CN115666007A - Method for manufacturing solder mask pre-curing baking plate by PCB - Google Patents
Method for manufacturing solder mask pre-curing baking plate by PCB Download PDFInfo
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- CN115666007A CN115666007A CN202211335226.8A CN202211335226A CN115666007A CN 115666007 A CN115666007 A CN 115666007A CN 202211335226 A CN202211335226 A CN 202211335226A CN 115666007 A CN115666007 A CN 115666007A
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Abstract
The invention discloses a method for manufacturing a solder resist pre-curing baking plate by a PCB (printed circuit board), which is characterized by comprising the following steps of: the method comprises the following steps of S1, preprocessing a PCB; s2, automatically printing the connecting line of the PCB; s3, standing before pre-baking; s4, pre-baking the connecting line; s5, exposure of the connecting line; s6, connecting line development; and S7, detecting the pre-curing effect of the PCB. The invention newly increases the standing time period before prebaking, overcomes the problem that the standing is not carried out after the solder resist ink is printed until the prebaking, and can solve the problem of insufficient precuring of the PCB.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a method for manufacturing a solder resist pre-curing baking plate by a PCB.
Background
With the development of science and technology, high-tech electronic and electric products are more and more appeared in our schedule life, one of important parts in the high-tech products comprises a PCB (circuit board), in order to meet the requirement of the order quantity of the PCB of a customer, in order to realize automatic line production, a solder resisting process in the PCB manufacturing process needs to implement line production of processes such as printing, pre-baking, exposure, development and the like; because the pre-baking oven for connecting the wires does not have a standing time period, the welding-proof bubbles are poor among the wires when a thick copper plate (the thickness of bottom copper is more than or equal to 1 oz) or a special ink baking plate is produced, the pre-baking for connecting the wires cannot be carried out, the production efficiency is seriously influenced, and the hidden quality trouble exists.
Disclosure of Invention
The invention aims to solve the problems that: the method for manufacturing the solder resist pre-curing baking plate for the PCB is provided, the standing time period before pre-baking is newly increased, the problem that the printed solder resist ink does not stand until the printed solder resist ink is pre-baked is solved, and the problem of insufficient pre-curing of the PCB can be solved.
The technical scheme provided by the invention for solving the problems is as follows: a method for manufacturing a solder resist pre-cured baking plate of a PCB comprises the following steps,
s1, preprocessing a PCB;
s2, automatically printing the connecting line of the PCB;
s3, standing before pre-baking;
s4, pre-baking the connecting line;
s5, exposing the connecting line;
s6, connecting line development;
and S7, detecting the pre-curing effect of the PCB.
Preferably, the PCB pre-processing in S1 specifically comprises the following steps,
s1.1, cutting: cutting a copper-clad plate large material into a working plate with a specified size;
s1.2, inner layer graph: manufacturing an inner layer circuit graph and a board edge target graph according to engineering data;
s1.3, AOI detection: using AOI to inspect the quality of the circuit board;
s1.4, pressing: combining the PCBs at different levels together by using a high-temperature fusion mode according to the customer stacking requirement;
s1.5, drilling: cutting hole sites on the PCB board to facilitate the operation of plugging and conducting;
s1.6, copper deposition/electroplating: covering a metal coating on the PCB by using an electrolysis mode;
s1.7, outer layer circuit: and manufacturing an outer layer circuit pattern and a board edge target pattern according to the engineering data.
Preferably, the time for standing before pre-baking in the step S3 is 45min.
Preferably, in the step S3, the specific process of standing before pre-baking is to turn off heating of 5 bins in front of the pre-baking oven, and the conveying time of each bin of the 5 bins is set to be 9min.
Preferably, the connection pre-baking in S4 specifically includes opening the heating of the last 5 bins of the pre-baking oven, where the heating temperature of each bin of the last 5 bins is 80 ℃, and the conveying time is 9min.
Preferably, the pre-oven is a hot air claw oven.
Compared with the prior art, the invention has the advantages that:
1. by newly adding the standing time period before prebaking, the connection prebaking parameters are optimized, and the problem that the standing is not caused after the solder resist ink is printed until before prebaking is solved;
2. the problem that the PCB is insufficiently pre-cured after the pre-baking oven is newly added and stands is solved;
3. by solving the problem of circuit bubbles, the PCB is in the process of solder mask connection production, and the production efficiency and the product quality are improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a parameter diagram of the inline pre-bake process of the present invention;
FIG. 2 is a parameter diagram of a prior art in-line pre-bake process.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present invention can be fully understood and implemented.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., it indicates that the orientation and positional relationship shown in the drawings are based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated without limiting the specific scope of protection of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may, explicitly or implicitly, include one or more of that feature, and in the context of this disclosure, a "plurality" means two or more unless otherwise specifically defined.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above-mentioned terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the invention. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Example 1
A method for manufacturing a solder resist pre-cured baking plate of a PCB comprises the following steps,
s1, preprocessing a PCB;
s2, automatically printing the PCB connecting line;
s3, standing for 45min before pre-baking;
s4, pre-baking the connecting line;
s5, exposure of the connecting line;
s6, connecting line development;
and S7, detecting the pre-curing effect of the PCB.
Preferably, the PCB pre-treatment in S1 specifically comprises the following steps,
s1.1, cutting: cutting a copper-clad plate large material into a working plate with a specified size;
s1.2, inner layer graph: manufacturing an inner layer circuit graph and a plate edge target graph according to engineering data;
s1.3, AOI detection: using AOI to inspect the quality of the circuit board;
s1.4, pressing: combining the PCBs at different levels together by using a high-temperature fusion mode according to the customer stacking requirement;
s1.5, drilling: cutting hole sites on the PCB board to facilitate the operation of inserting and conducting;
s1.6, copper deposition/electroplating: covering a metal coating on the PCB by using an electrolysis mode;
s1.7, outer layer circuit: and manufacturing an outer layer circuit pattern and a board edge target pattern according to the engineering data.
And in the S3, the specific process of standing before pre-baking is to close the heating of 5 bins in front of the pre-baking oven, and the conveying time of each bin of the 5 bins is set to be 9min.
The specific process of the connection line pre-baking in the S4 is to open the heating of 5 bins behind the pre-baking furnace, wherein the heating temperature of each bin of the 5 bins is 80 ℃, and the conveying time is 9min.
The parameters of the connecting line pre-baking process are as follows: 9min at 30 ℃ + 9min 9min +80 ℃ C. 9min; the first 5 parameters are technological parameters of 5 bins in front of the pre-baking furnace, the heating of the first 5 bins is closed, the temperature of the workshop is 30 ℃ under the control of room temperature, and the last 5 parameters are technological parameters of 5 bins behind the pre-baking furnace, which are specifically shown in fig. 1.
It should be noted that, the invention closes the heating of the front 5 bins of the pre-baking oven by modifying the parameters of the on-line pre-baking process, does not need additional equipment, and realizes the new increase of the standing time period before pre-baking.
Example 2
The technical scheme adopted by the invention comprises the following manufacturing steps:
1. PCB manufacturing main process: cutting, inner layer graph, AOI detection, pressing, drilling, copper deposition, plate electric, outer layer circuit, solder resistance, character surface treatment, molding, FQC packaging and shipment;
key process (solder resist: pretreatment-printing-prebaking-exposure-developing-character-postcuring)
1. Cutting: the method comprises the step of cutting a large copper-clad plate into a working plate with a specified size.
2. Inner layer pattern: and manufacturing an inner layer circuit pattern and a board edge target pattern according to the engineering data.
AOI detection: the circuit board quality was checked using AOI (automated optical inspection machine).
4. And (3) laminating: combining the PCBs of different levels together by high temperature fusion according to the stacking requirement of customers
5. Drilling: cutting hole sites on the PCB board to facilitate the operation of inserting and conducting;
6. copper deposition/electroplating: covering a metal coating on the PCB by using an electrolysis mode;
7. outer layer circuit: and manufacturing an outer layer circuit pattern and a board edge target pattern according to the engineering data.
8. Resistance welding: the printing ink is transferred to the circuit board by a screen printing missing mode to form a pattern consistent with the negative film, the solder mask is a protective film which can prevent bridging during welding and provide a long-time insulating environment and chemical protection resistance (the solder mask process flow comprises pretreatment, printing, prebaking, exposure, development, character and post curing), wherein the prebaking process is to bake the printed wet printing ink, and dry film is formed by drying the printing ink, so that the exposure production is convenient;
9. surface treatment: a layer of coating is formed on the surface of the PCB, and the surface of the PCB has good weldability or electrical property;
10. molding: decomposing the PCB according to the size required by a customer;
FQC: using an AOI (automatic optical inspection machine) to inspect the FQC;
the technical scheme adopted by the invention comprises the following manufacturing steps:
the automatic hole plugging machine comprises an automatic board placing machine used for automatically taking and placing boards, a first roller conveyor belt, an automatic hole plugging machine, a second roller conveyor belt, a hole plugging roll-leveling machine used for rolling redundant ink on a PCB after automatic hole plugging, a first mechanical arm used for adjusting the horizontal state of the PCB to the vertical state, an electrostatic spraying machine, a four-quadrant converter, a hot air hanging claw oven and a second mechanical arm used for adjusting the vertical state of the PCB to the horizontal state. Wherein, the temperature of the hot air hanging claw oven is 50-80 ℃, the baking plate is heated uniformly and stably, and the reliability of the performance of the PCB is ensured.
The foregoing is merely illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the claims. The present invention is not limited to the above embodiments, and its specific structure is allowed to vary. All changes which come within the scope of the invention as defined by the independent claims are intended to be embraced therein.
Claims (6)
1. A method for manufacturing a solder resist pre-curing baking plate for PCB is characterized by comprising the following steps: the method comprises the following steps of (a) carrying out,
s1, preprocessing a PCB;
s2, automatically printing the connecting line of the PCB;
s3, standing before pre-baking;
s4, pre-baking the connecting line;
s5, exposing the connecting line;
s6, developing the connecting line;
and S7, detecting the pre-curing effect of the PCB.
2. The method for manufacturing the solder resist pre-cured baking plate of the PCB as claimed in claim 1, wherein: the PCB pretreatment in S1 specifically comprises the following steps,
s1.1, cutting: cutting a large copper-clad plate material into a working plate with a specified size;
s1.2, inner layer graph: manufacturing an inner layer circuit graph and a plate edge target graph according to engineering data;
s1.3, AOI detection: using AOI to inspect the quality of the circuit board;
s1.4, pressing: combining the PCBs at different levels together by using a high-temperature fusion mode according to the customer stacking requirement;
s1.5, drilling: cutting hole sites on the PCB board to facilitate the operation of inserting and conducting;
s1.6, copper deposition/electroplating: covering a metal coating on the PCB by using an electrolysis mode;
s1.7, outer layer circuit: and manufacturing an outer layer circuit pattern and a board edge target pattern according to the engineering data.
3. The method for manufacturing the solder resist pre-curing baking plate of the PCB as claimed in claim 1, wherein: and the standing time before pre-baking in the S3 is 45min.
4. The method for manufacturing the solder resist pre-curing baking plate of the PCB as claimed in claim 1, wherein: and the specific process of standing before pre-baking in the S3 is to close the heating of 5 bins in front of the pre-baking furnace, and the conveying time of each bin of the 5 bins is set to be 9min.
5. The PCB manufacturing solder mask pre-curing baking plate method of claim 4, wherein: the specific process of the connection line pre-baking in the S4 is that the heating of 5 bins behind the pre-baking furnace is opened, the heating temperature of each bin of the 5 bins is 80 ℃, and the conveying time is 9min.
6. The method for manufacturing the solder resist pre-curing baking plate of the PCB as claimed in claim 5, wherein: the pre-baking oven is a hot air hanging claw baking oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211335226.8A CN115666007A (en) | 2022-10-28 | 2022-10-28 | Method for manufacturing solder mask pre-curing baking plate by PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211335226.8A CN115666007A (en) | 2022-10-28 | 2022-10-28 | Method for manufacturing solder mask pre-curing baking plate by PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115666007A true CN115666007A (en) | 2023-01-31 |
Family
ID=84992782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211335226.8A Pending CN115666007A (en) | 2022-10-28 | 2022-10-28 | Method for manufacturing solder mask pre-curing baking plate by PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115666007A (en) |
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2022
- 2022-10-28 CN CN202211335226.8A patent/CN115666007A/en active Pending
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