CN115682730B - Chip vacuum pressure sintering furnace and control method thereof - Google Patents
Chip vacuum pressure sintering furnace and control method thereof Download PDFInfo
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- CN115682730B CN115682730B CN202211717427.4A CN202211717427A CN115682730B CN 115682730 B CN115682730 B CN 115682730B CN 202211717427 A CN202211717427 A CN 202211717427A CN 115682730 B CN115682730 B CN 115682730B
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Abstract
The invention relates to the technical field of product pressure sintering processing, and provides a chip vacuum pressure sintering furnace and a control method thereof. According to the chip vacuum pressure sintering furnace and the control method thereof, before the first pressure head and the second pressure head are matched for hot pressing, the first sealing element and the second sealing element are matched to form a sealing structure in advance on the outer sides of the first pressure head and the second pressure head, so that the oxygen content is controlled to protect a workpiece; the elastic support mechanism can provide elastic support for the second sealing piece towards the direction of the first sealing piece, so that better pressure sintering effect is achieved when the first sealing piece and the second sealing piece are matched.
Description
Technical Field
The invention relates to the technical field of pressure sintering of product chips, in particular to a chip vacuum pressure sintering furnace and a control method thereof.
Background
The chip pressure sintering furnace is equipment for processing products in a heating and pressurizing mode, a furnace cavity of the common chip pressure sintering furnace is not of a completely closed structure, the temperature is higher during chip sintering, and the chip and a substrate are easily oxidized or doped with other impurities during sintering to influence the chip pressure sintering packaging quality. Therefore, the chip pressure sintering furnace can be better sealed, and the reduction of oxidation of the chip and the substrate is of great significance for improving the product quality.
Disclosure of Invention
The invention provides a chip vacuum pressure sintering furnace and a control method thereof, which are used for solving the problem that a chip and a substrate are oxidized because the chip pressure sintering furnace cannot realize good sealing when a workpiece is sintered in the prior art.
The invention provides a chip vacuum pressure sintering furnace, comprising:
the first pressure mechanism comprises a first pressure head and a first sealing element, and the first sealing element is wrapped on the outer side of the first pressure head and is fixed in position relative to the first pressure head;
the second pressure mechanism comprises a second pressure head and a second sealing element, the second sealing element is wrapped on the outer side of the second pressure head, the first end of the second sealing element is fixedly connected with the second pressure head, the second end of the second sealing element faces the first sealing element, and the second sealing element is of a telescopic structure;
the elastic supporting mechanism is connected with the second end of the second sealing member and elastically supports the second end of the second sealing member towards the direction close to the first sealing member when being compressed;
and the pressure driving mechanism is connected with at least one of the first pressure mechanism and the second pressure mechanism and is suitable for driving the second pressure mechanism and the first pressure mechanism to move close to or away from each other.
According to the chip vacuum pressure sintering furnace provided by the invention, the pressure driving mechanism comprises a bottom plate, a middle plate, a top plate, guide posts and a pressure cylinder, the guide posts are respectively and fixedly connected with the bottom plate and the top plate, the middle plate is positioned between the bottom plate and the top plate and is slidably connected with the guide posts, the pressure cylinder is vertically arranged, and a pressure rod of the pressure cylinder is fixedly connected with the middle plate;
the cylinder barrel of the pressure cylinder is fixedly connected with the top plate, the first pressure mechanism is arranged on the bottom plate, and the second pressure mechanism is arranged on the lower side of the middle plate, or the cylinder barrel of the pressure cylinder is fixedly connected with the bottom plate, the first pressure mechanism is arranged on the middle plate, and the second pressure mechanism is arranged on the lower side of the top plate.
According to the chip vacuum pressure sintering furnace provided by the invention, the pressure driving mechanism further comprises a pressure sensor, and the pressure sensor is used for measuring the pressure applied by the pressure cylinder.
According to the chip vacuum pressure sintering furnace provided by the invention, the pressure driving mechanism further comprises a displacement sensor, and the displacement sensor is used for detecting the displacement of the middle plate.
According to the invention, the chip vacuum pressure sintering furnace provided by the invention comprises an elastic supporting mechanism and a sintering furnace body, wherein the elastic supporting mechanism comprises:
a pressure spring for elastically supporting the second seal member downward;
and the first sliding rod is connected with the second sealing element in a sliding manner and is used for guiding the second sealing element in a sliding manner.
The invention provides a chip vacuum pressure sintering furnace, which further comprises:
an elastic adjustment device adapted to adjust the height of the top end of the pressure spring.
According to the chip vacuum pressure sintering furnace provided by the invention, the outer side of the first sealing element and/or the second sealing element is/are provided with a gas joint, the inner side of the first sealing element and/or the second sealing element is provided with a gas inlet, and the gas joint is communicated with the gas inlet.
According to the chip vacuum pressure sintering furnace provided by the invention, the heating element is arranged in and/or on the edge of at least one of the first pressing head and the second pressing head.
According to the chip vacuum pressure sintering furnace provided by the invention, a cooling pipeline is arranged at the non-crimping position of the first pressure head and/or the second pressure head.
The invention also provides a control method of the chip vacuum pressure sintering furnace, which comprises the following steps:
controlling the pressure driving mechanism to operate, so that the second pressure mechanism and the first pressure mechanism are close to each other until the second sealing element is in contact with the first sealing element and sealing is realized under the elastic support of the elastic support mechanism;
performing inert gas filling, reducing atmosphere filling and preset vacuumizing process operation on a sealed cavity formed by the first sealing element and the second sealing element, and heating a workpiece;
after the temperature of the workpiece reaches a first preset value, controlling the pressure driving mechanism to continue to operate, and enabling the first pressure head and the second pressure head to be matched to realize pressure sintering of the workpiece;
after sintering is finished, stopping heating and cooling the pressure head until the temperature of the pressure head reaches a second preset value;
and controlling the pressure driving mechanism to operate, so that the second pressure mechanism and the first pressure mechanism are away from each other until the second sealing element is separated from the first sealing element.
According to the chip vacuum pressure sintering furnace and the control method thereof, before the first pressure head and the second pressure head are matched for hot pressing, the first sealing element and the second sealing element are matched to form a sealing structure in advance on the outer sides of the first pressure head and the second pressure head, so that the construction of an inert gas environment, a reducing atmosphere environment or a vacuum environment can be realized through process presetting, the protection of a workpiece is realized, the workpiece is prevented from being oxidized, and the pressure sintering quality is improved; the elastic support mechanism can provide elastic support for the second sealing element towards the first sealing element, so that better sealing effect is achieved when the first sealing element and the second sealing element are matched.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of the overall structure of a vacuum pressure sintering furnace for chips provided by the invention;
FIG. 2 is a schematic structural diagram of a pressure driving mechanism in a chip vacuum pressure sintering furnace provided by the invention;
FIG. 3 is a schematic diagram showing a second sealing structure in a vacuum pressure sintering furnace for chips provided by the present invention;
FIG. 4 is a schematic diagram showing a first sealing structure in a vacuum pressure sintering furnace for chips according to the present invention;
FIG. 5 is a schematic diagram showing the structure of an elastic adjusting device in a chip vacuum pressure sintering furnace provided by the invention;
FIG. 6 is a flow chart of a control method of a chip vacuum pressure sintering furnace provided by the invention;
reference numerals: 101. a frame; 102. a first ram; 103. a first seal member; 104. a second ram; 105. a second seal member; 106. a gas joint; 107. an air inlet; 108. a base plate; 109. a middle plate; 110. a top plate; 111. a guide post; 112. a pressure cylinder; 113. a pressure sensor; 114. a displacement sensor; 115. a pressure spring; 116. a first slide bar; 117. a second slide bar; 118. a hand wheel; 119. a support frame; 120. a support shaft; 121. a feed screw nut driving structure; 122. a brake frame; 123. locking the bolt; 124. a digital display; 125. pressing a ring; 126. and a limiting nut.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention may be understood as specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The following describes a chip vacuum pressure sintering furnace according to an embodiment of the present invention, including a first pressure mechanism, a second pressure mechanism, an elastic support mechanism, and a pressure driving mechanism, with reference to fig. 1 to 5. The first pressure mechanism comprises a first pressure head 102 and a first sealing member 103, the first sealing member 103 is wrapped around the outer side of the first pressure head 102 and is fixed relative to the first pressure head 102, the second pressure mechanism comprises a second pressure head 104 and a second sealing member 105, the second sealing member 105 is wrapped around the outer side of the second pressure head 104, a first end of the second sealing member 105 is fixedly connected with the second pressure head 104, a second end of the second sealing member 105 faces the first sealing member 103, the second sealing member 105 is of a telescopic structure, an elastic supporting mechanism is connected with a second end of the second sealing member 105, the elastic supporting mechanism elastically supports the second end of the second sealing member 105 towards the direction close to the first sealing member 103 when being compressed, and a pressure driving mechanism is connected with at least one of the first pressure mechanism and the second pressure mechanism and is suitable for driving the second pressure mechanism and the first pressure mechanism to approach or move away from each other.
In the above scheme, when the pressure driving mechanism drives the second pressure mechanism and the first pressure mechanism to approach each other, a hot pressing process is performed, when the first sealing element 103 and the second sealing element 105 are in contact fit, a sealed cavity can be formed outside the first pressing head 102 and the second pressing head 104, and when the first pressing head 102 and the second pressing head 104 are in fit with each other, hot pressing of a workpiece can be performed. Taking fig. 1 as an example, the pressure driving mechanism may drive the second pressure mechanism to lift, when the second pressure mechanism is driven to fall until the lower end of the second sealing member 105 contacts with the first sealing member 103, a seal is formed, when the pressure driving mechanism continues to drive the second pressure mechanism to move downward, the second end of the second sealing member 105 is blocked by the upper end of the first sealing member 103, so that the second sealing member 105 is shortened, at this time, the elastic supporting mechanism generates elastic deformation, and under the support of the elastic supporting mechanism, the second sealing member 105 and the first sealing member 103 can achieve a good matching effect, thereby preventing external air from entering the sealed chamber. After the protective gas filling and the vacuumizing operation of the sealed chamber are completed, the pressure driving mechanism continues to drive the second pressure mechanism to move downwards, and the first pressure head 102 and the second pressure head 104 are matched to realize the hot pressing of the workpiece.
Alternatively, the first sealing member 103 and the second sealing member 105 of the embodiment of the present invention are formed in a square cylindrical shape. Further, the middle portion of the second sealing member 105 is provided as a telescopic tube structure, whereby the telescopic movement of the second sealing member 105 can be achieved.
Optionally, at least one of the first sealing member 103 and the second sealing member 105 is provided with a gas joint 106 on the outer side and an air inlet hole 107 on the inner side, and the gas joint 106 is communicated with the air inlet hole 107. The gas connector 106 is adapted to connect a gas supply device and a negative pressure device, after the gas supply device introduces protective gas through the gas connector 106, the protective gas enters the sealed chamber formed by the first sealing element 103 and the second sealing element 105 through the gas inlet hole 107, and when the negative pressure device operates, air in the sealed chamber formed by the first sealing element 103 and the second sealing element 105 is discharged through the gas inlet hole 107 and the gas connector 106.
Optionally, at least one of the first ram 102 and the second ram 104 is provided with a heating element, which may be a silicon-molybdenum rod, a silicon-carbon rod, or the like, located inside and/or at the edge of the first ram 102 and the second ram 104, and the heating element is capable of heating the workpiece to achieve hot pressing.
Optionally, at least one of the first ram 102 and the second ram 104 is provided with a cooling line, particularly at a non-crimping location of the first ram 102 and the second ram 104. After the cooling pipeline is connected with the cooling liquid supply equipment, the cooling liquid can enter the cooling pipeline, and the workpiece is cooled.
Preferably, the first ram 102 is provided with both heating elements and cooling lines, whereby heating or cooling can be performed according to production needs.
According to the vacuum pressure sintering furnace for the chip, disclosed by the embodiment of the invention, the pressure driving mechanism comprises a bottom plate 108, a middle plate 109, a top plate 110, guide pillars 111 and a pressure cylinder 112, wherein the guide pillars 111 are vertically arranged, the bottom plate 108, the middle plate 109 and the top plate 110 are horizontally arranged, the lower parts of the guide pillars 111 are fixedly connected with the bottom plate 108, the upper parts of the guide pillars 111 are fixedly connected with the top plate 110, the middle plate 109 is positioned between the bottom plate 108 and the top plate 110, the middle plate 109 is provided with through holes, and the guide pillars 111 are arranged in the through holes in a penetrating manner, so that the middle plate 109 is connected with the guide pillars 111 in a sliding manner. The guide posts 111 are provided in plural, and preferably, the guide posts 111 are provided in four. The pressure cylinder 112 is vertically arranged, a pressure rod of the pressure cylinder 112 is fixedly connected with the middle plate 109, and the pressure cylinder 112 can drive the middle plate 109 to lift up and down during operation, so that the first pressure mechanism and the second pressure mechanism are driven to approach or separate from each other.
In an alternative, as shown in fig. 1, the cylinder barrel of the pressure cylinder 112 is fixedly connected to the top plate 110, the first pressure mechanism is arranged on the upper side of the bottom plate 108, and the second pressure mechanism is arranged on the lower side of the middle plate 109. When the pressure cylinder 112 is extended, the middle plate 109 can be driven to slide downwards, when the pressure cylinder 112 is shortened, the middle plate 109 slides upwards, and the sliding process of the middle plate 109 can drive the second pressure mechanism to move close to or away from the first pressure mechanism. It should be noted that the second ram 104 of the second pressure mechanism is fixed to the middle plate 109 and always moves up and down synchronously with the middle plate 109, and the lower end of the second sealing member 105 can move vertically relative to the middle plate 109.
In an alternative, the cylinder barrel of the pressure cylinder 112 is fixedly connected to the bottom plate 108, a first pressure mechanism being arranged on the upper side of the middle plate 109 and a second pressure mechanism being arranged on the lower side of the top plate 110. When the pressure cylinder 112 is extended, the middle plate 109 can be driven to slide upwards, when the pressure cylinder 112 is shortened, the middle plate 109 slides downwards, and the sliding process of the middle plate 109 can drive the first pressure mechanism to move close to or away from the second pressure mechanism. It should be noted that the second ram 104 of the second pressure mechanism is fixed to the top plate 110, and the lower end of the second sealing member 105 can move vertically relative to the top plate 110.
Optionally, the pressure driving mechanism further comprises a pressure sensor 113, the pressure sensor 113 being adapted to measure the pressure exerted by the pressure cylinder 112. Specifically, the pressure sensor 113 is disposed between the middle plate 109 and the pressure rod of the pressure cylinder 112, and the pressure sensor 113 can detect the pressure applied to the middle plate 109 by the pressure cylinder 112, so that the precise control of the hot pressing pressure can be realized according to the detection result of the pressure sensor 113.
Optionally, the pressure driving mechanism further includes a displacement sensor 114, the displacement sensor 114 may be disposed on the pressure cylinder 112, the displacement sensor 114 is configured to detect a displacement of the middle plate 109, and the precise control of the lifting distance of the middle plate 109 may be achieved by connecting the displacement sensor 114 to a control circuit of the pressure cylinder 112.
The elastic support mechanism of the embodiment of the present invention is described in detail below:
the elastic support mechanism includes a pressure spring 115, and the pressure spring 115 serves to elastically support the second seal member 105 downward. Taking the example shown in fig. 1 that the second pressure mechanism is disposed on the middle plate 109, the pressure spring 115 is disposed between the middle plate 109 and the second sealing member 105, and after the second sealing member 105 contacts the first sealing member 103, the pressure driving mechanism drives the middle plate 109 to move downward, the pressure spring 115 compresses to apply elastic pressure to the second sealing member 105.
Optionally, the elastic support mechanism further comprises a first slide bar 116, the first slide bar 116 being slidably connected with the second seal 105 for slidably guiding said second seal 105. Specifically, taking the example that the second pressure mechanism shown in fig. 1 is disposed on the middle plate 109, the first sliding rod 116 is fixedly connected with the middle plate 109, the first sliding rod 116 passes through the second sealing element 105, the first sliding rod 116 is connected with the limit nut 126 in a threaded manner, the limit nut 126 is disposed on a side of the second sealing element 105 away from the movable end of the pressure driving mechanism, the limit nut 126 can prevent the first sliding rod 116 from being separated from the second sealing element 105, the limit nut 126 limits the movable range of the second sealing element 105, and the maximum distance between the second sealing element 105 and the middle plate 109 can be adjusted by rotating the limit nut 126. The first slide bar 116 is able to guide the second seal 105, avoiding deflection of the second seal 105. Preferably, the first sliding rod 116 is provided with a plurality of first sliding rods 116, and in the structure shown in the figure as an example, two first sliding rods 116 are respectively provided at both sides of the second sealing member 105, thereby making it possible to make the sliding of the second sealing member 105 more stable.
The vacuum pressure sintering furnace for chips according to the embodiment of the present invention further comprises an elastic adjustment means adapted to adjust the height of the top end of the pressure spring 115. Specifically, the elasticity adjusting device comprises an adjusting assembly and a pressing ring 125, a pressure spring 115 is arranged between the pressing ring 125 and the second sealing member 105, the upper end of the pressure spring 115 is in contact fit with the pressing ring 125, and the lower end of the pressure spring 115 is in contact fit with the second sealing member 105. The adjustment assembly can adjust the amount of compression of the compression spring 115 before the first seal 103 and the second seal 105 contact, and can also adjust the length of the second seal 105 before it contacts the first seal 103 to accommodate the machining requirements of workpieces of different sizes.
Optionally, the adjustment assembly includes a support bracket 119, a support shaft 120, and a telescoping adjustment member. Specifically, the support frame 119 includes a pair of end plates and a connecting rod disposed between the pair of end plates, and the connecting rod is preferably provided in plurality. The end plate at the bottom is fixed to the upper side of middle plate 109 or top plate 110. The support shaft 120 is vertically arranged and is connected with the support frame 119 in a sliding manner, the press ring 125 is fixedly arranged at the bottom end of the support shaft 120, the telescopic adjusting piece is connected with the support shaft 120 and is suitable for driving the support shaft 120 to slide relative to the support frame 119, and the press ring 125 can be driven to vertically move when the support shaft 120 vertically slides.
In some embodiments of the present invention, the telescopic adjustment member includes a screw nut driving structure 121 and a hand wheel 118, a screw of the screw nut driving structure 121 is vertically disposed and rotatably connected to the support frame 119, a nut of the screw nut driving structure 121 is fixedly connected to the support shaft 120, the hand wheel 118 is coaxially fixed to a screw of the screw nut driving structure 121, and when the hand wheel 118 rotates the screw of the screw nut driving structure 121, the screw drives the support shaft 120 to vertically slide. In order to facilitate the connection between the screw-nut driving structure 121 and the support shafts 120 and to make the movement of the compression rings 125 more stable, four support shafts 120 are provided, one end of each of the four support shafts 120 is connected to the compression ring 125, the other end is provided with an end plate, the screws of the screw-nut driving structure 121 are located between the four support shafts 120, and the nuts are fixedly connected to the end plates.
Optionally, the adjusting assembly further includes a locking device, the locking device connects the support frame 119 and the lead screw of the lead screw nut driving structure 121, and the locking device is used for locking the lead screw of the lead screw nut driving structure 121, so that after the pressing ring 125 is adjusted to a proper position, the lead screw can be locked by the locking device, and at this time, the position of the pressing ring 125 is fixed.
Optionally, the locking device includes a brake frame 122 and a locking bolt 123, the brake frame 122 is fixedly connected to the support frame 119, a lead screw of the lead screw nut driving structure 121 is inserted into the brake frame 122, the locking bolt 123 is disposed along a radial direction of the lead screw, the locking bolt 123 is threadedly connected to the brake frame 122, the locking bolt 123 is adapted to be switched between a contact engagement state and a disengagement state with the lead screw of the lead screw nut driving structure 121, locking is achieved when the locking bolt 123 is in contact engagement with the lead screw, and the lead screw can be rotated by the handwheel 118 when the locking bolt 123 is disengaged from the lead screw.
In some embodiments of the present invention, the digital display 124 is further included, the digital display 124 is connected to the lead screw of the lead screw nut driving structure 121, and is used for detecting and displaying the rotation angle of the lead screw nut driving structure 121, and the position of the pressing ring 125 can be accurately adjusted according to the display value of the digital display 124.
Optionally, the digital display 124 includes an angle sensor, a controller and a display screen, the angle sensor is used for detecting a screw rotation angle of the screw nut driving structure 121, the controller is electrically connected to the angle sensor and the display screen respectively, and the display screen can display a detection result of the angle sensor.
Optionally, the elastic support mechanism further includes a second sliding rod 117, the second sliding rod 117 is slidably connected to the pressing ring 125 and is fixedly connected to the second sealing member 105, and the pressure spring 115 is sleeved on the second sliding rod 117. The second sliding bar 117 is used to limit the pressure spring 115, so as to prevent the pressure spring 115 from deviating.
In some embodiments of the present invention, two elastic support mechanisms and two elastic adjustment devices are respectively disposed on two sides of the second pressure structure, and the two elastic support mechanisms and the two elastic adjustment devices correspond to each other one by one.
In some alternatives, the chip vacuum pressure sintering furnace further comprises a frame 101, the frame 101 is formed by welding a tubular structure and a sheet metal, the bottom of the frame 101 is provided with a plurality of support legs, and the bottom ends of the guide posts 111 are fixedly connected with the top of the frame 101.
Optionally, the feet are adjustable feet adapted to adjust the height of the frame 101.
The method for controlling the chip vacuum pressure sintering furnace provided by the invention is described below with reference to fig. 6, and the method for controlling the chip vacuum pressure sintering furnace described below and the above-described chip vacuum pressure sintering furnace can be correspondingly referred to each other.
The control method of the chip vacuum pressure sintering furnace according to the embodiment of the invention comprises the following steps:
and S100, controlling the pressure driving mechanism to operate, and enabling the second pressure mechanism and the first pressure mechanism to approach each other until the second sealing element 105 is in contact with the first sealing element 103 and sealing is realized under the elastic support of the elastic support mechanism.
And S200, performing inert gas filling, reducing atmosphere filling and preset vacuumizing operations on a sealed cavity formed by the first sealing element 103 and the second sealing element 105, and heating the workpiece.
And S300, when the temperature of the workpiece reaches a first preset value, controlling the pressure driving mechanism to continue to operate, and enabling the first pressing head 102 and the second pressing head 104 to be matched to realize pressure sintering of the workpiece.
S400, after sintering is completed, stopping heating and cooling the pressure head until the temperature of the pressure head reaches a second preset value.
And S500, controlling the pressure driving mechanism to operate, and enabling the second pressure mechanism and the first pressure mechanism to be away from each other until the second sealing element 105 and the first sealing element 103 are separated.
Optionally, step S200 specifically includes:
s201, extracting air in the sealed cavity, and when the pressure in the sealed cavity is smaller than or equal to a threshold value (for example, the pressure in the sealed cavity is smaller than or equal to 10 Pa), injecting a certain amount of nitrogen into the sealed cavity;
s202, repeating the steps at least twice;
s203, heating the workpiece, and filling nitrogen and formic acid into the sealed cavity again when the temperature in the sealed cavity starts to rise (the temperature of the cavity is less than or equal to 160 ℃ when the formic acid is filled);
s204, extracting gas in the sealed cavity again to create a vacuum environment;
and S205, stopping heating when the temperature in the cavity to be sealed reaches a first preset value.
In the embodiment of the present invention, the position of the middle plate 109 can be detected by the displacement sensor 114 to realize the accurate control of the pressure driving mechanism by the pressure driving mechanism.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A chip vacuum pressure sintering furnace, characterized by comprising:
the first pressure mechanism comprises a first pressure head and a first sealing element, and the first sealing element is wrapped on the outer side of the first pressure head and is fixed in position relative to the first pressure head;
the second pressure mechanism comprises a second pressure head and a second sealing element, the second sealing element is wound on the outer side of the second pressure head, the first end of the second sealing element is fixedly connected with the second pressure head, the second end of the second sealing element faces the first sealing element, and the second sealing element is of a telescopic structure;
the elastic supporting mechanism is connected with the second end of the second sealing member and elastically supports the second end of the second sealing member towards the direction close to the first sealing member when being compressed;
the pressure driving mechanism is connected with at least one of the first pressure mechanism and the second pressure mechanism and is suitable for driving the second pressure mechanism and the first pressure mechanism to move close to or away from each other;
the elastic support mechanism includes:
a pressure spring for elastically supporting the second seal member downward;
the first sliding rod is connected with the second sealing element in a sliding mode and used for guiding the second sealing element in a sliding mode;
the chip vacuum pressure sintering furnace further comprises:
the elastic adjusting device is suitable for adjusting the height of the top end of the pressure spring and comprises an adjusting assembly and a pressing ring, the pressure spring is arranged between the pressing ring and the second sealing element, the upper end of the pressure spring is in contact fit with the pressing ring, and the lower end of the pressure spring is in contact fit with the second sealing element;
the adjusting assembly comprises a supporting frame, a supporting shaft and a telescopic adjusting piece, the supporting frame comprises a pair of end plates and a connecting rod arranged between the pair of end plates, the end plate positioned at the bottom is fixed on the upper side of the middle plate or the top plate, the supporting shaft is vertically arranged and is connected to the supporting frame in a sliding mode, the pressing ring is fixedly arranged at the bottom end of the supporting shaft, and the telescopic adjusting piece is connected with the supporting shaft;
the telescopic adjusting piece comprises a screw-nut driving structure and a hand wheel, a screw rod of the screw-nut driving structure is vertically arranged and is rotationally connected to the support frame, a nut of the screw-nut driving structure is fixedly connected with the support shaft, and the hand wheel is coaxially fixed with the screw rod of the screw-nut driving structure;
the adjusting assembly further comprises a locking device, the locking device comprises a brake frame and a locking bolt, the brake frame is fixedly connected with the support frame, a lead screw of the lead screw nut driving structure penetrates through the brake frame, the locking bolt is arranged along the radial direction of the lead screw, the locking bolt is in threaded connection with the brake frame, and the locking bolt is suitable for switching between a lead screw contact matching state and a separation state with the lead screw nut driving structure.
2. The chip vacuum pressure sintering furnace according to claim 1, wherein the pressure driving mechanism comprises a bottom plate, a middle plate, a top plate, guide posts and a pressure cylinder, the guide posts are fixedly connected with the bottom plate and the top plate respectively, the middle plate is positioned between the bottom plate and the top plate and is slidably connected with the guide posts, the pressure cylinder is vertically arranged, and a pressure rod of the pressure cylinder is fixedly connected with the middle plate;
the cylinder barrel of the pressure cylinder is fixedly connected with the top plate, the first pressure mechanism is arranged on the bottom plate, and the second pressure mechanism is arranged on the lower side of the middle plate, or the cylinder barrel of the pressure cylinder is fixedly connected with the bottom plate, the first pressure mechanism is arranged on the middle plate, and the second pressure mechanism is arranged on the lower side of the top plate.
3. The die vacuum pressure sintering furnace of claim 2, wherein the pressure drive mechanism further comprises a pressure sensor for measuring the pressure exerted by the pressure cylinder.
4. The chip vacuum pressure sintering furnace according to claim 2 or 3, wherein the pressure driving mechanism further comprises a displacement sensor for detecting a displacement of the middle plate.
5. The furnace of claim 1, wherein the first sealing member and/or the second sealing member is provided with a gas joint at an outer side and a gas inlet hole at an inner side, and the gas joint is communicated with the gas inlet hole.
6. The chip vacuum pressure sintering furnace according to claim 1, wherein an inner portion and/or an edge of at least one of the first and second indenters is provided with a heating element.
7. The chip vacuum pressure sintering furnace according to claim 1, wherein a non-crimping position of the first ram and/or the second ram is provided with a cooling line.
8. A method of controlling a chip vacuum pressure sintering furnace according to any of claims 1 to 7, comprising:
controlling the pressure driving mechanism to operate, so that the second pressure mechanism and the first pressure mechanism are close to each other until the second sealing element is in contact with the first sealing element and sealing is realized under the elastic support of the elastic support mechanism;
filling inert gas, reducing atmosphere and preset vacuumizing process operations in a sealed cavity formed by the first sealing element and the second sealing element, and heating a workpiece;
after the temperature of the workpiece reaches a first preset value, controlling the pressure driving mechanism to continuously operate, and enabling the first pressure head and the second pressure head to be matched to realize workpiece pressure sintering;
after sintering is finished, stopping heating and cooling the pressure head until the temperature of the pressure head reaches a second preset value;
and controlling the pressure driving mechanism to operate, so that the second pressure mechanism and the first pressure mechanism are away from each other until the second sealing element is separated from the first sealing element.
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| CN117020567B (en) * | 2023-10-08 | 2024-01-23 | 北京中科同志科技股份有限公司 | Online hot-pressing crimping equipment with reduction function |
| CN117080132B (en) * | 2023-10-17 | 2024-03-12 | 北京中科同志科技股份有限公司 | Online hot pressing equipment with vacuum function |
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| US5709544A (en) * | 1996-04-16 | 1998-01-20 | Abar Ipsen Industries, Inc. | Dual seal for a vacuum heat treating furnace |
| JP3472963B1 (en) * | 2002-05-30 | 2003-12-02 | ミカドテクノス株式会社 | Vacuum press for high temperature |
| CN204648943U (en) * | 2015-04-14 | 2015-09-16 | 昆明理工大学 | A kind of microwave vacuum ventilation hot pressing furnace |
| CN206947295U (en) * | 2016-12-08 | 2018-01-30 | 天津大学 | A kind of device of the pressure assisted sintering large-area nano silver paste of controlled atmosphere |
| CN106486386A (en) * | 2016-12-08 | 2017-03-08 | 天津大学 | A kind of device and method of the pressure assisted sintering large-area nano silver paste of controlled atmosphere |
| CN217955814U (en) * | 2022-08-20 | 2022-12-02 | 广东品嘉灵智能科技有限公司 | Chip sintering machine |
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