CN115667964A

CN115667964A - Magnetic sensor package

Info

Publication number: CN115667964A
Application number: CN202180038019.3A
Authority: CN
Inventors: A·里查德; M·米勒-奥尔曼; P·托格; M·杜特; J·库比克; J·奥多德; E·尼科尔; S·奥布莱恩; J·施密特; R·古优乐; C·诺; C·吉列斯; B·欧玛拉; W·王
Original assignee: Analog Devices International ULC
Current assignee: Analog Devices International ULC
Priority date: 2020-05-26
Filing date: 2021-05-24
Publication date: 2023-01-31
Also published as: US20240060796A1; WO2021239648A1; US11761793B2; US20210372818A1; EP4158366A1

Abstract

The present disclosure provides a magnetic sensor package comprising a magnetic multi-turn sensor die and a magnetic single-turn sensor die, wherein both sensor dies are packaged on the same leadframe. The present disclosure also provides a method of manufacturing a magnetic sensor package. The present disclosure also provides a magnetic sensor system comprising a rotating magnet and a magnetic sensor package, wherein the sensor package is arranged such that the two sensor dies are located within a uniform magnetic field, thereby ensuring that the output signal of each sensor is not corrupted by any stray fields.

Description

Magnetic sensor package

Technical Field

The present disclosure relates to a magnetic sensor package. In particular, the present disclosure relates to a magnetic sensor package comprising a magnetic single-turn sensor and a magnetic multi-turn sensor.

Background

Magnetic single-turn and multi-turn sensors are commonly used in applications where it is desirable to monitor the number of device rotations and their precise angular position. Such as a steering wheel in a vehicle. Magnetic multi-turn and single-turn sensors typically use magnetoresistive elements that are sensitive to an applied external magnetic field. The resistance of the magneto-resistive elements in a multi-turn sensor can be changed by rotating the magnetic field in the vicinity of the sensor. The resistance change of the magnetoresistive element can be tracked to determine the number of turns in the magnetic field, which can be converted to the number of turns in the monitored equipment. Similarly, the resistance change of the magnetoresistive element in a single turn sensor can be tracked to determine the magnetic field angle, which can be translated into the angular position of the monitored device.

Disclosure of Invention

A first aspect of the present disclosure provides a magnetic sensor package comprising: at least one integrated device die comprising a first sensor portion having a sensing element configured to detect an orientation of a magnetic field generated by a rotating magnet; and a second sensor portion having a sensing element configured to detect a number of turns of the rotating magnet, a package substrate on which the at least one integrated device die is mounted; and a housing, wherein the housing encapsulates the package substrate at the at least one integrated device die.

In this way, a single sensor package is provided, which advantageously comprises a sensor for detecting the rotation angle and the number of turns of the external magnetic field. Thus, the sensor package may be placed where both sensing parts experience the same magnetic field. If one sensing portion is closer than the other, it will experience a stronger magnetic field with different magnitudes in the x-y plane, which may result in differences between the respective sensor outputs. Furthermore, the sensor package provides a compact arrangement that can be placed in a position where a uniform magnetic field is experienced, i.e. the magnetic field strength remains substantially the same magnetic field while the magnetic field direction changes with rotation, which is particularly important to ensure that the output of the angle sensing portion of the sensor package is accurate.

The at least one integrated device die may include: a first integrated device die including the first sensor portion, and a second integrated device die including the second sensor portion. In this case, the first integrated device die may be adjacent to the second integrated device die on the package substrate.

The top surface of the first integrated device die may be parallel to the top surface of the second integrated device die. This is particularly important to ensure that the first and second sensing portions experience the same magnetic field in the z-direction and therefore measure the same magnetic field.

In some arrangements, a first integrated device die may be stacked on a second integrated device die. Again, this helps to ensure that the first and second sensing portions experience, and therefore measure, the same magnetic field.

The magnetic sensor package may also include an application specific integrated circuit die mounted on the package substrate. In some cases, the first integrated device die may be mounted to an application specific integrated circuit die.

One or both of the first integrated device die and the second integrated device die may be mounted to the package substrate using a die attach film. By using a die attach film, there is no concern that epoxy material will bleed over the edge of the substrate, so the integrated device die can be placed close to the edge of the package substrate. Furthermore, the use of a die attach film may prevent movement of the integrated device die once the sensor package has been assembled and in use.

Where the magnetic sensor package includes an application specific integrated circuit die, the die attach film may also be used for attachment.

Alternatively, one or more of the first integrated device die, the second integrated device die, and the application specific integrated circuit die may be mounted to the package substrate using an epoxy die attach.

Advantageously, the package substrate may comprise a non-magnetic material. This is particularly important to prevent any distortion of the external magnetic field in which it is located, which helps to improve the measurement accuracy of the sensor part.

The package substrate may also include one or more leads for electrical connection.

It should of course be understood that the sensing element configured to detect the direction of the magnetic field generated by the rotating magnet may be an anisotropic magneto-resistance (AMR), a tunnel magneto-resistance (TMR), a giant magneto-resistance (GMR), a hall or other magnetic based angle sensor. Similarly, the sensing element configured to detect the number of turns of the rotating magnet may be a multi-turn sensor based on tunneling magneto-resistance (TMR) or giant magneto-resistance (GMR).

A second aspect of the present disclosure provides a magnetic sensing system comprising: a rotatable magnet configured to generate a rotating magnetic field; and a magnetic sensor package comprising: at least one integrated device die comprising a first sensor portion having a sensing element configured to detect an orientation of a magnetic field generated by a rotating magnet; and a second sensor portion having a sensing element configured to detect a number of turns of the rotating magnet, a package substrate on which the at least one integrated device die is mounted; and a housing, wherein the housing encapsulates the package substrate at the at least one integrated device die.

In some arrangements, the magnetic sensor package may be aligned with the axis of rotation of the magnet. More specifically, the center of the first sensing portion is aligned with the rotational axis of the magnet. In this respect it is important that the sensors providing angle sensing are located in a homogeneous field, otherwise stray fields may occur, leading to errors in the measured position.

In other arrangements, the magnetic sensor package may be offset from the axis of rotation of the magnet. In this case, the magnetic sensor package may be located at a first position in a plane perpendicular to the axis of rotation of the magnet, wherein the first position experiences a constant magnetic field strength as the magnet rotates. Again, this is important to ensure that the angle sensing portion remains within a uniform magnetic field.

In some cases, the magnetic sensing system may further include a shaft configured to rotate the magnet. The shaft may be part of a mechanical system, such as a steering system, with a magnetic sensor package for monitoring the system.

A third aspect of the present disclosure provides a method of manufacturing a magnetic sensor package, the method comprising: providing a packaging substrate; forming at least one integrated device die on the package substrate, the at least one integrated device die comprising: a first sensor portion having a sensing element configured to detect an orientation of a magnetic field generated by a rotating magnet; and a second sensor portion having a sensing element configured to detect a number of turns of the rotating magnet; and forming a case around the package substrate.

Forming the at least one integrated device die may further include forming a first integrated device die including the first sensor portion, and forming a second integrated device die including the second sensor portion. In this case, the first integrated device die may be formed on a first portion of the package substrate and the second integrated device die may be formed on a second portion of the package substrate, the first portion being adjacent to the second portion.

The first and second integrated device dies may be configured such that a top surface of the first integrated device die is parallel to a top surface of the second integrated device die.

In some arrangements, the method may further include forming an application specific integrated circuit die on the package substrate. A first integrated device die may then be formed on the application specific integrated circuit die.

The method may also include attaching one or both of the first integrated device die and the second integrated device die to the package substrate using a die attach film.

Optionally, the method may include attaching one or more of the first integrated device die, the second integrated device die, and the application specific integrated circuit die to the package substrate using epoxy die attach.

Advantageously, the package substrate may comprise a non-magnetic material.

In some arrangements, forming the housing may include providing a first molded component on a first side of the package substrate, providing a second molded component on a second side of the package substrate, and connecting the first and second molded components to enclose the package substrate.

Drawings

The present disclosure will now be described, by way of example only, with reference to the accompanying drawings, in which:

FIG. 1 is a perspective view of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 2 is a cross-sectional end view of the sensor package of FIG. 1;

FIG. 3 is a cross-sectional side view of the sensor package of FIG. 1;

FIG. 4 is an example of the magnetic sensor package of FIG. 1 in use;

FIG. 5 further illustrates the sensor package example of FIG. 1 in use;

FIG. 6 further illustrates the sensor package example of FIG. 1 in use;

FIG. 7 shows another example of the sensor package of FIG. 1 in use;

FIG. 8 further illustrates another example of the sensor package of FIG. 1 in use;

FIG. 9 further illustrates another example of the sensor package of FIG. 1 in use;

FIG. 10 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 11 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 12 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 13 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 14 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 15 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 16 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 17 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 18 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 19 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 20 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 21 shows another example of a magnetic sensor package according to an embodiment of the present disclosure;

FIG. 22 illustrates another example of the sensor package of FIG. 1 in use;

fig. 23 is a flow chart illustrating a method of manufacturing according to an embodiment of the present disclosure.

Detailed Description

Magnetic multi-turn and single-turn sensors can be used to monitor the number of turns and angular position of the rotating shaft. Such magnetic sensing may be applied in a variety of different applications, such as automotive applications, medical applications, industrial control applications, consumer applications, and many other applications requiring information about the position of a rotating component.

The present disclosure provides a magnetic sensor package comprising a magnetic Single Turn (ST) sensor and a magnetic multi-turn (MT) sensor packaged together on a single lead frame. The present disclosure also provides a method of positioning a magnetic sensor package relative to a rotating magnet to ensure that the ST sensor is located within a uniform magnetic field. Thus, the placement of the ST sensor and the MT sensor within the assembly will be based in part on the intended positioning of the sensor assembly after installation.

The ST sensors described herein may be Anisotropic Magnetoresistance (AMR), tunnel Magnetoresistance (TMR), giant Magnetoresistance (GMR), hall, or other magnetic-based ST angle sensors. Similarly, the MT sensor described herein may be a multi-turn sensor based on Tunnel Magnetoresistance (TMR) or Giant Magnetoresistance (GMR).

Fig. 1 to 3 show a magnetic sensor package 1 according to an embodiment of the present disclosure. The magnetic sensor package 1 comprises a package substrate 100, also referred to as a leadframe panel, which may comprise a laminate substrate, such as a Printed Circuit Board (PCB) substrate, a ceramic substrate, or any suitable type of substrate. An Application Specific Integrated Circuit (ASIC) die 102 is formed on the package substrate 100, on which a first integrated device die 104 is stacked, in which case the first integrated die 104 includes a magnetic multi-turn (MT) sensing element configured to count the number of turns in a rotating magnetic field. A second integrated device die 106 is provided on the substrate 100 adjacent to the ASIC die 102 and the MT sensor die 104 stack, the second integrated device die 106 including a magnetic Single Turn (ST) sensing element configured to measure an angular position of a rotating magnetic field.

The ASIC die 102, MT sensor die 104, and ST sensor die 106 may be assembled and secured to the substrate 100 in any suitable manner, for example, using an epoxy die attach or Die Attach Film (DAF). Preferably, by using DAF, there is no fear that the epoxy material oozes out on the edge of the substrate 100. Accordingly, the ASIC die 102 and MT sensor die 104 stack and the ST sensor die 106 may be located near the edge of the substrate 100, which may be preferred in applications where the sensor package 1 is located away from the axis of rotation of the magnet, as will be described in more detail below. Furthermore, once the package 1 has been assembled and in use, the use of DAF may prevent movement of the sensor dies 104 and 106, while the use of epoxy die attach may experience flow and shrinkage during curing. As will be described in more detail below, it is important that the sensor dies 104 and 106, and in particular the ST sensor die 106, do not move around once installed as part of the sensing system. The magnetoresistive elements in the ST and MT sensors are sensitive to changes in magnetic field strength and magnetic field angle, however, to monitor the position and number of turns of the magnetic field, only changes in the magnetic field angle are of interest, which can lead to errors in the sensor readings. Thus, the sensor dies 104 and 106 need to be fixed in positions where a uniform magnetic field exists in order to provide accurate readings, and it is therefore important that they not move to positions that experience different magnetic field strengths.

Furthermore, the MT sensor die 104 and the ST sensor die 106 are configured such that the top surfaces of each die are aligned on the same horizontal plane. That is, the distance from package substrate 100 to the top surface of MT sensor die 104 is the same as the distance from package substrate 100 to the top surface of ST sensor die 106. Therefore, when the magnetic sensor package 1 is placed near the magnet, the two sensors are at the same distance from the magnet in the z-direction and therefore experience the same magnetic field. If one sensor is closer than the other, it will experience a stronger magnetic field of different magnitude in the x-y plane, which may result in differences between the individual sensor outputs.

The package substrate 100 includes leads 108 on its lower surface to facilitate electrical connection with other electronic systems, for example, through another board such as a printed circuit board. The package substrate 100 and the leads 108 together may be considered a lead frame of the magnetic sensor package 1. The package substrate 100, the ASIC die 102, the MT sensor die 104, and the ST sensor die 106 are all housed within a molded package body 110. For example, the package body 110 may include a non-conductive molding including a double-sided configuration. As such, the molded package 110 may include two

hollow components

110A, 110B that are attached around the edges to form a housing, for example, by thermoplastic welding or bonding techniques (e.g., thermal compression bonding). Electrical connections 112 between the dies 102, 104, and 106 and the leads 108 may also be housed within the molded package body 110.

The present disclosure also provides a method of manufacturing the magnetic sensor package 1 described herein, as shown in fig. 23. In step 20, a package substrate 100 is first provided, the package substrate 100 including one or more leads 108. The package substrate 100 is advantageously made of a non-magnetic material, such as a copper alloy. This is particularly important to prevent any distortion of the external magnetic field in which it is located, which helps to improve the measurement accuracy of the MT sensor die 104 by ensuring that the MT sensor die 104 and the ST sensor die 106 measure the true magnetic field.

In step 21, an MT sensor die 104 and an ST sensor die 106 are then formed on the package substrate 100. In this example, the ASIC die 102 is also formed on the package substrate 100 such that the ASIC die 102 is formed between the package substrate 100 and the MT sensor die 104. However, it should be understood that the ASIC die 102 may be located in different locations on the package substrate.

At step 22, the MT sensor die 104, ST sensor die 106, and ASIC die 102 are attached to the package substrate 100. As described above, die Attach Film (DAF) or epoxy die may be used to attach to ASIC die piece 102, MT sensor die piece 104, and ST sensor die piece 106. The use of DAF is particularly advantageous because it avoids any material bleed on the edges of the substrate 100, which allows the sensor dies 104 and 106 to be placed close to the edges and ensures that the sensor dies 106 and 104 do not move once the package 1 has been assembled and in use.

The leads 108 are bonded to the sensor dies 102, 104, and 106 using suitable wire bond interconnects at step 23, and then a package 110 is formed around the package substrate 100 at step 24 to form a housing for the package, the ASIC die 102, the mt sensor die 104, and the ST sensor die 106. In this regard, the package body 110 is formed such that only the leads 108 extend therefrom to facilitate electrical connection with other components. As described above, the package body 110 may be formed by connecting the two molded

components

110A, 110B using any suitable connection technique. Preferably, the package body 110 is formed using a suitable plastic compound.

Fig. 4 to 6 illustrate a first method of positioning the magnetic sensor package 1 with respect to the magnetic assembly 2. The magnet assembly 2 includes a circular magnet 200 disposed at the end of a rotating shaft 202. The rotating shaft 202 may then be connected to a rotating member (not shown), such as a steering wheel. In the present embodiment, the magnetic sensor package 1 is aligned with the rotational axis 202 of the magnetic assembly 2 (so-called "on-axis" arrangement). Specifically, the magnetic sensor package 1 is positioned such that the ST sensor die 106 is directly aligned with the axis of rotation Z of the magnetic assembly 2, as shown in fig. 5 and 6. More specifically, the center point of ST sensor die 106 is aligned with the magnetic center of rotating magnet 200 such that ST sensor die 106 is located within a uniform magnetic field, that is, the magnetic field strength remains substantially the same while the magnetic field direction changes with rotation. This helps prevent ST sensor die 106 from experiencing any stray fields that may cause errors in the measured position. The multi-turn sensor die 104 is arranged such that it is also substantially in line with the axis of rotation Z of the magnetic component 2, so that any stray field it may experience will not be sufficient to interrupt its number of turns. In this regard, MT sensors are more tolerant of stray magnetic fields than ST sensors, since MT sensors typically measure the number of turns of the magnetic field in 90 ° or 180 ° increments, and therefore do not require the same accuracy as ST sensors.

Fig. 7 to 9 show another embodiment of a method of arranging the magnetic sensor package 1 with respect to the rotary magnet 200. The rotating shaft is not shown, but it is understood that the rotating magnet 200 would be connected to the rotating shaft in the same manner as shown in fig. 4-6. In this example, the magnetic sensor package 1 is positioned such that the magnetic sensor package is remote from the axis of rotation Z of the magnet 200 in an X-Y plane perpendicular to the axis of rotation Z (a so-called "off-axis" arrangement). As shown in detail in fig. 9, the magnetic sensor package 1 is arranged such that both the ST sensor die 106 and the MT sensor die 104 are located within a magnetic corridor (here denoted as 202) where the magnetic field strength is constant and only the magnetic field direction changes. As with the previous example, by arranging both sensor dies 104 and 106 within this channel 202, both are located within a uniform magnetic field. Thus, the magnetic field strength in this channel 202 remains substantially the same, while the field angle varies in proportion to the angle of rotation of the magnet about the z-axis. To ensure that both sensors are within magnetic tunnel 202, MT sensor die 104 and ST sensor die 106 need to be substantially the same distance from rotational axis Z, and MT sensor die 104 and ST sensor die 106 need to be substantially the same distance from rotational axis Z. For example, with a ring magnet 200 having an outer diameter of 14mm, an inner diameter of 8mm and a height of 3.5mm, the magnetic sensor package 1 will be located within the magnetic tunnel, whereby there is substantially no change in magnetic field strength at a distance of about 3mm from the magnet 200 in the z-direction and at a radial distance of about 6.5mm from the axis of rotation z.

In both arrangements, the MT sensor die 104 and the ST sensor die 106 are the same distance in the z-direction from the magnet 200. Thus, both sensor dies 104 and 106 experience the same magnetic field.

Fig. 10-21 illustrate a number of different ways in which magnetic multi-turn sensors and magnetic single-turn sensors may be arranged within a single leadframe package.

Figures 10 and 11 show two different ways of stacking the single and multi-turn sensors such that both the multi-turn and single-turn sensors are aligned with the axis of rotation of the magnetic body. Fig. 10 shows arrangement 3 in which multi-turn sensor die 304 and ASIC die 302 are arranged in a single package 308 on a first side of printed circuit board 300, and single-turn sensor die 306 is arranged in a second package 310 on a second side of printed wiring board 300. Fig. 11 shows another arrangement 4 in which a single turn sensor die 406 is mounted on top of a multi-turn sensor die 404, then on top of an ASIC die 402, and then the entire stack is arranged in a single package 408 on a printed circuit board 400.

Fig. 12 and 13 show two arrangements in which a single turn sensor die and a multi-turn sensor die are arranged side by side. Fig. 12 shows an arrangement 5 in which an ASIC die 502, a multi-turn sensor die 504, and a single-turn sensor die 506 are arranged side-by-side in series within a single package 508. In arrangement 6 of fig. 13, each of ASIC die 602, multi-turn sensor die 604, and single-turn sensor die 606 are disposed in

separate connection packages

608, 610, and 612, respectively, on the same printed circuit board 600. In both examples, the arrangement is positioned such that the centre of the single turn sensor die is aligned with the axis of rotation of the rotating magnet.

Fig. 14 and 15 both show two possible ways of arranging a multi-turn sensor die and a single-turn sensor die side-by-side on top of an ASIC die, and then packaging the entire arrangement within the same package on a printed circuit board. In both cases, the package is arranged so that the single turn sensor is aligned with the axis of rotation of the rotating magnet. In arrangement 7 of fig. 14, an MT sensor die 704 is arranged on a first leadframe 710 on an ASIC die 702, and an ST sensor die 716 is arranged on a second leadframe 712 on an ASC die 702. In fig. 15, the MT sensor die 804 and the ST sensor tube 806 are disposed on one side of the leadframe 810, with the ASIC die 102 disposed on the other side.

Fig. 16 and 17 illustrate a magnetic sensor package comprising two sensor arrangements within the same package. Fig. 16 shows a sensor package 9 comprising a first sensor arrangement comprising an ASIC die 902A on which a multi-turn sensor die 904A and a single-turn sensor die 906A are mounted in series, and a second sensor arrangement further comprising an ASIC die 902B on which a single-turn sensor die 906B and a multi-turn sensor die 904B are mounted in parallel. In this arrangement, two single turn sensor dies 906A and 906B are arranged at a position perpendicular to the axis of rotation of the magnet, which is equidistant from the center of the magnet, the two

single turn sensors

906A, 906B thus providing differential measurements. Fig. 17 shows a similar arrangement 10, where in each sensor arrangement is a stack comprising single turn sensor dies 1006A, 1006B mounted on top of multi-turn sensor dies 1004A, 1004B, which are then mounted on ASIC dies 1002A, 1002B. Similarly, each sensor stack is arranged at a position perpendicular to the axis of rotation of the magnet, which is equidistant from the center of the magnet.

Fig. 18 shows another arrangement 11 in which a single turn sensor die 1106 is mounted on top of a multi-turn sensor die 1104, and the multi-turn sensor die 1104 is mounted on top of an ASIC die 1002 by wire bonds 1110. Fig. 19 then shows sensor package 12, including a stack of single turn sensor die 1206 and multi-turn sensor die 1204 located adjacent ASIC die 1202 on the same lead frame 1210.

Fig. 20 shows another arrangement 13 in which a single-turn sensor die 1306 and a multi-turn sensor die 1304 are arranged side-by-side within a substrate 1302. FIG. 21 shows another arrangement 14 in which a single turn sensor die 1406 and a multi-turn sensor die 1404 are arranged side by side and molded into a laminate 1402.

Although fig. 10-21 show the sensor assembly positioned in an "on-axis" arrangement with the single-turn sensor die aligned with the axis of rotation of the magnet, it is also understood that the sensor assembly may also be positioned in an "off-axis" arrangement, as described with reference to fig. 7-9, with the sensor package placed in the magnetic corridor of the magnet where the magnetic field strength is constant.

Fig. 22 shows another "in-line" arrangement 15 in which the sensor package 1 is located on a substrate 1504 and is placed inside a ring magnet 1502. It will be appreciated that the ring magnet 1502 will be mounted on some form of mechanical system that rotates, and that the sensor package 1 may be any of those described herein. By placing the sensor package 1 inside the ring magnet 1502, the sensor package 1 experiences the magnetic field generated by the magnet 1502 at the point where the magnet 1502 is most uniform and least likely to be affected by stray magnetic fields.

Although the above examples include an MT sensor die and a separate ST sensor die, it should be understood that the multi-turn (MT) sensing element and the single-turn (ST) sensing unit may be disposed on the same integrated die within the sensor package.

Applications of the invention

Any of the principles and advantages discussed herein may be applied to other systems, not just the systems described above. Some embodiments may include a subset of the features and/or advantages set forth herein. The elements and operations of the various embodiments described above can be combined to provide further embodiments. The actions of the methods discussed herein may be performed in any order as appropriate. Further, the acts of the methods discussed herein may be performed in series or in parallel, as appropriate. Although the circuits are shown in a particular arrangement, other equivalent arrangements are possible.

Any of the principles and advantages discussed herein may be implemented in conjunction with any other system, apparatus, or method that may benefit from any of the teachings herein. For example, any of the principles and advantages discussed herein may be implemented in connection with any device that requires correction of rotational angle position data derived from a rotating magnetic field. Further, the device may comprise any magnetoresistive or Hall effect device capable of sensing a magnetic field.

Aspects of the present disclosure may be implemented in various electronic devices or systems. For example, phase correction methods and sensors implemented in accordance with any of the principles and advantages discussed herein may be included in various electronic devices and/or in various applications. Examples of electronic devices and applications may include, but are not limited to, servo, robot, airplane, submarine, toothbrush, biomedical sensing devices, and components of consumer electronics, such as semiconductor die and/or package modules, electronic test equipment, and the like, automotive and/or medical applications.

Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, in the sense of "including, but not limited to". The term "coupled" or "connected," as used generally herein, refers to two or more elements that are either directly connected or connected through one or more intervening elements. Thus, although the various schematic diagrams shown in the figures depict example arrangements of elements and components, additional intervening elements, devices, features, or components may be present in an actual embodiment (assuming that the functionality of the depicted circuitry is not adversely affected). The term "based on" as used herein is generally intended to include "based only on" and "based, at least in part, on". Further, as used in this application, the terms "herein," "above," "below," and words of similar import shall refer to this application as a whole and not to any particular portions of this application. Words using the singular or plural number in the detailed description of particular embodiments may also include the plural or singular number, respectively, as the context permits. The word "or" refers to a list of two or more items and is intended to cover all of the following interpretations of the word: any item in the list, all items in the list, and any combination of items in the list. All numerical values or distances provided herein are intended to include similar values within measurement error.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosure. Indeed, the novel devices, systems, and methods described herein may be embodied in a variety of other forms. Furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the disclosure.

Claims

1. A magnetic sensor package, comprising:

at least one integrated device die comprising:

a first sensor portion having a sensing element configured to detect an orientation of a magnetic field generated by a rotating magnet; and

a second sensor portion having a sensing element configured to detect a number of turns of the rotating magnet;

a package substrate, wherein the at least one integrated device die is mounted on the package substrate; and

a housing, wherein the housing encapsulates the package substrate at the at least one integrated device die.

2. A magnetic sensor package according to claim 1, wherein said at least one integrated device die comprises: a first integrated device die including the first sensor portion and a second integrated device die including the second sensor portion.

3. A magnetic sensor package according to claim 2, wherein the first integrated device die is adjacent to the second integrated device die on the package substrate.

4. A magnetic sensor package according to claim 3, wherein the top surface of said first integrated device die is parallel to the top surface of said second integrated device die.

5. A magnetic sensor package according to claim 2, wherein said first integrated device die is stacked on said second integrated device die.

6. A magnetic sensor package according to any one of claims 2 to 4, wherein one or both of the first integrated device die and the second integrated device die are mounted to the package substrate using a die attach film.

7. A magnetic sensor package according to any preceding claim, wherein the package substrate comprises a non-magnetic material.

8. A magnetic sensor system, comprising:

a rotatable magnet configured to generate a rotating magnetic field; and

a magnetic sensor package comprising:

at least one integrated device die comprising:

9. A magnetic sensor system according to claim 8, wherein said magnetic sensor package is aligned with the axis of rotation of said magnet.

10. A magnetic sensor system according to claim 8 or 9, wherein the centre of said first sensor section is aligned with the rotational axis of said magnet.

11. A magnetic sensor system according to claim 8, wherein said magnetic sensor package is offset from the axis of rotation of said magnet.

12. A magnetic sensor system according to claim 8, wherein said magnetic sensor package is located in a first position in a plane perpendicular to the axis of rotation of said magnet.

13. A magnetic sensor system according to claim 12, wherein said first position experiences a constant magnetic field strength when said magnet rotates.

14. A method of manufacturing a magnetic sensor package, the method comprising:

providing a packaging substrate;

forming at least one integrated device die on the package substrate, the at least one integrated device die comprising: a first sensor portion having a sensing element configured to detect an orientation of a magnetic field generated by a rotating magnet; and a second sensor portion having a sensing element configured to detect a number of turns of the rotating magnet; and

a case is formed around the package substrate.

15. The method of manufacturing of claim 14, wherein forming the at least one integrated device die comprises forming a first integrated device die including the first sensor portion, and forming a second integrated device die including the second sensor portion.

16. The method of manufacturing of claim 15, wherein the first integrated device die is formed on a first portion of the package substrate and the second integrated device die is formed on a second portion of the package substrate, the first portion being adjacent to the second portion.

17. The method of manufacturing of claim 16, wherein the first and second integrated device dies are configured such that a top surface of the first integrated device die is parallel to a top surface of the second integrated device die.

18. The manufacturing method of any of claims 15 to 17, further comprising attaching one or both of the first integrated device die and the second integrated device die to the package substrate using a die attach film.

19. The manufacturing method according to any one of claims 14 to 18, wherein the package substrate includes a non-magnetic material.

20. The manufacturing method according to any one of claims 14 to 19, wherein forming the housing includes:

providing a first molded part on a first side of the package substrate;

providing a second molded component on a second side of the package substrate; and

the first molding member and the second molding member are connected to surround the package substrate.