CN115665532A - Manufacturing method of flip camera module and product manufactured by manufacturing method - Google Patents
Manufacturing method of flip camera module and product manufactured by manufacturing method Download PDFInfo
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- CN115665532A CN115665532A CN202211320663.2A CN202211320663A CN115665532A CN 115665532 A CN115665532 A CN 115665532A CN 202211320663 A CN202211320663 A CN 202211320663A CN 115665532 A CN115665532 A CN 115665532A
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Abstract
The invention relates to the technical field of cameras, in particular to a manufacturing method of an inverted camera module and a manufactured product thereof, wherein the manufacturing method comprises the following steps: an image chip connecting step: the image chip is provided with gold balls, the gold balls are electrically connected with one surface of the circuit board through the gold balls, the gold balls are packaged to form a packaging layer, and the packaging layer is connected with the image chip and the circuit board; carrying the lens assembly: and carrying the lens assembly on the other surface of the circuit board. Packaging the gold balls, which comprises the following steps: glue is adopted for glue dispensing in the gap between the image chip and the circuit board, and the glue component comprises a UV material; and pre-curing the surface of the glue through ultraviolet light, heating and baking the pre-cured glue, and curing to form a packaging layer. This scheme of adoption can solve image chip and circuit board and connect unstablely among the prior art, the technical problem that the reliability is low to reduce the height of camera module.
Description
Technical Field
The invention relates to the technical field of cameras, in particular to a manufacturing method of an inverted camera module and a manufactured product thereof.
Background
In the packaging process of the camera module, the image chip for imaging and the circuit board for signal transmission need to be electrically connected. In the prior art, the connection between the image chip and the circuit board is usually pins, leads and solder joints, and the pins need to be connected at corresponding positions of the image chip and the circuit board by soldering tin and the like, so that the overall size of the module is large; the leads can be bent in a lead connection mode, layout can be carried out according to components in the module during connection, and the overall size of the module can be reduced to a certain extent; the mode of solder joint connection does not need the structure of carrying out soldering tin such as pin, lead wire, directly realizes the electric connection of image chip and circuit board through the solder joint for the whole size of module is littleer. Therefore, in the design of miniaturization and lightness of products, the camera module connected by using the welding spot is more popular.
However, the image chip and the circuit board are connected only by the solder joints in the solder joint connection manner, and the connection between the image chip and the circuit board is unstable. Meanwhile, the quality of the welding spot depends on the welding process, when a certain welding spot is not welded well, the welding spot cannot be found in time, the welding spot is easy to lose efficacy due to the influences of shaking, oxidation and the like in the using process, so that the electrical connection between the image chip and the circuit board is broken, and therefore a product manufactured by the manufacturing method of the flip camera module capable of improving the connection reliability between the image chip and the circuit board is urgently needed.
Disclosure of Invention
One of the objectives of the present invention is to provide a method for manufacturing a flip-chip camera module, so as to solve the technical problems of unstable connection between an image chip and a circuit board and low reliability in the prior art.
The invention provides a basic scheme I: a manufacturing method of a flip-chip camera module comprises the following steps:
an image chip connecting step: the image chip is provided with gold balls, the gold balls are electrically connected with one surface of the circuit board through the gold balls, the gold balls are packaged to form a packaging layer, and the packaging layer is connected with the image chip and the circuit board;
carrying the lens assembly: and carrying the lens assembly on the other surface of the circuit board.
The beneficial effects of the first basic scheme are as follows:
1. wrap up the gold ball through the encapsulation layer in this scheme, the setting of encapsulation layer completely cuts off gold ball and external world, reduces the probability of gold ball oxidation. Meanwhile, the gold balls realize the electrical connection between the image chip and the circuit board, the packaging layer wrapped by the gold balls is also connected with the image chip and the circuit board, and the stability of the connection between the image chip and the circuit board is improved through the arrangement of the packaging layer, so that the reliability of the product is guaranteed.
2. The existing packaging technology sequentially packages the image chip, the optical filter and the lens component, and in the packaging process, the image chip and the lens component are positioned on the same side of the circuit board, so that the structure of the existing camera is limited by an optical focal distance space, and the minimum height of the camera module is the thickness of the optical focal distance space superposed with the image chip and the circuit board. In the scheme, the image chip and the lens component are respectively arranged on two sides of the circuit board, the thickness of the circuit board is contained in the optical focal distance space, and the space matched with other components when the camera module is used for application contains the image chip, so that the height of the camera module is reduced. This scheme of adoption, the thickness minimum of camera module can equal to optical focal length, realizes the effective reduction of camera module height promptly, promotes the experience sense and the frivolousization of its application product.
Further, the gold balls are packaged, and the method comprises the following steps:
glue is adopted for glue dispensing in the gap between the image chip and the circuit board, and the glue component comprises a UV material;
the surface of the glue is pre-cured by ultraviolet light.
Has the beneficial effects that: in the micro camera module processing process, the product components are small, the dispensing difficulty is high, and meanwhile, the technical difficulty of the dispensing process is complex, so that in the prior art, when the micro camera module is dispensed, a good dispensing effect is difficult to achieve. This scheme is glued in the clearance between image chip and the circuit board and is glued, makes glue flow through capillary phenomenon and forms the parcel to the gold ball, compares with prior art, and glue can form the effective protection to the gold ball. Meanwhile, the glue can form encapsulation on the side edge of the image chip, and plays a certain role in protecting the image chip.
In this scheme, the glue composition includes the UV material, and the back is glued to the point, and accessible ultraviolet ray carries out precuring to the glue surface of parcel gold ball, reduces the outside flow of glue and spills over, control glue flow range, and the image chip blocks the ultraviolet ray, and inside glue still can be filled, and glue stops flowing after the filling.
Further, the gold ball is packaged, which also comprises the following contents:
and heating and baking the pre-cured glue, and curing to form the packaging layer.
Has the beneficial effects that: the pre-cured glue is heated and baked, and is cured into a packaging layer so as to realize effective protection of the electrical connection of the product structure, and meanwhile, the reliability of the connection of the image chip and the circuit board is increased.
Further, the gold ball is packaged, and the method further comprises the following steps:
preheating glue, wherein the heating temperature is 50-60 ℃, and dispensing by adopting the heated glue;
and when the pre-cured glue is heated and baked, the baking temperature is 120-150 ℃.
Has the advantages that: glue is preheated to ensure the flowability of the glue, and the glue flows and is filled based on the capillary phenomenon when the glue is dispensed conveniently. And heating and baking the glue through the baking temperature, so that the glue can be completely cured.
Furthermore, the viscosity of the glue is 5000-40000cps, and the gap between the image chip and the circuit board is 5-15um.
Has the advantages that: in the glue viscosity scope of this scheme selection for use, the speed that glue flows is the most suitable, in the clearance scope between the image chip of this scheme selection for use and the circuit board, capillary phenomenon effect is better.
Further, the following contents are included:
the step of carrying the optical filter: a window is arranged on the circuit board and opposite to the image chip, and an optical filter is carried on the window.
Has the beneficial effects that: the window is used for light to pass through to realize the formation of image of camera module. The optical filter is carried on the window, and the window separates the optical filter and the image chip, so that the phenomenon that the optical filter and the image chip are close to each other to generate light spots and influence the imaging effect of the camera module is avoided.
Further, the optical filter includes:
dispensing glue at the contact position of the optical filter and the circuit board by adopting glue, wherein the glue comprises a UV material;
and curing the glue through ultraviolet light, and carrying the optical filter on one side surface of the circuit board far away from the image chip.
Has the advantages that: when the optical filter is carried, glue is also adopted for dispensing, and the optical filter is transparent and is not shielded, so that the optical filter is directly cured by ultraviolet light.
The second objective of the present invention is to provide a product manufactured by the manufacturing method of the flip-chip camera module.
The invention provides a second basic scheme: the product manufactured by the manufacturing method of the flip camera module comprises the lens component and the circuit board which are connected, and the distance between the surfaces, far away from each other, of the lens component and the circuit board is equal to the TTL parameter of the product.
Description of the nouns: the TTL parameter of the product is the TTL value of the camera module at the current focal length, namely the TTL parameter can change along with the camera module and the focal length.
The second basic scheme has the beneficial effects that:
the existing packaging technology sequentially packages the image chip, the optical filter and the lens component, and in the packaging process, the image chip and the lens component are positioned on the same side of the circuit board, so that the structure of the existing camera is limited by an optical focal distance space, and the minimum height of a camera module is the thickness of the optical focal distance space superposed with the image chip and the circuit board. In the scheme, the image chip and the lens component are respectively arranged on two sides of the circuit board, the thickness of the circuit board is contained in the optical focal distance space, and the space matched with other components contains the image chip when the camera module is used, so that the height of the camera module is reduced. This scheme of adoption, the thickness of camera module can equal optical focal length at minimum, realizes the effective reduction of camera module height promptly, promotes the experience sense and the frivolousization of its application product.
Further, the product still includes the image chip, and in the optical axis direction, satisfies following condition: the thickness of the lens assembly, the thickness of the joint between the lens assembly and the circuit board, the thickness of the gold ball and the measurement error = TTL parameters of the product.
Description of the nouns: the thickness of the gold ball is equal to the gap between the image chip and the circuit board, namely the thickness of the gold ball is 5-15um. The measurement error refers to an error generated by measuring each thickness and the TTL parameter, and specifically is the sum of the measurement error calibrated by different measurement devices multiplied by the corresponding measurement times.
Has the beneficial effects that: considering that each part can adopt different connection modes to encapsulate in the actual camera module, the product of this scheme still satisfies the TTL parameter of product equals each part, the connection structure of each part to and measurement error sum.
Further, the distance between the inner side of the lens assembly and the edge of the optical filter is less than 0.35mm.
Has the advantages that: the inner side of the lens component refers to the inner wall of the lens barrel of the lens component, the distance between the inner side of the lens component and the optical filter is small, namely, only the optical filter exists in the lens component, so that the size of the lens component on a transverse plane is the minimum, the overall size of the camera module is further reduced, and the experience and the lightness of an application product of the camera module are further improved.
Drawings
Fig. 1 is a flowchart of a first embodiment of a method for manufacturing an inverted camera module according to the present invention;
fig. 2 is a schematic structural diagram of a first product manufactured by the manufacturing method of the flip-chip camera module according to the present invention.
Detailed Description
The following is further detailed by way of specific embodiments:
reference numerals in the drawings of the specification include: the device comprises a packaging layer 2, a circuit board 3, a filter 4, an image chip 5, a lens component 6 and a gold ball 7.
Example one
A method for manufacturing a flip-chip camera module, as shown in fig. 1, includes the following steps:
image chip connection: and adding gold balls on the image chip, electrically connecting the gold balls with one surface of the circuit board, and packaging the gold balls to form a packaging layer, wherein the packaging layer is connected with the image chip and the circuit board.
An optical filter carrying step: the circuit board is provided with a window opposite to the image chip, and the window is loaded with an optical filter.
Carrying the lens assembly: and carrying the lens assembly on the other surface of the circuit board.
The image chip can be a photosensitive chip, an image sensor, a sensor and the like, and can also be formed by laminating an imaging component on a connecting structure through SMT, so that one side surface of the image chip is used for receiving light for imaging, and the imaging surface is formed below.
The image chip connecting step specifically comprises the following steps:
s101: the gold balls are evaluated on a side of the image chip having the image plane, and in other embodiments, the gold balls may be evaluated on the edges of the image chip. The number of the gold balls is multiple, and the gold balls are distributed according to the arrangement of the image chip. The circuit board is provided with a PAD point electrically connected with the image chip, the PAD point is in contact with the gold balls and corresponds to the gold balls one by one, and in the embodiment, the PAD point is conducted through ultrasonic welding, so that the image chip is electrically connected with one surface of the circuit board through the gold balls.
S102: glue is adopted to glue the gap between the image chip and the circuit board, and in the embodiment, special glue is configured through a full-automatic glue dispensing system to coat. Before dispensing, the glue is preheated, the heating temperature is 50-60 ℃, and the heated glue is used for dispensing. In the dispensing process, the glue discharging amount of the glue is controlled by setting the air pressure, so that the dispensing and coating are realized.
S103: the surface of the glue is pre-cured by means of ultraviolet light, the glue composition comprising a UV material. Specifically, the surface of the spot-coated glue is pre-cured through UV ultraviolet light spectrum of 450-480nm, so that the glue is prevented from overflowing, meanwhile, the image chip blocks ultraviolet light, the inner glue can still be filled, and the glue stops flowing after the filling is finished, so that the gold ball is effectively coated.
S104: and heating and baking the pre-cured glue, and curing to form the packaging layer. In this embodiment, the circuit board and the image sensor chip are heated and baked in an automatic oven at 120-150 deg.C for 10-30 min. In this example, the baking temperature was 120 ℃ and the baking time was 30 minutes. The glue is completely cured after being heated and baked, so that the gold balls are packaged, the electric connection of the gold balls is effectively protected, and the connection between the image chip and the circuit board is realized.
The optical filter carrying step specifically comprises the following steps:
the circuit board is provided with a window opposite to the image chip, the window is loaded with the optical filter, glue is adopted to glue the contact part of the optical filter and the circuit board, and the glue is solidified through ultraviolet light. Specifically, the window is kept away from one end circumference extension formation standing groove of image chip, and the point is glued in the bottom of standing groove, with the laminating of light filter in the bottom of standing groove, carries on the light filter on the side of keeping away from the image chip of circuit board. Through the distance separation light filter and the image chip of standing groove bottom and the window other end, avoid both distances to be nearer, produce the facula, influence the camera module and constitute like the effect.
The lens component carrying step specifically comprises the following steps:
the lens assembly is carried by the automatic alignment technology, and during carrying, the lens module is carried on one side of the circuit board far away from the image chip.
A product manufactured by the manufacturing method of the flip-chip camera module is manufactured by the manufacturing method. As shown in fig. 2, the product includes a lens assembly 6, a circuit board 3 and an image chip 5, and the distance between the surfaces of the lens assembly 6 and the circuit board 3 away from each other is equal to the TTL parameter of the product. The TTL parameter of the product is the TTL value of the camera module at the current focal length, namely the TTL parameter can change along with the camera module and the focal length.
The product further comprises an optical filter 4, a through window is formed in the circuit board 3, the bottom surface of the circuit board 3 is connected with the image chip 5 through a gold ball 7, the image chip 5 is opposite to the window, a packaging layer 2 is further arranged between the circuit board 3 and the image chip 5, and the gold ball 7 is coated by the packaging layer 2. One end of the window, which is far away from the image chip 5, extends circumferentially to form a placing groove, and the bottom of the placing groove is attached to the optical filter 4. The top surface of the circuit board 3 is connected with the lens assembly 6, and the optical filter 4 is positioned in the lens assembly 6.
Therefore, in the optical axis direction, the product satisfies the following condition: the thickness of the lens assembly 6, the thickness of the joint between the lens assembly 6 and the circuit board 3, the thickness of the gold ball 7 and the measurement error = the TTL parameter of the product. The measurement error includes a measurement error of the TTL parameter, and a measurement error of each thickness.
The thickness of the gold ball is equal to the gap between the image chip and the circuit board, namely the thickness of the gold ball is 5-15um. The measurement error refers to an error generated by measuring each thickness and the TTL parameter, and specifically is the sum of the measurement error calibrated by different measurement devices multiplied by the corresponding measurement times. For example, the device a is used to measure each thickness, and the device B is used to measure the TTL parameter of the product, then the measurement error is the sum of the measurement error calibrated by the device a times its corresponding measurement times and the measurement error calibrated by the device B times its corresponding measurement times.
Example two
The difference between the present embodiment and the first embodiment is:
the glue comprises UV glue, polyurethane-acrylic acid vinegar glue, epoxy resin and silicon dioxide filling material.
The UV component glue polyurethane acrylic acid vinegar material glue accounts for 1.2-1.5 percent, the particle size of the silicon dioxide filling material is 0.5-10um, the silicon dioxide filling material is added to change the glue performance for improving the glue TG, the matched high TG value range is 80-90 ppm/DEG C, the glue can be effectively stacked, the glue is full and has no shrinkage after solidification, the side edge encapsulation and the gold ball wrapping of an image chip are formed, and the protection of the glue on the chip is formed.
EXAMPLE III
The difference between the present embodiment and the first embodiment is:
the glue viscosity of the glue is 5000-40000cps, the gap between the image chip and the circuit board is 5-15um, namely the thickness of the gold ball is 5-15um after the image chip is welded. In this range, the flow speed of the glue is matched with the gap, so that the capillary phenomenon effect is better.
Example four
The difference between the present embodiment and the first embodiment is:
the distance between the inner side of the lens assembly and the edge of the optical filter is less than 0.35mm.
EXAMPLE five
The difference between the present embodiment and the first embodiment is:
in this example, the baking temperature was 150 ℃ and the baking time was 10 minutes.
The foregoing is merely an example of the present invention, and common general knowledge in the field of known specific structures and characteristics is not described herein in any greater extent than that known in the art at the filing date or prior to the priority date of the application, so that those skilled in the art can now appreciate that all of the above-described techniques in this field and have the ability to apply routine experimentation before this date can be combined with one or more of the present teachings to complete and implement the present invention, and that certain typical known structures or known methods do not pose any impediments to the implementation of the present invention by those skilled in the art. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.
Claims (10)
1. A manufacturing method of an inverted camera module is characterized by comprising the following steps: the method comprises the following steps:
image chip connection: the image chip is provided with gold balls, the gold balls are electrically connected with one surface of the circuit board through the gold balls, the gold balls are packaged to form a packaging layer, and the packaging layer is connected with the image chip and the circuit board;
carrying the lens assembly: and carrying the lens assembly on the other surface of the circuit board.
2. The method of claim 1, wherein: packaging the gold balls, which comprises the following contents:
glue is adopted for glue dispensing in the gap between the image chip and the circuit board, and the glue component comprises a UV material;
the surface of the glue is pre-cured by ultraviolet light.
3. The method of claim 2, wherein: the gold ball is packaged, and the method further comprises the following steps:
and heating and baking the pre-cured glue, and curing to form the packaging layer.
4. The method of claim 3, wherein: the gold ball is packaged, and the method further comprises the following steps:
preheating glue, wherein the heating temperature is 50-60 ℃, and dispensing by adopting the heated glue;
and when the pre-cured glue is heated and baked, the baking temperature is 120-150 ℃.
5. A method of manufacturing a flip-chip camera module according to any one of claims 2 to 4, wherein: the glue viscosity is 5000-40000cps, and the gap between the image chip and the circuit board is 5-15um.
6. The method of claim 1, wherein: the method also comprises the following contents:
the step of carrying the optical filter: the circuit board is provided with a window opposite to the image chip, and the window is loaded with an optical filter.
7. The method of claim 6, wherein: an optical filter to be mounted, comprising:
dispensing glue at the contact position of the optical filter and the circuit board by adopting glue, wherein the glue comprises a UV material;
and curing the glue through ultraviolet light, and carrying the optical filter on one side surface of the circuit board far away from the image chip.
8. A product manufactured by a manufacturing method of an inverted camera module is characterized in that: manufactured using the method of manufacture of any of claims 1-8, the product comprising the lens assembly and the circuit board connected, the distance between the surfaces of the lens assembly and the circuit board facing away from each other being equal to the TTL parameter of the product.
9. The product manufactured by the manufacturing method of the flip-chip camera module according to claim 8, wherein: the product still includes the image chip, on the optical axis direction, satisfies following condition: the thickness of the lens assembly, the thickness of the joint between the lens assembly and the circuit board, the thickness of the gold ball and the measurement error = the TTL parameter of the product.
10. The product made by the method of manufacturing a flip-chip camera module of claim 9, wherein: the distance between the inner side of the lens assembly and the edge of the optical filter is less than 0.35mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211320663.2A CN115665532A (en) | 2022-10-26 | 2022-10-26 | Manufacturing method of flip camera module and product manufactured by manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211320663.2A CN115665532A (en) | 2022-10-26 | 2022-10-26 | Manufacturing method of flip camera module and product manufactured by manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115665532A true CN115665532A (en) | 2023-01-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211320663.2A Pending CN115665532A (en) | 2022-10-26 | 2022-10-26 | Manufacturing method of flip camera module and product manufactured by manufacturing method |
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| Country | Link |
|---|---|
| CN (1) | CN115665532A (en) |
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- 2022-10-26 CN CN202211320663.2A patent/CN115665532A/en active Pending
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