CN115677981A - Polyamide modified waterborne epoxy curing agent and preparation method thereof - Google Patents
Polyamide modified waterborne epoxy curing agent and preparation method thereof Download PDFInfo
- Publication number
- CN115677981A CN115677981A CN202211408936.9A CN202211408936A CN115677981A CN 115677981 A CN115677981 A CN 115677981A CN 202211408936 A CN202211408936 A CN 202211408936A CN 115677981 A CN115677981 A CN 115677981A
- Authority
- CN
- China
- Prior art keywords
- polyamide
- curing agent
- waterborne epoxy
- modified waterborne
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
Abstract
The invention discloses a polyamide modified waterborne epoxy curing agent and a preparation method thereof. The polyamide modified waterborne epoxy curing agent contains a nonionic polyether hydrophilic chain segment grafted on a side chain, and a polyamide structure chain segment is introduced into a main chain by adopting a linear block copolymerization mode, and the polyamide modified waterborne epoxy curing agent is synthesized by adopting the following raw materials in percentage by weight: 20-40% of polyamide resin, 2-6% of polyamine, 3-8% of polyetheramine, 10-15% of liquid epoxy resin, 8-12% of monoepoxide and the balance of deionized water. The curing agent disclosed by the invention is simple in synthesis process, environment-friendly and low in viscosity, can be cured and crosslinked with the waterborne epoxy resin, meets the curing requirement at room temperature, and can be used for preparing a coating film with excellent flexibility, corrosion resistance, chemical resistance and water resistance.
Description
Technical Field
The invention relates to the technical field of chemical synthesis, in particular to a polyamide modified waterborne epoxy curing agent and a preparation method thereof.
Background
The water-based epoxy resin coating has the characteristics of good chemical resistance, good physical and mechanical properties, low pollution, simple and convenient construction and the like, and is widely applied. In the application of the water-based epoxy coating, the requirements on the matched curing agent are different according to different epoxy components. Common waterborne epoxy curing agents include 3, that is, amidated polyamines prepared by reacting polyamines with mono fatty acids; polyamides formed by the condensation of dimer acid and polyamine, and epoxy-amine adducts formed by the addition of polyamine and epoxy resin.
The room temperature curing water-based paint system generally adopts an aliphatic polyamine curing agent, and a large amount of oligomers exist in the reaction of the aliphatic polyamine curing agent and epoxy resin, so that the cured paint film has poor adhesive force and a whitening phenomenon, and the toughness and the strength of the paint film are low. Due to the influence of molecular structure design, conventional amidated polyamine and polyamide curing agent have certain defects and are difficult to obviously improve, and epoxy-amine addition products are generally adopted as water-based epoxy curing agents at present, which accounts for more than eight times of markets at home and abroad. Most of the existing patent technologies such as CN113004495A, CN103183810A, CN105482079A and the like relate to waterborne epoxy curing agents which belong to epoxy-amine adduct types, namely epoxy resin chain segments are introduced into the molecular structure of polyamine, the compatibility of the curing agent and epoxy resin is improved, the compact hardness of a cured coating is high, a proper amount of epoxy active diluent is added into a resin component, the toughness of the coating can be improved, and the problem that the coating prepared by the curing agent is brittle is solved. In addition, in the preparation process of the epoxy-amine adduct type aqueous epoxy hardener, the raw materials are mostly still petrochemical raw materials. With the decreasing of energy sources such as petroleum and the increasing awareness of environmental protection, the water-based epoxy resin coating industry is seeking new ways to develop.
Disclosure of Invention
In order to solve the defects of poor film coating performance and the defects that the raw materials are mostly petrochemical materials in the prior art, the invention mainly aims to provide a branched chain type nonionic polyamide modified waterborne epoxy curing agent with good room temperature curing performance and water resistance and a preparation method thereof.
The purpose of the invention is realized by the following technical scheme:
the polyamide modified waterborne epoxy curing agent contains a nonionic polyether hydrophilic chain segment grafted on a side chain and a polyamide structure chain segment introduced into a main chain by adopting a linear block copolymerization mode, and is synthesized by adopting the following raw materials in percentage by weight: 20-40% of polyamide resin, 2-6% of polyamine, 3-8% of polyetheramine, 10-15% of liquid epoxy resin, 8-12% of monoepoxy compound and the balance of deionized water.
Preferably, the polyamine is selected from at least one of aromatic amine, aliphatic amine and alicyclic amine; the aromatic amine is selected from at least any one of m-phenylenediamine and m-xylylenediamine; the alicyclic amine is isophorone diamine; the aliphatic amine is at least one of ethylenediamine, propylenediamine, butylenediamine, pentylenediamine, hexylenediamine, diethylenetriamine, triethylenetetramine and tetraethylenepentamine.
Preferably, the monoepoxide compound is at least one selected from butyl glycidyl ether, phenyl glycidyl ether, o-tolyl glycidyl ether, octyl glycidyl ether and benzyl glycidyl ether.
Preferably, the liquid epoxy resin is at least one selected from DER331 available from DOW Chemicals, and EPON828 available from HEXION.
Preferably, the polyamide resin is selected from fatty diacid and fatty diamine.
Preferably, the polyamide resin is at least one selected from the group consisting of polyamide resin 250, polyamide resin 300, polyamide resin 650, and polyamide resin 651.
Preferably, the solid content of the polyamide modified waterborne epoxy curing agent is 60-70%.
The preparation method of any one of the polyamide modified waterborne epoxy curing agents comprises the following steps:
(1) preparation of a prepolymer:
adding polyamine into a reaction container, heating to 40-60 ℃, dropwise adding the monoepoxy compound at the temperature for 2-4 h, and after dropwise adding, keeping the temperature at 70-90 ℃ for reaction for 2h to prepare a compound A containing terminal primary amino; adding amine-terminated polyether into a reaction container, heating to 60-80 ℃, dropwise adding liquid epoxy resin at the temperature for 2-4 h, after dropwise adding, keeping the temperature at 120-140 ℃ for reacting for 2h to prepare a compound B containing a hydrophilic chain segment, and stirring;
(2) preparation of nonionic waterborne epoxy curing agent
Adding the compound A containing the terminal primary amine group prepared in the step (1) and polyamide resin into a reaction container, uniformly mixing, slowly dropwise adding the compound B containing the hydrophilic chain segment prepared in the step (1) at 50 +/-5 ℃ for 2-4 h, after dropwise adding, gradually heating up between 60 and 80 ℃ and keeping the temperature for 4-6 h, continuously and slowly dropwise adding a monoepoxy compound, reacting at 70 +/-5 ℃ for 2-3 h to obtain a product with the terminal primary amine hydrogen sealed, adding deionized water to prepare the nonionic aqueous epoxy hardener, and stirring the operations.
Preferably, the amino-terminated polyether is at least one of JEFFAMINE M-1000, M-2070, M-600, ED-900 and ED-2003, which are produced by HUNTSMAN company.
Preferably, the polyamide resin is prepared by reacting an aliphatic diacid with an aliphatic diamine.
Preferably, deionized water is added in the step (2) to ensure that the solid content of the final polyamide modified waterborne epoxy curing agent is 60-70%.
The preparation method and the obtained product have the following advantages and beneficial effects:
(1) The invention adopts an epoxy-polyamine addition method, adjusts the hydrophily and lipophilicity of the waterborne epoxy curing agent by introducing hydrophobic epoxy resin and a hydrophilic nonionic chain segment into polyamine, enhances the compatibility with the waterborne epoxy resin component, and avoids the step of adding organic acid for neutralization and salt formation;
(2) According to the invention, the hydrophilic chain segment is introduced in a side chain block mode, so that on the basis of ensuring the water-based performance, the use amount of hydrophilic substances is reduced, the viscosity is reduced, and the higher solid content is realized, therefore, the water resistance and the corrosion resistance of a coating film prepared by the curing agent are improved;
(3) According to the invention, the polyamide resin chain segment is introduced into the main chain of the waterborne epoxy hardener, an ether bond-containing alkyl chain exists, the flexibility is higher, meanwhile, the six-membered aliphatic ring in the molecule endows the waterborne epoxy hardener with higher temperature resistance, and the compound is used as a hardener, so that the solidifying activity is improved, and the room temperature solidification can be realized. In addition, the molecular weight of the main chain is higher, so that the steric hindrance is large, the pot life of the system is prolonged, and convenience can be brought to construction;
(4) The synthesis process is simple and environment-friendly, is a reaction system without organic solvent, does not generate micromolecular by-products in the reaction process, and the synthesized product meets the high environment-friendly requirement. In addition, the adoption of the bio-based raw materials can reduce the excessive dependence on petroleum resources under the severe situation of increasingly exhausted petroleum resources at present.
(5) The reaction principle of the invention is amine-epoxy ring opening reaction, but is different from the traditional amine-epoxy ring opening reaction: a. the method adopts step-by-step feeding, can ensure the regularity of the structure, and specifically comprises the steps of firstly carrying out single-end-capping treatment on diamine to obtain a long chain-shaped primary amino-terminated compound, so that the activity of amino can be reduced, the subsequent reaction can be ensured to be reacted with monoprimary amine as far as possible, and the gel phenomenon of the addition reaction can be avoided to a certain extent; b. according to the scheme, an amino-terminated compound is mixed with polyamide resin with larger molecular weight, and then the mixture reacts with a hydrophilic chain segment compound, a polyamide chain segment (long carbon chain flexible chain segment) is introduced into a molecular main chain, the molecular weight of the main chain is higher, the steric hindrance is large, and the working life of a system is prolonged; in addition, the existence of small molecular weight compounds can be reduced by forming the primary amino-terminated compound and then carrying out addition reaction, the purity of reactants is improved, and the crosslinking density of a coating film is enhanced; the introduced side chain hydrophilic chain segment and the main chain long carbon chain hydrophobic chain segment can improve the water resistance of the coating film.
Detailed Description
The present invention will be described in further detail with reference to examples, but the embodiments of the present invention are not limited thereto.
Example 1
(1) Preparation of a prepolymer:
adding 10.32g of diethylenetriamine into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heating to 50 ℃, slowly dropwise adding 15.02g of phenyl glycidyl ether under stirring, after dropwise adding is finished for 3h, keeping the temperature at 80 ℃ for reaction for 2h to prepare a primary amino group-containing compound A; 14.18g of amino terminated polyether JEFFAMINE 2070 (HUNSTMAN) is firstly added into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heated to 70 ℃, stirred, slowly dropped with 33.10g of liquid epoxy resin EPON828 (HEXION), heated to 130 ℃ after 2h of dropping, and temperature-controlled reaction is carried out for 2h, thus preparing the compound B containing the hydrophilic chain segment.
(2) Preparation of non-ionic aqueous epoxy curing agent
Adding 25.34g of the compound A containing the terminal primary amine group prepared in the step (1) and 74.00g of the polyamide resin 560 into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, uniformly mixing, heating to 50 ℃, stirring, slowly adding 47.28g of the compound B containing the hydrophilic chain segment prepared in the step (1) dropwise for 2 hours, after dropwise adding, keeping the temperature at 50 +/-2 ℃ for 2 hours, then heating to 70 +/-2 ℃ for 2 hours, then heating to 80 +/-2 ℃ for 2 hours, continuing slowly adding 12.01g of phenyl glycidyl ether dropwise, reacting at 70 ℃ for 2 hours to obtain a product with the terminal primary amine hydrogen being blocked, and adding 85.40g of deionized water to obtain the nonionic waterborne epoxy hardener.
The curing agent has a solids content of 65.0wt%, amine hydrogen equivalent =208.6 ± 10 (on a solids basis).
Example 2
(1) Preparation of a prepolymer:
adding 10.32g of diethylenetriamine into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heating to 40 ℃, slowly dropwise adding 13.02g of butyl glycidyl ether under stirring, after dropwise adding for 4h, keeping the temperature at 70 ℃ for reaction for 2h to prepare a primary amino group-containing compound A; 14.18g of amino terminated polyether JEFFAMINE 2070 (HUNSTMAN) is firstly added into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heated to 70 ℃, stirred, slowly dropped with 33.10g of liquid epoxy resin EPON828 (HEXION), heated to 120 ℃ after 4h of dropping, and temperature controlled reaction is carried out for 2h, thus preparing the compound B containing the hydrophilic chain segment.
(2) Preparation of non-ionic aqueous epoxy curing agent
Adding 23.34g of the compound A containing the terminal primary amine group prepared in the step (1) and 74.00g of the polyamide resin 560 into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, uniformly mixing, heating to 50 ℃, stirring, slowly adding 47.28g of the compound B containing the hydrophilic chain segment prepared in the step (1) dropwise for 3h, after dropwise adding, keeping the temperature at 50 +/-2 ℃ for 2h, then heating to 70 +/-2 ℃ for 2h, then heating to 80 +/-2 ℃ for 2h, continuing slowly adding 10.41g of butyl glycidyl ether dropwise, reacting at 70 ℃ for 2h to obtain a product with the terminal primary amine hydrogen being blocked, and adding 83.47g of deionized water to obtain the nonionic waterborne epoxy curing agent.
The curing agent has a solids content of 65.0wt%, amine hydrogen equivalent =204.0 ± 10 (on a solids basis).
Example 3
(1) Preparation of a prepolymer:
adding 10.32g of diethylenetriamine into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heating to 60 ℃, slowly dropwise adding 15.02g of phenyl glycidyl ether under stirring, after dropwise adding for 2h, keeping the temperature at 80 ℃ for reaction for 2h to prepare a primary amino group-containing compound A; 15.59g of amino terminated polyether JEFFAMINE M1000 (HUNSTMAN) is firstly added into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heated to 60 ℃, stirred, slowly dropped with 36.36g of liquid epoxy resin EPON828 (HEXION), heated to 140 ℃ after 2h of dropping, and temperature-controlled reaction is carried out for 2h, thus preparing the compound B containing the hydrophilic chain segment.
(2) Preparation of non-ionic aqueous epoxy curing agent
Adding 25.34g of the compound A containing the terminal primary amine group prepared in the step (1) and 74.00g of the polyamide resin 560 into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, uniformly mixing, heating to 50 ℃, stirring, slowly adding 51.95g of the compound B containing the hydrophilic chain segment prepared in the step (1) dropwise for 4 hours, after dropwise adding, keeping the temperature at 50 +/-2 ℃ for 2 hours, then heating to 70 +/-2 ℃ for 2 hours, then heating to 80 +/-2 ℃ for 2 hours, continuing slowly adding 12.01g of phenyl glycidyl ether dropwise, reacting at 70 ℃ for 2 hours to obtain a product with the terminal primary amine hydrogen being blocked, and adding 87.91g of deionized water to obtain the nonionic waterborne epoxy hardener.
The curing agent has a solids content of 65.0wt%, amine hydrogen equivalent =214.8 ± 10 (on a solids basis).
Example 4
(1) Preparation of a prepolymer:
adding 14.62g of triethylene tetramine into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heating to 50 ℃, slowly dropwise adding 15.02g of phenyl glycidyl ether under stirring, after dropwise adding for 3h, preserving heat at 70 ℃ for reacting for 2h to prepare a primary amino group-containing compound A; 14.18g of JEFFAMINE 2070 (HUNSTMAN) amine-terminated polyether is firstly added into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heated to 70 ℃, stirred, slowly dropped with 33.10g of liquid epoxy resin EPON828 (HEXION), and after 3h of dropping, heated to 120 ℃ and temperature-controlled reaction is carried out for 2h, thus preparing the compound B containing the hydrophilic chain segment.
(2) Preparation of nonionic waterborne epoxy curing agent
Adding 29.64g of compound A containing terminal primary amine groups prepared in the step (1) and 74.00g of polyamide resin 560 into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, uniformly mixing, heating to 50 ℃, stirring, slowly adding 47.28g of compound B containing hydrophilic chain segments prepared in the step (1) dropwise for 3h, after dropwise adding, keeping the temperature at 50 +/-2 ℃ for 2h, then heating to 70 +/-2 ℃ for 2h, then heating to 80 +/-2 ℃ for 2h, continuing slowly adding 10.41g of butyl glycidyl ether dropwise, reacting at 70 ℃ for 2h to obtain a product with the terminal primary amine hydrogen being blocked, and adding 86.87g of deionized water to obtain the nonionic waterborne epoxy hardener.
The curing agent has a solids content of 65.0wt%, amine hydrogen equivalent =187.6 ± 10 (on a solids basis).
Example 5
(1) Preparation of a prepolymer:
adding 14.62g of triethylene tetramine into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heating to 60 ℃, slowly dropwise adding 13.02g of butyl glycidyl ether under stirring, after dropwise adding for 2h, keeping the temperature at 80 ℃ for reaction for 2h to prepare a primary amino group-containing compound A; 15.59g of JEFFAMINE M1000 (HUNSTMAN) amine-terminated polyether is added into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, heated to 80 ℃, stirred, slowly dropped with 36.36g of liquid epoxy resin EPON828 (HEXION), and heated to 120 ℃ after 4h of dropping is finished, and temperature is controlled for reaction for 2h to prepare the compound B containing the hydrophilic chain segment.
(2) Preparation of non-ionic aqueous epoxy curing agent
Adding 27.64g of compound A containing terminal primary amine groups prepared in the step (1) and 74.00g of polyamide resin 560 into a 500mL four-neck flask provided with a dropping funnel, a stirrer and a thermometer, uniformly mixing, heating to 50 ℃, stirring, slowly adding 51.95g of compound B containing hydrophilic chain segments prepared in the step (1) dropwise for 4 hours, after dropwise adding, keeping the temperature at 50 +/-2 ℃ for 2 hours, then heating to 70 +/-2 ℃ for 2 hours, then heating to 80 +/-2 ℃ for 2 hours, continuing slowly adding 12.01g of phenyl glycidyl ether dropwise, reacting at 70 ℃ for 2 hours to obtain a product with the terminal primary amine hydrogen being blocked, and adding 89.16g of deionized water to obtain the nonionic waterborne epoxy hardener.
The curing agent has a solids content of 65.0wt%, amine hydrogen equivalent =192.6 ± 10 (on a solid basis).
Example 6: preparation of two-component waterborne epoxy coating
Uniformly stirring the waterborne epoxy curing agent, various auxiliaries, pigment fillers and deionized water at a high speed according to a formula in a table 1, then pouring the mixture into a small-sized laboratory sand mill, adding a proper amount of zirconium beads, grinding and dispersing until the fineness of a scraper blade is less than 30 mu m, standing for defoaming, and finally filtering and discharging to obtain a component A of the two-component waterborne epoxy coating. And uniformly mixing the component A and the component B of the commercially available epoxy emulsion according to the proportion, spraying the mixture by using a spray gun, curing at room temperature to form a film, and preparing the film into a plate by using a commercially available epoxy curing agent for comparison. The thickness of the dry film is controlled to be 40-50 mu m.
TABLE 1 two-component waterborne epoxy coating formulation
Example 7: two-component waterborne epoxy coatings of example 1, comparative example 1 and comparative example 2 were prepared and tested for coating performance
TABLE 2 Performance testing of the coating films
The coating formulations of comparative examples 1 and 2 are substantially the same as the formulation of example 1, except that the curing agent of comparative example 1 is a commercially available pure polyamide-based curing agent having a solid content of 65 ± 2wt%; the curing agent of comparative example 2 is a commercially available block nonionic waterborne epoxy curing agent with a solids content of 60 + -2 wt.%.
As can be seen from Table 2, compared with the curing agents used in comparative examples 1 and 2, the two-component waterborne epoxy coating film prepared by the polyamide modified waterborne epoxy curing agent prepared by the technical scheme of the invention reaches or exceeds a single type of curing agent product in the aspects of flexibility, pencil hardness, water resistance, acid and alkali medium resistance, salt mist resistance and the like, and has obvious technical effect and wide market prospect.
The above description is only for the best mode of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
Claims (10)
1. The polyamide modified waterborne epoxy hardener is characterized by comprising a nonionic polyether hydrophilic chain segment grafted on a side chain and a polyamide structure chain segment introduced into a main chain by adopting a linear block copolymerization mode, and is synthesized by adopting the following raw materials in percentage by weight: 20-40% of polyamide resin, 2-6% of polyamine, 3-8% of polyetheramine, 10-15% of liquid epoxy resin, 8-12% of monoepoxide and the balance of deionized water.
2. The polyamide-modified waterborne epoxy curing agent of claim 1, wherein the polyamine is at least one selected from the group consisting of aromatic amines, aliphatic amines, and alicyclic amines; the aromatic amine is selected from at least any one of m-phenylenediamine and m-xylylenediamine; the alicyclic amine is isophorone diamine; the aliphatic amine is at least one of ethylenediamine, propylenediamine, butylenediamine, pentylenediamine, hexylenediamine, diethylenetriamine, triethylenetetramine and tetraethylenepentamine.
3. The polyamide-modified waterborne epoxy curing agent of claim 1, wherein the monoepoxide compound is at least one compound selected from the group consisting of butyl glycidyl ether, phenyl glycidyl ether, o-tolyl glycidyl ether, octyl glycidyl ether, and benzyl glycidyl ether.
4. The polyamide-modified waterborne epoxy curing agent of claim 1, wherein the liquid epoxy resin is at least one selected from DER331 available from DOW chemical company and EPON828 available from HEXION company.
5. The polyamide-modified waterborne epoxy hardener of claim 1, wherein the polyamide resin is selected from the group consisting of fatty diacids and fatty diamines.
6. The polyamide-modified aqueous epoxy curing agent according to claim 1, wherein the polyamide resin is at least any one selected from the group consisting of polyamide resin 250, polyamide resin 300, polyamide resin 650, and polyamide resin 651.
7. The polyamide-modified waterborne epoxy curing agent of claim 1, wherein the polyamide-modified waterborne epoxy curing agent has a solid content of 60% to 70%.
8. The polyamide-modified waterborne epoxy curing agent of any one of claims 1 to 7, wherein the preparation method of the polyamide-modified waterborne epoxy curing agent comprises the following steps:
(1) preparation of a prepolymer:
adding polyamine into a reaction container, heating to 40-60 ℃, dropwise adding a monoepoxy compound at the temperature for 2-4 h, and after dropwise adding, keeping the temperature at 70-90 ℃ for reaction for 2h to prepare a compound A containing a terminal primary amino group; adding amine-terminated polyether into a reaction container, heating to 60-80 ℃, dropwise adding liquid epoxy resin at the temperature for 2-4 h, after dropwise adding, keeping the temperature at 120-140 ℃ for reacting for 2h to prepare a compound B containing a hydrophilic chain segment, and stirring;
(2) preparation of non-ionic aqueous epoxy curing agent
Adding the compound A containing the terminal primary amine group prepared in the step (1) and polyamide resin into a reaction container, uniformly mixing, slowly dropwise adding the compound B containing the hydrophilic chain segment prepared in the step (1) at 50 +/-5 ℃ for 2-4 h, after dropwise adding, gradually heating up between 60 and 80 ℃ and keeping the temperature for 4-6 h, continuously and slowly dropwise adding a monoepoxy compound, reacting at 70 +/-5 ℃ for 2-3 h to obtain a product with the terminal primary amine hydrogen sealed, adding deionized water to prepare the nonionic aqueous epoxy hardener, and stirring the operations.
9. The method for preparing a polyamide modified waterborne epoxy hardener as claimed in claim 8, wherein the amine-terminated polyether is at least one of JEFFAMINE M-1000, M-2070, M-600, ED-900 and ED-2003 available from HUNTSMAN.
10. The method of claim 8, wherein the polyamide resin is prepared by reacting an aliphatic diacid with an aliphatic diamine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211408936.9A CN115677981A (en) | 2022-11-11 | 2022-11-11 | Polyamide modified waterborne epoxy curing agent and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211408936.9A CN115677981A (en) | 2022-11-11 | 2022-11-11 | Polyamide modified waterborne epoxy curing agent and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115677981A true CN115677981A (en) | 2023-02-03 |
Family
ID=85052503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211408936.9A Pending CN115677981A (en) | 2022-11-11 | 2022-11-11 | Polyamide modified waterborne epoxy curing agent and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115677981A (en) |
-
2022
- 2022-11-11 CN CN202211408936.9A patent/CN115677981A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112135855B (en) | Modified phenolic amine curing agent for epoxy resin composition and application thereof | |
| US7615584B2 (en) | Method of preparation of a water based epoxy curing agent | |
| EP0918071B1 (en) | Polyamide curing agents based on mixtures of polyethyleneamines and piperazine derivatives | |
| JP2836811B2 (en) | Self-emulsifying epoxy curing agent | |
| CN110746578B (en) | Water-based epoxy curing agent based on castor oil triglycidyl ether and preparation method thereof | |
| CN102250321B (en) | Quick-drying room temperature curing waterborne epoxy resin curing agent and preparation method thereof | |
| CN110511356B (en) | Epoxy phenyl silicone oil modified waterborne epoxy curing agent and preparation method thereof | |
| NO329378B1 (en) | "Curing agent for epoxy resins, blending and process for making them" | |
| CN115109230A (en) | Aqueous epoxy curing agent | |
| CN112105670A (en) | Cardanol-based curing agent for epoxy resin compositions | |
| CN108059900B (en) | Water-based anticorrosive paint and preparation method thereof | |
| JP4327251B2 (en) | Epoxy curing reagent | |
| EP0886661B1 (en) | Curable epoxy resin compositions containing water-processable polyamine hardeners | |
| CN112341604B (en) | Emulsion type epoxy curing agent and preparation method thereof | |
| CA2440471A1 (en) | Adducts of polyalkylene glycol monoglycidyl ethers and amine compounds | |
| CN115677981A (en) | Polyamide modified waterborne epoxy curing agent and preparation method thereof | |
| CN114605616A (en) | Quick-drying nonionic waterborne epoxy curing agent and preparation method and application thereof | |
| CN116425953A (en) | Nonionic water-based epoxy curing agent and preparation method thereof | |
| CN113461960B (en) | Preparation method of hyperbranched waterborne epoxy resin curing agent | |
| CN117511344A (en) | Water-based epoxy resin composition and preparation method and application thereof | |
| CN117304732A (en) | Thixotropic agent and preparation method thereof | |
| CN116848086A (en) | Composition containing phenolic amine and preparation method thereof | |
| JPH0371452B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |