below.
It can be understood that, for any device that needs to be shielded, the above-mentioned reflective sheet 40 can be used for shielding, and similarly, the reflective sheet 40 can also be a membrane with other functions or a membrane with only shielding effect; through the limitation to the material, the material has higher heat shrinkage rate and better flatness after heat shrinkage, thereby preventing the bulge between the reflector plate 40 and the lower device from being uneven.
In this embodiment, the reflective sheet 40 has a wide application range, and can be used to shield various devices in different application scenarios.
Referring to fig. 5 and 6, a method for manufacturing a reflector 40 according to an embodiment of the present disclosure includes:
s1: raising a heat-shrinkable substrate 401;
s2: depositing a layer of high-reflection material to prepare a reflection coating 402;
s3: carrying out pressing and flattening operation on the reflective coating 402 to prepare a reflective mother board;
s4: the reflective mother substrate is divided to form a plurality of reflective sheets 40.
Wherein the high reflective material may be titanium dioxide.
After the reflective sheet 40 is prepared, holes 60 may be dug in a partial region of the reflective sheet 40, and a release film 70 may be attached to cover the reflective sheet 40, thereby protecting the reflective sheet 40.
In one embodiment, the step of depositing a layer of highly reflective material to produce the reflective coating 402 further comprises: and depositing a layer of high-reflection material by adopting a magnetron sputtering mode to prepare the reflection coating 402.
The compactness of the reflective coating 402 prepared by the magnetron sputtering method is better than that of the reflective coating prepared by the mechanical pressing method. And is more uniform.
It can be understood that the magnetron sputtering method deposits the high reflective material on the substrate more uniformly and tightly, prevents the reflective sheet 40 from shrinking, and prevents the reflective coating 402 and the heat shrinkable substrate 401 from relative displacement, thereby avoiding the reflective coating 402 from falling off.
In this embodiment, the process for preparing the reflective coating 402 is limited to magnetron sputtering, which improves the bonding force between the reflective coating 402 and the heat-shrinkable substrate 401, so that the reflective coating 402 is more uniformly and tightly disposed, and the problem that the reflective coating 402 falls off due to heat shrinkage of the reflective sheet 40 is avoided.
In one embodiment, the step of dividing the reflective motherboard further comprises: and cutting the reflection mother board in a mechanical cutting mode.
Wherein, the cutting rate, moving rate, material, etc. of the mechanical cutting can be selected or limited, so as to further reduce the heat generated by the mechanical cutting and prevent the thermal contraction substrate 401 from being deformed or displaced by heat.
It can be understood that, since the heat shrinkable substrate 401 shrinks when being heated, the mechanical cutting is not easy to deform or displace the heat shrinkable substrate 401 greatly compared to the laser cutting, which can improve the production yield.
In the embodiment, the cutting mode is limited to mechanical cutting with low heat generation, so that the yield is further improved.
Referring to fig. 7A to 7C and fig. 8, a method for manufacturing a backlight module 1 according to an embodiment of the present disclosure includes:
s10: providing a substrate 10;
s20: preparing a non-light emitting device 30 on the surface of one side of the substrate 10, and transferring and fixing the LED lamp 20 on the same side;
s30: providing a reflective sheet 40 according to any of the above embodiments, and attaching the reflective sheet 40 to the whole surface of the non-light emitting device 30 away from the substrate 10;
s40: heating the reflector 40 to a first preset temperature to make the reflector 40 shrink and adhere to the surface of the non-light-emitting device 30;
s50: and cooling the reflector plate 40 to a second preset temperature, and solidifying and shaping the reflector plate 40.
In one embodiment, the first preset temperature is in the range of 80 ℃ to 200 ℃ and the second preset temperature is in the range of 20 ℃ to 70 ℃.
The first preset temperature is a thermal shrinkage temperature, and the second preset temperature is a cooling and shaping temperature.
Wherein, when the preparation material of the heat shrinkable substrate 401 is multi-layer co-extruded polyolefin, the heat shrinkage rate is about 75%, and the heat shrinkage temperature range is 130 ℃ to 150 ℃.
Wherein, when the material of the heat-shrinkable substrate 401 is polyvinyl chloride, the heat shrinkage rate ranges from about 35% to 45%, and the heat-shrinkable temperature ranges from 80 ℃ to 100 ℃.
Wherein, when the material of the heat-shrinkable substrate 401 is polyethylene, the heat shrinkage rate is about 10% to 30%, and the heat-shrinking temperature range is 200 ℃.
It can be understood that the substrate of the existing reflective sheet 40 is usually made of PET material, and the heat shrinkage rate thereof is only 1% to 2%, and meanwhile, the PET material has the problem of uneven film layer after heat shrinkage; the heat-shrinkable substrate 401 prepared by multilayer co-extrusion of polyolefin, polyvinyl chloride and polyethylene has high heat shrinkage rate, and the film layer has good smoothness after heat shrinkage, so that the phenomenon of uneven reflection of the reflector plate 40 is avoided.
In this embodiment, the material, the thermal shrinkage rate, the thermal shrinkage temperature, and the cooling setting temperature of the thermal shrinkage substrate 401 are limited, so that the adhesion tightness between the reflector 40 and the non-light emitting device 30 below is further improved, and the problem of uneven film after the thermal shrinkage of the reflector 40 is alleviated.
In one embodiment, further comprising: at least one vacuum hole 50 is formed through the substrate 10 by mechanical dicing, and the vacuum hole 50 is provided so as to be spaced apart from the non-light emitting device 30 and the LED lamp 20 in the film thickness direction.
In one embodiment, the step of providing the reflective sheet 40 includes: the reflective coating 402 of the reflective sheet 40 is prepared by a magnetron sputtering method.
In one embodiment, the step of attaching the reflective sheet 40 to the non-light emitting device 30 on the side away from the substrate 10 includes: and the whole surface of the reflector plate 40 is attached to one side of the non-light-emitting device 30 far away from the substrate by adopting glue with the viscosity of more than or equal to 6000 mPa.
In this embodiment, the reflective sheet 40 and the LED lamp 20 are fixed by a high-strength adhesive, so that when the reflective sheet 40 shrinks, the reflective coating 402, the heat shrinkable substrate 401, the reflective sheet 40 and the LED lamp 20 do not move relative to each other, and the risk of the reflective coating 402 falling off and the risk of the reflective sheet 40 moving are reduced.
In any of the embodiments of the present application, the holes 60 of the reflector 40 are designed relative to the position of the non-light emitting device 30, so that the number of the holes 60 of the reflector 40 can be reduced, and the uniformity of the light of the lamp panel can be enhanced; and secondly, solving the problem of the taste dark clusters at the non-light-emitting device 30, wherein the taste dark clusters are caused by the fact that the non-light-emitting device 30 is generally black, and the black light absorption causes the display to be dark clusters. The uniformity of the lamp plate light is fundamentally improved, the taste is improved, and the possibility of large-scale mass production of backlight film groups is improved.
The reflector plate provided by the embodiment of the application comprises a heat-shrinkable substrate and a reflective coating, wherein the reflective coating is arranged on one side surface of the heat-shrinkable substrate, and the heat shrinkage of a preparation material of the heat-shrinkable substrate is greater than or equal to 10%; the thermal contraction substrate can contract when being heated, and the contraction degree of the reflecting sheet after being heated is improved by providing the reflecting sheet with the larger thermal contraction rate when being attached, so that the phenomenon of unevenness of bulges at the non-luminous device is eliminated or relieved.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The reflective sheet and the manufacturing method thereof, the backlight module and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principles and embodiments of the present application are explained in the present application by applying specific examples, and the description of the embodiments above is only used to help understanding the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A reflective sheet, comprising:
a heat-shrinkable substrate;
a reflective coating disposed on one side surface of the heat-shrinkable substrate;
wherein the heat shrinkage of the material from which the heat-shrinkable substrate is made is greater than or equal to 10%.
2. The reflective sheet of claim 1, wherein the heat shrinkable substrate is made of at least one of a multi-layer co-extruded polyolefin, polyvinyl chloride, and polyethylene.
3. The reflective sheet of claim 1, wherein said reflective coating is made of a material further comprising a flexible resin material.
4. A backlight module, comprising:
a substrate;
the LED lamp and the non-light-emitting device are arranged on the same side surface of the substrate;
the reflective sheet as claimed in any one of claims 1 to 3, which is disposed on a side of the non-light emitting device away from the substrate;
the reflecting sheet covers the LED lamp and the non-light-emitting device in the film thickness direction, and a gap between the reflecting sheet and the non-light-emitting device is smaller than or equal to a preset value.
5. The backlight module according to claim 4, wherein at least one vacuum hole is provided on the substrate, the vacuum hole being provided through the substrate, the vacuum hole being provided to avoid the LED lamp and the non-light emitting device in a film thickness direction.
6. A method for manufacturing a backlight module is characterized by comprising the following steps:
providing a substrate;
preparing a non-luminous device on the surface of one side of the substrate, and transferring and fixing the LED lamp on the same side;
providing a reflective sheet as claimed in any one of claims 1 to 3, attaching the reflective sheet to the entire surface of the non-light emitting device away from the substrate;
heating the reflector plate to a first preset temperature to enable the reflector plate to be shrunk and attached to the surface of the non-light-emitting device;
and cooling the reflector plate to a second preset temperature, and solidifying and shaping the reflector plate.
7. The method of claim 6, wherein the first predetermined temperature is in a range of 80 ℃ to 200 ℃ and the second predetermined temperature is in a range of 20 ℃ to 70 ℃.
8. The method of claim 6, further comprising: and forming at least one vacuum hole penetrating through the substrate in a mechanical cutting mode on the substrate, wherein the vacuum hole is arranged in the direction of the film thickness to avoid the non-light-emitting device and the LED lamp.
9. The method of claim 6, wherein the step of providing a reflective sheet comprises: the reflective coating of the reflector plate is prepared by a magnetron sputtering method.
10. The method of claim 6, wherein the step of attaching the reflective sheet to the non-light emitting device over the entire surface of the non-light emitting device away from the substrate further comprises: and adopting glue with the viscosity of more than or equal to 6000 mPa.s to attach the whole surface of the reflector plate to one side of the non-light-emitting device, which is far away from the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211386735.3A CN115685624A (en) | 2022-11-07 | 2022-11-07 | Reflector plate, backlight module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211386735.3A CN115685624A (en) | 2022-11-07 | 2022-11-07 | Reflector plate, backlight module and preparation method thereof |
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| CN115685624A true CN115685624A (en) | 2023-02-03 |
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| CN202211386735.3A Pending CN115685624A (en) | 2022-11-07 | 2022-11-07 | Reflector plate, backlight module and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08262209A (en) * | 1995-03-27 | 1996-10-11 | Mitsui Toatsu Chem Inc | Reflecting body and reflecting member using that and its production |
| CN106449819A (en) * | 2016-09-14 | 2017-02-22 | 中国电子科技集团公司第四十八研究所 | Flexible solar cell module and preparation method and application thereof |
| KR20210048688A (en) * | 2019-10-24 | 2021-05-04 | 엘지디스플레이 주식회사 | Display device, liquid crystal display device and multi-panel display device |
-
2022
- 2022-11-07 CN CN202211386735.3A patent/CN115685624A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08262209A (en) * | 1995-03-27 | 1996-10-11 | Mitsui Toatsu Chem Inc | Reflecting body and reflecting member using that and its production |
| CN106449819A (en) * | 2016-09-14 | 2017-02-22 | 中国电子科技集团公司第四十八研究所 | Flexible solar cell module and preparation method and application thereof |
| KR20210048688A (en) * | 2019-10-24 | 2021-05-04 | 엘지디스플레이 주식회사 | Display device, liquid crystal display device and multi-panel display device |
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